Semiconductor cleaning equipment

Abstract

The invention discloses semiconductor cleaning equipment and relates to the technical field of ultrasonic cleaning, the semiconductor cleaning equipment comprises an ultrasonic cleaning machine body and further comprises a fixing assembly, a placing groove is formed in the front side of the ultrasonic cleaning machine body, a cleaning agent is arranged in the ultrasonic cleaning machine body, and a square groove is formed in the right side of the ultrasonic cleaning machine body; a servo motor is fixedly mounted on the inner wall of the square groove, a lead screw is fixedly mounted at the output end of the servo motor, a bearing rod is fixedly mounted on the inner wall of the ultrasonic cleaning machine body, a bearing plate is slidably mounted on the circumferential surface of the bearing rod, and the bearing plate is limited by a bearing frame and cannot continuously move in the direction away from the matching frame; by limiting the clamping plate, surface deformation or stress concentration of the curved-surface semiconductor caused by non-uniform pressure can be avoided, so that the damage risk of the curved-surface semiconductor in the cleaning process is reduced, and the contact between the curved-surface semiconductor and the cleaning agent is more stable and uniform.

Description

Technical Field

[0001] The invention relates to the technical field of ultrasonic cleaning, in particular to semiconductor cleaning equipment. Background Art

[0002] Semiconductor cleaning equipment usually consists of an ultrasonic cleaning machine body, fixtures, protective components and control components, and some semiconductor cleaning equipment is specifically designed for cleaning standard semiconductors.

[0003] The patent with patent announcement number CN219292242U relates to a semiconductor ultrasonic cleaning equipment, including an ultrasonic cleaning machine main body and a cleaning chamber opened on the top of the ultrasonic cleaning machine main body, wherein a plurality of rack assemblies are placed in the cleaning chamber, wherein the rack assembly includes a U-shaped frame body and a movable clamp and a fixed clamp installed on the inner side of the U-shaped frame body, and a semiconductor silicon wafer is clamped between the movable clamp and the fixed clamp, and two cross bars are fixed on the inner side of the U-shaped frame body, and the rack assembly also includes a limiting structure and an adjusting structure; this patent improves the ultrasonic cleaning machine in the prior art, and correspondingly sets a limiting structure and an adjusting structure on the rack assembly. On the one hand, the limiting structure can be used to limit the movable clamp after the operator moves it sideways, so as to facilitate the placement and removal of the semiconductor silicon wafer; on the other hand, the position of the fixed clamp can be adaptively adjusted according to different usage requirements, which effectively improves the overall convenience and flexibility of the ultrasonic cleaning machine.

[0004] In the above patent, after the operator moves the movable clamp to the side, the movable clamp can be limited by the limiting structure to facilitate the placement and removal of semiconductor silicon wafers. On the other hand, the position of the fixed clamp can be adaptively adjusted according to different usage requirements, which effectively improves the overall convenience and flexibility of the ultrasonic cleaning machine. However, it is difficult to control the clamping force of the curved semiconductor. If the clamping force of the curved semiconductor is too large, it will cause uneven contact between the surface of the curved semiconductor and the cleaning agent, thereby affecting the effect of ultrasonic cleaning. Summary of the invention

[0005] In view of the deficiencies of the prior art, the present invention provides a semiconductor cleaning device that solves the problems raised in the above-mentioned background technology.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a semiconductor cleaning equipment, including an ultrasonic cleaning machine body and a fixing component, a placement groove is provided on the front side of the ultrasonic cleaning machine body, a cleaning agent is arranged inside the ultrasonic cleaning machine body, a square groove is provided on the right side of the ultrasonic cleaning machine body, a servo motor is fixedly installed on the inner wall of the square groove, a screw is fixedly installed on the output end of the servo motor, a load-bearing rod is fixedly installed on the inner wall of the ultrasonic cleaning machine body, a load-bearing plate is slidably installed on the circumferential surface of the load-bearing rod, a load-bearing frame is fixedly installed on the circumferential surface of the load-bearing rod, a clamping plate is slidably installed on the circumferential surface of the load-bearing rod, the clamping plate is threadedly connected to the screw, a connecting plate is fixedly installed on the inner wall of the ultrasonic cleaning machine body, a connecting rod is slidably penetrated on the upper and lower walls of the connecting plate, a limiting plate is fixedly installed on the bottom of the connecting rod, a limiting groove is provided on the bottom of the limiting plate, and the load-bearing plate cannot continue to move in the direction away from the matching frame due to the limitation of the load-bearing frame.

[0007] According to the above technical solution, a No. 1 spring is arranged between the load-bearing frame and the load-bearing plate, and the No. 1 spring can drive the load-bearing plate to reset. A control panel is fixedly installed on the inner wall of the placement groove, and the control panel is electrically connected to the ultrasonic cleaning machine body. The clamping plate moves toward the matching frame so that the load-bearing plate shakes to the right and resets under the elastic force of the No. 1 spring.

[0008] According to the above technical solution, a No. 2 spring is arranged between the connecting plate and the limit plate, and the No. 2 spring can drive the limit plate to reset. A button is fixedly installed on the right side of the ultrasonic cleaning machine body, and the button is electrically connected to the ultrasonic cleaning machine body.

[0009] According to the above technical scheme, a proportioning component for maintaining the concentration of the cleaning agent is arranged inside the ultrasonic cleaning machine body, a protective component is arranged on the right side of the ultrasonic cleaning machine body, the proportioning component includes a proportioning frame, a T-shaped rod, a proportioning rod, a dosing frame, a dosing hole, a T-shaped plate and a dosing pipe, the concentrated cleaning agent inside the dosing pipe enters the ultrasonic cleaning machine body through the dosing pipe, the proportioning frame is fixedly mounted on the inner wall of the ultrasonic cleaning machine body, the T-shaped rod is fixedly mounted on the inner wall of the proportioning frame, the proportioning rod is slidably mounted on the circumferential surface of the T-shaped rod, the dosing frame is fixedly mounted on the bottom of the inner wall of the proportioning frame, the dosing hole is opened on the circumferential surface of the dosing frame, the T-shaped plate is slidably mounted on the inner wall of the dosing frame, the dosing pipe is fixedly mounted on the bottom of the dosing frame, and the proportioning frame is provided with concentrated cleaning agent.

[0010] According to the above technical solution, the proportioning rod passes through the inner and outer walls of the proportioning frame, a sealing plate is fixedly installed on the right side of the proportioning rod, a sealing hole is opened on the top of the sealing plate, a cross rubber valve is arranged inside the dosing pipe, and the sealing plate moves to the right side so that the sealing hole is aligned with the dosing pipe.

[0011] According to the above technical solution, a No. 3 spring is arranged between the T-shaped rod and the proportioning rod, and the No. 3 spring can drive the proportioning rod to reset. A No. 4 spring is arranged between the dosing frame and the T-shaped plate, and the No. 4 spring can drive the T-shaped plate to reset. The top of the T-shaped plate is set as an inclined surface, the proportioning rod is in contact with the clamping plate, and the proportioning rod is in contact with the T-shaped plate.

[0012] According to the above technical solution, the protective assembly includes a protective tube, a protective plate, a protective rod, a protective tube, a reset spring and a protective hole. The protective tube moves forward to contact and block the button. The protective tube is fixedly passed through the inner and outer walls of the ultrasonic cleaning machine body. The protective plate is slidably installed on the inner wall of the protective tube. The protective rod is fixedly installed on the left side of the protective plate. The protective tube is slidably installed on the inner wall of the protective tube. The reset spring is arranged between the protective tubes, and the protective hole is opened on the circumferential surface of the protective tube.

[0013] According to the above technical solution, a No. 1 sealing ring is arranged between the protection tube and the protection plate, and the sealing performance of the protection tube can be improved by the No. 1 sealing ring; a No. 2 sealing ring is arranged between the protection tube and the protection tube, and the sealing performance of the protection tube can be improved by the No. 2 sealing ring; the protection rod is in contact with the sealing plate; a No. 3 sealing ring is arranged between the screw rod and the ultrasonic cleaning machine body, and the sealing performance of the ultrasonic cleaning machine body can be improved by the No. 3 sealing ring.

[0014] The present invention provides a semiconductor cleaning device having the following beneficial effects: (1) The semiconductor cleaning equipment, through the clamping plate being limited by the limit plate and unable to move further away from the proportioning frame, can avoid deformation or stress concentration of the curved semiconductor surface caused by uneven pressure by limiting the clamping plate, thereby reducing the risk of damage to the curved semiconductor during the cleaning process, and ensuring that the contact between the curved semiconductor and the cleaning agent is more stable and uniform, thereby improving the accuracy and consistency of the cleaning process. (2) The semiconductor cleaning equipment, through the clamping plate moving toward the proportioning frame, makes the load-bearing plate shake and reset to the right under the elastic force of the first spring, and the slight shaking of the load-bearing plate helps to shake off the contaminants from the inside of the load-bearing plate, avoiding the contaminants from causing secondary contamination to the curved semiconductor, thereby making the cleaning effect of the curved semiconductor more efficient. (3) The semiconductor cleaning equipment, the quantitative concentrated cleaning agent in the dosing pipe enters the ultrasonic cleaning machine body through the dosing pipe, and the concentrated cleaning agent is quantitatively added through the dosing pipe, so that the concentration of the cleaning agent can be accurately controlled, thereby ensuring that the cleaning agent is always kept within the optimal cleaning effect range, thereby avoiding the influence of too high or too low concentration on the cleaning effect. (4) The semiconductor cleaning equipment, after the sealing hole is aligned with the dosing tube, the sealing plate removes the shielding of the bottom of the dosing tube. If the detergent inside the ultrasonic cleaning machine body fluctuates too much and directly impacts the dosing tube, it will cause the detergent inside the ultrasonic cleaning machine body to flow in the opposite direction. By shielding the dosing tube, cross-contamination of the concentrated detergent can be effectively avoided, ensuring the purity and effectiveness of the concentrated detergent. (5) The semiconductor cleaning equipment, by moving the protective tube to the front side to contact and shield the button, can prevent the ultrasonic cleaning machine body from accidentally restarting, thereby reducing the risk of accidental injury during operation and ensuring the safety of operators and curved semiconductors. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the position structure of the servo motor and the lead screw of the present invention; Figure 3 For the present invention Figure 2 A schematic diagram of the structure enlargement of part A; Figure 4 It is a schematic diagram of the half-section structure of the ultrasonic cleaning machine body of the present invention; Figure 5 It is a schematic diagram of a half-section structure of a matching frame of the present invention; Figure 6 This is a schematic diagram of a half-section structure of a protection tube of the present invention; Figure 7 It is a schematic diagram of a half-section structure of the injection frame of the present invention.

[0016] In the figure: 1. ultrasonic cleaning machine body; 2. placement slot; 3. control panel; 4. square slot; 5. servo motor; 6. screw; 7. load-bearing rod; 8. load-bearing plate; 9. load-bearing frame; 10. clamping plate; 11. connecting plate; 12. connecting rod; 13. limit plate; 14. limit slot; 151. proportioning frame; 152. T-shaped rod; 153. proportioning rod; 154. dosing frame; 155. dosing hole; 156. T-shaped plate; 157. dosing pipe; 158. sealing plate; 159. sealing hole; 161. protective tube; 162. protective plate; 163. protective rod; 164. protective tube; 165. reset spring; 166. protective hole; 167. button. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] See also Figure 1-Figure 6 One embodiment of the present invention is: a semiconductor cleaning device, including an ultrasonic cleaning machine body 1, and also including a fixing component, a placement groove 2 is opened on the front side of the ultrasonic cleaning machine body 1, a cleaning agent is arranged inside the ultrasonic cleaning machine body 1, a square groove 4 is opened on the right side of the ultrasonic cleaning machine body 1, a servo motor 5 is fixedly installed on the inner wall of the square groove 4, a screw rod 6 is fixedly installed on the output end of the servo motor 5, a load-bearing rod 7 is fixedly installed on the inner wall of the ultrasonic cleaning machine body 1, a load-bearing plate 8 is slidably installed on the circumferential surface of the load-bearing rod 7, a load-bearing frame 9 is fixedly installed on the circumferential surface of the load-bearing rod 7, and the circumferential surface of the load-bearing rod 7 slides A clamping plate 10 is installed, and the clamping plate 10 is threadedly connected to the screw rod 6. A connecting plate 11 is fixedly installed on the inner wall of the ultrasonic cleaning machine body 1. A connecting rod 12 slides through the upper and lower walls of the connecting plate 11. A limiting plate 13 is fixedly installed on the bottom of the connecting rod 12. A limiting groove 14 is provided at the bottom of the limiting plate 13. By limiting the clamping plate 10, surface deformation or stress concentration of the curved semiconductor caused by uneven pressure can be avoided, thereby reducing the risk of damage to the curved semiconductor during the cleaning process, and ensuring that the contact between the curved semiconductor and the cleaning agent is more stable and uniform, thereby improving the accuracy and consistency of the cleaning process.

[0019] A No. 1 spring is arranged between the load-bearing frame 9 and the load-bearing plate 8, and the No. 1 spring can drive the load-bearing plate 8 to reset. A control panel 3 is fixedly installed on the inner wall of the placement slot 2, and the control panel 3 is electrically connected to the ultrasonic cleaning machine body 1. The clamping plate 10 moves toward the direction close to the matching frame 151 so that the load-bearing plate 8 is shaken and reset to the right side under the elastic force of the No. 1 spring. The slight shaking of the load-bearing plate 8 helps to shake off the contaminants from the inside of the load-bearing plate 8, thereby avoiding secondary contamination of the curved semiconductor by the contaminants, thereby making the curved semiconductor cleaning effect more efficient.

[0020] A second spring is provided between the connecting plate 11 and the limiting plate 13 , and the second spring can drive the limiting plate 13 to reset. A button 167 is fixedly installed on the right side of the ultrasonic cleaning machine body 1 , and the button 167 is electrically connected to the ultrasonic cleaning machine body 1 .

[0021] When the present embodiment is working, the curved surface semiconductor to be cleaned is placed between the load-bearing plate 8 and the clamping plate 10 and immersed in the cleaning agent. At the same time, the servo motor 5 drives the screw rod 6 to rotate, and the screw rod 6 rotates to drive the clamping plate 10 to move away from the matching frame 151. The clamping plate 10 moves away from the matching frame 151 and contacts the curved surface semiconductor to be cleaned and squeezes the curved surface semiconductor. The curved surface semiconductor is squeezed by the clamping plate 10 and moves away from the matching frame 151. The semiconductor moves in the direction away from the matching frame 151 and contacts the load-bearing plate 8 and squeezes the load-bearing plate 8. The load-bearing plate 8 is squeezed by the curved semiconductor and moves in the direction away from the matching frame 151. The load-bearing plate 8 moves in the direction away from the matching frame 151 and squeezes the No. 1 spring. The No. 1 spring is squeezed by the load-bearing plate 8 and deforms and accumulates force. At the same time, the load-bearing plate 8 moves in the direction away from the matching frame 151 and contacts the load-bearing frame 9 and is limited by the load-bearing frame 9. The load-bearing plate 8 is limited by the load-bearing frame 9 and cannot continue to move. The load-bearing plate 8 cannot continue to move in the direction away from the matching frame 151 to cooperate with the clamping plate 10 to clamp the curved semiconductor. At the same time, the clamping plate 10 moves in the direction away from the matching frame 151 to align itself with the limit groove 14. After the clamping plate 10 is aligned with the limit groove 14, the limit plate 13 moves downward under the elastic force of the second spring. The limit plate 13 moves downward so that the limit groove 14 contacts the clamping plate 10 and limits the limit plate 13. 10 is limited by the limit plate 13 and cannot continue to move away from the matching frame 151. At the same time, the button 167 is pressed to start the ultrasonic cleaning machine body 1 to clean the curved semiconductor. After the cleaning operation is completed, the servo motor 5 drives the screw rod 6 to rotate in the opposite direction. The screw rod 6 rotates in the opposite direction to drive the clamping plate 10 to move toward the matching frame 151. The clamping plate 10 moves toward the matching frame 151, so that the load-bearing plate 8 shakes to the right and resets under the elastic force of spring No. 1.

[0022] See also Figure 1-Figure 7 On the basis of the above embodiment, in another embodiment of the present invention, a proportioning component for maintaining the concentration of the cleaning agent is arranged inside the ultrasonic cleaning machine body 1, a protective component is arranged on the right side of the ultrasonic cleaning machine body 1, and the proportioning component includes a proportioning frame 151, a T-shaped rod 152, a proportioning rod 153, a dosing frame 154, a dosing hole 155, a T-shaped plate 156 and a dosing pipe 157, the proportioning frame 151 is fixedly mounted on the inner wall of the ultrasonic cleaning machine body 1, the T-shaped rod 152 is fixedly mounted on the inner wall of the proportioning frame 151, and the proportioning rod 153 is slidably mounted on the inner wall of the ultrasonic cleaning machine body 1 The circumferential surface of the T-shaped rod 152, the dosing frame 154 is fixedly installed at the bottom of the inner wall of the proportioning frame 151, the dosing hole 155 is opened on the circumferential surface of the dosing frame 154, the T-shaped plate 156 is slidably installed on the inner wall of the dosing frame 154, and the dosing pipe 157 is fixedly installed at the bottom of the dosing frame 154. Concentrated cleaning agent is arranged inside the proportioning frame 151. The concentrated cleaning agent is quantitatively added through the dosing pipe 157, and the concentration of the cleaning agent can be accurately controlled, thereby ensuring that the cleaning agent is always kept within the optimal cleaning effect range, thereby avoiding excessively high or low concentration affecting the cleaning effect.

[0023] The proportioning rod 153 passes through the inner and outer walls of the proportioning frame 151. A sealing plate 158 is fixedly installed on the right side of the proportioning rod 153. A sealing hole 159 is opened on the top of the sealing plate 158. A cross rubber valve is arranged inside the dosing pipe 157. The sealing plate 158 moves to the right so that the sealing hole 159 is aligned with the dosing pipe 157. By blocking the dosing pipe 157, cross contamination of the concentrated cleaning agent can be effectively avoided, thereby ensuring the purity and effectiveness of the concentrated cleaning agent.

[0024] A No. 3 spring is arranged between the T-shaped rod 152 and the proportioning rod 153, and the No. 3 spring can drive the proportioning rod 153 to reset. A No. 4 spring is arranged between the dosing frame 154 and the T-shaped plate 156, and the No. 4 spring can drive the T-shaped plate 156 to reset. The top of the T-shaped plate 156 is set as an inclined surface, the proportioning rod 153 is in contact with the clamping plate 10, the proportioning rod 153 is in contact with the T-shaped plate 156, and the concentrated cleaning agent inside the proportioning frame 151 enters the inside of the dosing frame 154 through the dosing hole 155.

[0025] The protection component includes a protection tube 161, a protection plate 162, a protection rod 163, a protection tube 164, a reset spring 165 and a protection hole 166. The protection tube 161 is fixedly passed through the inner and outer walls of the ultrasonic cleaning machine body 1, the protection plate 162 is slidably installed on the inner wall of the protection tube 161, the protection rod 163 is fixedly installed on the left side of the protection plate 162, the protection tube 164 is slidably installed on the inner wall of the protection tube 161, the reset spring 165 is arranged between the protection tube 161 and the protection tube 164, and the protection hole 166 is opened on the circumferential surface of the protection tube 164. The shielding button 167 can prevent the ultrasonic cleaning machine body 1 from accidentally restarting, thereby reducing the risk of accidental injury during operation and ensuring the safety of operators and curved semiconductors.

[0026] A No. 1 sealing ring is arranged between the protection tube 161 and the protection plate 162, and the sealing performance of the protection tube 161 can be improved by the No. 1 sealing ring. A No. 2 sealing ring is arranged between the protection tube 161 and the protection tube 164, and the sealing performance of the protection tube 161 can be improved by the No. 2 sealing ring. The protection rod 163 is in contact with the sealing plate 158. A No. 3 sealing ring is arranged between the screw rod 6 and the ultrasonic cleaning machine body 1, and the sealing performance of the ultrasonic cleaning machine body 1 can be improved by the No. 3 sealing ring.

[0027] When this embodiment is working: the clamping plate 10 moves toward the direction close to the proportioning frame 151, contacts the proportioning rod 153 and squeezes the proportioning rod 153. The proportioning rod 153 is squeezed by the clamping plate 10 and moves to the right. The proportioning rod 153 moves to the right to pull the No. 3 spring. The No. 3 spring is pulled by the proportioning rod 153 and deforms and accumulates force. At the same time, the proportioning rod 153 moves to the right and contacts the inclined surface of the T-shaped plate 156 and squeezes the T-shaped plate 156. The T-shaped plate 156 is squeezed by the proportioning rod 153 and moves downward. The T-shaped plate 156 moves downward to squeeze the No. 4 spring. The No. 4 spring is squeezed by the T-shaped plate 156 and deforms and accumulates force. At the same time, the T-shaped plate 156 moves downward to seal and squeeze the quantitative concentrated cleaning agent at the bottom of the dosing frame 154. The quantitative concentrated cleaning agent at the bottom of the dosing frame 154 is squeezed by the T-shaped plate 156. The plate 156 is squeezed into the dosing pipe 157, and the concentrated cleaning agent entering the dosing pipe 157 squeezes the cross rubber valve. The cross rubber valve is deformed by the squeeze of the concentrated cleaning agent and releases the seal on the dosing pipe 157. At the same time, the proportioning rod 153 moves to the right to drive the sealing plate 158 to move to the right. The sealing plate 158 moves to the right to align the sealing hole 159 with the dosing pipe 157. After the sealing hole 159 is aligned with the dosing pipe 157, the sealing plate 158 releases the obstruction to the bottom of the dosing pipe 157. After the obstruction of the bottom of the dosing pipe 157 is released, the concentrated cleaning agent in the dosing pipe 157 enters the ultrasonic cleaning machine body 1 through the dosing pipe 157. The concentrated cleaning agent entering the ultrasonic cleaning machine body 1 is mixed with the cleaning agent inside the ultrasonic cleaning machine body 1, thereby ensuring the stability of the cleaning agent concentration.

[0028] The proportioning rod 153 moves to the right, driving the sealing plate 158 to move to the right. The sealing plate 158 moves to the right and breaks away from the contact with the protection rod 163. After the protection rod 163 breaks away from the contact with the sealing plate 158, the protection tube 164 moves forward under the elastic force of the reset spring 165. The protection tube 164 moves forward to contact and block the button 167. When the proportioning rod 153 moves to the left under the elastic force of the No. 3 spring, the proportioning rod 153 moves to the left, driving the sealing plate 158 to move to the left. The sealing plate 158 moves to the left and contacts the protection rod 163 and squeezes the protection rod 163. 63 is squeezed to the left by the sealing plate 158, and the protection rod 163 moves to the left to drive the protection plate 162 to move to the left. The protection plate 162 moves to the left to suck the liquid inside the protection tube 161. The liquid inside the protection tube 161 is sucked to the left by the protection plate 162. The liquid inside the protection tube 161 moves to the left, so that the protection tube 164 moves backward under the action of the negative pressure inside the protection tube 161. The protection tube 164 moves backward to squeeze the No. 4 spring. The No. 4 spring is squeezed by the protection tube 164 to produce deformation and accumulate force. At the same time, the protection tube 164 moves backward to release the obstruction of the button 167.

[0029] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor cleaning device, comprising an ultrasonic cleaning machine body (1), characterized in that: It also includes a fixing assembly, wherein a placement groove (2) is provided on the front side of the ultrasonic cleaning machine body (1), a cleaning agent is arranged inside the ultrasonic cleaning machine body (1), a square groove (4) is provided on the right side of the ultrasonic cleaning machine body (1), a servo motor (5) is fixedly mounted on the inner wall of the square groove (4), a screw rod (6) is fixedly mounted on the output end of the servo motor (5), a load-bearing rod (7) is fixedly mounted on the inner wall of the ultrasonic cleaning machine body (1), a load-bearing plate (8) is slidably mounted on the circumferential surface of the load-bearing rod (7), and a load-bearing frame (9) is fixedly mounted on the circumferential surface of the load-bearing rod (7), A clamping plate (10) is slidably mounted on the circumferential surface of the load-bearing rod (7), and the clamping plate (10) is threadedly connected to the screw rod (6). A connecting plate (11) is fixedly mounted on the inner wall of the ultrasonic cleaning machine body (1), and a connecting rod (12) is slidably penetrated through the upper and lower walls of the connecting plate (11). A proportioning component for maintaining the concentration of a cleaning agent is arranged inside the ultrasonic cleaning machine body (1), and a protective component is arranged on the right side of the ultrasonic cleaning machine body (1). A limiting plate (13) is fixedly mounted on the bottom of the connecting rod (12), and a limiting groove (14) is provided at the bottom of the limiting plate (13).

2. A semiconductor cleaning device according to claim 1, characterized in that: A No. 1 spring is provided between the load-bearing frame (9) and the load-bearing plate (8), and a control panel (3) is fixedly mounted on the inner wall of the placement slot (2), and the control panel (3) is electrically connected to the ultrasonic cleaning machine body (1).

3. A semiconductor cleaning device according to claim 2, characterized in that: A No. 2 spring is provided between the connection plate (11) and the limit plate (13), and a button (167) is fixedly installed on the right side of the ultrasonic cleaning machine body (1), and the button (167) is electrically connected to the ultrasonic cleaning machine body (1).

4. A semiconductor cleaning device according to claim 3, characterized in that: The proportioning assembly comprises a proportioning frame (151), a T-shaped rod (152), a proportioning rod (153), a dosing frame (154), a dosing hole (155), a T-shaped plate (156) and a dosing pipe (157); the proportioning frame (151) is fixedly mounted on the inner wall of the ultrasonic cleaning machine body (1); the T-shaped rod (152) is fixedly mounted on the inner wall of the proportioning frame (151); the proportioning rod (153) is slidably mounted on the circumferential surface of the T-shaped rod (152); the dosing frame (154) is fixedly mounted on the bottom of the inner wall of the proportioning frame (151); the dosing hole (155) is provided on the circumferential surface of the dosing frame (154); the T-shaped plate (156) is slidably mounted on the inner wall of the dosing frame (154); the dosing pipe (157) is fixedly mounted on the bottom of the dosing frame (154); and a concentrated cleaning agent is arranged inside the proportioning frame (151).

5. A semiconductor cleaning device according to claim 4, characterized in that: The proportioning rod (153) passes through the inner and outer walls of the proportioning frame (151); a sealing plate (158) is fixedly mounted on the right side of the proportioning rod (153); a sealing hole (159) is provided on the top of the sealing plate (158); and a cross rubber valve is provided inside the dosing pipe (157).

6. A semiconductor cleaning device according to claim 5, characterized in that: A No. 3 spring is provided between the T-shaped rod (152) and the proportioning rod (153), a No. 4 spring is provided between the dosing frame (154) and the T-shaped plate (156), the top of the T-shaped plate (156) is provided as an inclined surface, the proportioning rod (153) is in contact with the clamping plate (10), and the proportioning rod (153) is in contact with the T-shaped plate (156).

7. A semiconductor cleaning device according to claim 6, characterized in that: The protection assembly comprises a protection tube (161), a protection plate (162), a protection rod (163), a protection tube (164), a reset spring (165) and a protection hole (166); the protection tube (161) is fixedly passed through the inner and outer walls of the ultrasonic cleaning machine body (1); the protection plate (162) is slidably mounted on the inner wall of the protection tube (161); the protection rod (163) is fixedly mounted on the left side of the protection plate (162); the protection tube (164) is slidably mounted on the inner wall of the protection tube (161); the reset spring (165) is arranged between the protection tube (161) and the protection tube (164); and the protection hole (166) is opened on the circumferential surface of the protection tube (164).

8. A semiconductor cleaning device according to claim 7, characterized in that: A first sealing ring is provided between the protection tube (161) and the protection plate (162), a second sealing ring is provided between the protection tube (161) and the protection tube (164), the protection rod (163) is in contact with the sealing plate (158), and a third sealing ring is provided between the screw rod (6) and the ultrasonic cleaning machine body (1).

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