Design method of piezoelectric buzzer
By identifying the risk characteristics of materials and structures in the reflow soldering process and establishing an optimization solution, the adhesive layer softening and conductive adhesive failure problems that occur in the high-temperature process of piezoelectric buzzer are solved, and the high-temperature adaptability and stability of the product are improved.
Patent Information
- Application Number
- CN202510140675.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-08
- Publication Date
- 2025-05-27
AI Technical Summary
Existing piezoelectric buzzers are prone to problems such as softening of adhesive layer and failure of conductive adhesive in high-temperature processes, resulting in insufficient high-temperature adaptability and long-term reliability of the product.
By identifying the risk characteristics of materials and structures in the reflow soldering process, establishing material optimization solutions and structural optimization solutions, selecting materials that are suitable for high temperatures and design optimization structures to improve the high temperature adaptability and stability of the buzzer.
Improve the high temperature adaptability and stability of the piezoelectric buzzer, ensuring that the product can work normally in high temperature environments and maintain long-term reliability.
Smart Images
Figure CN120046275A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of buzzers, and particularly to a design method for a piezoelectric buzzer. Background Art
[0002] A piezoelectric buzzer is a sound generating device widely used in electronic equipment, and its core components include structures such as a piezoelectric sheet, a cover plate, a housing, and wires. In the prior art, piezoelectric buzzers are usually connected to other structures in a plug-in manner, and these structures include a PCB board used in a drive circuit, a power input interface, an external control signal interface, and so on.
[0003] In actual production scenarios, although the plug-in method is flexible and convenient, it has the following deficiencies in terms of reliability and long-term use: The mechanical strength of the plug-in points is relatively low, and it is easy to become loose due to external force, vibration, or long-term use. Especially in a working environment where the buzzer vibrates frequently, loosening may lead to electrical connection failure; the plug-in points are easily affected by oxidation, contamination, or wear, resulting in an increase in contact resistance or intermittent open circuit, affecting the stability of signal transmission, and even causing the buzzer to malfunction; the plug-in method requires additional design of pins, sockets, or connectors, and these components increase the material and manufacturing costs. During the assembly and testing processes, it is necessary to ensure the reliability of the plug-in points, increasing the complexity of the production process; in high humidity, high temperature, or high vibration environments, the plug-in points are prone to degradation, further reducing the reliability and durability of the product.
[0004] To overcome the deficiencies of the plug-in method, in some processes, the reflow soldering method has begun to be used to replace the plug-in connection. Through heating the solder paste, the pins or pads of the buzzer are directly soldered to the pads of the PCB board, etc., forming a firm mechanical connection and reliable electrical contact. The solder joints can withstand greater mechanical stress and avoid loosening; the soldering points have low contact resistance, avoiding failures caused by oxidation or contamination; and the reflow soldering process has a high degree of automation, is suitable for mass production, and reduces manual intervention.
[0005] Although reflow soldering is superior to the plug-in method in terms of mechanical and electrical performance, the high-temperature process in it usually reaches 200°C - 260°C, which will have an adverse impact on the structure and performance of the piezoelectric buzzer, such as softening of the adhesive layer, failure of the conductive adhesive, etc. Therefore, when applying the reflow soldering process, it is often necessary to re-optimize the design of the piezoelectric buzzer to ensure the high-temperature adaptability and long-term reliability of the buzzer product. Summary of the Invention
[0006] In view of at least one of the above technical problems, the present invention provides a design method for a piezoelectric buzzer, and improves the long-term reliability of the product through the improvement of the design method.
[0007] According to a first aspect of the present invention, a design method of a piezoelectric buzzer is provided, which is carried out based on the design data of a plug-in piezoelectric buzzer and the requirements of the reflow soldering process, and includes the following steps: S10: Identify risk characteristics in the design data of the plug-in piezoelectric buzzer according to the requirements of the reflow soldering process, where the risk characteristics include material risk characteristics and structural risk characteristics; S20: Traverse the adhesive material, conductive material and structural material data in the design data of the plug-in piezoelectric buzzer based on the material risk characteristics, and establish a material optimization scheme; S30: Traverse the component structure data in the design data of the plug-in piezoelectric buzzer based on the structural risk characteristics, and establish a structural optimization scheme; S40: Integrate the material optimization scheme, the structural optimization scheme and the requirements of the reflow soldering process, and output the design scheme of the piezoelectric buzzer.
[0008] In some embodiments of the present invention, the design data of the plug-in piezoelectric buzzer includes the material information used.
[0009] In some embodiments of the present invention, the requirements of the reflow soldering process include the temperature range and the welding time.
[0010] In some embodiments of the present invention, in step S10, the material risk characteristics include the softening of the adhesive material at the set temperature, the thermal stability of the conductive material, and the expansion or aging of the structural material at the set temperature.
[0011] In some embodiments of the present invention, the structural risk characteristics include the bonding strength between the piezoelectric sheet and the housing of the piezoelectric buzzer, the looseness of the cover plate, whether the connection between the wire and the piezoelectric sheet fails, and the structural deformation caused by the concentration of thermal stress at the set temperature.
[0012] In some embodiments of the present invention, in step S20, when establishing the material optimization scheme, the adhesive material is selected as a material with an adaptation temperature higher than the reflow soldering process temperature, the conductive material is selected as a material with electrical properties resistant to the reflow soldering process temperature, and the structural material is selected as a material resistant to the reflow soldering process.
[0013] In some embodiments of the present invention, the adhesive material is selected as epoxy resin or silicone rubber, the conductive material is selected as a silver-based conductive material, and the structural material is selected as PPS, PEEK or LCP material.
[0014] In some embodiments of the present invention, in step S30, when establishing the structural optimization scheme, the structural optimization scheme includes the connection structure design between the piezoelectric sheet and the housing, the connection structure design between the cover plate and the housing, and the optimization design of the thermal stress distribution.
[0015] In some embodiments of the present invention, the material risk further includes the anti-corrosion painting material of the material.
[0016] In some embodiments of the present invention, the anti-corrosion painting material adopts a painting process.
[0017] The beneficial effects of the present invention are as follows: According to the process requirements of the reflux component, the material risk characteristics and structural risk characteristics are identified in the design data of the plug-in piezoelectric buzzer, and then an optimization plan is established after traversing based on the material risk characteristics and structural risk characteristics. Finally, the design plan of the piezoelectric buzzer is output by integrating the material optimization plan, the structural optimization plan, and the requirements of the reflow soldering process. Compared with the prior art, the above optimization design plan can improve the high-temperature adaptability and stability of the buzzer. Description of the Drawings
[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments recorded in the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0019] Figure 1 It is a flowchart of the steps of the design method of the piezoelectric buzzer in the embodiments of the present invention. Detailed Embodiments
[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments.
[0021] It should be noted that when an element is referred to as "fixed to" another element, it can be directly on the other element or there may also be a middle element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be a middle element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only implementation manner.
[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in the description of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.
[0023] Such asFigure 1 The design method of the piezoelectric buzzer shown is based on the design data of the plug-in piezoelectric buzzer and the requirements of the reflow soldering process, and includes the following steps: S10: Identify risk characteristics in the design data of the plug-in piezoelectric buzzer according to the requirements of the reflow soldering process, where the risk characteristics include material risk characteristics and structural risk characteristics; S20: Traverse the adhesive material, conductive material, and structural material data in the design data of the plug-in piezoelectric buzzer based on the material risk characteristics, and establish a material optimization plan; S30: Traverse the component structure data in the design data of the plug-in piezoelectric buzzer based on the structural risk characteristics, and establish a structural optimization plan; S40: Integrate the material optimization plan, the structural optimization plan, and the requirements of the reflow soldering process, and output the design plan of the piezoelectric buzzer.
[0024] In the above embodiment, according to the requirements of the reflow component process, material risk characteristics and structural risk characteristics are identified in the design data of the plug-in piezoelectric buzzer, and then optimization plans are established after traversing based on the material risk characteristics and the structural risk characteristics. Finally, the design plan of the piezoelectric buzzer is output by integrating the material optimization plan, the structural optimization plan, and the requirements of the reflow soldering process. Compared with the prior art, the above optimized design plan can improve the high-temperature adaptability and stability of the buzzer.
[0025] In the embodiment of the present invention, the design data of the plug-in piezoelectric buzzer includes the material information used. And, in the embodiment of the present invention, the requirements of the reflow soldering process include the temperature range and the welding time. By analyzing the influence of the reflow soldering process on the piezoelectric buzzer, the material and structural problems that may be caused by the high-temperature process in the existing design are found. It should be noted here that reflow soldering is a process of forming a firm connection between electronic components and pads by heating the solder paste, which is widely used in surface mount technology. In the embodiment of the present invention, it mainly aims at the connection between the piezoelectric sheet and the lead. The traditional welding method is likely to cause the solder joints to fall off after reflow soldering; and the materials used may deform or be stressed after being heated by reflow soldering, which may lead to product defects. Therefore, in the embodiment of the present invention, the material risk and the structural risk are identified by first analyzing the temperature range and the welding time in the reflow soldering process.
[0026] Specifically, in step S10, the material risk characteristics include the softening of the adhesive material at the set temperature, the thermal stability of the conductive material, and the expansion or aging of the structural material at the set temperature. The structural risk characteristics include the bonding strength between the piezoelectric sheet and the housing of the piezoelectric buzzer, the looseness of the cover plate, whether the connection between the wire and the piezoelectric sheet fails, and the structural deformation caused by thermal stress concentration at the set temperature. The set temperature here refers to the highest temperature in the reflow soldering process.
[0027] In some embodiments of the present invention, in step S20, when establishing the material optimization plan, the adhesive material is selected as a material with an adaptation temperature higher than the reflow soldering process temperature, the conductive material is selected as a material with electrical properties resistant to the reflow soldering process temperature, and the structural material is selected as a material resistant to the reflow soldering process. In some embodiments of the present invention, the adhesive material is selected as epoxy resin or silicone rubber, the conductive material is selected as a silver-based conductive material, and the structural material is selected as PPS, PEEK, or LCP material. It should be noted here that PPS refers to polyphenylene sulfide material, which has high rigidity, high strength, and thermal stability; PEEK is polyetheretherketone material, which has excellent high-temperature resistance, with a short-term temperature resistance of up to more than 300 degrees Celsius and is also resistant to chemical corrosion; specifically, in some embodiments of the present invention, the housing cover plate is selected as LCP material, and LCP refers to liquid crystal polymer, which has high rigidity, high strength, relatively excellent creep resistance, good flame retardancy, and excellent corrosion resistance. In addition, in the embodiments of the present invention, the material of the piezoelectric sheet is selected as nickel-based alloy, which can maintain a relatively high strength at high temperatures, and the wire is an insulated enameled wire, which can meet the requirement of normal performance after high temperature; regarding the connection method between the wire and the piezoelectric sheet, conductive silver paste is used. Conductive silver paste is mainly composed of matrix resin and conductive filler, that is, conductive particles. Through the bonding function of the matrix resin, the conductive particles are tightly combined to form a conduction path, thereby realizing the conductive connection between materials.
[0028] In some embodiments of the present invention, in step S30, when establishing the structural optimization plan, the structural optimization plan includes the connection structure design between the piezoelectric sheet and the housing, the connection structure design between the cover plate and the housing, and the optimization design of the thermal stress distribution. In the embodiments of the present invention, the improvement of the structure can be to add bumps on the cover plate to improve the gluing accuracy between the cover plate and the housing.
[0029] In the embodiments of the present invention, the material risk also includes the anti-corrosion spray paint material of the material. Specifically, the anti-corrosion spray paint material adopts the spray painting process. When specifically constructing, the piezoelectric sheet can be spray painted, which can effectively prevent corrosion and better improve the life and durability of the buzzer.
[0030] Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principle of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.
Claims
1. A design method for a piezoelectric buzzer, characterized in that: Based on the plug-in piezoelectric buzzer design data and reflow process requirements, the following steps are included: S10: identifying risk features in the plug-in piezoelectric buzzer design data according to the reflow process requirements, wherein the risk features include material risk features and structural risk features; S20: traversing the adhesive material, conductive material and structural material data in the plug-in piezoelectric buzzer design data based on the material risk characteristics, and establishing a material optimization plan; S30: traversing the component structure data in the plug-in piezoelectric buzzer design data based on the structural risk characteristics to establish a structural optimization plan; S40: Outputting a design solution of the piezoelectric buzzer based on the material optimization solution, the structure optimization solution and the reflow process requirements.
2. The design method of a piezoelectric buzzer according to claim 1, characterized in that: The plug-in piezoelectric buzzer design data includes information on the materials used.
3. The design method of a piezoelectric buzzer according to claim 1, characterized in that: The reflow soldering process requirements include temperature range and soldering time.
4. The design method of a piezoelectric buzzer according to claim 1, characterized in that: In step S10, the material risk characteristics include softening of adhesive materials at a set temperature, thermal stability of conductive materials, and expansion or aging of structural materials at a set temperature.
5. The design method of a piezoelectric buzzer according to claim 4, characterized in that: The structural risk characteristics include the bonding strength between the piezoelectric sheet and the shell of the piezoelectric buzzer, the looseness of the cover, whether the connection between the wire and the piezoelectric sheet has failed, and the structural deformation caused by thermal stress concentration at a set temperature.
6. The design method of a piezoelectric buzzer according to claim 1, characterized in that: In step S20, when establishing a material optimization plan, the adhesive material is selected to have an adaptability temperature greater than the reflow process temperature, the conductive material is selected to have electrical properties that can withstand the reflow process temperature, and the structural material is selected to have a material that can withstand the reflow process.
7. The design method of a piezoelectric buzzer according to claim 6, characterized in that: The adhesive material is epoxy resin or silicone adhesive, the conductive material is silver-based conductive material, and the structural material is PPS, PEEK or LCP material.
8. The design method of a piezoelectric buzzer according to claim 1, characterized in that: In step S30, when a structural optimization scheme is established, the structural optimization scheme includes the connection structure design between the piezoelectric sheet and the housing, the connection structure design between the cover plate and the housing, and the optimization design of thermal stress distribution.
9. The design method of a piezoelectric buzzer according to claim 8, characterized in that: The material risks also include the anti-corrosion paint materials of the materials.
10. The design method of a piezoelectric buzzer according to claim 1, characterized in that: The anti-corrosion spray paint material adopts a spray paint process.