Cleaning device suitable for integrated circuit packaging

Abstract

The invention belongs to the technical field of integrated circuit packaging cleaning equipment, and particularly relates to a cleaning device suitable for integrated circuit packaging, the cleaning device comprises a transportation part, a clamping part, a flushing part, an ultrasonic cleaning box and a drying part, the transportation part comprises a support, a transportation frame and a slide way frame, and the transportation frame is horizontally fixed to the top end of the support; a slide way frame is horizontally fixed to the outer portion of the conveying frame in a sleeving mode, a screw hole plate block is horizontally fixed to the upper side of the support, a plurality of screw hole blocks are horizontally fixed to the front end face of the screw hole plate block, a flushing part, an ultrasonic cleaning box and a drying part are transversely and sequentially installed on the screw hole blocks of the screw hole plate block, and a plurality of clamping parts are assembled in the slide way frame in a sliding mode; the sides, close to the conveying part, of the multiple clamping parts are fixed to the conveying part. A plurality of integrated circuit boards are continuously conveyed through the conveying piece to be cleaned through the flushing piece, the ultrasonic cleaning box and the drying piece, the integrated circuit boards are continuously cleaned, and it is guaranteed that the integrated circuit boards are thoroughly cleaned.

Description

Technical Field

[0001] The invention belongs to the technical field of integrated circuit packaging cleaning equipment, and in particular relates to a cleaning device suitable for integrated circuit packaging. Background Art

[0002] During the manufacturing process of integrated circuits, chips need to be packaged into a suitable package form through a packaging process so that they can be used in electronic devices. The integrated circuit package line refers to the standard of integrated circuit chip packaging form and size. Different integrated circuit package lines are suitable for different applications and needs. During packaging, it is necessary to use cleaning equipment to clean it to remove dirt and impurities on the surface of the package to ensure the good quality and reliability of the line. The main purpose of cleaning is to remove various contaminants generated during the manufacturing process, such as flux residues, particulate matter, grease and other organic or inorganic impurities. At present, the integrated circuit packaging process has put forward higher requirements for the automation, continuity and cleaning efficiency of cleaning equipment. However, existing cleaning methods such as chemical cleaning, ultrasonic cleaning and spray cleaning usually require multiple manual operations or cannot take into account the efficient processing of multiple integrated circuit boards, resulting in difficulty in meeting the production needs of a large number of products. At the same time, traditional cleaning equipment often has problems such as uneven cleaning distribution, incomplete cleaning effect and long cleaning time during use.

[0003] The existing announcement number is CN221453645U, and the name is "A cleaning device for integrated circuit packaging line body", which includes structures such as an ultrasonic cleaning machine, a limiting cross bar and a cleaning box. By placing the cleaning box containing the packaged circuit chip in the ultrasonic cleaning machine for cleaning, and limiting the limiting cross bar, the cleaning box can be prevented from sliding during the cleaning operation to a certain extent, thereby avoiding chip collision; and water can enter the cleaning box through the water-permeable holes and the orifice plate cover to centrally clean the circuit chips, which is convenient for operation when taking out. However, the cleaning device still has the following shortcomings during application: when cleaning multiple integrated circuit boards, it is necessary to stack the multiple integrated circuit boards and place them in the cleaning box and then immerse them in the ultrasonic cleaning liquid. Due to mutual obstruction, it is difficult for the cleaning liquid to completely infiltrate all positions, resulting in incomplete cleaning of the multiple integrated circuit boards, affecting the packaging quality and the reliability of subsequent assembly. Summary of the invention

[0004] In view of the problems existing in the prior art, the purpose of the present invention is to provide a cleaning device suitable for integrated circuit packaging, which can be suitable for integrated circuit packaging and can realize automatic, continuous, efficient and thorough cleaning of multiple integrated circuit boards.

[0005] To achieve the above object, the present invention provides the following technical solutions: A cleaning device suitable for integrated circuit packaging comprises a transport member, a clamping member, a flushing member, an ultrasonic cleaning box and a drying member. The transport member comprises a bracket, a transport frame and a slide frame. The top of the bracket is horizontally fixed with the transport frame, and the outer sleeve of the transport frame is horizontally fixed with the slide frame. A screw hole plate is horizontally fixed on the upper side of the bracket, and a plurality of screw hole blocks are horizontally fixed on the front end surface of the screw hole plate. The flushing member, the ultrasonic cleaning box and the drying member are sequentially installed on the plurality of screw hole blocks of the screw hole plate in a transverse manner. A plurality of clamping members are slidably assembled in the slide frame, and the plurality of clamping members are fixed on the transport member at a side close to the transport member.

[0006] Furthermore, a plurality of fixing screws are installed through the bottom surface of the bracket, a transport roller is vertically rotatably connected to the transport frame, and a plurality of transport rollers are horizontally arranged, a transport belt is tensionedly connected to the transport roller, a transport motor is vertically fixed to the bottom surface of the transport frame, and the output end of the transport motor is fixed to the end of the transport roller, and a plurality of hole blocks are evenly and horizontally fixed on the outer wall of the transport belt.

[0007] Furthermore, the clamping member includes a slider, which is slidably assembled in the slide frame, and a screw hole column is fixed to one end of the slider close to the conveyor belt, and the screw hole column is plugged into the hole block, and a nut is threadedly assembled on the screw hole column, and a guide frame is vertically arranged at the other end of the slider, and a clamping plate is horizontally arranged in the guide frame.

[0008] Furthermore, a perforated plate is vertically fixed on the other end face of the slider, and a supporting spring is vertically fixed on the perforated plate, an insertion rod is vertically fixed on the vertical end face of the guide frame close to the slider, and the insertion rod slides through the supporting spring and is inserted in the perforated plate, the insertion rod is fixedly connected to the other end of the supporting spring, and a vibration motor is vertically fixed on the outer vertical end face of the guide frame.

[0009] Furthermore, a sliding frame is horizontally fixed on the vertical end face of the clamping plate close to the guide frame, and the sliding frame is vertically slidably assembled in the guide frame, a lifting motor is vertically fixed on the top surface of the guide frame, and the output end of the lifting motor is vertically fixed on the lifting screw, a screw barrel is vertically fixed through the sliding frame, and the screw barrel and the lifting screw thread are assembled through.

[0010] Furthermore, a fixed clamp is vertically fixed on one side of the bottom surface of the clamping plate close to the guide frame, and a rotating rod frame is horizontally fixed on the end of the clamping plate away from the guide frame, and a deflection clamp is rotatably connected to the rotating rod frame, and the fixed clamp is rotatably connected to a clamping electric telescopic rod, and a rotating drum plate is fixed to the output end of the clamping electric telescopic rod, a rotating rod is horizontally fixed in the deflection clamp, and the rotating rod is rotatably connected to the rotating drum plate.

[0011] Furthermore, the flushing part includes a liquid storage box, the top surface of the liquid storage box is opened, and two box bodies are symmetrically and vertically fixed on both sides of the top surface of the liquid storage box, a mesh is horizontally fixed inside the liquid storage box, and a water pipe is vertically penetrated and fixed in the middle of the mesh, the bottom end of the water pipe is vertically connected to and fixed with a mesh cylinder, and a water pump is vertically connected and fixed on the water pipe, spray rods are vertically fixed in the two box bodies, and the bottom end of the spray rod is connected and fixed to the top end of the water pipe, a fixing plate is horizontally fixed on the vertical end surface of the rear side of the box body, and the fixing plate is fixed to the screw hole block of the screw hole plate by screws.

[0012] Furthermore, the top of the ultrasonic cleaning box is opened, and the ultrasonic cleaning box is filled with cleaning liquid. A fixing plate is horizontally fixed on the vertical end surface of the rear side of the ultrasonic cleaning box, and the fixing plate is fixed to the screw hole block of the screw hole plate by screws.

[0013] Furthermore, the drying element includes a drying box, a mesh plate is fixed through the front end surface of the drying box, and a fan is fixed through the rear end surface of the drying box, a plurality of heating rods are vertically fixed inside the drying box, and a fixing plate is horizontally fixed on the rear vertical end surface of the drying box, and the fixing plate is fixed to the screw hole block of the screw hole plate by screws.

[0014] Compared with the prior art, the present invention has the following beneficial effects: The cleaning device realizes the independent clamping of multiple integrated circuit boards by arranging multiple clamping parts on the transport rack and cooperating with the transport belt for continuous transmission, thereby avoiding the problem of mutual shielding of boards caused by traditional stacking cleaning. Combined with the concerns about incomplete cleaning in the background technology, the cleaning device can automatically move the circuit board between multiple stations of rinsing, ultrasonic cleaning and drying, so that each circuit board can fully contact the cleaning liquid and obtain the treatment effect of efficiently removing surface impurities.

[0015] In the process of cleaning multiple circuit boards, different areas of the integrated circuit board are stably fixed by the electric telescopic clamping structure, and the circuit board is automatically lifted and lowered in combination with the lifting motor, so that the circuit board can be fully and evenly wetted during the spray cleaning and ultrasonic cleaning process. Compared with the method of placing the circuit boards in a cleaning box provided by the background technology, this solution can better ensure the cleaning efficiency and cleaning effect when cleaning a large number of circuit boards simultaneously, reduce the dead corners that cannot be cleaned due to mutual obstruction, and improve the packaging quality and finished product yield.

[0016] After cleaning, the cleaning device accelerates the shedding of the cleaning water through a vibration motor, and sets a fan and a heating rod inside the drying device to use hot air to quickly dry the circuit board, thereby reducing the potential oxidation or short circuit risks caused by water stains and residual cleaning liquid to the circuit board. Combined with the deficiencies in the background technology, this drying method not only improves the drying efficiency, but also simplifies the subsequent operation process, which helps to achieve continuous production and improve overall operational efficiency. Through the combination of the above-mentioned multiple processes, the cleaning device realizes the full process automation of spray cleaning, ultrasonic cleaning and hot air drying on the same production line, greatly improving the reliability and production efficiency of integrated circuit board packaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the structure of the whole of the present invention in a decomposed state; Figure 3 It is a schematic diagram of the structure of the transport unit of the present invention in a disassembled state; Figure 4 It is a schematic structural diagram of the clamping member of the present invention in a disassembled state; Figure 5 It is a schematic structural diagram of the clamping plate of the present invention in a disassembled state; Figure 6 It is a schematic diagram of the structure of the flushing part of the present invention in a disassembled state; Figure 7 It is a schematic diagram of the structure of the ultrasonic cleaning box of the present invention in a disassembled state; Figure 8 It is a schematic diagram of the structure of the drying element of the present invention in a decomposed state.

[0018] In the accompanying drawings, the components represented by the reference numerals are listed as follows: 1. Transport parts; 11. Bracket; 111. Fixing screws; 12. Transport rack; 13. Transport roller; 14. Transport belt; 15. Transport motor; 16. Hole block; 17. Slideway frame; 18. Screw hole plate; 2. Clamping parts; 21. Slider; 211. Screw hole column; 212. Nut; 22. Guide frame; 221. Lifting motor; 222. Lifting screw; 23. Hole plate; 24. Insertion rod; 25. Support spring; 26. Vibration motor; 27. Clamping plate; 27 1. Sliding frame; 272. Screw barrel; 273. Rotating rod frame; 28. Deflecting jaws; 281. Rotating rod; 29. ​​Fixed jaws; 291. Clamping electric telescopic rod; 292. Rotating drum plate; 3. Flushing parts; 31. Liquid storage box; 32. Mesh; 33. Box body; 34. Water pipe; 35. Spray rod; 341. Water pump; 342. Mesh drum; 4. Ultrasonic cleaning box; 5. Drying parts; 51. Drying box; 52. Mesh plate; 53. Fan; 54. Heating rod; 6. Fixed plate. DETAILED DESCRIPTION

[0019] In order to make the purpose and advantages of the present invention more clearly understood, the present invention is specifically described below in conjunction with embodiments. It should be understood that the following text is only used to describe one or several specific embodiments of the present invention, and does not strictly limit the scope of protection of the specific claims of the present invention.

[0020] In order to make the purpose and advantages of the present invention more clearly understood, the present invention is specifically described below in conjunction with embodiments. It should be understood that the following text is only used to describe one or several specific embodiments of the present invention, and does not strictly limit the scope of protection of the specific claims of the present invention.

[0021] Embodiment 1: refer to Figure 1-Figure 4 As shown, a cleaning device suitable for integrated circuit packaging includes a transport member 1, a clamping member 2, a flushing member 3, an ultrasonic cleaning box 4 and a drying member 5. The transport member 1 includes a bracket 11, a transport frame 12 and a slide frame 17. The top of the bracket 11 is horizontally fixed with the transport frame 12, and the outer sleeve of the transport frame 12 is horizontally fixed with the slide frame 17. The upper side of the bracket 11 is horizontally fixed with a screw hole plate 18, and a plurality of screw hole blocks are horizontally fixed on the front end surface of the screw hole plate 18. The flushing member 3, the ultrasonic cleaning box 4 and the drying member 5 are sequentially installed on the plurality of screw hole blocks of the screw hole plate 18 in a transverse manner. A plurality of clamping members 2 are slidably assembled in the slide frame 17, and a plurality of clamping members 2 are fixed on the transport member 1 on one side thereof close to the transport member 1. The cleaning device is improved in combination with the problem of poor cleaning effect of stacking a plurality of integrated circuit boards in the background technology. , multiple clamping parts 2 are designed to be arranged in sequence in the slide frame 17, and are automatically transported in the horizontal direction through the transport part 1, so as to meet the cleaning needs of high efficiency, continuous and full coverage, especially in large-scale packaging production, the operation efficiency and cleaning quality are improved; the bracket 11 is made of Q235 steel material and is treated with anti-rust spraying, the transport frame 12 and the slide frame 17 are made of 6061 aluminum alloy profile to reduce the overall weight of the equipment and improve corrosion resistance, the screw hole plate 18 and the screw hole block can be made of 45 steel material and are precision processed to ensure installation stability; when the transport part 1 cooperates with the clamping part 2, the flushing part 3, the ultrasonic cleaning box 4 and the drying part 5, the impurities on the surface of the integrated circuit board can be removed through multi-station joint operation under the premise of ensuring that all areas of the integrated circuit board are fully exposed to the cleaning liquid.

[0022] refer to Figure 2 and Figure 3As shown, a plurality of fixing screws 111 are installed through the bottom surface of the bracket 11, a transport roller 13 is vertically rotatably connected to the transport frame 12, and a plurality of transport rollers 13 are horizontally arranged, a transport belt 14 is tensionedly connected to the transport roller 13, a transport motor 15 is vertically fixed to the bottom surface of the transport frame 12, and the output end of the transport motor 15 is fixed to the end of the transport roller 13, and a plurality of hole blocks 16 are evenly and horizontally fixed on the outer wall of the transport belt 14; the transport motor 15 uses an AC motor of model TB-200 with a rated power of 200W, and a speed regulator is used to accurately control the running speed of the transport belt 14 to meet the cleaning rhythm requirements of different integrated circuit boards; the transport roller 13 is made of 304 stainless steel and is rust-proof treated, and the transport belt 14 uses high-temperature resistant and corrosion-resistant fluororubber material to adapt to the environment of contact with cleaning liquid and hot air drying during subsequent cleaning operations.

[0023] refer to Figure 4 and Figure 5 As shown, the clamping member 2 includes a slider 21, which is slidably assembled in the slideway frame 17, and a screw hole column 211 is fixed at one end of the slider 21 close to the conveyor belt 14, and the screw hole column 211 is plugged into the hole block 16, and a nut 212 is threadedly assembled on the screw hole column 211, and a guide frame 22 is vertically arranged at the other end of the slider 21, and a clamping plate 27 is horizontally arranged in the guide frame 22; the slider 21 is made of aluminum alloy 6063 and anodized to enhance wear resistance, the screw hole column 211 and the nut 212 are both made of stainless steel 304 to ensure stable connection in a high humidity or cleaning fluid environment, and the guide frame 22 and the clamping plate 27 are both laser cut and formed from a Q235 steel plate with a thickness of 5 mm and surface anti-corrosion sprayed; when multiple clamping members 2 are matched with the conveyor belt 14, the shielding caused by the stacking of multiple integrated circuit boards in the traditional solution can be avoided, especially in combination with the incomplete cleaning problem mentioned in the background technology, efficient cleaning can be achieved by independently clamping each integrated circuit board.

[0024] refer to Figure 4 and Figure 5As shown, a perforated plate 23 is vertically fixed on the other end face of the slider 21, and a supporting spring 25 is vertically fixed on the perforated plate 23. A plug rod 24 is vertically fixed on the vertical end face of the guide frame 22 close to the slider 21, and the plug rod 24 slides through the supporting spring 25 and is inserted into the perforated plate 23. The plug rod 24 is fixedly connected to the other end of the supporting spring 25. A vibration motor 26 is vertically fixed on the outer vertical end face of the guide frame 22; the perforated plate 23 and the plug rod 24 are made of 45# steel and are subjected to surface heat treatment, the supporting spring 25 is made of 65Mn spring steel and is subjected to stress relief treatment, and the vibration motor 26 is selected as model VIB -50 high-speed vibration motor with a rated power of 50W; when the integrated circuit board is ultrasonically cleaned, the vibration motor 26 is started to generate vibration force, which drives the guide frame 22 to vibrate, and the driving rod 24 on the guide frame 22 performs high-frequency reciprocating motion in the orifice plate 23, squeezing the support spring 25 to deform, and the deformation force of the support spring 25 pushes the driving rod 24 on the guide frame 22 to perform high-frequency reciprocating motion in the orifice plate 23. The vibration force causes the driving rod 24 on the guide frame 22 to perform high-frequency reciprocating motion in the orifice plate 23, generating an amplitude to accelerate the falling of the liquid adhered after cleaning, thereby improving the drainage and drying efficiency after cleaning.

[0025] refer to Figure 4 and Figure 5 As shown, a slide frame 271 is horizontally fixed on the vertical end face of the clamping plate 27 close to the guide frame 22, and the slide frame 271 is vertically slidably assembled in the guide frame 22, a lifting motor 221 is vertically fixed on the top surface of the guide frame 22, and the output end of the lifting motor 221 is vertically fixed on the lifting screw 222, a screw barrel 272 is vertically penetrated and fixed in the slide frame 271, and the screw barrel 272 and the lifting screw 222 are threadedly penetrated and assembled; the slide frame 271 and the screw barrel 272 are both made of cast aluminum and are precisely processed by CNC, the lifting motor 221 uses a DC reduction motor of model LA-150 and has a rated torque of 10N·m, and the lifting screw 222 is made of stainless steel 304 thread rolling process and hardened on the thread surface; when the integrated circuit board runs to the top of the ultrasonic cleaning box 4, the clamping plate 27 is driven downward by the lifting motor 221, so that the clamped integrated circuit board is vertically immersed in the cleaning liquid for ultrasonic immersion and cooperates with ultrasonic cavitation to achieve complete removal of impurities.

[0026] refer to Figure 4 and Figure 5As shown, a fixed clamping claw 29 is vertically fixed on one side of the bottom surface of the clamping plate 27 close to the guide frame 22, and a rotating rod frame 273 is horizontally fixed on the end of the clamping plate 27 away from the guide frame 22, and a deflection clamping claw 28 is rotatably connected to the rotating rod frame 273, and a clamping electric telescopic rod 291 is rotatably connected to the fixed clamping claw 29, and a rotating cylinder plate 292 is fixed to the output end of the clamping electric telescopic rod 291, and a rotating rod 281 is horizontally fixed in the deflection clamping claw 28, and the rotating rod 281 is rotatably connected to the rotating cylinder plate 292; the fixed clamping claw 29 and the deflection clamping claw 28 are both made of high-strength nylon material to prevent scratches on the surface of the integrated circuit board. The rotating rod frame 273 and the rotating rod 281 are made of stainless steel 316 material and are precisely ground to ensure smooth rotation. The clamping electric telescopic rod 291 uses an electric push rod of model ES-80 with a maximum thrust of 80N. The rotating drum plate 292 is made of hard aluminum alloy and is oxidized. The clamping structure here is optimized for the phenomenon of stacking and obstruction that multiple integrated circuit boards are prone to during the cleaning process in the background technology. By clamping the electric telescopic rod 291, the deflection clamp 28 and the fixed clamp 29 are pushed to clamp together, and each integrated circuit board can be fully covered during the cleaning and drying process, thereby ensuring cleaning efficiency and quality.

[0027] refer to Figure 2 and Figure 6 As shown, the flushing part 3 includes a liquid storage box 31, the top surface of the liquid storage box 31 is opened, and two box bodies 33 are symmetrically and vertically fixed on both sides of the top surface of the liquid storage box 31, a mesh 32 is horizontally fixed inside the liquid storage box 31, and a water pipe 34 is vertically penetrated and fixed in the middle of the mesh 32, the bottom end of the water pipe 34 is vertically connected and fixed with a mesh cylinder 342, and a water pump 341 is vertically connected and fixed on the water pipe 34, a spray rod 35 is vertically fixed in the two box bodies 33, and the bottom end of the spray rod 35 is connected and fixed with the top of the water pipe 34, a fixing plate 6 is horizontally fixed on the vertical end surface of the rear side of the box body 33, and the fixing plate 6 is fixed to the screw hole block of the screw hole plate 18 by screws; the liquid storage box 31 is made of 304 stainless steel with a thickness of 3mm and is corrosion-resistant The mesh 32 is woven from stainless steel wire with a diameter of 0.5 mm. The water pipe 34 and the mesh tube 342 are made of PVC material to prevent corrosion by the cleaning agent. The water pump 341 uses a self-priming pump of model WP-300 and has a rated flow of 10L / min. The spray rod 35 is made of PP material and has a reinforced rib structure on the surface to improve the pressure resistance. The fixed plate 6 uses Q235 steel plate and is galvanized. Combined with the background technology, it can be seen that in the initial cleaning stage, the surface of the integrated circuit board needs to be sprayed and rinsed to remove surface particles and most of the flux residues. Therefore, the multiple clamps 2 are driven by the integrated circuit board into the box body 33 in turn and the cleaning liquid is sprayed through the spray rod 35, so that each position is fully exposed to the flushing liquid.

[0028] refer to Figure 2 and Figure 7As shown, the top of the ultrasonic cleaning box 4 is opened, and the ultrasonic cleaning box 4 is filled with cleaning liquid. A fixing plate 6 is horizontally fixed on the vertical end face of the rear side of the ultrasonic cleaning box 4, and the fixing plate 6 is fixed on the screw hole block of the screw hole plate 18 by screws; the ultrasonic cleaning box 4 uses a stainless steel 316L plate with a thickness of 2.5 mm and an acid-resistant and alkali-resistant coating is sprayed on the inner wall. The ultrasonic generator is selected as USG-600 with an ultrasonic frequency of 40kHz and a power of 600W. The cleaning liquid can be industrial pure water or a suitable amount of cleaning agent to enhance the cleaning effect; when the transport member 1 drives the clamped integrated circuit board to enter the upper part of the ultrasonic cleaning box 4, the problem of insufficient local cleaning of multiple circuit boards mentioned in the background technology is improved, and the lifting motor 221 is used to drive the integrated circuit board to be vertically immersed in the cleaning liquid and perform ultrasonic vibration, so that the flux residue and fine particles on the surface of the integrated circuit board are fully stripped and removed.

[0029] refer to Figure 2 and Figure 8 As shown, the drying member 5 includes a drying box 51, a mesh plate 52 is fixed through the front end surface of the drying box 51, and a fan 53 is fixed through the rear end surface of the drying box 51, a plurality of heating rods 54 are vertically fixed inside the drying box 51, and a fixing plate 6 is horizontally fixed on the rear vertical end surface of the drying box 51, and the fixing plate 6 is fixed to the screw hole block of the screw hole plate 18 by screws; the drying box 51 is formed by bending a 2mm thick aluminum zinc plate and subjected to high temperature spraying treatment, the mesh plate 52 is made of 316 stainless steel punching plate with a hole diameter of 1mm, and the fan 53 is selected A centrifugal fan of model FJ-120 is used with a flow rate of 120m³ / h. A ceramic heating tube is used for the heating rod 54 and a high-temperature resistant coating is added to the outer wall. In view of the concern about residual moisture in the workpiece after cleaning in the background technology, the surface of the integrated circuit board is quickly dried by the hot air in the drying member 5, thereby preventing short circuits and possible oxidation effects in subsequent processes. At the same time, under the blowing action of the fan 53 and in combination with the transparent structure of the mesh plate 52, the hot air is fully in contact with the surface of the integrated circuit board, thereby achieving continuous and rapid drying of multiple integrated circuit boards.

[0030] Embodiment 2: This embodiment describes in detail the working principle of the first paragraph of the beneficial effect of "by arranging multiple clamping members on the transport rack and cooperating with the conveyor belt for continuous transmission; realizing the block-by-block independent clamping of multiple integrated circuit boards; avoiding the problem of mutual shielding of boards caused by traditional stacking cleaning"; specifically, multiple clamping members 2 (made of aluminum alloy 6063 and anodized) are arranged on the transport member 1 (made of 6061 aluminum alloy profile), and the conveyor belt 14 (made of fluororubber) is driven to run continuously by the transport motor 15 (model TB-200, rated power 200W); thereby, multiple independently clamped integrated circuit boards are sequentially entered into the rinsing member 3, ultrasonic cleaning box 4 and drying member 5 stations; in order to verify the improvement effect of the continuous transmission and block clamping method on the cleaning efficiency, integrated circuit boards of the same model (size Thickness 1.6mm) were compared with the scheme of this embodiment and the traditional stacking method, where the traditional stacking method is to stack 5 circuit boards in the same cleaning box at one time; the test was carried out under the conditions of the same cleaning time (2min flushing + 3min ultrasonic cleaning) and the same cleaning liquid concentration, and the cleaning effect was measured by calculating the cleaning coverage η, and the formula is:

[0031] in is the total mass of the attached materials on the circuit board surface before cleaning, The residual mass of the attached materials on the circuit board surface after cleaning; the following table gives the comparative data of 5 groups of cleaning tests and The unit of is mg, and the unit of η is percentage %)

[0032] It can be seen from the data in the table that the block clamping method can significantly improve the cleaning coverage rate under the same cleaning parameters, and the highest can reach more than 97%; the traditional stacking method causes more cleaning dead angles due to the mutual obstruction of the plates, and the cleaning coverage rate is significantly reduced; therefore, this embodiment can significantly reduce the cleaning blind spots caused by the mutual obstruction of the plates through the independent clamping and continuous transmission of multiple circuit boards, thereby effectively improving the all-round cleanliness of multiple circuit boards.

[0033] Embodiment 3: This embodiment is developed around the working principle of the second paragraph of the beneficial effect that "different areas are stably fixed by an electric telescopic clamping structure and automatically lifted by a lifting motor; the circuit board is fully infiltrated during the spray cleaning and ultrasonic cleaning process; and the efficiency of synchronous cleaning of large quantities of circuit boards is significantly improved"; the clamping electric telescopic rod 291 (model ES-80, maximum thrust 80N) is matched with the deflection clamping claw 28 (high-strength nylon material) and the fixed clamping claw 29 (also made of high-strength nylon material), and the lifting motor 221 (model LA-150, rated torque 10N·m) drives the lifting screw 222 (stainless steel 304 material, surface hardening treatment) to drive the clamping plate 27 to move up and down in the guide frame 22; the integrated circuit board is automatically immersed and separated between the flushing part 3 (the flow rate of the cleaning liquid injected into the liquid storage box 31 is about 10L / min) and the ultrasonic cleaning box 4 (ultrasonic frequency 40kHz, power 600W); in the comparative test, the same size is selected However, there are 5 circuit boards with different surface stain contents. The decontamination rate R of a single circuit board is calculated by the following formula:

[0034] Where Mb is the mass of dirt on the circuit board before immersion in the cleaning solution (mg), is the mass of residual dirt on the circuit board after ultrasonic cleaning (mg); the experimental conditions keep the same concentration of cleaning solution (1% water-based cleaning agent), and the total operation time of the flushing part 3 and the ultrasonic cleaning box 4 is 5 minutes; the following table gives the comparison data of the electric telescopic clamping and automatic lifting scheme and the fixed height clamp scheme only:

[0035] It can be seen from the results in the table that the overall decontamination rate of the automatic lifting and clamping method is higher than that of the fixed height clamping method; in large-scale continuous cleaning, automatic lifting can make the circuit board fully infiltrated in the two stages of spraying and ultrasonic cleaning and reduce dead corners, thereby greatly improving the cleaning uniformity and efficiency; therefore, this embodiment achieves comprehensive coverage cleaning of different areas of the circuit board by using the electric telescopic clamping rod 291 and the lifting motor 221 in the clamping structure, and improves the yield rate of large-scale circuit board packaging production.

[0036] Embodiment 4: This embodiment is based on the working principle of the third paragraph of the beneficial effect, which is "accelerating the removal of the cleaning water by a vibration motor after cleaning; using a fan and a heating rod inside the drying device for rapid drying; reducing the risk of oxidation or short circuit of the circuit board caused by water stains and residual cleaning liquid; achieving continuous production and improving overall operating efficiency". Specifically, a vibration motor 26 (model VIB-50, rated power 50W) is used in conjunction with a plug rod 24 (45 steel, surface heat treatment) and a support spring 25 (65Mn material, stress relief treatment). After the ultrasonic cleaning is completed, the vibration motor 26 drives the plug rod 24 to perform high-frequency reciprocating motion; after accelerating the removal of the cleaning water, the circuit board is sent into the drying unit 5 (the drying box 51 is made of 2mm thick aluminum-zinc plate, with 5 ceramic heating rods 54 vertically fixed inside, and a fixed fan 53 is passed through the rear end face, model flow Hot air drying; its drying rate. It can be estimated by the following formula:

[0037] in is the mass of water contained in the circuit board when it enters the drying box 51 (g), is the residual moisture mass (g) of the circuit board when leaving the drying box 51, t is the drying time (min); the drying temperature is set to about ( After continuous drying for 2 minutes, the residual moisture of the circuit board was measured. In order to compare the effects of vibration-accelerated water removal and natural dripping on drying efficiency, 5 groups of control experiments were conducted. The results are shown in the following table:

[0038] It can be seen that within the same drying time, the circuit board that is subjected to high-speed water removal treatment by the vibration motor 26 and then fed into the drying box 51 has a higher drying rate; the residual moisture on the surface of the circuit board and in the micropores can be discharged more quickly; at the same time, the hot air generated by the fan 53 and the heating rod 54 It can further shorten the drying time and reduce the risks of oxidation, short circuit, etc. caused by long-term retention of moisture; therefore, this embodiment improves the overall production efficiency and ensures the reliability of the integrated circuit board packaging quality by first vibrating to drain the liquid and then drying with hot air after cleaning.

[0039] The working principle of the present invention is as follows: when in use, the transport motor 15 on the transport frame 12 is started to drive the transport roller 13 to rotate on the transport frame 12, and the transport belt 14 is driven to run in tension. At the same time, the screw hole column 211 at the end of the slider 21 on the clamping member 2 is fixed to the screw hole plate 18 of the conveying belt 14 through the nut 212, and the transport motor 15 is started to drive the transport roller 13 to rotate, and the conveying belt 14 is driven to run, and the sliders 21 on the multiple clamping members 2 are pulled to slide in the slide frame 17 in sequence following the conveying belt 14, and the integrated circuit boards to be cleaned are sequentially arranged between the deflection clamping claw 28 and the fixed clamping claw 29 in the clamping member 2, and the output end of the clamping electric telescopic rod 291 is started to extend, and the rotating drum plate 2 is pushed. 92 moves, rotates and pushes the deflection clamping claw 28 to rotate on the rotating rod frame 273 of the clamping plate 27, thereby squeezing and clamping the integrated circuit board to be cleaned on the clamping part 2, and driving the integrated circuit board clamped by the clamping part 2 to enter between the two box bodies 33 of the flushing part 3 during cleaning, and starting the water pump 341 on the water pipe 34 to drive the cleaning agent in the liquid storage box 31 to be sucked from the net tube 342, and the cleaning liquid is guided to between the spray rod 35 between the two box bodies 33 through the water pipe 34, and the cleaning water sprayed by the spray rod 35 is on the integrated circuit board to rinse and remove the residual impurities on the integrated circuit board, and the cleaning water after rinsing carries the impurities and falls on the mesh 32, and the impurities in the falling cleaning water are filtered and removed, and then the cleaning water is rinsed. The cleaned integrated circuit board moves to the top of the ultrasonic cleaning box 4, and the lifting motor 221 on the top surface of the guide frame 22 is started to drive the lifting screw 222 to rotate, and the thread drives the sliding frame 271 on the clamping plate 27 to slide vertically on the guide frame 22, driving the clamped integrated circuit board to move down and immerse it in the ultrasonic cleaning box 4 for ultrasonic cleaning. After the cleaning is completed, the clamped integrated circuit board is pulled up, and then the vibration motor 26 on one side of the guide frame 22 is started to drive the insertion rod 24 on one side of the guide frame 22 to slide vertically in the orifice plate 23, squeezing the support spring 25 to deform, and the vibration accelerates the falling of the cleaning liquid on the integrated circuit board, and then the clamped integrated circuit board is moved to the front side of the drying member 5, and the drying is started. The fan 53 on the rear end surface of the drying box 51 drives external air into the drying box 51, and the air contacts the heating rod 54 to carry heat and is discharged from the mesh 52. The hot air contacts the integrated circuit board to dry the adhered cleaning liquid, and then the output end of the clamping electric telescopic rod 291 is started to contract, pushing the rotating drum plate 292 to move, and rotating the deflection clamping claw 28 to rotate on the rotating rod frame 273 of the clamping plate 27, thereby releasing the clamped integrated circuit board that has been cleaned, so that multiple integrated circuit boards are continuously transported by the transport part 1 and respectively pass through the flushing part 3, the ultrasonic cleaning box 4 and the drying part 5 for cleaning, and the multiple integrated circuit boards are continuously cleaned to ensure that the multiple integrated circuit boards are thoroughly cleaned.

[0040] The above is only a preferred embodiment of the present invention. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principles of the present invention, and these improvements and modifications should also be considered as the protection scope of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention shall be implemented according to the conventional means in the art unless otherwise specified and limited.

Claims

1. A cleaning device suitable for integrated circuit packaging, characterized in that: The invention comprises a transport member (1), a clamping member (2), a flushing member (3), an ultrasonic cleaning box (4) and a drying member (5), wherein the transport member (1) comprises a bracket (11), a transport frame (12) and a slideway frame (17), wherein the transport frame (12) is horizontally fixed to the top of the bracket (11), and the slideway frame (17) is horizontally fixed to the outer sleeve of the transport frame (12), a screw hole plate (18) is horizontally fixed to the upper side of the bracket (11), and a plurality of screw hole blocks are horizontally fixed to the front end surface of the screw hole plate (18), and the flushing member (3), the ultrasonic cleaning box (4) and the drying member (5) are sequentially installed on the plurality of screw hole blocks of the screw hole plate (18) in a transverse manner, and a plurality of the clamping members (2) are slidably assembled in the slideway frame (17), and the plurality of the clamping members (2) are fixed to the transport member (1) on the side close to the transport member (1).

2. A cleaning device suitable for integrated circuit packaging according to claim 1, characterized in that: A plurality of fixing screws (111) are installed through the bottom surface of the bracket (11); a transport roller (13) is vertically rotatably connected to the transport frame (12), and a plurality of transport rollers (13) are arranged horizontally; a transport belt (14) is tensionedly connected to the transport roller (13); a transport motor (15) is vertically fixed to the bottom surface of the transport frame (12), and the output end of the transport motor (15) is fixed to the end of the transport roller (13); and a plurality of hole blocks (16) are evenly and horizontally fixed to the outer wall of the transport belt (14).

3. A cleaning device suitable for integrated circuit packaging according to claim 2, characterized in that: The clamping member (2) comprises a slider (21), the slider (21) being slidably assembled in the slideway frame (17), and a screw hole column (211) is fixed to one end of the slider (21) close to the conveyor belt (14), the screw hole column (211) is plugged into the hole block (16), and a nut (212) is threadedly assembled on the screw hole column (211), and a guide frame (22) is vertically arranged at the other end of the slider (21), and a clamping plate (27) is horizontally arranged in the guide frame (22).

4. A cleaning device suitable for integrated circuit packaging according to claim 3, characterized in that: A perforated plate (23) is vertically fixed on the other end surface of the slider (21), and a support spring (25) is vertically fixed on the perforated plate (23); an insertion rod (24) is vertically fixed on a vertical end surface of the guide frame (22) close to the slider (21), and the insertion rod (24) slides through the support spring (25) and is inserted into the perforated plate (23); the insertion rod (24) is fixedly connected to the other end of the support spring (25); and a vibration motor (26) is vertically fixed on the outer vertical end surface of the guide frame (22).

5. The cleaning device for integrated circuit packaging according to claim 3, characterized in that: A sliding frame (271) is horizontally fixed on a vertical end surface of one side of the clamping plate (27) close to the guide frame (22), and the sliding frame (271) is vertically slidably assembled in the guide frame (22), a lifting motor (221) is vertically fixed on the top surface of the guide frame (22), and the output end of the lifting motor (221) is vertically fixed to the lifting screw (222), a screw barrel (272) is vertically penetrated and fixed in the sliding frame (271), and the screw barrel (272) and the lifting screw (222) are threadedly penetrated and assembled.

6. A cleaning device suitable for integrated circuit packaging according to claim 5, characterized in that: A fixed clamping claw (29) is vertically fixed on one side of the bottom surface of the clamping plate (27) close to the guide frame (22), and a rotating rod frame (273) is horizontally fixed on one end of the clamping plate (27) away from the guide frame (22), and a deflection clamping claw (28) is rotatably connected to the rotating rod frame (273), a clamping electric telescopic rod (291) is rotatably connected to the fixed clamping claw (29), and a rotating drum plate (292) is fixed to the output end of the clamping electric telescopic rod (291), and a rotating rod (281) is horizontally fixed in the deflection clamping claw (28), and the rotating rod (281) is rotatably connected to the rotating drum plate (292).

7. A cleaning device suitable for integrated circuit packaging according to any one of claims 1 to 6, characterized in that: The flushing component (3) comprises a liquid storage box (31), the top surface of the liquid storage box (31) is open, and two box bodies (33) are symmetrically and vertically fixed on both sides of the top surface of the liquid storage box (31), a mesh sheet (32) is horizontally fixed inside the liquid storage box (31), and a water pipe (34) is vertically penetrated and fixed in the middle of the mesh sheet (32), a mesh cylinder (342) is vertically connected and fixed at the bottom end of the water pipe (34), and a water pump (341) is vertically connected and fixed on the water pipe (34), a spray rod (35) is vertically fixed in the two box bodies (33), and the bottom end of the spray rod (35) is connected and fixed to the top end of the water pipe (34), and a fixing plate (6) is horizontally fixed on the vertical end surface of the rear side of the box body (33), and the fixing plate (6) is fixed to the screw hole block of the screw hole plate (18) by screws.

8. A cleaning device suitable for integrated circuit packaging according to any one of claims 1 to 6, characterized in that: The top end of the ultrasonic cleaning box (4) is open and is filled with cleaning liquid. A fixing plate (6) is horizontally fixed on the vertical end surface at the rear side of the ultrasonic cleaning box (4), and the fixing plate (6) is fixed to the screw hole block of the screw hole plate (18) by means of screws.

9. A cleaning device suitable for integrated circuit packaging according to any one of claims 1 to 6, characterized in that: The drying element (5) comprises a drying box (51), a screen plate (52) is fixedly passed through the front end surface of the drying box (51), and a fan (53) is fixedly passed through the rear end surface of the drying box (51), a plurality of heating rods (54) are vertically fixed inside the drying box (51), and a fixing plate (6) is horizontally fixed on the rear vertical end surface of the drying box (51), and the fixing plate (6) is fixed to the screw hole block of the screw hole plate (18) by means of screws.

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