Limiting structure, wafer drying device and wafer drying method

Abstract

The invention provides a limiting structure, a wafer drying device and a wafer drying method. The limiting structure comprises a support, a first clamping tooth set, a second clamping tooth set and a first driving assembly. The support comprises a main beam, a first supporting beam and a second supporting beam, the first clamping tooth set and the second clamping tooth set are arranged on the two opposite sides of the main beam. The first driving assembly is connected with the first supporting beam and / or the second supporting beam and used for driving the main beam to rotate through the first supporting beam and / or the second supporting beam, and when the main beam rotates to a first target position, the first clamping tooth set restrains and positions the tops of the multiple wafers arranged side by side, and when the main beam rotates to a second target position, the second clamping tooth set restrains and positions the tops of the multiple wafers arranged side by side. The second latch group restrains and positions the side portions of the plurality of wafers arranged side by side. According to the invention, a plurality of wafers can be prevented from being laminated in the cleaning and drying process, and the problem of wafer damage caused by the lamination can be solved, and the productivity is ensured.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a limiting structure, a wafer drying device and a wafer drying method. Background Art

[0002] There are two main methods for drying wafers in the industry: spin drying, which is to drive the wafer to rotate at high speed to remove dirty water on the wafer surface; and Marangoni drying method based on isopropyl alcohol.

[0003] At present, the Marangoni drying method is widely used in the industry. The principle is: the wafer is transferred to a tank containing deionized water, the tank cover is sealed, and the isopropyl alcohol gas fills the entire chamber formed by the tank cover and the tank body through the outlet pipe on the tank cover; then the wafer is slowly lifted, and the top of the wafer is tangent to the water surface and the water is discharged until the entire wafer is completely out of water. At this stage, since the surface tension of isopropyl alcohol is much smaller than that of water (in an environment of 25°C, the surface tension of isopropyl alcohol is 20.9x10-3N / m, The surface tension of water is 72.8x10-3N / m), so a surface tension gradient will be formed on the surface of the sloped water flow, generating Marangoni convection. At this time, the water is sucked back to the water surface to achieve the purpose of drying; then the wafer is raised to the slot cover, the isopropyl alcohol gas and dirty water are discharged, and the wafer is purged to dry the wafer surface, and finally the wafer is lowered to a predetermined position, such as the point of interaction with the PRT (process robot), the slot cover is opened, and the PTR takes the wafer out of the slot body.

[0004] In order to improve production efficiency, the industry generally places up to 50 wafers side by side in the tank at the same time for the above-mentioned Marangoni drying process. Since the gap between two adjacent wafers is small and the diameter of each wafer is large (usually 300mm), the adjacent wafers will be adsorbed by each other due to the surface tension of the water during the period from the beginning of the wafer exiting the water to the complete exit of the water, resulting in stacking problems. This not only easily damages the wafer, but also affects the subsequent transmission, thereby affecting production capacity. Summary of the invention

[0005] In view of this, the present application provides a limiting structure, a wafer drying device and a wafer drying method, which can improve the problem of wafer stacking and the resulting easy damage to the wafer and affect the production capacity.

[0006] The present application provides a limiting structure for limiting the position of a plurality of wafers arranged side by side, and the limiting structure includes:

[0007] The bracket comprises a main beam and a first supporting beam and a second supporting beam respectively connected to two ends of the main beam;

[0008] A first latching tooth group and a second latching tooth group are arranged on opposite sides of the main beam;

[0009] A first driving component is connected to the first support beam and / or the second support beam, and is used to drive the main beam to rotate through the first support beam and / or the second support beam, and when the main beam rotates to a first target position, the first latching tooth group constrains and positions the tops of the multiple wafers arranged side by side, and when the main beam rotates to a second target position, the second latching tooth group constrains and positions the sides of the multiple wafers arranged side by side.

[0010] Optionally, the bracket further comprises a first shaft, a first shaft sleeve, a second shaft and a second shaft sleeve, wherein the first shaft is fixed to one end of the first support beam, the first shaft sleeve is sleeved on the first shaft and is used to be fixed to one inner side of the slot cover, the second shaft is fixed to one end of the second support beam, the second shaft sleeve is sleeved on the second shaft and is used to be fixed to the other inner side of the slot cover;

[0011] The first driving assembly includes a coupling and a driving source for driving the coupling, and the coupling is connected to the second shaft for driving the second shaft.

[0012] Optionally, the other end of the first support beam is provided with two first branches which are longitudinally opposite to each other;

[0013] The other end of the second support beam is provided with two second branches which are longitudinally opposite to each other;

[0014] One end of the main beam extends between the two first branches and is fixed to the first branch, and the other end extends between the two second branches and is fixed to the second branch.

[0015] Optionally, the first branch, the second branch and the extension direction of the main beam are parallel.

[0016] Optionally, the first branch and the second branch are respectively provided with long holes, and the long holes are through holes extending laterally; mounting holes are provided at both ends of the main beam for adjusting the longitudinal overlap position with the long holes to adjust the position of the first tooth group and the second tooth group between the first support beam and the second support beam.

[0017] Optionally, the latching teeth in the first latching tooth group and the second latching tooth group are aligned one by one.

[0018] The present application provides a wafer drying device, comprising:

[0019] A tank body, used to place multiple wafers and cleaning liquid side by side;

[0020] A tank cover, used for sealing the tank body;

[0021] And, in the limiting structure as described in any of the above items, the bracket of the limiting structure is arranged inside the slot cover, and the first driving component is arranged outside the slot cover.

[0022] Optionally, the wafer drying device further comprises:

[0023] The second driving component is used to drive the multiple wafers to perform lifting and lowering movements, and when driving the multiple wafers to rise to the third target position in the slot body, the first driving component drives the bracket to rotate to the first target position, and when driving the multiple wafers to rise to the fourth target position in the slot cover, the first driving component drives the bracket to rotate to the second target position.

[0024] Optionally, the wafer drying device further comprises:

[0025] The third latching tooth group is arranged in the slot cover laterally opposite to the limiting structure. The third latching tooth group is arranged in the slot cover and is used to constrain and position the two sides of the multiple wafers respectively together with the second latching tooth group when the bracket rotates to the second target position.

[0026] Optionally, the latching teeth in the third latching tooth group and the latching teeth in the second latching tooth group are aligned one by one.

[0027] A wafer drying method provided in the present application is based on the limiting structure or wafer drying device as described in any one of the above items, and the wafer drying method includes:

[0028] Placing a plurality of wafers arranged side by side in a tank containing a cleaning solution, sealing the tank with a tank cover, and introducing isopropyl alcohol gas into the tank;

[0029] Driving the support to rotate to a first target position so that the first latching gear group constrains and positions the tops of the plurality of wafers;

[0030] Discharging the cleaning liquid in the tank body, and performing Magoranie drying on the plurality of wafers during the process of discharging the cleaning liquid;

[0031] driving the support to rotate to a second target position;

[0032] Emptying the isopropyl alcohol gas and the cleaning liquid in the tank body, and raising the plurality of wafers into the tank cover, and constraining and positioning the sides of the plurality of wafers by the second latching tooth group rotated to the second target position;

[0033] The wafers are purged to dry the surfaces of the wafers.

[0034] As described above, in the present application, at the stage when multiple wafers arranged side by side just begin to emerge from the liquid surface of the cleaning liquid to the stage when they are completely exposed from the liquid surface of the cleaning liquid, the first driving component drives the main beam to rotate to the first target position through the first support beam and / or the second support beam, and the first locking tooth group constrains and positions the tops of the multiple wafers, thereby avoiding the stacking problem caused by mutual adsorption between adjacent wafers due to the influence of the surface tension of the cleaning liquid, which is not only beneficial to avoid damage caused by scratches between adjacent wafers, but also beneficial to subsequent transmission, and can ensure production capacity.

[0035] Furthermore, after completing Magorani drying of multiple wafers, the first driving component drives the main beam to rotate to the second target position through the first support beam and / or the second support beam, and the second latching gear group constrains and positions the sides of the multiple wafers, so that the multiple wafers can be constrained and positioned in the slot cover, which is also beneficial to avoid the problem of wafer stacking and damage caused by scratches between adjacent wafers during the purge and drying process. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 A schematic diagram of the three-dimensional structure of a wafer drying device provided in an embodiment of the present application;

[0037] Figure 2 A side view of a wafer drying device provided in an embodiment of the present application;

[0038] Figure 3 A schematic diagram of the cooperation between the tank cover and the tank body of the wafer drying device provided in an embodiment of the present application;

[0039] Figure 4 A schematic diagram of a limiting structure provided in an embodiment of the present application;

[0040] Figure 5 for Figure 4 The structural explosion diagram of the limiting structure shown;

[0041] Figure 6 A schematic diagram of the structural coordination between the limiting structure and the slot cover provided in the embodiment of the present application;

[0042] Figure 7 and Figure 8 A schematic diagram of two viewing angles when the first driving assembly drives the bracket to rotate to the first target position;

[0043] Figures 9 to 11 A schematic diagram of three viewing angles when the first driving assembly drives the bracket to rotate from a first target position to a second target position;

[0044] Fig.12 A schematic diagram of placing multiple wafers into a tank and immersing them in a cleaning solution for the present application;

[0045] Figures 13 to 15This is a schematic diagram of positioning the tops of multiple wafers through limiting structures in the present application;

[0046] Fig.16 A schematic diagram of the limiting structure constraining and positioning the tops of multiple wafers during the continuous discharge of the cleaning liquid in the present application;

[0047] Fig.17 A schematic diagram of the first driving assembly driving the bracket to rotate to the second target position after the cleaning liquid and isopropyl alcohol gas are emptied in the present application;

[0048] Fig.18 It is a schematic diagram of the second driving component of the present application driving multiple wafers to rise to a fourth target position;

[0049] Fig.19 and Fig. 20 It is a schematic diagram of the limiting structure constraining and positioning multiple wafers through the second latching gear group and the third latching gear group when the first driving component drives the bracket to rotate to the second target position;

[0050] Fig.21 A schematic diagram of the slot cover opening the slot body of the present application;

[0051] Fig. 22 This is a schematic diagram of the second driving component of the present application driving multiple wafers to rise to the outside of the tank;

[0052] Fig.23 A schematic flow chart of a wafer drying method provided in an embodiment of the present application. DETAILED DESCRIPTION

[0053] In order to make the purpose, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be clearly described below in conjunction with specific embodiments and corresponding drawings. Obviously, the embodiments described below are only part of the embodiments of the present application, not all of the embodiments. In the absence of conflict, the following embodiments and their technical features can be combined with each other and also belong to the technical solutions of the present application.

[0054] In the description of the embodiments of the present application, terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", and "counterclockwise" indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the technical solutions of the corresponding embodiments, rather than indicating or implying that a device or element must have a specific orientation, be constructed and operated in a specific orientation, and should not be understood as a limitation on the present application.

[0055] Please also read Figures 1 to 22, is a schematic diagram of the structure of a wafer drying device provided in an embodiment of the present application. The wafer drying device includes a tank body 1, a tank cover 2 and a limiting structure 3.

[0056] exist Figure 2 , Figure 6 , Figures 12 to 22 In the present application, the structural elements including the tank body 1 and the tank cover 2 are displayed in a perspective drawing manner to display other structural elements located inside thereof.

[0057] For the convenience of describing and understanding the scheme of the present application, the following takes the scenario of cleaning and drying multiple wafers 6 as an example, and the direction of gravity is referred to as the second direction y. Multiple wafers 6 will move up and down along the direction of gravity during the cleaning and drying process; a three-dimensional rectangular coordinate system is established with the second direction y as one of the coordinate axes, and the positive directions of the other two coordinate axes of the three-dimensional rectangular coordinate system are respectively referred to as the first direction x and the third direction z, and the first direction x, the second direction y and the third direction z are perpendicular to each other. It should be understood that the so-called verticality in the whole application does not require that the angle between the two must be 90°, but allows a deviation of, for example, ±10°, that is, the so-called verticality can be understood as the angle between any two directions is 80° to 100°. Similarly, the so-called parallelism in the whole application does not require that the angle between the two must be 0° or 180°, but allows a deviation of, for example, ±10°, that is, the so-called parallelism can be understood as the angle between any two directions is 0° to 10° or 170° to 190°.

[0058] The tank 1 is used to place multiple wafers 6 and cleaning liquid side by side. Figure 3 As shown, the tank cover 2 can move relative to the tank body 1 to open or close the tank body 1.

[0059] The limiting structure 3 includes a bracket 31, a first latching tooth group 321, a second latching tooth group 322 and a first driving assembly 33. The bracket 31 is disposed in the slot cover 2 and includes a main beam 311 and a first support beam 312 and a second support beam 313 respectively connected to both ends of the main beam 311. The first latching tooth group 321 and the second latching tooth group 322 are disposed on opposite sides of the main beam 311. For example, Figure 4 and Figure 5 In the illustrated scene, the main beam 311 is a long strip-shaped plate-like structure, and the first latching tooth group 321 and the second latching tooth group 322 are respectively arranged on two large surfaces of the main beam 311. The first driving assembly 33 is arranged outside the slot cover 2 and connected to the second support beam 313 to drive the main beam 311 to rotate through the second support beam 313.

[0060] In one example, combined Figure 4 and Figure 5 As shown, the bracket 31 further includes a first shaft 314 , a first shaft sleeve 315 , a second shaft 316 and a second shaft sleeve 317 .

[0061] The first sleeve 315 is sleeved on the first shaft 314, and the first sleeve 315 is fixed to an inner side of the slot cover 2. For example, an inner side of the slot cover 2 is provided with an opening, and the first sleeve 315 is embedded and fixed in the opening. One end of the first support beam 312 is provided with two branches, each branch is extended along the length direction of the first support beam 312, and the two branches are arranged oppositely, so that one end of the first support beam 312 is U-shaped; the part of the first sleeve 315 that is not embedded in the opening of the slot cover 2 is located between the first support beam 312 and an inner side of the slot cover 2, and the part of the first shaft 314 located outside the first sleeve 315 is accommodated between the two branches of the first support beam 312, and the first shaft 314 is fixed to one end of the first support beam 312 by two upper and lower protrusions penetrating the mounting holes respectively provided in the two branches.

[0062] The second sleeve 317 is sleeved on the second shaft 316 and can be fixed in the slot cover 2 by being inserted into the opening on the other inner side of the slot cover 2. Two branches are also provided at one end of the second support beam 313, each branch extending along the length direction of the second support beam 313, and the two branches are arranged opposite to each other, so that one end of the second support beam 313 is U-shaped; the part of the second shaft 316 not inserted into the opening of the slot cover 2 is located between the second support beam 313 and the other inner side of the slot cover 2, and the part of the second shaft 316 located outside the second sleeve 317 is accommodated between the two branches of the second support beam 313, and the second shaft 316 is fixed to one end of the second support beam 313 by two upper and lower bosses penetrating the mounting holes respectively provided in the two branches.

[0063] The first driving assembly 33 includes a coupling 331 and a driving source 332, and the driving source 332 can be a DC motor. The driving source 332 is connected to the coupling 331 to drive the coupling 331, and the coupling 331 is connected to the second shaft 316, and the two can be fixed by a top screw 318. Figure 1 and Figure 6 As shown, a protruding platform 21 is provided on the outside of the slot cover 2, and the bottom of the driving source 332 can be fixed on the platform 21, and the side of the driving source 332 can be fixed to the outside of the slot cover 2 by screws 319. The number of screws 319 includes but is not limited to Figure 5 The four shown in .

[0064] The driving source 332 drives the coupling 331 to rotate, thereby driving the second shaft 316 to rotate (for example, synchronous rotation), and the second shaft 316 drives the second support beam 313 to drive the main beam 311 to rotate, wherein the second shaft 316 rotates relative to the second sleeve 317, and the second sleeve 317 does not rotate relative to the slot cover 2; the main beam 311 drives the first support beam 312 to drive the first shaft 314 to rotate relative to the first sleeve 315, and the first sleeve 315 is fixed in the slot cover 2 and does not rotate.

[0065] The first driving assembly 33 drives the bracket 31 to perform rotational motion, which includes at least two situations:

[0066] Situation 1: Please also refer to Figure 7 and Figure 8 As shown, the first driving assembly 33 drives the bracket 31 to rotate to the first target position. At the first target position, the first support beam 312 and the second support beam 313 are both in a vertical state, extending out of the bottom of the slot cover 2 and extending into the slot body 1, the two large faces of the main beam 311 are both horizontally arranged, that is, perpendicular to the second direction y, the teeth of the first latching tooth group 321 face upward, and the teeth of the second latching tooth group 322 face downward, and the entire main beam 311 and the first latching tooth group 321 and the second latching tooth group 322 arranged thereon are all located in the slot body 1.

[0067] Situation 2: Please refer to Fig. 9 and Fig.10 As shown, the first driving assembly 33 drives the bracket 31 to rotate from the first target position to the second target position. At the second target position, the first support beam 312 and the second support beam 313 are in a horizontal state, the two large surfaces of the main beam 311 are vertically arranged, that is, parallel to the second direction y, and the entire bracket 31 (including the first latching tooth group 321 and the second latching tooth group 322 arranged on the bracket 31) are located in the slot cover 2.

[0068] That is, the first driving assembly 33 can drive the bracket 31 to rotate to switch between the first target position and the second target position.

[0069] In other examples, the first driving assembly 33 can be connected to the first support beam 312, the first support beam 312 adopts the structural matching design of the second support beam 313 and the slot cover 2, and the second support beam 313 adopts the structural matching design of the first support beam 312 and the slot cover 2. The driving source 332 drives the coupling 331 to rotate to drive the first shaft 314 to rotate, and the first shaft 314 drives the first support beam 312 to drive the main beam 311 to rotate; the main beam 311 drives the second support beam 313 to rotate.

[0070] Alternatively, the first driving assembly 33 may include two driving sources 332 and two couplings 331, the two couplings 331 are connected to the first support beam 312 and the second support beam 313 respectively, and the first support beam 312 and the second support beam 313 are both made of Figure 5 The second support beam 313 is designed to cooperate with the structure of the slot cover 2. Each driving source 332 drives the corresponding coupling 331 to rotate, so as to respectively drive the first support beam 312 and the second support beam 313 to rotate, so as to jointly drive the main beam 311 to rotate.

[0071] Please also read Figures 1 to 22 The wafer drying device further includes a second drive assembly 4 and a third latching gear set 5. The second drive assembly 4 can extend into the tank body 1 to drive the bearing assembly and a plurality of wafers 6 placed on the bearing assembly to perform lifting and lowering movements. The third latching gear set 5 is disposed in the tank cover 2 in a transverse manner relative to the limiting structure. Optionally, as Figure 5 As shown, the third latching tooth set 5 is fixed in the slot cover 2 by screw locking.

[0072] The working principle and process of the wafer drying device are introduced below:

[0073] First, see Fig.12 As shown, a plurality of wafers 6 arranged side by side are placed in a tank body 1 filled with a cleaning liquid (e.g., deionized water), the cleaning liquid submerges the top of the plurality of wafers 6, and the tank body 1 is sealed with a tank cover 2, and isopropyl alcohol gas is introduced into the tank body 1 through a pipe on the tank cover 2 (the isopropyl alcohol gas is represented by a circular spot in the figure), so that the space formed by the tank cover 2 and the tank body 1 is filled with isopropyl alcohol gas. In this state, the first driving component 33 drives the bracket 31 to rotate to the second target position, at which the first support beam 312 and the second support beam 313 are in a horizontal state, the two large surfaces of the main beam 311 are parallel to the second direction y, and the entire bracket 31 is located in the tank cover 2 and does not extend out of the bottom of the tank cover 2; the third latching tooth group 5 is opposite to and oriented to the second latching tooth group 322.

[0074] Then, see also Figures 13 to 16 As shown, the first driving assembly 33 drives the bracket 31 to rotate to the first target position, so that the first latching tooth group 321 constrains and positions the tops of the multiple wafers 6. At the first target position, the first support beam 312 and the second support beam 313 are both in a vertical state, extending out of the bottom of the slot cover 2 and extending into the slot body 1, the two large faces of the main beam 311 are perpendicular to the second direction y, and the entire main beam 311 is located in the slot body 1; the latching teeth of the first latching tooth group 321 are immersed in the cleaning liquid, and constrain and position the tops of the multiple wafers 6.

[0075] Alternatively, in other examples, the first driving assembly 33 drives the bracket 31 to rotate to the first target position only when the second driving assembly 4 drives the plurality of wafers 6 to rise to the third target position in the slot cover 2. At the third target position, the maximum length of the first latching tooth set 321 extending into the slot body 1 can enable the latching teeth of the first latching tooth set 321 to constrain and position the tops of the plurality of wafers 6.

[0076] Next, see Fig.16 As shown, the cleaning liquid in the tank body 1 can be discharged by opening the drain valve 10 disposed at the bottom of the tank body 1, and the plurality of wafers 6 can be subjected to Magoranyi drying during the cleaning liquid discharge process. The function of the Magoranyi drying process is to remove dirt from the surface of the wafer 6 by the cleaning liquid. The specific principle can be referred to the existing description, and will not be repeated here.

[0077] During the process of discharging the cleaning fluid, Fig.16 As shown, the liquid level of the cleaning liquid continues to drop, and the present application can continue to introduce isopropyl alcohol gas into the tank body 1.

[0078] See also Figures 17 to 20 As shown, after the isopropyl alcohol gas and cleaning liquid in the tank body 1 are emptied, the second drive assembly 4 drives the multiple wafers 6 to rise, and when they rise to the fourth target position in the tank cover 2, the first drive assembly 33 drives the bracket 31 to rotate to the second target position. At the fourth target position, the third latching tooth group 5 and the second latching tooth group 322 clamp the same wafer 6. The latching teeth of the same wafer 6 are located on the diameter of the wafer 6. At the second target position, the third latching tooth group 5 and the second latching tooth group 322 respectively constrain and position the two sides of the multiple wafers 6. Optionally, the latching teeth in the third latching tooth group 5 and the second latching tooth group 322 are aligned one by one, so as to align and clamp each wafer 6 one by one, and avoid damage caused by the deflection of the wafer 6 due to the misalignment of the latching teeth on both sides. The latching teeth in the first latching tooth group 321 and the second latching tooth group 322 can also be aligned one by one, so that when the bracket 31 switches between the first target position and the second target position, it can align and clamp each wafer 6 one by one without changing the position of the multiple wafers 6.

[0079] Alternatively, in other examples, when the cleaning liquid is discharged to below the top of the multiple wafers 6, the first drive component 33 can drive the bracket 31 to rotate to the second target position; then the second drive component 4 drives the multiple wafers 6 to rise to the fourth target position, and then the isopropyl alcohol gas and cleaning liquid in the trough body 1 are emptied.

[0080] See also Fig.18 As shown, after the second driving assembly 4 drives the plurality of wafers 6 to rise to the fourth target position, the plurality of wafers 6 are purged, for example, nitrogen or an inert gas is introduced into the tank body 1 through a pipe on the tank cover 2 to dry the surfaces of the plurality of wafers 6, as shown in FIG. Fig.21As shown, finally, the wafer 6 is lowered to a predetermined position in the tank body 1, such as a point for interacting with a process robot, and then the tank cover 2 is opened. Fig. 22 As shown, the second driving assembly 4 drives the plurality of wafers 6 to rise to the outside of the tank body 1 , and finally takes the wafers 6 out of the tank body 1 .

[0081] As described above, in the present application, at the stage when the multiple wafers 6 arranged side by side just begin to emerge from the liquid surface of the cleaning liquid to the stage when they are completely exposed from the liquid surface of the cleaning liquid, the first driving component 33 drives the bracket 31 to rotate to the first target position, and the first locking tooth group 321 constrains and positions the tops of the multiple wafers 6, thereby avoiding the stacking problem caused by the mutual adsorption between adjacent wafers 6 due to the influence of the surface tension of the cleaning liquid, which is not only beneficial to avoid damage caused by scratches between adjacent wafers 6, but also beneficial to subsequent transmission, and can ensure production capacity.

[0082] After completing Magorani drying of multiple wafers 6, the first drive assembly 33 drives the bracket 31 to rotate to the second target position, and the second latch gear group 322 constrains and positions the sides of multiple wafers 6, so that multiple wafers 6 can be constrained and positioned in the slot cover 2, which is also beneficial to avoid the problem of wafer 6 stacking, and can also help avoid damage caused by scratches between adjacent wafers 6 during the purging and drying process.

[0083] Please continue reading Figure 4 and Figure 5 As shown, the other end of the first support beam 312 is provided with two first branches 318 which are opposite to each other in the longitudinal direction, and each first branch 318 can be parallel to the extension direction of the main beam 311; the other end of the second support beam 313 is provided with two second branches 319 which are opposite to each other in the longitudinal direction, and each second branch 319 can be parallel to the extension direction of the main beam 311; one end of the main beam 311 extends between the two first branches 318 and is fixed to the first branch 318, for example, by screws, and the other end extends between the two second branches 319 and is fixed to the second branch 319, for example, by screws. This arrangement allows the main beam 311 to be provided with teeth at one end extending into the two first branches 318 and at the other end extending into the two second branches 319, so that the number of teeth in the first tooth group 321 and the second tooth group 322 is large, which is conducive to constraining and positioning more wafers 6.

[0084] The first branch 318 and the second branch 319 may be provided with a long hole, respectively, and the long hole is a through hole extending transversely. The main beam 311 is provided with mounting holes (not shown) at both ends, and the positions of the first latching tooth group 321 and the second latching tooth group 322 between the first support beam 312 and the second support beam 313 are adjusted by adjusting the longitudinal overlap position of the mounting holes and the corresponding long holes, so as to adjust the latching teeth on both sides of the main beam 311.

[0085] It should be understood that the wafer drying device provided in the present application is a complete device, and also has other necessary structures of known wafer drying devices, and may also have other non-essential structures. Only the components involved in cleaning and drying are described here, and other components are not elaborated.

[0086] In any of the above-mentioned examples of wafer drying devices, the position limiting structure 3 can be used as a separate device for production, assembly, transportation, sales, etc. Here, the embodiment of the present application also provides a position limiting structure, which at least includes a bracket, a first latching tooth group, a second latching tooth group and a first driving assembly.

[0087] The bracket includes a main beam and a first supporting beam and a second supporting beam respectively connected to two ends of the main beam;

[0088] The first latching tooth group and the second latching tooth group are arranged on opposite sides of the main beam;

[0089] The first driving component is connected to the first support beam and / or the second support beam, and is used to drive the main beam to rotate through the first support beam and / or the second support beam, and when the main beam rotates to the first target position, the first latch tooth group constrains the tops of the multiple wafers arranged side by side, and when the main beam rotates to the second target position, the second latch tooth group constrains the sides of the multiple wafers arranged side by side.

[0090] Each element of the limiting structure may have the same structural design and the same beneficial effects as the element of the limiting structure with the same name in any of the aforementioned examples, and will not be described in detail here.

[0091] The embodiment of the present application also provides a wafer drying method, based on any of the above-mentioned examples of wafer drying devices or any of the above-mentioned examples of limiting structures, such as Fig.23 As shown, the wafer drying method comprises the following steps:

[0092] S1: placing a plurality of wafers arranged side by side in a tank containing a cleaning solution, sealing the tank with a tank cover, and introducing isopropyl alcohol gas into the tank.

[0093] S2: driving the support to rotate to a first target position so that the first latching gear group constrains and positions the tops of the plurality of wafers.

[0094] S3: The cleaning liquid in the tank is discharged, and the plurality of wafers are subjected to Magoranie drying during the cleaning liquid discharge process.

[0095] S4: driving the support to rotate to the second target position.

[0096] S5: the isopropyl alcohol gas and the cleaning liquid in the tank body are emptied, and the plurality of wafers are lifted into the tank cover, and the second latching gear set rotated to the second target position constrains and positions the sides of the plurality of wafers.

[0097] S6: Purging the plurality of wafers to dry the surfaces of the plurality of wafers.

[0098] The limiting structure, wafer drying device and wafer drying method provided in the present application are several protection subjects based on the same concept, and the principles of solving the problems are basically the same or similar. The implementation methods of each protection subject can refer to each other. For example, the various steps of the wafer drying method can refer to the working principle and process of the aforementioned wafer drying device, and the repetitions of the implementation methods of each protection subject will not be repeated.

[0099] The above descriptions are only some embodiments of the present application, and are not intended to limit the patent scope of the present application. For ordinary technicians in this field, all equivalent structural changes made using the contents of this specification and drawings are also included in the patent protection scope of the present application.

[0100] Although the terms "first, second", etc. are used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. In addition, the singular forms "one", "an", and "the" are intended to include plural forms as well. The terms "or" and "and / or" are interpreted as inclusive, or mean any one or any combination. Only when the combination of elements, functions, steps, or operations is inherently mutually exclusive in some way, an exception to this definition will occur.

Claims

1. A limiting structure for limiting the position of a plurality of wafers arranged side by side, characterized in that: The limiting structure comprises: The bracket comprises a main beam and a first supporting beam and a second supporting beam respectively connected to two ends of the main beam; A first latching tooth group and a second latching tooth group are arranged on opposite sides of the main beam; A first driving component is connected to the first support beam and / or the second support beam, and is used to drive the main beam to rotate through the first support beam and / or the second support beam, and when the main beam rotates to a first target position, the first latching tooth group constrains and positions the tops of the multiple wafers arranged side by side, and when the main beam rotates to a second target position, the second latching tooth group constrains and positions the sides of the multiple wafers arranged side by side.

2. The limiting structure according to claim 1, characterized in that: The bracket further includes a first shaft, a first shaft sleeve, a second shaft and a second shaft sleeve, wherein the first shaft is fixed to one end of the first support beam, the first shaft sleeve is sleeved on the first shaft and is used to be fixed to one inner side of the slot cover, the second shaft is fixed to one end of the second support beam, the second shaft sleeve is sleeved on the second shaft and is used to be fixed to the other inner side of the slot cover; The first driving assembly includes a coupling and a driving source for driving the coupling, and the coupling is connected to the second shaft for driving the second shaft.

3. The limiting structure according to claim 2, characterized in that: The other end of the first support beam is provided with two first branches which are longitudinally opposite to each other; The other end of the second support beam is provided with two second branches which are longitudinally opposite to each other; One end of the main beam extends between the two first branches and is fixed to the first branch, and the other end extends between the two second branches and is fixed to the second branch.

4. The limiting structure according to claim 3, characterized in that: The first branch, the second branch and the extension direction of the main beam are parallel.

5. The limiting structure according to claim 3, characterized in that: The first branch and the second branch are respectively provided with a long hole, and the long hole is a through hole extending laterally; Both ends of the main beam are provided with mounting holes for adjusting the longitudinal overlap position with the long hole so as to adjust the positions of the first latching tooth group and the second latching tooth group between the first support beam and the second support beam.

6. The limiting structure according to any one of claims 1 to 5, characterized in that: The latching teeth in the first latching tooth group and the second latching tooth group are aligned one by one.

7. A wafer drying device, characterized in that: include: A tank body, used to place multiple wafers and cleaning liquid side by side; A tank cover, used for sealing the tank body; And, according to any one of claims 1 to 6, the bracket of the limiting structure is arranged inside the slot cover, and the first driving component is arranged outside the slot cover.

8. The wafer drying device according to claim 7, characterized in that: Also includes: The second driving component is used to drive the multiple wafers to perform lifting and lowering movements, and when driving the multiple wafers to rise to the third target position in the slot body, the first driving component drives the bracket to rotate to the first target position, and when driving the multiple wafers to rise to the fourth target position in the slot cover, the first driving component drives the bracket to rotate to the second target position.

9. The wafer drying device according to claim 7 or 8, characterized in that: Also includes: The third latching tooth group is arranged in the slot cover laterally opposite to the limiting structure. The third latching tooth group is arranged in the slot cover and is used to constrain and position the two sides of the multiple wafers respectively together with the second latching tooth group when the bracket rotates to the second target position.

10. The wafer drying device according to claim 9, characterized in that: The latching teeth in the third latching tooth group are aligned one by one with those in the second latching tooth group.

11. A wafer drying method, characterized in that: Based on the limiting structure described in any one of claims 1 to 6 or the wafer drying device described in any one of claims 7 to 9, The wafer drying method comprises: Placing a plurality of wafers arranged side by side in a tank containing a cleaning solution, sealing the tank with a tank cover, and introducing isopropyl alcohol gas into the tank; Driving the support to rotate to a first target position so that the first latching gear group constrains and positions the tops of the plurality of wafers; Discharging the cleaning liquid in the tank body, and performing Magoranie drying on the plurality of wafers during the process of discharging the cleaning liquid; driving the support to rotate to a second target position; Emptying the isopropyl alcohol gas and the cleaning liquid in the tank body, and raising the plurality of wafers into the tank cover, and constraining and positioning the sides of the plurality of wafers by the second latching tooth group rotated to the second target position; The wafers are purged to dry the surfaces of the wafers.

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