Manufacturing method of blind hole plate of printed circuit board

Abstract

The invention discloses a method for manufacturing a blind hole plate of a printed circuit board. The method comprises the steps of inner layer processing, pressing, drilling processing and copper deposition processing. According to the drilling treatment step, through holes and blind holes are machined at the same time in one-time continuous drilling operation, through hole drilling data and blind hole drilling data are integrated into a unified drilling program, and depth control setting is conducted on the tool sequence of drilling tools corresponding to the blind holes. Through the technical scheme, the hole deviation of primary and secondary drilling caused by the precision of different machine tables for secondary drilling by changing the machine table and the alignment difference of the upper plate is reduced, the comprehensive hole position precision CPK of the through hole and the blind hole is improved (the precision of two hole positions exists due to two drilling machines and two pieces of data in the original process, but the comprehensive hole position precision is relatively low), and the production efficiency is improved. Therefore, the equipment requirement is reduced, and the production efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board manufacturing, and in particular to a method for manufacturing a blind hole plate of a printed circuit board. Background Art

[0002] In multi-layer PCB manufacturing, blind vias are used to connect the outer and inner layers, while through holes run through the entire board. The traditional blind via board production process requires two drilling operations: the first drilling: processing through holes (through in the C→S direction); the second drilling: processing blind holes (drilling on one side to the inner layer). This process has the following defects:

[0003] Complicated process: Drilling twice requires switching machines, changing data, and repeatedly loading and unloading boards, which is time-consuming and labor-intensive. Loss of precision: Positioning deviations of different machines lead to alignment errors between through holes and blind holes (reduced CPK value). High cost: Double equipment occupancy and manpower investment.

[0004] Existing technologies attempt to improve efficiency by optimizing drill paths or depth control algorithms, but do not address the fundamental problem of integrating through-hole and blind-hole processes. Summary of the invention

[0005] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a method for manufacturing a blind hole plate of a printed circuit board, aiming to solve the problem that the blind hole and the through hole need to be processed twice.

[0006] To achieve the above object, the present invention adopts the following technical solutions:

[0007] The present invention provides a method for manufacturing a blind via plate of a printed circuit board, comprising:

[0008] Inner layer processing → lamination → drilling → copper plating;

[0009] The drilling processing step completes the processing of through holes and blind holes simultaneously in one continuous drilling operation, and integrates the through hole drilling data and the blind hole drilling data into a unified drilling program, wherein the drill sequence corresponding to the blind hole is depth controlled.

[0010] Furthermore, when processing the C-side blind hole plate, the through hole data and the C-side blind hole data are directly merged to keep the drilling directions of the through holes and the blind holes consistent; and when processing the S-side blind hole plate, the C-side through hole data is mirrored to form the S-side drilling direction.

[0011] Furthermore, the through hole drilling data and the blind hole drilling data are integrated into a unified drilling process, including:

[0012] Determine the relative position relationship between through holes and blind holes by analyzing product characteristics;

[0013] Automatically distinguish between through-hole tool paths and blind-hole tool paths;

[0014] Optimize the tool path combination for holes in the same axial direction.

[0015] Furthermore, when processing the C-side blind hole plate, it includes:

[0016] Merge the drilling coordinate sets of through holes / blind holes;

[0017] Identify and distinguish toolpath nodes containing blind hole features;

[0018] Automatically increment tool sequence numbers in merged consecutive programs;

[0019] Write dynamic depth control parameters to the blind hole tool sequence with limited depth.

[0020] Furthermore, when processing the S-side blind hole plate, it includes:

[0021] The drilling vector of the through hole from the C surface to the S surface is converted into the board surface coordinate system and converted into the S surface data format;

[0022] Use the mirror algorithm to process the through-hole coordinate point set;

[0023] Maintain the original coordinate system of the vector path from the S surface of the blind hole to the C surface.

[0024] Furthermore, the drill sequence corresponding to the blind hole is depth controlled, including:

[0025] Define the layered processing depth according to the Z-axis stacking structure of the plate;

[0026] Set the maximum safe travel distance of the blind hole drill;

[0027] Configure chip breaking parameters to manage through hole / blind hole tools differently.

[0028] Furthermore, it also includes:

[0029] Detect the drilling coordinate offset before and after merging;

[0030] Compare the tool collision risk of the two sets of data;

[0031] Verify logical consistency of through / blind via depth parameters.

[0032] Compared with the prior art, the beneficial effects of the present invention are: a method for manufacturing a blind hole plate of a printed circuit board, comprising: inner layer processing → lamination → drilling processing → copper plating processing; the drilling processing step simultaneously completes the processing of through holes and blind holes in one continuous drilling operation, and integrates the through hole drilling data and the blind hole drilling data into a unified drilling program, wherein the drill sequence corresponding to the blind hole is depth-controlled. Through this technical solution, the hole deviation between the primary and secondary drilling caused by the accuracy of different machines and the difference in the upper plate alignment when the machine is changed for secondary drilling is reduced, and the comprehensive hole position accuracy CPK of the through hole and the blind hole is improved (the original process has two machine drills and two data, so there will be two hole position accuracies, but the comprehensive hole position accuracy will be relatively low), thereby reducing equipment requirements and improving production efficiency.

[0033] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0035] Figure 1 Schematic diagram of drilling provided by a specific embodiment of the present invention Figure 1 ;

[0036] Figure 2 Schematic diagram of drilling provided by a specific embodiment of the present invention Figure 2 ;

[0037] Figure 3 Schematic diagram of drilling provided by a specific embodiment of the present invention Figure 3 . DETAILED DESCRIPTION

[0038] The technical solution of the present invention will be clearly and completely described below in conjunction with the specific embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0040] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0041] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0043] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0044] like Figures 1 to 3 As shown, an embodiment of the present invention provides a method for manufacturing a blind via plate of a printed circuit board, comprising the following steps: S10-S40.

[0045] S10, inner layer processing;

[0046] S20, pressing treatment;

[0047] S30, drilling processing, wherein the through hole and the blind hole are processed simultaneously in one continuous drilling operation, and the through hole drilling data and the blind hole drilling data are integrated into a unified drilling program, wherein the drill sequence corresponding to the blind hole is depth-controlled.

[0048] S40, copper plating treatment.

[0049] In one embodiment, when processing a C-side blind hole plate, the through hole data and the C-side blind hole data are directly merged to keep the drilling directions of the through holes and the blind holes consistent; and when processing an S-side blind hole plate, the C-side through hole data is mirrored to form the S-side drilling direction.

[0050] Specifically, when processing the C-side blind hole board, directly merge the through hole data and the C-side blind hole data to keep the drilling directions of the through holes and blind holes consistent. The specific implementation process is as follows:

[0051] First, obtain the design drawings of the printed circuit board, and extract various information about the through holes and C-side blind holes from the drawings, including the hole position coordinates, hole diameter size and other related parameters. For example, in a specific C-side blind hole board design, the through hole diameter is 0.8mm, the number is 50, and it is distributed in a specific area of ​​the circuit board; the C-side blind hole diameter is 0.5mm, the number is 30, and it is located in other areas of the circuit board.

[0052] Next, the extracted through-hole data and C-face blind hole data are input into a specialized drilling program design software. In the software, through specific operation instructions, the two sets of data are selected to be merged. The software will automatically identify and integrate key data such as coordinate information in the two sets of data, making them a unified set of drilling data. For example, in the software interface, by clicking the "Merge Drilling Data" button and selecting the corresponding through-hole data file and C-face blind hole data file, the software can perform the merge operation.

[0053] During the merging process, it is necessary to ensure that the drilling directions of through holes and blind holes are consistent. This means that when setting the drilling parameters, the drilling direction of the drilling equipment is set to start from the C surface. Since the drilling directions of the two sets of data themselves are both from the C surface, after the merger, the drilling equipment can process the through holes and blind holes in sequence in a unified direction when performing the drilling operation. For example, the spindle of the drilling equipment drives the drill to move vertically downward from the C surface, first drilling the first through hole, and then drilling the first blind hole after completion, and so on in sequence until all holes are processed.

[0054] In this way, when processing the C-side blind hole board, the traditional method of processing through hole and blind hole materials separately and the many problems caused by drilling in two different directions are avoided. Its technical effect is remarkable. It not only simplifies the production process and reduces the complexity of material processing, but also effectively improves production efficiency. Since the drilling direction is consistent, the number of equipment adjustments during the processing is reduced, the risk of equipment failure is reduced, and the accuracy of the hole position is improved. The phenomenon of hole deviation caused by inconsistent drilling direction is reduced, thereby improving the overall quality of the printed circuit board.

[0055] When processing the S-side blind hole plate, the C-side through-hole data is mirrored to form the S-side drilling direction. The specific implementation steps are as follows:

[0056] Similarly, extract the C-side through hole data and S-side blind hole data from the design drawings of the printed circuit board. Assume that in the design of an S-side blind hole board, there are 60 C-side through holes with a hole diameter of 1.0mm, and 40 S-side blind holes with a hole diameter of 0.6mm.

[0057] For C-side through-hole data, use professional graphics processing software or drilling program design software with corresponding functions to perform mirror flipping operations. In the software, select the graphics or data files corresponding to the C-side through-hole data that needs to be flipped through specific functional modules. For example, in the software operation interface, find the "Mirror Flip" function option, then select the C-side through-hole data, and set the flipped symmetry axis to be perpendicular to the axis of the S-side of the circuit board. According to the settings, the software will calculate and convert the coordinate information in the C-side through-hole data, and change the original drilling direction from the C-side to the S-side to the S-side from the S-side, so as to obtain data consistent with the drilling direction of the S-side blind hole data.

[0058] After the C-side through-hole data is mirror-flipped, it is merged with the S-side blind hole data. Just like the operation of merging data when processing the C-side blind hole board, these two sets of data are input into the drilling program design software, and they are integrated into a unified drilling data through the software's merging function. In the merged data, the drilling equipment can drill the through holes and blind holes in sequence in a unified direction from the S-side to the C-side. For example, starting from the S-side, the drilling equipment drills the first through hole after the mirror-flipping according to the hole position sequence in the merged data, and then drills the first S-side blind hole, and so on, to complete the drilling work of the entire S-side blind hole board.

[0059] This method for making S-side blind hole boards solves the problem of multiple adjustments of equipment parameters and drilling directions due to the different drilling directions of through holes and blind holes in traditional processes. The technical effect is obvious. Through mirror flipping and data merging, the drilling process is smoother and more efficient, which reduces the equipment adjustment time in the production process and improves production efficiency. At the same time, the unified drilling direction reduces the hole position deviation that may be caused by direction conversion, improves the hole position accuracy, ensures the quality stability of printed circuit boards, and provides reliable protection for subsequent circuit connections and electronic product performance.

[0060] In one embodiment, through hole drilling data and blind hole drilling data are integrated into a unified drilling program, including: determining the relative position relationship between the through hole and the blind hole by analyzing product characteristics; automatically distinguishing between the through hole tool path and the blind hole tool path; and optimizing the tool path combination for the hole positions in the same axial direction.

[0061] In the process of manufacturing printed circuit boards, product features contain a wealth of information, such as the size of the circuit board, functional layout, electrical connection requirements, etc. First, extract relevant data from the design file of the printed circuit board, which is usually in CAD (computer-aided design) format and contains the precise position coordinate information of through holes and blind holes. For example, in a printed circuit board design file for a smartphone motherboard, the locations of various through holes and blind holes are clearly marked. Through specialized data parsing software, the coordinate data in the design file is read and the coordinate information of the through holes and blind holes is extracted separately.

[0062] Take a certain area as an example. There is a through hole with coordinates (X1, Y1) and multiple blind holes around it, one of which has coordinates (X2, Y2). Their relative positional relationship is determined by calculating the distance difference between the two in the X-axis and Y-axis directions, that is, ΔX=X2-X1, ΔY=Y2-Y1. At the same time, considering the functional partitioning of the circuit board, if the area is responsible for signal processing, the relative position of the through hole and the blind hole must also meet the rationality of the electrical connection and avoid signal interference and other problems. In this way, the relative positional relationship between the through hole and the blind hole on the entire circuit board can be comprehensively and accurately analyzed to provide basic data for subsequent tool path planning.

[0063] After determining the relative position relationship between through holes and blind holes, advanced drilling programming software is used to automatically distinguish their tool paths. Tool paths can be planned based on the extracted hole feature information, such as hole size, hole type (through hole or blind hole), and relative position. For example, for a through hole with a hole diameter of 0.8mm, the software will plan a straight line tool path starting from the drilling starting point based on its position information, so that the drill can accurately drill a through hole along the path until it penetrates the circuit board. For a blind hole with a hole diameter of 0.5mm, a tool path that stops after reaching the specified depth will be planned based on its depth requirements (such as the blind hole depth of 1.5mm).

[0064] By identifying the hole type label (through holes and blind holes are clearly identified in the design file), the tool paths are automatically divided into two categories: through hole tool paths and blind hole tool paths.

[0065] After the distinction between through-hole and blind-hole tool paths is completed, the tool paths are further optimized for the holes in the same axial direction. Taking the vertical axial direction as an example, assuming that there are multiple through-holes and blind holes in this direction, the software will optimize the tool path according to the arrangement order and distance of the holes. For example, there are three through-holes A, B, C and two blind holes D and E arranged in sequence in the vertical direction. The software will calculate the shortest path from the starting point to each hole position to avoid unnecessary empty strokes and circuitous movements of the drill during the drilling process.

[0066] In one embodiment, when processing a C-side blind hole plate, the process includes: merging the drilling coordinate sets of through holes / blind holes; identifying and distinguishing tool path nodes containing blind hole features; automatically incrementing tool sequence numbers in the merged continuous program; and dynamically writing depth control parameters to the tool sequence of a blind hole with a limited depth.

[0067] When processing C-side blind via boards, the first step is to obtain the drilling coordinate information of through holes and blind holes in the PCB design file. These coordinate information are usually stored in the design file in a digital form, such as the common Gerber file format. Professional PCB design software or specialized data extraction tools can read the file and separate the coordinate sets of through holes and blind holes from it.

[0068] After completing the merging of the coordinate sets, the tool path nodes need to be identified and distinguished so that the drilling equipment can accurately identify which nodes correspond to the processing of blind holes.

[0069] In actual operation, the software can use a variety of methods to identify, such as adding a special "hole type" field in the properties of the tool path node, and setting the value of this field to "blind hole" for the blind hole node; or in the visual interface, displaying the tool path node of the blind hole feature with a specific color (such as red) or shape (such as circle).

[0070] In order for the drilling equipment to process through holes and blind holes in the correct order, it is necessary to automatically assign an increasing tool sequence number to each tool path node in the merged continuous program. In the drilling programming software, an automatic numbering function module is built in. When the coordinate set is merged and the tool path node identification of the blind hole feature is distinguished, the software will assign a unique tool sequence number to each node starting from 1 according to the order of the nodes in the coordinate set.

[0071] When drilling blind holes, the drilling depth needs to be precisely controlled to meet the design requirements. For the tool path nodes that identify the blind hole features, the dynamic depth control parameters are written in the drilling programming software by writing specific codes.

[0072] In one embodiment, when processing an S-surface blind hole plate, the process includes: converting the drilling vector of a through hole from a C-surface to an S-surface into a plate surface coordinate system and converting it into an S-surface data format; processing the through hole coordinate point set using a mirror algorithm; and maintaining the original coordinate system of the vector path of the blind hole drilled from the S-surface to the C-surface.

[0073] Specifically, in the design of printed circuit boards, the default coordinate system usually defines the drilling vector direction of the through hole based on the C surface, that is, drilling from the C surface to the S surface. However, when processing the S-surface blind hole board, in order to unify the drilling direction, the drilling vector needs to be converted to a coordinate system based on the S surface. This conversion process is achieved with the help of professional circuit board design and data processing software.

[0074] For example, in the original design file, the drilling vector of a through hole is defined as drilling from the coordinate point (Xc1, Yc1) on the C surface to the coordinate point (Xs1, Ys1) on the S surface. The corresponding drilling vector is expressed as Vc = (Xs1-Xc1, Ys1-Yc1) in the C surface coordinate system. During the conversion process, the software first reads the relevant information of the through hole, and then converts the coordinate values ​​in the C surface coordinate system to the coordinate values ​​in the S surface coordinate system according to the board surface coordinate system conversion rules. Assuming that the offset of the origin of the S surface coordinate system relative to the origin of the C surface coordinate system in the Z axis direction is Dz, then in the S surface coordinate system, the coordinates of the starting point of the through hole become (Xs1', Ys1') = (Xc1, Yc1 + Dz), and the coordinates of the end point become (Xs2', Ys2') = (Xs1, Ys1 + Dz). The converted drilling vector Vs = (Xs2'-Xs1', Ys2'-Ys1'). Through such conversion, the drilling vectors of all through holes drilled from the C surface to the S surface are converted into a data format based on the S surface, preparing for the subsequent integration with blind hole data and drilling operations.

[0075] After completing the coordinate system conversion, it is necessary to use the mirror algorithm to process the through hole coordinate point set so that the drilling direction of the through hole is consistent with the direction of the blind hole from the S surface to the C surface.

[0076] After the coordinate system conversion, a set of through-hole coordinate points {(Xs1', Ys1'), (Xs2', Ys2'), ..., (Xsn', Ysn')} is obtained. Select the through-hole coordinate point set and call the mirror algorithm. The axis perpendicular to the S surface and passing through the center of the circuit board is used as the mirror symmetry axis, and the software calculates each coordinate point according to the mirror algorithm. For the coordinate point (Xsi', Ysi'), the coordinates of the mirror point on the other side of the mirror symmetry axis (Xsi", Ysi") are calculated, where Xsi" = -Xsi' (assuming that the circuit board is symmetrical about the central axis in the X direction), and Ysi" = Ysi' (keeping the Y direction coordinate unchanged). After the mirror algorithm is processed, the original through-hole coordinate point set drilled from the C surface to the S surface is transformed into the coordinate point set drilled from the S surface to the C surface {(Xs1", Ys1"), (Xs2", Ys2"), ..., (Xsn", Ysn")}. In this way, the drilling directions of through holes and blind holes are unified at the data level, making it easier to integrate them into a unified drilling program later.

[0077] The design of the blind hole itself is to drill from the S surface to the C surface, and its coordinate information and vector path are defined based on the S surface in the original design file. Therefore, during the entire process of processing the S-surface blind hole plate, there is no need to make additional adjustments to the original coordinate system of the blind hole's S-surface drilling to C-surface vector path.

[0078] In one embodiment, the drill sequence corresponding to the blind hole is depth controlled, including: defining the layered processing depth according to the Z-axis stacking structure of the plate; setting the maximum safe travel distance of the blind hole drill; and configuring chip breaking parameters to differentially manage through hole / blind hole tools.

[0079] Specifically, in the production of printed circuit boards, different types of boards have different Z-axis stacking structures. For example, a common multi-layer printed circuit board is made up of insulating layers, copper foil layers, etc. stacked alternately. When processing blind holes, it is necessary to define the layered processing depth according to the Z-axis stacking structure of the board to ensure that the blind hole can be accurately drilled to the target position without damaging other layers.

[0080] Suppose we are processing a four-layer S-side blind hole board, and its Z-axis stacking structure starting from the S-side is: solder mask layer, top copper foil, insulation layer, inner copper foil, insulation layer, bottom copper foil, solder mask layer. First, by analyzing the board structure and the requirements for the blind hole depth in the design file, determine the number of layers and specific depth that the blind hole needs to penetrate. For example, the design requires the blind hole depth to reach the second layer of copper foil and cannot penetrate. In professional drilling programming software, set the layered processing depth according to the physical parameters and design requirements of the board. The software will calculate the depth range of each layer of processing based on the thickness information of each layer of material, such as the solder mask thickness is 0.05mm, the copper foil thickness is 0.035mm, the insulation layer thickness is 0.15mm, etc. For the blind hole in this example, the processing depth of the first layer (solder mask and top copper foil) may be set to 0.085mm, and the processing depth of the second layer (insulation layer) may be set to 0.15mm. The drill stops when it reaches a total depth of 0.235mm to ensure that the blind hole reaches the target position, which not only meets the design depth requirements but also avoids damage to other layers caused by excessive drilling.

[0081] In order to prevent the drill from over-traveling during blind hole processing due to unexpected circumstances (such as equipment failure, program error, etc.), resulting in drilling through the circuit board or damaging the equipment, it is necessary to set the maximum safe travel distance of the blind hole drill. This setting is based on a comprehensive consideration of the board thickness, blind hole design depth, and equipment performance.

[0082] Continuing with the above four-layer S-surface blind hole board as an example, it is known that the total thickness of the board is 1.6mm, and the design depth of the blind hole is 0.5mm (starting from the S surface). In the control system of the drilling equipment, the maximum safe travel distance of the blind hole drill is set according to these parameters. Taking into account a certain safety margin, assuming that the safety margin is set to 0.1mm, the maximum safe travel distance is set to 0.6mm. When the drilling equipment is performing a blind hole processing task, the equipment's sensor will monitor the travel distance of the drill in real time. Once the drill travel distance reaches 0.6mm, regardless of whether the blind hole processing is completed at this time, the equipment will immediately stop the feed movement of the drill, thereby effectively avoiding excessive travel of the drill due to various abnormal conditions, protecting the circuit board and drilling equipment, and improving the safety and stability of the production process.

[0083] Since the chip discharge and tool wear are different during the processing of through holes and blind holes, it is necessary to configure chip breaking parameters to manage through hole / blind hole tools differently. For blind hole processing, it is relatively difficult to discharge chips in the hole, which easily causes chip accumulation, affecting the drilling quality and tool life; while in through hole processing, chips can be discharged from both ends of the hole, which is relatively better.

[0084] In the parameter setting interface of the drilling equipment, different chip breaking parameters are set for blind hole tools and through hole tools. For example, for blind hole tools, adjust the tool speed, feed speed, flow rate and pressure of the cutting fluid to optimize the chip breaking effect. Set the speed of the blind hole tool to 12000 rpm, the feed speed to 0.08mm / rev, and the cutting fluid flow rate to 15L / min. Through this combination of parameters, the chips can be broken in time during the formation process and discharged smoothly from the blind hole. For through hole tools, considering that the chip discharge is relatively easy, set the speed to 10000 rpm, the feed speed to 0.1mm / rev, and the cutting fluid flow rate to 10L / min. Through such differentiated chip breaking parameter configuration, the processing quality of blind holes and through holes can be effectively improved, tool wear can be reduced, tool life can be extended, and production costs can be reduced.

[0085] In one embodiment, the method for manufacturing a blind hole plate of a printed circuit board further includes: detecting the drilling coordinate offset before and after merging; comparing the tool collision risk of two sets of data; and verifying the logical consistency of through hole / blind hole depth parameters.

[0086] Specifically, in the process of blind via board manufacturing for printed circuit boards, it is crucial to detect the coordinate offset after the drilling data of through holes and blind holes are merged. First, before merging the drilling data, accurate drilling coordinate information is extracted from the original through hole and blind hole design files. For example, in a printed circuit board design, the through hole coordinate set is {(X1, Y1), (X2, Y2), …, (Xn, Yn)}, and the blind hole coordinate set is {(Xm1, Ym1), (Xm2, Ym2), …, (Xmk, Ymk)}. These coordinate information are usually stored in the design file in digital form and can be read by professional circuit board design software or data extraction tools.

[0087] Before merging the through hole and blind hole drilling data, it is necessary to compare the collision risks that may be caused by the tool paths in the two sets of data. First, use professional drilling simulation software to import the drilling data of through holes and blind holes into the software separately. These data contain tool path information, such as the starting position of the tool, the direction of travel, the drilling sequence, etc.

[0088] In the production of blind vias for printed circuit boards, it is critical to ensure the logical consistency of the through-hole and blind-hole depth parameters. First, obtain the through-hole and blind-hole depth requirements and related board structure information from the design file. For example, for a multi-layer board structure, the total thickness of the board is known to be 2mm, the design requires that some through holes must completely penetrate the board, and the blind hole depth is 0.8mm, and the blind hole needs to terminate at a specific inner layer copper foil.

[0089] In summary, the present invention reduces the hole deviation between the primary and secondary drilling caused by the difference in the accuracy of different machines and the upper plate alignment when changing machines for secondary drilling, and improves the comprehensive hole position accuracy CPK of through holes and blind holes (the original process has two hole position accuracies due to two machine drills and two materials, but the comprehensive hole position accuracy will be relatively low), thereby reducing equipment requirements and improving production efficiency.

[0090] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A method for manufacturing a blind via plate of a printed circuit board, characterized in that: include: Inner layer processing → lamination → drilling → copper plating; The drilling processing step completes the processing of through holes and blind holes simultaneously in one continuous drilling operation, and integrates the through hole drilling data and the blind hole drilling data into a unified drilling program, wherein the drill sequence corresponding to the blind hole is depth controlled.

2. A method for manufacturing a blind via plate of a printed circuit board according to claim 1, characterized in that: When processing the C-side blind hole board, directly merge the through hole data and the C-side blind hole data to keep the drilling directions of the through holes and blind holes consistent; and when processing the S-side blind hole board, mirror-flip the C-side through hole data to form the S-side drilling direction.

3. A method for manufacturing a blind via plate of a printed circuit board according to claim 1, characterized in that: Integrate through-hole drilling data and blind-hole drilling data into a unified drilling process, including: Determine the relative position relationship between through holes and blind holes by analyzing product characteristics; Automatically distinguish between through-hole tool paths and blind-hole tool paths; Optimize the tool path combination for holes in the same axial direction.

4. A method for manufacturing a blind via plate of a printed circuit board according to claim 2, characterized in that: When processing C-side blind hole plate, including: Merge the drilling coordinate sets of through holes / blind holes; Identify and distinguish toolpath nodes containing blind hole features; Automatically increment tool sequence numbers in merged consecutive programs; Write dynamic depth control parameters to the blind hole tool sequence with limited depth.

5. A method for manufacturing a blind via plate of a printed circuit board according to claim 2, characterized in that: When processing S-side blind hole plate, including: The drilling vector of the through hole from the C surface to the S surface is converted into the board surface coordinate system and converted into the S surface data format; Use the mirror algorithm to process the through-hole coordinate point set; Maintain the original coordinate system of the vector path from the S surface of the blind hole to the C surface.

6. A method for manufacturing a blind via plate of a printed circuit board according to claim 1, characterized in that: The drill sequence corresponding to the blind hole is used to control the depth, including: Define the layered processing depth according to the Z-axis stacking structure of the plate; Set the maximum safe travel distance of the blind hole drill; Configure chip breaking parameters to manage through hole / blind hole tools differently.

7. A method for manufacturing a blind via plate for a printed circuit board according to claim 1, characterized in that: Also includes: Detect the drilling coordinate offset before and after merging; Compare the tool collision risk of the two sets of data; Verify logical consistency of through / blind via depth parameters.

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