External wafer separation auxiliary mechanism

Abstract

The invention relates to an external wafer separation auxiliary mechanism which comprises an ultrasonic cleaning water tank, and an auxiliary mechanism is installed on one side of the ultrasonic cleaning water tank. The auxiliary mechanism comprises a rotating module and a lifting module matched with the rotating module. The rotating module sequentially comprises a first motor, a motor mounting plate, a second motor, a first adapter plate, a second adapter plate and a suction cup from top to bottom; the lifting module comprises a lifting module and a sliding plate driven by the lifting module to move in the vertical direction. According to the invention, the problems of long time and easy failure of wafer ultrasonic wave splitting are improved.

Description

Technical Field

[0001] The present invention relates to the technical field related to wafer processing, and in particular to an external wafer separation auxiliary mechanism. Background Art

[0002] With the rise of the semiconductor industry, the importance of chips has become well known. The chip manufacturing process is also in urgent need of improvement. Among them, thin wafers are separated from a whole crystal ingot. This process is generally divided into two process types: wire cutting and laser invisible cutting. Due to various reasons, the cut wafers cannot be completely separated from the crystal ingot after laser invisible cutting. The solution is generally to separate them by ultrasonic cracking and then external force. The existing ultrasonic cracking equipment generally fixes the wafer and puts it into an ultrasonic water tank. The vibrator arranged under the water tank generates vibration to drive the solution in the water tank to vibrate slightly, thereby achieving wafer separation.

[0003] At present, there are few ultrasonic assisted splitters on the market. They all use suction cups to absorb the ingot and sink it into the ultrasonic cleaning tank for vibration splitting; the suction cup is generally fixed by hand or hanging. Since the size and position of the adhesion area between the wafer and the ingot are not fixed after laser invisible cutting, the success rate of separation can be achieved by holding it for a few minutes when the adhesion is small. However, when the adhesion is larger and firmer, under the current conditions, the separation of some sheets requires continuous ultrasonic vibration for more than 20 minutes, and it is impractical to hold each sheet by hand. The efficiency of hanging fixation is also low.

[0004] At present, ultrasonic-assisted splitting machines are generally used directly with ready-made ultrasonic cleaning machines. The ultrasonic vibration plate or vibrator is placed under the water tank, and the ultrasonic generator is used to control the vibration of the vibrator, which is transmitted to the crystal ingot through the solution to achieve splitting. However, there are gaps in the distribution of the vibrators, and the minimum gap is more than 10mm. When pursuing efficiency, the product will be close to the bottom of the water tank. The wafer is too large, and the vibration is not uniform in some parts, which will lead to low efficiency or even failure of wafer separation.

[0005] In view of the above-mentioned defects, the designer has actively carried out research and innovation in order to create an external wafer separation auxiliary mechanism to make it more valuable for industrial use. Summary of the invention

[0006] In order to solve any of the above technical problems, the purpose of the present invention is to provide an external wafer separation auxiliary mechanism.

[0007] To achieve the above object, the present invention adopts the following technical solution:

[0008] An external wafer separation auxiliary mechanism includes an ultrasonic cleaning water tank, and an auxiliary mechanism is installed on one side of the ultrasonic cleaning water tank;

[0009] The auxiliary mechanism includes a rotating module and a lifting module adapted to the rotating module;

[0010] The rotating module includes, from top to bottom, a first motor, a motor mounting plate, a second motor, a first adapter plate, a second adapter plate and a suction cup;

[0011] The lifting module includes a lifting module and a slide plate driven by the lifting module to move in a vertical direction;

[0012] The first motor is mounted on a motor mounting plate, and the motor mounting plate is mounted on a skateboard via a plurality of support columns. The motor output shaft of the first motor is connected to a first adapter plate below via an eccentric rotating shaft. The second motor is mounted on the first adapter plate, and the motor output shaft of the second motor is connected to a second adapter plate below via a concentric rotating shaft. A suction cup is mounted at the bottom of the second adapter plate.

[0013] As a further improvement of the present invention, an upper motor shield is installed on the motor mounting plate outside the first motor, and a cover shell and an outer cover are installed on the first adapter plate outside the second motor.

[0014] As a further improvement of the present invention, the motor output shaft of the first motor is connected to the eccentric rotating shaft below through a coupling, a rotating bearing is installed in the first adapter plate, a bearing pressure plate is installed above the rotating bearing, the eccentric rotating shaft passes through the rotating bearing and then an electric slip ring is installed through a slip ring fixing block, and a shaft ring and a round nut are installed below the eccentric rotating shaft.

[0015] As a further improvement of the present invention, the motor output shaft of the second motor is connected to the concentric rotating shaft below through a coupling, a rotating bearing is installed in the bearing mounting plate below the first adapter plate, the bearing mounting plate is connected to the first adapter plate above through a number of support columns, a bearing pressure plate is installed above the rotating bearing, and the concentric rotating shaft passes through the rotating bearing and is installed with a shaft ring and a round nut and then connected to the second adapter plate below.

[0016] As a further improvement of the present invention, a hook is installed at the bottom of the second adapter plate, and the top of the suction cup is installed on the hook through a suction cup mounting block.

[0017] As a further improvement of the present invention, the lifting module includes a screw mounting plate, a slide plate and a bottom plate from top to bottom, and a lifting screw is installed on the screw mounting plate, and the lifting screw drives the slide plate to move in the vertical direction.

[0018] As a further improvement of the present invention, a handle is installed on the lifting screw at the top of the screw mounting plate through a screw support.

[0019] As a further improvement of the present invention, a guide rod and a guide rod with a hole are respectively installed on both sides between the screw rod mounting plate and the base plate, and the slide plate moves along the vertical direction on the guide rod and the guide rod with a hole through linear bearings.

[0020] As a further improvement of the present invention, a fixing ring with a handle is installed near the bottom of the guide rod and the guide rod with a hole.

[0021] As a further improvement of the present invention, a second rib plate and a first rib plate are installed at the bottom of the slide plate.

[0022] By means of the above scheme, the present invention has at least the following advantages:

[0023] The present invention improves the problem of long wafer ultrasonic splitting time and easy failure.

[0024] When the present invention only rotates, there will still be areas in the radial direction that the vibrator cannot cover. The self-rotation plus eccentric rotation scheme of this structure can achieve vibrator coverage of the entire width of the product. It has been verified that the ultrasonic cracking time of the wafer, which originally took more than 20 minutes, can be reduced to about 15 minutes on average after replacing this structure, and the cracking success rate is also significantly improved.

[0025] The structural cost of the present invention is very low, and the semi-automatic processing can also facilitate personnel to observe the splitting effect and cut off the power in time.

[0026] The present invention uses an electric slip ring to optimize the motor wiring and prevent the problems of winding and joint loosening during the rotation process.

[0027] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 It is a schematic diagram of an application scenario of the present invention;

[0030] Figure 2 It is a structural schematic diagram of an external wafer separation auxiliary mechanism of the present invention;

[0031] Figure 3 yes Figure 2 The structural diagram of the rotating module;

[0032] Figure 4 yes Figure 2 Schematic diagram of the structure of the lifting module.

[0033] The meanings of the various reference numerals in the figures are as follows.

[0034] 100. Ultrasonic cleaning water tank; 200. Auxiliary mechanism; 300. Rotating module; 400. Lifting module;

[0035] Eccentric rotating shaft 1; 2, upper motor shield; motor mounting plate 3; 4, rotating bearing; 5, first motor; 6, bearing pressure plate; 7, slip ring fixing block; 8, electric slip ring; 9, round nut; 10, cover; 11, shaft collar; 12, concentric rotating shaft; 13, product; 14, suction cup; 15, suction cup mounting block; 16, bearing mounting plate; 17, hook; 18, second adapter plate; 19, support column; coupling 20; 21, first adapter plate; 22, outer cover; 23, second motor; slide plate 24; 25, screw support; 26, screw mounting plate; 27, handle; 28, first rib; 29, linear bearing; 30, guide rod; 31, bottom plate; 32, guide rod with hole; 33, fixing ring with handle; 34, second rib; 35, lifting screw. DETAILED DESCRIPTION

[0036] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0037] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. Obviously, the described embodiment is only a part of the embodiment of the present invention, rather than all the embodiments. The components of the embodiment of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiment of the present invention provided in the drawings is not intended to limit the scope of the invention claimed for protection, but merely represents the selected embodiment of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present invention.

[0038] like Figure 1 to Figure 4 As shown, an external wafer separation auxiliary mechanism includes an ultrasonic cleaning water tank 100, and an auxiliary mechanism 200 is installed on one side of the ultrasonic cleaning water tank 100. The auxiliary mechanism 200 includes a rotating module 300 and a lifting module 400 adapted to the rotating module 300.

[0039] 1. The rotating module 300 includes, from top to bottom, a first motor 5, a motor mounting plate 3, a second motor 23, a first adapter plate 21, a second adapter plate 18 and a suction cup 14.

[0040] The first motor 5 is mounted on the motor mounting plate 3, and the motor mounting plate 3 is mounted on the skateboard 24 through a plurality of support columns 19. The motor output shaft of the first motor 5 is connected to the first adapter plate 21 below through an eccentric rotating shaft 1. The second motor 23 is mounted on the first adapter plate 21, and the motor output shaft of the second motor 23 is connected to the second adapter plate 18 below through a concentric rotating shaft 12. A suction cup 14 is installed at the bottom of the second adapter plate 18.

[0041] The motor output shaft of the first motor 5 is connected to the eccentric rotating shaft 1 below through a coupling 20. A rotating bearing 4 is installed in the first adapter plate 21. A bearing pressure plate 6 is installed above the rotating bearing 4. The eccentric rotating shaft 1 passes through the rotating bearing 4 and then an electric slip ring 8 is installed through a slip ring fixing block 7. A shaft collar 11 and a round nut 9 are installed below the eccentric rotating shaft 1.

[0042] The motor output shaft of the second motor 23 is connected to the concentric rotating shaft 12 below through a coupling 20. A rotating bearing 4 is installed in the bearing mounting plate 16 below the first adapter plate 21. The bearing mounting plate 16 is connected to the first adapter plate 21 above through a plurality of support columns 19. A bearing pressure plate 6 is installed above the rotating bearing 4. After the concentric rotating shaft 12 passes through the rotating bearing 4, a shaft ring 11 and a round nut 9 are installed and then connected to the second adapter plate 18 below.

[0043] A hook 17 is installed at the bottom of the second adapter plate 18 , and the top of the suction cup 14 is installed on the hook 17 through a suction cup mounting block 15 .

[0044] 2. The lifting module 400 includes a lifting module and a slide plate 24 driven by the lifting module to move in a vertical direction.

[0045] The lifting module includes a screw mounting plate 26, a slide plate 24 and a bottom plate 31 from top to bottom. A lifting screw 35 is installed on the screw mounting plate 26, and the lifting screw 35 drives the slide plate 24 to move in the vertical direction.

[0046] A handle 27 is mounted on the lifting screw 35 at the top of the screw mounting plate 26 through the screw support 25 .

[0047] A guide rod 30 and a guide rod with a hole 32 are respectively installed on both sides between the screw rod mounting plate 26 and the bottom plate 31, and the slide plate 24 moves along the vertical direction on the guide rod 30 and the guide rod with a hole 32 through a linear bearing 29. A fixing ring 33 with a handle is installed near the bottom of the guide rod 30 and the guide rod with a hole 32.

[0048] The second rib 34 and the first rib 28 are mounted on the bottom of the slide plate 24 .

[0049] An upper motor shield 2 is mounted on the motor mounting plate 3 outside the first motor 5 , and a cover 10 and an outer cover 22 are mounted on the first adapter plate 21 outside the second motor 23 .

[0050] The positional relationship and connection relationship between the components of the present invention are as follows:

[0051] Screw the first motor 5 onto the motor mounting plate 3, screw the two support columns 19 below the motor mounting plate 3, lock the motor output shaft with the coupling 20, insert the rotating bearing 4 on top, screw the bearing pressure plate 6 on the top of the bearing, and then insert the eccentric rotating shaft 1. Install the motor mounting plate 3 and the two support columns 19 onto the slide plate 24. At this time, use the coupling 20 to firmly connect the first motor 5 and the eccentric rotating shaft 1. Insert the collar 11 below the eccentric rotating shaft 1 and screw on the round nut 9. Lock the slip ring fixing block 7 on the electric slip ring 8, put it on the eccentric rotating shaft 1, and fix it on the eccentric rotating shaft 1 with M3 screws. Lock the second motor 23 to the first adapter plate 21, and then fix it to the lower end surface of the eccentric rotating shaft 1. Then fix another set of couplings 20, support columns 19, rotating bearings 4, round nuts 9, bearing pressure plates 6, second adapter plates 18 and concentric rotating shafts 12 in the same way. The first adapter plate 21 is locked under the concentric rotating shaft 12, and then the hook 17 is locked. The installation of the rotating module is completed.

[0052] Lock the first rib plate 28 and the second rib plate 34 onto the slide plate 24, then insert the screw nuts of the two linear bearings 29 and the lifting screw 35 into the slide plate 24 and lock them, and insert the guide rod 30 and the guide rod with holes 32 into the linear bearings respectively. The guide rod with holes 32 should pay attention to the insertion angle, and the vacant part with holes should avoid the balls inside the linear bearings. Then insert a fixed ring 33 with a handle above the guide rod on one side as the upper limit, and lock the end faces of the two guide shafts with the screw mounting plate 26, and then put on the screw support 25 and the handle 27 in turn and lock them. Insert a fixed ring 33 with a handle under each of the two guide shafts as the lower limit. The lower end face is then locked with the bottom plate 31. After the motor slip ring is connected, the motor shield 2, the cover 10 and the outer cover 22 are encapsulated. The suction cup 14 and the suction cup mounting block 15 are connected and fastened with nuts. After manually adsorbing the product, the suction cup mounting block 15 is clamped into the hook 17 for operation.

[0053] The working principle of the present invention is as follows: the lifting module drives the screw rod through the handle to control the lifting of the entire rotating module. The module only needs an upper limit (material taking position) and a lower limit (working position). The lower limit relies on a fixed block, and the upper limit is fixed by inserting an ordinary 7-type hexagonal wrench into the guide shaft with a hole. The rotating module uses two slow motors to control the self-rotation and eccentric rotation of the product. After the main switch is pressed, the first motor 5 (28W slow motor) drives the second motor 23 to eccentrically rotate through the eccentric rotating shaft 1. The second motor 23 (14W slow motor) is powered on through the electric slip ring 8 and drives the product to rotate through the concentric rotating shaft 12.

[0054] The working process of the present invention is as follows: the rotating module is moved to the upper limit position by the handle 27, and a hexagonal wrench is inserted into the guide rod 32 with a hole for limiting the position. The suction cup 14 and the suction cup mounting block 15 are fastened to form an integral hanging suction cup, and the thick part of the ingot with the thin wafer facing downward is manually adsorbed, and hung on the hook 17. The hexagonal wrench for limiting the position is pulled out, and the rotating module is manually cranked to the lower limit position. At this time, the product 13 sinks into the ultrasonic water tank, and the equipment is powered on to start rotating and splitting. After the splitting is completed, the power is turned off, and the rotating module is manually cranked to the upper limit position, and the limiting hexagonal wrench is inserted. The suction cup is manually removed to discharge the material. This is repeated.

[0055] Through a set of auxiliary rotating mechanism, it is ensured that the ingot is fully covered by the vibrator in the water tank. With the help of the up-and-down motion structure, semi-automatic ultrasonic assisted splitting is realized. The worker only needs to control the structure to rise to the material taking position or descend to the working position, and manually load and unload the material after the splitting is completed. No need to hold it continuously. Efficiency and success rate are improved.

[0056] The problem of long wafer ultrasonic splitting time and easy failure has been improved. When the present invention only rotates, there will still be areas in the radial direction that the vibrator cannot cover. The self-rotation plus eccentric rotation scheme of this structure can achieve vibrator coverage of the entire width of the product. It has been verified that the wafer ultrasonic splitting time that originally took more than 20 minutes has an average splitting time of about 15 minutes after replacing this structure, and the splitting success rate has also been significantly improved. The structural cost is very low, and semi-automatic processing can also facilitate personnel to observe the splitting effect and cut off the power in time. Use electric slip rings to optimize motor wiring. Prevent winding and loose joints during rotation.

[0057] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implying the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0058] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0059] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principles of the present invention, and these improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. An external wafer separation auxiliary mechanism, comprising an ultrasonic cleaning water tank (100), wherein an auxiliary mechanism (200) is installed on one side of the ultrasonic cleaning water tank (100); characterized in that: The auxiliary mechanism (200) comprises a rotating module (300) and a lifting module (400) adapted to the rotating module (300); The rotating module (300) comprises, from top to bottom, a first motor (5), a motor mounting plate (3), a second motor (23), a first adapter plate (21), a second adapter plate (18) and a suction cup (14); The lifting module (400) comprises a lifting module and a slide plate (24) driven by the lifting module to move in a vertical direction; The first motor (5) is mounted on a motor mounting plate (3), and the motor mounting plate (3) is mounted on a slide plate (24) via a plurality of support columns (19). The motor output shaft of the first motor (5) is connected to a first adapter plate (21) below via an eccentric rotating shaft (1), and the second motor (23) is mounted on the first adapter plate (21), and the motor output shaft of the second motor (23) is connected to a second adapter plate (18) below via a concentric rotating shaft (12), and a suction cup (14) is mounted at the bottom of the second adapter plate (18).

2. The external wafer separation auxiliary mechanism according to claim 1, characterized in that: An upper motor shield (2) is mounted on a motor mounting plate (3) outside the first motor (5), and a cover (10) and an outer cover (22) are mounted on a first adapter plate (21) outside the second motor (23).

3. The external wafer separation auxiliary mechanism according to claim 1, characterized in that: The motor output shaft of the first motor (5) is connected to the eccentric rotating shaft (1) below through a coupling (20); a rotating bearing (4) is installed in the first adapter plate (21); a bearing pressure plate (6) is installed above the rotating bearing (4); the eccentric rotating shaft (1) passes through the rotating bearing (4) and is then installed with an electric slip ring (8) through a slip ring fixing block (7); and a shaft ring (11) and a round nut (9) are installed below the eccentric rotating shaft (1).

4. The external wafer separation auxiliary mechanism according to claim 1, characterized in that: The motor output shaft of the second motor (23) is connected to the concentric rotating shaft (12) below through a coupling (20); a rotating bearing (4) is installed in the bearing mounting plate (16) below the first adapter plate (21); the bearing mounting plate (16) is connected to the first adapter plate (21) above through a plurality of support columns (19); a bearing pressure plate (6) is installed above the rotating bearing (4); the concentric rotating shaft (12) passes through the rotating bearing (4) and is then installed with a shaft ring (11) and a round nut (9) and connected to the second adapter plate (18) below.

5. The external wafer separation auxiliary mechanism according to claim 1, characterized in that: A hook (17) is installed at the bottom of the second adapter plate (18), and the top of the suction cup (14) is installed on the hook (17) via a suction cup mounting block (15).

6. The external wafer separation auxiliary mechanism according to claim 1, characterized in that: The lifting module comprises, from top to bottom, a screw rod mounting plate (26), a slide plate (24) and a bottom plate (31). A lifting screw rod (35) is mounted on the screw rod mounting plate (26), and the lifting screw rod (35) drives the slide plate (24) to move in a vertical direction.

7. The external wafer separation auxiliary mechanism according to claim 6, characterized in that: A handle (27) is installed on the lifting screw (35) at the top of the screw mounting plate (26) through the screw support (25).

8. The external wafer separation auxiliary mechanism according to claim 6, characterized in that: A guide rod (30) and a guide rod with a hole (32) are respectively installed on both sides between the screw rod installation plate (26) and the bottom plate (31), and the slide plate (24) moves along the vertical direction on the guide rod (30) and the guide rod with a hole (32) respectively through a linear bearing (29).

9. The external wafer separation auxiliary mechanism according to claim 8, characterized in that: A fixing ring (33) with a handle is installed on the guide rod (30) and the guide rod with a hole (32) at a position close to the bottom.

10. The external wafer separation auxiliary mechanism according to claim 6, characterized in that: A second rib plate (34) and a first rib plate (28) are installed at the bottom of the slide plate (24).

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