A high-efficiency semiconductor wafer slicing device for bending slicing

Abstract

The application provides a high-efficiency semiconductor wafer slicing device with bending function, which comprises a slicing assembly, the slicing assembly comprising a bending module, a lifting module and a fixed support; the bending module comprising a plurality of adsorption blocks; in a flat supporting state, the support frame moves upward to support the plurality of adsorption blocks, and the plurality of adsorption planes are coplanar; in a bending and slicing state, the support frame moves downward, and other adsorption blocks except the adsorption blocks fixedly connected rotate downward under the action of gravity or tension spring, and the plurality of adsorption planes are non-coplanar. In the application, one fixed adsorption block and other plurality of adsorption blocks rotate around the X horizontal direction, so that the semiconductor wafer is placed on the adsorption plane and is adsorbed and fixed by the adsorption hole, the adsorption blocks rotate downward under the action of gravity, and therefore the semiconductor wafer with scratches can be sliced, and the up-down position of the support frame can be accurately controlled, so that the bending module can accurately switch between the two states, thereby improving the slicing accuracy.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of solar semiconductor silicon wafer production, and particularly relates to a high-efficiency bending and separating device for semiconductor silicon wafers. BACKGROUND

[0002] The separating device is mainly used to separate the semiconductor silicon wafers after being cut by a cutting machine. In the current photovoltaic industry, the size of the semiconductor silicon wafers needs to be different, and the separating device needs to be designed according to the specifications and the number of the semiconductor silicon wafers, and the efficiency of the separating device also needs to be improved.

[0003] The existing separating device has the following disadvantages: (1) the number of the semiconductor silicon wafers separated at one time is limited, and the semiconductor silicon wafers can only be separated in one direction; (2) for the semiconductor silicon wafers with narrow spacing and large number, the traditional mechanical hard force separating device is easy to damage the semiconductor silicon wafers, and the existing device cannot achieve the separating of the semiconductor silicon wafers with narrow spacing and large number, and the semiconductor silicon wafers are basically separated by manual work, and the loss of the semiconductor silicon wafers is large. SUMMARY

[0004] The present application provides a high-efficiency bending and separating device for semiconductor silicon wafers.

[0005] In order to achieve the purpose of the present application, the present application provides a high-efficiency bending and separating device for semiconductor silicon wafers, which comprises a separating assembly, the separating assembly comprising a bending module, a lifting module and a fixed support; the bending module comprising a plurality of suction blocks, the suction blocks extending along the X horizontal direction, the plurality of suction blocks arranged along the Y horizontal direction, the suction blocks being provided with suction planes extending along the X horizontal direction, the suction planes being provided with suction holes, the suction blocks being provided with suction pipelines in communication with the suction holes, the outer ends of the suction pipelines being provided with interfaces, the suction blocks being provided with hinge parts at the edges of the suction planes based on the Y horizontal direction, the hinge parts extending along the X horizontal direction, the two hinge parts of the adjacent two suction blocks being hinged to each other; the fixed support being fixedly connected with one of the suction blocks, and the other suction blocks rotating around the X horizontal direction; the lifting module comprising a lifting driving device and a support frame, the support frame extending along the Y horizontal direction, the support frame being located below the plurality of suction blocks, the lifting driving device being connected with the support frame and driving the support frame to move along the Z axis vertical direction; in the flat supporting state, the support frame moves upward to support the plurality of suction blocks, and the plurality of suction planes are horizontally coplanar; in the bending and separating state, the support frame moves downward, and the suction blocks other than the fixedly connected suction block rotate downward under the action of gravity, and the plurality of suction planes are non-coplanar.

[0006] Further, the suction block is provided with a lower stop surface below the hinge part; in the flat supporting state, the two opposite lower stop surfaces have a movable gap therebetween; in the bending and separating state, the two opposite lower stop surfaces are adjacent to each other.

[0007] Further, the lower stop surface is arranged at an acute angle with the vertical direction of the Z axis.

[0008] Further, the upper stop surface of the crossbar is arranged on the outside of the Y horizontal direction of the hinge portion, and the bottom surface of the crossbar is provided with an upper stop surface extending along the Y horizontal direction; in the flat supporting state, the upper stop surface of one adsorption block is located above and adjacent to the adsorption plane of the adjacent adsorption block; in the curved slicing state, the upper stop surface of one adsorption block is located above and separated from the adsorption plane of the adjacent adsorption block.

[0009] Further, the adsorption plane is provided with two hinge portions based on the edge of the Y horizontal direction, and the two hinge portions are respectively located at the ends of the X horizontal direction; the adjacent two crossbars are distributed in staggered manner in the X horizontal direction.

[0010] Further, the hinge portion is arranged as a hinge hole, and the adjacent two hinge portions on the same side are communicated along the X horizontal direction and connected by a hinge column.

[0011] Further, the fixed support is fixedly connected with the adsorption block at the two ends in the X horizontal direction.

[0012] Further, the bending module comprises a tension spring connected between the adsorption blocks located on the outer sides of the Y horizontal direction.

[0013] Further, the semiconductor wafer slicing device comprises two slicing assemblies, and the placement positions of the two slicing assemblies are horizontally rotated by 90°, wherein the adsorption blocks of one slicing assembly rotate around the X horizontal direction, and the adsorption blocks of the other slicing assembly rotate around the Y horizontal direction.

[0014] Further, the semiconductor wafer slicing device is provided with a first slicing station and a second slicing station, the slicing assembly rotating around the X horizontal direction is located on the first slicing station, and the slicing assembly rotating around the Y horizontal direction is located on the second slicing station; the number of adsorption blocks of the slicing assembly of the second slicing station is greater than that of the slicing assembly of the first slicing station.

[0015] The beneficial effects of the present application are that based on one fixed adsorption block, other adsorption blocks rotate around the X horizontal direction, so that the semiconductor silicon wafer is placed on the adsorption plane and is adsorbed and fixed by the adsorption hole, the adsorption block rotates downward under the action of gravity, so that the semiconductor silicon wafer with scratches can be separated, and the up-down position of the support frame can be accurately controlled, so that the bending module can accurately switch between two states, thereby improving the separation accuracy. Furthermore, through the arrangement of the lower stop surface and the upper stop surface, and through the arrangement of the hinge part at both ends, and the transverse rod is arranged in a staggered manner, thereby realizing the position stability of the bending module in the flat supporting state and the bending separation state, and the staggered arrangement can make the hinge part closer to the edge of the adsorption block, thereby the scratches of the separated wafer can be more accurately positioned at the position of the hinge part, thereby further improving the separation accuracy. And the elastic tension of the tension spring drives the rotation and bending of the adsorption block, thereby improving the bending force of the separation.

[0016] In addition, through the arrangement of the first separation station and the second separation station, the separation is carried out along the X horizontal direction in the first separation station, and the separation is carried out along the Y horizontal direction in the second separation station, and through the respective separation in the XY direction, the separation efficiency can be greatly improved. Further, during the first separation, the whole wafer has not been separated, the area is relatively large, and the resistance is relatively large, so fewer adsorption blocks are arranged for separation, and during the second separation, the area is reduced after the first separation, and the resistance is correspondingly reduced, so more adsorption blocks are arranged for separation, thereby improving the separation efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a structural diagram of the semiconductor silicon wafer slicing and separating complete equipment of the present application.

[0018] Figure 2 is a structural diagram of the semiconductor silicon wafer separating device embodiment of the present application.

[0019] Figure 3 is a structural diagram of the semiconductor silicon wafer separating device embodiment of the present application from another perspective.

[0020] Figure 4 is a structural diagram of the separating assembly in the first separation station in the semiconductor silicon wafer separating device embodiment of the present application.

[0021] Figure 5 is a structural diagram of the separating assembly in the first separation station in the semiconductor silicon wafer separating device embodiment of the present application from another perspective.

[0022] Figure 6 is a structural diagram of the bending module in the semiconductor silicon wafer separating device embodiment of the present application.

[0023] Figure 7 is an exploded view of the bending module in the semiconductor silicon wafer separating device embodiment of the present application.

[0024] Figure 8 is a structure diagram of a semiconductor silicon wafer in an embodiment of the semiconductor silicon wafer splitting device of the present application.

[0025] Figure 9 is a side view of the first splitting station in a flat supporting state in an embodiment of the semiconductor silicon wafer splitting device of the present application.

[0026] Figure 10 is a side view of the first splitting station in a curved splitting state in an embodiment of the semiconductor silicon wafer splitting device of the present application.

[0027] Figure 11 is a side view of the second splitting station in a flat supporting state in an embodiment of the semiconductor silicon wafer splitting device of the present application.

[0028] Figure 12 is a side view of the second splitting station in a curved splitting state in an embodiment of the semiconductor silicon wafer splitting device of the present application.

[0029] The present application is further described below in conjunction with the accompanying drawings and embodiments. DETAILED DESCRIPTION

[0030] Reference Figures 1 to 12 The complete set of semiconductor silicon wafer slicing and splitting equipment includes a slicing device, a mechanical hand device 12, a semiconductor silicon wafer splitting device 10, and a discharging device 13. The slicing device is used to perform scratch processing on the semiconductor silicon wafer 101 along the X horizontal direction and the Y horizontal direction, thereby forming X direction scratches 103 and Y direction scratches 104, and planning a plurality of silicon single pieces 102, and having waste edges 105 on both sides in the X horizontal direction, and waste edges 106 on both sides in the Y horizontal direction. After slicing, the mechanical hand device 12 is used to carry the semiconductor silicon wafer to the semiconductor silicon wafer splitting device 10 for splitting processing.

[0031] The semiconductor silicon wafer splitting device 10 includes a splitting assembly 2, a splitting assembly 4, and a turnover device 3. The semiconductor silicon wafer splitting device 10 is provided with a first splitting station and a second splitting station. The splitting assembly 2 rotating around the X horizontal direction is located on the first splitting station, and the splitting assembly 4 rotating around the Y horizontal direction is located on the second splitting station. The splitting structures of the splitting assembly 2 and the splitting assembly 4 are similar, and only differ in the arrangement of the adsorption blocks and the rotating direction. The splitting assembly 2 and the splitting assembly 4 are horizontally rotated by 90°. The splitting assembly 2 is mainly described below.

[0032] The fragmentation assembly 2 comprises a bending module 21, a lifting module 22, a fixed support 23 and four edge trimming modules 24. The bending module 21 comprises four suction blocks 211 and two tension springs 220. The suction blocks 211 extend along the X horizontal direction, and a plurality of suction blocks 211 are arranged along the Y horizontal direction. The suction blocks 211 are provided with suction planes 212 extending along the X horizontal direction. The suction planes 212 are provided with suction holes 213. The suction blocks 211 are provided with suction pipelines 214 in communication with the suction holes 213. The outer ends of the suction pipelines 214 are provided with interfaces 217 for connecting with a vacuum generator. The suction blocks 211 are provided with two hinge portions 214 at the edges of the suction planes 212 based on the Y horizontal direction. The two hinge portions 214 are respectively located at the ends of the X horizontal direction. The suction planes 212 of the suction blocks 211 are provided with crossbars 215 at the outer sides of the hinge portions 214 based on the Y horizontal direction. The crossbars 215 of the suction blocks 211 located in the middle outwardly protrude towards both sides of the Y horizontal direction, while the crossbars 215 of the suction blocks 211 located at the ends are only provided on one side and outwardly protrude towards the middle. The bottom surface of the outwardly protruding portion of the crossbar 215 is provided with an upper stop surface 216 extending along the Y horizontal direction.

[0033] The hinge portions 214 extend along the X horizontal direction. In this embodiment, the hinge portions 214 are arranged as hinge holes. Two hinge portions 214 of adjacent two suction blocks 211 close to each other are hinged. The adjacent two hinge portions 214 located on the same side are in communication along the X horizontal direction and are connected by a hinge column (not shown). The adjacent two crossbars 215 are distributed in a staggered manner along the X horizontal direction. The suction blocks 211 are provided with lower stop surfaces 218 below the hinge portions 214. The stop surfaces 218 extend along the X horizontal direction and are arranged at an acute angle with the Z vertical direction.

[0034] The two fixed supports 23 extend along the Z vertical direction and are respectively located at the two ends of the bending module 21 based on the X horizontal direction. The fixed support 23 is fixedly connected with a suction block 211 located in the middle of the Y horizontal direction. The fixed support 23 is fixedly connected with the two end portions of the suction block 211 in the X horizontal direction, so that the suction blocks 211 on the other two sides rotate around the X horizontal direction. The tension springs 220 are connected between the suction blocks 211 located on the outer sides of the Y horizontal direction. The tension springs 220 are located on the back side of the suction planes 212. The two tension springs 220 are respectively located at the two ends of the X horizontal direction. The tension springs 220 extend along the Y horizontal direction, and the central tension of the tension springs 220 drives the rotation of the suction blocks 211 by applying an elastic external force.

[0035] The lifting module 22 comprises a lifting driving device 221 and a support frame 222. The support frame 222 extends along the Y horizontal direction and is located below the plurality of suction blocks 211. The lifting driving device 221 is connected with the support frame 222 and drives the support frame 222 to move along the Z vertical direction.

[0036] The edge punching module 24 comprises an edge punching support 241, an edge punching driving device 242 and an edge punching column 243, the edge punching driving device 242 is fixedly connected on the edge punching support 241, the edge punching driving device 242 can adopt an electric or pneumatic driving device, the edge punching driving device 242 is connected with the edge punching column 243 and drives the edge punching column 243 to move along the Y horizontal direction, the edge punching column 243 is located at the side of the bending module based on the Y horizontal direction, two edge punching modules 24 are respectively arranged at the side of the bending module based on the Y horizontal direction, the two edge punching modules 24 on the same side are arranged along the X horizontal direction, the edge punching support 241 extends along the Z axis vertical direction, and the edge punching driving device 242 is arranged at the upper end of the edge punching support 241.

[0037] With reference to Figure 9 In the flat supporting state, the support frame 222 moves upward to support the plurality of adsorption blocks 211, the plurality of adsorption planes 212 are horizontally coplanar, at this time, the semiconductor silicon wafer 101 can be placed on the adsorption planes 212 and fixed by the adsorption holes 213, and the X direction scratch 103 is aligned with the edge of the adsorption plane 212 in the Y horizontal direction, the upper stop surface 216 of one adsorption block 211 is located above and adjacent to the adsorption plane 212 of the adjacent adsorption block 211, the rotation of the adsorption block 211 is limited, and the two opposite lower stop surfaces 218 have a movable gap 219.

[0038] With reference to Figure 10 In the bending and slicing state, the support frame 222 moves downward and loses the supporting effect on the adsorption block 211, and the adsorption blocks 211 except the fixedly connected adsorption block 211 rotate downward under the action of gravity and the tension spring 220, at this time, the plurality of adsorption planes 212 are not coplanar, the upper stop surface 216 of one adsorption block 211 is located above and separated from the adsorption plane 212 of the adjacent adsorption block 211, and the two opposite lower stop surfaces 218 are adjacent, at this time, the slicing of the X direction scratch 103 of the semiconductor silicon wafer 101 is completed, then, the edge punching column 243 moves along the Y horizontal direction, because the edge punching direction of the edge punching column 243 and the adsorption plane 212 of the adsorption block 211 located at the edge form an obtuse angle, the edge punching direction of the edge punching column 243 and the waste edge 106 form an obtuse angle, with the edge punching movement of the edge punching column 243, the waste edge 106 is punched off and can fall into the waste groove below.

[0039] After the slicing and edge punching of the first slicing station are completed, the semiconductor silicon wafer 101 after the first slicing and edge punching can be transferred to the slicing assembly 4 of the second slicing station by the mechanical hand device 12 and the suction disc 121 on the mechanical hand device 12.

[0040] The slicing assembly 4 comprises a bending module 41, a lifting module 44, a fixed support and eight edge trimming modules 44. The bending module 41 comprises seven suction blocks 411 which are hingedly arranged along the X horizontal direction based on the same principle of the slicing assembly 2. The fixed support is fixedly connected with the middle suction block 411, and the other suction blocks 411 rotate around the Y horizontal direction.

[0041] Referring to Figure 11 When in the flat supporting state, the support frame 422 moves upward to support the plurality of suction blocks 411, and the plurality of suction planes are coplanar horizontally. At this time, the semiconductor silicon wafer 101 can be placed on the suction planes and fixedly adsorbed by the suction holes, and the Y direction scribe line 104 is aligned with the edge of the suction plane in the X horizontal direction.

[0042] Referring to Figure 12 When in the curved slicing state, the support frame 422 moves downward and loses the supporting effect on the suction blocks 411. Except for the fixedly connected suction block, the other suction blocks rotate downward under the action of gravity and the tension spring. At this time, the plurality of suction planes are non-coplanar, thereby completing the slicing of the Y direction scribe line 104 of the semiconductor silicon wafer 101. Then, the edge trimming column of the edge trimming module 44 moves along the X horizontal direction. Since the edge trimming moving direction of the edge trimming column forms an obtuse angle with the suction plane of the suction block located at the edge, the edge trimming moving direction of the edge trimming column forms an obtuse angle with the waste edge 105. With the edge trimming movement of the edge trimming column, the waste edge 105 is trimmed off and can fall into the waste groove below.

[0043] Then, the flipping device 3 is flipped toward the bending module 41. The suction blocks on the flipping device 3 adsorb each silicon wafer 102. After flipping again, the silicon wafer 102 is flipped toward the outside. Finally, the suction disc 121 on the mechanical hand device 12 transfers each silicon wafer 102 to the tray of the discharging device 13 and discharges it outward.

[0044] Of course, the above-mentioned embodiments are only preferred embodiments of the present application. In specific applications, the number of suction blocks and edge trimming modules can be set according to actual conditions, which includes but is not limited to two or more than two, and the specific number of edge trimming modules can also be set according to actual conditions. The setting of the upper stop surface and the lower stop surface can also be achieved by the lifting of the support frame to switch between the flat supporting state and the curved slicing state. The setting of the upper stop surface and the lower stop surface is a selective setting.

[0045] As can be seen from the above, based on one fixed adsorption block, other adsorption blocks rotate around the X horizontal direction, so that the semiconductor silicon wafer is placed on the adsorption plane and is adsorbed and fixed by the adsorption hole, the adsorption block rotates downward under the action of gravity, so that the semiconductor silicon wafer with scratches can be separated, and the up-down position of the support frame can be accurately controlled, so that the bending module can accurately switch between the two states, to improve the separation accuracy. Furthermore, through the arrangement of the lower stop surface and the upper stop surface, and through the arrangement of the hinge at both ends, and the transverse rod is arranged in a staggered manner, the position stability of the bending module in the flat supporting state and the bending separation state can be realized, and the staggered arrangement can make the hinge closer to the edge of the adsorption block, so that the separation scratch can be more accurately directed to the position of the hinge, thereby further improving the separation accuracy. And by using the abutment positioning of the lower stop surface, not only can the rotation of the adsorption block be limited, but also support is provided when the edge column is edge trimming towards the semiconductor silicon wafer.

[0046] In addition, through the arrangement of the first separation station and the second separation station, the separation is carried out along the X horizontal direction in the first separation station, and the separation is carried out along the Y horizontal direction in the second separation station. Through the respective separation in the XY direction, the separation efficiency can be greatly improved. Further, in the first separation, since the whole piece is not separated, the area is large and the resistance is relatively large, so fewer adsorption blocks are arranged for separation. In the second separation, since it has been separated once, the area is reduced and the resistance is correspondingly reduced, so more adsorption blocks are arranged for separation, to improve the separation efficiency.

Claims

1. A high-efficiency bending slicing device for semiconductor silicon wafers, characterized in that, The device comprises a fragmentation assembly, a lifting module and a fixed support; The bending module comprises a plurality of adsorption blocks extending along the X horizontal direction, and the adsorption blocks are arranged along the Y horizontal direction, and the adsorption blocks are provided with adsorption planes extending along the X horizontal direction, and the adsorption planes are provided with adsorption holes, and the adsorption blocks are provided with adsorption pipelines communicating with the adsorption holes, and the outer end of the adsorption pipeline is provided with an interface, and the adsorption blocks are provided with hinge parts based on the edge of the adsorption plane along the Y horizontal direction, and the hinge parts extend along the X horizontal direction, and the hinge parts of two adjacent adsorption blocks close to each other are hinged; The fixed support is fixedly connected with one of the adsorption blocks, and the other adsorption blocks rotate around the X horizontal direction; The lifting module comprises a lifting driving device and a support frame, and the support frame extends along the Y horizontal direction, and the support frame is located below the plurality of adsorption blocks, and the lifting driving device is connected with the support frame and drives the support frame to move along the Z axis vertical direction; In the flat supporting state, the support frame moves upward to support the plurality of adsorption blocks, and the plurality of adsorption planes are horizontally coplanar; In the bending fragmentation state, the support frame moves downward, and the adsorption blocks except the fixedly connected adsorption block rotate downward under the action of gravity, and the plurality of adsorption planes are non-coplanar.

2. The semiconductor silicon wafer fragmentation device according to claim 1, wherein: The adsorption block is provided with a lower stop surface below the hinge part; In the flat supporting state, the movable gap is provided between the two opposite lower stop surfaces; In the bending fragmentation state, the two opposite lower stop surfaces abut.

3. The semiconductor silicon wafer fragmentation device according to claim 2, wherein: The lower stop surface and the Z axis vertical direction are arranged at an acute angle.

4. The semiconductor silicon wafer fragmentation device according to claim 1, wherein: The adsorption block is provided with a crossbar based on the outer side of the hinge part along the Y horizontal direction, and the bottom surface of the crossbar is provided with an upper stop surface extending along the Y horizontal direction; In the flat supporting state, the upper stop surface of one adsorption block is located above and abuts the adsorption plane of the adjacent adsorption block; In the bending fragmentation state, the upper stop surface of one adsorption block is located above and separated from the adsorption plane of the adjacent adsorption block.

5. The semiconductor silicon wafer fragmentation device according to claim 4, wherein: The adsorption plane is provided with two hinge parts based on the edge of the Y horizontal direction, and the two hinge parts are respectively located at the end of the X horizontal direction; The adjacent two crossbars are staggered in the X horizontal direction.

6. The semiconductor silicon wafer fragmentation device according to claim 5, wherein: The hinge part is arranged as a hinge hole, and the adjacent two hinge parts on the same side communicate along the X horizontal direction and are connected through a hinge column.

7. The semiconductor wafer splitting device according to claim 1, wherein: the fixed support is fixedly connected with the adsorption blocks at two ends in the X horizontal direction.

8. The semiconductor wafer splitting device according to claim 1, wherein: the bending module comprises a tension spring connected between the adsorption blocks at two outer sides in the Y horizontal direction.

9. The semiconductor wafer splitting device according to any one of claims 1 to 8, wherein: the semiconductor wafer splitting device comprises two wafer splitting assemblies, and the two wafer splitting assemblies are horizontally rotated by 90°, wherein the adsorption blocks of one wafer splitting assembly are rotated around the X horizontal direction, and the adsorption blocks of the other wafer splitting assembly are rotated around the Y horizontal direction.

10. The semiconductor wafer splitting device according to claim 7, wherein: the semiconductor wafer splitting device is provided with a first wafer splitting station and a second wafer splitting station, the wafer splitting assembly rotated around the X horizontal direction is located at the first wafer splitting station, and the wafer splitting assembly rotated around the Y horizontal direction is located at the second wafer splitting station; the number of the adsorption blocks of the wafer splitting assembly of the second wafer splitting station is greater than the number of the adsorption blocks of the wafer splitting assembly of the first wafer splitting station.

Images