PCB manufacturing method and PCB

Abstract

The invention discloses a manufacturing method of a PCB, and the method comprises the steps: placing a plurality of stacked outer prepregs in a first pressing machine, and carrying out the partial heating and pressing of the plurality of outer prepregs in the stacking direction, and obtaining an outer prepreg layer; sequentially laminating an outer semi-cured layer and an outer copper foil layer towards the two opposite sides of the core plate layer in the direction deviating from the core plate layer to obtain a main plate; a main plate is placed between the two tool plates, and a to-be-pressed set is obtained; and after the to-be-pressed set is placed on a second pressing machine to be subjected to heating pressing, the tool plate is separated from the mainboard, and the mainboard is formed into the PCB. According to the manufacturing method of the PCB, before the main board is heated and pressed, the parts of the plurality of laminated outer prepregs are heated and pressed in advance along the lamination direction, so that the part of each outer prepreg can be combined with the part of the adjacent outer prepreg after being fused and has a certain restraining effect on each other; the probability of sliding of the PCB in the pressing process is reduced, and the product yield is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB manufacturing, and in particular, to a method for manufacturing a PCB and a PCB. Background Art

[0002] A PCB (Printed Circuit Board), also known as a printed circuit board, is a carrier for the electrical interconnection of electronic components. When the PCB is a multi-layer circuit board structure, it mainly includes a core board, a semi-cured layer, and a copper foil. The PCB is manufactured by laminating and pressing the core board, the outer semi-cured layer, and the copper foil in sequence.

[0003] In the related art, when manufacturing a PCB by lamination and pressing, the core board, the outer semi-cured layer, and the copper foil that are laminated in sequence are usually placed in a laminator for heating and pressing. The glue in the multiple semi-cured sheets of the outer semi-cured layer will be heated and melted to form a fluid-like hot melt adhesive. In addition to filling the copper-free area, the hot melt adhesive will flow disorderly and cause skidding, resulting in a low product yield of the manufactured PCB. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. For this purpose, the present invention provides a method for manufacturing a PCB and a PCB, which can reduce the probability of skidding during the lamination and pressing of the PCB and improve the product yield.

[0005] The method for manufacturing a PCB according to the first aspect embodiment of the present invention includes:

[0006] Placing multiple stacked outer semi-cured sheets on a first laminator, and performing partial heating and pressing on the multiple outer semi-cured sheets in the stacking direction to obtain an outer semi-cured layer;

[0007] Stacking the outer semi-cured layer and the outer copper foil layer on both opposite sides of the core board layer in the direction away from the core board layer to obtain a main board;

[0008] Placing the main board between two tool plates to obtain a group to be laminated and pressed;

[0009] After placing the group to be laminated and pressed on a second laminator for heating and pressing, separating the tool plates from the main board, and the main board is formed into a PCB.

[0010] The method for manufacturing a PCB according to the embodiment of the present invention has at least the following beneficial effects:

[0011] In the method for manufacturing a PCB according to an embodiment of the present invention, before heat-pressing the main board, by pre-heat-pressing a part of the stacked multiple outer semi-cured sheets along the stacking direction, the part of each outer semi-cured sheet can be combined with the part of the adjacent outer semi-cured sheet after melting, so that each adjacent pair of outer semi-cured sheets has a certain constraining effect on each other. Thus, in the subsequent process of heat-pressing the outer semi-cured layer, the core board layer, and the outer copper foil layer in the second press, even if the other part of the multiple outer semi-cured sheets is heated and melted to form a fluid state, the constraining effect between each adjacent pair of outer semi-cured sheets can resist the lateral force generated after the other part melts during pressing, making it not easy for the outer semi-cured sheets to generate relative slippage, avoiding the core board layer or the outer copper foil layer from slipping when the lateral force acts on the core board layer or the outer copper foil layer, reducing the probability of the PCB slipping during the pressing process, and improving the product yield.

[0012] According to some embodiments of the present invention, placing the stacked multiple outer semi-cured sheets in a first press and performing partial heat-pressing on the multiple outer semi-cured sheets along the stacking direction to obtain an outer semi-cured layer includes:

[0013] Placing the stacked multiple outer semi-cured sheets in a first press and performing heat-pressing on the side edges of the multiple outer semi-cured sheets along the stacking direction to obtain an outer semi-cured layer.

[0014] According to some embodiments of the present invention, placing the stacked multiple outer semi-cured sheets in a first press and performing heat-pressing on the side edges of the multiple outer semi-cured sheets along the stacking direction to obtain an outer semi-cured layer includes:

[0015] Placing the stacked multiple outer semi-cured sheets in a first press and performing heat-pressing on a short side edge of the stacked multiple semi-cured sheets along the stacking direction to obtain an outer semi-cured layer.

[0016] According to some embodiments of the present invention, when the glass fiber thickness of each of the stacked multiple outer semi-cured sheets is less than 90 microns, the heating temperature of the stacked multiple outer semi-cured sheets by the first press is greater than or equal to 110 degrees and less than 130 degrees;

[0017] When the glass fiber thickness of at least one of the stacked multiple outer semi-cured sheets is greater than or equal to 90 microns, the heating temperature of the stacked multiple outer semi-cured sheets by the first press is greater than or equal to 130 degrees and less than or equal to 150 degrees.

[0018] According to some embodiments of the present invention, when the glass fiber thickness of each of the stacked multiple outer semi-cured sheets is less than 90 microns, the heating and pressing duration of the stacked multiple outer semi-cured sheets by the first press is greater than or equal to 5 seconds and less than 7 seconds;

[0019] When the glass fiber thickness of at least one of the stacked outer prepregs is greater than or equal to 90 microns, the heating and pressing duration of the stacked outer prepregs by the first press is greater than or equal to 7 seconds and less than or equal to 9 seconds.

[0020] According to some embodiments of the present invention, the pressing pressure of the stacked outer prepregs by the first press is greater than or equal to 4 bar and less than or equal to 6 bar.

[0021] According to some embodiments of the present invention, before obtaining the main board by sequentially laminating an outer prepreg layer and an outer copper foil layer on both opposite sides of the core board layer in a direction away from the core board layer, it further includes:

[0022] Stacking multiple core boards and multiple inner prepreg layers to obtain a core board layer, wherein at least one inner prepreg layer is provided between two adjacent core boards.

[0023] According to some embodiments of the present invention, placing the main board between two tool plates to obtain a to-be-pressed group, includes:

[0024] Stacking multiple rigid boards between two tool plates, placing a main board between every two adjacent rigid boards, and wrapping every two adjacent rigid boards on the opposite sides of the corresponding main board respectively to obtain a to-be-pressed group.

[0025] According to some embodiments of the present invention, stacking multiple rigid boards between two tool plates, placing a main board between every two adjacent rigid boards, and wrapping every two adjacent rigid boards on the opposite sides of the corresponding main board respectively to obtain a to-be-pressed group, includes:

[0026] Placing two buffer bodies between two tool plates, stacking multiple rigid boards between the two buffer bodies, placing a main board between every two adjacent rigid boards, wrapping every two adjacent rigid boards on the opposite sides of the corresponding main board respectively, and wrapping the two tool plates on the opposite sides of the corresponding two buffer bodies respectively to obtain a to-be-pressed group.

[0027] The second aspect embodiments of the present invention provide a PCB, which is obtained by the PCB manufacturing method of any one of the first aspect embodiments.

[0028] The PCB according to the embodiments of the present invention has at least the following beneficial effects:

[0029] Before heat-pressing the main board, by pre-heat-pressing multiple stacked outer semi-cured sheets, each outer semi-cured sheet can be combined with the adjacent outer semi-cured sheet after melting, so that each adjacent pair of outer semi-cured sheets has a certain constraining effect on each other. In this way, during the subsequent heat-pressing process of the outer semi-cured layer, the core board layer, and the outer copper foil layer in the second press, the constraining effect between each adjacent pair of outer semi-cured sheets can resist the lateral force generated by the heat-melted part during pressing, making it not easy for the outer semi-cured sheets to produce relative slip, avoiding the core board layer or the outer copper foil layer from slipping when the lateral force acts on the core board layer or the outer copper foil layer, reducing the probability of the PCB slipping during the pressing process, and improving the product yield.

[0030] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The present invention will be further described below in conjunction with the drawings and embodiments, where:

[0032] Figure 1 is a schematic diagram of the main steps of the manufacturing method of the PCB according to the embodiment of the present invention;

[0033] Figure 2 is Figure 1 a schematic diagram of the specific steps of step S100 in

[0034] Figure 3 is Figure 2 a schematic diagram of the specific steps of step S110 in

[0035] Figure 4 is Figure 1 a schematic diagram of the steps before step S200 in

[0036] Figure 5 is Figure 1 a schematic diagram of the specific steps of step S300 in

[0037] Figure 6 is Figure 5 a schematic diagram of the specific steps of step S310 in

[0038] Figure 7 is a schematic diagram of the structure of the group to be pressed in the manufacturing method of the PCB according to the embodiment of the present invention;

[0039] Figure 8 is Figure 7 a schematic diagram of the structure of the main board of the group to be pressed in

[0040] Reference numerals:

[0041] Main board 500;

[0042] Outer semi-cured layer 510; outer semi-cured sheet 511; core board layer 520; core board 521; inner semi-cured layer 522; inner semi-cured sheet 5221; outer copper foil layer 530;

[0043] Tooling board 600;

[0044] Rigid board 700;

[0045] Buffer body 800. Detailed implementation manners

[0046] The embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation of the present invention.

[0047] In the description of the present invention, it should be understood that with respect to the orientation description, such as the orientation or positional relationship indicated by up, down, front, back, left, right, etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0048] In the description of the present invention, the meaning of several is more than one, the meaning of multiple is more than two, greater than, less than, exceeding, etc. are understood as not including the present number, and above, below, within, etc. are understood as including the present number. If there is a description of first and second, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0049] In the description of the present invention, unless otherwise clearly defined, words such as setting, installing, connecting, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in the present invention in combination with the specific content of the technical solution.

[0050] In the description of the present invention, the description referring to terms such as "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0051] During the lamination process of PCB, the glue in the multiple semi-cured sheets of the outer semi-cured layer will be heated and melted to form a fluid hot melt adhesive, resulting in the lack of lateral restraint between the multiple outer semi-cured sheets and easy relative slippage, and the core board and copper foil on the opposite sides of the outer semi-cured layer are also prone to slippage, resulting in the outer semi-cured layer, core board and copper foil sliding alternately. If the sliding situation occurs, it will affect the quality, performance and reliability of the product, resulting in the scrapping of the PCB and high cost.

[0052] In the related art, the outer semi-cured layer, core board and copper foil are riveted together to avoid the staggered slippage of the outer semi-cured layer, core board and copper foil during the heating and pressing process, thereby ensuring the product yield. However, the riveting operation method adds operations such as opening holes and riveting. Powder and debris are generated during the riveting process, which increases the step of removing the powder and debris, greatly reducing production efficiency. In addition, the PCB may cause product problems such as copper surface pits after heating and pressing.

[0053] See also Figures 1 to 8 In view of this, an embodiment of the present invention provides a method for manufacturing a PCB and a PCB, which can reduce the probability of a PCB sliding during the pressing process and improve the product yield.

[0054] like Figure 1 As shown, the method for manufacturing a PCB according to the first embodiment of the present invention includes but is not limited to the following steps:

[0055] S100 , placing the stacked plurality of outer prepreg sheets 511 on a first laminating machine, and heating and laminating portions of the plurality of outer prepreg sheets 511 along a laminating direction X to obtain an outer prepreg layer 510 .

[0056] During the heating and pressing process of the stacked multiple outer prepregs 511, the multiple outer prepregs 511 can be heated to melt from a solid state to a fluid state, and are tightly connected together under the pressing action of the press, so that the multiple outer prepregs 511 are combined with each other. During the heating and pressing process of the first press, the multiple outer prepregs 511 are transformed from a solid state to a fluid state, or from a solid state to a fluid state and then to a viscous state. Since the other part of the multiple outer prepregs 511 is not heated and pressed, the other part of the multiple outer prepregs 511 remains in a solid state.

[0057] The number of the outer prepreg sheets 511 of the outer prepreg layer 510 can be two or more. In a specific implementation, the number of the outer prepreg sheets 511 can be adjusted accordingly according to different product requirements.

[0058] S200, stack the outer semi-cured layers 510 and the outer copper foil layers 530 on both opposite sides of the core board layer 520 in sequence along the direction away from the core board layer 520 to obtain the main board 500.

[0059] When the main board 500 is placed flat, its structure from bottom to top is, in sequence, the outer copper foil layer 530, the outer semi-cured layer 510, the core board layer 520, the outer semi-cured layer 510, and the outer copper foil layer 530. The outer copper foil layer 530, the outer semi-cured layer 510, the core board layer 520, the outer semi-cured layer 510, and the outer copper foil layer 530 are stacked in sequence from bottom to top.

[0060] S300, place the main board 500 between two tool boards 600 to obtain the group to be press-fitted.

[0061] S400, after placing the group to be press-fitted in the second press for heating and press-fitting, separate the tool boards 600 from the main board 500, and the main board 500 is formed into a PCB.

[0062] When heating and press-fitting the group to be press-fitted, the second press raises the temperature stage by stage and transfers heat to the main board 500 through the tool boards 600, so that part of the multiple outer semi-cured layers 510 changes from a fluid state to a viscous state and then to a cured state or from a viscous state to a cured state. At the same time, another part of the multiple outer semi-cured layers 510 is heated and melted to form a fluid state. And the second press transfers extrusion pressure to the main board 500 through the tool boards 600, so that the outer copper foil layer 530, the outer semi-cured layer 510, and the core board layer 520 are mutually extruded. Another part of the multiple outer semi-cured layers 510 is heated and melted to form a fluid state and fills the gap between the core board layer 520 and the outer copper foil layer 530. During this period, the process of the state change of part of the multiple outer semi-cured layers 510 precedes the process of the state change of the other part. After heating and press-fitting by the second press, another part of the multiple outer semi-cured sheets 511 changes from a fluid state to a viscous state and then to a cured state, thereby realizing the bonding of the core board layers 520 and the outer copper foil layers 530 on both sides.

[0063] In the method for manufacturing a PCB according to an embodiment of the present invention, before heat-pressing the main board 500, by pre-heat-pressing a part of the stacked multiple outer semi-cured sheets 511 along the stacking direction X, it is ensured that after melting, a part of each outer semi-cured sheet 511 can be combined with a part of an adjacent outer semi-cured sheet 511, so that each adjacent pair of outer semi-cured sheets 511 has a certain constraining effect on each other. Thus, during the subsequent heat-pressing process of the outer semi-cured layer 510, the core board layer 520, and the outer copper foil layer 530 in the second press, even if another part of the multiple outer semi-cured sheets 511 is heated and melted to form a fluid state, the constraining effect between each adjacent pair of outer semi-cured sheets 511 can resist the lateral force generated after the other part melts during pressing, making it difficult for relative slippage to occur between the outer semi-cured sheets 511, and avoiding the core board layer 520 or the outer copper foil layer 530 from slipping when the lateral force acts on the core board layer 520 or the outer copper foil layer 530, reducing the probability of the PCB slipping during the pressing process, and improving the product yield.

[0064] It should be noted that, in order to avoid the situation of the PCB slipping during the lamination process, the industry generally uses the riveting and fixing method to rivet and fix the outer semi-cured layer, the core board, the copper foil, etc. together. Its development is relatively mature. At the same time, it is precisely because the trial-and-error cost of solutions other than the riveting and fixing method for the slipping problem is relatively high. Therefore, the riveting and fixing method is a commonly used technical means in the industry to solve the slipping problem, making it difficult for those skilled in the art to think of seeking new solutions other than the riveting and fixing method. Through the mechanism analysis of the slipping problem, the inventor of the present invention realized that the reason for the slipping is that the colloid in the outer semi-cured sheet 511 melts and forms a fluid state when heated, and by combining the state change of the outer semi-cured sheet 511 after heating (specifically, as the heating time increases, the state change of the outer semi-cured sheet 511 is successively solidified state, viscous state, fluid state, viscous state and solidified state, and its state change is irreversible), the present invention provides a method for manufacturing a PCB according to an embodiment. Specifically, by pre-heating and laminating a part of the stacked outer semi-cured sheets 511, each outer semi-cured sheet 511 forms a fluid state and merges with each other after melting, so as to realize the combination of each outer semi-cured sheet 511 with the adjacent outer semi-cured sheet 511. Since the state change of the outer semi-cured sheet 511 is irreversible, during the subsequent heating and lamination process of the outer semi-cured layer 510, the core board layer 520 and the outer copper foil layer 530 in the second laminator, due to the state change process of a part of the multiple outer semi-cured layers 510 preceding the state change process of another part, before another part of the multiple outer semi-cured layers 510 is completely melted into a fluid state, a part of the multiple outer semi-cured layers 510 has formed a viscous or solidified state with a constraining effect, so as to resist the lateral force generated after the other part melts during lamination, thereby solving the slipping problem, saving operations such as drilling holes and driving rivets, and also avoiding problems such as powder generated by drilling holes, greatly improving the production efficiency, and avoiding product problems such as copper surface pits that may occur after the PCB is heated and laminated.

[0065] As Figure 2 shown, in some embodiments, the stacked outer semi-cured sheets 511 are placed in a first laminator, and a part of the stacked outer semi-cured sheets 511 is heated and laminated along the stacking direction X to obtain the outer semi-cured layer 510, including but not limited to the following steps:

[0066] S110, place the stacked outer semi-cured sheets 511 in a first laminator, and heat and laminate the sides of the stacked outer semi-cured sheets 511 along the stacking direction X to obtain the outer semi-cured layer 510.

[0067] After placing multiple stacked outer prepregs 511 in the first laminator, the first laminator heats and presses the side positions of the upper surface and the corresponding side positions of the lower surface of the multiple stacked outer prepregs 511, so that the multiple stacked outer prepregs 511 are only melt-bonded at the side positions.

[0068] In this embodiment, by only heating and pressing the sides of the multiple stacked outer prepregs 511, while ensuring that each adjacent pair of outer prepregs 511 has a certain constraining effect on each other and realizing the combination of each outer prepreg 511, the steps of heating and pressing the multiple outer prepregs 511 can be simplified, saving time, improving production efficiency, and reducing production costs.

[0069] As Figure 3 shown, in some embodiments, placing multiple stacked outer prepregs 511 in the first laminator and heating and pressing the sides of the multiple outer prepregs 511 along the stacking direction X to obtain the outer prepreg layer 510 includes, but is not limited to, the following steps:

[0070] S111, placing multiple stacked outer prepregs 511 in the first laminator and heating and pressing one short side of the multiple stacked outer prepregs 511 along the stacking direction X to obtain the outer prepreg layer 510.

[0071] After placing multiple stacked outer prepregs 511 in the first laminator, the first laminator heats and presses one short side position of the upper surface and the corresponding short side position of the lower surface of the multiple stacked outer prepregs 511, so that the multiple stacked outer prepregs 511 are only melt-bonded at the side positions.

[0072] In this embodiment, by only heating and pressing one short side of the multiple stacked outer prepregs 511, the steps of heating and pressing the multiple outer prepregs 511 can be further simplified, saving time, improving production efficiency, and reducing production costs. Moreover, the size of the first laminator used for heating and pressing the short side can be designed to be relatively smaller accordingly, and the corresponding heating module, extrusion module and other structures can also be designed only for the short side of the multiple outer prepregs 511, reducing equipment costs and floor space occupancy.

[0073] It can be understood that in some other embodiments, it is also possible to heat and press other sides or multiple sides of the multiple outer prepregs 511, for example, the long side, or the long side and the short side adjacent to the long side.

[0074] It should be noted that since only the sides of the stacked multiple outer semi-cured sheets 511 are heated and pressed, the first press can be redesigned compared with the existing presses, so that the heating module and the extrusion module of the first press only heat and press the sides of the stacked multiple outer semi-cured sheets 511, without fully covering the stacked multiple outer semi-cured sheets 511. The design size of the first press can be smaller than that of the second press, and the structure of the first press can be simpler. Compared with the riveting fixing method, redesigning a first press specifically for heating and pressing the sides of the stacked multiple outer semi-cured sheets 511 has a lower overall production cost.

[0075] In some embodiments, when the glass fiber thickness of each of the stacked multiple outer semi-cured sheets 511 is less than 90 microns, the heating temperature of the first press for the stacked multiple outer semi-cured sheets 511 is greater than or equal to 110 degrees and less than 130 degrees. The glass fiber thickness being less than 90 microns also means that the resin of the outer semi-cured sheet 511 is more likely to flow. When heating and pressing in the first press, a relatively low heating temperature can be used to achieve the molten bonding between the outer semi-cured sheets 511, so as to avoid excessive melting of the outer semi-cured sheets 511, thereby ensuring a good bonding effect between the outer semi-cured sheets 511.

[0076] When the glass fiber thickness of at least one of the stacked multiple outer semi-cured sheets 511 is greater than or equal to 90 microns, the heating temperature of the first press for the stacked multiple outer semi-cured sheets 511 is greater than or equal to 130 degrees and less than or equal to 150 degrees. The glass fiber thickness being greater than or equal to 90 microns for all also means that the resin fluidity of the outer semi-cured sheet 511 is relatively poor. When heating and pressing in the first press, a relatively high heating temperature can be used to achieve the molten bonding between the outer semi-cured sheets 511, so as to avoid the outer semi-cured sheets 511 failing to reach the ideal molten bonding state, thereby ensuring a good bonding effect between the outer semi-cured sheets 511.

[0077] In some embodiments, when the glass fiber thickness of each of the stacked multiple outer semi-cured sheets 511 is less than 90 microns, the heating and pressing duration of the first press for the stacked multiple outer semi-cured sheets 511 is greater than or equal to 5 seconds and less than 7 seconds. The glass fiber thickness being less than 90 microns also means that the resin of the outer semi-cured sheet 511 is more likely to flow. When heating and pressing in the first press, a relatively short heating and pressing time can be used to achieve the molten bonding between the outer semi-cured sheets 511, so as to avoid excessive melting of the outer semi-cured sheets 511, thereby ensuring a good bonding effect between the outer semi-cured sheets 511.

[0078] When the glass fiber thickness of at least one of the stacked outer prepregs 511 is greater than or equal to 90 microns, the heating and pressing duration of the stacked outer prepregs 511 by the first press is greater than or equal to 7 seconds and less than or equal to 9 seconds. The glass fiber thickness being greater than or equal to 90 microns for all means that the resin fluidity of the outer prepregs 511 is relatively poor. When performing heating and pressing in the first press, a relatively long heating and pressing time can be used to achieve the molten bonding between the outer prepregs 511, so as to avoid the outer prepregs 511 from failing to reach the ideal molten bonding state, thereby ensuring a good bonding effect between the outer prepregs 511.

[0079] In some embodiments, the pressing pressure of the first press on the stacked outer prepregs 511 is 4 bar to 6 bar. By setting the pressing pressure parameter, it can be avoided that the bonding effect between the outer prepregs 511 is poor due to too low pressing pressure, and it can also be avoided that the outer prepregs 511 wrinkle due to too high pressing pressure, thereby ensuring a good bonding effect between the outer prepregs 511.

[0080] As Figure 4 shown, in some embodiments, before obtaining the main board 500 by sequentially stacking the outer prepreg layer 510 and the outer copper foil layer 530 on both opposite sides of the core board layer 520 in the direction away from the core board layer 520, the following steps are included but not limited to:

[0081] S201, stack a plurality of core boards 521 and multiple inner prepreg layers 522 to obtain the core board layer 520, wherein at least one inner prepreg layer 522 is provided between every two adjacent core boards 521.

[0082] In this embodiment, by setting a plurality of core boards 521, the interior of the PCB has more layers of circuits, which can provide additional internal circuit support for the PCB.

[0083] When heating and pressing the group to be pressed, the second press transfers heat to the main board 500 through the tooling plate 600, so that the inner prepreg layer 522 is heated and melted. And the second press transfers extrusion pressure to the main board 500 through the tooling plate 600, so that the core boards 521 and the inner prepreg layer 522 are mutually extruded. The melted inner prepreg layer 522 bonds the core boards 521 on both sides and fills the gaps between the core boards 521.

[0084] Among them, the number of core boards 521 can be two or more. In the specific implementation process, the number of core boards 521 can be adjusted accordingly according to different product requirements; the number of inner semi-cured layers 522 between two adjacent core boards 521 can be one or more. In the specific implementation process, the number of inner semi-cured layers 522 can be adjusted accordingly according to different product requirements; the inner semi-cured layer 522 includes at least one inner semi-cured sheet 5221, and the number of inner semi-cured sheets 5221 can be one or more. In the specific implementation process, the number of inner semi-cured sheets 5221 can be adjusted accordingly according to different product requirements.

[0085] Optionally, in the main board 500, one inner semi-cured layer 522 is provided between every two adjacent core boards 521. The number of inner semi-cured layers 522 is one less than the number of core boards 521, and the outermost two sides of the core board layer 520 are both core boards 521.

[0086] As Figure 5 shown, in some embodiments, placing the main board 500 between two tool boards 600 to obtain a to-be-pressed group includes, but is not limited to, the following steps:

[0087] Step S310, stacking multiple rigid boards 700 between two tool boards 600, placing one main board 500 between every two adjacent rigid boards 700, and covering every two adjacent rigid boards 700 on the opposite sides of a corresponding main board 500 respectively to obtain a to-be-pressed group.

[0088] Wherein, the corresponding main board 500 is the main board 500 between every two adjacent rigid boards 700.

[0089] In this embodiment, by stacking multiple rigid boards 700 between two tool boards 600 and placing one main board 500 between every two adjacent tool boards 600, it is possible to form multiple formed PCBs after one heating and pressing, improving production efficiency; and by covering every two adjacent rigid boards 700 on the opposite sides of a corresponding main board 500 respectively, the corresponding main board 500 can be clamped and limited, which can effectively improve the flatness of the heating and pressing and avoid situations such as wrinkling and warping of the main board 500 during the heating and pressing process.

[0090] As Figure 6 shown, in some embodiments, stacking multiple rigid boards 700 between two tool boards 600, placing one main board 500 between every two adjacent rigid boards 700, and covering every two adjacent rigid boards 700 on the opposite sides of a corresponding main board 500 respectively to obtain a to-be-pressed group includes:

[0091] Step S311, place two buffer bodies 800 between two tool plates 600, stack multiple rigid plates 700 between the two buffer bodies 800, place a main board 500 between every two adjacent rigid plates 700, wrap every two adjacent rigid plates 700 around the opposite sides of a corresponding main board 500 respectively, wrap the two buffer bodies 800 around the opposite sides of the corresponding two rigid plates 700 respectively, and wrap the two tool plates 600 around the opposite sides of the two buffer bodies 800 respectively to obtain a to-be-pressed group.

[0092] Wherein, the corresponding two rigid plates 700 are the two rigid plates 700 adjacent to the two buffer bodies 800 respectively.

[0093] In this embodiment, by wrapping the two buffer bodies 800 around the opposite sides of the corresponding two rigid plates 700 respectively, and wrapping the tool plates 600 around the opposite sides of the two buffer bodies 800 respectively, the structures between the two tool plates 600 can be clamped and limited, which can effectively improve the flatness of hot pressing. Moreover, the buffer body 800 can play a certain buffering role and reduce the wear of the structures on its two sides.

[0094] The PCB provided by the second aspect embodiment of the present invention is manufactured by the manufacturing method of the PCB according to any one of the first aspect embodiments.

[0095] In the manufacturing method of the PCB of the embodiment of the present invention, before hot pressing the main board 500, by pre-heat pressing a part of the stacked multiple outer semi-cured sheets 511 along the stacking direction X, so that the parts of each outer semi-cured sheet 511 can be combined with the parts of the adjacent outer semi-cured sheets 511 after melting, thereby enabling every two adjacent outer semi-cured sheets 511 to have a certain constraining effect on each other. In this way, during the subsequent process of hot pressing the outer semi-cured layer 510, the core board layer 520, and the outer copper foil layer 530 in the second press, even if another part of the multiple outer semi-cured sheets 511 is heated and melted into a fluid state, the constraining effect between every two adjacent outer semi-cured sheets 511 can resist the lateral force generated after the other part is melted during pressing, making it not easy for the outer semi-cured sheets 511 to generate relative slippage, avoiding the core board layer 520 or the outer copper foil layer 530 from slipping when the lateral force acts on the core board layer 520 or the outer copper foil layer 530, reducing the probability of the PCB slipping during the pressing process, and improving the product yield.

[0096] The manufacturing method of the PCB according to the embodiment of the present invention solves the skateboard problem by pre-heating and pressing multiple stacked outer prepregs 511 so that each outer prepreg 511 can be combined with the adjacent outer prepreg 511 after melting, saving operations such as opening holes and riveting, and also avoiding problems such as powder generated by opening holes, greatly improving production efficiency, and preventing product problems such as copper surface pits that may occur after the PCB is heated and pressed.

[0097] The PCB according to the embodiment of the second aspect has multiple layers of circuits and is manufactured by the manufacturing method of the PCB according to the embodiment of the first aspect, which can effectively reduce the probability of skateboarding of the core board layer 520 and improve the product yield.

[0098] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those of ordinary skill in the art. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

Claims

1. A method for manufacturing a PCB, characterized in that: include: Placing the stacked multiple outer prepregs in a first laminating machine, and partially heating and laminating the multiple outer prepregs along the laminating direction to obtain an outer prepreg layer; In a direction away from the core board layer, the outer semi-cured layer and the outer copper foil layer are sequentially laminated on opposite sides of the core board layer to obtain a main board; Placing the main plate between two tool plates to obtain a group to be pressed; After placing the assembly to be pressed in a second pressing machine for heating and pressing, the tool plate is separated from the main board, and the main board is formed into a PCB.

2. The method for manufacturing a PCB according to claim 1, characterized in that: The stacked multiple outer prepregs are placed in a first laminating machine, and the multiple outer prepregs are partially heated and pressed along the laminating direction to obtain an outer prepreg layer, comprising: The stacked multiple outer prepregs are placed in a first pressing machine, and the sides of the multiple outer prepregs are heated and pressed along the stacking direction to obtain the outer prepreg layer.

3. The method for manufacturing a PCB according to claim 2, characterized in that: The stacked multiple outer prepregs are placed in a first laminating machine, and the sides of the multiple outer prepregs are heated and pressed along the laminating direction to obtain the outer prepreg layer, comprising: The stacked multiple outer prepregs are placed in a first pressing machine, and one short side of the stacked multiple prepregs is heated and pressed along the stacking direction to obtain the outer prepreg layer.

4. The method for manufacturing a PCB according to claim 1, characterized in that: When the glass fiber thickness of each of the stacked plurality of outer prepregs is less than 90 μm, the heating temperature of the stacked plurality of outer prepregs by the first laminating machine is greater than or equal to 110 degrees and less than 130 degrees; When the glass fiber thickness of at least one of the stacked multiple outer semi-cured sheets is greater than or equal to 90 microns, the first laminating machine heats the stacked multiple outer semi-cured sheets to a temperature greater than or equal to 130 degrees and less than or equal to 150 degrees.

5. The method for manufacturing a PCB according to claim 1, characterized in that: When the glass fiber thickness of each of the stacked plurality of outer prepregs is less than 90 μm, the first laminating machine heats and presses the stacked plurality of outer prepregs for a time period greater than or equal to 5 seconds and less than 7 seconds; When the glass fiber thickness of at least one of the stacked multiple outer semi-cured sheets is greater than or equal to 90 microns, the first pressing machine heats and presses the stacked multiple outer semi-cured sheets for a time period greater than or equal to 7 seconds and less than or equal to 9 seconds.

6. The method for manufacturing a PCB according to claim 1, characterized in that: The first laminating machine applies a pressing pressure greater than or equal to 4 bar and less than or equal to 6 bar to the stacked plurality of outer prepregs.

7. The method for manufacturing a PCB according to claim 1, characterized in that: Before the outer semi-cured layer and the outer copper foil layer are sequentially stacked on opposite sides of the core board layer in a direction away from the core board layer to obtain the main board, the method further comprises: The core board layer is obtained by stacking a plurality of core boards and a plurality of inner semi-cured layers, wherein at least one inner semi-cured layer is arranged between two adjacent core boards.

8. The method for manufacturing a PCB according to claim 1, characterized in that: Placing the main board between two tool boards to obtain a group to be pressed together comprises: A plurality of rigid plates are stacked between two tool plates, a main plate is placed between each two adjacent rigid plates, and each two adjacent rigid plates are respectively covered on opposite sides of a corresponding main plate to obtain the group to be pressed.

9. The method for manufacturing a PCB according to claim 8, characterized in that: The method comprises stacking a plurality of rigid plates between two tool plates, placing a main plate between each two adjacent rigid plates, and covering each two adjacent rigid plates on opposite sides of a corresponding main plate to obtain the group to be pressed, including: Two buffer bodies are placed between two tool plates, multiple rigid plates are stacked between the two buffer bodies, a main plate is placed between every two adjacent rigid plates, each two adjacent rigid plates are respectively covered on the opposite sides of a corresponding main plate, and the two tool plates are respectively covered on the opposite sides of the corresponding two buffer bodies to obtain the group to be pressed. 10.PCB, characterized in that, The PCB is manufactured by the PCB manufacturing method according to any one of claims 1 to 9.

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