Manufacturing method of super-thick copper PCB (Printed Circuit Board) and PCB

Abstract

The embodiment of the invention provides a manufacturing method of an ultra-thick copper PCB and the PCB, and the method comprises the steps: S1, carrying out the cutting of a substrate with ultra-thick bottom copper, and forming an ultra-thick copper inner-layer core plate; s2, manufacturing an inner layer circuit pattern on the ultra-thick copper inner layer core plate; s3, after the inner layer circuit pattern is manufactured, browning processing is carried out on the copper surface of the ultra-thick copper inner layer core plate; s4, carrying out silk-screen printing and curing on the circuit gaps of the ultra-thick copper inner-layer core plate by adopting resin; s5, laminating the ultra-thick copper inner-layer core board and the prepreg PP according to a layer sequence to form a semi-finished PCB; according to the invention, the gaps between the lines are filled with the resin, so that the thickness of the resin is equal to the height of the lines, the problem of lack of glue between the lines after lamination is solved, the practical manufacturing process of the ultra-thick copper PCB is realized, the manufacturing quality of the ultra-thick copper PCB is fully improved, and the application prospect is wide.

Description

Technical Field

[0001] The present application belongs to the technical field of PCB boards, and specifically relates to a method for manufacturing an ultra-thick copper PCB board and a PCB board. Background Art

[0002] At present, the heat dissipation capacity of PCB components is improved by design solutions such as wide conductors, thick copper foil, thin plates or multi-layer structures, large-area copper plating or thick copper foil layers built into the core layer, adding metal base plates (such as the use of metal-based PCBs), and increasing thermal conductive holes. Considering the trend of electronic products towards thinness, lightness, miniaturization, and high density, as well as the development of current PCB manufacturing technology, more attention is paid to the use of thick copper foil to solve problems such as high-power PCB heat dissipation efficiency. High-current substrates are generally high-power and high-voltage substrates, which are mostly used in automotive electronics, communication equipment, aerospace, electric power, new energy (photovoltaic power generation, wind power generation), electric locomotives and other industries. Therefore, further improving the reliability and stability of substrate performance is currently the top priority in the production of high-current substrates.

[0003] In the prior art, products with a base copper thickness greater than 10oz are usually defined as ultra-thick copper. For ultra-thick copper products, conventional pressing production methods cannot overcome the problem of lack of glue between circuits. Based on this, the present invention proposes a method for manufacturing an ultra-thick copper PCB board, which can effectively solve the above problem. Summary of the invention

[0004] In view of the problems existing in the prior art, the present application provides a method for manufacturing an ultra-thick copper PCB board and a PCB board.

[0005] The present application provides a method for manufacturing an ultra-thick copper PCB board, comprising:

[0006] S1. Use a substrate with ultra-thick bottom copper to cut the material to form an ultra-thick copper inner core board;

[0007] S2, making inner layer circuit patterns on the ultra-thick copper inner layer core board;

[0008] S3. After the inner layer circuit pattern is completed, the copper surface of the ultra-thick copper inner layer core board is browned;

[0009] S4, screen printing and curing the line gap of the ultra-thick copper inner core board with resin;

[0010] S5. Lay and laminate the ultra-thick copper inner core board and the prepreg PP in order of layers to form a semi-finished PCB board.

[0011] Furthermore, the method of screen printing and curing the line gaps of the ultra-thick copper inner core board using resin includes:

[0012] Screen printing is performed on the line gaps on the front side of the ultra-thick copper inner core board, including using 36T white screen to screen print the front side, filling the line gaps with printed resin, placing it horizontally for 1 hour after printing, and then baking it in a cabinet oven at 110 degrees Celsius for 60 minutes for pre-curing;

[0013] Screen printing is performed on the line gap on the back of the ultra-thick copper inner core board, including using 36T white screen to screen print the back, filling the line gap with printed resin, placing it horizontally for 1 hour after printing, and then placing it in a cabinet oven at 150 degrees Celsius for 30 minutes for post-curing.

[0014] Furthermore, before laminating and pressing the ultra-thick copper inner core board and the prepreg PP in a layer-by-layer order to form a semi-finished PCB board, the method includes:

[0015] Grind off the excess resin on the copper surface of the extra-thick copper inner core board.

[0016] Furthermore, before laminating and pressing the ultra-thick copper inner core board and the prepreg PP in a layer-by-layer order to form a semi-finished PCB board, the method includes:

[0017] The ultra-thick copper inner core board after grinding is subjected to browning treatment again.

[0018] Further, the method comprises:

[0019] Drill holes for conducting inner-layer circuits on the semi-finished PCB board after lamination, and remove burrs on the hole openings;

[0020] Use chemical methods to deposit copper on the PCB board and in the holes to form a conductive effect;

[0021] Electroplating thickens hole copper and surface copper on the basis of copper deposition;

[0022] Electroplating hole copper to thicken the hole copper to the required range;

[0023] Use a vacuum plugging machine to plug the resin into the holes;

[0024] Using the principle of optical imaging to make the outer circuit pattern on the second outer core board;

[0025] Printing ink on the surface of PCB board;

[0026] Print text and logo on the outer layer of PCB;

[0027] Plate a thin layer of gold on the outer circuit pattern;

[0028] Produce PCB finished graphics of the size required by customers;

[0029] Conduct open and short circuit tests on finished PCB products to detect conduction performance;

[0030] Perform visual inspection on finished PCB products.

[0031] Furthermore, when the resin is used to screen print and solidify the circuit gaps of the ultra-thick copper inner core board, the scraper scrapes the solder paste on the screen board, and the solder paste is printed onto the ultra-thick copper inner core board through the holes on the screen board to achieve scraping.

[0032] Furthermore, the thickness of the scraper is 20 mm, the hardness of the scraper is 70-80 degrees, the angle of the scraper is 7-15 degrees, the speed of the scraper is 10-100 mm / s, and the pressure of the scraper is 0.2-0.35 MPa.

[0033] Furthermore, when printing ink on the surface of the PCB board, the ink return speed is 100-300 mm / s.

[0034] Furthermore, when the resin is used to screen print and solidify the line gaps of the ultra-thick copper inner core board, the resin is filled 1-3 times.

[0035] The present application also provides a PCB board, which is manufactured using the above-mentioned method for manufacturing the ultra-thick copper PCB board.

[0036] The above technical solution provided by the embodiment of the present application has the following advantages compared with the prior art: the present application uses a substrate with ultra-thick bottom copper for cutting to form an ultra-thick copper inner core board; the circuit pattern required by the customer is made on the ultra-thick copper inner core board by using the principle of optical imaging; after the inner layer circuit pattern is completed, the copper surface of the ultra-thick copper inner core board is browned, and the line gap of the ultra-thick copper inner core board is screen-printed with resin so that the resin fills the line gap, and the resin is cured; after the curing is completed, the stacked boards are arranged in the order of layers, and semi-cured sheets P are added between each ultra-thick copper inner core board as required P, the semi-cured sheet is completely cured by a press at high temperature and high pressure, so that all layers of copper base are pressed into a PCB semi-finished product with a sequential structure; the present application adopts the method of filling the gap between the lines with resin to make the resin thickness equal to the line height, which solves the problem of lack of glue between the lines after pressing, realizes the practical production process of ultra-thick copper PCB boards, and the circuit board lines formed by it are evenly copper-clad, which can meet the basic requirements of the circuit board, fully improves the quality of the production of ultra-thick copper circuit boards, effectively improves the quality reliability of ultra-thick copper multi-layer printed boards, significantly improves the company's production efficiency and benefits, and has broad prospects for use. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and, together with the description, serve to explain the principles of the invention.

[0038] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0039] In the attached picture:

[0040] Figure 1 A schematic diagram of the process of manufacturing an ultra-thick copper PCB board provided in this application. DETAILED DESCRIPTION

[0041] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific embodiments of the present invention are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the directions or positional relationships indicated by "front", "back", "up", "down", "left", "right", "longitudinal", "horizontal", "vertical", "horizontal", "top", "bottom", "inside", "outside", "head", "tail", etc. are based on the directions or positional relationships shown in the accompanying drawings, are constructed and operated in a specific direction, and are only for the convenience of describing the present technical solution, rather than indicating that the mechanism or element referred to must have a specific direction, and therefore cannot be understood as a limitation to the present invention.

[0042] It should also be noted that, unless otherwise clearly specified and limited, the terms such as "installed", "connected", "connected", "fixed", "set" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. When an element is referred to as being "on" or "under" another element, the element can be "directly" or "indirectly" located on the other element, or there may be one or more intermediate elements. The terms "first", "second", "third", etc. are only for the convenience of describing the present technical solution, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second", "third", etc. can explicitly or implicitly include one or more of the features. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0043] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present invention. However, it should be clear to those skilled in the art that the present invention may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, mechanisms, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present invention.

[0044] Figure 1 A schematic diagram of the process of manufacturing the ultra-thick copper PCB provided in this application, such as Figure 1 As shown, the present application provides a method for manufacturing an ultra-thick copper PCB board, comprising:

[0045] S1. Use a substrate with ultra-thick bottom copper to cut the material to form an ultra-thick copper inner core board;

[0046] S2, making inner layer circuit patterns on the ultra-thick copper inner layer core board;

[0047] S3. After the inner layer circuit pattern is completed, the copper surface of the ultra-thick copper inner layer core board is browned;

[0048] S4, screen printing and curing the line gap of the ultra-thick copper inner core board with resin;

[0049] S5. Lay and laminate the ultra-thick copper inner core board and the prepreg PP in order of layers to form a semi-finished PCB board.

[0050] Specifically, when the line gap of the ultra-thick copper inner core board is screen-printed and cured with resin, a scraper scrapes the solder paste on the screen board, and the solder paste is printed onto the ultra-thick copper inner core board through the holes on the screen board to achieve scraping; the thickness of the scraper is 20 mm, the hardness of the scraper is 70-80 degrees, the angle of the scraper is 7-15 degrees, the speed of the scraper is 10-100 mm / s, and the pressure of the scraper is 0.2-0.35 MPa; the number of resin fillings is 1-3 times.

[0051] Specifically, a substrate with ultra-thick bottom copper is used for cutting, and the large-size substrate material is cut into a small-size core board that meets the PNL size of the PCB board to form an ultra-thick copper inner core board; the circuit pattern required by the customer is made on the ultra-thick copper inner core board using the principle of optical imaging. After the inner layer circuit pattern is completed, the copper surface of the ultra-thick copper inner core board is browned, and the copper surface can also be roughened and blackened to ensure the adhesion between the resin and the copper surface; the line gap of the ultra-thick copper inner core board is screen-printed with resin, so that the resin fills the line gap, and the resin is cured; after the curing is completed, the stacked boards are arranged in layer order, and semi-cured sheets PP are added between each ultra-thick copper inner core board as required, and the press is heated to 400°. The semi-cured sheet is completely cured by high pressure, so that all layers of copper base are pressed into a semi-finished PCB with a sequential structure. After pressing, the PP flow glue will fill the line spacing area. After pressing, the ceramic grinding plate is used to grind off the PP glue overflowing at the spacing. This embodiment adopts the method of filling the line gap with resin to make the resin thickness equal to the line height, which solves the problem of lack of glue between the lines after pressing, realizes the practical production process of ultra-thick copper PCB boards, and the circuit board lines formed by it are evenly copper-coated, which can meet the basic requirements of the circuit board, fully improves the quality of the production of ultra-thick copper circuit boards, effectively improves the quality reliability of ultra-thick copper multi-layer printed boards, significantly improves the company's production efficiency and benefits, and has broad prospects for use.

[0052] Furthermore, the method of screen printing and curing the line gaps of the ultra-thick copper inner core board using resin includes:

[0053] T-side screen printing: screen printing the line gaps on the front side of the ultra-thick copper inner core board, including using 36T white screen to screen print the front side and fill the line gaps with printed resin;

[0054] T-surface curing: After the printed ultra-thick copper inner core board is placed horizontally for 1 hour, it is placed in a cabinet oven and baked at 110 degrees Celsius for 60 minutes for pre-curing;

[0055] B-side screen printing: screen printing the circuit gaps on the reverse side of the ultra-thick copper inner core board, including using 36T white screen to screen print the reverse side and printing resin to fill the circuit gaps;

[0056] B side curing: After the printed ultra-thick copper inner core board is placed horizontally for 1 hour, it is placed in a cabinet oven and baked at 150 degrees Celsius for 30 minutes for post-curing.

[0057] Specifically, the resin is filled into the line gap on the front side of the ultra-thick copper inner core board by silk screen printing, and the resin is initially cured by high temperature in a cabinet oven to prevent resin from being reversed when silk screen printing the B side. After silk screen printing of the T side is completed, the B side is silk screened using a 36T white screen, and the resin is thoroughly cured by high temperature in a cabinet oven to prevent delamination and explosion of the board due to uncured resin after pressing.

[0058] Furthermore, before laminating and pressing the ultra-thick copper inner core board and the prepreg PP in a layer-by-layer order to form a semi-finished PCB board, the method includes:

[0059] Grind off the excess resin on the copper surface of the extra-thick copper inner core board;

[0060] The ultra-thick copper inner core board after grinding is subjected to browning treatment again.

[0061] Specifically, the excess resin on the copper surface is ground away using a ceramic brush, leaving only the resin in the gaps between the lines.

[0062] Furthermore, the method further comprises:

[0063] Drilling: Drill holes for conducting inner-layer circuits on the semi-finished PCB board after lamination, and remove burrs on the hole openings;

[0064] Copper deposition: Copper is deposited on the PCB board and in the holes by chemical methods to form a conductive effect;

[0065] Electroplating: Electroplating thickens the hole copper and surface copper on the basis of copper deposition;

[0066] Hole plating: electroplating hole copper to thicken the hole copper to the required range;

[0067] Resin plugging: Use a vacuum plugging machine to plug the resin into the hole;

[0068] Sub-outer circuit: Use the principle of optical imaging to make the outer circuit pattern on the sub-outer core board;

[0069] Solder resist: printing ink on the surface of the PCB board; when printing ink on the surface of the PCB board, the ink return speed is 100-300mm / s;

[0070] Text: Print text and logo on the outer layer of PCB;

[0071] Gold plating: Plating a thin layer of gold on the outer circuit pattern;

[0072] Appearance: produce PCB finished graphics of the size required by customers;

[0073] Electrical testing: Conduct open and short circuit tests on finished PCB products to detect conduction performance;

[0074] Visual inspection: Perform appearance inspection on the finished PCB.

[0075] The present application also provides a PCB board, which is manufactured using the manufacturing method of the ultra-thick copper PCB board as described above.

[0076] The present application also provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the method for manufacturing an ultra-thick copper PCB board as described in any one of the above items when executing the computer program.

[0077] The present application also provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the method for manufacturing an ultra-thick copper PCB board as described in any of the above items is implemented.

[0078] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems, or computer program products. Therefore, the present application may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the present application may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code. The schemes in the embodiments of the present application may be implemented in various computer languages, such as C language, VHDL language, Verilog language, object-oriented programming language Java, and interpreted scripting language JavaScript, etc. These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer-readable memory produce a manufactured product including an instruction device, which is implemented in a box Figure 1 These computer program instructions can also be loaded onto a computer or other programmable data processing device, so that a series of operation steps are executed on the computer or other programmable device to produce a computer-implemented process, so that the instructions executed on the computer or other programmable device provide the functions specified in the box. Figure 1 The steps for the functions specified in one or more boxes.

[0079] Although the preferred embodiments of the present application have been described, those skilled in the art may make additional changes and modifications to these embodiments once they are aware of the basic creative concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present application.

[0080] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A method for manufacturing an ultra-thick copper PCB board, characterized in that: include: S1. Use a substrate with ultra-thick bottom copper to cut the material to form an ultra-thick copper inner core board; S2, making inner layer circuit patterns on the ultra-thick copper inner layer core board; S3. After the inner layer circuit pattern is completed, the copper surface of the ultra-thick copper inner layer core board is browned; S4, screen printing and curing the line gap of the ultra-thick copper inner core board with resin; S5. Lay and laminate the ultra-thick copper inner core board and the prepreg PP in order of layers to form a semi-finished PCB board.

2. The method for manufacturing an ultra-thick copper PCB according to claim 1, characterized in that: The method of screen printing and curing the line gaps of the ultra-thick copper inner core board using resin includes: Screen printing is performed on the line gaps on the front side of the ultra-thick copper inner core board, including using 36T white screen to screen print the front side, filling the line gaps with printed resin, placing it horizontally for 1 hour after printing, and then baking it in a cabinet oven at 110 degrees Celsius for 60 minutes for pre-curing; Screen printing is performed on the line gap on the back of the ultra-thick copper inner core board, including using 36T white screen to screen print the back, filling the line gap with printed resin, placing it horizontally for 1 hour after printing, and then placing it in a cabinet oven at 150 degrees Celsius for 30 minutes for post-curing.

3. The method for manufacturing an ultra-thick copper PCB according to claim 1, characterized in that: The method comprises: laminating and pressing the ultra-thick copper inner core board and the prepreg PP in a layer-by-layer order to form a semi-finished PCB board; Grind off the excess resin on the copper surface of the extra-thick copper inner core board.

4. The method for manufacturing an ultra-thick copper PCB according to claim 3, characterized in that: The method comprises: laminating and pressing the ultra-thick copper inner core board and the prepreg PP in a layer-by-layer order to form a semi-finished PCB board; The ultra-thick copper inner core board after grinding is subjected to browning treatment again.

5. The method for manufacturing an ultra-thick copper PCB according to claim 1, characterized in that: include: Drill holes for conducting inner-layer circuits on the semi-finished PCB board after lamination, and remove burrs on the hole openings; Use chemical methods to deposit copper on the PCB board and in the holes to form a conductive effect; Electroplating thickens hole copper and surface copper on the basis of copper deposition; Electroplating hole copper to thicken the hole copper to the required range; Use a vacuum plugging machine to plug the resin into the holes; Using the principle of optical imaging to make the outer circuit pattern on the second outer core board; Printing ink on the surface of PCB board; Print text and logo on the outer layer of PCB; Plate a thin layer of gold on the outer circuit pattern; Produce PCB finished graphics of the size required by customers; Conduct open and short circuit tests on finished PCB products to detect conduction performance; Perform visual inspection on finished PCB products.

6. The method for manufacturing an ultra-thick copper PCB according to claim 1, characterized in that: When the resin is used to screen print and solidify the line gap of the ultra-thick copper inner core board, the scraper scrapes the solder paste on the screen board, and the solder paste is printed onto the ultra-thick copper inner core board through the holes on the screen board to achieve scraping.

7. The method for manufacturing an ultra-thick copper PCB according to claim 6, characterized in that: The thickness of the scraper is 20 mm, the hardness of the scraper is 70-80 degrees, the angle of the scraper is 7-15 degrees, the speed of the scraper is 10-100 mm / s, and the pressure of the scraper is 0.2-0.35 MPa.

8. The method for manufacturing an ultra-thick copper PCB according to claim 5, characterized in that: When printing ink on the surface of the PCB board, the ink return speed is 100-300mm / s.

9. The method for manufacturing an ultra-thick copper PCB according to claim 1, characterized in that: When the resin is used to screen print and solidify the line gaps of the ultra-thick copper inner core board, the resin is filled 1-3 times.

10. A PCB board, characterized in that: The ultra-thick copper PCB is manufactured by the manufacturing method of any one of claims 1 to 9.

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