A semiconductor chip mounting device for PCB board

Abstract

The present invention belongs to the technical field of integrated circuit processing, and specifically is a semiconductor patch device for PCB boards, comprising a support table, a group of conveyor belts are installed on both sides of the support table, and each group of conveyor belts is symmetrically provided with two. A PCB board is provided inside the support table, and both ends of the PCB board are clamped between each group of conveyor belts. A support assembly is provided in the middle of each conveyor belt. A mesh plate is provided inside the support table below the middle of the conveyor belt, and a scraper is provided below the mesh plate. A baffle is fixed to the bottom of one side of the scraper head inclined surface, and a spray rack is fixed to the bottom end of the baffle. A support plate is provided on one side of the scraper head, and a plurality of protrusions are fixed to the bottom end of the support plate, and the number and position of the plurality of protrusions match the number and position of the mesh holes of the mesh plate. The support plate pushes the protrusions to push out the solder paste inside the mesh holes of the mesh plate, and the scraper head scrapes the material from the bottom of the mesh plate when resetting, so that the surface of the mesh plate and the inside of the mesh holes can be cleaned.

Description

Technical Field

[0001] The invention belongs to the technical field of integrated circuit processing, in particular to a semiconductor chip mounting device for a PCB board. Background Art

[0002] PCB board is a physical carrier of electronic components. Integrated circuit is a miniature electronic device. Integrated circuit is composed of components such as transistors, resistors, capacitors and inductors and interconnected wiring. Therefore, when processing integrated circuits, components need to be soldered on the PCB board. During soldering, semiconductor patch devices are required to operate.

[0003] A patent application with the existing publication number CN28317515A discloses a positioning mechanism for PCB patches. The upper ends of several contact rings are connected to a limit ring via a second spring, thereby supporting the area of the PCB board where the hole will be drilled. When the spiral drill bit moves into the receiving groove, several brushes generate a large friction force between the rotating drill bit, scraping impurities off the surface of the spiral drill bit.

[0004] During the processing of existing PCB board semiconductor patch devices, it is necessary to print solder paste on the bottom of the PCB board, and then attach the components to the surface of the PCB board and solder them together through reflow soldering. However, when printing the solder paste, there will be solder paste residue on the surface of the stencil. When the liquid inside the solder paste evaporates, it will form a fixed adhesion on the surface of the stencil, and solder paste will also remain inside the mesh. In subsequent printing, it is easy to cause the amount of solder paste printed on the surface of the PCB board to decrease, and the connection between the component and the PCB board is not stable enough during welding.

[0005] To this end, the present invention provides a semiconductor chip mounting device for a PCB board. Summary of the Invention

[0006] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0007] The technical solution adopted by the present invention to solve its technical problems is: the present invention describes a semiconductor patch device for PCB boards, comprising a support table, a group of conveyor belts installed on both sides of the support table, two conveyor belts symmetrically arranged in each group, a PCB board arranged in the support table, both ends of the PCB board clamped between each group of conveyor belts, a support assembly arranged in the middle of each conveyor belt, a mesh plate arranged below the middle of the conveyor belt in the support table, a scraper head arranged below the mesh plate, a scraper assembly arranged below the scraper head, a baffle fixed to the bottom of one side of the scraper head inclined surface, a spray rack fixed to the bottom end of the baffle, an output assembly arranged on one side of the spray rack, a collecting trough arranged on the side of the scraper head away from the baffle, a support plate arranged on one side of the scraper head, a plurality of protrusions fixed to the bottom end of the support plate, the number and position of the plurality of protrusions matching the number and position of the mesh holes of the mesh plate.

[0008] Preferably, the scraper assembly includes a support shell fixed to the bottom end of the mesh plate, a movable plate is provided below the scraper head, a threaded column is rotatably connected to the inside of the support shell, an electric telescopic rod is installed on the side of the support shell away from the support plate, the rotating shaft end of the electric telescopic rod is fixedly connected to one end of the threaded column, the movable plate and the threaded column are threadedly connected, two electric telescopic rods are installed at the bottom end of the support shell, and the bottom end of the electric telescopic rod is installed inside the support platform.

[0009] Preferably, a lifting column is fixed to the bottom end of the scraping head, the lifting column is inserted into the top end of the movable plate, and a fourth spring is fixed to the bottom end of the lifting column, and the bottom end of the fourth spring is fixedly connected to the movable plate.

[0010] Preferably, the output component includes an air cylinder installed inside the supporting shell, the push rod of the air cylinder is fixedly connected to the movable plate, a solder paste cylinder is installed on one side inside the supporting shell, the air inlet of the solder paste cylinder is connected to the air outlet of the air cylinder through a pipe, and the discharge port of the solder paste cylinder is connected to the feed port of the spray rack through a pipe.

[0011] Preferably, an extension rod is provided on the side of the support plate away from the support shell, and a lifting plate is sleeved on the outside of the extension rod. Two guide frames are fixed on the side of the lifting plate away from the mesh plate, and a guide rod is fixed inside the guide frame. Guide blocks are fixed on both sides of the end of the extension rod away from the mesh plate, and the guide block is slidably connected to the inside of the guide frame, and the guide rod passes through the inside of the guide block. A first spring is sleeved on the outside of the guide rod, and one end of the first spring is fixedly connected to the side of the guide block away from the mesh plate, and the other end of the first spring is fixedly connected to the guide frame.

[0012] Preferably, a support block is slidably connected to the lower part of the lifting plate, the bottom end of the support block is fixedly connected to the support shell through an extension plate, a second spring is fixed to the top end of the support block, and the top end of the second spring is fixedly connected to the lifting plate.

[0013] Preferably, a lifting block is fixed on one side of the mesh plate close to the extension rod, and a movable cavity is opened on one end of the extension rod close to the mesh plate. The lifting block is slidably connected to the inside of the movable cavity, and a guide column is fixed inside the movable cavity. A third spring is sleeved on the outside of the guide column, and the bottom end of the third spring is fixedly connected to the lifting block, and the top end of the third spring is fixedly connected to the inner wall of the movable cavity.

[0014] Preferably, a first pull rope is fixed to the top of the lifting block, the first pull rope passes through the inside of the extension rod, and the first pull rope passes through the inside of the lifting plate, the end of the first pull rope away from the lifting block is fixedly connected to the bottom end inside the support platform, the elastic force of the first spring is greater than the elastic force of the third spring, and the elastic force of the second spring is greater than the elastic force of the first spring.

[0015] Preferably, two sliders are provided on the side of the support shell away from the mesh plate, a slide rod is fixed between the two sliders, a scraper is slidably connected to the outside of the slide rod, a threaded rod is rotatably connected between the two sliders, the threaded rod and the scraper are threadedly connected, a gear is fixed at one end of the threaded rod, a toothed belt is meshed and connected to the bottom of the gear, the toothed belt is rotatably connected to one side of the support shell through a pulley, a second motor is installed inside the support shell, and the end of the rotating shaft of the second motor is fixedly connected to the pulley of the toothed belt.

[0016] Preferably, sliding grooves are provided on both sides of the interior of the support shell, the slider is slidably connected to the interior of the sliding groove, a fifth spring is fixed to the bottom end of the slider, the bottom end of the fifth spring is fixedly connected to the inner wall of the sliding groove, a second pull rope passes through the interior of the fifth spring, the second pull rope passes through the interior of the support shell, and the end of the second pull rope away from the slider is fixedly connected to the side wall of the support shell.

[0017] The beneficial effects of the present invention are as follows:

[0018] 1. The semiconductor patch device for a PCB board described in the present invention pushes the bumps through the support plate to eject the solder paste inside the mesh of the stencil, and scrapes the material from the bottom of the stencil when the scraper head is reset, thereby cleaning the stencil surface and the inside of the mesh.

[0019] 2. The semiconductor patch device for a PCB board described in the present invention can control the support plate to automatically complete the storage and expansion actions during the lifting process by tightening and loosening the first pull rope during the lifting and lowering of the support component and coordinating the elastic forces of the third spring, the first spring, and the second spring. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention will be further described below with reference to the accompanying drawings.

[0021] Figure 1 It is a perspective view of the present invention;

[0022] Figure 2 It is a schematic diagram of the internal structure of the support platform in the present invention;

[0023] Figure 3 It is a schematic diagram of the screen structure of the present invention;

[0024] Figure 4 It is a schematic diagram of the support plate structure in the present invention;

[0025] Figure 5 This is a schematic diagram of the internal structure of the telescopic rod in the present invention;

[0026] Figure 6 yes Figure 5 A partial enlarged view of the middle part;

[0027] Figure 7 Schematic diagram of the internal structure of the support shell in the present invention;

[0028] Figure 8 It is a schematic diagram of the structure of the movable plate in the present invention;

[0029] Figure 9 It is a schematic diagram of the sliding rod structure of the present invention;

[0030] Figure 10 yes Figure 9 A partial enlarged view of point B in the middle;

[0031] Figure 11 This is a schematic diagram of the chute structure in the present invention

[0032] In the figure: 1, support platform; 2, conveyor belt; 21, support assembly; 3, PCB board; 4, mesh board; 41, support shell; 411, first motor; 412, threaded column; 413, inflatable cylinder; 414, solder paste cylinder; 415, spray rack; 416, baffle; 417, slide; 42, electric telescopic rod; 43, support plate; 431, bump; 432, extension rod; 433, lifting plate; 434, first pull rope; 435, guide frame; 436, guide Rod; 437, first spring; 438, support block; 439, second spring; 44, lifting block; 441, movable chamber; 442, third spring; 45, scraper head; 451, collecting trough; 452, movable plate; 453, fourth spring; 454, lifting column; 46, slider; 461, scraper; 462, slide rod; 463, threaded rod; 464, gear; 465, toothed belt; 466, second motor; 467, fifth spring; 468, second pull rope. DETAILED DESCRIPTION

[0033] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0034] like Figures 1 to 4As shown, a semiconductor patch device for PCB boards described in an embodiment of the present invention includes a support table 1, a group of conveyor belts 2 are installed on both sides of the support table 1, and each group of conveyor belts 2 is symmetrically provided with two, a PCB board 3 is provided inside the support table 1, and both ends of the PCB board 3 are clamped between each group of conveyor belts 2, and a support assembly 21 is provided in the middle of the interior of each conveyor belt 2, a screen plate 4 is provided below the middle of the conveyor belt 2 inside the support table 1, a scraper head 45 is provided below the screen plate 4, and a scraper assembly is provided below the scraper head 45, a baffle 416 is fixed to the bottom of one side of the inclined surface of the scraper head 45, a spray rack 415 is fixed to the bottom end of the baffle 416, an output assembly is provided on one side of the spray rack 415, a collecting trough 451 is provided on the side of the scraper head 45 away from the baffle 416, a support plate 43 is provided on one side of the scraper head 45, and a plurality of protrusions 431 are fixed to the bottom end of the support plate 43, and the number and position of the plurality of protrusions 431 match the number and position of the mesh holes of the screen plate 4;

[0035] During the processing of printed circuits, components need to be soldered on the PCB board 3. Therefore, operations such as patching need to be performed on the PCB board 3 during the processing. Before patching, solder paste needs to be printed on the surface of the PCB board 3. At this time, the PCB board 3 will be transported to the printing position. At this time, the motor of the conveyor belt 2 is started to drive the conveyor belt to roll, and then the PCB board 3 is loaded into the position between the conveyor belts 2. The PCB board 3 can be moved by the rolling of the conveyor belt 2. At this time, the conveyor belt 2 transports the PCB board 3 to the position of the support component 21, and then the conveyor belt 2 stops rolling. At this time, the PCB board 3 is transported to the position of the support component 21. The B board 3 is placed above the stencil 4, and the positions of the PCB board 3 and the stencil 4 are aligned. Then the output component and the scraper component are started. At this time, the spray rack 415 outputs solder paste, and the scraper component drives the scraper head 45 to move. At this time, the scraper head 45 can apply the solder paste to the bottom of the stencil 4. During the coating process, the solder paste will contact the surface of the PCB board 3 through the mesh of the stencil 4 and adhere to the surface of the PCB board 3. At this time, printing is completed. Then the conveyor belt 2 is started to drive the PCB board 3 to the patch area for patching. After patching, the PCB board 3 and the components are soldered together through reflow soldering;

[0036] After the stencil 4 is printed, a portion of solder paste will remain on its surface and inside the mesh. After multiple printings, the remaining solder paste will solidify on the surface and inside the mesh of the stencil 4 due to evaporation of the internal liquid. At this time, the amount of solder paste that can be printed on the PCB board 3 will be reduced during the subsequent printing process, resulting in an unstable connection between the component and the PCB board 3. Therefore, the stencil 4 needs to be cleaned. The scraper head 45 will reset after each use. During the reset process, the scraper head 45 will reversely scrape the bottom of the stencil 4 once. During this process, the scraper head 45 can clean the bottom of the stencil 4. At the same time, a collection device is provided on one side of the scraper head 45. The groove 451 can receive the scraped solder paste. After multiple uses, the support plate 43 is moved to the top of the stencil 4, and then the protrusion 431 under the support plate 43 is aligned with the mesh of the stencil 4. The support plate 43 is moved downward to insert the protrusion 431 into the mesh of the stencil 4. At this time, the protrusion 431 can push out the solder paste remaining in the mesh of the stencil 4. At this time, the scraper head 45 is moved in the opposite direction to scrape the bottom of the stencil 4 to scrape off the solder paste inside the mesh. At this time, the stencil 4 can be kept in a relatively clean state, and there is no need to remove the stencil 4 for cleaning in a short time. The stencil 4 can be removed for cleaning after long-term use.

[0037] like Figures 1 to 7 As shown, the scraper assembly includes a support shell 41 fixed to the bottom end of the screen plate 4, a movable plate 452 is provided below the scraper head 45, a threaded column 412 is rotatably connected to the interior of the support shell 41, an electric telescopic rod 42 is installed on the side of the support shell 41 away from the support plate 43, the rotating shaft end of the electric telescopic rod 42 is fixedly connected to one end of the threaded column 412, the movable plate 452 is threadedly connected to the threaded column 412, and two electric telescopic rods 42 are installed at the bottom end of the support shell 41, and the bottom ends of the electric telescopic rods 42 are installed inside the support platform 1;

[0038] During the printing process, when the PCB board 3 moves to the top position of the screen plate 4, friction will occur between them, so they need to be separated first. At this time, the PCB board 3 first moves to the top of the screen plate 4, and then the electric telescopic rod 42 is started to push up the support shell 41, and the support shell 41 drives the screen plate 4 to move to the bottom position of the PCB board 3. Then, the first motor 411 is started to drive the threaded column 412 to rotate, and the threaded column 412 drives the moving plate 452 to move, and the moving plate 452 drives the scraper 45 to move, so that the scraper head 45 can scrape the material from the bottom of the screen plate 4. After scraping, the screen plate 4 and the PCB board 3 need to be separated first. At this time, the electric telescopic rod 42 is started to drive the support shell 41 to move the screen plate 4 downward, and then the PCB board 3 can be transported to the patch position through the conveyor belt 2.

[0039] like Figures 1 to 8As shown, a lifting column 454 is fixed to the bottom end of the scraping head 45, and the lifting column 454 is inserted into the top inner portion of the movable plate 452. A fourth spring 453 is fixed to the bottom end of the lifting column 454, and the bottom end of the fourth spring 453 is fixedly connected to the movable plate 452.

[0040] During the use of the scraper head 45, friction will be generated with the bottom of the stencil 4. In order to prevent a gap from appearing between the scraper head 45 and the stencil 4 due to long-term friction, a fourth spring 453 is provided. During the use of the scraper head 45, the elastic force of the fourth spring 453 pushes the lifting column 454 to push the scraper head 45 up and press it against the bottom of the stencil 4. At this time, the gap between the scraper head 45 and the stencil 4 can be automatically adjusted to prevent the gap from being too large and the solder paste from being unable to be scraped.

[0041] like Figures 1 to 7 As shown, the output assembly includes an air cylinder 413 installed inside the support shell 41, a push rod of the air cylinder 413 is fixedly connected to the movable plate 452, a solder paste cylinder 414 is installed on one side inside the support shell 41, an air inlet of the solder paste cylinder 414 is connected to the air outlet of the air cylinder 413 via a pipe, and a discharge port of the solder paste cylinder 414 is connected to the feed port of the spray rack 415 via a pipe;

[0042] When the movable plate 452 moves, it pushes the inflation cylinder 413 to inflate. At this time, the inflation cylinder 413 fills the gas into the interior of the solder paste cylinder 414. The interior of the solder paste cylinder 414 is squeezed by the gas and the solder paste can be output to the interior of the spray rack 415. In this way, the solder paste can be automatically output by scraping the scraper 45, which can make the spray rack 415 output the solder paste more uniformly. When the movable plate 452 is reset, the inflation cylinder 413 can automatically inhale and reset.

[0043] like Figures 1 to 6 As shown, an extension rod 432 is provided on the side of the support plate 43 away from the support shell 41, and a lifting plate 433 is sleeved on the outside of the extension rod 432. Two guide frames 435 are fixed to the side of the lifting plate 433 away from the mesh plate 4. A guide rod 436 is fixed inside the guide frame 435. Guide blocks are fixed on both sides of the end of the extension rod 432 away from the mesh plate 4. The guide blocks are slidably connected to the inside of the guide frames 435, and the guide rod 436 runs through the inside of the guide blocks. A first spring 437 is sleeved on the outside of the guide rod 436, and one end of the first spring 437 is fixedly connected to the side of the guide block away from the mesh plate 4, and the other end of the first spring 437 is fixedly connected to the guide frame 435.

[0044] In order to prevent the support plate 43 from affecting the printing of the screen 4, an extension rod 432 is set. After the screen 4 is used, the extension rod 432 pulls the support plate 43. At this time, the support plate 43 is moved away from the top of the screen 4. At this time, the guide block of the extension rod 432 slides inside the guide frame 435. The guide rod 436 limits and guides the guide block of the extension rod 432. At the same time, the guide block squeezes the first spring 437, which can move the support plate 43 away from the top of the screen 4 to prevent the support plate 43 from interfering with the conveyor belt 2 to drive the PCB board 3 to move.

[0045] like Figures 1 to 6 As shown, a support block 438 is slidably connected to the lower part of the lifting plate 433. The bottom end of the support block 438 is fixedly connected to the support shell 41 through an extension plate. A second spring 439 is fixed to the top of the support block 438. The top end of the second spring 439 is fixedly connected to the lifting plate 433.

[0046] After the support plate 43 is moved away from above the mesh plate 4, the height of the support plate 43 will block the movement of the PCB board 3. Therefore, after the support plate 43 is moved away, the lifting plate 433 moves downward to drive the extension rod 432 to move downward. At this time, the extension rod 432 can drive the support plate 43 to move downward. At this time, the support plate 43 will not block the movement of the PCB board 3, and the second spring 439 is squeezed.

[0047] like Figures 1 to 6 As shown, a lifting block 44 is fixed to one side of the mesh plate 4 close to the extension rod 432, and a movable cavity 441 is opened at one end of the extension rod 432 close to the mesh plate 4. The lifting block 44 is slidably connected to the interior of the movable cavity 441, and a guide column is fixed to the interior of the movable cavity 441. A third spring 442 is sleeved on the outside of the guide column. The bottom end of the third spring 442 is fixedly connected to the lifting block 44, and the top end of the third spring 442 is fixedly connected to the inner wall of the movable cavity 441.

[0048] After the support plate 43 moves to the top of the mesh plate 4, a lifting block 44 is set to clean the mesh of the mesh plate 4 so that the protrusion 431 can be lifted and lowered. The lifting block 44 can be lifted and lowered inside the movable cavity 441. When lifted, the third spring 442 will be squeezed. In this way, the support plate 43 can drive the protrusion 431 to lift and lower.

[0049] like Figures 1 to 6 As shown, a first pull rope 434 is fixed to the top of the lifting block 44, the first pull rope 434 passes through the interior of the extension rod 432, and the first pull rope 434 passes through the interior of the lifting plate 433, and the end of the first pull rope 434 away from the lifting block 44 is fixedly connected to the bottom end inside the support platform 1, the elastic force of the first spring 437 is greater than the elastic force of the third spring 442, and the elastic force of the second spring 439 is greater than the elastic force of the first spring 437;

[0050] In the initial state, the electric telescopic rod 42 pushes the support shell 41 to the highest position. At this time, the mesh plate 4 is close to the bottom of the PCB board 3, and the support plate 43 is separated from the mesh plate 4. At this time, the first pull rope 434 is in a taut state, and the third spring 442, the first spring 437 and the second spring 439 are all in a squeezed state. After the mesh plate 4 has been used many times, the mesh needs to be cleaned. At this time, the electric telescopic rod 42 is started to drive the support shell 41 to move downward. During the movement, the support shell 41 drives the support plate 43 and the entire assembly below to move downward. During this process, the first pull rope 434 will be gradually relaxed. Because the elastic forces of the third spring 442, the first spring 437 and the second spring 439 are different, the second spring 439 will rebound first. At this time, the support The height of the plate 43 is restored, and then the first spring 437 will rebound. At this time, the position of the support plate 43 moves to the upper position of the mesh plate 4, and finally the third spring 442 rebounds. At this time, the third spring 442 pushes the lifting block 44 to drive the support plate 43 to insert the protrusion 431 into the mesh of the mesh plate 4. At this time, the protrusion 431 can clean the mesh inside of the mesh plate 4. When the cleaning is completed and the support shell 41 is reset, the first pull rope 434 is tightened to first drive the third spring 442 to press, so that the protrusion 431 is separated from the mesh inside of the mesh plate 4, and then drive the first spring 437 to tighten to separate the support plate 43 from the top of the mesh plate 4, and then pull the lifting plate 433 to move downward to compress the second spring 439, so that the support plate 43 can be automatically moved during the lifting process of the support shell 41.

[0051] When the support assembly 21 descends and the first pull rope 434 is relaxed, the elastic force of the second spring 439 is greater than the sum of the elastic forces of the first spring 437 and the third spring 442, so that it can be relaxed first. The elastic forces of the first spring 437 and the third spring 442 are both less than the elastic force of the second spring 439. At this time, the area where the first pull rope 434 is placed between the third spring 442 and the first spring 437 is tightened by the elastic force of the second spring 439, so that the shapes of the first spring 437 and the third spring 442 do not change while the second spring 439 recovers. Subsequently, the first spring 437 recovers first, and the third spring 442 recovers last.

[0052] During the process of tightening the first pull rope 434 when the support assembly 21 rises, because the elastic force of the first spring 437 and the second spring 439 is much greater than the elastic force of the third spring 442, the third spring 442 can be tightened first, then the first spring 437 is tightened, and finally the second spring 439 is tightened, so that the second spring 439, the first spring 437 and the third spring 442 can be relaxed and tightened in sequence, which is convenient for controlling the moving position of the support plate 43.

[0053] like Figures 1 to 11As shown, two sliders 46 are provided on the side of the support shell 41 away from the screen plate 4, a slide rod 462 is fixed between the two sliders 46, and a scraper 461 is slidably connected to the outside of the slide rod 462, a threaded rod 463 is rotatably connected between the two sliders 46, and the threaded rod 463 is threadedly connected to the scraper 461, and a gear 464 is fixed to one end of the threaded rod 463, and a toothed belt 465 is meshed and connected to the bottom of the gear 464, and the toothed belt 465 is rotatably connected to one side of the support shell 41 through a rotating wheel, and a second motor 466 is installed inside the support shell 41, and the end of the rotating shaft of the second motor 466 is fixedly connected to the rotating wheel of the toothed belt 465;

[0054] After the scraper head 45 scrapes the material from the bottom of the stencil 4, there will be residual solder paste on the surface of the scraper head 45. At this time, in order to prevent the solder paste from being smeared on the bottom of the stencil 4 when the scraper head 45 is reset, a scraper 461 is set. When the scraper head 45 completes scraping, one side of the scraper 461 is attached to the area above the inclined surface of the scraper head 45. The second motor 466 is started to drive the toothed belt 465 to rotate. The toothed belt 465 drives the gear 464 to rotate the threaded rod 463. At this time, the threaded rod 463 drives the scraper 461 to move. When the scraper 461 moves, it can scrape the material above the inclined surface of the scraper head 45. At this time, the solder paste in the area above the inclined surface of the scraper head 45 can be scraped and moved downward. At this time, the solder paste on the inclined surface of the scraper head 45 can slide to the connection with the baffle 416.

[0055] like Figures 1 to 11 As shown, a slide groove 417 is provided on both sides of the interior of the support shell 41, and the slider 46 is slidably connected to the interior of the slide groove 417. A fifth spring 467 is fixed to the bottom end of the slider 46, and the bottom end of the fifth spring 467 is fixedly connected to the inner wall of the slide groove 417. A second pull rope 468 runs through the interior of the fifth spring 467, and the second pull rope 468 passes through the interior of the support shell 41. The end of the second pull rope 468 away from the slider 46 is fixedly connected to the side wall of the support shell 41.

[0056] After multiple uses, the stencil 4 is cleaned. The support shell 41 moves downward, and during this movement, the second pull cord 468 is tightened, pulling the slider 46 downward toward the bottom of the chute 417. The scraper 461 moves downward, and the bottom of the scraper 461 can be close to the connection between the scraper head 45 and the baffle 416. The second motor 466 then continues to drive the scraper 461 to scrape the surface of the scraper head 45 and the baffle 416, removing the remaining solder paste and collecting it in a container on the side of the support shell 41, making it convenient for the solder paste to be recycled and reused. When the support assembly 21 rises, the second pull cord 468 is relaxed, causing the fifth spring 467 to push the slider 46 back to its original position.

[0057] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the foregoing embodiments. The foregoing embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip mounting device for a PCB board, characterized by: It includes a support table, a group of conveyor belts are installed on both sides of the interior of the support table, and each group of conveyor belts is symmetrically provided with two, a PCB board is provided inside the support table, and both ends of the PCB board are clamped between each group of conveyor belts, and a support assembly is provided in the middle of each conveyor belt, a mesh plate is provided inside the support table below the middle of the conveyor belt, a scraper head is provided below the mesh plate, and a scraper assembly is provided below the scraper head, a baffle is fixed to the bottom of one side of the inclined surface of the scraper head, a spray rack is fixed to the bottom end of the baffle, an output assembly is provided on one side of the spray rack, a collecting trough is provided on the side of the scraper head away from the baffle, a support plate is provided on one side of the scraper head, and a plurality of protrusions are fixed to the bottom end of the support plate, and the number and position of the plurality of protrusions match the number and position of the mesh holes of the mesh plate; The scraper assembly includes a support shell fixed to the bottom end of the screen plate, a movable plate is provided below the scraper head, a threaded column is rotatably connected to the interior of the support shell, an electric telescopic rod is installed on the side of the support shell away from the support plate, the rotating shaft end of the electric telescopic rod is fixedly connected to one end of the threaded column, the movable plate and the threaded column are threadedly connected, two electric telescopic rods are installed at the bottom end of the support shell, and the bottom ends of the electric telescopic rods are installed inside the support platform; A lifting column is fixed to the bottom end of the scraping head, the lifting column is inserted into the top inner part of the movable plate, the bottom end of the lifting column is fixed to the fourth spring, and the bottom end of the fourth spring is fixedly connected to the movable plate; The output assembly includes an air cylinder installed inside the support shell, a push rod of the air cylinder is fixedly connected to the movable plate, a solder paste cylinder is installed on one side of the support shell, the air inlet of the solder paste cylinder is connected to the air outlet of the air cylinder through a pipe, and the discharge port of the solder paste cylinder is connected to the feed port of the spray rack through a pipe; An extension rod is provided on the side of the support plate away from the support shell, and a lifting plate is sleeved on the outside of the extension rod. Two guide frames are fixed on the side of the lifting plate away from the mesh plate, and a guide rod is fixed inside the guide frame. Guide blocks are fixed on both sides of the end of the extension rod away from the mesh plate, and the guide block is slidably connected to the inside of the guide frame, and the guide rod passes through the inside of the guide block. A first spring is sleeved on the outside of the guide rod, and one end of the first spring is fixedly connected to the side of the guide block away from the mesh plate, and the other end of the first spring is fixedly connected to the guide frame.

2. The semiconductor chip mounting device for a PCB according to claim 1, characterized in that: A support block is slidably connected to the lower part of the lifting plate, the bottom end of the support block is fixedly connected to the support shell through an extension plate, a second spring is fixed to the top end of the support block, and the top end of the second spring is fixedly connected to the lifting plate.

3. The semiconductor chip mounting device for a PCB according to claim 2, characterized in that: A lifting block is fixed on one side of the mesh plate close to the extension rod, and a movable cavity is opened on the end of the extension rod close to the mesh plate. The lifting block is slidably connected to the inside of the movable cavity. A guide column is fixed inside the movable cavity, and a third spring is sleeved on the outside of the guide column. The bottom end of the third spring is fixedly connected to the lifting block, and the top end of the third spring is fixedly connected to the inner wall of the movable cavity.

4. The semiconductor chip mounting device for a PCB according to claim 3, characterized in that: A first pull rope is fixed to the top of the lifting block, the first pull rope passes through the inside of the extension rod, and the first pull rope passes through the inside of the lifting plate. The end of the first pull rope away from the lifting block is fixedly connected to the bottom end inside the support platform. The elastic force of the first spring is greater than the elastic force of the third spring, and the elastic force of the second spring is greater than the elastic force of the first spring.

5. The semiconductor chip mounting device for a PCB according to claim 4, characterized in that: Two sliders are provided on the side of the supporting shell away from the screen plate, a sliding rod is fixed between the two sliders, a scraper is slidably connected to the outside of the sliding rod, a threaded rod is rotatably connected between the two sliders, the threaded rod and the scraper are threadedly connected, a gear is fixed at one end of the threaded rod, a toothed belt is meshed and connected to the bottom of the gear, the toothed belt is rotatably connected to one side of the supporting shell through a pulley, a second motor is installed inside the supporting shell, and the end of the rotating shaft of the second motor is fixedly connected to the pulley of the toothed belt.

6. The semiconductor chip mounting device for a PCB according to claim 5, characterized in that: Slide grooves are provided on both sides of the support shell, and the slider is slidably connected to the inside of the slide groove. A fifth spring is fixed to the bottom end of the slider, and the bottom end of the fifth spring is fixedly connected to the inner wall of the slide groove. A second pull rope passes through the inside of the fifth spring, and the second pull rope passes through the inside of the support shell. The end of the second pull rope away from the slider is fixedly connected to the side wall of the support shell.

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