MEMS microphone and electronic equipment

Abstract

The invention provides an MEMS microphone and electronic equipment. The MEMS microphone comprises a telescopic substrate and a spliced shell arranged on the telescopic substrate, the splicing shell comprises an inner shell fixedly arranged on one side of the telescopic base plate and an outer shell fixedly arranged on the other side of the telescopic base plate. A partial overlapping area is formed between the outer shell and the inner shell, and the overlapping areas of the outer shell and the inner shell are in sliding connection; and the splicing shell is matched with the telescopic substrate for adjusting the size of the MEMS microphone. According to the invention, the size of the microphone can be flexibly adjusted according to user requirements, the application range of the microphone is widened, and different requirements of users on the microphone are met.

Description

Technical Field

[0001] The present invention relates to the technical field of product plastic packaging, and more specifically, to a MEMS microphone and an electronic device manufactured by using the process. Background Art

[0002] With the progress of society and the development of technology, in recent years, the size of electronic products such as mobile phones and laptops has been continuously reduced, and people have higher and higher performance requirements for these portable electronic products, which also requires the size of the electronic parts that match them to be continuously reduced, and the performance and consistency to be continuously improved. MEMS microphones integrated by MEMS (Micro-Electro-Mechanical-System, MEMS for short) technology have begun to be applied in large quantities to electronic products such as mobile phones, laptops, and wearable devices. Their packaging volume is smaller than that of traditional electret microphones, so they are favored by most microphone manufacturers.

[0003] At present, in the whole machine application process of the client, the requirements for the size and opening position of the MEMS microphone are different for different application scenarios. Since the openings and sizes of conventional microphones are fixed, it is necessary to manufacture multiple types of microphones to meet the requirements of different application scenarios. The application scope of the microphone is limited and cannot flexibly meet user needs. Summary of the invention

[0004] In view of the above problems, the purpose of the present invention is to provide a MEMS microphone and an electronic device to solve the problems of high cost of mold preparation process for existing special-shaped plastic packaging bodies, easy to cause mold flow imbalance, resulting in holes inside the packaged product, affecting product reliability, etc.

[0005] The MEMS microphone provided by the present invention comprises a telescopic substrate and a spliced ​​outer shell arranged on the telescopic substrate; wherein the spliced ​​outer shell comprises an inner shell fixedly arranged on one side of the telescopic substrate, and an outer shell fixedly arranged on the other side of the telescopic substrate; a partial overlapping area is provided between the outer shell and the inner shell, and the overlapping area of ​​the outer shell and the inner shell is slidably connected; the spliced ​​outer shell cooperates with the telescopic substrate to adjust the size of the MEMS microphone.

[0006] In addition, an optional technical solution is that the telescopic substrate includes a substrate body and an elastic band arranged in the substrate body; wherein the elastic band runs through the longitudinal axis or transverse axis direction of the substrate body; and the relative sliding direction between the outer shell and the inner shell is perpendicular to the setting direction of the elastic band.

[0007] In addition, an optional technical solution is that the elastic band includes retractable inert conductive metal strips, and the number of the inert conductive metal strips corresponds to the number of PCB layers of the retractable machine board.

[0008] In addition, an optional technical solution is that a buckle and a sliding button are provided on the outer shell, and a slot adapted to the buckle is provided on the inner shell, and the buckle is limited to move in the slot; wherein the sliding button is used to press and adjust the size of the spliced ​​outer shell by adjusting the position of the buckle in the slot.

[0009] In addition, an optional technical solution is to provide a through hole on the spliced ​​shell; wherein a spring baffle is provided on the inner wall of the spliced ​​shell; when the spring baffle is opened, the internal cavity of the spliced ​​shell is connected to the outside through the through hole, and when the spring baffle is closed, the through hole is closed.

[0010] In addition, an optional technical solution is that the spring baffle includes a vertical rod fixed on the spliced ​​outer shell, a baffle hinged to one end of the vertical rod, and an elastic member connecting the other end of the vertical rod and the baffle; the elastic member is used to drive the baffle to flip away from or close to the opening side under the action of external force and lock the position.

[0011] In addition, an optional technical solution is to provide a sound hole that penetrates the telescopic substrate on the telescopic substrate, and to embed a push-pull baffle located on one side of the sound hole in the telescopic substrate; the push-pull baffle is adjusted in position in the telescopic substrate to adjust the opening size of the sound hole.

[0012] In addition, an optional technical solution is to provide a slide rail on the upper side and / or lower side of the push-pull baffle, and to provide a slide groove matched with the slide rail in the retractable base plate, so that the slide rail is limited to move in the slide groove.

[0013] In addition, an optional technical solution is to further include a MEMS chip and an ASIC chip arranged on the telescopic substrate; wherein the ASIC chip is connected and conductive to the telescopic substrate, and the MEMS chip is connected and conductive to the ASIC chip.

[0014] On the other hand, the present invention further provides an electronic device, comprising the above-mentioned MEMS microphone.

[0015] By utilizing the above-mentioned MEMS microphone and electronic device, a size-adjustable telescopic substrate and a size-adjustable spliced ​​shell are provided. The spliced ​​shell includes an inner shell and an outer shell whose relative positions are adjustable. There is an overlapping area of ​​partial sliding connection between the outer shell and the inner shell. Therefore, the overall size of the MEMS microphone can be adjusted by adjusting the size of the spliced ​​shell and the telescopic substrate to meet the requirements of different application scenarios, thereby improving the flexibility and applicability of the microphone.

[0016] In order to achieve the above and related purposes, one or more aspects of the present invention include the features that will be described in detail later. The following description and the accompanying drawings describe some exemplary aspects of the present invention in detail. However, these aspects indicate only some of the various ways in which the principles of the present invention can be used. In addition, the present invention is intended to include all these aspects and their equivalents. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] By referring to the following description in conjunction with the accompanying drawings, and with a more comprehensive understanding of the present invention, other objects and results of the present invention will become more apparent and easy to understand. In the accompanying drawings:

[0018] Figure 1 is an exploded view of a MEMS microphone according to an embodiment of the present invention;

[0019] Figure 2 A schematic diagram of a bottom-type structure of a MEMS microphone according to an embodiment of the present invention;

[0020] Figure 3 FIG. 4 is a schematic diagram of a top-type structure of a MEMS microphone according to an embodiment of the present invention.

[0021] Markings in the accompanying drawings: inner shell 11, outer shell 12, spring baffle 2, through hole 3, ASIC chip 4, sliding button 5, MEMS chip 6, telescopic substrate 7, push-pull baffle 8, sound hole 81, elastic band 9.

[0022] The same reference numerals throughout the drawings indicate similar or corresponding features or functions. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] In the following description, for the purpose of illustration, in order to provide a comprehensive understanding of one or more embodiments, many specific details are set forth. However, it is apparent that these embodiments may also be implemented without these specific details. In other examples, for ease of describing one or more embodiments, known structures and devices are shown in the form of block diagrams.

[0025] In the description of the present invention, it is to be understood that the orientations or positional relationships indicated by the following terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc. are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the content or structure of the present invention.

[0026] In order to solve the problem that the openings and sizes of existing microphones are fixed, and therefore cannot meet the requirements of different application scenarios, resulting in a limited application scope of the microphone, etc., the present invention provides a MEMS microphone and an electronic device, wherein a common substrate is set as a telescopic substrate with adjustable size, and a shell is set as a spliced ​​shell with adjustable size, and the spliced ​​shell includes an inner shell and an outer shell with adjustable relative positions, and there is an overlapping area of ​​partial sliding connection between the outer shell and the inner shell, so that the size of the spliced ​​shell can be adjusted through the relative movement of the outer shell and the inner shell, so that the overall size of the MEMS microphone can be adjusted through the corresponding adjustment of the spliced ​​shell and the telescopic substrate, so that it can meet the requirements of different application scenarios and improve the flexibility and application scope of the microphone.

[0027] To describe the structure of the MEMS microphone and the electronic device of the present invention in detail, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0028] Figure 1 shows an exploded schematic structure of a MEMS microphone according to an embodiment of the present invention; Figure 2 and Figure 3 The schematic cross-sectional structures of the bottom type and the top type of the MEMS microphone according to the embodiment of the present invention are respectively shown.

[0029] like Figures 1 to 3 As shown together, the MEMS microphone of an embodiment of the present invention includes a telescopic substrate 7 and a spliced ​​outer shell 12 arranged on the telescopic substrate 7; wherein the spliced ​​outer shell 12 includes an inner shell 11 fixedly arranged on one side of the telescopic substrate 7 and an outer shell 12 fixedly arranged on the other side of the telescopic substrate 7; there is a partial overlapping area between the outer shell 12 and the inner shell 11, the two are spliced ​​with each other and can be adjusted in relative position, and at the same time, the outer shell 12 and the inner shell 11 are slidably connected between the overlapping areas so as to adjust the positions of the outer shell 12 and the inner shell 11 and lock the adjusted positions; the spliced ​​outer shell 12 cooperates with the telescopic substrate 7 to adjust the size of the MEMS microphone, so as to meet the size requirements of different MEMS microphones in different usage scenarios.

[0030] The telescopic substrate 7 includes a substrate body and an elastic band 9 disposed in the substrate body; the elastic band 9 runs through the longitudinal axis or transverse axis direction of the substrate body; and the relative sliding direction between the outer shell 12 and the inner shell 11 is perpendicular to the setting direction of the elastic band 9. In the real-time mode of the present invention, the elastic band 9 is disposed in the transverse axis direction (short axis) of the substrate body, and at the same time, the overlapping part of the inner shell 11 and the outer shell 12 is also distributed along the transverse axis direction of the MEMS microphone.

[0031] Furthermore, in order to make the inner shell 11 and the outer shell 12 consistent with the movement of the telescopic substrate 7, the bottom of the inner shell 11 can be fixed on the left side of the telescopic substrate 7, and the bottom of the outer shell 12 can be fixed on the right side of the telescopic substrate 7. When the inner shell 11 and the outer shell 12 move relative to each other, the telescopic substrate 7 on the corresponding side can be driven to move synchronously under the action of the elastic band 9, thereby achieving the size adjustment of the MEMS microphone. Among them, the elastic band 9 includes a retractable inert conductor metal strip, and the number of inert conductive metal strips corresponds to the number of PCB layers of the telescopic board. In addition to the inert conductor metal strip, a non-conductive elastic connector can also be simultaneously provided to play an elastic protection and limit role for the elastic band 9.

[0032] In a specific embodiment of the present invention, a buckle and a sliding button 5 are provided on the outer shell 12 of the MEMS microphone, and a plurality of slots adapted to the buckle are provided on the inner shell 11, and the buckle is limited to move in the slot; wherein, the sliding button 5 is used to press and adjust the size of the spliced ​​outer shell 12 by adjusting the position of the buckle in the slot, and the cooperation of the buckle and the slot can not only realize the position adjustment of the inner shell 11 and the outer shell 12, but also play the role of guide rail guiding to prevent the position deviation between the inner shell 11 and the outer shell 12, and the inner shell 11 and the outer shell 12 can also be limited by the setting of the buckle and the slot, that is, the minimum size and maximum size position of the microphone are determined to prevent the elastic band 9 from being damaged due to the excessive position.

[0033] It should be noted that in order to adjust the sound input type of the MEMS microphone, a through hole 3 can be set on the spliced ​​shell 12, and a spring baffle 2 can be set on the inner wall of the spliced ​​shell 12 on one side of the through hole 3; when the spring baffle 2 is opened, the internal cavity of the spliced ​​shell 12 is connected to the outside through the through hole 3, and when the spring baffle 2 is closed, the through hole 3 is closed, so that the switching of the sound input type can be achieved through the structure of the elastic baffle.

[0034] Specifically, the spring baffle 2 includes a vertical rod fixed on the splicing shell 12, a baffle hinged to one end of the vertical rod close to the splicing shell 12, and an elastic member connecting the other end of the vertical rod and the baffle, wherein the elastic member is used to drive the baffle to flip away from or close to the opening side and lock the position under the action of external force, wherein an elastic sealing member can be provided at the end of the free end of the baffle so that when it blocks the through hole 3, the sealing effect can be effectively ensured while reducing the collision of the baffle with the splicing shell.

[0035] In another specific embodiment of the present invention, a sound hole 81 penetrating the telescopic substrate 7 is further provided on the telescopic substrate 7, and a push-pull baffle 8 located on one side of the sound hole 81 is embedded in the telescopic substrate 7; the push-pull baffle 8 is position-adjusted in the telescopic substrate 7 to adjust the opening size of the sound hole 81. It can be seen that when the elastic baffle located at the through hole 3 is opened and the push-pull baffle 8 completely blocks the sound hole 81, the MEMS microphone belongs to a top-type structure, and when the elastic baffle at the through hole 3 is closed and the push-pull baffle 8 opens the sound hole 81, the MEMS microphone belongs to a bottom-type structure, thereby realizing the switching of the microphone type, meeting the different requirements of customers for microphone types in the assembly of the whole machine, and solving more welding problems of the client.

[0036] In order to improve the positioning accuracy of the push-pull baffle 8, at least one slide rail can be set on the upper side and / or lower side of the push-pull baffle 8, and a slide groove compatible with the slide rail can be set inside the retractable substrate 7. The slide rail is limited to move in the slide groove. This can not only improve the positioning accuracy of the push-pull baffle 8, realize flexible adjustment of the opening size of the sound hole 81, change the size of the front cavity to affect the microphone frequency response curve, and meet the terminal application requirements for different resonance peaks, but also reduce the friction between the push-pull baffle 8 and the retractable substrate 7 and extend the service life.

[0037] In addition, the push-pull baffle 8 can also be set to a drawer-type pulling method, and a limit port is set on the side corresponding to the free end of the telescopic base plate 7 and the push-pull baffle 8. When the push-pull baffle 8 completely blocks the sound hole 81, the free end of the push-pull baffle 8 can be inserted into the limit port for limiting.

[0038] The MEMS microphone of the embodiment of the present invention further comprises a MEMS chip 6 and an ASIC chip 4 arranged on a telescopic substrate 7; wherein the ASIC chip 4 is connected to the telescopic substrate 7 via an electrical connection line, and the MEMS chip 6 is connected to the ASIC chip 4 via an electrical connection line.

[0039] Corresponding to the above-mentioned MEMS microphone, the present invention further provides an electronic device, comprising the above-mentioned MEMS microphone.

[0040] It should be noted that the embodiments of the above electronic devices can refer to the description in the MEMS microphone embodiment, which will not be described in detail here.

[0041] According to the above-mentioned MEMS microphone and electronic device, a size-adjustable telescopic substrate and a spliced ​​shell are provided, and the spliced ​​shell includes an inner shell and an outer shell whose relative positions are adjustable, and an overlapping area of ​​a partial sliding connection is provided between the outer shell and the inner shell, and the size adjustment of the spliced ​​shell and the telescopic substrate is achieved through the relative movement of the outer shell and the inner shell, so that the overall size of the MEMS microphone can be adjusted through the spliced ​​shell and the telescopic substrate; and, by cooperating with the spring baffle and the push-pull file to control the through hole and the sound hole, the switching of the microphone's sound input type and the adjustment of the opening size of the sound hole are achieved, so as to achieve the adjustment of the microphone's frequency response curve, so that it can meet the needs of different application scenarios and improve the flexibility and applicability of the microphone.

[0042] The MEMS microphone and the electronic device according to the present invention are described above by way of example with reference to the accompanying drawings. However, those skilled in the art should understand that various improvements can be made to the MEMS microphone and the electronic device proposed by the present invention without departing from the content of the present invention. Therefore, the protection scope of the present invention should be determined by the content of the attached claims.

Claims

1. A MEMS microphone, characterized in that: It includes a telescopic substrate and a splicing shell arranged on the telescopic substrate; wherein, The spliced ​​housing includes an inner housing fixedly arranged on one side of the telescopic base plate, and an outer housing fixedly arranged on the other side of the telescopic base plate; There is a partial overlapping area between the outer shell and the inner shell, and the overlapping area between the outer shell and the inner shell is slidably connected; The spliced ​​housing cooperates with the telescopic substrate to adjust the size of the MEMS microphone.

2. The MEMS microphone according to claim 1, characterized in that: The telescopic substrate comprises a substrate body and an elastic band arranged in the substrate body; wherein, The elastic band runs through the longitudinal axis or the transverse axis direction of the substrate body; and, The relative sliding direction between the outer shell and the inner shell is perpendicular to the setting direction of the elastic band.

3. The MEMS microphone according to claim 2, characterized in that: The elastic band includes retractable inert conductive metal strips, and the number of the inert conductive metal strips corresponds to the number of PCB layers of the retractable machine board.

4. The MEMS microphone according to claim 1, characterized in that: The outer shell is provided with a buckle and a sliding button, and the inner shell is provided with a slot adapted to the buckle, and the buckle is limited to move in the slot; wherein, The sliding button is used to adjust the size of the spliced ​​housing by pressing it and adjusting the position of the buckle in the slot.

5. The MEMS microphone according to claim 1, characterized in that: A through hole is provided on the spliced ​​shell; wherein, A spring baffle is provided on the inner side wall of the spliced ​​shell; When the spring baffle is opened, the internal cavity of the spliced ​​housing is connected to the outside through the through hole, and when the spring baffle is closed, the through hole is closed.

6. The MEMS microphone according to claim 1, characterized in that: The spring baffle comprises a vertical rod fixed to the spliced ​​housing, a baffle hinged to one end of the vertical rod, and an elastic member connecting the other end of the vertical rod and the baffle; The elastic member is used to drive the baffle to flip away from or close to the opening side and lock the position under the action of external force.

7. The MEMS microphone according to claim 1, characterized in that: A sound hole penetrating the telescopic substrate is provided on the telescopic substrate, and a push-pull baffle located on one side of the sound hole is embedded in the telescopic substrate; The push-pull baffle is positionally adjusted within the telescopic base plate to adjust the opening size of the sound hole.

8. The MEMS microphone according to claim 1, characterized in that: A slide rail is arranged on the upper side and / or the lower side of the push-pull baffle, a slide groove matched with the slide rail is arranged in the retractable base plate, and the slide rail is limited to move in the slide groove.

9. The MEMS microphone according to claim 1, characterized in that: It also includes a MEMS chip and an ASIC chip arranged on the telescopic substrate; wherein, The ASIC chip is connected and conducted with the telescopic substrate, and the MEMS chip is connected and conducted with the ASIC chip.

10. An electronic device, characterized in that: Comprising the MEMS microphone according to any one of claims 1 to 9.

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