Cooling structure for electronic component and vehicle drive device

Abstract

The invention provides a cooling structure of electronic components and a vehicle driving device, which can efficiently cool a plurality of electronic components and can miniaturize a device equipped with the electronic components. In the cooling structure of the electronic component, a plurality of cooling plates (11, 12) are configured, and cooling fluid flow paths for cooling the electronic component (15, 16, 21, 22, T) to flow are formed in the cooling plates (11, 12). In a cooling structure for electronic components, electronic components (15, 16, 21, 22, T) are disposed facing each other on both sides of a plurality of cooling plates (11, 12), and each electronic component (15, 16, 21, 22, T) is cooled via the facing cooling plates (11, 12).

Description

Technical Field

[0001] The present invention relates to a cooling structure for electronic components and a vehicle drive device. Background Art

[0002] In recent years, cars equipped with motors as driving sources (hybrid electric vehicles (HEV: Hybrid Electric Vehicle), plug-in hybrid electric vehicles (PHEV: Plug-in Hybrid Electric Vehicle), battery electric vehicles (BEV: Battery Electric Vehicle), fuel cell electric vehicles (FCEV: Fuel Cell Electric Vehicle), etc.) are becoming popular. Hereinafter, these cars are collectively referred to as electric vehicles. In electric vehicles, since there are many devices that need to be cooled, such as motors (including internal combustion engines such as engines), batteries, air conditioners, ECUs, etc., a cooling circuit is formed to circulate coolant, refrigerant, and oil to cool them.

[0003] Patent document 1 discloses a power supply device, which includes: a housing divided into a first space and a second space by a partition member; and a transformer that transforms the voltage of the input power and outputs it. In the power supply device, a first circuit portion of the transformer to which a first voltage of the input power is applied is accommodated in the first space, and a second circuit portion to which a second voltage transformed from the first voltage is applied is accommodated in the second space. The first circuit portion and the second circuit portion are electrically connected in the housing via a hole provided in the partition member. The partition member has a heat sink, and the first circuit portion and the second circuit portion are in contact with the partition member.

[0004] Patent Document 2 discloses a power electronic module including a plurality of semiconductor chips and a first liquid cooler and a second liquid cooler for cooling the plurality of semiconductor chips. In the power electronic module, the first liquid cooler and the second liquid cooler are stacked, and the plurality of semiconductor chips are arranged between the first liquid cooler and the second liquid cooler.

[0005] Patent Document 1: Japanese Patent Application Publication No. 2020-061892

[0006] Patent Document 2: Japanese Patent Application No. 2018-512742

[0007] The power supply device disclosed in Patent Document 1 has a first circuit portion and a second circuit portion disposed on both sides of a partition member having a heat sink. Therefore, when the number of components constituting the first circuit portion or the second circuit portion increases, it is necessary to increase the area of ​​the partition member facing the first circuit portion and the second circuit portion. As a result, the size of the power supply device also increases, so there is room for improvement.

[0008] The first liquid cooler and the second liquid cooler of the power electronic module disclosed in Patent Document 2 are opposite to a plurality of semiconductor chips. However, the surfaces of the first liquid cooler and the second liquid cooler that are not opposite to the plurality of semiconductor chips are not provided with components such as semiconductor chips. Therefore, the cooling functions of the first liquid cooler and the second liquid cooler cannot be fully and effectively utilized, and there is room for improvement. Summary of the invention

[0009] Therefore, there is a demand for an electronic component cooling structure and a vehicle drive device that can efficiently cool a plurality of electronic components and can reduce the size of a device on which these electronic components are mounted.

[0010] One embodiment of the cooling structure of the electronic component involved in the present invention is a cooling structure of the electronic component configured with multiple cooling plates, the multiple cooling plates have cooling fluid flow paths formed inside them for circulating cooling fluid for cooling the electronic components, the electronic components are arranged opposite to each other on both sides of each of the multiple cooling plates, and each of the electronic components is cooled via the opposite cooling plates.

[0011] According to the present embodiment, since a plurality of cooling plates are provided, compared with a structure in which only one cooling plate is provided, if the area of ​​the cooling plates is the same, the configuration of the plurality of cooling plates can further increase the degree of freedom of configuration of the plurality of electronic components. In addition, a plurality of electronic components are disposed opposite to each other on both sides of the plurality of cooling plates, and each electronic component is cooled via the opposing cooling plates. Therefore, compared with the case in which the electronic components are cooled using only one side of the cooling plate, the cooling area of ​​the cooling plate can be doubled. Therefore, a plurality of electronic components can be cooled in a space-saving manner. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a longitudinal cross-sectional view of a vehicle drive device in which a conversion module is housed.

[0013] Figure 2 This is a perspective view of a power conversion device including an inverter.

[0014] Figure 3 It is an exploded perspective view of the power conversion device.

[0015] Figure 4 is a top view of the support component.

[0016] Figure 5 This is a circuit diagram of a cooling circuit showing a cooling fluid flow path and a refrigerant flow path.

[0017] Figure 6 This is a circuit diagram of a power conversion circuit of a power conversion device.

[0018] Figure 7It is a cross-sectional view schematically showing the power conversion device.

[0019] Figure 8 yes Figure 1 Cross-sectional view taken along the VII-VII direction.

[0020] Fig. 9 yes Figure 1 A cross-sectional view taken along the VIII-VIII direction.

[0021] Fig.10 This is an exploded perspective view of a vehicle drive device and a housing according to another embodiment (e).

[0022] Description of Reference Numerals

[0023] 11...first cooling plate (cooling plate); 11a...first upper surface (upper surface); 11b...first lower surface (lower surface); 12...second cooling plate (cooling plate); 12a...second upper surface (upper surface); 12b...second lower surface (lower surface); 13...connecting path; 15...switching element (electronic component, inter-board electronic component); 16...large-capacity capacitor (electronic component, inter-board electronic component); 18...frame component; 18a...wall; 18c...protrusion; 18c1...protrusion; 21...coil module (electronic component); 22...AC filter (electronic component, filter substrate); 50...OBC unit (on-board charger); 66...motor drive circuit (electronic components, drive circuit); 100...electric vehicle; A...vehicle drive device; A1...rotation axis; AH...housing; B...power conversion device; BAT1...main battery (battery); BAT2...system battery (battery); C...inverter; E1...first storage chamber; E2...second storage chamber; L...axial direction; E3...upper area; E4...lateral area; M...travel motor (motor); R...flow path (cooling fluid flow path); T...transformer (electronic components, inter-board electronic components); Y...axis-orthogonal direction; Y1...first side of the axis-orthogonal direction; Z...vertical direction. DETAILED DESCRIPTION

[0024] Hereinafter, the cooling structure of the electronic component and the vehicle drive device according to the present invention will be described in detail using the accompanying drawings. In addition, the embodiments described below are for illustrating the present invention, and the present invention is not limited to these embodiments. Therefore, the present invention can be implemented in various ways without departing from its main purpose.

[0025] 〔Basic structure〕

[0026] Figure 1The figure shows a vehicle drive device A that transmits the driving force of a running motor M (an example of a motor) to wheels (not shown). The vehicle drive device A accommodates the running motor M, a gear mechanism Ge that decelerates the driving force of the running motor M and transmits it to the drive wheels, a power conversion device B, and an inverter C in a housing AH. Hereinafter, a vehicle having a running motor M as a running drive source is also referred to as an electric vehicle. Examples of electric vehicles include hybrid electric vehicles (HEV: Hybrid Electric Vehicle), plug-in hybrid electric vehicles (PHEV: Plug-in Hybrid Electric Vehicle), battery electric vehicles (BEV: Battery Electric Vehicle), and fuel cell electric vehicles (FCEV: Fuel Cell Electric Vehicle).

[0027] Since the vehicle drive device A Figure 1 The upper and lower relationships shown are provided in the electric vehicle 100, so in this embodiment, Figure 1 The up and down directions shown are used as a reference to explain the up and down relationship. Figure 1 represents a longitudinal cross section of the vehicle drive device A when viewed in the front-rear direction, Figure 1 The left-right direction in FIG. 1 becomes the width direction of the vehicle body.

[0028] like Figure 6 As shown, the power conversion device B will generate power from the electric vehicle 100 (refer to Figure 1 ) is converted into high-voltage DC power. The converted high-voltage DC power is charged to a main battery BAT1 (an example of a battery) disposed outside the vehicle drive device A. In addition, the power conversion device B converts the DC power from the main battery BAT1 to generate AC power similar to the commercial power supply and supplies it to the outside of the electric vehicle 100.

[0029] like Figure 6 As shown, the inverter C converts DC power from the main battery BAT1 into three-phase AC power, controls the frequency, and supplies the power to the running motor M. As a result, the driving wheels of the electric vehicle 100 are driven, and the electric vehicle 100 runs.

[0030] In addition, if Figure 1 , Figure 2 As shown, the power conversion device B is composed of a plurality of layers in which a plurality of conversion modules (a first conversion module Ba, a second conversion module Bb, and a third conversion module Bc) are stacked in the vertical direction.

[0031] 〔Vehicle drive device〕

[0032] like Figure 1 As shown, the vehicle drive device A accommodates a travel motor M and a gear mechanism Ge in the lower space LS of the housing AH. In the vehicle drive device A, the outer side of the travel motor M in the lower space LS is closed by a motor cover 1, and the outer side of the gear mechanism Ge in the lower space LS is closed by a gear cover 2. The rotation axis A1 of the travel motor M is the same axis as the rotation axis of the gear mechanism Ge.

[0033] The vehicle drive device A accommodates the power conversion device B and the inverter C in the upper space HS of the housing AH. The upper space HS is closed by the upper cover 3. The lower space LS and the upper space HS are independent spaces that are not communicated with each other.

[0034] In the present embodiment, as described above, the power conversion device B and the inverter C are housed in an integrated state inside the housing AH of the vehicle drive device A, but the power conversion device B and the inverter C may be separated. In addition, the vehicle drive device A is a structure in which each of the power conversion device B and the inverter C is housed inside, but at least one of the power conversion device B and the inverter C may be arranged on the outer wall surface or outside of the housing AH of the vehicle drive device A.

[0035] [Layer structure of power conversion device]

[0036] like Figure 1 to Figure 3 As shown, the power conversion device B arranges the first conversion module Ba, the second conversion module Bb and the third conversion module Bc in order from top to bottom. The power conversion device B arranges the first cooling plate 11 (an example of a cooling plate) at the top, arranges the second cooling plate 12 (an example of a cooling plate) below the first cooling plate 11 in the vertical direction, and connects them via a spacer or the like. Thus, it is configured to be stacked at a predetermined interval in the order of the first cooling plate 11 and the second cooling plate 12 from the top along the vertical direction. Both the first cooling plate 11 and the second cooling plate 12 have a plate-like shape.

[0037] The first cooling plate 11 and the second cooling plate 12 each have a flow path R (an example of a cooling fluid flow path) for a coolant (an example of a cooling fluid) to flow, and a coolant (LLC) containing ethylene glycol, propylene glycol, etc. or a coolant such as insulating oil flows through the flow path R. Thus, various electronic components constituting the first conversion module Ba, the second conversion module Bb, and the third conversion module Bc arranged opposite to the upper and lower plate surfaces of the first cooling plate 11 and the second cooling plate 12 can be cooled. Such a structure is a cooling structure of electronic components involved in this embodiment.

[0038] As a specific configuration, in the power conversion device B, a first conversion module Ba and a second conversion module Bb are arranged between the first lower surface 11b (an example of the lower surface) of the first cooling plate 11 and the second upper surface 12a (an example of the upper surface) of the second cooling plate 12. In addition, a third conversion module Bc is arranged on one side of the second lower surface 12b (an example of the lower surface) of the second cooling plate 12. In addition, the inverter C is arranged on one side of the first upper surface 11a (an example of the upper surface) of the first cooling plate 11.

[0039] The first conversion module Ba is disposed opposite to the first lower surface 11b of the first cooling plate 11, and is cooled by the coolant flowing through the first cooling plate 11. The second conversion module Bb is disposed opposite to the second upper surface 12a of the second cooling plate 12, and is cooled by the coolant flowing through the second cooling plate 12. The third conversion module Bc is disposed opposite to the second lower surface 12b of the second cooling plate 12, and is cooled by the coolant flowing through the second cooling plate 12.

[0040] The first conversion module Ba is composed of a plurality of switch elements 15 (an example of an electronic component, an example of an inter-board electronic component) mounted on the upper surface of a plate-shaped upper substrate 14. The upper substrate 14 is supported on the first cooling plate 11 in a state of being away from the first lower surface 11b of the first cooling plate 11 downward. The plurality of switch elements 15 constitute an OBC (On Board Charger) unit 50 (an example of an on-board charger, see Figure 6 ) part.

[0041] exist Figure 1 In FIG. 1 , the plurality of switching elements 15 are shown as one block. The plurality of switching elements 15 are arranged in contact with or close to the first lower surface 11 b of the first cooling plate 11 . Thus, the plurality of switching elements 15 are cooled by the first cooling plate 11 .

[0042] like Figure 3As shown, the second conversion module Bb is composed of a transformer T (an example of an electronic component, an inter-board electronic component) mounted on the lower surface of the upper substrate 14, a plurality of large-capacity capacitors 16 (an example of an electronic component, an inter-board electronic component), and a frame member 18. The frame member 18 functions as a spacer by protruding downward from the lower surface of the upper substrate 14 in a state of surrounding at least a portion of the outer periphery of the transformer T or at least a portion of the plurality of large-capacity capacitors 16. In addition, the plurality of large-capacity capacitors 16 and the transformer T are electronic components with a relatively large weight relative to other electronic components arranged on the same layer. The lower surfaces of the plurality of large-capacity capacitors 16 and the lower surface of the transformer T are arranged in a state of contact with or close to the second upper surface 12a of the second cooling plate 12. As a result, the plurality of large-capacity capacitors 16 and the transformer T are cooled by the second cooling plate 12. In this way, each inter-board electronic component arranged between the first cooling plate 11 and the second cooling plate 12 is cooled by either the first cooling plate 11 or the second cooling plate 12.

[0043] As described later, the heat resistance temperature (heat resistance) of the plurality of large-capacity capacitors 16 is relatively lower than that of other electronic components. By arranging such electronic components with low heat resistance between the first cooling plate 11 and the second cooling plate 12, the influence of heat generated by electronic components with large heat generation such as the inverter C described later can be cut off. As described above, the inverter C is arranged on one side of the first upper surface 11a of the first cooling plate 11, and the first cooling plate 11 is arranged between the plurality of large-capacity capacitors 16 and the inverter C.

[0044] like Figure 3 , Figure 4As shown, the frame member 18 has: a plurality of wall portions 18a, which overlap at least a portion of the transformer T or the large-capacity capacitor 16 when viewed from the side; a plurality of protrusions 18b, which protrude from the upper surface of the second cooling plate 12 along the stacking direction and face the first lower surface 11b of the first cooling plate 11; and a plurality of protrusions 18c, which protrude from the upper surface of the second cooling plate along the stacking direction and face the lower surface of the upper substrate 14. The wall portion 18a is configured to surround the end of the second cooling plate 12 and a portion of the side surface of the transformer T and the large-capacity capacitor 16. The protrusions 18b and 18c may be connected to the wall portion 18a. The upper surfaces of the protrusions 18b and 18c may be located above the upper surface of the wall portion 18a, or may be located on the same plane as the upper surface of the wall portion 18a. Connection holes for connecting the frame member 18 to the first cooling plate 11 or the upper substrate 14 are formed on the upper surfaces of the protrusions 18b and 18c. The upper substrate 14, the first cooling plate 11, and the frame member 18 are connected by inserting a fastening member such as a bolt (not shown) into the fastening hole while the upper surfaces of the protruding portions 18b and 18c are in contact with the first lower surface 11b of the first cooling plate 11 or the lower surface of the upper substrate 14. The protruding portion 18c is in contact with the first cooling plate 11 via the fastening member.

[0045] like Figure 4 As shown, the cross-sectional area of ​​the protrusion 18c1 in the direction perpendicular to the stacking direction among the plurality of protrusions 18c is formed to be larger than the cross-sectional area of ​​the protrusion 18c at other locations. Since the areas of the holes formed on the upper surfaces of the protrusion 18c and the protrusion 18c1 are respectively equal, the protrusion 18c1 is thicker than the protrusion 18c. As a result, the contact area between the upper surface of the protrusion 18c1 and the first lower surface 11b of the first cooling plate 11 can be increased, so that heat exchange between the protrusion 18c1 and the first cooling plate 11 is easy, and the frame member 18 can be cooled. Therefore, by arranging the protrusion 18c1 near the switch element 15 with a large current and a high heat generation and the substrate wiring that generates heat due to the current, the switch element 15 and the substrate wiring that generates heat due to the current can be cooled via the protrusion 18c1.

[0046] like Figure 1 , Figure 3As shown, the third conversion module Bc is composed of a plurality of coil modules 21 (an example of an electronic component) and a plurality of AC filters 22 (an example of an electronic component and a filter substrate) mounted on the upper surface of a lower substrate 20 configured to move downward from the second lower surface 12b of the second cooling plate 12. The plurality of coil modules 21 and the plurality of AC filters 22 are electronic components that are relatively heavy relative to other electronic components configured on the same layer. The upper surfaces of the plurality of coil modules 21 and the upper surfaces of the plurality of AC filters 22 are configured to be in contact with or close to the second lower surface 12b of the second cooling plate 12. As a result, the plurality of coil modules 21 and the plurality of AC filters 22 are cooled by the second cooling plate 12.

[0047] 〔Cooling circuit〕

[0048] like Figure 5 As shown, the vehicle drive device A includes a cooling circuit including a coolant flow path L1 through which a coolant as a cooling fluid circulates, a refrigerant flow path L2 through which a coolant circulates, and a lubricating oil flow path L3 through which a lubricating oil circulates.

[0049] The coolant flow path L1 circulates the coolant in the order of the radiator 34, the first cooling plate 11 and the second cooling plate 12 of the power conversion device B, the oil cooler 32, and the water-cooled condenser 31 by driving the coolant pump 33. The flow path R is a part of the coolant flow path L1.

[0050] The refrigerant flow path L2 is configured to supply the refrigerant cooled externally to the water-cooled condenser 31. In the refrigerant flow path L2, hydrofluorocarbon (HFC), hydrofluoroolefin (HFO) or the like is used as the refrigerant.

[0051] The lubricating oil flow path L3 supplies low-temperature lubricating oil to the interior of the travel motor M and the gear mechanism Ge by driving the hydraulic pump 35 .

[0052] The cooling circuit allows the coolant cooled by the radiator 34 to flow through the flow path R of the first cooling plate 11 and the flow path R of the second cooling plate 12 of the power conversion device B. As a result, the coolant absorbs the heat generated in the first conversion module Ba, the second conversion module Bb, and the third conversion module Bc, and cools the first conversion module Ba, the second conversion module Bb, and the third conversion module Bc. As a result, the temperature of the coolant rises.

[0053] The oil cooler 32 is arranged on the downstream side of the power conversion device B in the coolant flow path L1, and performs heat exchange between the coolant and the oil circulating in the coolant flow path L1. As a result, the temperature of the coolant further rises and the temperature of the oil decreases. In this way, the oil with a lowered temperature is circulated in the lubricating oil flow path L3. As a result, the temperature rise of the travel motor M and the gear mechanism Ge in the lower space LS of the housing AH is suppressed, and the travel motor M and the gear mechanism Ge are lubricated. The coolant whose temperature has risen at the oil cooler 32 absorbs heat from the refrigerant at the water-cooled condenser 31, and then the temperature is lowered by heat dissipation at the radiator 34, and is supplied to the power conversion device B again.

[0054] 〔Structure of power conversion circuit〕

[0055] Figure 6 The circuit diagram shows a power conversion circuit of the power conversion device B. The power conversion circuit includes a filter unit 40 , an OBC unit 50 , an auxiliary machine inverter unit 60 and a main machine inverter unit 65 constituting an inverter C, and a control unit D.

[0056] 〔Power conversion circuit: filter unit〕

[0057] The filter unit 40 includes an input connector 40 a , an output connector 40 b , the AC filter 22 , a relay module 42 , a coil module 21 , a current detection module 44 , and an input / output control unit 45 .

[0058] like Figure 1 , Figure 3 As shown, the plurality of coil modules 21 and the plurality of AC filters 22 of the filter unit 40 are provided in the third conversion module Bc.

[0059] In addition, the input / output control unit 45 outputs a control signal to the relay module 42 and acquires a detection signal from the current detection module 44 .

[0060] [Power conversion circuit: OBC unit]

[0061] like Figure 6As shown, the OBC unit 50 includes a transformer T, a low voltage connector 50a, a conversion circuit 51, a primary coil control circuit 52, a large-capacity capacitor 16, a secondary coil control circuit 54, a tertiary coil control circuit 55, a conversion circuit control unit 56, a transformer control unit 57, and a low voltage control unit 58. The primary coil control circuit 52 controls the primary coil T1 of the transformer T. The large-capacity capacitor 16 is arranged in the power system that transmits power from the conversion circuit 51 to the primary coil control circuit 52. The secondary coil control circuit 54 controls the secondary coil T2 of the transformer T. The tertiary coil control circuit 55 obtains power from the tertiary coil T3 of the transformer T. The low voltage connector 50a supplies the power from the tertiary coil control circuit 55 to the low voltage system battery BAT2 (an example of a battery).

[0062] In the OBC unit 50, a plurality of switching elements 15 constituting a part of the conversion circuit 51, the primary coil control circuit 52, the secondary coil control circuit 54, etc. are mounted on the upper surface of the upper substrate 14 as a first conversion module Ba and are cooled by the first cooling plate 11 (see Figure 1 ).

[0063] In addition, if Figure 1 , Figure 3 As shown, the transformer T and a plurality of large-capacity capacitors 16 of the OBC unit 50 are mounted on the lower surface of the upper substrate 14 to form a second conversion module Bb. In addition, the transformer T, a plurality of large-capacity capacitors 16, and components associated with them may also be provided on a substrate different from the upper substrate 14.

[0064] like Figure 6 As shown, the conversion circuit control unit 56 controls the plurality of switching elements 15 of the conversion circuit 51. In addition, the transformer control unit 57 controls the plurality of switching elements 15 of the primary coil control circuit 52 and the plurality of switching elements 15 of the secondary coil control circuit 54. The low voltage control unit 58 controls the plurality of switching elements 15 of the tertiary coil control circuit 55.

[0065] [Power conversion circuit: auxiliary machine inverter unit]

[0066] like Figure 6 As shown, the auxiliary machine inverter unit 60 of the inverter C functions as a DC-DC converter 70 (hereinafter, also referred to as a converter 70 ), and includes a first high voltage connector 60 a , an auxiliary machine drive circuit 61 , a DC filter 62 , and an auxiliary machine control unit 63 .

[0067] The auxiliary machine drive circuit 61 includes a plurality of switching elements. The auxiliary machine control unit 63 supplies high-voltage power to the air conditioner 5 and the like as auxiliary machines through the first high-voltage connector 60a by controlling the auxiliary machine drive circuit 61. That is, the converter 70 includes a plurality of switching elements.

[0068] like Figure 2 As shown in FIG. 1 , the auxiliary machine inverter unit 60 of the inverter C is arranged above the first cooling plate 11 and in a region protruding outward from the first cooling plate 11 when viewed in the vertical direction.

[0069] 〔Power conversion circuit: main inverter unit〕

[0070] like Figure 6 As shown, the main inverter unit 65 of the inverter C includes a second high voltage connector 65a, a motor drive circuit 66 (an example of an electronic component and a drive circuit), and a smoothing capacitor 67. The motor drive circuit 66 includes a plurality of switching elements and supplies power to the travel motor M. The motor drive circuit 66 is disposed adjacent to the smoothing capacitor 67.

[0071] like Figure 2 As shown, the main inverter unit 65 including the motor drive circuit 66 and the smoothing capacitor 67 is arranged in contact with or close to the first upper surface 11a of the first cooling plate 11. Thus, the main inverter unit 65 is cooled by the first cooling plate 11.

[0072] The main inverter unit 65 functions by supplying high-voltage power flowing between the OBC unit 50 and the auxiliary inverter unit 60, and charging the main battery BAT1 by supplying the high-voltage power from the second high-voltage connector 65a. Therefore, in a broad sense, the OBC unit 50 and the main inverter unit 65 can also be referred to as an on-board charger.

[0073] The main inverter unit 65 converts the power from the main battery BAT1 into three-phase AC power through the motor drive circuit 66 , controls the frequency and supplies the power to the running motor M, thereby obtaining a driving force from the running motor M that enables the electric vehicle 100 to run.

[0074] 〔Power conversion circuit: control unit〕

[0075] like Figure 6 As shown, the control unit D outputs control signals to the input / output control unit 45 , the conversion circuit control unit 56 , the transformer control unit 57 , the low voltage control unit 58 , and the auxiliary machine control unit 63 .

[0076] like Figure 2 As shown in FIG. 1 , the control unit D is overlapped on the upper side of the first cooling plate 11 and is arranged at a position adjacent to the smoothing capacitor 67 . Thus, the control unit D is cooled by the first cooling plate 11 .

[0077] [Power conversion circuit: current flow]

[0078] The power conversion circuit is controlled by the relay module 42, and the conversion circuit 51 converts the AC power from the AC power supply (basically a commercial power supply) supplied from the outside of the electric vehicle 100 to the input connector 40a into DC, and provides the AC power of a set frequency generated by the primary coil control circuit 52 to the primary coil T1 side of the transformer T.

[0079] The high-voltage power output to the secondary coil T2 side of the transformer T is taken out as high-voltage DC power by the secondary coil control circuit 54 and charged into the main battery BAT1 through the second high-voltage connector 65 a .

[0080] The high-voltage DC power charged in the main battery BAT1 is converted into three-phase AC power by the motor drive circuit 66, and the frequency is controlled and supplied to the running motor M. As a result, the running motor M is driven at a target rotation speed, and the electric vehicle 100 is driven. In addition, the high-voltage DC power from the main battery BAT1 is DC-DC converted by the auxiliary machine drive circuit 61, and supplied to the air conditioner 5 and the like from the first high-voltage connector 60a.

[0081] On the other hand, the low voltage power output to the tertiary coil side of the transformer T is charged as DC power from the low voltage connector 50a to the system battery BAT2 by the tertiary coil control circuit 55. In addition, the power charged to the system battery BAT2 is supplied to the control device and control equipment of the vehicle body of the electric vehicle 100.

[0082] In addition, the power conversion circuit supplies power from the main battery BAT1 to the secondary coil control circuit 54, the transformer T, the primary coil control circuit 52, etc. in sequence through the control of the relay module 42, thereby generating an AC power supply similar to the commercial power supply and outputting it from the output connector 40b.

[0083] 〔Cooling mechanism〕

[0084] The power conversion device B is cooled by the coolant flowing through the first cooling plate 11 and the second cooling plate 12. Figure 7 As shown, the first cooling plate 11 and the second cooling plate 12 are configured such that the flow path R is continuous through a communication path 13 extending in the up-down direction between the first cooling plate 11 and the second cooling plate 12 . The communication path 13 is formed integrally with the frame member 18 .

[0085] The cooling liquid cooled by the radiator 34 and the like and reaching the power conversion device B is Fig. 9The inlet 17 of the second cooling plate 12 shown in the figure flows into the flow path R of the second cooling plate 12. The second cooling plate 12 is continuously formed with a first portion 12A, a second portion 12B, a third portion 12C, and a fourth portion 12D. The flow path R is formed so that the cooling liquid flows in the order of the first portion 12A, the second portion 12B, the third portion 12C, and the fourth portion 12D. The first portion 12A is along the lower substrate 20 (refer to Figure 7 The second portion 12B is folded back from the end of the first portion 12A and extended in a curved manner. The third portion 12C is folded back from the end of the second portion 12B and extended in the length direction of the lower substrate 20. The fourth portion 12D is folded back from the end of the third portion 12C and extended in the length direction of the lower substrate 20. The end of the fourth portion 12D is connected to the end of the connecting path 13.

[0086] The cooling liquid flowing through the flow path R formed in the communication path 13 reaches the first cooling plate 11. Figure 8 As shown, the first cooling plate 11 is continuously formed with a first portion 11A, a second portion 11B, a third portion 11C, a fourth portion 11D, and a fifth portion 11E. The flow path R is formed so that the cooling liquid flows in the order of the first portion 11A, the second portion 11B, the third portion 11C, the fourth portion 11D, and the fifth portion 11E. The first portion 11A extends along the length direction of the lower substrate 20. The second portion 11B is folded back from the end of the first portion 11A and extends along the length direction of the lower substrate 20. The third portion 11C is folded back from the end of the second portion 11B toward the length direction of the lower substrate 20 and extends. The fourth portion 11D is folded back from the end of the third portion 11C at a right angle to the length direction of the lower substrate 20 and extends. The fifth portion 11E is folded back from the end of the fourth portion 11D toward the length direction of the lower substrate 20 and extends. An outflow port (not shown) is formed at the end of the downstream side of the fifth portion 11E, and the cooling liquid flows out from the outflow port to the outside of the power conversion device B.

[0087] Here, when the power generation amount and the heat-resistant temperature (heat resistance) were compared for each electronic component, the results are shown in Table 1.

[0088]

Table 1

[0089]

[0090] That is, the conversion modules Ba, Bb, and Bc (conversion modules) have a current value of, for example, 50 A or less, and the heat generation of the large-capacity capacitor 16 (mode A) is relatively small and the heat resistance temperature is relatively low compared to other electronic components. In addition, the heat generation of the switching element 15 (mode B) is relatively small and the heat resistance temperature is relatively high.

[0091] The main inverter unit 65 has a current of 700A or less, and the smoothing capacitor 67 (mode C) generates a relatively large amount of heat and has a relatively low heat resistance temperature compared to other electronic components. In addition, the motor drive circuit 66 (mode D) generates a relatively large amount of heat and has a relatively high heat resistance temperature.

[0092] The converter 70 has a current of, for example, 20 A or less, and a switching element (mode B) of the converter 70 generates relatively less heat and has a relatively higher heat resistance temperature than other electronic components. The travel motor M (mode D) has a current of, for example, 700 A or less, and generates relatively more heat and has a relatively higher heat resistance temperature than other electronic components.

[0093] In this embodiment, a large-capacitance capacitor 16 is disposed at a position corresponding to the first portion 12A and the second portion 12B of the second cooling plate 12, and an AC filter 22 is disposed at a position corresponding to the third portion 12C of the second cooling plate 12 (see FIG. Fig. 9 ). In addition, the switch element 15 of the first conversion module Ba is arranged at a position corresponding to the boundary between the first portion 11A and the second portion 11B of the first cooling plate 11 (see Figure 8 ).

[0094] Regarding the host inverter unit 65, a smoothing capacitor 67 is arranged at a position corresponding to the first portion 11A and the second portion 11B of the first cooling plate 11, and a switching element of the motor drive circuit 66 is arranged at a position corresponding to the third portion 11C of the first cooling plate 11 (see Figure 8 ).

[0095] In addition, a converter 70 is arranged at a position corresponding to the fourth portion 11D of the first cooling plate 11 (see Figure 8 ).

[0096] In this way, the cooling plates 11 and 12 form a flow path R so that the coolant flows in the order of the large-capacity capacitor 16 of the second conversion module Bb, the AC filter 22, the switching element 15 of the first conversion module Ba, the smoothing capacitor 67 of the host inverter unit 65, the motor drive circuit 66 (switching element) of the inverter C, and the switching element of the converter 70.

[0097] Thus, the power conversion device B does not experience excessive temperature rise because it is cooled by the coolant flowing through the first cooling plate 11 and the second cooling plate 12. Similarly, the inverter C does not experience excessive temperature rise because it is cooled by the coolant flowing through the first cooling plate 11.

[0098] In addition, since the wall portion 18a1 is connected to the communication path 13, the frame member 18 is cooled by heat exchange with the communication path 13 via the wall portion 18a1. Therefore, the large-capacity capacitor 16 arranged near the frame member 18, the switch element 15 of the first conversion module Ba, and the substrate wiring that generates heat due to the current passing therethrough are also cooled by the coolant flowing through the communication path 13. Therefore, the electronic components arranged between the first cooling plate 11 and the second cooling plate 12 are cooled by the coolant flowing through the first cooling plate 11, the communication path 13, and the second cooling plate 12, so that the power conversion device B can be cooled more effectively from its upper surface, lower surface, and side surface.

[0099] The wall portion 18a1 connected to the communication passage 13 is preferably formed thicker than the other wall portions 18a. As a result, the wall portion 18a1 is easily cooled by the coolant flowing through the communication passage 13, so that the power conversion device B can be cooled more effectively via the frame member 18. In addition, not limited to the wall portion 18a1, other wall portions 18a in contact with the first cooling plate 11 can also be made thicker. As a result, the cooling efficiency is improved, and the vibration resistance against external vibrations is improved, so the strength of the power conversion device B can also be improved.

[0100] [Other implementation methods]

[0101] The present invention may be configured as follows other than the above-described embodiment (portions having the same functions as those in the embodiment are denoted by the same reference numerals and reference signs as those in the embodiment).

[0102] (a) In the above embodiment, the power conversion device B is described as having cooling plates 11 and 12 through which coolant as a cooling fluid flows inside each of the plurality of conversion modules Ba, Bb, and Bc, but the present invention is not limited thereto. The power conversion device B may be configured so that a liquid refrigerant (an example of a cooling fluid) flows inside the cooling plates 11 and 12. In addition, the power conversion device B may be configured so that a gas refrigerant (an example of a cooling fluid) flows inside the cooling plates 11 and 12.

[0103] (b) In the above embodiment, the cooling plates 11 and 12 are stacked up and down, but a single cooling plate may be arranged, or three or more cooling plates may be stacked.

[0104] (c) In the above embodiment, an example of a structure in which the cooling plates 11 and 12 are formed with a flow path R so that the coolant flows to the large-capacity capacitor 16, the AC filter 22, the switching element 15, the smoothing capacitor 67 of the host inverter unit 65, the motor drive circuit 66, and the converter 70 is shown. Alternatively, the cooling plates 11 and 12 may also have the following structure. The cooling plates 11 and 12 may also be formed with a flow path R so that the coolant flows to at least the large-capacity capacitor 16, the switching element 15, and the motor drive circuit 66 of the host inverter unit 65. Alternatively, the cooling plates 11 and 12 may also be formed with a flow path R so that the coolant flows to at least the large-capacity capacitor 16, the switching element 15, the motor drive circuit 66 of the host inverter unit 65, and the converter 70.

[0105] (d) In the above embodiment, each electronic component is configured as follows. That is, a host inverter unit 65 including a motor drive circuit 66 and a smoothing capacitor 67 is arranged opposite to the first upper surface 11a of the first cooling plate 11, and a plurality of switching elements 15 of the OBC unit 50 are arranged opposite to the first lower surface 11b. In addition, a plurality of large-capacity capacitors 16 and a transformer T are arranged opposite to the second upper surface 12a of the second cooling plate 12, and a plurality of coil modules 21 and a plurality of AC filters 22 are arranged opposite to the second lower surface 12b. However, the configuration of each electronic component along the vertical direction may be opposite to the above configuration. That is, a plurality of coil modules 21 and a plurality of AC filters 22 may be arranged opposite to the first upper surface 11a of the first cooling plate 11, and a plurality of large-capacity capacitors 16 and a transformer T may be arranged opposite to the first lower surface 11b. Alternatively, the plurality of switching elements 15 of the OBC unit 50 may be disposed oppositely on the second upper surface 12 a of the second cooling plate 12 , and the main inverter unit 65 including the motor drive circuit 66 and the smoothing capacitor 67 may be disposed oppositely on the second lower surface 12 b .

[0106] (e) Fig.10 The vehicle drive device A is shown for transmitting the driving force of the travel motor M to wheels (not shown) relative to the housing AH. The vehicle drive device A is configured such that the travel motor M, a gear mechanism Ge that decelerates the driving force of the travel motor M and transmits it to the drive wheels, a power conversion device B, and an inverter C are accommodated in the housing AH.

[0107] The housing AH includes a first housing chamber E1 for housing the travel motor M, and a second housing chamber E2 for housing the power conversion device B and the inverter C for controlling the power supplied to the travel motor M. A direction perpendicular to the vertical direction Z and along the rotation axis A1 of the rotor (not shown) of the travel motor M is defined as an axial direction L, a direction orthogonal to the vertical direction Z and the axial direction L is defined as an axially orthogonal direction Y, and one side of the axially orthogonal direction Y is defined as an axially orthogonal direction first side Y1.

[0108] The housing AH closes the outer side of the travel motor M in the first storage chamber E1 with the first cover 101 and closes the outer side of the gear mechanism Ge in the first storage chamber E1 with the second cover 102. The upper opening of the housing AH is closed with the upper cover 103. Thus, the housing AH has a sealed structure.

[0109] The gear mechanism Ge includes a differential gear mechanism 110 disposed on the same axis as the rotation axis A1 of the travel motor M, and a counter gear mechanism 111 disposed on an offset axis B1 offset from the rotation axis A1.

[0110] The second storage chamber E2 includes: an upper area E3, which is an area on the upper side of the vertical direction Z relative to the driving motor M and overlaps with the driving motor M when viewed in the vertical direction when the electric vehicle 100 is mounted on the vehicle; and a side area E4, which is adjacent to the upper area E3 and is on the first side Y1 in the axial orthogonal direction relative to the driving motor M and does not overlap with the driving motor M when viewed in the vertical direction.

[0111] In the vehicle drive device A of the present embodiment, at least a portion of the inverter C is disposed in the upper region E3 , and the power conversion device B is disposed in a region extending downward from the inverter C in the side region E4 .

[0112] That is, in the present embodiment, when viewed in the direction along the axial direction L (when viewed from the side), when the inverter C is in a horizontal position, the power conversion device B extends in the longitudinal direction along the vertical direction Z, so that the inverter C and the power conversion device B form an "inverted L" shape. That is, in the area extending along the axis-orthogonal direction Y in the upper area E3 of the second storage chamber E2, the inverter C is arranged in a horizontal position on the upper side of the travel motor M, and the power conversion device B is arranged in a vertical position in the side area E4 adjacent to the upper area E3 and extending in the longitudinal direction. In addition, instead of the configuration of the present embodiment, it is also possible to configure the power conversion device B to be arranged in the upper area E3 and the inverter C to be arranged in the side area E4. According to the configuration of the present embodiment, the upper area E3 on the upper side of the motor M and the side area E4 adjacent to the motor M in the axis-orthogonal direction Y can be effectively used to configure the inverter C and the power conversion device B.

[0113] In this other embodiment e, the side opposite to the first side Y1 in the axis-orthogonal direction is referred to as the second side Y2 in the axis-orthogonal direction, and either the first side Y1 in the axis-orthogonal direction or the second side Y2 in the axis-orthogonal direction may be the front side of the body of the electric vehicle 100 .

[0114] In the above-mentioned embodiment, the following structures are conceivable.

[0115] [1] One form of a cooling structure for electronic components is a cooling structure for electronic components in which a plurality of cooling plates 11, 12 are stacked and arranged, wherein the plurality of cooling plates 11, 12 have a cooling fluid flow path R formed therein for circulating a cooling liquid for cooling the electronic components 15, 16, 21, 22, 66, T, and electronic components 15, 16, 21, 22, 66, T are arranged opposite to each other on both sides of the plurality of cooling plates 11, 12, and each electronic component 15, 16, 21, 22, 66, T is cooled via the opposite cooling plates 11, 12.

[0116] The cooling structure of the electronic component of this method is equipped with a plurality of cooling plates 11 and 12. Therefore, compared with a structure equipped with only one cooling plate, if the area of ​​the cooling plates is the same, the arrangement of a plurality of cooling plates 11 and 12 can further increase the degree of freedom of arrangement of the plurality of electronic components 15, 16, 21, 22, 66, and T. In addition, a plurality of electronic components 15, 16, 21, 22, 66, and T are arranged opposite to each other on both sides of the plurality of cooling plates 11 and 12, and each electronic component 15, 16, 21, 22, 66, and T is cooled via the opposing cooling plates 11 and 12. Therefore, compared with the case where the electronic component is cooled using only one side of the cooling plate, the cooling area of ​​the cooling plate can be doubled. Therefore, the plurality of electronic components 15, 16, 21, 22, 66, and T can be cooled in a space-saving manner.

[0117] [2] In the electronic component cooling structure of [1], the electronic components 15 , 16 , 21 , 22 , 66 , T and the plurality of cooling plates 11 , 12 are preferably built into the electric vehicle 100 .

[0118] Thus, the electronic components 15 , 16 , 21 , 22 , 66 , and T built into the electric vehicle 100 can be efficiently cooled by the plurality of cooling plates 11 and 12 .

[0119] [3] In the cooling structure for electronic components of [2], preferably, a plurality of cooling plates 11 and 12 are stacked.

[0120] Thus, since the plurality of cooling plates 11 and 12 are stacked, the device having the cooling plates built therein can be more compact than a structure in which only one cooling plate is provided if the cooling plates have the same area.

[0121] [4] In the electronic component cooling structure of [3], the electronic components 15 , 16 , and T disposed between adjacent cooling plates 11 , 12 among the plurality of cooling plates 11 , 12 are preferably cooled by any one of the adjacent cooling plates 11 , 12 .

[0122] Thus, the inter-board electronic components 15, 16, and T composed of electronic components arranged between adjacent cooling plates 11 and 12 are cooled by any of the adjacent cooling plates 11 and 12, so that the inter-board electronic components 15, 16, and T can be cooled by efficiently utilizing the space between the adjacent cooling plates 11 and 12.

[0123] [5] In the electronic component cooling structure of [4], it is preferred that the heat resistance of the inter-board electronic component 16 is relatively lower than that of other electronic components.

[0124] Thus, by arranging the electronic component 16 with relatively low heat resistance between adjacent cooling plates 11 and 12, even if an electronic component with high heat generation is arranged outside the adjacent cooling plates 11 and 12, the cooling plates 11 and 12 can suppress the heat from being transferred to the electronic component 16 with relatively low heat resistance.

[0125] [6] In the cooling structure of the electronic component of [4] or [5], a frame part 18 is preferably arranged between adjacent cooling plates 11 and 12 to cover the side surfaces of at least a portion of the inter-plate electronic components 15, 16, T, and the frame part 18 has a connecting path 13 connected to the cooling fluid flow paths (flow paths R) of the respective cooling plates 11 and 12.

[0126] Thus, the frame member 18 has the communication path 13 through which the cooling fluid flows, so that the frame member 18 is cooled by the cooling fluid flowing through the communication path 13, and the inter-board electronic components 15, 16, T covered by the frame member (18) can be indirectly cooled. Thus, the inter-board electronic components 15, 16, T can be effectively cooled from the upper surface, the lower surface and the side surface thereof.

[0127] [7] In the cooling structure of the electronic component of [6], the frame component 18 preferably has a plurality of wall portions 18a overlapping at least a portion of the inter-board electronic components 15, 16, T in a direction orthogonal to the stacking direction of the cooling plates 11, 12, and at least one of the wall portions 18a is connected to the connecting path 13.

[0128] Thus, the wall portion 18a1 connected to the communication path 13 is easily cooled by the cooling fluid, so the frame member 18 can be cooled through the wall portion 18a1. In addition, the inter-board electronic components 15, 16, and T located near the frame member 18 can be efficiently cooled.

[0129] [8] In the cooling structure of the electronic component of [6] or [7], the frame part 18 preferably has a plurality of protrusions 18c protruding from the cooling plate 12 along the stacking direction and opposite to the adjacent cooling plate 11, and the cross-sectional area of ​​the protrusion 18c1 located near the electronic component (switching element 15) with relatively large heat generation and the substrate wiring that generates heat due to the current flowing therethrough in a direction orthogonal to the stacking direction is larger than the cross-sectional area of ​​the protrusion 18c at other locations.

[0130] Thus, the contact area between the upper surface of the protrusion 18c1 located near the electronic component (switching element 15) with a relatively large heat generation and the substrate wiring that generates heat due to the current flow can be increased, and the cooling plate 11 can be used to indirectly cool the protrusion 18c1. Thus, the electronic component (switching element 15) with a large current flow and a relatively large heat generation and the substrate wiring that generates heat due to the current flow can be indirectly cooled via the frame member 18. Thus, in addition to the cooling plate 11, the electronic component (switching element 15) with a relatively large heat generation and the substrate wiring that generates heat due to the current flow can also be cooled by the frame member 18, so that efficient cooling can be performed.

[0131] [9] In the electronic component cooling structure of [8], the electronic components that generate relatively large amounts of heat are preferably the switching element 15 of the onboard charger 50 that charges the batteries BAT1 and BAT2 of the electric vehicle 100 and the substrate wiring that generates heat due to the current flowing therethrough.

[0132] Thus, the switching element 15, which has a large current flow and generates a relatively large amount of heat, and the substrate wiring that generates heat due to the current flow can be cooled indirectly via the frame member 18. Thus, in addition to the cooling plate 11, the switching element 15 and the substrate wiring that generates heat due to the current flow can also be cooled by the frame member 18, so that cooling can be performed efficiently.

[0133]

[10] In the cooling structure of the electronic component of [3], the plurality of cooling plates 11 and 12 preferably include a first cooling plate 11 and a second cooling plate 12, which are arranged in the order of the first cooling plate 11 and the second cooling plate 12 from the top along the vertical direction, and a driving circuit 66 for driving a motor M that serves as a driving power source for the electric vehicle 100 is arranged on the upper surface 11a of the first cooling plate 11 as an electronic component.

[0134] Generally, the driving circuit 66 that drives the motor M that is the driving power source of the electric vehicle 100 generates a large amount of heat. Therefore, by arranging the driving circuit 66 on the upper surface 11a of the first cooling plate 11, it is possible to suppress the heat of the driving circuit 66 from being transferred to other electronic components, and the driving circuit 66 can be efficiently cooled by the first cooling plate 11.

[0135]

[11] In the electronic component cooling structure of

[10] , the switching element 15 of the onboard charger 50 for charging the batteries BAT1 and BAT2 of the electric vehicle 100 is preferably arranged as an electronic component on the lower surface 11 b of the first cooling plate 11 .

[0136] Thus, the switching element 15 of the on-vehicle charger 50 can be efficiently cooled by the first cooling plate 11. Also, by arranging the switching element 15 of the on-vehicle charger 50 on the lower surface 11b of the first cooling plate 11, electrical wiring to the control circuit can be shortened.

[0137]

[12] In the electronic component cooling structure of

[10] or

[11] , preferably, a transformer T and a large-capacity capacitor 16 are arranged as electronic components on the upper surface 12 a of the second cooling plate 12 .

[0138] Thus, the transformer T and the large-capacity capacitor 16 can be efficiently cooled by the second cooling plate 12. In particular, since the heat resistance of the large-capacity capacitor 16 is relatively low, even if electronic components with a large heat generation are arranged outside the adjacent cooling plates 11 and 12, the cooling plates 11 and 12 can suppress the heat from being transferred to the electronic components with relatively low heat resistance, that is, the large-capacity capacitor 16.

[0139]

[13] In the electronic component cooling structure of

[10] or

[11] , a filter substrate 22 and a coil module 21 are preferably arranged as the electronic components 21 and 22 on the lower surface 12 b of the second cooling plate 12 .

[0140] Thus, the filter substrate 22 and the coil module 21 can be efficiently cooled by the second cooling plate 12. In addition, by arranging the filter substrate 22 and the coil module 21, which are heavy, at the lower side, the weight balance is stabilized.

[0141]

[14] In the cooling structure of the electronic component of [3], the plurality of cooling plates 11 and 12 preferably include a first cooling plate 11 and a second cooling plate 12, which are arranged in the order of the first cooling plate 11 and the second cooling plate 12 from the top along the vertical direction, and a filter substrate 22 and a coil module 21 are arranged on the upper surface 11a of the first cooling plate 11 as electronic components.

[0142] Thus, the filter substrate 22 and the coil module 21 can be efficiently cooled by the first cooling plate 11 .

[0143]

[15] In the electronic component cooling structure of

[14] , preferably, a transformer T and a large-capacity capacitor 16 are disposed as electronic components on the lower surface 11 b of the first cooling plate 11 .

[0144] Thus, the transformer T and the large-capacity capacitor 16 can be efficiently cooled by the first cooling plate 11. In particular, since the heat resistance of the large-capacity capacitor 16 is relatively low, even if electronic components with a large heat generation are arranged outside the adjacent cooling plates 11 and 12, the cooling plates 11 and 12 can suppress the heat from being transferred to the electronic components with relatively low heat resistance, that is, the large-capacity capacitor 16.

[0145]

[16] In the electronic component cooling structure of

[14] or

[15] , the switching element 15 of the onboard charger 50 for charging the batteries BAT1 and BAT2 of the electric vehicle 100 is preferably arranged as an electronic component on the upper surface 12a of the second cooling plate 12.

[0146] Thus, the switching element 15 of the on-vehicle charger 50 can be efficiently cooled by the second cooling plate 12. Also, by arranging the switching element 15 of the on-vehicle charger 50 on the upper surface 12a of the second cooling plate 12, electrical wiring to the control circuit can be shortened.

[0147]

[17] In the electronic component cooling structure of

[14] or

[15] , a drive circuit 66 for driving a motor M serving as a driving power source for the electric vehicle 100 is preferably disposed on the lower surface 12 b of the second cooling plate 12 as an electronic component.

[0148] Generally, the driving circuit 66 that drives the motor M that is the driving power source of the electric vehicle 100 generates a large amount of heat. Therefore, by arranging the driving circuit 66 on the lower surface 12b of the second cooling plate 12, it is possible to suppress the heat of the driving circuit 66 from being transferred to other electronic components, and the driving circuit 66 can be efficiently cooled by the second cooling plate 12.

[0149] [Industrial Applicability]

[0150] The present invention can be used for a cooling structure of electronic components and a vehicle drive device.

Claims

1. A cooling structure for an electronic component, the cooling structure for the electronic component comprising a plurality of cooling plates each having a cooling fluid flow path formed therein for circulating a cooling fluid for cooling the electronic component, wherein: The electronic components are disposed opposite to each other on both sides of each of the plurality of cooling plates. Each of the electronic components is cooled via the opposing cooling plates.

2. The cooling structure for electronic components according to claim 1, wherein: The electronic component and the plurality of cooling plates are built into the electric vehicle.

3. The cooling structure for electronic components according to claim 2, wherein: A plurality of the cooling plates are stacked.

4. The cooling structure for electronic components according to claim 3, wherein: The inter-board electronic components constituted by the electronic components arranged between the adjacent cooling plates among the plurality of cooling plates are cooled by any one of the adjacent cooling plates.

5. The cooling structure for electronic components according to claim 4, wherein: The heat resistance of the inter-board electronic component is relatively lower than that of the other electronic components.

6. The cooling structure for electronic components according to claim 4, wherein: A frame member covering at least a portion of the side surfaces of the electronic components between the boards is arranged between the adjacent cooling boards. The frame member has a communication path communicating with the cooling fluid flow paths of each of the plurality of cooling plates.

7. The cooling structure for electronic components according to claim 6, wherein: The frame member has a plurality of wall portions overlapping at least a portion of the inter-board electronic components in a direction orthogonal to a stacking direction of the cooling plates. At least one of the wall portions is connected to the communication path.

8. The cooling structure for electronic components according to claim 6 or 7, wherein: The frame member has a plurality of protrusions that protrude from the cooling plates along a stacking direction of the cooling plates and face the adjacent cooling plates. The cross-sectional area of ​​the protrusion in the direction perpendicular to the stacking direction is larger in the vicinity of the electronic component generating relatively large amounts of heat and the substrate wiring generating heat due to the current flowing therethrough than in other locations.

9. The cooling structure for electronic components according to claim 8, wherein: The electronic component and the substrate wiring that generate relatively large amounts of heat are switching elements of an on-vehicle charger that charges a battery of the electric vehicle.

10. The cooling structure for electronic components according to claim 3, wherein: The plurality of cooling plates include a first cooling plate and a second cooling plate, The first cooling plate and the second cooling plate are arranged in this order from the top along the vertical direction, A drive circuit for driving a motor serving as a driving power source for the electric vehicle is disposed on an upper surface of the first cooling plate as the electronic component.

11. The cooling structure for electronic components according to claim 10, wherein: A switching element of an on-vehicle charger for charging a battery of the electric vehicle is disposed as the electronic component on the lower surface of the first cooling plate.

12. The cooling structure for electronic components according to claim 10 or 11, wherein: A transformer and a large-capacity capacitor are arranged on the upper surface of the second cooling plate as the electronic components.

13. The cooling structure for electronic components according to claim 10 or 11, wherein: A filter substrate and a coil module are arranged on the lower surface of the second cooling plate as the electronic components.

14. The cooling structure for electronic components according to claim 3, wherein: The plurality of cooling plates include a first cooling plate and a second cooling plate, The first cooling plate and the second cooling plate are arranged in this order from the top along the vertical direction, A filter substrate and a coil module are arranged on the upper surface of the first cooling plate as the electronic components.

15. The cooling structure for electronic components according to claim 14, wherein: A transformer and a large-capacity capacitor are arranged as the electronic components on the lower surface of the first cooling plate.

16. The cooling structure for electronic components according to claim 14 or 15, wherein: A switching element of an on-vehicle charger for charging a battery of the electric vehicle is arranged as the electronic component on the upper surface of the second cooling plate.

17. The cooling structure for electronic components according to claim 14 or 15, wherein: A drive circuit for driving a motor serving as a driving power source for the electric vehicle is disposed on a lower surface of the second cooling plate as the electronic component.

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