M.2 card adapter and radiator

Abstract

An M.2 adapter / heat sink includes a thermal diffuser clip configured to receive an M.2 module having a plurality of M.2 module lengths. The M.2 adapter / heat sink also includes an adapter fastener and a spacer. The adapter fastener may be attached to the thermal diffuser clip at any one of a plurality of attachment positions respectively corresponding to different M.2 module lengths. When the M.2 module is received in the clip, the adapter fastener attaches to the clip at an attachment location corresponding to the length of the M.2 module. The adapter fastener engages the M.2 base of the M.2 module, thereby attaching the M.2 module to the clip. The spacer is attached to the thermal diffuser clip and positioned such that a replica M.2 mount of the spacer may be connected to the PCA by a fastener. Thus, the spacer will clip and thus also attach (indirectly) the M.2 module to the PCA.

Description

Background Art

[0001] M.2 is a specification for computer expansion cards and associated connectors. Expansion cards that meet the M.2 specification may be referred to herein as M.2 cards or M.2 modules, and may include things such as storage modules (e.g., solid-state drives (SSDs)), WiFi modules, Bluetooth modules, near-field communications (NFC) modules, etc. The M.2 specification relates to both the physical form factor and electrical connectivity of the M.2 module. Several different sizes of M.2 modules are available, including a width of 12, 16, 22, or 30 mm and a length of 16, 26, 30, 38, 42, 60, 80, or 110 mm. The M.2 module has an edge-style electrical connector at the edge in a width direction (width-wise) and an M.2 base at the edge in the opposite width direction. The M.2 base includes a semicircular hole and an edge / lip defining the hole. The M.2 module is mounted on a host printed circuit assembly (PCA) in the following manner: the edge connector is connected to the electrical connector of the host PCA, and the M.2 base is connected to the PCA via a fastener. The fastener includes a standoff and a set screw. The standoff is attached to the PCA at a predetermined position arranged so that as the edge connector is connected to the electrical connector, the M.2 base is aligned with and rests on top of the standoff. The set screw is inserted through the semicircular hole and engages with the standoff so that when tightened, the rim / lip around the semicircular hole is clamped between the set screw and the standoff. In this way, the M.2 module is secured to the PCA and supported at its two opposing widthwise edges: one edge is connected to and supported by the electrical connector, and the other edge is connected to and supported by the fastener. BRIEF DESCRIPTION OF THE DRAWINGS

[0002] can be derived from the following detailed description alone or in conjunction with the attached Figure 1 The accompanying drawings are included to provide a further understanding of the present disclosure and are incorporated into and constitute a part of this specification. The accompanying drawings illustrate one or more examples of the present teachings and together with the description explain certain principles and operations. In the drawings:

[0003] Figure 1 is a block diagram schematically illustrating an example M.2 adapter / heat sink.

[0004] Figure 2 It is schematically shown including Figure 1 A block diagram of the M.2 adapter / heatsink system.

[0005] Figure 3 Here's a perspective view of another example M.2 adapter / heat sink.

[0006] Figure 4 yes Figure 3An exploded perspective view of the M.2 adapter / heat sink.

[0007] Figure 5 yes Figure 3 Front view of the M.2 adapter / heat sink.

[0008] Figure 6 yes Figure 3 A top view of the M.2 adapter / heat sink.

[0009] Figure 7 yes Figure 3 Rear view of the M.2 adapter / heat sink.

[0010] Figure 8 yes Figure 3 Bottom view of the M.2 adapter / heat sink.

[0011] Fig. 9 yes Figure 3 Left side view of the M.2 adapter / heat sink.

[0012] Fig.10 yes Figure 3 Right side view of the M.2 adapter / heat sink.

[0013] Fig.11 is in a state of disengagement Figure 3 A perspective view of the M.2 adapter / heatsink, M.2 fasteners, and M.2 modules.

[0014] Fig.12 is in attached state Fig.11 A perspective view of the M.2 fastener and M.2 module.

[0015] Fig.13 yes Figure 3 A top perspective view of the M.2 adapter / heat sink spacer.

[0016] Fig.14 yes Figure 3 Bottom perspective view of the M.2 adapter / heat sink spacer.

[0017] Fig.15 yes Figure 3 A perspective view of the M.2 adapter / heat sink with the first M.2 module installed in it.

[0018] Fig.16 yes Fig.15 Front view of the M.2 adapter / heatsink and first M.2 module.

[0019] Fig.17 yes Fig.15 Top view of the M.2 adapter / heatsink and first M.2 module.

[0020] Fig.18 yes Fig.15 Rear view of the M.2 adapter / heatsink and first M.2 module.

[0021] Fig.19 yes Fig.15 Bottom view of the M.2 adapter / heat sink and first M.2 module.

[0022] Fig. 20 yes Fig.15 Left side view of the M.2 adapter / heatsink and first M.2 module.

[0023] Fig.21 yes Fig.15 Right side view of the M.2 adapter / heat sink and first M.2 module.

[0024] Fig. 22 yes Fig.15 Cross-section of the M.2 adapter / heat sink and first M.2 module, with the section taken along AA.

[0025] Fig.23 yes Figure 3 A perspective view of the M.2 adapter / heat sink with a second M.2 module installed in it.

[0026] Fig.24 is a perspective view of an example system in a first state, the system including a PCA and Figure 3 The M.2 adapter / heatsink, in which the first M.2 module is installed.

[0027] Fig.25 It is in the second state Fig.23 perspective of the system.

[0028] Fig.26 It is in the third state Fig.23 perspective of the system.

[0029] Fig. 27 It is in the first state Fig.23 A partial perspective view of a portion of a system.

[0030] Fig.28 It is in the third state Fig.23 A partial perspective view of a portion of a system.

[0031] Fig.29 is a top-down perspective view of another example system that includes another PCA and two Figure 3 The M.2 adapters / heat sinks each have one of the first M.2 modules installed therein.

[0032] Fig.30 is a bottom-up perspective view of another example system that includes another PCA and two Figure 3 The M.2 adapters / heat sinks each have one of the first M.2 modules installed therein. DETAILED DESCRIPTION

[0033] When in use, the M.2 module may generate heat. For example, in an M.2 SSD module, the storage controller of the module may generate a large amount of heat. Therefore, in order to keep the temperature of the storage controller within the desired range, it is necessary to remove the heat generated thereby. One way to remove such heat is to dissipate the heat into the air flowing around the module. However, in some cases, the air flowing around the module cannot dissipate the heat quickly enough to fully cool the device because the surface area of ​​the heat-generating component exposed to the air flow is too small. Generally, the larger the surface area of ​​the component exposed to the air flow, the greater the rate at which heat can be dissipated from the component to the air flow. Therefore, to ensure sufficient cooling of the M.2 module, the manufacturer of the computing device may attach a heat sink to the M.2 module, wherein the heat sink is configured to diffuse the heat generated by the component outward to a larger surface area and thus generate a greater rate of heat transfer to the air flow.

[0034] As described above, M.2 modules come in a variety of different sizes, and it is not uncommon for manufacturers of computing devices to use multiple different sized M.2 modules in their systems. One reason a manufacturer may utilize multiple different sized M.2 modules is to provide more choice and flexibility to customers. Another reason is that a manufacturer may obtain M.2 modules from multiple different suppliers (e.g., to ensure that a shortage or failure of one supplier does not disrupt the manufacturer's operations), and these different suppliers of M.2 modules may provide modules of different sizes.

[0035] However, one problem that arises from attempting to accommodate multiple different sized M.2 modules is that each M.2 module size may require a different heat sink to accommodate the specific size of the corresponding M.2 module. Therefore, a manufacturer of a computing system may need to design, produce, and / or stock multiple different models of M.2 heat sinks. Designing and producing multiple models of M.2 heat sinks increases manufacturing costs, for example, due to different tooling required for each model. In addition, having multiple models of M.2 heat sinks increases the number of SKUs in use, which can increase logistics costs.

[0036] Therefore, it may be desirable to be able to use a heat sink of the same design for a variety of different sized M.2 modules. However, this can be challenging due to the different sizes of M.2 modules. For example, a long heat sink that accommodates a long M.2 module may not be used with a shorter M.2 module because the longer heat sink may extend outward beyond the distal end of the shorter M.2 module, thereby obstructing access to the M.2 base of the shorter M.2 module and thus preventing the module from being attached to the PCA. On the other hand, if a shorter heat sink is used to avoid obstructing the M.2 base of the shorter module, the longer M.2 module may not be adequately cooled because the smaller heat sink may not be able to fully cover the larger M.2 module, and therefore the heat sink may not be thermally coupled to some of the heat generating components of the larger M.2 module. In addition, a smaller heat sink may have a smaller surface area, and therefore may not be able to provide a sufficient heat transfer rate for a larger set of M.2 modules that are compatible with the M.2 module size.

[0037] To address these and other issues, examples disclosed herein include an M.2 adapter / heat sink compatible with a variety of different M.2 module sizes. These M.2 module sizes may be referred to herein as a set of compatible M.2 module sizes, a set of compatible sizes, compatible M.2 module sizes, or compatible sizes. An M.2 module having one of the compatible sizes may be referred to as a set of compatible M.2 modules or a compatible M.2 module. The M.2 adapter / heat sink being compatible with the set of compatible sizes means that the M.2 adapter / heat sink is able to securely attach any M.2 module having one of the compatible sizes to the host PCA and also provide adequate cooling for each such module. The M.2 adapter / heat sink can be used as both an adapter and a heat sink. The reason why the M.2 adapter / heat sink acts as an adapter is that it facilitates the attachment of any one of the compatible M.2 modules to the PCA, regardless of the corresponding size of the M.2 module (as long as it is one of the compatible M.2 module sizes), and the reason why the M.2 adapter acts as a heat sink is that it can be thermally coupled to the heat generating components of the M.2 module to facilitate heat transfer to the surrounding air. In particular, the M.2 adapter / heat sink includes: a heat spreader clip configured to clamp around an M.2 module; a spacer that is selectively attachable to the heat spreader clip; and an adapter fastener that is selectively attachable to the heat spreader clip at any one of a plurality of mounting positions corresponding to M.2 modules of different sizes.

[0038] The length of the heat spreader clip can be similar to the length of the longest M.2 module in the set of compatible sizes, and therefore the heat spreader clip can also fully cover any of the other compatible M.2 module sizes. Because the heat spreader can fully cover all compatible M.2 module sizes, it can thermally couple with all heat generating components on any of the compatible M.2 modules, thereby ensuring that adequate cooling is provided for each M.2 module. In addition, because the heat spreader is sized to match the largest M.2 module in the set, its surface area is maximized, thereby further improving cooling efficiency.

[0039] In addition, the adapter fastener and spacer allow for secure attachment to the PCA of each of the compatible M.2 modules, regardless of size (as long as it is within the set of compatible sizes). Specifically, if the longest M.2 module is installed, the distal end of the M.2 module extends just beyond the distal end of the heat spreader clip, and the M.2 base of the M.2 module can be directly fastened to the PCA. However, if an M.2 module shorter than the longest M.2 module is used, the adapter fastener can be used to attach the shorter M.2 module to the heat spreader clip, and the spacer can be used to fasten the heat spreader clip to the PCA, thereby indirectly securing the M.2 module to the PCA via the M.2 adapter / heat sink. In particular, the adapter fastener is configured to selectively attach to the heat spreader clip at one of a set of predetermined mounting locations (e.g., mounting holes) and engage the M.2 base of the M.2 module in that location. These predetermined mounting positions correspond to compatible M.2 module sizes, respectively, and are arranged so as to align with the M.2 base of the corresponding M.2 module when the corresponding M.2 module is installed in the M.2 adapter / heat sink. Thus, when a given M.2 module is installed, the adapter fastener can be engaged with its M.2 base by installing the adapter fastener at the corresponding mounting position. In addition, the spacer may be attached to the heat spreader clip, near the distal end of the heat spreader clip, and the spacer is in turn attached to the PCA. The spacer may have a replica M.2 base formed therein, which is attached to the PCA using the same M.2 fastener that will be used for the longer M.2 module. Thus, the M.2 module is attached to the heat spreader clip (via the adapter fastener), the heat spreader clip is attached to the spacer, the spacer is attached to the PCA, and thus the M.2 module is indirectly attached to the PCA via the M.2 adapter / heat sink. Thus, while the heat spreader clip may extend beyond the distal end of a shorter M.2 module and thereby obstruct its M.2 base, thereby preventing the possibility of mounting the M.2 module directly to the PCA, the adapter fastener and spacer allow the shorter M.2 to be securely attached (indirectly) to the PCA.

[0040] Therefore, because a single heat sink design can be used with a variety of different sized M.2 modules, fewer types of heat sinks may be needed (in some cases, a single heat sink model can cover all of a manufacturer's needs), and thus manufacturing and logistics costs can be reduced. In addition, the M.2 adapter / heat sink achieves this while providing adequate cooling and secure attachment for each of the different sized M.2 modules (although they are different sizes).

[0041] Additionally, an M.2 adapter / heat sink may allow for simplification of the PCA to which the M.2 modules will be attached, which further reduces manufacturing costs. Specifically, if a variety of different sized M.2 modules will be used, the PCA may need to be configured with multiple different mounting points at which fasteners can be attached to account for the different locations of the M.2 bases for the different sized M.2 modules. These multiple mounting points take up valuable PCA space and restrict PCA design. In contrast, with an M.2 adapter / heat sink, only one attachment point is required, which can be used for all the different compatible sized M.2 modules.

[0042] Turning now to the figures, various apparatus, systems, and methods in accordance with aspects of the present disclosure will be described.

[0043] Figure 1 is a block diagram schematically illustrating an M.2 adapter / heat sink 10, and Figure 2 is a block diagram schematically illustrating a system 90 including the same M.2 adapter / heat sink 10. It should be understood that Figure 1 and Figure 2 The specific shapes, sizes, or other structural details are not intended to be illustrated accurately or to scale, and embodiments of the M.2 adapter / heat sink 10 and system 90 may have a different number and arrangement of the components illustrated, and may also include other parts not illustrated. Figure 1 and Figure 2 In the drawings, attachments / connections between components are conceptually indicated by lines (both solid and dashed), wherein dashed lines indicate that attachment is selective, optional, and / or reversible (e.g., a connection may be established in some states and not in other states), and thermal coupling between components is indicated by dashed lines. Thermal coupling between two components may include direct contact therebetween, or mutual contact with a thermally conductive intermediate, such as a thermal interface material (TIM).

[0044] like Figure 1As shown in , the M.2 adapter / heat sink 10 includes a heat spreader clip 20. The heat spreader clip 20 includes a top wall 21, a bottom wall 22, and a spine 23. In some examples, the top wall 21, the bottom wall 22, and the spine 23 can be integrally connected parts, meaning that they are part of the same single body (rather than physically separate parts that have been joined together). For example, in some embodiments, the top wall 21, the bottom wall 22, and the spine 23 are formed from a single piece of sheet metal that has been bent and / or otherwise formed into the shape of the heat spreader clip 20. The top wall 21 and the bottom wall 22 are arranged substantially parallel to each other. The spine 23 is perpendicular to the top wall 21 and the bottom wall 22 and extends therebetween, wherein the spine 23 is attached to the top wall 21 and the bottom wall 22 at their lateral edges, which may be referred to as attachment edges of the walls 21 and 22 hereinafter. Therefore, the heat spreader clip 20 has a generally C-shaped or U-shaped cross-section. The space between the top wall 21 and the bottom wall 22 is configured to receive an M.2 module, wherein the two widest faces of the M.2 module are adjacent to the top wall 21 and the bottom wall 22, respectively. In this context, the two widest faces of the M.2 module are adjacent to the top wall 21 and the bottom wall 22, which means that they are positioned opposite to each other and are either in direct contact with each other or in contact with the TIM disposed therebetween. In some examples, the attachment edges of the top wall 21 and the bottom wall 22 are lateral edges that extend parallel to the longitudinal (longitudinal) dimension of the heat spreader clip 20, which also corresponds to the longitudinal dimension of the M.2 module when installed in the M.2 adapter / heat sink 10.

[0045] The heat spreader clip 20 is formed of a thermally conductive material. In some examples, the heat spreader clip 20 is formed of copper (or its alloys), aluminum (or its alloys), brass (or its alloys), nickel (or its alloys), zinc (or its alloys), stainless steel, another thermally conductive metal (or its alloys), or a thermally conductive plastic. In some examples, the heat spreader clip 20 is formed of a highly thermally conductive material (defined below), such as some forms of copper or aluminum.

[0046] The heat spreader clip 20 is also configured to thermally couple with M.2 modules when these modules are installed in the heat spreader clip 20. Specifically, the heat spreader clip 20 is configured so that each of the top wall 21 and the bottom wall 22 is either (1) in direct contact with the M.2 module installed in the clip 20, or (2) in indirect contact with the M.2 module via mutual contact with a thermally conductive intermediate member (such as a TIM) disposed between the corresponding wall and the M.2 module.

[0047] In some examples, the heat spreader clip 20 is configured to function like a spring clip that generates spring forces that clamp the top wall 21 and the bottom wall 22 against the opposite face of the M.2 module (directly or via the TIM). More specifically, the top wall 21 and the bottom wall are spring biased toward a rest position in which the free edges of the top wall 21 and the bottom wall 22 (i.e., the edges opposite the attachment edge attached to the ridge 23) are a first distance apart, but when the M.2 module is installed, the top wall 21 and the bottom wall 22 can be deflected away from the rest position to a position in which the free edges of the top wall 21 and the bottom wall 22 are a second distance apart, the second distance being greater than the first distance. Therefore, due to this deflection, spring forces are generated that urge the top wall 21 and the bottom wall 22 back toward the rest position and thus the top wall and the bottom wall 21 are pressed against the opposite face of the M.2 module. This clamping action may help ensure good thermal contact between the clip 20 and the M.2 module, whether direct or indirect via the TIM.

[0048] The above-described thermal coupling of the heat spreader clip 20 to the M.2 module allows the heat spreader clip 20 to absorb heat from the heat generating components of the M.2 module (such as a storage controller or other heat generating components). The heat spreader clip 20 diffuses this absorbed heat outwardly across the surface of the heat spreader clip 20 via conduction through the heat spreader clip 20, and the heat spreader clip 20 then dissipates the heat into the cooling air flow that flows around and impinges on the clip 20. Because the absorbed heat is diffused outwardly across the heat spreader clip 20 (which has a relatively large surface area compared to the surface area of ​​the heat generating components), the heat can be transferred from the clip 20 to the air at a much greater rate than can be achieved if the heat generating components are simply directly exposed to the cooling air flow (the rate of heat transfer to the air depends on the contact area between the air and the body transferring the heat into the area). The thermal interface between the heat generating component and the clip 20, as well as the conduction of heat through the clip 20, will impose a certain resistance to the heat flow (as will every thermal interface). However, because the clip 20 is formed of a thermally conductive material, the resistance to heat transfer can be relatively small, and the improvement in the rate of heat dissipation into the ambient air can more than make up for these other losses. Therefore, the heat spreader clip 20 allows relatively high rates of heat transfer from the M.2 module to the ambient air, and these rates can be much higher than the rates that can be achieved when the M.2 module is directly exposed to the cooling air flow without the heat spreader clip 20.

[0049] like Figure 1As shown in , the heat spreader clip 20 may also include protrusions 25, which are attached to one or both of the top wall 21 and the bottom wall 22. These protrusions may protrude from the (multiple) faces of the top wall 21 and / or the bottom wall 22 to promote better heat transfer to the surrounding air. These protrusions can improve heat transfer because they protrude into the air flowing around the heat spreader clip 20, thereby allowing more air to contact the heat spreader clip 20-in other words, these protrusions increase the total contact area between the flowing air and the heat spreader clip 20. These protrusions may include, for example, folded fins, skived fins, molded / cast fins, pin arrays, or any other type of protrusions. In some examples, the protrusions (e.g., fins) are integrally coupled to the top wall 21 and / or the bottom wall 22, which means that they are formed by the same single body. For example, in some embodiments, the top wall 21 and / or the bottom wall 22 comprise planar pieces of sheet metal, and the protrusions 25 comprise folded fins stamped from the sheet metal—for example, the protrusions may be partially cut from the remainder of the sheet, with one end of each protrusion remaining integrally connected to the remainder of the sheet, and the cut portion may then be folded so that it extends perpendicularly from the remaining planar portion of the sheet. In other examples, the protrusions (e.g., fins) may be portions that are formed separately from the top wall 21 and / or the bottom wall 22 and later attached thereto (e.g., via solder, brazing, welding, adhesives, mechanical fasteners, or any other fastening technique).

[0050] By varying the properties of the clip 20 and / or the TIM used between the clip and the M.2 module, the rate of heat transfer between the M.2 module and the air via the clip 20 can be adjusted to a desired level. In particular, the rate of heat transfer can depend on: the surface area of ​​the clip 20, which can be adjusted, for example, by configuring the number, size, and / or shape of the protrusions 25; the thermal conductivity of the material used for the clip 20; and the heat transfer rate of the thermal interface between the clip 20 and the M.2 module, which can be adjusted, for example, by varying the TIM. Thus, the desired heat transfer rate of the clip 20 can be balanced with other factors (e.g., cost), depending on the goals and constraints of a particular implementation.

[0051] In some examples, a removable handle (not shown) may be attached to the heat spreader clip 20 and configured to be actuable by a user to spread the top wall 21 and the bottom wall 22 apart, thus allowing an M.2 module to be inserted into the space between the top wall 21 and the bottom wall 22. For example, the handle may be attached to the free edges of the top wall 21 and the bottom wall 22 and arranged to act as a lever using the top wall 21 and the bottom wall 22 as a fulcrum, so that squeezing the free ends of the handle together forces the free edges of the top wall 21 and the bottom wall 22 to move away from each other. After the M.2 module is inserted into the clip 20, the handle may be released to allow the spring force to press the top wall 21 and the bottom wall 22 against the M.2 module, whereupon the handle may be removed from the clip 20.

[0052] As described above, when the M.2 adapter / heat sink 10 is used and an M.2 module of any size except the maximum size is mounted therein, the M.2 module is not directly coupled to the PCA. Instead, the M.2 module is coupled to the heat spreader clip 20 via the adapter fastener 40 that engages with the fastener holes 28 / 29 in the clip 20, and then the adapter / heat sink 10 is attached to the PCA via the spacer 30. Thus, the M.2 module is indirectly coupled to the PCA via the M.2 adapter / heat sink 10. If the maximum M.2 module is used, the fastener 40 and the spacer 30 are omitted, and the M.2 module can be directly coupled to the PCA.

[0053] like Figure 1 As shown in , the top wall 21 includes a plurality of fastener holes 28. Similarly, the bottom wall 22 includes a plurality of fastener holes 29. The plurality of fastener holes 28 are distributed along the length dimension of the top wall 21, and the plurality of fastener holes 29 are distributed along the length dimension of the bottom wall 22, wherein each fastener hole 28 is aligned with a corresponding fastener hole 29 to form a pair. Each pair of fastener holes 28 / 29 corresponds to one M.2 size in the set of compatible M.2 sizes, and is positioned so as to align with the M.2 base of the corresponding M.2 module when the module is installed in the clip 20. That is, if an M.2 module of the first size is installed, its M.2 base is aligned with the first pair of fastener holes 28 / 29; if an M.2 module of the second size is installed, its M.2 base is aligned with the second pair of fastener holes 28 / 29; and so on for each size of M.2 module in the set of compatible modules, except for the longest module, which does not have a corresponding pair of fastener holes 29 / 29. In some examples, there are five compatible sizes of M.2 modules in the set, and therefore there are four pairs of fastener holes 28 / 29 distributed along the length of the clip 20. For example, in some embodiments, the set of compatible module sizes includes modules with lengths of 30, 42, 60, 80, and 110 mm, and the pairs of fastener holes 28 / 29 are arranged at positions corresponding to the M.2 bases of 30, 42, 60, and 80 mm length modules.

[0054] The adapter fastener 40 is configured to be selectively mounted at any pair of the paired fastener holes 28 / 29. When the adapter fastener 40 is mounted at a given pair of fastener holes, the first portion 41 of the adapter fastener 40 engages with the fastener hole 28 in the top wall 21, and the second portion 42 of the adapter fastener 40 engages with the fastener hole 29 of the bottom wall 22, and in this manner the adapter fastener 40 is attached to the heat spreader clip 20. For example, the first portion 41 and the second portion 42 of the adapter fastener 40 may each include a columnar support having a snap-fit ​​feature disposed at one end thereof. The fastener holes 28 and 29 may be configured as snap-fit ​​holes that interface with the snap-fit ​​features of the first portion 41 and the second portion 42, respectively, to attach the first portion and the second portion 42 to the top wall 21 and the bottom wall 22, respectively. For example, first portion 41 of adapter fastener 40 may be positioned above top wall 21, and first portion 41 may then be pressed downwardly into fastener hole 28, causing first portion 41 to extend into the interior space between top wall 21 and bottom wall 22 and causing snap-fit ​​features of first portion 41 to engage with fastener hole 28. Conversely, second portion 42 may be positioned below bottom wall 22, and second portion 42 may then be pressed upwardly into fastener hole 29, causing second portion 42 to extend into the interior space between top wall 21 and bottom wall 22 and causing snap-fit ​​features of second portion 42 to engage with fastener hole 29. As another example, first portion 41 and second portion 42 of adapter fastener 40 may include threaded screw holes, and fastener holes 28 and 29 may include threaded screw holes to engage threads of adapter fastener 40.

[0055] The first portion 41 and the second portion 42 of the adapter fastener 40 also include an engagement surface. The engagement surface may include an end face or an annular boss, lip, or flange of the portion 41 or 42. The engagement surface is configured to engage the opposite side of the M.2 base of the M.2 module when the M.2 module is installed in the clip 20 and the adapter fastener 40 is attached to the clip 20. That is, if a given M.2 module is installed in the clip, when the first portion 41 is inserted into the corresponding fastener hole 28, the engagement surface of the first portion 41 engages (e.g., contacts or abuts) the top surface of the M.2 base of the given M.2 module, and then when the second portion 42 is inserted into the corresponding fastener hole 29, the engagement surface of the second portion 42 engages (e.g., contacts or abuts) the bottom surface of the M.2 base of the given M.2 module. Therefore, the M.2 base is clamped between the first portion 41 and the second portion 42, thereby fastening the M.2 module to the adapter fastener 40. Because the first and second portions 41, 42 are themselves attached to the clip 20, the M.2 module is also attached to the clip 20 via its engagement with the adapter fastener 40. The same type of attachment can be made for each size of M.2 module (except the largest size), with the fastener 40 installed at a different pair of holes 28 / 29, depending on the size of the module being used. If the largest M.2 module is used, the fastener 40 is omitted, and instead of attaching the module to the clip 20, the module is attached directly to the PCA using its M.2 mount.

[0056] The first portion 41 and the second portion 42 of the adapter fastener 40 may also be connected to each other. For example, the second portion 42 may include a coupling portion that extends beyond the engagement portion and couples with the first portion 41 (when both are installed in corresponding holes 28 / 29). For example, the coupling portion may include a pin or column that extends through the semicircular hole of the M.2 base and into the hole in the first portion 41 to couple the first portion 41 and the second portion 42 together.

[0057] As described above, the M.2 adapter / heat sink 10 also includes a spacer 30. The spacer 30 is configured to be attached to the clip 20, near the distal end of the heat spreader clip, when M.2 modules other than the longest M.2 module are installed in the heat spreader clip 20. (The proximal end of the M.2 module is the end with the edge connector, and similarly, the proximal end of the adapter / heat sink 10 is the end adjacent to the edge connector of the M.2 module; its distal end is the end opposite its proximal end). The spacer 30 is disposed in the space between the top wall 21 and the bottom wall 22, adjacent to the M.2 module and in line with it. The spacer 30 can be attached to the top wall 21 and / or the bottom wall 22, for example via screws or other fasteners. The spacer 30 includes a replica M.2 base 35 formed therein. The replica M.2 base 35 has a shape and size similar to the standard M.2 base, but is referred to as a "replica" herein because it is formed on the spacer 30 rather than on the actual M.2 module. The spacer 30 is positioned in the clip 20 so that when the largest M.2 module is installed in the clip 20, the replica M.2 base 35 is located at the same position as the M.2 base of the largest M.2 module. Therefore, the replica M.2 base 35 is aligned with the same PCA fastener that will be used to fasten the largest M.2 module to the PCA. Therefore, the spacer 30 can be attached to the PCA using the M.2 fastener, thereby attaching the M.2 adapter / heat sink 10 to the PCA.

[0058] For example, Figure 2 The following are illustrated: an example assembly 85 including an M.2 adapter / heat sink 10 having an M.2 module 50 installed therein; and an example system 90 including the assembly 85 and a host PCA 60. The M.2 module 50 has a size in the set of compatible sizes for the M.2 adapter / heat sink, but is not the longest M.2 module in the set. The M.2 module 50 is disposed in the space between the top wall 21 and the bottom wall 22, and the M.2 module 50 is thermally coupled to the top wall 21 and the bottom wall 22, as shown by Figure 2 The adapter fastener 40 is then installed at a pair of fastener holes 28 / 29 that correspond to the specific size of the M.2 module 50, and thus the first portion 41 and the second portion 42 of the fastener 40 engage opposite sides of the M.2 base 52 of the M.2 module 50, as indicated by Figure 2 In addition, the spacer 30 is installed in the adapter / heat sink 10 and attached thereto, as indicated by the dashed line in FIG. Figure 2 The resulting combination of the M.2 adapter / heat sink 10 and the M.2 module 50 mounted therein forms an assembly 85 .

[0059] The assembly 85 may then be positioned adjacent to the host PCA 60, and the connector 51 of the M.2 module 50 may be physically and electrically connected to the complementary connector 61 of the PCA 60. The distal end of the assembly 85 is then secured to the PCA 60 by a PCA fastener 65 that engages at one end with the replica M.2 mount 35 of the spacer 30 and at the other end with a fastener hole 66 coupled to the PCA 60. The PCA fastener 65 may be a standoff with a set screw, such as would be commonly used to fasten a bare M.2 module to the PCA 60. Thus, one end of the assembly 85 is coupled to the PCA 60 by the engagement between the connectors 51 and 61, while the opposite end of the assembly 85 is connected to the PCA 60 via the spacer 30 and the PCA fastener 65.

[0060] As described above, the M.2 module 50 is not the longest module in the set of compatible modules. Therefore, the heat spreader clip 20 extends beyond the distal end of the M.2 module 50 and prevents its M.2 base 52 from being directly connected to the PCA 60. Nevertheless, the M.2 module 50 can still be securely attached to and supported by the PCA 60. This is made possible by the adapter fastener 40 attaching the M.2 module 50 to the clip 20 and the spacer 30 attaching the clip 20 to the PCA 60. In addition, the same result can be achieved even if a different size M.2 module (other than the longest M.2 module) is used in place of the M.2 module 50, the only difference being that the adapter fastener 40 will be installed at a different pair of holes 28 / 29 corresponding to the size of the other M.2 modules. If the longest M.2 module is used instead, the spacer 30 and adapter fastener 40 are omitted, and the PCA fastener 65 is directly connected to the M.2 base 52 of the M.2 module.

[0061] In some examples, PCA 60 comprises a main system board (eg, a motherboard) of a computing system, and M.2 module 50 is electrically connected to processing circuitry on PCA 60 via connectors 51 and 61 .

[0062] In other examples, PCA 60 may include a riser card, which is a circuit board that serves as intermediary to facilitate the connection between M.2 module 50 and the main system board. In such cases, PCA 60 may include an additional connector 62 to electrically connect PCA 60 to the main system board. Connector 62 may be electrically connected to connector 61 via the internal circuitry of PCA 60, so that M.2 module 50 is connected to the processing circuitry of the main system board via a communication path extending through connector 51, connector 61, and connector 62.

[0063] Now turn to Figure 3-23, another example M.2 adapter / heat sink 110 and two example assemblies 185 and 285 including the M.2 adapter / heat sink 110 will be described. The M.2 adapter / heat sink 110 is an example configuration of the M.2 adapter / heat sink 10. Therefore, some components of the M.2 adapter / heat sink 110 correspond to components of the M.2 adapter / heat sink 10 described above (i.e., are the same as, similar to, and / or are example configurations of these components). The components of the M.2 adapter / heat sink 110 and the components of the M.2 adapter / heat sink 10 correspond to each other and are given reference numerals with the same last two digits (such as, 20 and 120). The above description of the components of the M.2 adapter / heat sink 10 is applicable to the corresponding components of the M.2 adapter / heat sink 110 (unless otherwise indicated or logically contradictory), and therefore the repeated description of some aspects already described above is omitted below.

[0064] Figure 3-23 The M.2 adapter / heat sink 110 is shown at various perspectives and in various states, and aspects of the M.2 adapter / heat sink 110 can be seen in the various figures. The following description will refer to the figures as long as they are relevant to the aspects being described and not in strict numerical order.

[0065] like Figure 3-10 As shown in , the M.2 adapter / heat sink 110 includes a heat spreader clip 120. The heat spreader clip 120 includes a top wall 121, a bottom wall 122, and a ridge 123. The top wall 121, the bottom wall 122, and the ridge 123 are integrally connected. For example, in some embodiments, the top wall 121, the bottom wall 122, and the ridge 123 are formed from a single piece of sheet metal that has been bent and / or otherwise formed into the shape of the heat spreader clip 120. The top wall 121 and the bottom wall 122 are arranged substantially parallel to each other and parallel to the top wall 121. Figure 3-23 The ridge 123 is perpendicular to the top wall 121 and the bottom wall 122 and parallel to the Figure 3-23 The ridge 123 extends between the top wall 121 and the bottom wall 122, wherein the ridge 123 is attached to these walls at the lateral edges of the top wall 121 and the bottom wall 122. Therefore, the heat spreader clip 120 has a cross-section that is generally C-shaped or U-shaped. The attachment edges of the top wall 121 and the bottom wall 122 are their lateral edges, which extend parallel to the longitudinal (lengthwise) dimension of the heat spreader clip 120 (i.e., parallel to the y-axis as illustrated in the figure). The longitudinal dimension of the heat spreader clip 120 corresponds to the longitudinal dimension of the M.2 module when installed in the M.2 adapter / heat sink 110.

[0066] like Figure 3-5As shown in FIG. 1 , a space 127 is defined between the top wall 121 and the bottom wall 122, and the space 127 is configured to receive an M.2 module. When the M.2 module is installed in the clip 120, the two widest faces of the M.2 module are adjacent to the top wall 121 and the bottom wall 122, respectively. Fig. 22 As shown in FIG. 1 , regarding the M.2 module 150. For example, Fig.15 and Fig.23 Two example M.2 modules 150 and 250 are illustrated installed in space 127 in clip 120. In particular, M.2 adapter / heat sink 110 is configured to be usable with multiple sizes of M.2 modules, which may be referred to as a set of compatible M.2 modules. In some examples, the set includes at least M.2 modules having lengths of 30, 42, 60, 80, and 110 mm. For example, Fig.23 The length of the M.2 module 250 shown in FIG. 1 is 110 mm, while Fig.15 The length of the M.2 module 150 shown in FIG. 1 is 80 mm. Other M.2 modules (not shown) (such as 30, 42, 60 mm modules) may also be used with the M.2 adapter / heat sink 110 .

[0067] The heat spreader clip 120 is formed of a thermally conductive material. In some examples, the heat spreader clip 120 is formed of copper (or its alloys), aluminum (or its alloys), brass (or its alloys), nickel (or its alloys), zinc (or its alloys), stainless steel, another thermally conductive metal (or its alloys), or a thermally conductive plastic. In some examples, the heat spreader clip 120 is formed of a highly thermally conductive material (defined below), such as some forms of copper or aluminum.

[0068] The heat spreader clip 120 is configured to thermally couple with the M.2 modules when they are mounted in the heat spreader clip 120. Specifically, the heat spreader clip 120 is configured such that each of the top wall 121 and the bottom wall 122: either (1) directly contacts the M.2 module mounted in the clip 120, or (2) indirectly contacts the M.2 module via mutual contact with the TIM 118, which is disposed between the corresponding wall and the M.2 module. Figure 5 , Fig. 9 and Fig.10 As shown in FIG. 1 , TIM 118 is attached to the bottom side of top wall 121, and similarly, another TIM 118 is attached to the top side of bottom wall 122. TIM 118 may be, for example, a thermal gap pad, thermal grease, thermal paste, or any other TIM. When the M.2 module is mounted in clip 120, two layers of TIM 118 are disposed between the M.2 module and top wall 121 and bottom wall 122, as shown in FIG. Fig.16 and Figure 20-22 In other examples, TIM 118 is omitted.

[0069] The heat spreader clip 120 is configured to function like a spring clip that generates spring forces that clamp the top wall 121 and the bottom wall 122 against the opposite face of the M.2 module (directly or via the TIM 118). More specifically, the top wall 121 and the bottom wall 122 are spring biased toward a rest position in which the free edges of the top wall 121 and the bottom wall 122 (i.e., the edges opposite the attachment edges attached to the ridge 123) are a first distance apart. If the top wall 121 and the bottom wall 122 are along the Figure 3 The direction "d" shown in FIG. 1 is deflected away from the rest position so that the free edges of the top wall 121 and the bottom wall 122 are farther apart than the first distance, thereby generating a spring force f s , these spring forces oppose the displacement and urge the top wall 121 and the bottom wall 122 in the opposite direction (i.e., back toward the rest position), as shown by Figure 3 The mark in is f s This displacement of walls 121 and 122 may occur when an M.2 module is installed, and in such a case, the resulting spring force f s The top wall 121 and the bottom wall are pressed against the opposing faces of the M.2 module. This clamping action can help ensure good thermal contact between the clip 120 and the M.2 module, whether the thermal contact is direct contact or indirect contact via the TIM 118. This thermal coupling of the heat spreader clip 120 to the M.2 module allows the heat spreader clip 120 to absorb heat from the heat generating components of the M.2 module and dissipate the heat into the surrounding air.

[0070] like Figure 3-6 , Fig. 9 and Fig.10 As shown in , the heat spreader clip 120 also includes protrusions 125 that are attached to the top wall 121. The protrusions 125 protrude from the face of the top wall 121 to promote better heat transfer to the surrounding air. The protrusions 125 include folded fins that are integrally coupled to the top wall 121. For example, in some embodiments, the top wall 121 includes several planar pieces of sheet metal, and the protrusions 125 include folded fins stamped from the sheet metal. Figure 3 , Fig. 9 and Fig.10 As shown in FIG. 1 , in some examples, the protrusion 125 is rounded (folded) at its distal end to avoid having protruding sharp edges (where these sharp edges may injure a person).

[0071] like Figure 3-10As shown in FIG. 1 , the adapter / heat sink 110 includes removable metal wire handles 119. These wire handles 119 can be attached to the heat spreader clip 120 during installation of the M.2 module, and can then be removed thereafter. In particular, the top wall 121 and the bottom wall 122 include handle receptacles 124 that receive the ends of the wire handles 119, such as Figure 3 and Figure 4 The wire handle 119 can be actuated by a user to spread the top wall 121 and the bottom wall 122 apart, thereby allowing an M.2 module to be inserted into the space 127 between the top wall 121 and the bottom wall 122. In particular, as Fig. 9 As shown in FIG. 1 , the handle 119 acts as a lever using the top wall 121 and the bottom wall 122 as a fulcrum so that the handle 119 can be moved along the Fig. 9 The free ends of the handle 119 are squeezed together in the direction marked "b" in FIG. 1 to force the free edges of the top wall 121 and the bottom wall 122 to move along Fig. 9 After the M.2 module is inserted into the clip 120, the handle 119 can be released, which allows the spring force f s Move the top wall 121 and the bottom wall 122 backward in opposite directions to press against the M.2 module. Figure 6 and Figure 8 The handle 119 may be removed from the clip 120 by pulling the end of the handle 119 in directions “e” and “f” as illustrated in FIG. 1 , thereby causing the end of the handle 119 to come out of the receptacle 124 .

[0072] As described above, when the M.2 adapter / heat sink 110 is used and an M.2 module of any size except the maximum size is mounted therein, the M.2 module is not directly coupled to the PCA. Instead, the M.2 module is coupled to the heat spreader clip 120 via the adapter fastener 140 that engages with the fastener holes 128 / 29 in the clip 120, and then the adapter / heat sink 110 is attached to the PCA via the spacer 130. Thus, the M.2 module is indirectly coupled to the PCA via the M.2 adapter / heat sink 110. If the maximum M.2 module is used, the fastener 140 and the spacer 130 are omitted, and the M.2 module can be directly coupled to the PCA.

[0073] like Figure 3 , Figure 4 and Figure 6As shown in , the top wall 121 includes a plurality of fastener holes 128, namely fastener holes 128-1, 128-2, 128-3 and 128-4. Similarly, the bottom wall 122 includes a plurality of fastener holes 129, namely fastener holes 129-1, 129-2, 129-3 and 129-4. The plurality of fastener holes 128 are distributed along the length dimension (parallel to the y-axis) of the top wall 121, and the plurality of fastener holes 129 are distributed along the length dimension (parallel to the y-axis) of the bottom wall 122, wherein each fastener hole 128 is aligned with a corresponding fastener hole 129 to form a pair. Each pair of fastener holes 128 / 29 corresponds to one M.2 size in the set of compatible M.2 sizes and is positioned so as to align with the M.2 base of the corresponding M.2 module when the module is installed in the clip 120. In particular, fastener holes 128-1 and 129-1 correspond to a first size M.2 module (e.g., 30 mm), fastener holes 128-2 and 129-2 correspond to a second size M.2 module (e.g., 42 mm), fastener holes 128-3 and 129-3 correspond to a third size M.2 module (e.g., 60 mm), and fastener holes 128-4 and 129-4 correspond to a fourth size M.2 module (e.g., 80 mm). A fifth size M.2 module (e.g., 110 mm) may also be part of the set of compatible M.2 modules, but fastener holes 128 / 129 are not present for this largest M.2 module because it can be directly connected to the PCA, as will be described below.

[0074] The adapter fastener 140 is configured to be selectively mountable in any one of the pairs of fastener holes 128 / 129. Figure 4 , Fig.11 and Fig.12 As shown in , the adapter fastener 40 includes a first portion 141 and a second portion 142. Figure 4 and Fig. 22 As shown in , when the adapter fastener 140 is installed at a given pair of fastener holes 128 / 129, the first portion 141 engages with the fastener hole 128 in the top wall 121, and the second portion 142 engages with the fastener hole 129 of the bottom wall 122. In this way, the adapter fastener 140 is attached to the heat spreader clip 120.

[0075] For example, Fig.11 and Fig.12As shown in , the first portion 141 includes a cylindrical support having a snap-fit ​​feature 145 disposed at one end thereof. The snap-fit ​​feature 145 includes grooves / recesses around the circumference of the first portion 141 into which the edges of the hole 128 can be received when the first portion 141 is pressed into the hole 128. For example, the first portion 141 is slightly oversized for the hole 128 and is therefore compressed when it is pressed into the hole 128, and / or when the first portion 141 is pressed into the hole 128, the edges of the hole bend and expand (there may be cutouts in the edges of the hole 128 to facilitate such bending / expansion). Whether the first portion 141 is compressed or the rim is expanded (or both), in either case, when the recess of the snap-fit ​​feature 145 reaches the rim of the hole 128, the rim of the hole 128 "snaps" into the recess, allowing the multiple parts to elastically and quickly return to their normal size and position. The rim of the hole 128 is thereafter retained in the recess, thereby attaching the first portion 141 to the top wall 121. The snap-fit ​​feature 145 may also include a cap at the end of the first portion 141 to abut the top side of the top wall 121 and prevent the first portion 141 from being pressed all the way through the hole 128. The second portion 142 includes similar snap-fit ​​features 147, which may be different in size and / or configuration from the snap-fit ​​features 145 but similar in function. Thus, the first portion 141 of the adapter fastener 140 may be positioned above the top wall 121, and then the first portion 141 may be pressed downward (-z direction) into the fastener hole 128, causing the first portion 141 to extend into the interior space 127 between the top wall 121 and the bottom wall 122 and causing the snap-fit ​​feature 145 of the first portion 141 to engage with the fastener hole 128. Conversely, the second portion 142 may be positioned below the bottom wall 122, and then the second portion 142 may be pressed upward (+z direction) into the fastener hole 129, causing the second portion 142 to extend into the interior space 127 between the top wall 121 and the bottom wall 122 and causing the snap-fit ​​feature of the second portion 142 to engage with the fastener hole 129. Figure 5 , Figure 6 , Figure 8 and Fig. 9 The first portions 141 and 142 are illustrated as being installed in the holes 128 - 4 and 129 - 4 without the M.2 module being present.

[0076] like Fig.11 and Fig.12As shown in , the first portion 141 and the second portion 142 of the adapter fastener 140 further include engagement surfaces 146 and 149, respectively. The engagement surface 146 includes an end surface of the first portion 141 opposite the snap-fit ​​feature 145. The engagement surface 149 includes a boss (shoulder) that circumferentially surrounds the second portion 142 and is positioned between the snap-fit ​​feature 145 and the opposite end of the second portion 142. The engagement surfaces 146 and 149 are configured to engage opposite sides of the M.2 base of the M.2 module when the M.2 module is installed in the clip 120 and the adapter fastener 140 is attached to the clip 120. For example, as Fig.11 and Fig.12 As shown in FIG. , if a given M.2 module 150 is installed in the clip 120 (in Fig.11 and Fig.12 120 is omitted to allow for better visibility), then when the first portion 141 is inserted into the corresponding fastener hole 128-4, the engagement surface 146 of the first portion 141 engages (e.g., contacts or abuts) the top surface of the M.2 base 152 of the given M.2 module 150. Then, when the second portion 142 is inserted into the corresponding fastener hole 129-4, the engagement surface 149 of the second portion 142 engages (e.g., contacts or abuts) the bottom surface of the M.2 base 152 of the given M.2 module 150. Thus, as Fig.12 As shown in FIG. 1 , the M.2 base 152 is clamped between the first portion 141 and the second portion 142, thereby fastening the M.2 module 150 to the adapter fastener 140. Thus, the M.2 module is attached to the clip 120 by its engagement with the fastener 140. See also Fig.16 and Fig. 22 , which shows the first part 141 and the second part 142 attached to the M.2 base 152 in the installed state. Although the example described above is related to the M.2 module 150, it should be understood that other sizes of M.2 modules can be used and the attachment sequence will be similar, except that a different pair of holes 128 / 129 will be used based on the size of the M.2 module (unless the M.2 module is the largest module, in which case the fastener 40 is omitted).

[0077] The first portion 141 and the second portion 142 of the adapter fastener 140 are also configured to connect to each other when installed at the pair of holes 128 / 129. Fig.11 As shown in , the second portion 142 includes a coupling portion 148 that protrudes beyond the engagement surface 149. Fig.12 and Fig. 22As shown in , the coupling portion 148 is configured to be received within the internal hole 143 of the first portion 141 (when both are installed in a pair of holes 128 / 129), thereby coupling the second portion to the first portion 141. The coupling portion 148 extends through the semicircular hole of the M.2 base 152.

[0078] like Figure 4 As shown in , the M.2 adapter / heat sink 110 also includes a spacer 130. Figure 3 and Figure 4 As shown in , the spacer 130 is configured to be attached to the clip 120, near the distal end of the heat spreader clip 120, when M.2 modules other than the longest M.2 module are installed in the heat spreader clip 120. The spacer 130 is disposed in the space 127 between the top wall 121 and the bottom wall 122, adjacent to the M.2 module and in line with it. Figure 3 , Figure 4 , Fig.13 and Fig. 22 As shown in , the spacer 130 is attachable to the top wall 121 by screws 136 that extend through screw holes 126 in the top wall 121 and engage with threaded holes 132 in the top of the spacer 130. Figure 8 , Fig.14 and Fig. 22 As shown in FIG. 1 , the spacer 130 is engaged with the bottom wall 122 via a locating feature 137 that extends into an aperture 139 in the bottom wall 122 .

[0079] like Fig.13 and Fig.14 As shown in , the spacer 130 includes a replica M.2 mount 135 formed therein. The replica M.2 mount 135 has a shape and size similar to a standard M.2 mount, but is referred to herein as a "replica" because it is formed on the spacer 130 rather than on an actual M.2 module. When installed, the spacer 130 is positioned in the clip 120 so that when the largest M.2 module 250 is installed in the clip 120, the replica M.2 mount 135 is located at the same position as the M.2 mount 253 of the largest M.2 module 250.

[0080] For example, Fig.23 An assembly 285 is shown including a maximum M.2 module 250 mounted in a clip 120, while Fig.15 An assembly 185 including a smaller M.2 module 150 and a spacer 130 mounted in a clip 120 is illustrated (see also FIG. 1 for other views of the assembly 185). Figure 16-22 ). By comparison Fig.15 and Fig.23 It can be seen that Fig.15 The replica M.2 base 135 is located in the same Fig.23253 in the same position. Therefore, the replica M.2 mount 135 can be fastened to the PCA using the same PCA fasteners that will be used to fasten the M.2 mount 235 to the PCA. Note that in assembly 185, fasteners 140 and spacer 130 are omitted.

[0081] Now turn to Figure 24-28 , an example system 390 is described. The system 390 includes a PCA 360 and an assembly including an M.2 adapter / heat sink 110 and an M.2 module installed therein. An assembly 185 including an M.2 adapter / heat sink 110 having an M.2 module 150 installed therein is shown in FIG. Figure 24-26 390 as an illustrative example, but any of the M.2 modules described herein may be used in M.2 adapter / heat sink 110 in system 390. PCA 360 may be any PCA, including a main system board of a computing device, a riser card, or some other PCA. Figure 24-26 Only a portion of PCA 360 is illustrated in FIG.

[0082] Fig.24 The diagram illustrates an initial state in a sequence of events for attaching the assembly 185 to the PCA 360. The assembly 185 is adjacent to the PCA 360, and the screw 367 of the PCA fastener 365 is removed from the standoff 366 of the PCA fastener 365. The standoff 366 of the PCA fastener 365 is attached to the PCA 360 at a predetermined position, which is set so that if the electrical connector 251 of the long M.2 module 250 is connected to the electrical connector 361, the standoff 366 will be aligned with the M.2 base 235 of the long M.2 module 250. Fig. 27 The standoff 366 and screw 367 of the PCA fastener 365 are shown in greater detail.

[0083] like Fig.25 As shown in , the next operation in the mounting assembly 185 is to connect the edge-style electrical connector 151 of the M.2 module 150 with the complementary electrical connector 361 of the PCA 360. This causes the replica M.2 mount 135 of the spacer 130 to be aligned with the standoff 366, and the bottom surface of the replica M.2 mount 135 can rest on the engagement surface 368 of the standoff 366 (for a view of the engagement surface 368, see Fig. 27 ). The replica M.2 mount 135 of the spacer 130 is aligned with the standoff 366 because the standoff 366 is positioned to mate with the M.2 mount 235 of the longer M.2 module 250, and as described above, the replica M.2 mount 135 is positioned relative to the clip 120 at the same location as the M.2 mount 235 would be if the module 250 was instead installed in the clip 120. Fig. 27The replica M.2 mount 135 is shown in a state immediately after the electrical connectors 151 and 361 are connected, but with the M.2 mount 135 slightly lifted upwardly from the standoff 366 to allow for better visibility of the engagement surface 368 (in fact, in this state, the replica M.2 mount 135 may rest on the engagement surface 368). Fig. 27 As can be seen in FIG. 1 , in this state, the engagement surface 368 is positioned to engage the bottom of the replica M.2 base 135 , with the central threaded portion of the standoff 366 extending through the semi-circular hole of the replica M.2 base 135 .

[0084] like Fig.26 As shown in FIG. 1 , the final operation in the mounting assembly 185 is to engage the set screw 367 with the standoff 366. This results in the replica M.2 base 135 being clamped between the set screw 367 and the standoff 366, as shown in FIG. Fig.28 360 (e.g., engagement surface 368 of standoff 366 abuts the bottom side of replica M.2 base 135, while set screw 367 abuts the top side). Thus, in this state, the proximal end of assembly 185 is connected to PCA 360 via engagement between connectors 151 and 361, while the distal end of assembly 185 is connected to PCA 360 via engagement between PCA fastener 365 and spacer 130. Spacer 130 is attached to clip 120, and clip 120 is attached to the distal end of M.2 module 150 via fastener 140, and thus both ends of M.2 module 150 are also (directly or indirectly) connected to and supported by PCA 360.

[0085] Now turn to Fig.29 and Fig.30 , an example system 490 is described. The system 490 includes a PCA 460 and two instances of an assembly including an M.2 adapter / heat sink 110 having an M.2 module installed therein. Fig.29 and Fig.30 , the M.2 modules illustrated are M.2 modules 150 - 1 and 150 - 2 , but this is merely an illustrative example, and any size of M.2 modules compatible with M.2 adapter / heat sink 110 may be used in system 490 .

[0086] like Fig.29 and Fig.30 As shown in FIG. 4 , the first M.2 adapter / heat sink 110 - 1 and the second M.2 adapter / heat sink 110 - 2 , and the first M.2 module and the second M.2 module installed therein are connected to opposite sides of the PCA 460 . Fig.29As shown in FIG. 4 , PCA 460 includes a first electrical connector 461-1 on a first side of PCA 460 that is connected to first M.2 module 150-1. Additionally, a first PCA fastener 465-1 attached to the first side of PCA 460 is connected to spacer 130-1 of first M.2 adapter / heat sink 110-1 in a manner similar to that described above with respect to system 390. Similarly, as Fig.30 , the PCA 460 includes a second electrical connector 461-2 connected to the second M.2 module 150-2 on a second side of the PCA 460. Additionally, a second PCA fastener 465-2 attached to the second side of the PCA 460 is connected to the spacer 130-2 of the second M.2 adapter / heat sink 110-2 in a manner similar to that described above with respect to the system 390. In this manner, two of the assemblies 185 described above can be coupled to opposite sides of the same PCA 460.

[0087] In some examples, PCA 460 includes a riser card configured to function as middleware to facilitate connection of M.2 modules 150-1 and 150-2 to another PCA, such as a main system board of a computing device. Thus, in some examples, PCA 460 further includes another connector 462 configured to connect to another PCA via a complementary connector that may be mounted on another PCA or may be attached to a cable that in turn connects to another connector mounted on another PCA. In some examples, PCA 460 may also include an attachment feature 469 to attach PCA 460 to a support structure, such as another PCA, a riser cage, a chassis of a computing device, and the like. PCA 460 may also include some electrical circuitry 466, such as an input / output controller, to coordinate communications between M.2 modules 150-1 and 150-2 and other PCAs 460. Electronic circuitry 466 may be attached with a heat sink 467 to assist in cooling.

[0088] In some examples, the M.2 adapter / heat sink 110 may beneficially allow the PCA 460 to be designed in a manner that is independent of the size of the M.2 module connected thereto. For example, in some cases, only one attachment point may be required on each side of the PCA 460 for the PCA fastener 465, rather than requiring multiple attachment points on each side of the PCA 460 for multiple different sized M.2 modules. It is possible to provide only one attachment point on each side because the replica M.2 base 135 is used to attach the assembly 185 to the PCA 460 (assuming one of the smaller M.2 modules is used), and the replica M.2 base 135 remains in the same location regardless of the size of the M.2 module used (and if the largest M.2 module 250 is used, its base 235 is also located in the same location). Having only a single attachment point on each side may simplify the design of the PCA 460 and allow valuable space on the PCA to be utilized by other components.

[0089] Thermally coupled: As used herein, "thermally coupling" two objects means providing a thermally conductive pathway between the objects that allows heat to be conducted between the objects. Two objects are considered to be thermally coupled if any of the following are true: (1) the two objects are in contact with each other (either directly or via a TIM), (2) the objects are both thermally coupled to a thermally conductive intermediate (e.g., a heat pipe, a heat spreader, etc.) (or to a series of thermally conductive intermediates that are thermally coupled together), or (3) the heat transfer coefficient between the two objects is 10 W·m -2 ·K -1 or larger.

[0090] Thermal Conductivity: An object, device, or assembly (which may include multiple different bodies thermally coupled, and may include multiple different materials) is "thermally conductive" between two thermal interfaces if any of the following is true: (1) the heat transfer coefficient between the thermal interfaces is 10 W·m at any temperature between 0°C and 100°C; -2 ·K -1 or greater, (2) the object is a continuous piece of material that has a resistance of 1 W·m between two interfaces at any temperature between 0°C and 100°C. -1 ·K -1 or greater thermal conductivity (often expressed as k, λ, or κ), (3) the object is a heat pipe, a vapor chamber, a continuous copper body, or a continuous aluminum body. Materials (between 0°C and 100°C, these materials have a thermal conductivity greater than 1 W·m -1 ·K -1 Examples of ) include almost all metals and their alloys (e.g., copper, aluminum, gold, etc.), some plastics (e.g., TC compounds, D series thermally conductive plastics) and many other materials.

[0091] Highly Thermally Conductive: An object, device, or assembly (which may include multiple different bodies thermally coupled, and may include multiple different materials) is "highly thermally conductive" between two thermal interfaces if any of the following is true: (1) The heat transfer coefficient between the thermal interfaces is 1000 W·m at any temperature between 0°C and 100°C; -2 ·K -1 or greater, (2) the object is a continuous piece of material that has a thermal conductivity of 100 W·m between two interfaces at any temperature between 0°C and 100°C. -1 ·K -1 or greater thermal conductivity (often expressed as k, λ, or κ), (3) the object is a heat pipe, a vapor chamber, a continuous copper body, or a continuous aluminum body. Materials (between 0°C and 100°C, the thermal conductivity of these materials is 100 W·m -1 ·K -1 or greater) include certain types of copper, aluminum, silver, and gold.

[0092] In the above description, various types of electronic circuit systems are described. As used herein, "electronic" is intended to be broadly understood to include all types of circuit systems that utilize electricity, including digital and analog circuit systems, direct current (DC) and alternating current (AC) circuit systems, and circuit systems for converting electricity into another form of energy and circuit systems for using electricity to perform other functions. In other words, as used herein, there is no distinction between "electronic" circuit systems and "electrical" circuit systems.

[0093] It will be understood that both the general description and the detailed description provide examples, which are illustrative in nature and are intended to provide an understanding of the present disclosure without limiting the scope of the present disclosure. Various mechanical, composition, structure, electronics and operational changes may be made without departing from the scope of the description and claims. In some cases, well-known circuits, structures and techniques are not shown or described in detail in order not to obscure the examples. Similar numbers in two or more figures represent identical or similar elements.

[0094] In addition, unless the context indicates otherwise, the singular forms "a", "an", and "the" are intended to include the plural forms as well. Furthermore, the terms "comprises", "comprising", "includes", etc. specify the presence of stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups. Unless explicitly noted otherwise, components described as connected may be directly connected electronically or mechanically, or they may be indirectly connected via one or more intermediate components. Unless the context of the description indicates otherwise, mathematical and geometric terms are not necessarily intended to be used in accordance with their strict definitions, as one of ordinary skill in the art will understand that, for example, substantially similar elements that function in a substantially similar manner may readily fall within the scope of a descriptive term, even if the term also has a strict definition.

[0095] And / or: The phrase "and / or" is occasionally used herein in connection with a list of items. This phrase means that any combination of the items in the list can be included—from a single item to all items and any permutation in between. Thus, for example, "A, B, and / or C" means "one of {A}, {B}, {C}, {A,B}, {A,C}, {C,B}, and {A,C,B}."

[0096] Whenever practicable, elements and their associated aspects described in detail with reference to one example may be included in other examples where these elements and aspects are not specifically shown or described. For example, if an element is described in detail with reference to one example, but not described with reference to a second example, the element may still be claimed to be included in the second example.

[0097] Unless otherwise noted herein or implied by the context, when approximate terms such as "substantially," "approximately," "about," "roughly," and the like are used, this should be understood to mean that mathematical precision is not required, but rather a range of variation is mentioned that includes but is not strictly limited to the stated value, property, or relationship. In particular, the range of variation implied by the use of such approximate terms also includes at least any insignificant variations, as well as those variations that are typical for the type of item in question due to manufacturing or other tolerances in the relevant art, in addition to any ranges explicitly stated herein (if any). In any case, unless otherwise indicated, the range of variation may at least include values ​​within ±1% of the stated value, property, or relationship.

[0098] In view of the disclosure herein, further modifications and alternative examples will be apparent to those of ordinary skill in the art. For example, the apparatus and method may include additional components or steps, which are omitted from the figures and descriptions for clarity of operation. Therefore, the description will be interpreted as being merely illustrative, and its purpose is to teach those skilled in the art the general manner of implementing this teaching. It will be understood that the various examples shown and described herein will be considered exemplary. Elements and materials, and the arrangement of those elements and materials may be replaced with the elements and materials illustrated and described herein, parts and processes may be reversed, and certain features of this teaching may be utilized independently, all of which will be apparent to those skilled in the art after benefiting from the description herein. The elements described herein may be modified without departing from the scope of this teaching and the following claims.

[0099] It will be understood that the specific examples set forth herein are non-limiting and that modifications may be made in structure, dimensions, materials, and methods without departing from the scope of the present teachings.

[0100] Other examples according to the present disclosure will be apparent to those skilled in the art by considering the specification and practicing the invention disclosed herein. It is intended that the specification and examples be considered exemplary only, with the following claims being given their full breadth, including equivalents, under applicable law.

Claims

1. An M.2 adapter / heat sink, comprising: a heat spreader clip comprising a top wall, a bottom wall, and a ridge extending between the top wall and the bottom wall, the heat spreader clip being configured to receive an M.2 module having any one of a plurality of M.2 module lengths; an adapter fastener configured to selectively attach to the heat spreader clip at any one of a plurality of attachment locations, the plurality of attachment locations respectively corresponding to M.2 lengths other than a longest M.2 length among a plurality of M.2 lengths, wherein the adapter fastener is configured to engage an M.2 base of a given M.2 module received in the space between the top wall and the bottom wall in response to the adapter fastener being attached to the heat spreader clip at a given attachment location out of the plurality of attachment locations and corresponding to the length of the given M.2 module; and A spacer configured to be selectively attached to the heat spreader clip in the space between the top wall and the bottom wall, wherein the spacer includes a replica M.2 mount configured to connect to a printed circuit assembly (PCA) via a PCA fastener.

2. The M.2 adapter / heat sink of claim 1, in, The replica M.2 mount of the spacer is positioned at a same position relative to the heat spreader clip regardless of which M.2 module length from the plurality of M.2 module lengths other than the longest M.2 module length is received in the heat spreader clip.

3. The M.2 adapter / heat sink according to claim 2, in, In a state where an M.2 module having the longest M.2 module length from among the multiple M.2 module lengths is received in the heat spreader clip, the spacer is not attached to the heat spreader clip, and when the spacer is attached to the heat spreader clip, the M.2 base of the M.2 module is located at the same position as the replica M.2 base.

4. The M.2 adapter / heat sink of claim 1, a plurality of first fastener holes disposed in the top wall; a plurality of second fastener holes disposed in the bottom wall, wherein: The first fastener holes and the second fastener holes are grouped in pairs, each pair including a first fastener hole and a second fastener hole aligned with each other, wherein each pair of the pairs of fastener holes corresponds to one of the attachment locations; and Wherein, the adapter fastener is configured to attach to the heat spreader clip at any one of the attachment locations by engaging with a pair of fastener holes at corresponding attachment locations.

5. The M.2 adapter / heat sink of claim 4, in, The adapter fastener includes a first portion configured to engage with the first fastener hole, and a second portion configured to engage with the second fastener hole; Wherein, the adapter fastener is configured to be attached to the heat spreader clip at the given attachment location by inserting the first portion downwardly through the first fastener hole of the pair of fastener holes at the given attachment location, and inserting the second portion upwardly through the second fastener hole of the pair of fastener holes at the given attachment location.

6. The M.2 adapter / heat sink of claim 5, in, The first portion and the second portion include snap-fit ​​features configured to engage with the first fastener hole and the second fastener hole in response to the first portion being pressed downward through one of the first holes and in response to the second portion being pressed upward through one of the second holes.

7. The M.2 adapter / heat sink according to claim 5, in, The first portion and the second portion each include an engagement feature configured to engage opposite sides of the M.2 base of the given M.2 module in response to inserting the first portion and the second portion through the pair of fastener holes at the given attachment location.

8. The M.2 adapter / heat sink of claim 1, in, The top wall, the bottom wall, or both the top wall and the bottom wall include a plurality of protrusions extending from the respective wall.

9. The M.2 adapter / heat sink of claim 8, in, The plurality of protrusions include folded fins.

10. The M.2 adapter / heat sink of claim 1, in, When the given M.2 module is received in the heat spreader clip, the heat spreader clip is biased to press the top wall and the bottom wall against opposing faces of the given M.2 module.

11. The M.2 adapter / heat sink of claim 10, comprising: A linear handle configured to be removably mounted in a receptacle coupled to free ends of the top wall and the bottom wall, wherein the linear handle is configured to act as a lever with the top wall and the bottom wall as a fulcrum when mounted in the receptacle such that squeezing the linear handle together causes the top wall and the bottom wall to move away from each other in a manner opposite to the bias.

12. The M.2 adapter / heat sink of claim 1, in, The various M.2 module lengths include 30mm, 42mm, 60mm, 80mm and 110mm.

13. A component comprising: The M.2 adapter / heat sink according to claim 1; a first M.2 module mounted in the heat spreader clip; Wherein, the first M.2 module has a first length; wherein the fastener is attached to the heat spreader clip at a first attachment location corresponding to the first length, and the fastener is attached to an M.2 base of the first M.2 module; and Wherein, the spacer is attached to the heat spreader clip.

14. A system comprising: a printed circuit assembly PCA, the PCA comprising a first electrical connector connected to a first side of the PCA; a first PCA fastener attached to a first side of the PCA; The assembly according to claim 13, wherein the electrical connector of the first M.2 module is connected to the first electrical connector of the PCA; and wherein the replica M.2 mount of the spacer of the assembly engages with the first PCA fastener to attach the assembly to the PCA.

15. The system according to claim 14, comprising: a second electrical connector connected to a second side of the PCA; a second PCA fastener attached to a second side of the PCA; A second component, the second component comprising: A second example of the M.2 adapter / heat sink according to claim 1; a second M.2 module mounted in the heat spreader clip of the second instance of the M.2 adapter / heat sink; wherein the electrical connector of the second M.2 module is connected to the second electrical connector of the PCA; and wherein the replica M.2 mount of the spacer of the second component engages the second PCA fastener to attach the component to the PCA.

16. An M.2 adapter / heat sink, comprising: a heat spreader clip comprising a top wall, a bottom wall, and a ridge extending between the top wall and the bottom wall; a plurality of first fastener holes disposed in the top wall; a plurality of second fastener holes disposed in the bottom wall, wherein the first fastener holes and the second fastener holes are grouped in pairs, each pair including one first fastener hole and one second fastener hole aligned with each other, wherein the pairs of fastener holes include a first pair of fastener holes and a second pair of fastener holes; an adapter fastener configured to selectively attach to the heat spreader clip at either the first pair of fastener holes or the second pair of fastener holes; and a spacer configured to be selectively attached to the heat spreader clip in a space between the top wall and the bottom wall, wherein the spacer comprises a replica M.2 mount configured to connect to a printed circuit assembly (PCA) via a PCA fastener; wherein the adapter fastener is configured to attach to the first pair of fastener holes and engage an M.2 mount of a first M.2 module in response to a first M.2 module having a first M.2 module length being received in the heat spreader clip, Wherein the adapter fastener is configured to attach to the second pair of fastener holes and engage the M.2 mount of a second M.2 module in response to a second M.2 module having a second M.2 module length being received in the heat spreader clip.

17. The M.2 adapter / heat sink of claim 16, in, The adapter fastener includes a first portion configured to engage with the first fastener hole, and a second portion configured to engage with the second fastener hole; Wherein, the adapter fastener is configured to be attached to the heat spreader clip at the first pair of fastener holes by inserting the first portion downwardly through the first fastener holes in the first pair and inserting the second portion upwardly through the second fastener holes in the first pair of fasteners.

18. The M.2 adapter / heat sink of claim 17, in, The first portion and the second portion include snap-fit ​​features configured to engage with the first fastener hole and the second fastener hole in response to the first portion being pressed downward through one of the first holes and in response to the second portion being pressed upward through one of the second holes.

19. A method comprising: Provides M.2 modules and M.2 adapters / heat sinks; Insert the M.2 module into the heat spreader clip of the M.2 adapter / heat sink; Attaching an adapter fastener to the heat spreader clip at an attachment location out of a plurality of attachment locations provided in the heat spreader clip that corresponds to a length of the M.2 module, wherein attaching the adapter fastener to the heat spreader clip comprises attaching the adapter fastener to an M.2 mount of the M.2 module; Attaching a spacer to the heat spreader clip and adjacent to the M.2 module; A replica M.2 mount of the spacer is attached to the printed circuit assembly.

20. The method according to claim 19, in, The heat spreader clip includes a top wall and a bottom wall, wherein each of the attachment locations comprises a first fastener hole in the top wall and a second fastener hole in the bottom wall; wherein the adapter fastener comprises: a first portion and a second portion, the first portion comprising a snap-fit ​​feature configured to engage with the first fastener hole; the second portion comprising a snap-fit ​​feature configured to engage with the second fastener hole; and Wherein, attaching the adapter fastener to the heat spreader clip at the attachment position corresponding to the length of the M.2 module includes: pressing the first part downward through the first fastener hole of the attachment position and pressing the second part upward through the second fastener hole of the attachment position until the first part and the second part engage with the M.2 base of the M.2 module and the snap-fit ​​features of the first part and the second part engage with the first fastener hole and the second fastener hole respectively.

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