Wafer ultrasonic cleaning device

Abstract

The invention belongs to the technical field of wafer cleaning equipment, and particularly relates to a wafer ultrasonic cleaning device which comprises a base, an ultrasonic cleaning pool is fixedly connected to one side of the upper end face of the base, and a clamping assembly used for fixing a wafer is arranged on the ultrasonic cleaning pool; the base is also provided with an adjustable blanking auxiliary mechanism which can enable a plurality of scattered wafers to be arranged in order. According to the wafer cleaning device, by means of the adjustable discharging auxiliary mechanism and the variable-pitch material moving mechanism, a plurality of wafers to be cleaned which are placed in a scattered mode can be changed into a neat arrangement state and then placed on the positioning base in an adsorption mode, the wafers on the positioning base are kept at certain intervals and are fixed, and therefore the situation that the wafers to be cleaned are in a neat arrangement state due to the fact that the wafers to be cleaned are scattered is avoided. And therefore, the follow-up cleaning efficiency can be favorably improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of wafer cleaning equipment, and specifically relates to a wafer ultrasonic cleaning device. Background Art

[0002] A wafer refers to a silicon wafer used for manufacturing silicon semiconductor integrated circuits. Since its shape is circular, it is called a wafer. During the semiconductor wafer manufacturing process, the wafer will be contaminated after each processing, such as impurities like metals, organic substances, and inorganic substances. If these impurities are not removed, they will directly affect the quality and performance of the chip. Therefore, it is necessary to remove these contaminants through ultrasonic cleaning.

[0003] The patent with the publication number CN117324306A discloses a semiconductor wafer ultrasonic cleaning machine, which includes a base. A fixing frame is fixedly installed on the top of the base. An ultrasonic cleaning tank is fixedly installed on the base and below the fixing frame. A first telescopic rod in the vertical direction is installed on the fixing frame. The telescopic end of the first telescopic rod is connected to a mounting frame. An electric cylinder for driving the mounting frame to move along the first telescopic rod is fixedly installed on the fixing frame. When this patent is in use, multiple wafer bodies are fixed in a cleaning basket. The electric cylinder is used to move the mounting frame downward along the first telescopic rod, so that the cleaning basket is located in the ultrasonic cleaning tank, and the mounting frame is reciprocated up and down along the first telescopic rod to clean the wafer bodies. Through the design of the guiding member, when the mounting frame moves along the first telescopic rod, the cleaning basket rotates around the hinge axis to form the up and down swing of the end of the cleaning basket, thereby further improving the cleaning effect on the wafer bodies and further improving the cleaning efficiency.

[0004] However, the above technical solution still has the following deficiencies in the actual application process: In order to improve the cleaning efficiency, multiple wafers are cleaned simultaneously at one time. And, in order to ensure the cleaning effect of the wafers, the multiple wafers are separated from each other and placed on a positioning seat, and the wafers are fixed to prevent the wafers from contacting each other during the cleaning process and affecting the cleaning effect. And, when the wafers are placed on the positioning seat, the robotic arm sequentially transports the stacked wafers to the cleaning machine. However, when the robotic arm transports the wafers, the wafers need to be neatly stacked to facilitate the robotic arm to transport them. In some cases, multiple wafers are not neat but rather scattered and concentrated in a container, which is caused by the previous processing step. When the wafers are scattered, it is not convenient for the robotic arm to transport the wafers, thereby affecting the subsequent cleaning efficiency. Summary of the Invention

[0005] In order to make up for the deficiencies of the prior art and solve at least one of the technical problems proposed in the background art, the present invention proposes a wafer ultrasonic cleaning device.

[0006] The technical solution adopted by the present invention to solve its technical problems is: a wafer ultrasonic cleaning device, including a base, on one side of the upper end surface of the base, an ultrasonic cleaning tank is fixedly connected, and a clamping assembly for fixing the wafer is arranged on the ultrasonic cleaning tank; An adjustable blanking auxiliary mechanism capable of neatly arranging a plurality of scattered wafers is further arranged on the base; The adjustable blanking auxiliary mechanism includes an inclined plate fixedly connected to one side of the upper end surface of the base, a feed pipe is fixedly connected to one side of the upper end of the inclined plate, a feed port is fixedly connected to the upper end of the feed pipe, both sides of the bottom of the feed pipe are inserted and slidably connected with the inclined plate, a cylinder four is fixedly connected to one side of the feed pipe, a baffle one is fixedly connected to the piston end of the cylinder four, and two baffle two are inserted and slidably connected to both sides of the baffle one; A variable pitch material transfer mechanism for taking away the wafers arranged on the inclined plate is further arranged on the base; The variable pitch material transfer mechanism includes a frame slidably connected to one side of the upper end surface of the base, a lifting plate is slidably connected to the chute of the frame, a regulating plate is rotatably arranged on one side of the lower end of the lifting plate, a plurality of sliders are slidably connected to the lower side of the regulating plate, a guiding column is fixedly connected to one side of the slider, a regulating block is fixedly connected to one end of the guiding column, a rotating block is rotatably arranged on one side of the lower end of the regulating block, a hard tube is fixedly connected to the lower end of the rotating block, and a suction cup is arranged at the lower end of the hard tube.

[0007] Preferably, the clamping assembly includes two sliding rods three slidably connected to the bottom of the ultrasonic cleaning tank, a positioning seat is fixedly connected to the upper ends of the sliding rods three, a plurality of placing blocks are inserted and slidably connected to the positioning seat, and a positioning block is slidably connected to the groove of the placing block.

[0008] Preferably, a cylinder three is fixedly connected to one side of the lower end surface of the ultrasonic cleaning tank, the piston end of the cylinder three is fixedly connected to the bottom of the positioning seat, a spring three is fixedly connected to one side of the positioning block, and the end of the spring three away from the positioning block is fixedly connected to the placing block.

[0009] Preferably, two cylinders five are fixedly connected to both sides of the bottom of the feed pipe, the piston end of the cylinder five is fixedly connected to one end of the limiting plate, a spring one is fixedly connected to one side of the baffle two, and the end of the spring one away from the baffle two is fixedly connected to one side of the inner cavity of the baffle one.

[0010] Preferably, one side of the lower end of the frame body is threadedly connected with a first threaded rod, both ends of the first threaded rod are rotatably arranged on the base, one side of the upper end surface of the base is fixedly connected with a first motor, the output end of the first motor is fixedly connected with one end of the first threaded rod, one end of the lifting plate is threadedly connected with a second threaded rod, both ends of the second threaded rod are rotatably arranged on the frame body, one side of the upper end surface of the frame body is fixedly connected with a second motor, the output end of the second motor is fixedly connected with one end of the second threaded rod, one side of the lower end of the lifting plate is fixedly connected with a third motor, and the output end of the third motor is fixedly connected with one side of the adjusting plate.

[0011] Preferably, one side of the upper end surface of the adjusting plate is fixedly connected with an air pump, the air inlet end of the air pump is communicated and fixedly connected with a long pipe, multiple hoses are communicated on one side of the long pipe, and one end of the hose is communicated with one side of the hard pipe.

[0012] Preferably, one side of the adjusting block is fixedly connected with a fourth motor, the output end of the fourth motor is fixedly connected with one side of the rotating block, one side of the upper end of the adjusting plate is slidably connected with a first sliding rod, the lower end of the first sliding rod is fixedly connected with a groove plate, a plurality of sliding grooves are arranged on the groove plate, the guiding column passes through the sliding groove on the groove plate and is slidably connected therewith, one side of the upper end surface of the adjusting plate is fixedly connected with an electric push rod, and the piston end of the electric push rod is fixedly connected with one side of the upper end of the groove plate.

[0013] Preferably, a spacing-reducing type blanking mechanism for taking out the cleaned wafer from the ultrasonic cleaning tank is further arranged on the base; The spacing-reducing type blanking mechanism includes a support column fixedly connected to one side of the upper end surface of the base, two fourth sliding rods fixedly connected to both ends of one side of the support column, a connecting column slidably connected to the fourth sliding rods, a toothed block rod slidably connected to one end of the connecting column, a material taking plate rotatably arranged at the lower end of one side of the toothed block rod, a second clamping plate slidably connected to the material taking plate through a sliding groove, a first clamping plate fixedly connected to the piston end of a first air cylinder on one side of the material taking plate, and two adjusting rods symmetrically and rotatably arranged on one side of the upper end of the material taking plate.

[0014] Preferably, a fourth threaded rod is threadedly connected to one side of the connecting column. Both ends of the fourth threaded rod are rotatably arranged on the support column. One side of the upper end of the support column is fixedly connected with an eighth motor. The output end of the eighth motor is fixedly connected to one end of the fourth threaded rod. One end of the connecting column is rotatably arranged with a second gear. The second gear meshes with the tooth block on the tooth block rod. One end of the connecting column is fixedly connected with a ninth motor. The output end of the ninth motor is fixedly connected to the second gear. One side of the lower end of the tooth block rod is fixedly connected with a fifth motor. The output end of the fifth motor is fixedly connected to the material taking plate. One side of the upper end of the second clamping plate is threadedly connected with a third threaded rod. Both ends of the third threaded rod are rotatably arranged on the material taking plate. One side of the material taking plate is fixedly connected with a seventh motor. The output end of the seventh motor is fixedly connected to one end of the third threaded rod. One end of the adjusting rod is fixedly connected with a first gear. The first gear is rotatably arranged on the material taking plate. The two first gears mesh with each other. One side of the upper end surface of the material taking plate is fixedly connected with a sixth motor. The output end of the sixth motor is fixedly connected to one end of the adjusting rod.

[0015] Preferably, a fixing plate is fixedly connected to the lower end surface of the placing block. One side of the upper end surface of the fixing plate is fixedly connected with two second sliding rods. The second sliding rods are slidably connected to one side of the positioning seat. The upper ends of the second sliding rods are fixedly connected with a pressing plate. A second spring is sleeved on one side of the second sliding rod. The upper end of the second spring is fixedly connected to the pressing plate, and the lower end is fixedly connected to the positioning seat. One side of the upper end surface of the material taking plate is fixedly connected with a second cylinder. When the piston end of the second cylinder descends, it can contact the pressing plate.

[0016] The beneficial effects of the present invention are as follows: 1. For a wafer ultrasonic cleaning device of the present invention, by using an adjustable blanking assisting mechanism and a variable-spacing material transferring mechanism, multiple scattered wafers to be cleaned can be first changed into a neatly arranged state, and then placed on the positioning seat by adsorption. Moreover, the wafers on the positioning seat are kept at a certain distance and fixed, thereby avoiding the situation that it is difficult to transport the scattered wafers to the positioning seat, which is beneficial to improving the subsequent cleaning efficiency.

[0017] 2. For a wafer ultrasonic cleaning device of the present invention, by using a spacing-reducing blanking mechanism, after the wafers are cleaned, the spacing between the cleaned wafers can be reduced, adjacent wafers are mutually attached, and they are transferred to the collection container in a neatly stacked manner, avoiding the situation that when the wafers are transferred by using a suction cup, the wafers can only be arranged flat or vertically placed in the container, which is not conducive to handling, and is beneficial to improving the subsequent transfer efficiency of the wafers. Description of the Drawings

[0018] The present invention will be further described below with reference to the drawings.

[0019] Figure 1 is a three-dimensional structural schematic diagram of the present invention; Figure 2 It is a three-dimensional structure schematic diagram of the lifting plate; Figure 3 It is a three-dimensional structure schematic diagram of the adjusting plate; Figure 4 It is a three-dimensional structure schematic diagram of another view of the adjusting plate; Figure 5 It is Figure 4 The partial enlarged view of part A in Figure 6 It is a three-dimensional structure schematic diagram of the ultrasonic cleaning tank; Figure 7 It is Figure 6 The partial enlarged view of part B in Figure 8 It is a three-dimensional structure schematic diagram of the feeding port; Figure 9 It is Figure 8 The partial enlarged view of part C in Figure 10 It is a three-dimensional structure schematic diagram of the support column; Figure 11 It is Figure 10 The partial enlarged view of part D in Figure 12 It is a three-dimensional structure schematic diagram of the fixing plate; Figure 13 It is a three-dimensional structure schematic diagram of the adjusting rod; Figure 14 It is a three-dimensional structure schematic diagram of the baffle plate I; Figure 15 It is a three-dimensional structure schematic diagram of the placing block.

[0020] In the figure: 1, base; 2, frame; 3, feed inlet; 4, inclined plate; 5, feed pipe; 6, ultrasonic cleaning tank; 7, support pillar; 8, toothed block rod; 9, motor one; 10, threaded rod one; 11, motor two; 12, threaded rod two; 13, lifting plate; 14, motor three; 15, adjusting plate; 16, air pump; 17, trough plate; 18, long pipe; 19, hose; 20, slider; 21, rigid pipe; 22, suction cup; 23, electric push rod; 24, slide bar one; 25, motor four; 26, adjusting block; 27, guide post; 28, rotating block; 29, spring one; 30, motor five; 31, material taking plate; 32, cylinder one; 33, clamping plate one; 34, adjusting rod; 35, gear one; 36, motor six; 37, cylinder two; 38, threaded rod three; 39, motor seven; 40, clamping plate two; 41, placing block; 42, positioning block; 43, pressing plate; 44, slide bar two; 45, spring two; 46, cylinder three; 47, slide bar three; 48, fixing plate; 49, cylinder four; 50, baffle one; 51, baffle two; 52, cylinder five; 53, limiting plate; 54, motor eight; 55, threaded rod four; 56, slide bar four; 57, connecting column; 58, motor nine; 59, gear two; 60, spring three; 61, positioning seat. Detailed implementation mode

[0021] Next, the technical solutions of the present invention will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0022] Please refer to Figures 1 - 15 , the present invention provides a technical solution: a wafer ultrasonic cleaning device, including a base 1, on one side of the upper end surface of the base 1, an ultrasonic cleaning tank 6 is fixedly connected, and a clamping assembly for fixing the wafer is arranged on the ultrasonic cleaning tank 6; An adjustable blanking auxiliary mechanism capable of neatly arranging multiple scattered wafers is also arranged on the base 1; The adjustable blanking auxiliary mechanism includes an inclined plate 4 fixedly connected to one side of the upper end surface of the base 1, on one side of the upper end of the inclined plate 4, a feed pipe 5 is fixedly connected, the upper end of the feed pipe 5 is fixedly connected with a feed inlet 3, both sides of the bottom of the feed pipe 5 are inserted and slidably connected to the inclined plate 4, one side of the feed pipe 5 is fixedly connected with a cylinder four 49, the piston end of the cylinder four 49 is fixedly connected with a baffle one 50, and both sides of the baffle one 50 are inserted and slidably connected with a baffle two 51; A variable-distance material transfer mechanism for taking away the wafers arranged on the inclined plate 4 is also arranged on the base 1; The variable pitch material transfer mechanism includes a frame body 2 slidably connected to one side of the upper end surface of the base 1. A lifting plate 13 is slidably connected to the chute of the frame body 2. One side of the lower end of the lifting plate 13 is rotatably provided with an adjusting plate 15. A plurality of sliders 20 are slidably connected to the lower side of the adjusting plate 15. One side of the slider 20 is fixedly connected with a guide post 27. One end of the guide post 27 is fixedly connected with an adjusting block 26. One side of the lower end of the adjusting block 26 is rotatably provided with a rotating block 28. The lower end of the rotating block 28 is fixedly connected with a hard tube 21. A suction cup 22 is provided at the lower end of the hard tube 21.

[0023] In this embodiment, as Figures 1 - 9 , Figure 12 , Figure 14 , Figure 15 shown, the clamping assembly includes two third slide bars 47 slidably connected to the bottom of the ultrasonic cleaning tank 6. The upper ends of the third slide bars 47 are fixedly connected with positioning seats 61. A plurality of placing blocks 41 are inserted and slidably connected to the positioning seats 61. A positioning block 42 is slidably connected to the groove of the placing block 41.

[0024] One side of the lower end surface of the ultrasonic cleaning tank 6 is fixedly connected with a third cylinder 46. The piston end of the third cylinder 46 is fixedly connected to the bottom of the positioning seat 61. One side of the positioning block 42 is fixedly connected with a third spring 60. The end of the third spring 60 away from the positioning block 42 is fixedly connected with the placing block 41.

[0025] Both sides of the bottom of the feed pipe 5 are fixedly connected with fifth cylinders 52. The piston ends of the fifth cylinders 52 are fixedly connected to one end of a limiting plate 53. One side of the second baffle 51 is fixedly connected with a first spring 29. The end of the first spring 29 away from the second baffle 51 is fixedly connected to one side of the inner cavity of the first baffle 50.

[0026] One side of the lower end of the frame body 2 is threadedly connected with a first threaded rod 10. Both ends of the first threaded rod 10 are rotatably arranged on the base 1. One side of the upper end surface of the base 1 is fixedly connected with a first motor 9. The output end of the first motor 9 is fixedly connected to one end of the first threaded rod 10. One end of the lifting plate 13 is threadedly connected with a second threaded rod 12. Both ends of the second threaded rod 12 are rotatably arranged on the frame body 2. One side of the upper end surface of the frame body 2 is fixedly connected with a second motor 11. The output end of the second motor 11 is fixedly connected to one end of the second threaded rod 12. One side of the lower end of the lifting plate 13 is fixedly connected with a third motor 14. The output end of the third motor 14 is fixedly connected to one side of the adjusting plate 15.

[0027] One side of the upper end surface of the adjusting plate 15 is fixedly connected with an air pump 16. The air inlet end of the air pump 16 is communicated and fixedly connected with a long tube 18. A plurality of hoses 19 are communicated with one side of the long tube 18. One end of the hose 19 is communicated with one side of the hard tube 21.

[0028] One side of the adjusting block 26 is fixedly connected with the fourth motor 25. The output end of the fourth motor 25 is fixedly connected with one side of the rotating block 28. One side of the upper end of the adjusting plate 15 is slidably connected with the first sliding rod 24. The lower end of the first sliding rod 24 is fixedly connected with the groove plate 17. A plurality of sliding grooves are arranged on the groove plate 17. The guiding column 27 passes through the sliding grooves on the groove plate 17 and is slidably connected therewith. One side of the upper end surface of the adjusting plate 15 is fixedly connected with the electric push rod 23. The piston end of the electric push rod 23 is fixedly connected with one side of the upper end of the groove plate 17.

[0029] Specifically, when the existing wafer ultrasonic cleaning machine is in use, in order to improve the cleaning efficiency, multiple wafer slices are cleaned simultaneously at one time. And, in order to ensure the cleaning effect of the wafer slices, the multiple wafer slices are separated from each other and placed on the positioning seat 61, and the wafer slices are fixed to prevent the wafer slices from contacting each other during the cleaning process and affecting the cleaning effect. And, when the wafer slices are placed on the positioning seat 61, the robotic arm sequentially transports the stacked and transported wafer slices to the cleaning machine. However, when the robotic arm transports the wafer slices, the wafer slices need to be neatly stacked to facilitate the robotic arm to transport them. In some cases, however, the multiple wafer slices are not neat but rather scattered and concentrated in a container, which is caused by the previous processing step. When the wafer slices are scattered, it is not convenient for the robotic arm to transport the wafer slices, thus affecting the subsequent cleaning efficiency. Therefore, to solve the above problems, in this embodiment, when in use, the same batch of wafer slices with the same specifications are used; according to the thickness and diameter of the wafer slices, the fourth cylinder 49 and the fifth cylinder 52 are respectively started. The fourth cylinder 49 drives the first baffle 50 and the second baffle 51 to move, adjusting the distance between the bottoms of the first baffle 50 and the second baffle 51 and the inclined plate 4. This distance is greater than the thickness of one wafer slice and less than the thickness of two wafer slices. The fifth cylinder 52 drives the two limiting plates 53 to slide simultaneously and in different directions, so as to adjust the distance between the two limiting plates 53 to be equal to the diameter of the wafer slice. At the same time, the second baffle 51 will also move due to the movement of the limiting plate 53 and fit with the limiting plate 53 under the action of the first spring 29. Then, a plurality of scattered wafer slices are poured into the feeding port 3 and fall onto the inclined plate 4 along the feeding pipe 5. The wafer slices slide downward along the inclined plate 4 under the action of gravity. Since the gap formed by the first baffle 50, the second baffle 51, and the limiting plate 53 can only pass one horizontally placed wafer slice at a time, so, the multiple wafer slices will be neatly arranged on the inclined plate 4 in sequence. Then, the rotation of the first screw rod 10 is driven by the first motor 9 to horizontally move the frame body 2. The rotation of the second screw rod 12 is driven by the second motor 11 to longitudinally move the lifting plate 13, adjusting the height of multiple suction cups 22. Then, the rotation of the adjusting plate 15 is driven by the third motor 14 to adjust the angles of multiple suction cups 22 until the adsorption surfaces of the suction cups 22 are parallel to the surface of the inclined plate 4. Then, according to the distance between the centers of two adjacent wafers, the electric push rod 23 is used to drive the groove plate 17 to move up and down. When the groove plate 17 moves up and down, multiple guide posts 27 can be driven to move simultaneously through the chute, causing the slider 20 to slide on the adjusting plate 15, so that the distances between multiple sliders 20 change equally until the distance between two adjacent suction cups 22 is the same as the distance between the centers of two adjacent wafers. At this time, the position of the suction cup 22 can be adjusted again to make the suction cup 22 contact the surface of the wafer. Under the action of the air pump 16, the wafer is adsorbed by the suction cup 22, and then the wafer is driven to move above the ultrasonic cleaning tank 6. The positioning seat 61 is driven out of the ultrasonic cleaning tank 6 by the third cylinder 46. Then, the fourth motor 25 is used to drive multiple rotating blocks 28 to rotate 90 degrees simultaneously, making multiple wafers in a vertical state. Then, by adjusting the distance between adjacent wafers again, each wafer is aligned with the inclined surface of the positioning block 42, and then the wafer is driven to descend. When the wafer contacts the inclined surface of the positioning block 42, the positioning block 42 will move horizontally until the bottom of the wafer contacts the inner bottom of the placing block 41. At this time, the positioning block 42 clamps the wafer under the action of the third spring 60. At this time, the suction cup 22 releases the wafer, and the wafer can be clamped and placed. Then, the above operations are repeated to place wafers in each placing block 41, and the wafers are placed vertically, which is beneficial to saving the placement space. Then, the positioning seat 61 is driven into the ultrasonic cleaning tank 6 for cleaning. The cleaning process is a prior art and will not be elaborated too much; thus, multiple scattered wafers to be cleaned can be first transformed into a neatly arranged state and then placed on the positioning seat 61 by adsorption, thereby avoiding the situation that it is not easy to transport the scattered wafers to be cleaned to the positioning seat 61, which is beneficial to improving the subsequent cleaning efficiency.

[0030] In this embodiment, as Figure 6 , Figure 7 , Figure 11 , Figure 13 shown, a spacing-reducing type blanking mechanism for taking out the cleaned wafers from the ultrasonic cleaning tank 6 is further provided on the base 1; The spacing reduction type unloading mechanism includes a pillar 7 fixedly connected to one side of the upper end surface of the base 1, two sliding rods 4 56 are fixedly connected at both ends of one side of the pillar 7, the sliding rod 4 56 is slidably connected to a connecting column 57, one end of the connecting column 57 is slidably connected to a gear block rod 8, a feeding plate 31 is rotatably provided at the lower end of one side of the gear block rod 8, a clamping plate 2 40 is slidably connected to the feeding plate 31 through a sliding groove, a cylinder 1 32 is fixedly connected to one side of the feeding plate 31, a clamping plate 1 33 is fixedly connected to the piston end of the cylinder 1 32, and two adjusting rods 34 are symmetrically rotatably provided on one side of the upper end of the feeding plate 31.

[0031] A threaded rod 4 55 is threadedly connected to one side of the connecting column 57, and both ends of the threaded rod 4 55 are rotatably set on the pillar 7. A motor 8 54 is fixedly connected to one side of the upper end of the pillar 7, and the output end of the motor 8 54 is fixedly connected to one end of the threaded rod 4 55. A gear 2 59 is rotatably set at one end of the connecting column 57, and the gear 2 59 is meshed with the gear block on the gear block rod 8. A motor 9 58 is fixedly connected to one end of the connecting column 57, and the output end of the motor 9 58 is fixedly connected to the gear 2 59. A motor 5 30 is fixedly connected to the lower end of one side of the gear block rod 8, and the output end of the motor 5 30 is connected to the gear block rod 8. The feeding plate 31 is fixedly connected, and a threaded rod 38 is threadedly connected to one side of the upper end of the clamping plate 2 40, and both ends of the threaded rod 38 are rotatably set on the feeding plate 31, and a motor 7 39 is fixedly connected to one side of the feeding plate 31, and the output end of the motor 7 39 is fixedly connected to one end of the threaded rod 38, and one end of the adjusting rod 34 is fixedly connected to a gear 1 35, and the gear 1 35 is rotatably set on the feeding plate 31, and the two gears 1 35 are meshed with each other, and a motor 6 36 is fixedly connected to one side of the upper end surface of the feeding plate 31, and the output end of the motor 6 36 is fixedly connected to one end of the adjusting rod 34.

[0032] A fixing plate 48 is fixedly connected to the lower end surface of the placement block 41, and two sliding rods 44 are fixedly connected to one side of the upper end surface of the fixing plate 48. The sliding rod 44 is slidably connected to one side of the positioning seat 61. The upper end of the sliding rod 44 is fixedly connected to the pressing plate 43. A spring 45 is sleeved on one side of the sliding rod 44. The upper end of the spring 45 is fixedly connected to the pressing plate 43, and the lower end is fixedly connected to the positioning seat 61. A cylinder 37 is fixedly connected to one side of the upper end surface of the material taking plate 31, and the piston end of the cylinder 37 can contact the pressing plate 43 when it descends.

[0033] Specifically, in the above embodiment, although the wafers can be transported to the positioning seat 61 in sequence, after the wafers are cleaned in the ultrasonic cleaning tank 6, they need to be taken out and placed in a container for subsequent transportation and processing. If the wafers are still taken out by adsorption by the suction cup 22, the wafers can only be arranged horizontally or vertically when placed in the container. When arranged horizontally, they are more scattered, which is not conducive to transportation. When placed vertically, the wafers are easily displaced and tipped, which also affects normal transportation. Therefore, in order to solve this problem, the working principle of this embodiment is as follows: After the wafer cleaning is completed, drive the positioning seat 61 out of the ultrasonic cleaning tank 6. By rotating the second gear 59 driven by the ninth motor 58, the toothed block rod 8 slides on the connecting column 57 until the pick-up plate 31 is above the ultrasonic cleaning tank 6 and the bottom of the first clamping plate 33 fits against the upper end face of the positioning seat 61. Then, according to the number of wafers on the positioning seat 61, rotate the third threaded rod 38 driven by the seventh motor 39 to move the second clamping plate 40 closer to the wafers until the second clamping plate 40 fits against the wafers. At this time, multiple wafers are between the first clamping plate 33 and the second clamping plate 40. Then, start the second cylinder 37, and its piston end will move downward and push the pressing plate 43. When the pressing plate 43 descends, the second sliding rod 44 and the fixing plate 48 also descend simultaneously until the top of the placing block 41 is flush with the upper end face of the positioning seat 61. At this time, the wafers are no longer clamped. At the same time, the second clamping plate 40 moves closer to the first clamping plate 33 until multiple wafers are clamped. And because the wafers may tilt when the positioning block 42 loses its clamping force, the adjusting rod 34 on one side can be rotated by the sixth motor 36. With the cooperation of the two first gears 35, the adjusting rods 34 on both sides rotate simultaneously in different directions until the adjusting rods 34 fit against both sides of the wafers to limit the wafers. And because the contact surface between the adjusting rod 34 and the wafer is an arc surface, the friction is small. When the second clamping plate 40 moves horizontally, it can also push the wafers. That is, under the limitation of the adjusting rod 34, multiple vertically placed wafers can be made to fit against each other and their edges aligned. At this time, drive the pick-up plate 31 to displace, and the wafers on the positioning seat 61 can be taken away. At this time, a container can be placed on the base 1, and then the pick-up plate 31 is rotated 90 degrees by the fifth motor 30 so that multiple wafers are stacked vertically. Then, by rotating the fourth threaded rod 55 driven by the eighth motor 54, the picked-up wafers are moved into the container. Then, drive the first clamping plate 33 away from the lowermost wafer in the container by the first cylinder 32, and the wafers can be placed in the container, thus realizing the transfer of the cleaned wafers, making the cleaned wafers placed in the collection container in a neatly stacked manner, and avoiding the situation that when transferring wafers by adsorbing with the suction cup 22, the wafers can only be arranged flat or placed vertically in the container, which is not conducive to handling.

[0034] Working principle: According to the thickness and diameter of the wafer, the cylinder four 49 and the cylinder five 52 are started respectively. The cylinder four 49 drives the baffle one 50 and the baffle two 51 to move, and adjusts the distance between the bottoms of the baffle one 50 and the baffle two 51 and the inclined plate 4. This distance is greater than the thickness of one wafer and less than the thickness of two wafers. The cylinder five 52 drives the two limit plates 53 to slide simultaneously and in different directions, so as to adjust the distance between the two limit plates 53, making this distance equal to the diameter of the wafer. At the same time, the baffle two 51 will also move due to the movement of the limit plate 53 and fit with the limit plate 53 under the action of the spring one 29. Then, a plurality of scattered wafers are poured into the feed port 3 and fall onto the inclined plate 4 along the feed pipe 5. Under the action of gravity, the wafers slide down along the inclined plate 4. Since only one flat wafer can pass through the gap formed by the baffle one 50, the baffle two 51, and the limit plate 53 at a time, a plurality of wafers will be neatly arranged on the inclined plate 4 in sequence. Then, the motor one 9 drives the threaded rod one 10 to rotate, causing the frame body 2 to move horizontally. The motor two 11 drives the threaded rod two 12 to rotate, causing the lifting plate 13 to move longitudinally, and adjusts the height of the plurality of suction cups 22. Then, by driving the adjusting plate 15 to rotate through the motor three 14, the angles of the plurality of suction cups 22 are adjusted until the adsorption surface of the suction cup 22 is parallel to the surface of the inclined plate 4. Then, according to the distance between the centers of adjacent two wafers, the electric push rod 23 drives the groove plate 17 to move up and down. When the groove plate 17 moves up and down, it can drive a plurality of guide posts 27 to move simultaneously through the chute, causing the slider 20 to slide on the adjusting plate 15, so that the distances between the plurality of sliders 20 change equally until the distance between adjacent two suction cups 22 is the same as the distance between the centers of adjacent two wafers. At this time, the position of the suction cup 22 can be adjusted again to make the suction cup 22 contact the surface of the wafer. Under the action of the air pump 16, the wafer is adsorbed by the suction cup 22, and then the wafer is driven to move above the ultrasonic cleaning pool 6. The cylinder three 46 is used to drive the positioning seat 61 to move out of the ultrasonic cleaning pool 6. Then, the motor four 25 drives the plurality of rotating blocks 28 to rotate 90 degrees simultaneously, making the plurality of wafers in a vertical state. Then, by adjusting the distance between adjacent wafers again, each wafer is aligned with the inclined surface of the positioning block 42, and then the wafer is driven to descend. When the wafer contacts the inclined surface of the positioning block 42, the positioning block 42 will move horizontally until the bottom of the wafer contacts the inner bottom of the placing block 41. At this time, the positioning block 42 clamps the wafer under the action of the spring three 60. At this time, the suction cup 22 releases the wafer again, and the wafer can be clamped and placed. Then, the above operations are repeated to place wafers in each placing block 41. Moreover, the wafers are placed vertically, which is beneficial to saving the placement space. Then, the positioning seat 61 is driven into the ultrasonic cleaning pool 6 for cleaning. The cleaning process is the prior art and will not be elaborated too much;Thus, multiple wafers to be cleaned placed in a scattered manner can first be transformed into a neatly arranged state, and then placed on the positioning seat 61 by adsorption, thereby avoiding the situation that it is difficult to transport the wafers to be cleaned to the positioning seat 61 due to their scattered state, which is beneficial to improving the subsequent cleaning efficiency. After the wafers are cleaned, the positioning seat 61 is driven to move out of the ultrasonic cleaning tank 6. By driving the gear two 59 to rotate through the motor nine 58, the toothed block rod 8 slides on the connecting column 57 until the pick-up plate 31 is above the ultrasonic cleaning tank 6 and the bottom of the clamping plate one 33 fits against the upper end surface of the positioning seat 61. Then, according to the number of wafers on the positioning seat 61, the motor seven 39 drives the threaded rod three 38 to rotate, so that the clamping plate two 40 approaches the wafers until the clamping plate two 40 fits against the wafers. At this time, multiple wafers are between the clamping plate one 33 and the clamping plate two 40. Then, the cylinder two 37 is started, and its piston end moves downward and pushes the pressing plate 43. When the pressing plate 43 descends, the sliding rod two 44 and the fixing plate 48 also descend simultaneously until the top of the placing block 41 is flush with the upper end surface of the positioning seat 61. At this time, the wafers are no longer clamped. At the same time, the clamping plate two 40 approaches the clamping plate one 33 until multiple wafers are clamped. And because the wafers may fall when the clamping of the positioning block 42 is lost, the motor six 36 can be driven to rotate the adjusting rod 34 on one side. With the cooperation of the two gears one 35, the adjusting rods 34 on both sides rotate simultaneously in different directions until the adjusting rods 34 fit against both sides of the wafers to limit the wafers. And because the contact surface between the adjusting rod 34 and the wafer is an arc surface, the friction force is small. When the clamping plate two 40 moves horizontally, it can also push the wafers. That is, under the limitation of the adjusting rod 34, multiple vertically placed wafers can be made to fit against each other and their edges are aligned. At this time, by driving the pick-up plate 31 to displace, the wafers on the positioning seat 61 can be taken away. At this time, a container can be placed on the base 1, and then the motor five 30 drives the pick-up plate 31 to rotate by ninety degrees so that multiple wafers are stacked vertically. Then, by driving the threaded rod four 55 to rotate through the motor eight 54, the picked-up wafers are moved into the container. Then, the cylinder one 32 drives the clamping plate one 33 to move away from the lowermost wafer in the container, and the wafers can be placed in the container, thus realizing the transfer work of the cleaned wafers and placing the cleaned wafers in the collection container in a neatly stacked manner, avoiding the situation that when transferring wafers by using the suction cup 22 for adsorption, the wafers can only be arranged flat or placed vertically in the container, which is not conducive to handling.;

[0035] The basic principles, main features and advantages of the present invention have been shown and described above. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer ultrasonic cleaning device, comprising a base (1), characterized in that: An ultrasonic cleaning tank (6) is fixedly connected to one side of the upper end surface of the base (1), and a clamping assembly for fixing the wafer is provided on the ultrasonic cleaning tank (6); The base (1) is also provided with an adjustable material unloading auxiliary mechanism capable of arranging a plurality of scattered wafers in an orderly manner; The adjustable material unloading auxiliary mechanism comprises an inclined plate (4) fixedly connected to one side of the upper end surface of the base (1), a feed pipe (5) fixedly connected to one side of the upper end of the inclined plate (4), a feed port (3) fixedly connected to the upper end of the feed pipe (5), both sides of the bottom of the feed pipe (5) are plugged and slidably connected to the inclined plate (4), one side of the feed pipe (5) is fixedly connected to a cylinder four (49), a piston end of the cylinder four (49) is fixedly connected to a baffle one (50), and both sides of the baffle one (50) are plugged and slidably connected to baffle two (51); The base (1) is also provided with a variable distance material moving mechanism for removing wafers arranged and placed on the inclined plate (4); The variable-length material shifting mechanism comprises a frame (2) slidably connected to one side of the upper end surface of the base (1); a lifting plate (13) is slidably connected to a sliding groove of the frame (2); an adjusting plate (15) is rotatably provided on one side of the lower end of the lifting plate (13); a plurality of sliding blocks (20) are slidably connected to the lower side of the adjusting plate (15); a guide column (27) is fixedly connected to one side of the sliding block (20); an adjusting block (26) is fixedly connected to one end of the guide column (27); a rotating block (28) is rotatably provided on one side of the lower end of the adjusting block (26); a hard tube (21) is fixedly connected to the lower end of the rotating block (28); a suction cup (22) is provided at the lower end of the hard tube (21).

2. The wafer ultrasonic cleaning device according to claim 1, characterized in that: The clamping assembly comprises two sliding rods (47) slidably connected to the bottom of the ultrasonic cleaning tank (6); the upper end of the sliding rod (47) is fixedly connected to a positioning seat (61); a plurality of placement blocks (41) are plugged into and slidably connected to the positioning seat (61); and a positioning block (42) is slidably connected to the groove of the placement block (41).

3. A wafer ultrasonic cleaning device according to claim 2, characterized in that: A cylinder three (46) is fixedly connected to one side of the lower end surface of the ultrasonic cleaning tank (6); a piston end of the cylinder three (46) is fixedly connected to the bottom of the positioning seat (61); a spring three (60) is fixedly connected to one side of the positioning block (42); an end of the spring three (60) away from the positioning block (42) is fixedly connected to the placement block (41).

4. The wafer ultrasonic cleaning device according to claim 1, characterized in that: Both sides of the bottom of the feed pipe (5) are fixedly connected to a cylinder five (52), the piston end of the cylinder five (52) is fixedly connected to one end of a limit plate (53), one side of the baffle plate two (51) is fixedly connected to a spring one (29), and one end of the spring one (29) away from the baffle plate two (51) is fixedly connected to one side of the inner cavity of the baffle plate one (50).

5. The wafer ultrasonic cleaning device according to claim 1, characterized in that: A threaded rod 1 (10) is threadedly connected to one side of the lower end of the frame (2), and both ends of the threaded rod 1 (10) are rotatably arranged on the base (1). A motor 1 (9) is fixedly connected to one side of the upper end surface of the base (1), and the output end of the motor 1 (9) is fixedly connected to one end of the threaded rod 1 (10). A threaded rod 2 (12) is threadedly connected to one end of the lifting plate (13), and both ends of the threaded rod 2 (12) are rotatably arranged on the frame (2). A motor 2 (11) is fixedly connected to one side of the upper end surface of the frame (2), and the output end of the motor 2 (11) is fixedly connected to one end of the threaded rod 2 (12). A motor 3 (14) is fixedly connected to one side of the lower end of the lifting plate (13), and the output end of the motor 3 (14) is fixedly connected to one side of the adjustment plate (15).

6. The wafer ultrasonic cleaning device according to claim 1, characterized in that: An air pump (16) is fixedly connected to one side of the upper end surface of the adjustment plate (15); an air inlet end of the air pump (16) is connected to and fixedly connected to a long tube (18); one side of the long tube (18) is connected to a plurality of hoses (19); one end of the hose (19) is connected to one side of the hard tube (21).

7. The wafer ultrasonic cleaning device according to claim 1, characterized in that: One side of the adjustment block (26) is fixedly connected to a motor four (25), and the output end of the motor four (25) is fixedly connected to one side of the rotating block (28). One side of the upper end of the adjustment plate (15) is slidably connected to a slide rod one (24), and the lower end of the slide rod one (24) is fixedly connected to a slot plate (17), and a plurality of slide grooves are provided on the slot plate (17). The guide column (27) passes through the slide grooves on the slot plate (17) and is slidably connected thereto. One side of the upper end surface of the adjustment plate (15) is fixedly connected to an electric push rod (23), and the piston end of the electric push rod (23) is fixedly connected to one side of the upper end of the slot plate (17).

8. The wafer ultrasonic cleaning device according to claim 1, characterized in that: The base (1) is also provided with a spacing-reducing unloading mechanism for taking out the cleaned wafers from the ultrasonic cleaning tank (6); The spacing reduction type unloading mechanism comprises a pillar (7) fixedly connected to one side of the upper end surface of the base (1), two sliding rods (56) are fixedly connected at both ends of one side of the pillar (7), the sliding rod (56) is slidably connected to a connecting column (57), one end of the connecting column (57) is slidably connected to a tooth block rod (8), a feeding plate (31) is rotatably provided at the lower end of one side of the tooth block rod (8), a clamping plate (40) is slidably connected to the feeding plate (31) through a sliding groove, a cylinder (32) is fixedly connected to one side of the feeding plate (31), a clamping plate (33) is fixedly connected to the piston end of the cylinder (32), and two adjustment rods (34) are symmetrically rotatably provided on one side of the upper end of the feeding plate (31).

9. The wafer ultrasonic cleaning device according to claim 8, characterized in that: One side of the connecting column (57) is threadedly connected to a threaded rod four (55), and both ends of the threaded rod four (55) are rotatably arranged on the pillar (7). One side of the upper end of the pillar (7) is fixedly connected to a motor eight (54), and the output end of the motor eight (54) is fixedly connected to one end of the threaded rod four (55). One end of the connecting column (57) is rotatably provided with a gear two (59), and the gear two (59) is meshed with the gear block on the gear block rod (8). One end of the connecting column (57) is fixedly connected to a motor nine (58), and the output end of the motor nine (58) is fixedly connected to the gear two (59). The lower end of one side of the gear block rod (8) is fixedly connected to a motor five (30), and the output end of the motor five (30) is fixedly connected to the gear block rod (8). The output end is fixedly connected to the feeding plate (31); one side of the upper end of the clamping plate 2 (40) is threadedly connected to a threaded rod 3 (38); both ends of the threaded rod 3 (38) are rotatably arranged on the feeding plate (31); one side of the feeding plate (31) is fixedly connected to a motor 7 (39); the output end of the motor 7 (39) is fixedly connected to one end of the threaded rod 3 (38); one end of the adjusting rod (34) is fixedly connected to a gear 1 (35); the gear 1 (35) is rotatably arranged on the feeding plate (31); the two gears 1 (35) are meshed with each other; one side of the upper end surface of the feeding plate (31) is fixedly connected to a motor 6 (36); the output end of the motor 6 (36) is fixedly connected to one end of the adjusting rod (34).

10. The wafer ultrasonic cleaning device according to claim 2, characterized in that: The lower end surface of the placement block (41) is fixedly connected to a fixing plate (48), one side of the upper end surface of the fixing plate (48) is fixedly connected to two sliding rods (44), the sliding rods (44) are slidably connected to one side of the positioning seat (61), the upper end of the sliding rods (44) is fixedly connected to a pressing plate (43), one side of the sliding rods (44) is sleeved with a spring (45), the upper end of the spring (45) is fixedly connected to the pressing plate (43), and the lower end is fixedly connected to the positioning seat (61), and one side of the upper end surface of the material taking plate (31) is fixedly connected to a cylinder (37), and the piston end of the cylinder (37) can contact the pressing plate (43) when it descends.

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