Etching cleaning device for wafer manufacturing

Abstract

The invention relates to the technical field of wafer manufacturing, in particular to an etching cleaning device for wafer manufacturing, which comprises an ultrasonic cleaning equipment body and a plurality of cleaning pools arranged in the ultrasonic cleaning equipment body, a moving mechanism is arranged at the top end in the ultrasonic cleaning equipment body, and a moving block is connected to the moving mechanism. A clamping rod is arranged at the bottom of the moving block; according to the etching cleaning device for wafer manufacturing, in the cleaning process, through the matched loading pieces on the loading frame, the multiple arc-shaped frames containing wafers can swing relative to the interior of the cleaning pool, the effect of rapidly cleaning the wafers is further assisted, the cleaning efficiency is further improved, and the practicability is high. Meanwhile, when the residual cleaning liquid is removed, the multiple arc-shaped frames can swing again and cooperate with the blowing-off mechanism, the residual cleaning liquid is removed in an accelerated mode, and it is further guaranteed that the wafer is fully cleaned in the subsequent cleaning pool.

Description

Technical Field

[0001] The invention relates to the technical field of wafer manufacturing, and in particular to an etching and cleaning device for wafer manufacturing. Background Art

[0002] Wafer manufacturing is to extract silicon from sand, and finally produce wafers that can be used for semiconductor chips after a series of processes such as purification, smelting, cutting, and polishing. Etching is a key step in wafer manufacturing. Through etching, some materials can be removed from the surface of the wafer to form the required circuit pattern and component structure. Before etching, the surface of the wafer must be thoroughly cleaned to remove surface particles, organic matter, metal ions and other contaminants. These contaminants may affect the adhesion and uniformity of the photoresist, and thus affect the accuracy and effect of etching;

[0003] In addition, when cleaning existing wafers, ultrasonic cleaning equipment is usually used to clean the wafers. During cleaning, a loading rack containing wafers is clamped by a robot and placed in different ultrasonic cleaning tanks in turn, such as the first cleaning tank: usually used to preliminarily remove large particles of impurities and floating oil on the surface of the wafer; the second cleaning tank: further cleans the surface of the wafer to remove finer particles and organic matter; the third cleaning tank: uses ultrapure water or deionized water for rinsing to remove residual cleaning fluid and impurities on the surface of the wafer.

[0004] However, when the wafer is cleaned, on the one hand, the loading rack is relatively fixed. Although ultrasonic cleaning is used, it takes a long time to clean. On the other hand, after the wafer is cleaned in the cleaning tank, it needs to be clamped to another cleaning tank by a robot. The wafer contains a lot of cleaning liquid in the previous cleaning tank and remains on the wafer surface and the loading rack, which can easily cause the residual cleaning liquid to enter the cleaning tank to be cleaned, thereby affecting the wafer cleaning effect. For this reason, we propose an etching cleaning device for wafer manufacturing. Summary of the invention

[0005] The object of the present invention is to provide an etching and cleaning device for wafer manufacturing to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an etching cleaning device for wafer manufacturing, comprising an ultrasonic cleaning device body and a plurality of cleaning pools arranged inside the ultrasonic cleaning device body, a moving mechanism is arranged at the top of the ultrasonic cleaning device body, and a moving block is connected to the moving mechanism, a clamping rod is arranged at the bottom of the moving block, a telescopic mechanism is installed at the bottom of the moving block, and the telescopic mechanism is connected to the clamping rod;

[0007] The clamping rod is composed of a connecting end and a clamping end, the clamping end is clamped with a loading frame, and both sides of the loading frame are equipped with matching loading parts, the matching loading parts are used to support multiple wafers and make the wafers and the cleaning tank cooperate for cleaning;

[0008] A connecting mechanism is provided at the connecting end, and a mobile blowing-off mechanism is connected to the connecting mechanism. The mobile blowing-off mechanism and the connecting mechanism are detachably connected, and the mobile blowing-off mechanism can blow away the cleaning liquid remaining on the surface of the wafer after the wafer is cleaned. At the same time, the mobile blowing-off mechanism can move synchronously with the clamping rod without affecting the independent operation of the clamping rod.

[0009] Among them, the telescopic mechanism includes an electric push rod and a connecting plate, the electric push rod is fixedly installed at the bottom of the moving block, and the electric push rod is located on the outside of the connecting end of the clamping rod, the output end of the electric push rod is fixedly connected to the connecting plate, and the connecting plate is fixedly connected to the connecting end, and the telescopic mechanism is provided, so that the clamping rod can move up and down along the cleaning pool.

[0010] The matching loading member includes a supporting shell, a supporting shaft, a rotating swinging member, an arc frame, a guide frame and a crossbar. The supporting shell is fixedly mounted on the bottom of one side of the loading frame. A plurality of supporting shafts are provided. The plurality of supporting shafts pass through the supporting shell at equal distances. The supporting shaft is rotatably connected to the supporting shell through a sealed bearing. The rotating swinging member is mounted inside the supporting shell, and the rotating swinging member is used to drive the plurality of supporting shafts.

[0011] The arc frame is fixedly mounted on the support shaft, and an arc groove is provided on the arc frame at a position corresponding to the wafer;

[0012] There are two guide frames, one end of each of which is fixedly connected to the loading frame, and the guide frames are located on both sides of the outside of the multiple arc-shaped frames;

[0013] The arc-shaped frame and the positions corresponding to the two guide frames are provided with connecting pieces;

[0014] The two ends of the crossbar are fixedly connected to the ends of the two guide frames away from the loading rack, and the function of loading multiple wafers is achieved through the matching loading parts.

[0015] Among them, the rotating swinging member includes a first spur bevel gear, a second spur bevel gear, a connecting shaft, a synchronous gear, a synchronous drive belt, a guide wheel and a driving motor, the first spur bevel gear is provided with a plurality of, and the plurality of the first spur bevel gears are respectively fixedly mounted on the bottom ends of a plurality of supporting shafts, the second spur bevel gear is meshedly connected with the first spur bevel gear, the connecting shaft is rotatably connected to the supporting shell, one end of the connecting shaft is fixedly connected to the second spur bevel gear, and the other end of the connecting shaft is fixedly connected to the synchronous gear, the synchronous drive belt is transmission-connected between the plurality of synchronous gears, the guide wheels are provided with a plurality of, and the plurality of guide wheels are rotatably connected inside the supporting shell, and the plurality of guide wheels are used to keep the synchronous drive belt in a tensioned state, the driving motor is mounted on the supporting shell, and the driving motor is used to drive one of the synchronous gears, and the function of synchronously driving the plurality of supporting shafts is achieved through the rotating swinging member provided.

[0016] Wherein, a connection port is provided on the guide frame and corresponds to the position of the plurality of connection members, and the connection member comprises a limit rod, a limit block, a hollow sleeve, a positioning rod, a limit shaft and a limit plate, the limit rod slides through the connection port, the limit block is slidably connected to the connection port, and the limit block is fixedly connected to the limit rod, the hollow sleeve is fixedly installed at the bottom of the limit rod, the positioning rod slides through the hollow sleeve, and one end of the positioning rod located inside the hollow sleeve is a convex setting;

[0017] The limiting shaft is located outside the hollow sleeve, and the limiting shaft is fixed through one end of the positioning rod. Two limiting plates are provided, and the two limiting plates are respectively rotatably sleeved on the two ends of the positioning rod, and the other ends of the two limiting plates are fixedly connected to the arc frame, and the arc frame is connected through the connecting piece.

[0018] Wherein, a connecting groove is provided at the connection end and at the position corresponding to the connecting mechanism, the connecting mechanism comprises a pushing block, a clamping piece and a synchronous moving piece, two pushing blocks are provided, the two pushing blocks are respectively slidably connected at the connecting groove, an inclined groove is provided inside the pushing block, and the clamping piece is connected to the inclined groove, and the clamping piece is used to connect the mobile blowing mechanism;

[0019] A push rod is fixedly installed on one side of the push block, and a push opening is provided at the connection groove and at positions corresponding to the two push rods, and the push rod slides through the push opening;

[0020] The synchronous moving part is located outside the connection end, and is used to synchronously drive the two push rods, and through the provided connection mechanism, the function of connecting the mobile blowing mechanism is achieved.

[0021] Among them, the clamping part includes an inclined rod and a clamping rod, the inclined rod slides through the inclined groove, and one end of the inclined rod is fixedly connected to the clamping rod, and a movable hole connected to the connecting groove is provided at the connecting end, the clamping rod slides through the movable hole, and the clamping rod is connected to the mobile blowing-off mechanism, and the mobile blowing-off mechanism is detachably connected through the provided clamping part.

[0022] Wherein, the synchronous moving part includes a positioning shell, a rotating motor and a rotating rod, the positioning shell is fixedly installed on the outside of the connecting end, and the rotating motor is fixedly installed inside the positioning shell, the output end of the rotating motor is fixedly connected to the rotating rod, and the positioning shell is provided with a rotating port at a position corresponding to the rotating rod;

[0023] Both ends of the rotating rod are provided with synchronization ports, and the rotating rod is slidably sleeved on the outsides of the two push rods through the two synchronization ports, and the synchronous mechanism is provided to achieve the function of synchronously driving the two push rods.

[0024] Among them, the mobile blowing-off mechanism includes a blower, a telescopic tube, a connecting tube, an exhaust piece, a guide plate and a sliding rod. There are two blowers, and the two blowers are installed on the outside of the ultrasonic cleaning equipment body. The output end of the blower is connected with the telescopic tube, one end of the telescopic tube is connected with the connecting tube, and one end of the connecting tube is connected with the exhaust piece. There are two guide plates, and the two guide plates are installed on the exhaust piece. The sliding rod is fixedly installed at the top end inside the ultrasonic cleaning equipment body, and the guide plate is slidably sleeved on the outside of the sliding rod. Through the mobile blowing-off mechanism, the cleaning liquid remaining on the surface of the wafer is blown away.

[0025] Among them, the exhaust component includes an exhaust shell and an air blowing pipe, the exhaust shell is U-shaped, and one end of the connecting pipe is connected to the exhaust shell, the air blowing pipe is provided with multiple, and the multiple air blowing pipes are all connected to the exhaust shell, and the air blowing pipe is installed at the bottom of the exhaust shell, and the bottom of the air blowing pipe is provided with multiple air blowing holes, and a clamping block is provided on the exhaust shell and on one side close to the clamping rod, and a clamping groove is provided on the clamping block and on one side close to the clamping rod, so that the multiple air blowing pipes correspond to the multiple arc frames, so as to achieve the function of blowing away the cleaning liquid remaining on the wafers on the multiple arc frames.

[0026] The present invention has at least the following beneficial effects:

[0027] 1. When the present invention is used, the clamping rod is provided to be composed of a connecting end and a clamping end, and the clamping end can be used to clamp a loading rack equipped with a plurality of wafers, so that the loading rack can be moved to the inside of a cleaning tank accordingly, so as to realize ultrasonic cleaning of the wafers. In the cleaning process, the arc-shaped frames equipped with a plurality of wafers can be swung relative to the inside of the cleaning tank through the matching loading parts on the loading rack, so as to further assist in the rapid cleaning of the wafers and further improve the cleaning efficiency.

[0028] 2. When the present invention is in use, through the connection mechanism provided, the clamping rod can drive the mobile blow-off mechanism to move synchronously, so that after the wafer is cleaned in a cleaning tank, the multiple blowing pipes at the mobile blow-off mechanism above the cleaning tank can blow away the cleaning liquid remaining on the wafer and the loading rack, and at the same time, the multiple arc frames can swing again to cooperate with the blow-off mechanism to accelerate the removal of the residual cleaning liquid, thereby further ensuring that the wafer is fully cleaned in the subsequent cleaning tank. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0030] Figure 2 It is a schematic diagram of the internal structure of the ultrasonic cleaning device of the present invention;

[0031] Figure 3 This is a schematic diagram of the structure of the mobile blow-off mechanism of the present invention;

[0032] Figure 4 It is a schematic diagram of the side structure of the cleaning pool of the present invention;

[0033] Figure 5 It is a schematic diagram of the structure of the mobile block of the present invention;

[0034] Figure 6 It is a schematic diagram of the structure of the clamping rod of the present invention;

[0035] Figure 7 This is a schematic diagram of the structure of the air blowing pipe of the present invention;

[0036] Figure 8 It is a schematic diagram of the telescopic mechanism structure of the present invention;

[0037] Fig. 9 It is a schematic diagram of the structure of the connecting mechanism of the present invention;

[0038] Fig.10 It is a schematic diagram of the structure of the rotating motor of the present invention;

[0039] Fig.11 For the present invention Fig.10 A schematic diagram of the enlarged structure of the middle A area;

[0040] Fig.12 It is a schematic diagram of the crossbar structure of the present invention;

[0041] Fig.13 This is a schematic diagram of the guide frame structure of the present invention;

[0042] Fig.14 This is a schematic diagram of the arc frame structure of the present invention;

[0043] Fig.15 This is a schematic diagram of the structure of the synchronous drive belt of the present invention;

[0044] Fig.16 For the present invention Fig.15 Schematic diagram of the enlarged structure of the middle B area;

[0045] Fig.17 This is a schematic diagram of the supporting shell structure of the present invention;

[0046] Fig.18 For the present invention Fig.17 Schematic diagram of the enlarged structure of the middle C area.

[0047] In the figure: 1-ultrasonic cleaning equipment body; 2-cleaning tank; 3-moving block; 4-clamping rod; 41-connecting end; 411-connecting groove; 412-pushing port; 42-clamping end; 5-telescopic mechanism; 51-electric push rod; 52-connecting plate; 6-loading frame; 7-matching loading member; 71-support shell; 72-support shaft; 73-rotating swing member; 731-first straight bevel gear; 732-second straight bevel gear; 733-connecting shaft; 734-synchronous gear; 735-synchronous drive belt; 736-guide wheel; 737-drive motor; 74-arc frame; 75-guide frame; 751-connecting port; 76-cross bar; 77-connecting member ;771-limit rod;772-limit block;773-hollow sleeve;774-positioning rod;775-limit shaft;776-limit plate;8-connecting mechanism;81-pushing block;811-bevel groove;82-clamping piece;821-oblique rod;822-clamping rod;83-synchronous moving piece;831-positioning shell;832-rotating motor;833-rotating rod;8331-synchronous port;84-pushing rod;9-moving blowing mechanism;91-blower;92-telescopic tube;93-connecting tube;94-exhaust piece;941-exhaust shell;942-blowing pipe;95-guide plate;96-slide rod;97-clamping block;971-clamping groove. DETAILED DESCRIPTION

[0048] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0049] Embodiment 1

[0050] See also Figure 1 to Figure 2 , an etching cleaning device for wafer manufacturing, comprising an ultrasonic cleaning device body 1 and a plurality of cleaning pools 2 arranged inside the ultrasonic cleaning device body 1, a moving mechanism is provided at the top of the inside of the ultrasonic cleaning device body 1, and a moving block 3 is connected to the moving mechanism, and in this embodiment, the moving mechanism is an existing moving guide rail or a moving mechanism composed of a lead screw and a motor, which is used to drive the moving block 3 to move along the top of the inside of the ultrasonic cleaning device;

[0051] A clamping rod 4 is provided at the bottom of the moving block 3, and a telescopic mechanism 5 is installed at the bottom of the moving block 3, and the telescopic mechanism 5 is connected to the clamping rod 4. The clamping rod 4 is composed of a connecting end 41 and a clamping end 42, and the clamping end 42 is in a curved shape, which can clamp and fix the loading frame 6;

[0052] See also Figures 6 to 8 The telescopic mechanism 5 includes an electric push rod 51 and a connecting plate 52. The electric push rod 51 is fixedly installed at the bottom of the moving block 3, and the electric push rod 51 is located outside the connecting end 41 of the clamping rod 4. The output end of the electric push rod 51 is fixedly connected to the connecting plate 52, and the connecting plate 52 is fixedly connected to the connecting end 41;

[0053] Thus, through the extension and retraction of the electric push rod 51, the connecting plate 52 can further drive the clamping rod 4 to move up and down in the vertical direction;

[0054] The clamping end 42 is clamped with a loading frame 6, and both sides of the loading frame 6 are installed with matching loading members 7, which are used to support multiple wafers and enable the wafers to be cleaned in coordination with the cleaning tank 2;

[0055] See also Figures 12 to 18, the matching loading member 7 includes a support shell 71, a support shaft 72, a rotating swing member 73, an arc frame 74, a guide frame 75 and a cross bar 76, the support shell 71 is fixedly installed at the bottom of one side of the loading frame 6, a plurality of support shafts 72 are provided, and the plurality of support shafts 72 pass through the support shell 71 at equal distances, and in this embodiment, the support shell 71 is made of a material with high damping performance, and then after the support shell 71 is placed in the cleaning tank 2, when the cleaning tank 2 is ultrasonically cleaned, the ultrasonic energy outside the support shell 71 does not affect the inside of the support shell 71, the support shaft 72 is rotatably connected to the support shell 71 through a sealed bearing, the rotating swing member 73 is installed inside the support shell 71, and the rotating swing member 73 is used to drive the plurality of support shafts 72;

[0056] The arc frame 74 is fixedly mounted on the support shaft 72. An arc groove is provided on the arc frame 74 at a position corresponding to the wafer. In the present embodiment, the arc frame 74 is hollowed out to prevent the cleaning liquid from remaining on the arc frame 74.

[0057] There are two guide frames 75, one end of each of which is fixedly connected to the loading frame 6, and the guide frames 75 are located on both sides of the outside of the plurality of arc-shaped frames 74;

[0058] The arc frame 74 and the positions corresponding to the two guide frames 75 are provided with connecting pieces 77;

[0059] Both ends of the cross bar 76 are fixedly connected to the ends of the two guide frames 75 away from the loading frame 6 .

[0060] See also Figures 14 to 16 The rotating swing member 73 includes a first spur bevel gear 731, a second spur bevel gear 732, a connecting shaft 733, a synchronous gear 734, a synchronous drive belt 735, a guide wheel 736 and a driving motor 737. The first spur bevel gear 731 is provided with a plurality of first spur bevel gears 731, and the plurality of first spur bevel gears 731 are respectively fixedly mounted on the bottom ends of the plurality of support shafts 72. The second spur bevel gear 732 is meshedly connected with the first spur bevel gear 731. The connecting shaft 733 is rotatably connected to the support shell 71. One end of the connecting shaft 733 One end is fixedly connected to the second spur bevel gear 732, and the other end of the connecting shaft 733 is fixedly connected to the synchronous gear 734, the synchronous drive belt 735 is transmission-connected between the plurality of synchronous gears 734, a plurality of guide wheels 736 are provided, the plurality of guide wheels 736 are rotatably connected inside the support shell 71, and the plurality of guide wheels 736 are used to keep the synchronous drive belt 735 in a tensioned state, the drive motor 737 is mounted on the support shell 71, and the drive motor 737 is used to drive one of the synchronous gears 734.

[0061] A connection port 751 is provided on the guide frame 75 at a position corresponding to the plurality of connection members 77. The connection member 77 includes a limit rod 771, a limit block 772, a hollow sleeve 773, a positioning rod 774, a limit shaft 775 and a limit plate 776. The limit rod 771 slides through the connection port 751, the limit block 772 is slidably connected to the connection port 751, and the limit block 772 is fixedly connected to the limit rod 771, the hollow sleeve 773 is fixedly installed at the bottom of the limit rod 771, the positioning rod 774 slides through the hollow sleeve 773, and one end of the positioning rod 774 located inside the hollow sleeve 773 is a protrusion.

[0062] The limiting shaft 775 is located outside the hollow sleeve 773, and the limiting shaft 775 is fixedly passed through one end of the positioning rod 774. Two limiting plates 776 are provided, and the two limiting plates 776 are respectively rotatably sleeved on the two ends of the positioning rod 774, and the other ends of the two limiting plates 776 are fixedly connected to the arc frame 74;

[0063] Specific implementation method: After the clamping rod 4 places the loading rack 6 inside the cleaning tank 2 through the clamping end 42, the cleaning tank 2 is running to realize ultrasonic cleaning of the wafer. At the same time, the driving motors 737 inside the two supporting shells 71 on both sides of the loading rack 6 are running. When the driving motor 737 is running, one of the synchronous gears 734 is rotated. When the synchronous gear 734 is rotating, the synchronous driving belt 735 drives multiple synchronous gears 734 to rotate synchronously, and further rotates the connecting shaft 733. When the connecting shaft 733 rotates, the second spur bevel gear 732 drives the first spur bevel gear 731 to rotate, and further the first spur bevel gear 731 drives the supporting shaft 72 to rotate relative to the supporting shell 71.

[0064] At this time, by driving the motor 737 to run back and forth, the multiple support shafts 72 drive the multiple arc frames 74 to swing back and forth relative to the two guide frames 75. In this embodiment, the reciprocating swing angle is 15° to -15°, and in the process of swinging, the arc frame 74 is simultaneously limited by the limit blocks 772 on both sides and the limit rod 771, so that the positioning rod 774 is telescopically moved relative to the hollow sleeve 773. At the same time, the two limit plates 776 are rotated relative to the positioning rod 774 through the limit shaft 775, further assisting the arc frame 74 to swing smoothly. At this time, the wafer at the arc frame 74 is fully in contact with the cleaning liquid inside the cleaning tank 2. At the same time, during the swinging process, the cleaning liquid flushes the surface of the wafer, thereby improving the cleaning efficiency of the wafer.

[0065] See also Figures 3 to 11A connecting mechanism 8 is provided at the connecting end 41. At the same time, in this embodiment, the connecting end 41 is never in contact with the cleaning liquid inside the cleaning tank 2. A mobile blowing mechanism 9 is connected to the connecting mechanism 8. The mobile blowing mechanism 9 is detachably connected to the connecting mechanism 8. After the wafer is cleaned, the mobile blowing mechanism 9 can blow away the cleaning liquid remaining on the surface of the wafer. At the same time, the mobile blowing mechanism 9 can move synchronously with the clamping rod 4 without affecting the independent operation of the clamping rod 4.

[0066] A connection groove 411 is provided at the connection end 41 and at a position corresponding to the connection mechanism 8. The connection mechanism 8 includes a push block 81, a clamping member 82 and a synchronous moving member 83. Two push blocks 81 are provided. The two push blocks 81 are respectively slidably connected at the connection groove 411. At the same time, in this embodiment, the two push blocks 81 are not on the same Y axis, that is, the two push blocks 81 are staggeredly distributed inside the connection groove 411.

[0067] The push block 81 is provided with an inclined groove 811 inside, and the clamping member 82 is connected to the inclined groove 811, and the clamping member 82 is used to connect the mobile blowing mechanism 9;

[0068] A push rod 84 is fixedly installed on one side of the push block 81, and a push opening 412 is provided at the connection groove 411 and at positions corresponding to the two push rods 84, and the push rod 84 slides through the push opening 412;

[0069] The synchronous moving member 83 is located outside the connecting end 41 , and is used to synchronously drive the two push rods 84 .

[0070] The clamping member 82 includes an inclined rod 821 and a clamping rod 822. The inclined rod 821 slides through the inclined groove 811, and one end of the inclined rod 821 is fixedly connected to the clamping rod 822. A movable hole connected to the connecting groove 411 is provided at the connecting end 41. The clamping rod 822 slides through the movable hole, and the clamping rod 822 is connected to the movable blowing mechanism 9.

[0071] The synchronous moving member 83 includes a positioning shell 831, a rotating motor 832 and a rotating rod 833. The positioning shell 831 is fixedly installed on the outside of the connecting end 41, and the rotating motor 832 is fixedly installed inside the positioning shell 831. The output end of the rotating motor 832 is fixedly connected to the rotating rod 833, and the positioning shell 831 is provided with a rotating opening at a position corresponding to the rotating rod 833.

[0072] Both ends of the rotating rod 833 are provided with synchronization holes 8331 , and the rotating rod 833 is slidably sleeved on the outer sides of the two pushing rods 84 through the two synchronization holes 8331 .

[0073] See also Figures 3 to 7The mobile blowing mechanism 9 includes a blower 91, a telescopic tube 92, a connecting tube 93, an exhaust member 94, a guide plate 95 and a slide bar 96. Two blowers 91 are provided, and the two blowers 91 are installed on the outside of the ultrasonic cleaning equipment body 1. The output end of the blower 91 is connected to the telescopic tube 92, one end of the telescopic tube 92 is connected to the connecting tube 93, and one end of the connecting tube 93 is connected to the exhaust member 94. Two guide plates 95 are provided, and the two guide plates 95 are installed on the exhaust member 94. The slide bar 96 is fixedly installed at the top end inside the ultrasonic cleaning equipment body 1, and the guide plate 95 is slidably sleeved on the outside of the slide bar 96.

[0074] The exhaust member 94 includes an exhaust shell 941 and an air blowing pipe 942. The exhaust shell 941 is U-shaped, and one end of the connecting pipe 93 is connected to the exhaust shell 941. A plurality of air blowing pipes 942 are provided, and the plurality of air blowing pipes 942 are all connected to the exhaust shell 941. The air blowing pipes 942 are installed at the bottom of the exhaust shell 941, and a plurality of air blowing holes are provided at the bottom of the air blowing pipe 942. A clamping block 97 is provided on one side of the exhaust shell 941 and close to the clamping rod 822, and a clamping groove 971 is provided on one side of the clamping block 97 and close to the clamping rod 822.

[0075] Specific implementation process: after the multiple wafers on both sides of the loading rack 6 are cleaned in a cleaning tank 2, the clamping rod 4 clamps the loading rack 6 through the clamping rod 4, and moves the loading rack 6 upward as a whole and separates from the cleaning liquid surface in the cleaning tank 2. At this time, the two blowers 91 are operated, so that the airflow enters the exhaust shell 941 through the telescopic tube 92 and the connecting tube 93, and then blows out through multiple exhaust pipes. When the exhaust pipes blow out, they are synchronously located above the arc frame 74, that is, the airflow blows down through the arc frame 74, so as to fully blow away the wafers on the arc frame 74 and the cleaning liquid remaining on the loading rack 6. When the multiple blowing pipes 942 are blowing, the driving motors 737 inside the two supporting shells 71 are synchronously operated, further making the multiple arc frames 74 swing synchronously. When the arc frame 74 swings, it further cooperates with the blowing pipe 942 to remove the cleaning liquid remaining on it into the cleaning tank 2.

[0076] When the residual cleaning liquid is removed, the clamping rod 4 is extended and retracted by the electric push rod 51, so that the clamping end 42 drives the loading frame 6 to move up and down relative to the air blowing pipe 942, thereby further accelerating the removal of the residual cleaning liquid.

[0077] When the residual cleaning liquid is removed, the top end of the connecting end 41 of the clamping rod 4 moves to contact with the moving block 3, and then the rotating motor 832 is operated. While the rotating motor 832 is operating, the rotating rod 833 is further rotated. While the rotating rod 833 is rotating, the pushing rod 84 is driven to move through the synchronous port 8331. Because the pushing rod 84 is limited by the pushing block 81 and the pushing port 412, the two pushing blocks 81 are further moved in a direction away from each other. As the pushing block 81 moves, due to the limiting effect of the inclined slot 811, one end of the clamping rod 822 is further connected to the clamping slot 971 of the clamping block 97 on the exhaust shell 941 through the connecting slot 411. At this time, the clamping rod 4 drives the loading rack 6 and the two exhaust shells 941 to move to the next cleaning pool 2.

[0078] This cycle is repeated over and over again.

[0079] Embodiment 2

[0080] See also Figure 3 , Embodiment 2 is a further supplementary explanation of Embodiment 1, specifically: a plurality of slide buckles are sleeved on the outer sides of the two telescopic tubes 92, two slide grooves are arranged at the top of the ultrasonic cleaning equipment body 1, and the top ends of the plurality of slide buckles are respectively slidably connected to the slide grooves;

[0081] Furthermore, when the telescopic tube 92 is telescopically moved, the plurality of slide buckles simultaneously limit the telescopic tube 92, which not only ensures the stable movement of the telescopic tube 92, but also prevents the telescopic tube 92 from being loosened, so that the exhaust housing 941 can be stably and synchronously moved with the clamping rod 4;

[0082] Embodiment 3

[0083] See also Figure 4 and Figure 7 , Example 3 is a further supplementary explanation of the example, specifically: the cross-section of the air blowing pipe 942 is U-shaped, and the air blowing pipe 942 is arranged above the arc frame 74, so that when the arc frame 74 moves below the air blowing pipe 942, the U-shaped setting can fully blow away the cleaning liquid remaining on the surface of the wafer.

[0084] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0085] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An etching cleaning device for wafer manufacturing, comprising an ultrasonic cleaning device body (1) and a plurality of cleaning pools (2) arranged inside the ultrasonic cleaning device body (1), a moving mechanism is arranged at the top of the ultrasonic cleaning device body (1), and a moving block (3) is connected to the moving mechanism, and a clamping rod (4) is arranged at the bottom of the moving block (3), characterized in that: A telescopic mechanism (5) is installed at the bottom of the moving block (3), and the telescopic mechanism (5) is connected to the clamping rod (4); The clamping rod (4) is composed of a connecting end (41) and a clamping end (42); the clamping end (42) is clamped with a loading frame (6), and matching loading parts (7) are installed on both sides of the loading frame (6); the matching loading parts (7) are used to support a plurality of wafers and enable the wafers to be cleaned in coordination with the cleaning tank (2); A connecting mechanism (8) is provided at the connecting end (41), and a movable blowing mechanism (9) is connected to the connecting mechanism (8). The movable blowing mechanism (9) is detachably connected to the connecting mechanism (8), and after the wafer is cleaned, the movable blowing mechanism (9) can blow away the cleaning liquid remaining on the surface of the wafer. At the same time, the movable blowing mechanism (9) can move synchronously with the clamping rod (4) without affecting the independent operation of the clamping rod (4).

2. The etching and cleaning device for wafer manufacturing according to claim 1, characterized in that: The telescopic mechanism (5) comprises an electric push rod (51) and a connecting plate (52); the electric push rod (51) is fixedly mounted on the bottom of the moving block (3), and the electric push rod (51) is located outside the connecting end (41) of the clamping rod (4); the output end of the electric push rod (51) is fixedly connected to the connecting plate (52), and the connecting plate (52) is fixedly connected to the connecting end (41).

3. The etching and cleaning device for wafer manufacturing according to claim 1, characterized in that: The matching loading member (7) comprises a supporting shell (71), a supporting shaft (72), a rotating swing member (73), an arc frame (74), a guide frame (75) and a crossbar (76); the supporting shell (71) is fixedly mounted on the bottom of one side of the loading frame (6); a plurality of supporting shafts (72) are provided, and the plurality of supporting shafts (72) penetrate the supporting shell (71) at equal distances; the supporting shaft (72) is rotatably connected to the supporting shell (71) via a sealed bearing; the rotating swing member (73) is mounted inside the supporting shell (71), and the rotating swing member (73) is used to drive the plurality of supporting shafts (72); The arc frame (74) is fixedly mounted on the support shaft (72), and an arc groove is provided on the arc frame (74) at a position corresponding to the wafer; There are two guide frames (75), one end of each of the two guide frames (75) is fixedly connected to the loading frame (6), and the guide frames (75) are located on both sides of the outside of the plurality of arc-shaped frames (74); The arc frame (74) and the positions corresponding to the two guide frames (75) are both provided with connecting pieces (77); Both ends of the crossbar (76) are fixedly connected to one end of the two guide frames (75) away from the loading frame (6).

4. The etching and cleaning device for wafer manufacturing according to claim 3, characterized in that: The rotating swing member (73) comprises a first spur bevel gear (731), a second spur bevel gear (732), a connecting shaft (733), a synchronous gear (734), a synchronous drive belt (735), a guide wheel (736) and a driving motor (737); a plurality of the first spur bevel gears (731) are provided, and the plurality of the first spur bevel gears (731) are respectively fixedly mounted on the bottom ends of the plurality of supporting shafts (72); the second spur bevel gear (732) is meshedly connected with the first spur bevel gear (731); the connecting shaft (733) is rotatably connected to the supporting shell (71); the connecting shaft (733) ) is fixedly connected to the second spur bevel gear (732), and the other end of the connecting shaft (733) is fixedly connected to the synchronous gear (734), the synchronous drive belt (735) is transmission-connected between the plurality of synchronous gears (734), a plurality of guide wheels (736) are provided, the plurality of guide wheels (736) are rotationally connected inside the support shell (71), and the plurality of guide wheels (736) are used to keep the synchronous drive belt (735) in a tensioned state, the drive motor (737) is mounted on the support shell (71), and the drive motor (737) is used to drive one of the synchronous gears (734).

5. The etching and cleaning device for wafer manufacturing according to claim 3, characterized in that: A connection port (751) is provided on the guide frame (75) and at positions corresponding to the plurality of connection members (77); the connection member (77) comprises a limit rod (771), a limit block (772), a hollow sleeve (773), a positioning rod (774), a limit shaft (775) and a limit plate (776); the limit rod (771) slides through the connection port (751); the limit block (772) is slidably connected to the connection port (751); the limit block (772) is fixedly connected to the limit rod (771); the hollow sleeve (773) is fixedly mounted at the bottom of the limit rod (771); the positioning rod (774) slides through the hollow sleeve (773); and one end of the positioning rod (774) located inside the hollow sleeve (773) is a protrusion; The limiting shaft (775) is located outside the hollow sleeve (773), and the limiting shaft (775) is fixedly passed through one end of the positioning rod (774). Two limiting plates (776) are provided, and the two limiting plates (776) are rotatably sleeved on the two ends of the positioning rod (774), and the other ends of the two limiting plates (776) are fixedly connected to the arc frame (74).

6. The etching and cleaning device for wafer manufacturing according to claim 2, characterized in that: A connecting groove (411) is provided at the connecting end (41) and at a position corresponding to the connecting mechanism (8); the connecting mechanism (8) comprises a pushing block (81), a clamping piece (82) and a synchronous moving piece (83); two pushing blocks (81) are provided, and the two pushing blocks (81) are respectively slidably connected at the connecting groove (411); an inclined groove (811) is provided inside the pushing block (81), and the clamping piece (82) is connected to the inclined groove (811); the clamping piece (82) is used to connect the moving blowing mechanism (9); A push rod (84) is fixedly mounted on one side of the push block (81); a push opening (412) is provided at the connection groove (411) and at positions corresponding to the two push rods (84); and the push rod (84) slides through the push opening (412); The synchronous moving member (83) is located outside the connecting end (41), and the synchronous moving member (83) is used to synchronously drive the two pushing rods (84).

7. The etching and cleaning device for wafer manufacturing according to claim 6, characterized in that: The clamping member (82) comprises an inclined rod (821) and a clamping rod (822); the inclined rod (821) slides through the inclined groove (811), and one end of the inclined rod (821) is fixedly connected to the clamping rod (822); a movable hole connected to the connecting groove (411) is provided at the connecting end (41); the clamping rod (822) slides through the movable hole, and the clamping rod (822) is connected to the movable blow-off mechanism (9).

8. The etching and cleaning device for wafer manufacturing according to claim 6, characterized in that: The synchronous moving member (83) comprises a positioning shell (831), a rotating motor (832) and a rotating rod (833); the positioning shell (831) is fixedly mounted on the outside of the connecting end (41), and the rotating motor (832) is fixedly mounted inside the positioning shell (831); the output end of the rotating motor (832) is fixedly connected to the rotating rod (833), and the positioning shell (831) is provided with a rotating opening at a position corresponding to the rotating rod (833); Both ends of the rotating rod (833) are provided with synchronization ports (8331), and the rotating rod (833) is slidably sleeved on the outsides of the two pushing rods (84) through the two synchronization ports (8331).

9. The etching and cleaning device for wafer manufacturing according to claim 1, characterized in that: The mobile blowing mechanism (9) comprises a blower (91), a telescopic tube (92), a connecting tube (93), an exhaust member (94), a guide plate (95) and a slide bar (96). Two blowers (91) are provided, and the two blowers (91) are both installed on the outside of the ultrasonic cleaning device body (1). The output end of the blower (91) is connected to the telescopic tube (92), one end of the telescopic tube (92) is connected to the connecting tube (93), and one end of the connecting tube (93) is connected to the exhaust member (94). Two guide plates (95) are provided, and the two guide plates (95) are installed on the exhaust member (94). The slide bar (96) is fixedly installed at the top end inside the ultrasonic cleaning device body (1), and the guide plate (95) is slidably sleeved on the outside of the slide bar (96).

10. The etching and cleaning device for wafer manufacturing according to claim 9, characterized in that: The exhaust component (94) comprises an exhaust shell (941) and an air blowing pipe (942); the exhaust shell (941) is U-shaped, and one end of the connecting pipe (93) is connected to the exhaust shell (941); a plurality of air blowing pipes (942) are provided, and the plurality of air blowing pipes (942) are all connected to the exhaust shell (941); the air blowing pipes (942) are installed at the bottom of the exhaust shell (941); a plurality of air blowing holes are provided at the bottom of the air blowing pipe (942); a clamping block (97) is provided on one side of the exhaust shell (941) close to the clamping rod (822); and a clamping groove (971) is provided on one side of the clamping block (97) close to the clamping rod (822).

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