Flip chip packaging method and flip chip packaging structure
By using a metal layer mesh of the same size as the chip in the flip chip packaging process, the interface degradation of the organic heat dissipation materials is blocked, and the interface degradation problem caused by the difference in thermal expansion coefficient in the chip packaging is solved, and the heat dissipation performance of the chip is improved.
Patent Information
- Application Number
- CN202510104359.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-22
- Publication Date
- 2025-04-29
AI Technical Summary
In the prior art, the interface deteriorates due to the difference in thermal expansion coefficients between the chip and the carrier plate during the flip-chip packaging process. Especially in large-size chips and multiple chips, four-corner degradation and hollow quality problems are prone to occur, affecting the heat dissipation performance of the chip.
A metal layer mesh of the same size as the chip is used, and it is placed on the organic heat dissipation material, and the metal layer mesh is aligned with the chip during the curing process of the organic heat dissipation material to prevent the interface of the organic heat dissipation material from degrading. The metal layer mesh includes a plurality of first mesh structures and a second mesh structures for providing strength support and dispersing loads and relieving stress during curing.
Effectively prevent the interface degradation of organic heat dissipation materials, ensure the coverage of organic materials on the back of the chip, reduce the void rate, and improve the heat dissipation performance of the chip.
Smart Images
Figure CN119905406A_ABST
Abstract
Description
Technical Field
[0001] The disclosed embodiments belong to the field of semiconductor packaging technology, and specifically relate to a flip chip packaging method and packaging structure. Background Art
[0002] Flip chip ball grid array packaging has great market application potential due to its superior electrical performance and space utilization, and is widely used in notebook computers, high-performance computing, artificial intelligence and other fields. Its typical process mainly includes chip mounting, reflow soldering, bottom sealant filling, heat sink mounting and ball planting. However, with the continuous advancement of power electronics technology, high power, high density and miniaturization have become the development direction of chips, and heat dissipation has become one of the core challenges that the semiconductor industry cannot bypass.
[0003] The current mainstream heat dissipation method is to use a combination of thermal interface materials and metal heat sinks on the back of the chip to ensure that the heat of the chip can be quickly transferred to the heat dissipation module to improve the heat dissipation performance. Thermal interface materials generally use metal heat dissipation materials and organic heat dissipation materials. Among them, organic heat dissipation materials are mainly silicone-based interface materials, and fillers use inorganic thermal conductive materials such as alumina. Figure 1 As shown, in the existing process, the main steps of using organic heat dissipation materials are generally as follows: after the chip 2 is mounted on the carrier 1, the organic heat dissipation material 3 is dispensed on the back of the chip according to the designed specific pattern, the metal heat sink 4 is pressed together, and the thermal conductive material is cured by heating in an oven.
[0004] However, if Figure 2 As shown, the above process has the following technical bottlenecks: the organic heat dissipation material will be spread on the back of the entire chip 2 after being pressed by the metal heat sink 4. When baked in the oven, the main component of the carrier 1 is organic resin, and the main component of the chip 2 is silicon. Therefore, there is a significant difference in the thermal expansion coefficient between the chip 2 and the carrier 1.
[0005] During the baking process, the relative deformation of the two will intensify, causing the organic heat dissipation material 3 to be stretched on all sides. During the process of cooling back to room temperature, the organic heat dissipation material 3 slowly shrinks, and it is very easy to degrade at the four corners of the chip 2. Moreover, as the size of the chip 2 increases, the shrinkage and expansion of the organic heat dissipation material 3 easily form void quality problems at the heat dissipation interface, seriously affecting the heat dissipation performance of the chip.
[0006] In view of the above problems, it is necessary to propose a flip chip packaging method and packaging structure that are reasonably designed and effectively solve the above problems. Summary of the invention
[0007] The embodiments of the present disclosure aim to solve at least one of the technical problems existing in the prior art and provide a flip chip packaging method and packaging structure.
[0008] An aspect of an embodiment of the present disclosure provides a flip chip packaging method.
[0009] The law includes:
[0010] Providing a substrate, a chip and a metal layer mesh, wherein the size of the metal layer mesh is the same as the size of the chip;
[0011] Flip-chip the chip onto the substrate;
[0012] Dispensing an organic heat dissipation material on the back of the chip according to a preset pattern;
[0013] Placing a metal layer mesh on the organic heat dissipation material and aligning the metal layer mesh with the chip;
[0014] Mounting a heat sink on the metal layer mesh, wherein during the mounting process, the organic heat dissipation material is subjected to force and evenly covers the back of the chip;
[0015] The organic heat dissipation material is solidified; wherein the metal layer mesh can prevent the interface degradation of the organic heat dissipation material during the solidification process of the organic heat dissipation material.
[0016] Optionally, the metal layer mesh includes a plurality of first mesh structures and a plurality of second mesh structures;
[0017] The first mesh structure and the second mesh structure are arranged alternately; wherein,
[0018] The first mesh structure is used to provide strength support for the organic heat dissipation material during the curing process of the organic heat dissipation material;
[0019] The second mesh structure is used to disperse and transfer the load acting on the organic heat dissipation material during the curing process of the organic heat dissipation material, so as to relieve the stress acting on the organic heat dissipation material.
[0020] Optionally, the first mesh structure is a honeycomb structure, and the second mesh structure is a grid structure.
[0021] Optionally, the first mesh structure is distributed in a chip deformation concentrated area, and the second mesh structure is distributed in an area outside the chip deformation concentrated area.
[0022] Optionally, a plurality of the first mesh structures and a plurality of the second mesh structures are distributed in an interlaced manner along the length direction of the chip.
[0023] Optionally, dispensing the organic heat dissipation material on the back of the chip according to a preset pattern includes:
[0024] Determining the amount of the organic heat dissipation material to be dispensed according to the thickness of the metal layer mesh and its mesh structure;
[0025] The organic heat dissipation material is dispensed on the back side of the chip according to a preset pattern and the dispensing amount.
[0026] Optionally, curing the organic heat dissipation material includes:
[0027] Preliminarily fixing the organic heat dissipation material at room temperature;
[0028] Heating the organic heat dissipation material after preliminary fixation to a preset temperature to enhance the interfacial adhesion of the organic heat dissipation material;
[0029] The organic heat dissipation material is placed in an oven for baking to completely solidify the organic heat dissipation material.
[0030] Another aspect of the embodiment of the present disclosure provides a flip chip packaging structure, comprising a substrate, a chip, an organic heat dissipation material layer, a metal layer mesh and a heat sink; wherein the size of the metal layer mesh is the same as the size of the chip;
[0031] The chip is flip-chip mounted on the substrate;
[0032] The organic heat dissipation material layer is arranged on the back side of the chip;
[0033] The metal layer mesh is embedded in the organic heat dissipation material layer and aligned with the chip; wherein,
[0034] The metal layer mesh can prevent the interface degradation of the organic heat dissipation material layer during the curing process of the organic heat dissipation material layer, so that the organic heat dissipation material layer can completely cover the back side of the chip;
[0035] The heat sink is covered on the organic heat sink material layer and the edge area of the heat sink is fixed on the substrate.
[0036] Optionally, the metal layer mesh includes a plurality of first mesh structures and a plurality of second mesh structures;
[0037] The first mesh structure and the second mesh structure are arranged alternately; wherein,
[0038] The first mesh structure can provide strength support for the organic heat dissipation material layer during the curing process of the organic heat dissipation material layer;
[0039] The second mesh structure can disperse and transfer the load acting on the organic heat dissipation material layer during the curing process of the organic heat dissipation material layer, so as to relieve the stress acting on the organic heat dissipation material layer.
[0040] Optionally, the first mesh structure is a honeycomb structure, and the second mesh structure is a grid structure.
[0041] The flip chip packaging method and packaging structure of the disclosed embodiment, in which after the organic heat dissipation material is dispensed on the back of the chip according to a preset pattern, a metal layer mesh of the same size as the chip is placed on the organic heat dissipation material to improve the heat conduction efficiency and uniform thermal stress distribution; in addition, the metal layer mesh can prevent the interface degradation of the organic heat dissipation material caused by the difference in expansion coefficient between the chip and the substrate during the curing process of the organic heat dissipation material, especially solve the problem of four-corner degradation of organic heat dissipation materials for large-size chips and multiple chips, ensure the coverage rate of organic material on the back of the chip, reduce the void rate, and improve the heat dissipation performance of the chip. BRIEF DESCRIPTION OF THE DRAWINGS
[0042] Figure 1 It is a schematic diagram of the flip chip packaging process in the prior art;
[0043] Figure 2 A schematic diagram of chip structure deformation during baking of an organic heat dissipation material in a flip chip packaging structure in the prior art and degradation of the interface of the organic heat dissipation material after the chip is cooled;
[0044] Figure 3 A schematic diagram of a process of a flip chip packaging method according to an embodiment of the present disclosure;
[0045] Figures 4 to 8 A process schematic diagram of a flip chip packaging method according to another embodiment of the present disclosure;
[0046] Fig. 9 It is a structural schematic diagram of a flip chip packaging structure of another embodiment of the present disclosure. DETAILED DESCRIPTION
[0047] In order to enable those skilled in the art to better understand the technical solutions of the embodiments of the present disclosure, the embodiments of the present disclosure are further described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0048] like Figure 3 As shown, one aspect of an embodiment of the present disclosure provides a flip chip packaging method S100, the method S100 comprising:
[0049] S110, providing a substrate, a chip and a metal layer mesh, wherein the size of the metal layer mesh is the same as the size of the chip.
[0050] like Figure 4 and Figure 6 As shown, a substrate 110 , a chip 120 and a metal layer mesh 130 are provided, wherein the size of the metal layer mesh 130 is the same as that of the chip 120 .
[0051] It should be noted that, in this embodiment, the metal layer mesh 130 may be made of metal copper material, which can achieve better heat dissipation.
[0052] S120, flip-chipping the chip onto the substrate.
[0053] like Figure 4 As shown, the front side of the chip 120 is flipped and placed on the substrate 110 to complete the mounting of the chip 120 , and an underfill is filled between the chip 120 and the substrate 110 to further fix the chip 120 on the substrate 110 .
[0054] S130, dispensing organic heat dissipation material on the back side of the chip according to a preset pattern.
[0055] like Figure 5 As shown, the organic heat dissipation material 3 is dispensed on the back of the chip 120 according to a preset pattern.
[0056] The specific process of step S130 may be as follows:
[0057] First, the amount of the organic heat dissipation material 140 to be dispensed is determined according to the thickness of the metal layer mesh 130 and its mesh structure.
[0058] Secondly, the organic heat dissipation material 140 is dispensed on the back of the chip 120 according to the preset pattern and the amount of dispensing. In this embodiment, the organic heat dissipation material 140 can be dispensed along the diagonal line of the chip 120 .
[0059] It should be noted that the present embodiment does not specifically limit the preset pattern, and it can be selected according to actual needs.
[0060] In this embodiment, the amount of the organic heat dissipation material to be dispensed is determined according to the thickness of the metal layer mesh and its mesh structure, which can ensure the coverage of the organic heat dissipation material and avoid material waste.
[0061] It should be noted that before mounting the chip 120 , it is necessary to confirm the simulation parameters of each packaging material and simulate the warping state of the entire package of the chip 120 .
[0062] The deformation of the organic heat dissipation material 140 is determined based on the warpage morphology change and stress change of the chip 120 from room temperature to high temperature and then back to room temperature. Figure 2As shown in a, at room temperature, the chip 120 presents a crying face curve. After heating, the substrate 110 deforms faster than the chip 120, and the warpage is gradually flattened or even reverses to a smiling face curve. Especially in BGA type products, the temperature rise and fall range is nearly 200 degrees Celsius. During the whole process, the location with the largest warpage change is mainly concentrated in the corners of the chip 120. Therefore, the organic heat dissipation material around the chip 120 is very likely to degrade, such as Figure 2 b.
[0063] S140, placing a metal layer mesh on the organic heat dissipation material, and aligning the metal layer mesh with the chip.
[0064] like Figure 7 As shown, the metal layer mesh 130 is placed on the glued organic heat dissipation material, and the metal layer mesh 130 is aligned with the chip 120 to improve the heat conduction efficiency and uniform thermal stress distribution.
[0065] S150, attaching a heat sink to the metal layer mesh, wherein during the attaching process, the organic heat dissipation material is subjected to force to evenly cover the back side of the chip.
[0066] like Figure 8 As shown, the heat sink 150 is attached to the metal layer mesh 130 . During the attaching process, the heat sink 150 is pressurized. During the pressurization process, the organic heat dissipation material 140 is pressurized and begins to spread evenly around until 100% of the back side of the chip 120 is covered.
[0067] S160, curing the organic heat dissipation material; wherein the metal layer mesh can prevent the interface degradation of the organic heat dissipation material during the curing process of the organic heat dissipation material.
[0068] The step S160 of curing the organic heat dissipation material 140 includes:
[0069] First, the organic heat dissipation material 140 is initially fixed at room temperature to maintain the organic heat dissipation material 140 evenly distributed.
[0070] Secondly, the organic heat dissipation material 140 after the preliminary fixation is heated to a preset temperature to enhance the preliminary adhesion of the interface of the organic heat dissipation material 140 .
[0071] Finally, the organic heat dissipation material 140 is placed in an oven for baking to completely solidify the organic heat dissipation material 140 to form a Figure 8 The organic heat dissipation material layer 141 is shown. That is, Figure 8 The entire blue portion covering the chip 120 is the cured organic heat dissipation material layer 141 .
[0072] The metal layer mesh 130 can prevent the interface degradation of the organic heat dissipation material 140 during the curing process of the organic heat dissipation material 140. Specifically, the organic heat dissipation material 140 will be subject to metal resistance when shrinking due to the presence of the metal layer mesh 130 in the middle, which can effectively prevent the interface of the organic heat dissipation material 140 from degrading inward.
[0073] For example, Figure 6 As shown, the metal layer mesh 130 includes a plurality of first mesh structures 131 and a plurality of second mesh structures 132 .
[0074] The first mesh structure 131 and the second mesh structure 132 are arranged alternately.
[0075] The first mesh structure 131 is used to provide strength support for the organic heat dissipation material 140 during the curing process of the organic heat dissipation material 140 .
[0076] The second mesh structure 132 is used to disperse and transfer the load acting on the organic heat dissipation material 140 during the curing process of the organic heat dissipation material 140 , so as to relieve the stress acting on the organic heat dissipation material 140 .
[0077] In this embodiment, through the multiple first mesh structures and second mesh structures that are distributed at intervals and staggered, during the solidification process of the organic heat dissipation material, the first mesh structure provides strength support, and the second mesh structure disperses and transfers the load, effectively relieving stress and avoiding single stress concentration, so that when the organic heat dissipation material shrinks, it can be subjected to the resistance of the first mesh structure and the second mesh structure, which can effectively prevent the interface of the organic heat dissipation material from degenerating inward, avoid the formation of voids at the interface of the organic heat dissipation material, ensure the coverage rate of the organic heat dissipation material on the back of the chip, and improve the heat dissipation performance of the chip.
[0078] Specifically, Figure 6 As shown, in this embodiment, the first mesh structure 131 is a honeycomb structure, and the second mesh structure 132 is a grid structure. That is to say, the metal layer net formed by the alternating arrangement of the honeycomb structure and the grid structure provides a multi-dimensional heat conduction path, the honeycomb structure provides strength support in a local area, and the grid structure has multi-directional force performance, which can disperse and transfer loads, effectively relieve stress, and avoid single stress concentration.
[0079] Exemplarily, the first mesh structure 131 is distributed in the chip deformation concentrated area, and the second mesh structure 132 is distributed in the area outside the chip deformation concentrated area. In other words, the honeycomb structure is distributed in the chip deformation concentrated area, and the grid structure is distributed in the area outside the chip deformation concentrated area.
[0080] Specifically, for areas where the chip deformation is large, the organic heat dissipation material 140 is likely to be delaminated. The metal layer mesh 130 is designed in a honeycomb structure at this location. The aperture of the honeycomb structure is designed based on the ductility of the organic heat dissipation material 140 to increase strength and support. Outside the deformation concentration area, the organic heat dissipation material will be subjected to the shear force of the planar layer. The metal layer mesh 130 is designed in a grid structure at this location. The aperture of the grid structure is designed accordingly based on the ductility of the organic heat dissipation material 140, which can effectively disperse and transfer the load. Among them, in this embodiment, the copper wire diameter of the metal layer mesh 130 is controlled within the range of 25μm to 30μm, which not only meets the heat dissipation requirements but also ensures the feasibility of the processing technology.
[0081] For example, Figure 6 and Figure 7 As shown, the plurality of first mesh structures 131 and the plurality of second mesh structures 132 are staggered and distributed along the length direction of the chip 120. The plurality of first mesh structures 131 and the plurality of second mesh structures 132 can be staggered and distributed at equal intervals or at unequal intervals.
[0082] Among them, multiple rows of first mesh structures 131 can be set in the chip deformation concentrated area. For example, if the position where the chip warpage changes the most is mainly concentrated at the corner end of the chip, the first mesh structure 131 can be set at the corner end of the metal layer mesh 130.
[0083] It should be noted that the specific distribution of the first mesh structure 131 and the second mesh structure 132 is not specifically limited in this embodiment and can be selected according to actual needs. In other words, the metal layer mesh adopts a honeycomb structure and a grid structure according to the simulation results, which can adapt to various packages with different chip numbers and different warping conditions.
[0084] It should be further explained that by adjusting the ratio and density of the honeycomb structure and the grid structure, it can flexibly adapt to different chip sizes and shapes, and according to the different ductility of the organic heat dissipation material, the metal layer mesh with different matching structures can be designed to make the heat dissipation efficiency more stable and reliable. Because the organic heat dissipation material has a metal mesh structure in the middle, it will be affected by metal resistance when shrinking, which can effectively prevent it from degenerating inward. Among them, the size of the mesh gap of the metal mesh structure can be set according to actual needs.
[0085] In different packaging scenarios, if the organic heat dissipation material selected has strong ductility, it can quickly fill the entire back of the chip after the patch is pressed. For this type of heat dissipation material, the gaps in the grid structure can be reduced to better limit the thermal shrinkage of the organic heat dissipation material. According to the different simulation results generated by different designs, the positions of the honeycomb structure and the mesh structure can be adjusted accordingly, ultimately balancing the overall heat dissipation solution and reducing the voids caused by a single stress concentration.
[0086] Similarly, if the selected organic heat dissipation material has a certain degree of adhesion and relatively weak ductility, the mesh pores of the metal layer mesh need to be enlarged to ensure that the organic heat dissipation material can be evenly spread to the back of the entire chip during pressing. This type of organic heat dissipation material has a certain degree of adhesion, which will increase the stress of the connection with the chip while ensuring the coverage rate. The introduction of metal mesh material can relieve stress and reduce delamination caused by stress concentration. The above design can also greatly alleviate the pumping effect of the organic heat dissipation material and enhance the reliability of the product.
[0087] The flip chip packaging method of the disclosed embodiment, in which, after dispensing the organic heat dissipation material on the back of the chip according to a preset pattern, a metal layer mesh of the same size as the chip is placed on the organic heat dissipation material to improve the heat conduction efficiency and uniform thermal stress distribution; in addition, the metal layer mesh can prevent the interface degradation of the organic heat dissipation material caused by the difference in expansion coefficient between the chip and the substrate during the curing process of the organic heat dissipation material, especially solve the problem of four-corner degradation of organic heat dissipation materials for large-size chips and multiple chips, ensure the coverage rate of the organic material on the back of the chip, reduce the void rate, and improve the heat dissipation performance of the chip.
[0088] For example, Fig. 9 As shown, another aspect of the disclosed embodiment provides a flip chip packaging structure 100, including a substrate 110, a chip 120, a metal layer mesh 130, an organic heat dissipation material layer 141 and a heat sink 150. The size of the metal layer mesh 130 is the same as that of the chip 120.
[0089] The chip 120 is flip-chip mounted on the substrate 110 .
[0090] The organic heat dissipation material layer 141 is disposed on the back side of the chip 120 .
[0091] The metal layer mesh 130 is embedded in the organic heat dissipation material layer 141 and aligned with the chip 120. The metal layer mesh 130 can prevent the interface degradation of the organic heat dissipation material layer 141 during the curing process of the organic heat dissipation material layer 141, so that the organic heat dissipation material layer 141 can completely cover the back of the chip 120.
[0092] The heat sink 150 covers the organic heat dissipation material layer 141 and the edge region of the heat sink 150 is fixed to the substrate 110 .
[0093] The flip chip packaging structure of the disclosed embodiment can improve the heat conduction efficiency and uniform thermal stress distribution by setting a metal layer mesh, wherein the size of the metal layer mesh is the same as the size of the chip; in addition, the metal layer mesh can prevent the interface degradation of the organic heat dissipation material layer caused by the difference in expansion coefficient between the chip and the substrate during the curing process of the organic heat dissipation material, so that the organic heat dissipation material layer can completely cover the back of the chip, especially solving the problem of four-corner degradation of organic heat dissipation materials of large-size chips and multiple chips, ensuring the coverage rate of organic material on the back of the chip, reducing the void rate, and improving the heat dissipation performance of the chip.
[0094] For example, Figure 6 As shown, the metal layer mesh 130 includes a plurality of first mesh structures 131 and a plurality of second mesh structures 132 .
[0095] The first mesh structure 131 and the second mesh structure 132 are arranged alternately.
[0096] The first mesh structure 131 can provide strength support for the organic heat dissipation material layer 141 during the curing process of the organic heat dissipation material layer 141 .
[0097] The second mesh structure 132 can disperse and transfer the load acting on the organic heat dissipation material layer 141 during the curing process of the organic heat dissipation material layer 141 , so as to relieve the stress acting on the organic heat dissipation material layer 141 .
[0098] Specifically, Figure 6 As shown, in this embodiment, the first mesh structure 131 is a honeycomb structure, and the second mesh structure 132 is a grid structure.
[0099] In this embodiment, through the multiple first mesh structures and second mesh structures that are distributed at intervals and staggered, during the solidification process of the organic heat dissipation material layer, the first mesh structure can provide strength support, and the second mesh structure can disperse and transfer the load, effectively relieve stress, and avoid single stress concentration, so that when the organic heat dissipation material layer shrinks, it can be subjected to the resistance of the first mesh structure and the second mesh structure, which can effectively prevent the interface of the organic heat dissipation material layer from degenerating inward, avoid the formation of voids at the interface of the organic heat dissipation material layer, ensure the coverage rate of the organic heat dissipation material layer on the back of the chip, and improve the heat dissipation performance of the chip.
[0100] It should be noted that, for the specific structural features and distribution features of the first network structure and the second network structure, reference may be made to the above description, which will not be repeated here.
[0101] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the embodiments of the present disclosure, but the embodiments of the present disclosure are not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the embodiments of the present disclosure, and these modifications and improvements are also considered to be within the protection scope of the embodiments of the present disclosure.
Claims
1. A flip chip packaging method, characterized in that: The method comprises: Providing a substrate, a chip and a metal layer mesh, wherein the size of the metal layer mesh is the same as the size of the chip; Flip-chip the chip onto the substrate; Dispensing an organic heat dissipation material on the back of the chip according to a preset pattern; Placing a metal layer mesh on the organic heat dissipation material and aligning the metal layer mesh with the chip; Mounting a heat sink on the metal layer mesh, wherein during the mounting process, the organic heat dissipation material is subjected to force and evenly covers the back of the chip; The organic heat dissipation material is solidified; wherein the metal layer mesh can prevent the interface degradation of the organic heat dissipation material during the solidification process of the organic heat dissipation material.
2. The flip chip packaging method according to claim 1, characterized in that: The metal layer mesh includes a plurality of first mesh structures and a plurality of second mesh structures; The first mesh structure and the second mesh structure are arranged alternately; wherein, The first mesh structure is used to provide strength support for the organic heat dissipation material during the curing process of the organic heat dissipation material; The second mesh structure is used to disperse and transfer the load acting on the organic heat dissipation material during the curing process of the organic heat dissipation material, so as to relieve the stress acting on the organic heat dissipation material.
3. The flip chip packaging method according to claim 2, characterized in that: The first network structure is a honeycomb structure, and the second network structure is a grid structure.
4. The flip chip packaging method according to claim 2, characterized in that: The first mesh structure is distributed in a chip deformation concentrated area, and the second mesh structure is distributed in an area outside the chip deformation concentrated area.
5. The flip chip packaging method according to any one of claims 2 to 4, characterized in that: A plurality of the first mesh structures and a plurality of the second mesh structures are distributed alternately and at intervals along the length direction of the chip.
6. The flip chip packaging method according to any one of claims 1 to 4, characterized in that: The dispensing of the organic heat dissipation material on the back of the chip according to a preset pattern includes: Determining the amount of the organic heat dissipation material to be dispensed according to the thickness of the metal layer mesh and its mesh structure; The organic heat dissipation material is dispensed on the back side of the chip according to a preset pattern and the dispensing amount.
7. The flip chip packaging method according to any one of claims 1 to 4, characterized in that: The step of curing the organic heat dissipation material comprises: Preliminarily fixing the organic heat dissipation material at room temperature; Heating the organic heat dissipation material after preliminary fixation to a preset temperature to enhance the interfacial adhesion of the organic heat dissipation material; The organic heat dissipation material is placed in an oven for baking to completely solidify the organic heat dissipation material.
8. A flip chip packaging structure, characterized in that: It includes a substrate, a chip, an organic heat dissipation material layer, a metal layer mesh and a heat sink; wherein the size of the metal layer mesh is the same as the size of the chip; The chip is flip-chip mounted on the substrate; The organic heat dissipation material layer is arranged on the back side of the chip; The metal layer mesh is embedded in the organic heat dissipation material layer and aligned with the chip; wherein, The metal layer mesh can prevent the interface degradation of the organic heat dissipation material layer during the curing process of the organic heat dissipation material layer, so that the organic heat dissipation material layer can completely cover the back side of the chip; The heat sink is covered on the organic heat sink material layer and the edge area of the heat sink is fixed on the substrate.
9. The flip chip packaging structure according to claim 8, characterized in that: The metal layer mesh includes a plurality of first mesh structures and a plurality of second mesh structures; The first mesh structure and the second mesh structure are arranged alternately; wherein, The first mesh structure can provide strength support for the organic heat dissipation material layer during the curing process of the organic heat dissipation material layer; The second mesh structure can disperse and transfer the load acting on the organic heat dissipation material layer during the curing process of the organic heat dissipation material layer, so as to relieve the stress acting on the organic heat dissipation material layer.
10. The flip chip packaging structure according to claim 9, characterized in that: The first network structure is a honeycomb structure, and the second network structure is a grid structure.