A cooling device for circuit board processing

Abstract

The present invention relates to the technical field of circuit board processing, and specifically discloses a cooling device for circuit board processing, including a reflow soldering machine, and further including: a conveying mechanism, the conveying mechanism is arranged in the reflow soldering machine, and the conveying mechanism is used for conveying circuit boards. The present invention has at least the following beneficial effects: By setting the conveying mechanism and the weighing and positioning mechanism, when performing reflow soldering processing on circuit boards of the same batch model, the weighing and positioning mechanism can be adaptively adjusted to clamp and fix the circuit boards. In this way, the position of the circuit boards can be guaranteed, the stability can be improved. After the fixing work of the circuit boards is completed, the weight can be lowered according to the weight of the circuit boards to obtain the weight data of the circuit boards. By setting the power adjustment mechanism, the resistance value in the power adjustment mechanism can be timely adjusted according to the change of the height position of the weighing structure in the weighing and positioning mechanism.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and particularly to a cooling device for circuit board processing. Background Art

[0002] During soldering processes such as reflow soldering of circuit boards, a large amount of heat is generated, and this heat may affect the electrical performance. Therefore, the cooling process is crucial for the quality of solder joints. An appropriate cooling rate can ensure the formation of good solder joints and avoid problems such as poor soldering and unstable quality.

[0003] When the existing circuits are undergoing reflow soldering, a reflow soldering machine is used for soldering and cooling processing. Mainly, the circuit board is placed on the conveyor belt of the B-type mesh belt of the reflow soldering machine and conveyed. Through the preheating zone, heat preservation zone, soldering zone, and cooling zone of the reflow soldering machine, the solder is melted by the heat source, and the heat is transferred to the circuit board and components through the circulating flow of gas, thereby achieving soldering. Finally, the cooling is completed when passing through the cooling zone. During this conveying process, the circuit board is directly placed on the B-type mesh belt. This placement method cannot ensure the stability of the circuit board's position, and the circuit boards have various models. When the B-type mesh belt conveys circuit boards of different sizes, due to the different weights of the circuit boards and the influence of the conveying speed, different inertial forces will be generated, which will affect the position of the solder on the circuit board and then affect the soldering quality. Therefore, we propose a cooling device for circuit board processing. Summary of the Invention

[0004] The purpose of the present invention is to provide a cooling device for circuit board processing to solve the problems mentioned in the above background art, that is, the circuit board is directly placed on the B-type mesh belt. This placement method cannot ensure the stability of the circuit board's position, and the circuit boards have various models. When the B-type mesh belt conveys circuit boards of different sizes, due to the different weights of the circuit boards and the influence of the conveying speed, different inertial forces will be generated, which will affect the position of the solder on the circuit board and then affect the soldering quality.

[0005] To achieve the above purpose, the present invention provides the following technical solution: A cooling device for circuit board processing, including: a reflow soldering machine,

[0006] It further includes: a conveying mechanism, which is arranged in the reflow soldering machine and is used for conveying the circuit board;

[0007] A weighing and positioning mechanism, which is arranged on the conveying mechanism, and the number of the weighing and positioning mechanisms is multiple, and it clamps and weighs the circuit boards according to different model sizes;

[0008] The power adjustment mechanism is arranged inside the reflow soldering machine. The power adjustment mechanism adjusts the conveying power of the conveying mechanism according to the weight weighed by the weighing and positioning mechanism.

[0009] Among them, the conveying mechanism includes two conveying rollers rotatably connected to the inside of the reflow soldering machine. A V-shaped mesh belt is arranged on the outer sides of the two conveying rollers. A motor is fixedly connected to the inside of the reflow soldering machine, and the output end of the motor is fixedly connected to one end of one of the conveying rollers.

[0010] Among them, the weighing and positioning mechanism includes a plurality of load-bearing plates fixedly connected to the outer side of the V-shaped mesh belt. A weighing plate is slidably connected inside each load-bearing plate, and a first spring is fixedly connected to the bottom of the weighing plate and located inside the load-bearing plate.

[0011] Among them, a plurality of placement boxes are slidably connected to one side of the weighing plate. A rotating pull plate is rotatably connected to one side of each placement box, and a buckle is fixedly connected to one side of the placement box.

[0012] Among them, a first rotating shaft is rotatably connected to the inside of the placement box. A winding wheel is fixedly connected to the outer side of the first rotating shaft. A steel wire is fixedly connected between the winding wheel and the rotating pull plate. A torsion spring is fixedly connected between one side of the winding wheel and the inner side of the placement box. A limiting sleeve is fixedly connected to the inner side of the placement box and located outside the steel wire.

[0013] Among them, two first gears are fixedly connected to the outer side of the first rotating shaft. First racks are meshed and connected to both sides of the two first gears. A clamping and limiting plate is fixedly connected to one side of the first rack. A second spring is fixedly connected to one side of the clamping and limiting plate, and the side of the second spring away from the clamping and limiting plate is fixedly connected to the placement box.

[0014] Among them, two first limiting hollow plates are slidably connected inside the weighing plate. A first limiting telescopic rod is fixedly connected to one side of the two first limiting hollow plates. A contact plate is fixedly connected to one side of the first limiting telescopic rod. A third spring is sleeved outside the first limiting telescopic rod and between the contact plate and the first limiting hollow plate. Two fixed blocks are fixedly connected inside the weighing plate. A second gear is rotatably connected between the two fixed blocks. A second rack is meshed with the bottom of the second gear. Second limiting telescopic rods are fixedly connected between both sides of the second rack and the inner side of the weighing plate. A third rack is fixedly connected to the bottom of the placement box. The third rack is meshed with the second gear. Fourth springs are fixedly connected to both sides of the third rack. A limiting block is fixedly connected to one side of the two fourth springs away from the third rack. A rotating plate is rotatably connected to one side of the limiting block. One end of the rotating plate away from the limiting block is rotatably connected to a second limiting hollow plate. The second limiting hollow plate is slidably connected to the weighing plate. A second rotating shaft is rotatably connected inside the placement box. Pulley wheels are fixedly connected to the bottom of one of the first gears and the outside of the second rotating shaft. A belt is arranged outside the two pulley wheels. A fixed disk is fixedly connected to one end of the second rotating shaft. A driving column is fixedly connected to one side of the fixed disk and inside the second limiting hollow plate.

[0015] Among them, two chutes are opened inside the first rotating shaft. One-way angle blocks are slidably connected to the inner walls of the two chutes. A fifth spring is fixedly connected to one side of the one-way angle block.

[0016] Among them, adjusting plates are fixedly connected to one side of several placement boxes. L-shaped fixing plates are fixedly connected to the top and bottom of several adjusting plates. A fixing rod is fixedly connected between the two L-shaped fixing plates. A limiting tail plate is slidably connected to the outside of the two fixing rods. Sixth springs are sleeved outside the two fixing rods and at the top and bottom of the limiting tail plate. A plurality of weight spacing plates are fixedly connected to the inner side of the reflow soldering machine.

[0017] Among them, the power adjustment mechanism includes a placement groove opened inside the reflow soldering machine. A sliding rheostat is fixedly connected to the inner wall of the placement groove. A limiting connection block is fixedly connected to one side of the sliding piece inside the sliding rheostat. The limiting connection block is slidably connected to the reflow soldering machine. A track block is fixedly connected to one side of the limiting connection block away from the sliding rheostat.

[0018] The present invention at least has the following beneficial effects:

[0019] By setting up a conveying mechanism and a weighing and positioning mechanism, during the reflow soldering process of circuit boards of the same batch model, the weighing and positioning mechanism can be used for adaptive adjustment to clamp and fix the circuit board. In this way, the position of the circuit board can be guaranteed, and the stability can be improved. After the circuit board is fixed, the weighing can be carried out by moving down according to the weight of the circuit board, and then the weight data of the circuit board can be obtained. By setting up a power adjustment mechanism, the resistance value in the power adjustment mechanism can be adjusted in a timely manner according to the change in the height position of the weighing structure in the weighing and positioning mechanism. Through the power adjustment mechanism, the conveying power of the conveying mechanism can be adjusted to a value corresponding to the weight of the circuit board weighed in the weighing and positioning mechanism. In this way, when carrying out the reflow soldering process on circuit boards of different models and the same batch, the conveying speed can be adjusted according to the actual weight of the circuit board, so as to ensure the stability of the solder position on the circuit board, and further ensure the welding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 is a schematic diagram of the overall structure of the present invention after being opened;

[0022] Figure 3 is a schematic front view of the interior of the conveying mechanism of the present invention;

[0023] Figure 4 is a schematic rear view of the interior of the conveying mechanism of the present invention;

[0024] Figure 5 For the present invention Figure 4 is an enlarged schematic diagram of part A in;

[0025] Figure 6 is a schematic diagram of the weighing and positioning mechanism of the present invention;

[0026] Figure 7 For the present invention Figure 6 is an enlarged schematic diagram of part B in;

[0027] Figure 8 is a schematic diagram of the internal structure of the load-bearing plate and the placement box of the present invention;

[0028] Figure 9 is a schematic diagram of the weighing and positioning mechanism of the present invention;

[0029] Figure 10 is a schematic diagram of the upper part structure of the weighing and positioning mechanism of the present invention;

[0030] Figure 11 is a schematic diagram of the lower part structure of the weighing and positioning mechanism of the present invention;

[0031] Figure 12 Schematic diagram of the internal structure of the first rotating shaft of the present invention;

[0032] Figure 13 Schematic diagram of the structure of the limit connection block and the track block of the present invention.

[0033] In the figure: 1, reflow soldering machine; 2, conveying mechanism; 21, motor; 22, conveying roller; 23, type B mesh belt; 3, weighing and positioning mechanism; 31, load-bearing plate; 32, weighing plate; 33, first spring; 34, placement box; 35, first rotating shaft; 36, torsion spring; 37, winding wheel; 38, steel wire; 39, limiting sleeve; 310, first gear; 311, first rack; 312, clamping and limiting plate; 313, second spring; 314, first limiting hollow plate; 315, first limiting telescopic rod; 316, contact disc; 317, third spring; 318, fixed block; 319, second gear; 320, second rack; 321, second limiting telescopic rod; 322, third rack; 323, fourth spring; 324, limiting block; 325, second limiting hollow plate; 326, rotating plate; 327, second rotating shaft; 328, pulley; 329, fixed disc; 330, driving column; 331, chute; 332, one-way angle block; 333, fifth spring; 334, buckle; 335, rotating pull plate; 336, adjusting plate; 337, L-shaped fixing plate; 338, fixing rod; 339, limiting tail plate; 340, sixth spring; 341, weight and distance fixing plate; 4, power adjustment mechanism; 41, placement groove; 42, sliding rheostat; 43, limit connection block; 44, track block. Specific embodiments

[0034] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0035] Embodiment 1

[0036] Please refer to Figures 1 to 13 , the present invention provides a technical solution: a cooling device for circuit board processing, including: a reflow soldering machine 1,

[0037] It further includes: a conveying mechanism 2, the conveying mechanism 2 is arranged in the reflow soldering machine 1, and the conveying mechanism 2 is used for conveying circuit boards;

[0038] A weighing and positioning mechanism 3, the weighing and positioning mechanism 3 is arranged on the conveying mechanism 2, and the number of the weighing and positioning mechanisms 3 is multiple, and it clamps and weighs circuit boards according to different model sizes;

[0039] A power adjustment mechanism 4 is provided inside the reflow soldering machine 1. The power adjustment mechanism 4 adjusts the conveying power of the conveying mechanism 2 according to the weight weighed by the weighing and positioning mechanism 3.

[0040] By providing the conveying mechanism 2 and the weighing and positioning mechanism 3 as described above, when performing reflow soldering on circuit boards of the same batch model, the weighing and positioning mechanism 3 can perform adaptive adjustment to clamp and fix the circuit boards. In this way, the stability of the position of the circuit boards can be guaranteed. After the circuit boards are fixed, the weighing can be performed by moving downward according to the weight of the circuit boards, and then the weight data of the circuit boards can be obtained. By providing the power adjustment mechanism 4, the resistance value inside the power adjustment mechanism 4 can be adjusted in a timely manner according to the change in the height position of the weighing structure inside the weighing and positioning mechanism 3. Through the power adjustment mechanism 4, the conveying power of the conveying mechanism 2 can be adjusted to a value corresponding to the weight of the circuit boards weighed inside the weighing and positioning mechanism 3. In this way, when performing reflow soldering on circuit boards of different models and the same batch processing, the conveying speed can be adjusted according to the actual weight of the circuit boards, thus ensuring the stability of the solder position on the circuit boards and further guaranteeing the welding quality.

[0041] The conveying mechanism 2 includes two conveying rollers 22 rotatably connected to the inside of the reflow soldering machine 1. A V-shaped mesh belt 23 is arranged on the outer sides of the two conveying rollers 22. A motor 21 is fixedly connected to the inside of the reflow soldering machine 1, and the output end of the motor 21 is fixedly connected to one end of one of the conveying rollers 22;

[0042] During use, controlling the motor 21 to operate can rotate one of the conveying rollers 22, and one of the rotating conveying rollers 22 can drive the other conveying roller 22 through the V-shaped mesh belt 23. When the operating power of the motor 21 is adjusted, the output power corresponding to the circuit boards of the same batch processing can be adjusted.

[0043] The weighing and positioning mechanism 3 includes a plurality of load-bearing plates 31 fixedly connected to the outer side of the V-shaped mesh belt 23. A weighing plate 32 is slidably connected to the inside of each load-bearing plate 31, and a first spring 33 is fixedly connected to the bottom of the weighing plate 32 and located inside the load-bearing plate 31;

[0044] During use, when the circuit board is placed on the weighing plate 32, the height position of the weighing plate 32 begins to move downward due to the change in weight, causing the weighing plate 32 to slide downward inside the load-bearing plate 31 and compress the first spring 33.

[0045] A plurality of placement boxes 34 are slidably connected to one side of the weighing plate 32. A rotating pull plate 335 is rotatably connected to one side of each placement box 34, and a buckle 334 is fixedly connected to one side of the placement box 34;

[0046] During use, when it is necessary to clamp and fix the circuit board, pull the rotating pull plate 335 to make the rotating pull plate 335 disengage from the buckle 334, and then move the position of the clamping mechanism. Then place the circuit board in the clamping mechanism, and then reset the rotating pull plate 335 to complete the clamping and fixing of the circuit board. The position of the rotating pull plate 335 can be locked by the buckle 334.

[0047] A first rotating shaft 35 is rotatably connected inside the placement box 34. A winding wheel 37 is fixedly connected to the outer side of the first rotating shaft 35. A steel wire 38 is fixedly connected between the winding wheel 37 and the rotating pull plate 335. A torsion spring 36 is fixedly connected between one side of the winding wheel 37 and the inner side of the placement box 34. A limiting sleeve 39 is fixedly connected to the inner side of the placement box 34 and located outside the steel wire 38.

[0048] During use, when the rotating pull plate 335 pulls the steel wire 38, the outer side of the winding wheel 37 that winds the steel wire 38 is driven, and the rotating winding wheel 37 twists the torsion spring 36. When the rotating pull plate 335 is reset, under the action of the torsion spring 36, the winding wheel 37 is driven to wind the steel wire 38.

[0049] Two first gears 310 are fixedly connected to the outer side of the first rotating shaft 35. The two sides of the two first gears 310 are meshed with first racks 311. One side of the first rack 311 is fixedly connected to a clamping limiting plate 312. One side of the clamping limiting plate 312 is fixedly connected to a second spring 313. The side of the second spring 313 away from the clamping limiting plate 312 is fixedly connected to the placement box 34.

[0050] During use, when the winding wheel 37 is pulled, it drives the first rotating shaft 35 to rotate, so that the first rotating shaft 35 drives the two first gears 310 to rotate. The two first gears 310 both drive the two first racks 311 corresponding to their two sides. The clamping limiting plate 312 can be driven to separate through the first rack 311. Under the spring force of the second spring 313, it is convenient to clamp and fix the circuit. When the winding wheel 37 rotates in the reverse direction and resets, it can drive the clamping limiting plate 312 to clamp and fix the circuit board.

[0051] There are two first limit hollow plates 314 slidably connected inside the weighing plate 32. One side of the two first limit hollow plates 314 is fixedly connected with a first limit telescopic rod 315. One side of the first limit telescopic rod 315 is fixedly connected with a contact disc 316. A third spring 317 is sleeved outside the first limit telescopic rod 315 and between the contact disc 316 and the first limit hollow plate 314. There are two fixed blocks 318 fixedly connected inside the weighing plate 32. A second gear 319 is rotatably connected between the two fixed blocks 318. The bottom of the second gear 319 is meshed with a second rack 320. Second limit telescopic rods 321 are fixedly connected between both sides of the second rack 320 and the inner side of the weighing plate 32. The bottom of the placement box 34 is fixedly connected with a third rack 322. The third rack 322 is meshed with the second gear 319. Fourth springs 323 are fixedly connected to both sides of the third rack 322. One side of the two fourth springs 323 away from the third rack 322 is fixedly connected with a limit block 324. One side of the limit block 324 is rotatably connected with a rotating plate 326. One end of the rotating plate 326 away from the limit block 324 is rotatably connected with a second limit hollow plate 325. The second limit hollow plate 325 is slidably connected with the weighing plate 32. A second rotating shaft 327 is rotatably connected inside the placement box 34. Pulley wheels 328 are fixedly connected to the bottom of one of the first gears 310 and the outside of the second rotating shaft 327. A belt is arranged outside the two pulley wheels 328. One end of the second rotating shaft 327 is fixedly connected with a fixed disc 329. A driving column 330 is fixedly connected inside the second limit hollow plate 325 on one side of the fixed disc 329;

[0052] During use, the driving rods provided at the bottoms of two of the clamping and limiting plates 312 can move the first limiting hollow plate 314 when clamping the circuit board. In this way, the first limiting hollow plate 314 can be driven to the corresponding position according to the clamping position of the width of the circuit board. The moved first limiting hollow plate 314 presses the contact disc 316 through the third spring 317. Furthermore, the pressing force of the contact disc 316 against the second gear 319 can be adjusted according to the widths of different models of the circuit board. When clamping the length of the circuit board, through the pulley 328 fixedly connected to the bottom of the upper first gear 310, the two first gears 310 adaptively adjust the rotational angular positions, and the fixed disc 329 at the bottom of the second rotating shaft 327 can be driven to within the corresponding range of a quarter-circle angle. In this way, the driving column 330 on one side of the fixed disc 329 drives the second limiting hollow plate 325 to move, so that the moved second limiting hollow plate 325 pushes the limiting block 324 to move through the two rotating plates 326. The moving positions of the two limiting blocks 324 reflect the corresponding length of the circuit board. Furthermore, the fourth spring 323 is compressed by the moving limiting block 324, and the reaction force exerted on the third rack 322 by the compressed fourth spring 323 can adjust the inertial damping force corresponding to different models of the circuit board when the third rack 322 is subjected to inertial force. When the inertial force generated by the movement of the circuit board above the placement box 34 drives the third rack 322 to move, the third rack 322 drives the second gear 319, and the corresponding resistance is exerted by the fourth spring 323 and the third spring 317, which can ensure the stability of the position of the circuit board.

[0053] Embodiment 2

[0054] Two chutes 331 are provided inside the first rotating shaft 35, and one-way angle blocks 332 are slidably connected to the inner walls of the two chutes 331. A fifth spring 333 is fixedly connected to one side of the one-way angle block 332;

[0055] During use, when clamping the circuit board, under the one-way driving action of the one-way angle block 332, the first rotating shaft 35 can be driven to rotate, which is convenient for clamping different models of circuit boards. According to the length and width of the circuit board, under the action of the one-way angle block 332 in the other direction, the two first gears 310 can be adaptively rotated, and the corresponding clamping positions can be adjusted according to the length and width of the circuit board. Moreover, a plurality of one-way angle grooves corresponding to the one-way angle block 332 are provided inside the first gear 310.

[0056] One side of several placement boxes 34 is fixedly connected with an adjustment plate 336, and the top and bottom of several adjustment plates 336 are fixedly connected with an L-shaped fixing plate 337, a fixing rod 338 is fixedly connected between two L-shaped fixing plates 337, and the outer sides of the two fixing rods 338 are slidably connected with a limit tail plate 339, and the outer sides of the fixing rods 338 and the top and bottom of the limit tail plate 339 are sleeved with a sixth spring 340, and the inner side of the reflow soldering machine 1 is fixedly connected with a plurality of weight distance plates 341;

[0057] When in use, after the circuit board is placed on top of the placement box 34, the placement box 34 is moved down, and the adjustment plate 336 arranged on one side of the placement box 34 is not provided with a limit tail plate 339, while the adjustment plate 336 arranged on the other side of the placement box 34 is provided with a limit tail plate 339. In this way, the adjustment plate 336 without the limit tail plate 339 enters the weight distance plate 341 at the corresponding height position after the height change occurs. The entrance of the weight distance plate 341 is specially set to an oblique entrance, which can ensure that when the height position of the weight distance plate 341 has a certain range of error, it can be ensured to enter the weight distance plate 341 smoothly. In this way, the height position can be fixed when the weighing plate 32 is moved, and the limit tail plate 339 in the front weighing plate 32 is about to fall off the track. When the track block 44 is moved up or down, the limiting tail plate 339 in the front is driven, and the limiting tail plate 339 slides on the outside of the fixing rod 338, thereby compressing the sixth spring 340. Under the action of the sixth spring 340, the movement and reset of the limiting tail plate 339 can be facilitated. The above work is used for the working situation of processing the same batch of models. When processing circuit boards of other batches of models, another batch of circuit boards is conveyed after the circuit boards being processed are completed, so as to prevent circuit boards of different models from being conveyed at the same time, resulting in differences in conveying speed and affecting the processing quality.

[0058] The power regulating mechanism 4 comprises a placement groove 41 provided inside the reflow soldering machine 1, a sliding rheostat 42 is fixedly connected to the inner wall of the placement groove 41, a limited connection block 43 is fixedly connected to one side of the sliding piece in the sliding rheostat 42, the limited connection block 43 is slidably connected to the reflow soldering machine 1, and a track block 44 is fixedly connected to one side of the limited connection block 43 away from the sliding rheostat 42;

[0059] During use, when the track block 44 is driven, the limit connection block 43 can be driven to slide in the reflow soldering machine 1, so that the moving limit connection block 43 can adjust the slider in the sliding rheostat 42 to a resistance value position corresponding to the weight of the circuit board, and the sliding rheostat 42 is connected to the motor 21 through a wire.

[0060] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device.

[0061] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cooling device for circuit board processing, comprising: Reflow soldering machine (1), Characterized in that: it further includes: a conveying mechanism (2), the conveying mechanism (2) is arranged inside the reflow soldering machine (1), and the conveying mechanism (2) is used for conveying circuit boards; A weighing and positioning mechanism (3), the weighing and positioning mechanism (3) is arranged on the conveying mechanism (2), and the number of the weighing and positioning mechanisms (3) is multiple, and it clamps and weighs circuit boards of different model sizes; A power adjustment mechanism (4), the power adjustment mechanism (4) is arranged inside the reflow soldering machine (1), and the power adjustment mechanism (4) adjusts the conveying power of the conveying mechanism (2) according to the weight weighed by the weighing and positioning mechanism (3); The weighing and positioning mechanism (3) includes a plurality of load-bearing plates (31) fixedly connected to the outer side of the type B mesh belt (23), a weighing plate (32) is slidably connected inside each load-bearing plate (31), and a first spring (33) is fixedly connected to the bottom of the weighing plate (32) and located inside the load-bearing plate (31); A plurality of placement boxes (34) are slidably connected to one side of the weighing plate (32), a rotating pull plate (335) is rotatably connected to one side of each placement box (34), and a buckle (334) is fixedly connected to one side of the placement box (34); A first rotating shaft (35) is rotatably connected inside the placement box (34), a winding wheel (37) is fixedly connected to the outer side of the first rotating shaft (35), a steel wire (38) is fixedly connected between the winding wheel (37) and the rotating pull plate (335), a torsion spring (36) is fixedly connected between one side of the winding wheel (37) and the inner side of the placement box (34), and a limiting sleeve (39) is fixedly connected to the inner side of the placement box (34) and located outside the steel wire (38); Two first gears (310) are fixedly connected to the outer side of the first rotating shaft (35), first racks (311) are meshed and connected to both sides of the two first gears (310), a clamping limiting plate (312) is fixedly connected to one side of the first rack (311), a second spring (313) is fixedly connected to one side of the clamping limiting plate (312), and the side of the second spring (313) away from the clamping limiting plate (312) is fixedly connected to the placement box (34); Adjusting plates (336) are fixedly connected to one side of several of the placement boxes (34), L-shaped fixing plates (337) are fixedly connected to the top and bottom of several of the adjusting plates (336), a fixing rod (338) is fixedly connected between the two L-shaped fixing plates (337), a limiting tail plate (339) is slidably connected to the outer side of the two fixing rods (338), sixth springs (340) are sleeved on the outer side of the fixing rod (338) and located at the top and bottom of the limiting tail plate (339), and a plurality of weight distance plates (341) are fixedly connected to the inner side of the reflow soldering machine (1); The power adjustment mechanism (4) includes a placement groove (41) opened inside the reflow soldering machine (1). The inner wall of the placement groove (41) is fixedly connected with a slide rheostat (42). One side of the slide of the slide rheostat (42) is fixedly connected with a limit connection block (43). The limit connection block (43) is slidably connected with the reflow soldering machine (1). The side of the limit connection block (43) away from the slide rheostat (42) is fixedly connected with an orbit block (44).

2. The cooling device for circuit board processing according to claim 1, wherein: The conveying mechanism (2) includes two conveying rollers (22) rotatably connected to the inside of the reflow soldering machine (1). A type B mesh belt (23) is arranged on the outer sides of the two conveying rollers (22). A motor (21) is fixedly connected to the inside of the reflow soldering machine (1). The output end of the motor (21) is fixedly connected to one end of one of the conveying rollers (22).

3. The cooling device for circuit board processing according to claim 1, characterized in that: Two first limit hollow plates (314) are slidably connected to the inside of the weighing plate (32). One side of the two first limit hollow plates (314) is fixedly connected with a first limit telescopic rod (315). One side of the first limit telescopic rod (315) is fixedly connected with a contact disc (316). A third spring (317) is sleeved on the outer side of the first limit telescopic rod (315) and between the contact disc (316) and the first limit hollow plate (314). Two fixed blocks (318) are fixedly connected to the inside of the weighing plate (32). A second gear (319) is rotatably connected between the two fixed blocks (318). The bottom of the second gear (319) is meshed with a second rack (320). Second limit telescopic rods (321) are fixedly connected between the two sides of the second rack (320) and the inner side of the weighing plate (32). A third rack (322) is fixedly connected to the bottom of the placement box (34). The third rack (322) is meshed with the second gear (319). Fourth springs (323) are fixedly connected to the two sides of the third rack (322). One side of the two fourth springs (323) away from the third rack (322) is fixedly connected with a limit block (324). One side of the limit block (324) is rotatably connected with a rotating plate (326). One end of the rotating plate (326) away from the limit block (324) is rotatably connected with a second limit hollow plate (325). The second limit hollow plate (325) is slidably connected with the weighing plate (32). A second rotating shaft (327) is rotatably connected to the inside of the placement box (34). Pulley wheels (328) are fixedly connected to the bottom of one of the first gears (310) and the outer side of the second rotating shaft (327). A belt is arranged on the outer sides of the two pulley wheels (328). One end of the second rotating shaft (327) is fixedly connected with a fixed disc (329). A driving column (330) is fixedly connected to one side of the fixed disc (329) and inside the second limit hollow plate (325).

4. The cooling device for circuit board processing according to claim 1, characterized in that: Two sliding grooves (331) are formed inside the first rotating shaft (35). One-way angle blocks (332) are slidably connected to the inner walls of the two sliding grooves (331), and a fifth spring (333) is fixedly connected to one side of each one-way angle block (332).

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