Heat dissipation module for enhancing utilization efficiency of heat pipe and processing method of heat dissipation module
By designing a heat dissipation module containing multiple upright and tilted climbing heat pipes, the problems of insufficient utilization of heat pipe climbing sections and bottlenecks in the prior art are solved, and more efficient heat dissipation and cooling air flow utilization of heat pipes are achieved, which improves heat dissipation performance and maintains a reasonable pressure drop.
Patent Information
- Application Number
- CN202510242448.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-03
- Publication Date
- 2025-05-06
AI Technical Summary
The existing 2U heat dissipation module heat pipe design fails to make full use of the climbing section of the heat pipe, resulting in the heat dissipation area of the heat pipe not being fully utilized. At the same time, although increasing the fin density can improve the heat dissipation performance, the performance is not much improved after exceeding the optimal operating point of the system, the cost-effectiveness is not high, and it is easy to cause the overall pressure drop of the module to be too large.
A heat dissipation module including the main Fin heat sink, a small Fin heat sink, a number of upright and inclined climbing heat pipes, and a bottom plate is designed. By tightly attaching the middle upright section of the upright climbing heat pipe to the small Fin heat sink, the middle inclined section of the inclined climbing heat pipe is embedded in the inclined groove of the main Fin heat sink, thereby enhancing the contact area and efficiency of the heat pipe and the heat sink.
It effectively improves the heat pipe heat dissipation efficiency and cooling air flow utilization efficiency, improves the heat dissipation performance, and maintains the overall module pressure drop within the acceptable range of the system fan static pressure, and improves the thermal resistance by 0.012-0.015C/W.
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Figure CN119934869A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the field of heat dissipation heat pipes, and more particularly to a heat dissipation module for enhancing the utilization efficiency of heat pipes and a processing method thereof. Background Art
[0002] Conventional 2U heat dissipation module heat pipe and fin design has the following problems:
[0003] 1. Due to the location of the heat source, the heat pipe must be arranged centrally at the bottom. When it extends to the cooling area above the fins, the existing design does not take into account the use of the heat pipe climbing section.
[0004] 2. Stamped fins require a certain thickness and width to be formed, so conventional designs will directly break them open. At this time, the cooling airflow is easy to leak from the broken part, and the heat pipe does not fully utilize its heat dissipation area.
[0005] 3. Increasing the fin density can effectively increase the heat dissipation area and improve performance. However, simply increasing the fin density will not improve performance much once it exceeds the optimal operating point of the system, and the cost performance is not high. It is also easy to cause excessive overall voltage drop of the module.
[0006] In summary, in the prior art, a bottleneck is encountered when further improving the heat dissipation performance, so there is an urgent need for a heat dissipation module and a processing method thereof that can enhance the utilization efficiency of heat pipes. Summary of the invention
[0007] In order to overcome the above-mentioned defects of the prior art, the present invention provides a heat dissipation module and a processing method thereof for enhancing the utilization efficiency of heat pipes.
[0008] The technical solution of the present invention is as follows:
[0009] A heat dissipation module for enhancing the utilization efficiency of heat pipes and a processing method thereof, comprising a main fin heat sink, a small fin heat sink, a heat pipe, and a bottom plate, wherein the heat pipes are arranged in a plurality, including a vertical climbing heat pipe and an inclined climbing heat pipe; the heat absorbing end of the vertical climbing heat pipe is embedded in the bottom plate, the heat dissipating end is inserted into the main fin heat sink and is tightly attached, and the vertical section in the middle is tightly attached to the small fin heat sink; the heat absorbing end of the inclined climbing heat pipe is embedded in the bottom plate, the heat dissipating end is inserted into the main fin heat sink and is tightly attached, and the middle is an inclined section and is embedded in the inclined groove of the main fin heat sink;
[0010] The processing method is:
[0011] S1. Pre-apply solder paste to the small Fin heat sink and insert it into the two opposite corners of the main Fin heat sink until it is in place;
[0012] S2. Insert the heat pipe into the main Fin heat sink and the small Fin heat sink;
[0013] S3. After the heat pipe is inserted, use a needle to pull the tin;
[0014] S4. Connect the bottom plate to the copper block and print tin with a screen;
[0015] S5. Connect and position the assembled heat pipe, main Fin heat sink, small Fin heat sink and bottom plate and then weld them.
[0016] There are two small Fin heat sinks, which are respectively arranged at opposite corners of the main Fin heat sink.
[0017] The contact portion between the small Fin heat sink and the upright section in the middle of the upright climbing heat pipe is configured as a complete contact surface.
[0018] A plurality of air ducts are arranged inside the small Fin heat sink.
[0019] The heat pipes are arranged in two groups, with three heat pipes in each group, and the two groups are respectively inserted from both sides of the main Fin heat sink.
[0020] A copper block is fixed on the bottom plate, and the bottom surface of the heat absorbing end of the heat pipe is in close contact with the copper block.
[0021] The top surface of the heat absorbing end of the heat pipe is in close contact with the bottom of the main Fin heat sink.
[0022] A plurality of spring screws are installed on the bottom plate.
[0023] Pre-apply solder paste to the small Fin heat sink and then insert it into the main Fin heat sink.
[0024] After connecting the base plate to the copper block, tin needs to be screen printed.
[0025] Technical effects and advantages of the present invention:
[0026] 1. Further improve the heat dissipation efficiency of heat pipes;
[0027] 2. Further improve the cooling airflow utilization efficiency;
[0028] 3. Further improve the heat dissipation performance, while the overall module pressure drop is still within the acceptable range of the system fan static pressure;
[0029] 4. Performance improvement: thermal resistance improved by 0.012-0.015C / W. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] Figure 1 It is a schematic diagram of the overall structure of the present invention;
[0031] Figure 2 It is a side schematic diagram of the present invention;
[0032] Figure 3 and Figure 4 Schematic diagram of the main fin heat sink and base plate separated;
[0033] Figure 5 This is a schematic diagram of the main fin heat sink and heat pipe separated;
[0034] Figure 6 This is a schematic diagram of a small fin heat sink;
[0035] Figure 7 This is a schematic diagram after removing part of the main fin heat sink;
[0036] Figure 8 This is a schematic diagram of the small fin heat sink assembly;
[0037] Fig. 9 This is a schematic diagram of the heat pipe assembly;
[0038] Fig.10 Schematic diagram of the assembly of the main Fin heat sink, small Fin heat sink, heat pipe and base plate. DETAILED DESCRIPTION
[0039] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0040] Embodiment 1
[0041] like Figure 1-7 A heat dissipation module for enhancing the utilization efficiency of heat pipes shown in the figure comprises a main Fin heat sink 1, a small Fin heat sink 2, a heat pipe 3, and a base plate 4. The heat pipes are provided in two groups, each with three pipes, and the two groups are respectively inserted from both sides of the main Fin heat sink; the heat pipe 3 comprises two upright climbing heat pipes 31 and one inclined climbing heat pipe 32; the heat absorbing end 311 of the upright climbing heat pipe 31 is embedded in the base plate 4, the heat dissipating end 312 is inserted into the main Fin heat sink and is tightly attached, and the upright section 313 in the middle is tightly attached to the small Fin heat sink; the heat absorbing end 321 of the inclined climbing heat pipe 32 is embedded in the base plate, the heat dissipating end 322 is inserted into the main Fin heat sink and is tightly attached, and the middle part is an inclined section 323 and is embedded in the inclined groove of the main Fin heat sink.
[0042] Furthermore, there are two small Fin heat sinks 2, which are respectively arranged at opposite corners of the main Fin heat sink.
[0043] Furthermore, the contact portion between the small Fin heat sink 2 and the upright section in the middle of the upright climbing heat pipe is configured as a complete contact surface 21 .
[0044] Furthermore, a plurality of air ducts 22 are provided inside the small Fin heat sink 2 .
[0045] Furthermore, a copper block 5 is fixed on the bottom plate 4, and the bottom surface of the heat absorbing end of the heat pipe is in close contact with the copper block. The top surface of the heat absorbing end of the heat pipe is in close contact with the bottom of the main Fin heat sink.
[0046] Furthermore, a plurality of spring screws 6 are installed on the bottom plate 4 .
[0047] Implementation column 2
[0048] Through experimental testing, the performance comparison report is as follows:
[0049]
[0050] Through the data, it can be found that this patent further improves the heat dissipation efficiency of heat pipes; further improves the cooling airflow utilization efficiency; further improves the heat dissipation performance, while the overall module pressure drop is still within the acceptable range of the system fan static pressure; performance improvement: thermal resistance improved by 0.012-0.015C / W.
[0051] Embodiment 3
[0052] A heat dissipation module processing method for enhancing the utilization efficiency of heat pipes is:
[0053] S1. Figure 8 As shown, pre-apply solder paste to the small Fin heat sink and insert it into the two opposite corners of the main Fin heat sink in the direction of the arrow until it is positioned;
[0054] S2. Fig. 9 As shown, insert the heat pipe into the main Fin heat sink and the small Fin heat sink;
[0055] S3. After the heat pipe is inserted, use a needle to pull the tin;
[0056] S4. Connect the bottom plate to the copper block and print tin with a screen;
[0057] S5. Fig.10 As shown, the assembled heat pipe, main Fin heat sink, small Fin heat sink and bottom plate are connected, positioned and then welded.
[0058] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims
1. A heat dissipation module for enhancing the utilization efficiency of heat pipes and a processing method thereof, characterized in that: It includes a main Fin heat sink, a small Fin heat sink, a heat pipe, and a bottom plate. The heat pipes are arranged in multiple pieces, including a vertical climbing heat pipe and an inclined climbing heat pipe. The heat absorbing end of the vertical climbing heat pipe is embedded in the bottom plate, the heat dissipating end is inserted into the main Fin heat sink and is tightly attached, and the vertical section in the middle is tightly attached to the small Fin heat sink. The heat absorbing end of the inclined climbing heat pipe is embedded in the bottom plate, the heat dissipating end is inserted into the main Fin heat sink and is tightly attached, and the middle part is an inclined section and is embedded in the inclined groove of the main Fin heat sink. The processing method is: S1. Insert the small Fin heat sink into the two opposite corners of the main Fin heat sink and swing it into position; S2. Insert the heat pipe into the main Fin heat sink and the small Fin heat sink; S3. After the heat pipe is inserted, use a needle to pull the tin; S4. Connect the bottom plate to the copper block; S5. Connect and position the assembled heat pipe, main Fin heat sink, small Fin heat sink and bottom plate and then weld them.
2. A heat dissipation module for enhancing the utilization efficiency of heat pipes and a processing method thereof according to claim 1, characterized in that: There are two small Fin heat sinks, which are respectively arranged at opposite corners of the main Fin heat sink.
3. A heat dissipation module for enhancing the utilization efficiency of heat pipes and a processing method thereof according to claim 1, characterized in that: The contact portion between the small Fin heat sink and the upright section in the middle of the upright climbing heat pipe is configured as a complete contact surface.
4. The heat dissipation module for enhancing the utilization efficiency of heat pipes and the processing method thereof according to claim 1, characterized in that: A plurality of air ducts are arranged inside the small Fin heat sink.
5. The heat dissipation module for enhancing the utilization efficiency of heat pipes and the processing method thereof according to claim 1, characterized in that: The heat pipes are arranged in two groups, with three heat pipes in each group, and the two groups are respectively inserted from both sides of the main Fin heat sink.
6. The heat dissipation module for enhancing the utilization efficiency of heat pipes and the processing method thereof according to claim 1, characterized in that: A copper block is fixed on the bottom plate, and the bottom surface of the heat absorbing end of the heat pipe is in close contact with the copper block.
7. A heat dissipation module for enhancing the utilization efficiency of heat pipes and a processing method thereof according to claim 1, characterized in that: The top surface of the heat absorbing end of the heat pipe is in close contact with the bottom of the main Fin heat sink.
8. The heat dissipation module for enhancing the utilization efficiency of heat pipes and the processing method thereof according to claim 1, characterized in that: A plurality of spring screws are installed on the bottom plate.
9. The heat dissipation module for enhancing the utilization efficiency of heat pipes and the processing method thereof according to claim 1, characterized in that: Pre-apply solder paste to the small Fin heat sink and then insert it into the main Fin heat sink.
10. A heat dissipation module for enhancing heat pipe utilization efficiency and a processing method thereof according to claim 1, characterized in that: After connecting the base plate to the copper block, tin needs to be screen printed.