Flexible circuit board

Abstract

The invention discloses a flexible circuit board which comprises a circuit board body, a fiber reinforcement layer and an anti-corrosion protection layer. The fiber reinforced layer is arranged on one side of the circuit board body, and the thickness of the fiber reinforced layer is 0.4-0.5 mm, so that the bending performance of the circuit board is prevented from being greatly influenced by the too thick fiber reinforced layer on the premise of ensuring that the structural strength and the wear resistance of the circuit board are improved; and the anti-corrosion protection layer is arranged on one surface, far away from the circuit board body, of the fiber reinforcement layer, and the thickness of the anti-corrosion protection layer is 0.25-0.30 mm, so that the bending performance of the circuit board is prevented from being greatly influenced by the too thick fiber reinforcement layer on the premise that the surface of the circuit board is protected from being damaged by chemical substances and external environment.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and in particular to a flexible circuit board. Background Art

[0002] Flexible circuit boards are widely used in electronic products. Their unique flexibility and bendability enable them to adapt to the space constraints and shape requirements of various complex electronic devices. However, flexible circuit boards often have problems such as weak structure and easy damage. Summary of the invention

[0003] In order to solve the above technical problems, an embodiment of the present invention provides a flexible circuit board, including a circuit board body, a fiber reinforced layer and an anti-corrosion protective layer; the fiber reinforced layer is arranged on one side of the circuit board body, and the thickness of the fiber reinforced layer is 0.4-0.5 mm; the anti-corrosion protective layer is arranged on the side of the fiber reinforced layer away from the circuit board body, and the thickness of the anti-corrosion protective layer is 0.25-0.30 mm.

[0004] As a preferred embodiment, the fiber reinforcement layer includes hydroxyethyl cellulose and polyethylene.

[0005] As a preferred embodiment, the mass ratio of the hydroxyethyl cellulose to the polyethylene is 1:1 to 1:5.

[0006] As a preferred embodiment, the fiber reinforced layer is provided with a plurality of first through holes, the anti-corrosion protection layer is provided with a plurality of second through holes, the first through holes are connected with the second through holes to form third through holes; the plurality of first through holes and the plurality of second through holes are in a one-to-one correspondence.

[0007] As a preferred solution, a porous heat dissipation material is provided in the third through hole.

[0008] As a preferred solution, an adhesive is further provided in the third through hole, and the porous heat dissipation material is connected in the third through hole through the adhesive.

[0009] As a preferred solution, the diameter of the third through hole gradually increases from the fiber reinforced layer toward the anti-corrosion protective layer.

[0010] As a preferred solution, the ratio of the diameter of the third through hole to the depth of the third through hole is 1 / 2 to 5.

[0011] Compared with the prior art, the beneficial effects of the embodiments of the present invention are as follows: the embodiments of the present invention provide a flexible circuit board, which includes a circuit board body, a fiber reinforcement layer and an anti-corrosion protective layer; the fiber reinforcement layer is arranged on one side of the circuit board body, and the thickness of the fiber reinforcement layer is 0.4-0.5 mm, so as to ensure that the structural strength and wear resistance of the circuit board are improved, while avoiding the excessively thick fiber reinforcement layer from causing a significant impact on the bending performance of the circuit board; the anti-corrosion protective layer is arranged on the side of the fiber reinforcement layer away from the circuit board body, and the thickness of the anti-corrosion protective layer is 0.25-0.30 mm, so as to protect the surface of the circuit board from damage by chemicals and the external environment, while avoiding the excessively thick fiber reinforcement layer from causing a significant impact on the bending performance of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 Schematic diagram of the structure of the flexible circuit board in the embodiment of the present invention.

[0013] Among them, 1. Circuit board body; 2. Fiber reinforcement layer; 3. Anti-corrosion protective layer. DETAILED DESCRIPTION

[0014] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0015] See also Figure 1 , which is a schematic diagram of the structure of the flexible circuit board in an embodiment of the present invention.

[0016] The flexible circuit board of an embodiment of the present invention includes a circuit board body, a fiber reinforced layer and an anti-corrosion protective layer; the fiber reinforced layer is arranged on one side of the circuit board body, and the thickness of the fiber reinforced layer is 0.4-0.5 mm; the anti-corrosion protective layer is arranged on the side of the fiber reinforced layer away from the circuit board body, and the thickness of the anti-corrosion protective layer is 0.25-0.30 mm.

[0017] In this embodiment, the circuit board body is a circuit board with flexibility and bendability, also known as a flexible circuit board, a soft board, a flexible printed circuit board, etc.

[0018] Specifically, the thickness of the fiber reinforced layer is 0.4-0.5 mm, for example, it can be 0.4 mm, 0.41 mm, 0.42 mm, 0.43 mm, 0.44 mm, 0.45 mm, 0.46 mm, 0.47 mm, 0.48 mm, 0.49 mm, 0.5 mm, etc. Of course, the thickness of the fiber reinforced layer can also be set to other values ​​within the range of 0.4-0.5 mm according to actual use requirements, which will not be elaborated here.

[0019] In an optional embodiment, the fiber reinforcement layer includes hydroxyethyl cellulose and polyethylene. In a specific implementation, for example, the hydroxyethyl cellulose and polyethylene can be crushed and mixed first, and a solvent such as ethanol or acetone can be added to prepare a polymer solution, and then the impurities are filtered out and coated on one side of the circuit board body, which can be cured to form a fiber reinforcement layer, thereby improving the structural strength and wear resistance of the circuit board. Exemplarily, the mass ratio of the hydroxyethyl cellulose and the polyethylene is 1:1 to 1:5, for example, it can be 1:1, 1:1.3, 1:1.5, 1:2, 1:2.5, 1:2.8, 1:3, 1:3.3, 1:3.5, 1:3.8, 1:4, 1:4.3, 1:4.5, 1:4.8, 1:5, etc. Of course, the mass ratio of the hydroxyethyl cellulose and the polyethylene can also be set to other ratios according to actual use requirements, which will not be described in detail here.

[0020] Specifically, the thickness of the anti-corrosion protective layer is 0.25-0.30 mm, for example, it can be 0.25 mm, 0.255 mm, 0.26 mm, 0.265 mm, 0.27 mm, 0.275 mm, 0.28 mm, 0.285 mm, 0.29 mm, 0.295 mm, 0.30 mm, etc. Of course, the thickness of the anti-corrosion protective layer can also be set to other values ​​within the range of 0.25-0.30 mm according to actual use requirements, which will not be elaborated here.

[0021] In a specific implementation, the anti-corrosion protective layer can be formed by coating a coating composed of sodium dihydrogen phosphate (2g), dipotassium hydrogen phosphate (3.5g), zinc salt (2g), ammonium chloride (0.5g) and water (400ml) on the fiber reinforced layer and curing it.

[0022] In an optional embodiment, the fiber reinforced layer is provided with a plurality of first through holes, the anti-corrosion protection layer is provided with a plurality of second through holes, the first through holes are connected with the second through holes to form third through holes; the plurality of first through holes and the plurality of second through holes are in a one-to-one correspondence.

[0023] In an embodiment of the present invention, by providing a plurality of first through holes in the fiber-reinforced layer, and providing a plurality of second through holes in the anti-corrosion protective layer, and the first through holes are connected with the second through holes to form a third through hole, the plurality of first through holes and the plurality of second through holes are in a one-to-one correspondence, so that deformation space can be reserved in advance, so that the fiber-reinforced layer and the anti-corrosion protective layer are heated and expanded to the reserved deformation space when the flexible circuit board is heated due to work or other reasons, so as to avoid the problem that the fiber-reinforced layer and the anti-corrosion protective layer are damaged in various places due to thermal expansion. In addition, the reserved deformation space can also make the flexible circuit board easy to bend, making the flexible circuit board particularly suitable for scenes with large bending angles. In addition, the reserved deformation space can also facilitate the heat dissipation of the flexible circuit board to ensure the stable operation of the flexible circuit board.

[0024] In a specific implementation, for example, laser drilling or other methods may be used to provide a plurality of first through holes in the fiber reinforced layer, and a plurality of second through holes in the anti-corrosion protection layer.

[0025] Furthermore, a porous heat dissipation material is provided in the third through hole. Exemplarily, the porous heat dissipation material is, for example, porous metal, graphite, etc. Of course, the porous heat dissipation material can also be other porous heat dissipation materials. In this embodiment, since the porous heat dissipation material is provided in the third through hole, it is not easy to cause short circuit and other problems to the flexible circuit board even if it has conductive properties, so the porous heat dissipation material can be a conductive material or a non-conductive material.

[0026] The embodiment of the present invention further improves the heat dissipation performance of the flexible circuit board by providing a porous heat dissipation material in the third through hole. At the same time, due to the porous structure of the porous heat dissipation material, it has a certain elasticity, so that the bending performance of the flexible circuit board can be guaranteed, so that it can have a larger bending angle. In addition, compared with the case where the porous heat dissipation material is not provided in the third through hole, the embodiment of the present invention provides a porous heat dissipation material in the third through hole, which can improve the strength of the flexible circuit board to a certain extent.

[0027] Furthermore, an adhesive is also provided in the third through hole, and the porous heat dissipation material is connected to the third through hole through the adhesive. In a specific implementation, for example, an adhesive can be first provided in the third through hole, and then the porous heat dissipation material can be provided on the adhesive, so that the porous heat dissipation material is firmly connected to the third through hole. In addition, by adding the adhesive, the strength of the flexible circuit board can be further improved. In addition, since the adhesive also has a certain elasticity, it can also ensure the bending performance of the flexible circuit board to a certain extent, so that it can have a larger bending angle.

[0028] In an optional embodiment, the aperture of the third through hole gradually increases from the fiber reinforced layer toward the anti-corrosion protective layer, so that the third through hole gradually increases from the bottom toward its opening, and finally the opening of the third through hole is larger than other parts of the third through hole, which can further facilitate the bending of the flexible circuit board to improve the bending performance of the flexible circuit board, and can further facilitate heat dissipation.

[0029] In an optional implementation, the ratio of the diameter of the third through hole to the depth of the third through hole is 1 / 2 to 5, so that the flexible circuit board has good bending and heat dissipation properties.

[0030] Compared with the prior art, the beneficial effects of the embodiments of the present invention are as follows: the embodiments of the present invention provide a flexible circuit board, which includes a circuit board body, a fiber reinforcement layer and an anti-corrosion protective layer; the fiber reinforcement layer is arranged on one side of the circuit board body, and the thickness of the fiber reinforcement layer is 0.4-0.5 mm, so as to ensure that the structural strength and wear resistance of the circuit board are improved, while avoiding the excessively thick fiber reinforcement layer from causing a significant impact on the bending performance of the circuit board; the anti-corrosion protective layer is arranged on the side of the fiber reinforcement layer away from the circuit board body, and the thickness of the anti-corrosion protective layer is 0.25-0.30 mm, so as to protect the surface of the circuit board from damage by chemical substances and the external environment, while avoiding the excessively thick fiber reinforcement layer from causing a significant impact on the bending performance of the circuit board. The embodiments of the present invention can be widely used in flexible circuit boards of various electronic products. At the same time, the embodiments of the present invention can also effectively reduce the cost of the circuit board and improve production efficiency and quality.

[0031] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A flexible circuit board, characterized in that: It includes a circuit board body, a fiber reinforced layer and an anti-corrosion protective layer; the fiber reinforced layer is arranged on one side of the circuit board body, and the thickness of the fiber reinforced layer is 0.4-0.5 mm; the anti-corrosion protective layer is arranged on the side of the fiber reinforced layer away from the circuit board body, and the thickness of the anti-corrosion protective layer is 0.25-0.30 mm.

2. The flexible circuit board according to claim 1, characterized in that: The fiber reinforcement layer includes hydroxyethyl cellulose and polyethylene.

3. The flexible circuit board according to claim 2, characterized in that: The mass ratio of the hydroxyethyl cellulose to the polyethylene is 1:1 to 1:

5.

4. The flexible circuit board according to any one of claims 1 to 3, characterized in that: The fiber reinforced layer is provided with a plurality of first through holes, the anti-corrosion protection layer is provided with a plurality of second through holes, the first through holes are connected with the second through holes to form third through holes; the plurality of first through holes and the plurality of second through holes are in a one-to-one correspondence.

5. The flexible circuit board according to claim 4, characterized in that: A porous heat dissipation material is disposed in the third through hole.

6. The flexible circuit board according to claim 5, characterized in that: Adhesive is also provided in the third through hole, and the porous heat dissipation material is connected in the third through hole through the adhesive.

7. The flexible circuit board according to claim 4, characterized in that: The aperture of the third through hole gradually increases from the fiber reinforced layer toward the anti-corrosion protective layer.

8. The flexible circuit board according to claim 4, characterized in that: The ratio of the diameter of the third through hole to the depth of the third through hole is 1 / 2 to 5.

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