PCB (printed circuit board) slot processing method

Abstract

The invention discloses a PCB (Printed Circuit Board) slot processing method, which belongs to the technical field of PCB design and manufacture, and comprises the following steps of: manufacturing a plurality of first positioning bonding pads near a preset pattern position of a TOP (Total Operating Panel) surface of a target PCB, and manufacturing second positioning bonding pads on a Bottom surface of the target PCB corresponding to the positions of the first positioning bonding pads; the method comprises the following steps of: determining the optimal compensation values of the two surfaces of the slot position with the optimal processing precision on the TOP surface and the Bottom surface of the PCB, and finally manufacturing the slot position according to the optimal compensation values of the two surfaces and the theoretical processing position of the slot position, so that the position precision requirement of the PCB pattern on the TOP surface and the Bottom surface is realized, the processing position precision of the two surfaces of the PCB is improved, and the processing precision of the two surfaces of the PCB is improved. The problem that the processing position precision of the Bottom surface cannot be ensured when the PCB is processed at present is solved.

Description

Technical Field

[0001] The present invention relates to a method for processing PCB board slot positions, belonging to the technical field of PCB design and manufacturing. Background Art

[0002] With the iterative upgrade of products in PCB board processing, strict requirements are imposed on slot positions, graphic accuracy, and their relative position accuracy. In order to achieve control over position accuracy, currently, a CCD machine can be used to accurately position the graphic pads on the upper surface of the PCB board. Since the acquisition lens of the CCD machine is located on the upper table, it is impossible to take into account the graphic positioning on the lower surface of the PCB board. Eventually, there will be a problem that the processing position accuracy of the TOP surface of the PCB board is very high, but the processing position accuracy of the Bottom surface is not ideal. Summary of the Invention

[0003] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a method for processing PCB board slot positions, which can take into account the graphic positioning on both the TOP surface and the Bottom surface of the PCB board, improve the processing position accuracy of both sides of the PCB board, and solve the problem that the processing position accuracy of the Bottom surface cannot be ensured during the current PCB board processing.

[0004] To solve the above technical problems, the present invention is implemented by adopting the following technical solutions: The present invention provides a method for processing PCB board slot positions, including: Determine the theoretical processing position of the slot according to the preset graphic position on the target PCB board; Make a plurality of first positioning pads near the preset graphic position on the TOP surface of the target PCB board, and make second positioning pads on the Bottom surface of the target PCB board corresponding to the positions of the first positioning pads; Based on the positions of the first positioning pads and the second positioning pads, determine the best compensation values for both sides with the best processing accuracy of the slot on the TOP surface and the Bottom surface of the PCB board; Make the slot according to the theoretical processing position of the slot and the best compensation values for both sides.

[0005] Further, the step of making a plurality of first positioning pads near the preset graphic position on the TOP surface of the target PCB board and making second positioning pads on the Bottom surface of the target PCB board corresponding to the positions of the first positioning pads includes: According to the preset graphic position on the target PCB board, determine the shipping size and non-effective area near the preset graphic position on the TOP surface of the target PCB board; Determine the diameter of the first positioning pad and the size of the copper-free area of the first positioning pad within the shipping size and at a position close to the preset graphic in the non-effective area; At the position on the Bottom side of the target PCB board corresponding to the first positioning pad, determine the diameter of the second positioning pad and the size of the copper-free area of the second positioning pad, where the second positioning pad is the same size as the first positioning pad; Fabricate the first positioning pad and the second positioning pad according to the diameter of the first positioning pad, the size of the copper-free area of the first positioning pad, the diameter of the second positioning pad, and the size of the copper-free area of the second positioning pad.

[0006] Furthermore, the step of fabricating a plurality of first positioning pads near the preset pattern position on the TOP side of the target PCB board and fabricating the second positioning pad on the Bottom side of the target PCB board corresponding to the position of the first positioning pad further includes: According to the preset pattern position on the target PCB board, determine the shipping size and the non-effective area near the preset pattern position on the TOP side of the target PCB board; Determine the diameter of the first positioning pad and the size of the copper-free area of the first positioning pad at a position in the non-effective area close to the preset pattern; At the position on the Bottom side of the target PCB board corresponding to the first positioning pad, determine the diameter of the second positioning pad and the size of the copper-free area of the second positioning pad, where the second positioning pad is the same size as the first positioning pad; Fabricate the first positioning pad and the second positioning pad according to the diameter of the first positioning pad, the size of the copper-free area of the first positioning pad, the diameter of the second positioning pad, and the size of the copper-free area of the second positioning pad.

[0007] Even further, the step of fabricating the first positioning pad and the second positioning pad according to the diameter of the first positioning pad, the size of the copper-free area of the first positioning pad, the diameter of the second positioning pad, and the size of the copper-free area of the second positioning pad includes: Laser process the copper-free area and the hole ring around the first positioning pad according to the diameter of the first positioning pad, the diameter of the second positioning pad, and the size of the copper-free area of the first positioning pad; Based on the size of the copper-free area of the second positioning pad, the copper-free area and the hole ring around the first positioning pad, laser process the copper ring on the Bottom side of the target PCB board; Obtain the first positioning pad and the second positioning pad.

[0008] Even further, 0.5 mm ≤ the diameter of the first positioning pad ≤ 2.0 mm.

[0009] Even further, the copper ring on the Bottom side of the target PCB board is at least 0.25 mm larger than the copper-free area around the first positioning pad on each side.

[0010] Even further, the non-effective area includes the typesetting spacing between the shipping sizes.

[0011] The PCB slot processing method according to claim 1 is characterized in that, based on the positions of the first positioning pad and the second positioning pad, the optimal compensation values for both sides with the best processing accuracy of the slot on the TOP surface and the Bottom surface of the PCB board are determined, including: Obtain the coordinate data of the first positioning pad and the coordinate data of the second positioning pad; Based on the coordinate data of the first positioning pad, perform compensation calculation to determine the optimal compensation value for the TOP surface; Based on the coordinate data of the second positioning pad, perform compensation calculation to determine the optimal compensation value for the Bottom surface; According to the optimal compensation value for the TOP surface and the optimal compensation value for the Bottom surface, calculate the optimal compensation value for both sides.

[0012] Furthermore, the calculating the optimal compensation value for both sides according to the optimal compensation value for the TOP surface and the optimal compensation value for the Bottom surface includes: Calculate the optimal compensation value for both sides through the following formula: ; Where: X represents the coordinate of the optimal compensation value for both sides on the x axis in the rectangular coordinate system, Y represents the coordinate of the optimal compensation value for both sides on the y axis in the rectangular coordinate system; The optimal compensation value for the TOP surface is expressed as ( ); The optimal compensation value for the Bottom surface is expressed as ( ).

[0013] Furthermore, the manufacturing the slot according to the theoretical processing position of the slot and the optimal compensation value for both sides includes: Calculate the coordinates ( X’ , Y’ ) used for manufacturing the slot through the following formula:

[0014] Where: The coordinate of the theoretical processing position is expressed as ( X , Y）, The coordinate of the optimal compensation value for both sides is expressed as ( , ).

[0015] Compared with the prior art, the beneficial effects achieved by the present invention: 1. The present invention makes a plurality of first positioning pads near the preset graphic positions on the TOP surface of the target PCB board and makes second positioning pads on the Bottom surface of the target PCB board corresponding to the positions of the first positioning pads. Based on the positions of the first positioning pads and the second positioning pads, the two-sided optimal compensation values with the best machining accuracy of the slot on the TOP surface and the Bottom surface of the PCB board are determined. Finally, the slot is made through the two-sided optimal compensation values and the theoretical machining position of the slot, achieving the position accuracy requirements of the PCB board graphics on the TOP surface and the Bottom surface, improving the machining position accuracy of both sides of the PCB board, and solving the problem that the machining position accuracy of the Bottom surface cannot be ensured during the current PCB board processing.

[0016] 2. Based on the copper-free area size of the second positioning pad, the copper-free area and the hole ring around the first positioning pad, the present invention lasers to process a copper ring on the Bottom surface of the target PCB board, avoiding directly grasping the copper ring on the Bottom surface from the TOP surface when the PCB board is flipped, thereby obtaining the coordinate data of the second positioning pad and simplifying the processing steps. Description of the Drawings

[0017] Figure 1 is a flowchart of a method for processing a slot on a PCB board provided by an embodiment of the present invention; Figure 2 is a schematic diagram of the position of the first positioning pad in Embodiment 1 of the present invention; Figure 3 is a schematic diagram of the position of the first positioning pad in Embodiment 2 of the present invention; Figure 4 is a schematic diagram of the production of the first positioning pad and the second positioning pad in the embodiment of the present invention.

[0018] In the figure: 1. Shipping size; 2. Non-effective area; 3. First positioning pad; 4. Hole ring; 5. Copper ring; 6. Second positioning pad. Detailed Embodiment

[0019] The present invention will be further described below with reference to the drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present invention and cannot be used to limit the protection scope of the present invention.

[0020] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features.

[0021] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", "connection" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood through specific situations. Embodiment 1

[0022] As Figure 1 shown, a method for processing PCB board slot positions includes: Determine the theoretical processing position of the slot according to the preset graphic position on the target PCB board; in this example, taking the accuracy from the slot to the graphic as an example, the preset graphic is a gold finger, and the gold finger is designed on the TOP surface and the Bottom surface of the product; Make a plurality of first positioning pads 3 near the preset graphic position on the TOP surface of the target PCB board, and make second positioning pads 6 on the Bottom surface of the target PCB board corresponding to the positions of the first positioning pads 3. Specifically: As Figure 2 shown, according to the preset graphic position on the target PCB board, determine the shipping size 1 and the non-effective area 2 near the preset graphic position on the TOP surface of the target PCB board. In this example, the non-effective area 2 is the layout spacing between the shipping sizes 1; Determine the diameters of 2 first positioning pads 3 within the shipping size 1, and determine the diameters of 2 first positioning pads 3 at the position near the preset graphic in the non-effective area 2. The diameter of the first positioning pad 3 is 1.0 mm; Determine the copper-free area of the first positioning pad 3 at the edge of the first positioning pad 3, and the unilateral dimension is 0.2 mm; On the Bottom surface of the target PCB board, 4 second positioning pads 6 of the same size as the first positioning pad 3 are determined at the position corresponding to the first positioning pad 3, with a diameter of 1.0 mm. A copper-free area of the second positioning pad 6 is determined at the edge of the second positioning pad 6, with a unilateral size of 0.1 mm; As Figure 4 shown, according to the diameter of the first positioning pad 3, the diameter of the second positioning pad 6, and the size of the copper-free area of the first positioning pad 3, a copper-free area and a via ring 4 around the first positioning pad 3 are laser processed; Based on the size of the copper-free area of the second positioning pad 6, the copper-free area and the via ring 4 around the first positioning pad 3, a copper ring 5 on the Bottom surface of the target PCB board is laser processed, where the copper ring 5 on the Bottom surface is at least 0.25 mm larger than the copper-free area around the first positioning pad 3 on each side, and the extension direction of the size of the copper ring 5 is as Figure 4 shown by the arrow in The first positioning pad 3 and the second positioning pad 6 are obtained.

[0023] Based on the positions of the first positioning pad 3 and the second positioning pad 6, the best compensation values for both sides with the best machining accuracy on the TOP surface and the Bottom surface of the PCB board are determined. Specifically: The coordinate data of the first positioning pad 3 and the coordinate data of the second positioning pad 6 are obtained, including: The target PCB board is transferred to the CCD hole fishing station according to the processing flow, and the coordinate data of the first positioning pad 3 on the TOP surface is grabbed using the CCD function. The coordinate data of the first positioning pad 3 is expressed as ( ); Through the compensation operation by the CCD hole fishing station controller, the best compensation value for the TOP surface is determined. The best compensation value for the TOP surface is expressed as ( ); The target PCB board is flipped so that the Bottom surface faces up, and the coordinate data of the second positioning pad 6 is grabbed using the CCD function. The coordinate data of the second positioning pad 6 is expressed as ( ); Through the compensation operation by the CCD hole fishing station controller, the best compensation value for the Bottom surface is determined. The best compensation value for the Bottom surface is expressed as ( ); According to the best compensation value for the TOP surface and the best compensation value for the Bottom surface, the best compensation value for both sides is calculated by the following formula: ; Where: represents the coordinate of the best compensation value for both sides on the x axis in the rectangular coordinate system, represents the coordinate of the best compensation value for both sides on the y axis in the rectangular coordinate system.

[0024] The theoretical machining position coordinates are expressed as ( X , Y）， The coordinates for making the slot are calculated by the following formula ( X’ , Y’ ):

[0025] According to the theoretical machining position of the slot and the optimal compensation values for both sides, the slot is made, meeting the position accuracy requirements of the PCB board pattern on the TOP side and the Bottom side, and improving the machining position accuracy of both sides of the PCB board. Embodiment 2

[0026] As Figure 1 shown, a method for machining slots on a PCB board includes: Determine the theoretical machining position of the slot according to the preset pattern position on the target PCB board; in this example, taking the accuracy from the slot to the pattern as an example, the preset pattern is a gold finger, and the gold fingers are designed on the TOP side and the Bottom side of the product; Make a plurality of first positioning pads 3 near the preset pattern position on the TOP side of the target PCB board, and make second positioning pads 6 on the Bottom side of the target PCB board corresponding to the positions of the first positioning pads 3. Specifically: As Figure 3 shown, according to the preset pattern position on the target PCB board, determine the shipping size 1 and the non-effective area 2 near the preset pattern position on the TOP side of the target PCB board. In this example, the non-effective area 2 is the typesetting spacing between the shipping sizes 1; Determine the diameters of 4 first positioning pads 3 at positions near the preset pattern in the non-effective area 2. The diameter of the first positioning pads 3 is 1.0 mm, and determine the copper-free area of the first positioning pads 3 at the edges, with a unilateral size of 0.2 mm; Determine 4 second positioning pads 6 on the Bottom side of the target PCB board that are the same size as the first positioning pads 3 corresponding to the positions of the first positioning pads 3, with a diameter of 1.0 mm, and determine the copper-free area of the second positioning pads 6 at the edges, with a unilateral size of 0.1 mm; As Figure 4 shown, according to the diameter of the first positioning pads 3, the diameter of the second positioning pads 6, and the size of the copper-free area of the first positioning pads 3, laser machine the copper-free area and the hole ring 4 around the first positioning pads 3; Based on the size of the copper-free area of the second positioning pads 6, the copper-free area and the hole ring 4 around the first positioning pads 3, laser machine the copper ring 5 on the Bottom side of the target PCB board, where the copper ring 5 on the Bottom side is at least 0.25 mm larger than the unilateral size of the copper-free area around the first positioning pads 3, and the extension direction of the size of the copper ring 5 is asFigure 4 as shown by the arrow therein; The first positioning pad 3 and the second positioning pad 6 are obtained.

[0027] Based on the positions of the first positioning pad 3 and the second positioning pad 6, the optimal compensation values for the two sides with the best machining accuracy of the slot on the TOP surface and the Bottom surface of the PCB board are determined. Specifically: The coordinate data of the first positioning pad 3 and the coordinate data of the second positioning pad 6 are obtained, including: Transfer the target PCB board to the CCD hole fishing station according to the processing flow, and use the CCD function to capture the coordinate data of the first positioning pad 3 on the TOP surface. The coordinate data of the first positioning pad 3 is expressed as ( ); Through the compensation operation by the CCD hole fishing station controller, the optimal compensation value for the TOP surface is determined. The optimal compensation value for the TOP surface is expressed as ( ); The PCB does not need to be moved. Readjust the lens focal length of the CCD hole fishing station, directly grab the copper ring 5 on the Bottom surface from the TOP surface, and then obtain the coordinate data of the second positioning pad 6, which simplifies the processing steps. The coordinate data of the second positioning pad 6 is expressed as ( ); Through the compensation operation by the CCD hole fishing station controller, the optimal compensation value for the Bottom surface is determined. The optimal compensation value for the Bottom surface is expressed as ( ); According to the optimal compensation value for the TOP surface and the optimal compensation value for the Bottom surface, the optimal compensation value for the two sides is calculated by the following formula: ; Wherein: represents the coordinate of the optimal compensation value for the two sides on the x axis in the rectangular coordinate system, represents the coordinate of the optimal compensation value for the two sides on the y axis in the rectangular coordinate system.

[0028] The theoretical machining position coordinate is expressed as ( X , Y）， The coordinates used for making the slot are calculated by the following formula ( X’ , Y’ ):

[0029] According to the theoretical machining position of the slot and the optimal compensation value for the two sides, the slot is made, realizing the position accuracy requirements of the PCB board pattern on the TOP surface and the Bottom surface, and improving the machining position accuracy of the two sides of the PCB board.

[0030] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the technical principle of the present invention, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A PCB board slot processing method, characterized in that: include: Determine the theoretical processing position of the slot according to the preset graphic position on the target PCB board; A plurality of first positioning pads are made near the preset graphic positions on the TOP surface of the target PCB board, and a second positioning pad is made on the Bottom surface of the target PCB board corresponding to the positions of the first positioning pads; Based on the positions of the first positioning pad and the second positioning pad, determine the optimal compensation values ​​of the slot on the top and bottom surfaces of the PCB board with the best processing accuracy; The slot is made according to the theoretical processing position of the slot and the optimal compensation value on both sides.

2. The PCB slot processing method according to claim 1 is characterized in that: The method of manufacturing a plurality of first positioning pads near the preset graphic positions on the TOP surface of the target PCB board, and manufacturing a second positioning pad on the Bottom surface of the target PCB board corresponding to the positions of the first positioning pads, comprises: According to the preset graphic position on the target PCB board, the shipping size and non-valid area near the preset graphic position are determined on the TOP surface of the target PCB board; Determine the diameter of the first positioning pad and the size of the copper-free area of ​​the first positioning pad at a position close to the preset pattern within the shipping size and the non-effective area; At the position of the first positioning pad on the Bottom surface of the target PCB board, determine the diameter of the second positioning pad and the size of the copper-free area of ​​the second positioning pad, wherein the second positioning pad is the same size as the first positioning pad; The first positioning pad and the second positioning pad are manufactured according to the first positioning pad diameter, the size of the first positioning pad copper-free area, the second positioning pad diameter and the size of the second positioning pad copper-free area.

3. The PCB slot processing method according to claim 1 is characterized in that: The method of manufacturing a plurality of first positioning pads near the preset graphic position on the TOP surface of the target PCB board, and manufacturing a second positioning pad on the Bottom surface of the target PCB board corresponding to the position of the first positioning pads, further includes: According to the preset graphic position on the target PCB board, the shipping size and non-valid area near the preset graphic position are determined on the TOP surface of the target PCB board; Determine the diameter of the first positioning pad and the size of the copper-free area of ​​the first positioning pad at a position close to the preset pattern in the non-effective area; At the position of the first positioning pad on the Bottom surface of the target PCB board, determine the diameter of the second positioning pad and the size of the copper-free area of ​​the second positioning pad, wherein the second positioning pad is the same size as the first positioning pad; The first positioning pad and the second positioning pad are manufactured according to the first positioning pad diameter, the size of the first positioning pad copper-free area, the second positioning pad diameter and the size of the second positioning pad copper-free area.

4. The PCB slot processing method according to claim 2 or 3, characterized in that: The method of manufacturing the first positioning pad and the second positioning pad according to the first positioning pad diameter, the size of the first positioning pad copper-free area, the second positioning pad diameter and the size of the second positioning pad copper-free area comprises: According to the diameter of the first positioning pad, the diameter of the second positioning pad and the size of the copper-free area of ​​the first positioning pad, laser processing is performed to form a copper-free area and an annular ring around the first positioning pad; Based on the size of the copper-free area of ​​the second positioning pad, the copper-free area around the first positioning pad and the hole ring, a copper ring is laser processed on the bottom surface of the target PCB board; A first positioning pad and a second positioning pad are obtained.

5. The PCB slot processing method according to claim 4 is characterized in that: The diameter of the first positioning pad is 0.5 mm ≤ the diameter of the first positioning pad ≤ 2.0 mm.

6. The PCB slot processing method according to claim 4 is characterized in that: The copper ring on the bottom surface of the target PCB board is at least 0.25 mm larger than the single side of the copper-free area around the first positioning pad.

7. The PCB slot processing method according to claim 2 or 3, characterized in that: The non-valid area includes the layout spacing between shipping sizes.

8. The PCB slot processing method according to claim 1 is characterized in that: The method of determining the optimal compensation values ​​of the slot on the top and bottom surfaces of the PCB board with the best processing accuracy based on the positions of the first positioning pad and the second positioning pad includes: Acquire coordinate data of the first positioning pad and coordinate data of the second positioning pad; Perform compensation calculation based on the coordinate data of the first positioning pad to determine the optimal compensation value of the TOP surface; Perform compensation calculation based on the coordinate data of the second positioning pad to determine the optimal compensation value of the Bottom surface; According to the optimal compensation value of the top surface and the optimal compensation value of the bottom surface, the optimal compensation values ​​of the two surfaces are calculated.

9. The PCB slot processing method according to claim 8, characterized in that: The method of calculating the optimal compensation values ​​of the two surfaces according to the optimal compensation value of the top surface and the optimal compensation value of the bottom surface includes: The optimal compensation value for both sides is calculated by the following formula: ； in: Indicates the optimal compensation value of the two sides in the rectangular coordinate system x The coordinates of the axes, Indicates the optimal compensation value of the two sides in the rectangular coordinate system y The coordinates of the axes; The optimal compensation value of TOP surface is expressed as ( ); The optimal compensation value of the bottom surface is expressed as ( ).

10. The PCB slot processing method according to claim 1, characterized in that: The method of making the slot according to the theoretical processing position of the slot and the optimal compensation values ​​of the two sides includes: The coordinates used to make the slot are calculated using the following formula ( X’ , Y’ ): X’ = X + ； Y’ = Y + ； Among them: The theoretical processing position coordinates are expressed as ( X , Y）, The coordinates of the optimal compensation values ​​of the two sides are expressed as ( , ).

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