A liquid cooling test system, a liquid cooling server, and a liquid cooling server test method

Abstract

The present application discloses a liquid cooling test system, a liquid cooling server, and a liquid cooling server test method, which relate to the technical field of server cooling. By respectively arranging a first sensing component and a second sensing component at the liquid inlet end and the liquid outlet end of the electronic device to be tested, according to the data collected by the first sensing component and the second sensing component, the coolant distribution unit adjusts the working state inside the coolant distribution unit to adapt to the flow resistance characteristics of different electronic nodes in the electronic device to be tested. Compared with the related art, there is no need to redesign the coolant distribution unit. Therefore, the technical problem of the reduced use efficiency of the prototype immersion cooling system in the related art can be solved, and the use efficiency of the prototype immersion cooling system is improved.

Description

Technical Field

[0001] The present application relates to the technical field of server cooling, and particularly to a liquid cooling test system, a liquid cooling server, and a liquid cooling server test method. Background Art

[0002] In the immersion liquid cooling technology, server hardware is immersed in a coolant, and heat is directly absorbed and conducted to an external heat exchanger to achieve server heat dissipation. During the research and development process of an immersion liquid cooling system, it is necessary to test a server prototype to verify the cooling capacity of the immersion liquid cooling system. In order to solve the problem of uneven heat dissipation of components with different power consumptions in the server, for different electronic nodes in the server, the components of different electronic nodes are immersed separately, and at the same time, a directional cooling cold plate structure is designed on the surface of the components to uniformly cool chips with different power consumptions.

[0003] In the related art, the electronic nodes are designed in a structurally sealed form and placed in a cabinet, and the inlet and outlet liquid circulation is realized through a water distributor on the cabinet. At the same time, a directional cooling cold plate structure is designed on the surface of the components of different electronic nodes, and the fluid is cooled by flowing through the cold plate and then flowing into the chassis. However, in the related art, during the prototype test, the size structures and flow resistance and flow characteristics of different server systems are different, and it is necessary to design corresponding liquid cooling pipeline structures and select coolant distribution units for different servers, resulting in a reduction in the use efficiency of the prototype immersion cooling system. Summary of the Invention

[0004] The present application provides a liquid cooling test system, a liquid cooling server, and a liquid cooling server test method to at least solve the problem of reduced use efficiency of the prototype immersion cooling system in the related art.

[0005] The present application provides a liquid cooling test system, including: a coolant distribution unit, a first water distributor, a second water distributor, a plurality of first control valves, a plurality of first sensing components, a plurality of second control valves, and a plurality of second sensing components;

[0006] The liquid supply end of the coolant distribution unit is communicated with the liquid inlet end of the first water distributor;

[0007] The liquid outlet end of the first water distributor is communicated with the liquid inlet end of the electronic device to be tested through a first communication pipeline;

[0008] Wherein, a first control valve and a first sensing component are arranged on the first communication pipeline;

[0009] The liquid outlet end of the electronic device to be tested is communicated with the liquid inlet end of the second water distributor;

[0010] The liquid outlet end of the second water distributor is communicated with the liquid return end of the coolant distribution unit through a second communication pipeline;

[0011] Among them, a second control valve and a second sensing component are provided on the second connecting pipeline.

[0012] This application also provides a liquid-cooled server, including: a plurality of electronic nodes; the electronic nodes include: a cold plate assembly, a first sensing unit, and a second sensing unit;

[0013] Among them, the cold plate assembly is arranged between the liquid inlet end and the liquid outlet end of the electronic node;

[0014] The liquid inlet end of the electronic node is communicated with the liquid inlet end of the cold plate assembly through a first internal pipeline;

[0015] Among them, a first sensing unit is provided on the first internal pipeline;

[0016] The liquid outlet end of the electronic node is communicated with the liquid outlet end of the cold plate assembly through a second internal pipeline;

[0017] Among them, a second sensing unit is provided on the second internal pipeline.

[0018] This application also provides a method for testing a liquid-cooled server, which uses a liquid-cooling test system, including:

[0019] Open the first control valve and the second control valve corresponding to the electronic device to be tested;

[0020] Open the coolant distribution unit to flow the coolant from the secondary side liquid supply end of the coolant distribution unit into the liquid inlet end of the first water distributor;

[0021] The coolant flows out from the liquid outlet end of the first water distributor, passes through the first sensing component and the second sensing component in sequence, and flows into the liquid inlet end of the second water distributor;

[0022] The coolant flows out through the liquid outlet end of the second water distributor and enters the secondary side liquid return end of the coolant distribution unit;

[0023] The coolant distribution unit adjusts the parameters of the coolant distribution unit according to the parameter information of the first sensing component and the second sensing component to adapt to the electronic device to be tested.

[0024] Through this application, a first sensing component and a second sensing component are respectively arranged at the liquid inlet end and the liquid outlet end of the electronic device to be tested. According to the data collected by the first sensing component and the second sensing component, the coolant distribution unit adjusts the working state inside the coolant distribution unit to adapt to the flow resistance characteristics of different electronic nodes in the electronic device to be tested. Compared with the related technology, there is no need to redesign the coolant distribution unit. Therefore, the technical problem of reduced use efficiency of the prototype immersion cooling system in the related technology can be solved, and the use efficiency of the prototype immersion cooling system is improved. Description of the Drawings

[0025] To more clearly illustrate the embodiments of the present application, the following will briefly introduce the drawings required in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0026] Figure 1 It is a schematic structural diagram of the liquid cooling test system provided by the embodiment of the present application;

[0027] Figure 2 It is a schematic internal structure diagram of the coolant distribution unit provided by the embodiment of the present application;

[0028] Figure 3 It is a schematic diagram of the flow rate limitation range of the liquid extraction device provided by the embodiment of the present application;

[0029] Figure 4 It is a schematic structural diagram of the liquid cooling server equipped with the liquid cooling test system provided by the embodiment of the present application;

[0030] Figure 5 It is a schematic flowchart of the liquid cooling server test method provided by the embodiment of the present application.

[0031] Among them, the above-mentioned drawings include the following reference numerals:

[0032] 101 - coolant distribution unit;

[0033] 102 - first water distributor;

[0034] 103 - second water distributor;

[0035] 104 - multiple first control valves;

[0036] 105 - multiple first sensing components;

[0037] 106 - multiple second control valves;

[0038] 107 - multiple second sensing components;

[0039] 201 - liquid extraction device;

[0040] 202 - liquid storage tank;

[0041] 2021 - liquid storage tank;

[0042] 2022 - liquid storage valve;

[0043] 203 - heat exchanger;

[0044] 204 - primary side pipeline;

[0045] 2041 - primary side liquid supply pipeline;

[0046] 2042 - Primary side liquid return pipeline;

[0047] 205 - Secondary side pipeline;

[0048] 2051 - Secondary side liquid supply pipeline;

[0049] 2052 - Secondary side liquid return pipeline;

[0050] 206 - Liquid bypass;

[0051] 207 - Bypass valve;

[0052] 208 - Control system;

[0053] 209 - Display panel;

[0054] 301 - Electronic node;

[0055] 3011 - Cold plate assembly;

[0056] 3012 - First sensing unit;

[0057] 3013 - Second sensing unit. Detailed implementation manners

[0058] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of the present application.

[0059] It should be noted that in the description of the present application, the terms "include", "comprise" or any other variant thereof are intended to cover non - exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or further includes elements inherent to such process, method, article or device. The terms "first", "second", etc. in the present application are used to distinguish similar objects, rather than to describe a specific order or sequence.

[0060] First, the nouns involved in the present application are explained:

[0061] Manifold: In a water system, it is a device used to connect the distribution and collection devices of each path.

[0062] Cooling Distribution Unit (CDU) is a device used to efficiently distribute cooling liquid in data centers, laboratories or industrial environments. Its main function is to provide precise cooling liquid distribution for servers, cabinets or other high-heat equipment to ensure that the equipment operates at an appropriate temperature.

[0063] Directional cooling cold plate: A directional cooling cold plate is a single-fluid heat exchanger whose internal channels are designed with specific directionality to guide the cooling medium, such as liquids such as water and ethylene glycol or gases such as air, to flow along a predetermined path. When the heat source, such as heat generated by electronic components, is transferred to the cold plate, the cooling medium flows away the heat to achieve a heat dissipation effect. Since the flow direction of the cooling medium is predetermined, directional cooling can be achieved, improving heat dissipation efficiency.

[0064] Immersion server liquid cooling system: The immersion server liquid cooling system uses the high thermal conductivity and specific heat capacity of liquid to directly immerse the electronic components that generate heat inside the server, such as the CPU, GPU, and memory, in an insulating, non-corrosive coolant. The coolant cools the server by absorbing the heat generated by the electronic components. After the heat is absorbed by the coolant, the coolant is transported to the heat exchanger through a circulating pump to exchange heat with the external environment and dissipate the heat. The cooled coolant then returns to the server to continue absorbing heat, forming a closed-loop cycle.

[0065] BMC: Baseboard Management Controller (BMC). The main functions of BMC include remote server management, hardware health monitoring, power control management, remote restart and firmware update.

[0066] In order to solve the problem of reduced utilization efficiency of the prototype immersion cooling system in the related art, the embodiments of the present application propose the following technical concepts: the inventors considered setting a plurality of first control valves and a plurality of first sensor components on the first connecting pipeline between the liquid inlet end of the electronic device to be tested and the liquid outlet end of the first water distributor, and setting a plurality of second control valves and a plurality of second sensor components on the second connecting pipeline between the liquid outlet end of the electronic device to be tested and the liquid inlet end of the second water distributor, considering controlling the circulation of the coolant of the electronic device to be tested by the first control valve and the second control valve, considering using the first sensor component and the second sensor component to collect parameter information of the electronic device to be tested, adjusting the internal working state of the coolant distribution unit according to the parameter information collected by the first sensor component and the second sensor component through the coolant distribution unit to adapt to the flow and flow resistance characteristics of different electronic devices to be tested. Compared with the related art, there is no need to redesign the coolant distribution unit according to the flow and flow resistance characteristics of each electronic device to be tested, thereby improving the utilization efficiency of the prototype immersion cooling system.

[0067] To enable those skilled in the art of this technology to better understand the solution of this application, the following further detailed description of this application will be provided in conjunction with the accompanying drawings and specific embodiments.

[0068] Figure 1 It is a schematic structural diagram of the liquid cooling test system provided by an embodiment of this application. As Figure 1 shown, the liquid cooling test system includes: a coolant distribution unit 101, a first water distributor 102, a second water distributor 103, a plurality of first control valves 104, a plurality of first sensing components 105, a plurality of second control valves 106, and a plurality of second sensing components 107.

[0069] The liquid supply end of the coolant distribution unit is communicated with the liquid inlet end of the first water distributor.

[0070] In this embodiment, the cooling system of the server is a cartridge immersion server liquid cooling system.

[0071] In this embodiment, the electronic device to be tested is a single-node server or a rack server. When the electronic device to be tested is a rack server, it includes a plurality of electronic nodes, each electronic node is arranged in a different node layer in the rack, and the coolant distribution unit is arranged at the bottom of the rack.

[0072] In this embodiment, each electronic node includes, but is not limited to, a switching node (such as: Switch node), a computing node (such as a CPU node and / or a GPU node), and a storage node, etc.

[0073] In this embodiment, in the liquid cooling test system, the connection mode of each electronic node in the electronic device to be tested is a parallel connection.

[0074] In this embodiment, the coolant distribution unit includes a liquid extraction device, a liquid storage tank, a heat exchanger, a control system, and a display panel.

[0075] Among them, the liquid storage tank stores coolant in advance.

[0076] Exemplarily, the components of the coolant include, but are not limited to, ethylene glycol solution, propylene glycol solution, deionized water, fluorinated liquid, mineral oil, and nanofluid, etc.

[0077] In this embodiment, the first water distributor is a water distributor connected to the liquid supply end of the coolant distribution unit.

[0078] In this embodiment, the first water distributor is configured with one liquid inlet end and at least one liquid outlet end.

[0079] In this embodiment, the first water distributor is a columnar structure.

[0080] In this embodiment, the material of the first water separator can be brass, polypropylene or polyethylene.

[0081] In this embodiment, a valve can also be provided at the liquid inlet end of the first water separator. Among them, the valve at the liquid inlet end of the first water separator is an electric control valve, and the opening and closing state and the opening degree of the valve can also be manually controlled.

[0082] The liquid outlet end of the first water separator is communicated with the liquid inlet end of the electronic device to be tested through a first communication pipeline.

[0083] In this embodiment, the electronic device to be tested is a single-node server or a cabinet server. When the electronic device to be tested is a cabinet server, it includes a plurality of electronic nodes, each electronic node is arranged in a different node layer in the cabinet, and the coolant distribution unit is arranged at the bottom of the cabinet.

[0084] In this embodiment, each electronic node includes, but is not limited to, a switching node (such as a Switch node), a computing node (such as a CPU node and / or a GPU node), a storage node, etc.

[0085] In this embodiment, the first water separator includes at least one liquid outlet end.

[0086] In this embodiment, a control valve is provided between each liquid outlet end of the first water separator and the liquid inlet end of the electronic device to be tested.

[0087] Among them, the control valve is an electric control valve, and the opening and closing state and the opening degree of the valve can also be manually controlled.

[0088] Among them, the electric control valve is controlled by the coolant distribution unit, and the coolant distribution unit controls the opening and closing state of the valve and the opening degree of the valve.

[0089] In this embodiment, the coolant distribution unit controls the control valves on each first communication pipeline in a wired control manner.

[0090] In this embodiment, the pipeline between each liquid outlet end of the first water separator and the liquid inlet end of the electronic device to be tested is a first communication pipeline.

[0091] Among them, a first control valve and a first sensing component are provided on the first communication pipeline.

[0092] In this embodiment, the first control valve is a valve for controlling the coolant flow rate in the first communication pipeline.

[0093] In this embodiment, the first control valve is an electric control valve, and the opening and closing state and the opening degree of the valve can also be manually controlled.

[0094] In this embodiment, the first sensing component is the sensing component on the side close to the liquid inlet end of the electronic device to be measured.

[0095] In this embodiment, the first sensing component includes a plurality of first sensors and is arranged on the side of the first control valve close to the liquid inlet end of the electronic device to be measured.

[0096] In this embodiment, the multiple sensors in the first sensing component are arranged in series on the side of the first communication pipeline close to the liquid inlet end of the electronic device to be measured.

[0097] In this embodiment, the first sensing component can be a sensor component insulated in the coolant.

[0098] Specifically, the coolant flows out from the liquid outlet end of the first water distributor, passes through the first communication pipeline, and flows into the liquid inlet end of the electronic device to be measured. The first sensing component collects the parameter information of the coolant when it flows into the electronic device to be measured.

[0099] Among them, the parameter information includes temperature information, pressure information, and flow rate information.

[0100] In this embodiment, one set of first sensing components can be arranged on the first communication pipeline, or multiple sets of first sensing components can be arranged.

[0101] The liquid outlet end of the electronic device to be measured is communicated with the liquid inlet end of the second water distributor.

[0102] In this embodiment, the second water distributor is a water distributor connected to the liquid return end of the coolant distribution unit.

[0103] In this embodiment, the second water distributor is configured with one liquid outlet end and at least one liquid inlet end.

[0104] In this embodiment, the second water distributor is in a columnar structure.

[0105] In this embodiment, the material of the second water distributor can be brass material, polypropylene material, or polyethylene material.

[0106] In this embodiment, a control valve is provided between each liquid inlet end of the second water distributor and the liquid outlet end of the electronic device to be measured.

[0107] Among them, the control valve is an electric control valve, and the opening and closing state and valve opening of the electric control valve can also be controlled manually.

[0108] Among them, the electric control valve is controlled by the coolant distribution unit, and the coolant distribution unit controls the opening and closing state of the valve and the valve opening.

[0109] In this embodiment, the coolant distribution unit controls the control valves on each second communication pipeline in a wired control manner.

[0110] The liquid outlet end of the second water separator is communicated with the liquid return end of the coolant distribution unit through a second communication pipeline.

[0111] In this embodiment, a valve may also be provided at the liquid outlet end of the second water separator. Among them, the valve at the liquid outlet end of the second water separator is an electrically controlled valve, and the opening and closing state and the valve opening of the valve can also be manually controlled.

[0112] In this embodiment, the pipelines connecting the liquid inlet ends of the second water separator and the liquid outlet end of the electronic device to be tested are second communication pipelines.

[0113] Among them, a second control valve and a second sensing component are provided on the second communication pipeline.

[0114] In this embodiment, the second control valve is a valve for controlling the coolant flow rate in the second communication pipeline.

[0115] In this embodiment, the second control valve is an electrically controlled valve, and the opening and closing state and the valve opening of the valve can also be manually controlled.

[0116] In this embodiment, the second sensing component is a sensing component on the side close to the liquid outlet end of the electronic device to be tested.

[0117] In this embodiment, the second sensing component includes a plurality of sensors; and is arranged on the side of the second control valve close to the liquid outlet end of the electronic device to be tested.

[0118] In this embodiment, the first sensor includes but is not limited to at least one of a temperature sensor, a pressure sensor, and a flow sensor.

[0119] In this embodiment, the second sensor includes but is not limited to at least one of a temperature sensor, a pressure sensor, and a flow sensor.

[0120] In this embodiment, the multiple sensors in the second sensing component are arranged in series on the second communication pipeline on the side close to the liquid outlet end of the electronic device to be tested.

[0121] In this embodiment, the second sensing component can be a sensor component insulated in the coolant.

[0122] Specifically, the coolant flows out from the liquid outlet end of the electronic device to be tested, passes through the second communication pipeline, and flows into the liquid inlet ends of the second water separator. The second sensing component collects the parameter information of the coolant when it flows out of the electronic device to be tested.

[0123] Among them, the parameter information includes temperature information, pressure information, and flow information.

[0124] In this embodiment, a set of second sensing components may be provided on the second communication pipeline, or multiple sets of second sensing components may be provided.

[0125] In this embodiment, the coolant distribution unit includes a control system, which controls each first control valve, each second control valve, each first sensing component, and each second sensing component.

[0126] Among them, the connection mode between the control system and each first control valve, each second control valve, each first sensing component, and each second sensing component is electrical connection.

[0127] Specifically, the coolant distribution unit collects the pressure parameters, flow parameters, and temperature parameters at the liquid inlet end and the liquid outlet end of each electronic device to be tested through the first sensing component and the second sensing component provided at the liquid inlet end and the liquid outlet end of each electronic device to be tested, and calculates the power consumption of each electronic node in the electronic device to be tested based on the pressure parameters, flow parameters, and temperature parameters.

[0128] In this embodiment, the coolant distribution unit calculates and generates the power consumption of each electronic node in the electronic device to be tested under different working conditions according to the temperature parameters, flow parameters, and temperature parameters of the coolant flowing through each electronic node in the electronic device to be tested when the electronic device to be tested operates under different working conditions.

[0129] In this embodiment, the calculation formula for calculating the power consumption of each electronic node in the electronic device to be tested is:

[0130]

[0131] In the formula, represents the power consumption of each electronic node; represents the specific heat capacity of the medium; represents the mass flow rate; represents the liquid temperature difference.

[0132] In this embodiment, when each electronic node in the electronic device to be tested is placed in the cabinet, the connection mode of the liquid cooling pipeline is parallel connection. Among them, affected by the gravitational potential energy in the height direction, the liquid supply flow rate attenuation of the electronic nodes at high positions is large. According to the power consumption of each electronic node calculated by the coolant distribution unit under different working conditions, the flow resistance characteristics of the corresponding electronic nodes are obtained. According to the flow resistance characteristics of different electronic nodes, the placement modes of different electronic nodes under different working conditions are set, and a suitable coolant distribution unit is adapted according to the flow resistance characteristics of different electronic nodes.

[0133] Exemplarily, the coolant distribution unit may be a large-flow and small-flow-resistance coolant distribution unit, or a small-flow and large-flow-resistance coolant distribution unit.

[0134] As can be seen from the above embodiments, by respectively arranging a first sensing component at the liquid inlet end and a second sensing component at the liquid outlet end of the electronic device to be tested, and according to the data collected by the first sensing component and the second sensing component, the coolant distribution unit adjusts the internal working state of the coolant distribution unit to adapt to the flow resistance characteristics of different electronic nodes in the electronic device to be tested. Compared with the related art, there is no need to redesign the coolant distribution unit, which improves the use efficiency of the prototype immersion cooling system.

[0135] Figure 2 This is a schematic diagram of the internal structure of the coolant distribution unit provided by the embodiment of the present application. As Figure 2 shown, the coolant distribution unit includes: a liquid extraction device 201, a liquid storage tank 202, a heat exchanger 203, a primary side pipeline 204, and a secondary side pipeline 205;

[0136] Among them, the primary side pipeline includes a primary side liquid supply pipeline and a primary side liquid return pipeline.

[0137] In this embodiment, the primary side liquid supply pipeline of the primary side pipeline penetrates into the radiator of the coolant distribution unit, and the primary side liquid return pipeline penetrates out of the radiator of the coolant distribution unit.

[0138] In this embodiment, the primary side pipeline is connected to an external refrigeration device.

[0139] Exemplarily, the external refrigeration device includes, but is not limited to, a cooling tower, an air-cooled condenser, a chiller, etc.

[0140] Among them, the chiller includes an air-cooled chiller and a water-cooled chiller.

[0141] In this embodiment, the coolant of the external refrigeration device flows into the primary side liquid supply pipeline through the liquid supply end of the primary side pipeline, exchanges heat with the secondary side pipeline through the heat exchanger of the coolant distribution unit to reduce the temperature of the secondary side pipeline, and the coolant of the external refrigeration device flows out from the primary side liquid return pipeline and returns to the external refrigeration device.

[0142] Among them, the secondary side pipeline includes a secondary side liquid supply pipeline and a secondary side liquid return pipeline.

[0143] In this embodiment, the secondary side liquid supply pipeline of the secondary side pipeline penetrates into the radiator of the coolant distribution unit, and the secondary side liquid return pipeline penetrates out of the radiator of the coolant distribution unit.

[0144] In this embodiment, the secondary side pipeline is connected to a first water distributor and a second water distributor.

[0145] In this embodiment, a liquid extraction device is arranged on the secondary side liquid supply pipeline.

[0146] In this embodiment, the liquid extraction device includes, but is not limited to, a water pump, a water diversion tank, a pneumatic liquid extraction pump, etc.

[0147] In this embodiment, the coolant flows into the first water distributor through the liquid supply end of the secondary side pipeline, and then into the electronic device under test through the liquid outlet end of the first water distributor. After cooling the electronic device under test, it flows into each liquid inlet end of the second water distributor, and then into the liquid return end of the secondary side pipeline from the liquid outlet end of the second water distributor. It exchanges heat with the primary side pipeline through the heat exchanger to reduce the temperature of the coolant in the secondary side pipeline.

[0148] In this embodiment, the primary side pipeline and the secondary side pipeline perform heat transfer in a non-contact form through the inner wall surface of the heat exchanger to achieve the cooling of the coolant.

[0149] The liquid extraction device is arranged on the secondary side liquid supply pipeline.

[0150] In this embodiment, the liquid extraction device penetrates the secondary side liquid supply pipeline to extract the coolant in the secondary side pipeline.

[0151] In this embodiment, the on-off state of the bypass valve on the liquid bypass is used to control the liquid extraction device to be in the forward working state and the reverse working state.

[0152] In this embodiment, the forward working state of the liquid extraction device is as follows: when the coolant flow rate required by the system is lower than the adjustable range of the liquid extraction device, the bypass valve is opened, and the liquid extraction device flows a part of the coolant in the secondary side pipeline through the liquid bypass into the liquid storage tank, reducing the coolant flow rate entering the electronic device under test in the secondary side pipeline.

[0153] In this embodiment, the reverse working state of the liquid extraction device is as follows: when the coolant flow rate required by the system is higher than the adjustable range of the liquid extraction device, the bypass valve is opened, and the liquid extraction device extracts the coolant in the liquid storage tank, and through the liquid bypass, flows it into the secondary side pipeline, increasing the coolant flow rate entering the electronic device under test in the secondary side pipeline.

[0154] In this embodiment, the forward working state and the reverse working state of the liquid extraction device are adjusted by the control system in the coolant distribution unit.

[0155] The liquid storage tank is communicated with the secondary side liquid return pipeline.

[0156] In an embodiment of the present application, the liquid storage tank includes: a liquid storage tank and a liquid storage valve arranged on the liquid storage tank.

[0157] In this embodiment, a liquid storage valve is provided on the liquid storage tank, and the control system is controlled to be an open system and a closed system by controlling the opening and closing of the liquid storage valve.

[0158] Specifically, when the liquid storage valve is fully opened, the liquid storage tank is communicated with the atmosphere and becomes an open system.

[0159] Specifically, when the liquid storage valve is fully closed, the liquid storage tank is isolated from the atmosphere and becomes a closed system.

[0160] In this embodiment, the liquid storage valve adjusts the air pressure value in the liquid storage tank by controlling the valve opening.

[0161] In this embodiment, when the coolant distribution unit is in a closed system, the working pressure of the system ≥ 1.5 bar.

[0162] In this embodiment, the working pressures of different electronic nodes in the electronic device to be tested are different, and the working pressures of some electronic nodes ≤ 1 bar.

[0163] Specifically, when the working pressure of the electronic node is less than the working pressure of the closed system, the pressure inside the system is controlled by adjusting the opening of the liquid storage valve to adapt to the working pressure of the electronic node.

[0164] The primary side pipeline and the secondary side pipeline pass through both sides of the heat exchanger respectively.

[0165] In this embodiment, the primary side pipeline and the secondary side pipeline perform heat transfer in a non-contact form through the inner wall surface of the heat exchanger to achieve the cooling of the coolant.

[0166] The primary side liquid supply pipeline and the primary side liquid return pipeline are respectively connected to an external refrigeration device.

[0167] Exemplarily, the external refrigeration device includes, but is not limited to, a cooling tower, an air cooler, a chiller, etc.

[0168] Among them, the chiller includes an air-cooled chiller and a water-cooled chiller.

[0169] In this embodiment, the coolant of the external refrigeration device flows into the primary side liquid supply pipeline through the liquid supply end of the primary side pipeline, exchanges heat with the secondary side pipeline through the heat exchanger of the coolant distribution unit to reduce the temperature of the secondary side pipeline, and the coolant of the external refrigeration device flows out from the primary side liquid return pipeline and returns to the external refrigeration device.

[0170] The secondary side liquid supply pipeline is connected to the liquid inlet end of the first water distributor.

[0171] The secondary side liquid return pipeline is connected to the liquid outlet end of the second water distributor.

[0172] As can be seen from the above embodiments, by providing a liquid storage tank communicating with the atmosphere in the coolant distribution unit, the pressure inside the coolant distribution unit can be adjusted from zero, improving the pressure adaptability of the coolant distribution unit to different electronic nodes.

[0173] In an embodiment of the present application, the coolant distribution unit further includes: a liquid bypass and a bypass valve;

[0174] A bypass valve is provided on the liquid bypass.

[0175] Figure 3 It is a schematic diagram of the flow rate limit range of the liquid extraction device provided by the embodiment of the present application.

[0176] As Figure 3 shown, Figure 3 records the flow power curves of the liquid extraction device at rotational speeds of 500 rpm, 1000 rpm, 1500 rpm, 2000 rpm, 2500 rpm, 2800 rpm, and 3000 rpm. Under any pressure, the secondary side pipeline cannot achieve a wide range of adjustable flow rates. Figure 3 In the regions below the lowest rotational speed and above the highest rotational speed in, there are regions where the flow rate of the liquid extraction device cannot be covered. Exemplarily, when the liquid extraction device rotates at 500 rpm, within the pressure range of the system, the maximum flow rate does not exceed 20 lpm. For different electronic nodes, when the required flow rate of the electronic node is greater than 20 lpm, the cooling effect of the system on the electronic node decreases.

[0177] In this embodiment, when the required flow rate of the system is lower than the adjustable range of the liquid extraction device, the bypass valve is opened so that the liquid extraction device is in the forward working state. The liquid extraction device passes a part of the coolant in the secondary side pipeline through the liquid bypass and flows into the liquid storage tank, reducing the coolant flow rate entering the electronic node in the secondary side pipeline.

[0178] In this embodiment, when the required flow rate of the system is higher than the adjustable range of the liquid extraction device, the bypass valve is opened so that the liquid extraction device is in the reverse working state. The liquid extraction device extracts the coolant from the liquid storage tank, passes it through the liquid bypass, and flows into the secondary side pipeline, increasing the coolant flow rate entering the electronic node in the secondary side pipeline.

[0179] One end of the liquid bypass is communicated with the secondary side liquid supply pipeline.

[0180] The other end of the liquid bypass is communicated with the liquid storage tank.

[0181] The liquid bypass passes through the heat exchanger.

[0182] In this embodiment, the liquid bypass passes through the heat exchanger and is located between the primary side pipeline and the secondary side pipeline, and the relationship with the primary side pipeline and the secondary side pipeline is a parallel relationship.

[0183] As can be seen from the above embodiments, by providing a liquid bypass and a bypass valve, when the required flow rate is lower than the adjustable range of the liquid extraction device, part of the coolant flows into the liquid storage tank through the bypass by controlling the valve; when the required flow rate is higher than the adjustable range of the liquid extraction device, the coolant in the liquid storage tank enters the secondary side liquid supply pipeline through the bypass, improving the adaptability of the coolant distribution unit to the flow rates of different electronic nodes.

[0184] In one embodiment of the present application, the coolant distribution unit further includes: a control system;

[0185] The control system is electrically connected to the first control valve, the second control valve, and the liquid storage tank.

[0186] As can be seen from the above embodiments, by controlling the first control valve and the second control valve on each first communication pipeline and the second communication pipeline through the control system, the cooling capabilities of different electronic nodes can be tested separately; by controlling the liquid storage valve of the liquid storage tank, the atmospheric pressure in the coolant distribution unit can be adjusted from zero.

[0187] In one embodiment of the present application, the coolant distribution unit further includes: a display panel; the display panel is used to display the pressure information and temperature information of the liquid cooling test system.

[0188] In this embodiment, the display panel is used to display the pressure information and temperature information of each electronic node in the electronic device to be tested.

[0189] In this embodiment, the display panel is a touch panel.

[0190] Figure 4 It is a schematic diagram of the system structure of a liquid-cooled server equipped with a liquid cooling test system provided by an embodiment of the present application. As Figure 4 shown, the liquid-cooled server includes a plurality of electronic nodes 301, and the electronic nodes 301 include: a cold plate assembly 3011, a first sensing unit 3012, and a second sensing unit 3013;

[0191] In this embodiment, the cold plate assembly includes a plurality of cooling cold plates; the cooling cold plates are connected in parallel.

[0192] In this embodiment, the cooling cold plate is a directional cooling cold plate.

[0193] In this embodiment, the coolant flows through the cold plate according to the coolant flow direction designed by the directional cooling cold plate.

[0194] Among them, the devices of each electronic node are embedded in the cooling cold plate.

[0195] Among them, the cold plate assembly is arranged between the liquid inlet end and the liquid outlet end of the electronic node.

[0196] Specifically, the coolant flows into the electronic node from the liquid inlet end, passes through the cold plate assembly in each electronic node, cools the devices in the electronic node, and then flows out from the liquid outlet end of the electronic node.

[0197] In this embodiment, each electronic node is placed on different node placement layers in the cabinet.

[0198] In this embodiment, the devices of each electronic node are arranged in a sealed chassis, and an inlet and an outlet are provided on the chassis.

[0199] In this embodiment, each electronic node is immersed in the coolant, and the chassis is a box-shaped chassis.

[0200] In this embodiment, each electronic node includes, but is not limited to, a switching node (such as a Switch node), a computing node (such as a CPU node and / or a GPU node), a storage node, etc.

[0201] The liquid inlet end of the electronic node is communicated with the liquid inlet end of the cold plate assembly through a first internal pipeline.

[0202] In this embodiment, the first internal pipeline is the pipeline between the liquid inlet end of the electronic node and the liquid inlet end of the cold plate assembly.

[0203] Wherein, a first sensing unit is provided on the first internal pipeline.

[0204] In this embodiment, the first sensing unit is a sensor unit provided on the first internal pipeline.

[0205] In this embodiment, the first sensing unit includes a plurality of first sensors; and is arranged on one side close to the liquid inlet end of the cold plate assembly.

[0206] In this embodiment, the multiple sensors in the first sensing unit are arranged in series on one side of the first internal pipeline close to the liquid inlet end of the cold plate assembly.

[0207] In this embodiment, the first sensing unit is a sensor assembly insulated in the coolant.

[0208] Specifically, the coolant flows into the electronic node from the liquid inlet end, passes through the first internal pipeline, and the first sensing unit collects the parameter information of the coolant when it flows into the cold plate.

[0209] Wherein, the parameter information includes temperature information, pressure information, and flow rate information.

[0210] In this embodiment, a group of first sensing units can be provided on the first internal pipeline, or multiple groups of first sensing units can be provided.

[0211] The liquid outlet end of the electronic node is communicated with the liquid outlet end of the cold plate assembly through a second internal pipeline.

[0212] In this embodiment, the second internal pipeline is the pipeline between the liquid outlet end of the electronic node and the liquid outlet end of the cold plate assembly.

[0213] Wherein, a second sensing unit is provided on the second internal pipeline.

[0214] In this embodiment, the second sensing unit is a sensor unit provided on the second internal pipeline.

[0215] In this embodiment, multiple sensors in the second sensing unit are arranged in series on one side of the second internal pipeline close to the liquid outlet end of the cold plate assembly.

[0216] In this embodiment, the second sensing unit is a sensor assembly insulated in the coolant.

[0217] Specifically, the coolant flows out from the liquid outlet end of the cold plate assembly, passes through the second internal pipeline, and the second sensing unit collects the parameter information of the coolant when it flows out of the cold plate.

[0218] Wherein, the parameter information includes temperature information, pressure information and flow rate information.

[0219] In this embodiment, a group of second sensing units or multiple groups of second sensing units can be provided on the second internal pipeline.

[0220] In this embodiment, the second sensing unit includes multiple second sensors; and is arranged on one side close to the liquid outlet end of the cold plate assembly.

[0221] In this embodiment, the first sensor includes but is not limited to at least one of a temperature sensor, a pressure sensor and a flow rate sensor.

[0222] In this embodiment, the second sensor includes but is not limited to at least one of a temperature sensor, a pressure sensor and a flow rate sensor.

[0223] In this embodiment, the electronic node is provided with a bus interface, and the first sensing unit and the second sensing unit are electrically connected to an external device through the bus interface.

[0224] In this embodiment, the electronic node is arranged inside a sealed chassis.

[0225] In this embodiment, the bus interface is an I2C bus interface.

[0226] In this embodiment, a bus interface is reserved on the main board of each electronic node.

[0227] In this embodiment, the external device includes a BMC and a display device.

[0228] Among them, the first sensing unit and the second sensing unit are connected to the BMC, and the BMC reads the temperature, flow rate, and pressure parameters of the cold plate assembly collected by the first sensing unit and the second sensing unit, and obtains the flow resistance characteristics of the cold plate assembly according to the temperature, flow rate, and pressure parameters of the cold plate assembly.

[0229] In this embodiment, an external device reads the temperature, flow rate, and pressure parameters of the cold plate assembly collected by the first sensing unit and the second sensing unit, obtains the flow resistance characteristics of the cold plate assembly according to the temperature, flow rate, and pressure parameters of the cold plate assembly, compares them with the simulation parameters, and corrects the simulation parameters according to the flow resistance characteristics.

[0230] Among them, the simulation parameters are the temperature, flow rate, and pressure simulation parameters of the cold plate assembly when simulating the coolant flowing through the cold plate assembly during the design of the cold plate assembly.

[0231] As can be seen from the above embodiments, by respectively arranging the first sensing unit and the second sensing unit at the liquid inlet end and the liquid outlet end of the cold plate in the electronic node, the flow resistance characteristics of the cold plate are obtained according to the data collected by the first sensing unit and the second sensing unit, and the simulation result of the cold plate is corrected according to the flow resistance characteristics.

[0232] Figure 5 It is a schematic flow chart of the liquid cooling server test method provided by the embodiment of the present application. The method includes:

[0233] S501: Open the first control valve and the second control valve corresponding to the electronic device to be tested.

[0234] Specifically, an electric signal is sent to the first control valve and the second control valve through the control system of the coolant distribution unit to control the opening and closing states of the first control valve and the second control valve.

[0235] Among them, the control system of the coolant distribution unit can control the opening and closing of the first control valve and the second control valve, or can control the opening degrees of the first control valve and the second control valve.

[0236] Specifically, the control system of the coolant distribution unit can respectively control the opening and closing states of the first control valve and the second control valve corresponding to each electronic node in the electronic device to be tested.

[0237] S502: Open the coolant distribution unit to allow the coolant to flow from the secondary side liquid supply end of the coolant distribution unit into the liquid inlet end of the first water distributor.

[0238] In this embodiment, the components of the coolant include but are not limited to ethylene glycol solution, propylene glycol solution, deionized water, fluorinated liquid, mineral oil, and nanofluid, etc.

[0239] Specifically, the liquid extraction device in the coolant distribution unit extracts the pre-stored coolant in the liquid storage tank, causing the coolant to flow from the secondary side liquid supply pipeline of the coolant distribution unit into the liquid inlet end of the first water distributor.

[0240] S503: The coolant flows out from the liquid outlet end of the first water distributor, passes through the first sensing assembly and the second sensing assembly in sequence, and flows into the liquid inlet end of the second water distributor.

[0241] Specifically, the first water distributor, based on the on-off states of the electronic nodes to be tested and the first control valves corresponding to the electronic nodes to be tested, causes the coolant to flow out from the liquid outlet end. The coolant passes through the first sensing assembly provided on the first communication pipeline. The first sensing assembly reads the temperature value, flow rate value, and pressure value when the coolant enters the electronic node. The coolant flows into the electronic node through the liquid inlet end of the electronic node. Through the first sensing unit provided inside the electronic node, the first sensing unit reads the temperature value, flow rate value, and pressure value when the coolant flows into the cold plate assembly. The coolant flows through the cold plate assembly to cool the internal components in the electronic node. Through the second sensing unit provided inside the electronic node, the second sensing unit reads the temperature value, flow rate value, and pressure value when the coolant flows out of the cold plate assembly. The coolant flows out from the liquid outlet end of the electronic node, passes through the second sensing assembly provided on the second communication pipeline. The second sensing assembly reads the temperature value, flow rate value, and pressure value when the coolant flows out of the electronic node, and flows into the liquid inlet end of the second water distributor through the second control valve.

[0242] S504: The coolant flows out through the liquid outlet end of the second water distributor and enters the secondary side liquid return end of the coolant distribution unit.

[0243] Specifically, the coolant flows through the liquid outlet end of the second water distributor, into the secondary side liquid return end of the coolant distribution unit, and through the heat exchanger in the coolant distribution unit, exchanges and cools the heat in the coolant with the outside.

[0244] S505: The coolant distribution unit adjusts the parameters of the coolant distribution unit according to the parameter information of the first sensing assembly and the second sensing assembly to adapt to the electronic device to be tested.

[0245] Specifically, the coolant distribution unit reads the temperature parameters, pressure parameters, and flow rate parameters of each electronic node according to the parameter information collected by the first sensing assembly and the second sensing assembly, calculates the power consumption of each electronic node according to the temperature parameters, pressure parameters, and flow rate parameters, obtains the flow resistance characteristics of each electronic node according to the power consumption of the electronic node, and according to the flow resistance characteristics of each electronic node, the coolant distribution unit controls the opening degree of the liquid storage valve to adjust the pressure of the test system, and the coolant distribution unit controls the opening degree of the bypass valve to adjust the flow rate of the coolant flowing into the secondary side pipeline, and adapts to the electronic device to be tested according to different pressure values and flow rate values.

[0246] As can be seen from the above embodiments, by respectively arranging the first sensing component and the second sensing component at the liquid inlet end and the liquid outlet end of each electronic node, and according to the data collected by the first sensing component and the second sensing component, the coolant distribution unit adjusts the working state inside the coolant distribution unit to adapt to the flow resistance characteristics of different electronic nodes. Compared with the related art, there is no need to redesign the coolant distribution unit, which improves the usage efficiency of the prototype immersion cooling system.

[0247] In an embodiment of the present application, step S505 includes:

[0248] S5051: The coolant distribution unit obtains temperature parameters, pressure parameters, and flow parameters according to the parameter information read from the first sensing component and the second sensing component.

[0249] Specifically, the control system in the coolant distribution unit reads the parameter information of the first sensing component and the second sensing component to obtain the temperature parameters, pressure parameters, and flow parameters at the liquid inlet end of each electronic node, as well as the temperature parameters, pressure parameters, and flow parameters at the liquid outlet end.

[0250] S5052: Calculate the power consumption of each electronic node in the electronic device to be measured according to the temperature parameters, pressure parameters, and flow parameters.

[0251] In an embodiment of the present application, the calculation formula for calculating the power consumption of each electronic node in the electronic device to be measured is:

[0252]

[0253] In the formula, represents the power consumption of each electronic node; represents the specific heat capacity of the medium; represents the mass flow rate; represents the liquid temperature difference.

[0254] S5053: Adjust the parameters of the coolant distribution unit according to the power consumption of each electronic node in the electronic device to be measured to adapt to the electronic device to be measured.

[0255] Specifically, according to the calculated power consumption value of the electronic node, the coolant distribution unit obtains the flow resistance characteristics of different electronic nodes. According to the flow resistance characteristics of each electronic node, the coolant distribution unit controls the opening degree of the liquid storage valve. According to the opening degree of the liquid storage valve, to control the pressure of the control system, the coolant distribution unit controls the opening degree of the bypass valve to adjust the flow rate of the coolant flowing into the secondary side pipeline, and adapts to the electronic device to be measured according to different pressure values and flow rate values.

[0256] As can be seen from the above embodiments, by respectively arranging the first sensing component and the second sensing component at the liquid inlet end and the liquid outlet end of each electronic node, and according to the data collected by the first sensing component and the second sensing component, the coolant distribution unit calculates the power consumption of each electronic node, and adjusts the internal working state of the coolant distribution unit according to the power consumption of each electronic node to adapt to the flow resistance characteristics of different electronic nodes. Compared with the related art, there is no need to redesign the coolant distribution unit, which improves the usage efficiency of the prototype immersion cooling system.

[0257] In an embodiment of the present application, step S5053 includes:

[0258] S301: Generate a flow resistance characteristic curve of the electronic nodes according to the power consumption of each electronic node in the electronic device to be tested.

[0259] Specifically, according to the flow rate, temperature and pressure parameter values corresponding to each electronic node, draw and generate the flow resistance characteristic curve of the electronic nodes.

[0260] S302: Adjust the parameters of the coolant distribution unit according to the flow resistance characteristic curve to adapt to the electronic device to be tested.

[0261] Specifically, obtain the flow resistance coordinate points corresponding in the flow resistance characteristic curve, and adjust the pressure and flow rate parameters inside the coolant distribution unit according to the flow resistance parameters in the coordinate points to adapt to the electronic device to be tested.

[0262] As can be seen from the above embodiments, by obtaining the power consumption of each electronic node, drawing the flow resistance characteristic curve, and adjusting the pressure and flow rate parameter values inside the coolant distribution unit according to the flow resistance characteristic curve to adapt to the flow resistance characteristics of each electronic node in the electronic device to be tested, there is no need to redesign the coolant distribution unit, which improves the usage efficiency of the prototype immersion cooling system. It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0263] It should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

[0264] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, the meaning of "a plurality of" and "several" is two or more, unless otherwise specifically defined.

[0265] The above has introduced in detail a liquid cooling test system, a liquid cooling server, and a liquid cooling server test method provided by the present application. Specific examples are used herein to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only for helping to understand the method and its core idea of the present application. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A liquid cooling test system, characterized in that, Comprising: A coolant distribution unit, a first water distributor, a second water distributor, a plurality of first control valves, a plurality of first sensing components, a plurality of second control valves, and a plurality of second sensing components; The coolant distribution unit includes: a liquid extraction device, a liquid storage tank, a heat exchanger, a primary side pipeline, a secondary side pipeline, a liquid bypass, and a bypass valve; the liquid storage tank includes a liquid storage tank and a liquid storage valve; the primary side pipeline includes a primary side liquid supply pipeline and a primary side liquid return pipeline; the secondary side pipeline includes a secondary side liquid supply pipeline and a secondary side liquid return pipeline; The liquid supply end of the coolant distribution unit is communicated with the liquid inlet end of the first water distributor, and the liquid outlet end of the first water distributor is communicated with the liquid inlet end of the electronic device to be tested through a first communication pipeline; wherein, the first control valve and the first sensing component are arranged on the first communication pipeline; The liquid outlet end of the electronic device to be tested is communicated with the liquid inlet end of the second water distributor, and the liquid outlet end of the second water distributor is communicated with the liquid return end of the coolant distribution unit through a second communication pipeline; wherein, the second control valve and the second sensing component are arranged on the second communication pipeline; The first sensing component and the second sensing component are used to collect coolant parameters and transmit the coolant parameters to the coolant distribution unit; the coolant parameters include temperature parameters, pressure parameters, and flow parameters; The coolant distribution unit is used to calculate the power consumption of each electronic node in the electronic device to be tested according to the temperature parameter, the pressure parameter, and the flow parameter; generate a flow resistance characteristic curve corresponding to each electronic node according to the power consumption of each electronic node in the electronic device to be tested; adjust the internal working state of the coolant distribution unit according to each curve to adapt to the flow resistance characteristics of different electronic nodes in the electronic device to be tested; Wherein, adjusting the internal working state of the coolant distribution unit includes: Adjusting the opening degree of the bypass valve so that the coolant flows into the liquid storage tank or enters the secondary side liquid supply pipeline through the liquid bypass to match the coolant circulation flow required by the liquid cooling test system; Adjusting the opening degree of the liquid storage valve to control the pressure inside the liquid cooling test system and adapt to the working pressure of different electronic nodes.

2. The liquid cooling test system according to claim 1, wherein The first sensing component includes a plurality of first sensors; arranged on one side of the first control valve close to the liquid inlet end of the electronic device to be tested.

3. The liquid cooling test system according to claim 1, wherein The second sensing component includes a plurality of second sensors; arranged on one side of the second control valve close to the liquid outlet end of the electronic device to be tested.

4. The liquid cooling test system according to claim 2, wherein The first sensor includes but is not limited to at least one of a temperature sensor, a pressure sensor, and a flow sensor.

5. The liquid cooling test system according to claim 3, wherein The second sensor includes but is not limited to at least one of a temperature sensor, a pressure sensor, and a flow sensor.

6. The liquid cooling test system according to claim 1, wherein The liquid extraction device is arranged on the secondary side liquid supply pipeline; The liquid storage tank is communicated with the secondary side liquid return pipeline; The primary side pipeline and the secondary side pipeline respectively pass through both sides of the heat exchanger; The primary liquid supply pipeline and the primary liquid return pipeline are respectively connected to an external refrigeration device; The secondary liquid supply pipeline is connected to the liquid inlet end of the first water distributor; The secondary liquid return pipeline is connected to the liquid outlet end of the second water distributor.

7. The liquid cooling test system according to claim 1, wherein, The liquid storage valve is used to control the air pressure value inside the liquid storage tank.

8. The liquid cooling test system according to claim 1, wherein A bypass valve is provided on the liquid bypass; One end of the liquid bypass is connected to the secondary liquid supply pipeline; The other end of the liquid bypass is connected to the liquid storage tank; The liquid bypass passes through the heat exchanger.

9. The liquid cooling test system according to claim 6, wherein The coolant distribution unit further includes: a control system; The control system is electrically connected to the first control valve, the second control valve, and the liquid storage tank.

10. The liquid cooling test system according to claim 6, characterized in that, The coolant distribution unit further includes: a display panel; the display panel is used to display the pressure information and temperature information of the liquid cooling test system.

11. A liquid-cooled server, characterized in that, It includes: Multiple electronic nodes; The electronic node includes: a cold plate assembly, a first sensing unit, and a second sensing unit; The cold plate assembly is arranged between the liquid inlet end and the liquid outlet end of the electronic node; The liquid inlet end of the electronic node and the liquid inlet end of the cold plate assembly are connected through a first internal pipeline; wherein, the first sensing unit is provided on the first internal pipeline; The liquid outlet end of the electronic node and the liquid outlet end of the cold plate assembly are connected through a second internal pipeline; wherein, the second sensing unit is provided on the second internal pipeline; The first sensing unit and the second sensing unit are used to collect the temperature parameters, pressure parameters, and flow parameters of the electronic node, and transmit them to the coolant distribution unit in the liquid cooling test system according to any one of claims 1-10, so that the coolant distribution unit calculates the power consumption of each electronic node in the electronic device to be tested according to the temperature parameters, the pressure parameters, and the flow parameters; according to the power consumption of each electronic node in the electronic device to be tested, generate the flow resistance characteristic curves of each electronic node; adjust the internal working state of the coolant distribution unit according to each of the curves to adapt to the flow resistance characteristics of different electronic nodes in the electronic device to be tested.

12. The liquid-cooled server according to claim 11, wherein The cold plate assembly includes a plurality of cooling cold plates; The cooling cold plates are connected in parallel.

13. The liquid-cooled server according to claim 11, wherein The first sensing unit includes a plurality of first sensors; arranged on one side close to the liquid inlet end of the cold plate assembly.

14. The liquid-cooled server according to claim 11, wherein The second sensing unit includes a plurality of second sensors; arranged on one side close to the liquid outlet end of the cold plate assembly.

15. The liquid-cooled server according to claim 13, wherein The first sensor includes but is not limited to at least one of a temperature sensor, a pressure sensor, and a flow sensor.

16. The liquid-cooled server according to claim 14, wherein The second sensor includes but is not limited to at least one of a temperature sensor, a pressure sensor, and a flow sensor.

17. The liquid-cooled server according to claim 11, wherein The electronic node is provided with a bus interface, and the first sensing unit and the second sensing unit are electrically connected to an external device through the bus interface.

18. A liquid-cooled server testing method, characterized in that, Using the liquid cooling test system according to any one of claims 1 to 10, includes: Opening the first control valve and the second control valve corresponding to the electronic device to be tested; Turn on the coolant distribution unit to allow coolant to flow from the secondary-side liquid supply end of the coolant distribution unit into the liquid inlet end of the first water distributor; The coolant flows out from the liquid outlet end of the first water distributor, passes through the first sensing assembly and the second sensing assembly in sequence, and flows into the liquid inlet end of the second water distributor; The coolant flows out through the liquid outlet end of the second water distributor and enters the secondary-side liquid return end of the coolant distribution unit; The coolant distribution unit obtains temperature parameters, pressure parameters, and flow parameters based on the parameter information read from the first sensing assembly and the second sensing assembly; Calculate the power consumption of each electronic node in the electronic device under test based on the temperature parameters, pressure parameters, and flow parameters; Generate a flow resistance characteristic curve corresponding to each electronic node according to the power consumption of each electronic node in the electronic device under test; Adjust the pressure and flow parameter values inside the coolant distribution unit according to each curve to adapt to the flow resistance characteristics of different electronic nodes in the electronic device under test; Among them, adjusting the working state inside the coolant distribution unit includes: Adjust the opening degree of the bypass valve so that the coolant flows into the liquid storage tank via the liquid bypass or enters the secondary-side liquid supply pipeline to match the coolant circulation flow required by the liquid cooling test system; Adjust the opening degree of the liquid storage valve to control the pressure inside the liquid cooling test system and adapt to the working pressure of different electronic nodes.

19. The liquid-cooled server testing method according to claim 18, wherein The calculation formula for calculating the power consumption of each electronic node in the electronic device under test is: In the formula, represents the power consumption of each electronic node; represents the specific heat capacity of the medium; represents the mass flow rate; represents the liquid temperature difference.

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