A Tin Liquid Type Fast Welding System for Diodes

Abstract

The present invention discloses a molten tin type rapid welding system for diodes, which relates to the field of diode welding. The system includes a welding workbench. A tooling notch is formed in the top surface of the welding workbench. One end of the tooling notch penetrates through the side wall of the welding workbench. A flipping clamping mechanism is arranged in the tooling notch. The flipping clamping mechanism is used for clamping the circuit board carrying the diodes. Above the welding workbench, a molten tin type welding device is arranged. The molten tin type welding device includes a lifting box and a molten tin dropper. The lifting box has the freedom to move along the height direction of the welding workbench. A molten tin cavity is arranged inside the lifting box. An electric heating sheet is installed on the outer side wall of the lifting box. A piston plate is slidably fitted in the molten tin cavity. A plurality of molten tin droppers are connected to the bottom of the lifting box. The plurality of molten tin droppers correspond to the diode welding points on the circuit board one by one. The molten tin droppers communicate with the molten tin cavity, and can complete the welding operations of all diodes in a narrow space, improving the welding efficiency.

Description

Technical Field

[0001] The present invention relates to the field of diode soldering, and specifically to a tin liquid type rapid soldering system for diodes. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature, and are widely used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields, such as diodes. A diode is also called a crystal diode, simply referred to as a diode (diode). In addition, there is also the early vacuum electron diode; it is an electronic device with unidirectional conduction current. Inside a semiconductor diode, there is a PN junction and two lead terminals. This electronic device has the transduction property of unidirectional current according to the direction of the applied voltage. The diode is one of the most commonly used electronic components. Its greatest characteristic is unidirectional conduction, that is, current can only flow through the diode in one direction. The functions of the diode include rectifier circuits, detection circuits, voltage stabilization circuits, various modulation circuits. Therefore, multiple diodes are soldered on the circuit board at the same time. When soldering, multiple diodes need to be soldered one by one, and the soldering efficiency is low, affecting the production efficiency. Secondly, since the positive and negative pins of the diode need to be soldered to the holes on the circuit board, the distance between the positive and negative pins of the diode is small, resulting in a small moving space for the soldering gun, and it is easy to collide with the pins to be soldered during soldering, causing the pins to bend and affecting the soldering quality. Summary of the Invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a tin liquid type rapid soldering system for diodes to solve the deficiencies of the prior art.

[0004] The purpose of the present invention is achieved through the following technical solutions: A tin liquid type rapid soldering system for diodes includes a soldering workbench. A tooling slot is opened on the top surface of the soldering workbench. One end of the tooling slot passes through the side wall of the soldering workbench. A flipping and clamping mechanism is arranged in the tooling slot. The flipping and clamping mechanism is used to clamp the circuit board carrying the diode. A tin liquid soldering device is arranged above the soldering workbench. The tin liquid soldering device includes a lifting box and a tin liquid dropper. The lifting box has the freedom to move in the height direction of the soldering workbench. A tin liquid cavity is arranged inside the lifting box. An electric heating sheet is installed on the outer side wall of the lifting box. A piston plate is slidably fitted in the tin liquid cavity. A plurality of the tin liquid droppers are connected to the bottom of the lifting box. The plurality of tin liquid droppers correspond one by one to the diode soldering points on the circuit board. The tin liquid droppers communicate with the tin liquid cavity. The tin liquid droppers are sleeved on the pins of the diode and contact the circuit board. Under the pressure of the piston plate, tin liquid is dripped from the tin liquid droppers into the diode soldering points.

[0005] Further, the tin liquid dropper includes a connecting pipe, a one-way pipe, and a dropping pipe. The two ends of the one-way pipe are coaxially connected to the dropping pipe and the connecting pipe respectively. The end of the connecting pipe away from the one-way pipe communicates with the tin liquid chamber. The inner hole diameter of the connecting pipe and the inner diameter of the dropping pipe are both smaller than the inner hole diameter of the one-way pipe. A steel ball spring is arranged inside the one-way pipe. One end of the steel ball spring is connected to the step formed by the one-way pipe and the dropping pipe, and the other end is connected with a steel ball. Under the action of the steel ball spring, the steel ball blocks the inner hole of the connecting pipe.

[0006] Further, a vibration dropping mechanism is arranged on the lifting box. The vibration dropping mechanism includes a vibration plate. The vibration plate has a degree of freedom to move in the horizontal direction. The vibration plate is provided with a through hole at a position corresponding to the tin liquid dropper. The tin liquid dropper passes through the through hole, and a rubber block is fixed on the inner wall of the through hole.

[0007] Further, a vibration sliding groove is opened at the bottom of the lifting box. A guide rod is fixed in the vibration sliding groove. A guide slider is slidably penetrated on the guide rod. A spring is sleeved on the guide rod. The two ends of the spring are respectively connected to the guide slider and the lifting box. A motor seat is arranged on the side wall of the lifting box. A motor is installed on the motor seat. The output shaft of the motor is connected with a cam. A wedge surface is arranged on the top surface of the vibration plate near one end of the cam. The wedge surface is located on the rotation path of the cam.

[0008] Further, the tin liquid type soldering device further includes a soldering frame. A first cylinder is vertically installed on the soldering frame. The telescopic shaft of the first cylinder is connected to a lifting cross beam. The lifting box is fixedly installed on the lifting cross beam. A second cylinder is vertically installed on the lifting cross beam. The telescopic shaft of the second cylinder is connected with a pressing rod. The pressing rod movably penetrates into the tin liquid chamber and is connected to the piston plate.

[0009] Further, a tin replenishing box is installed on the lifting cross beam. A plurality of tin bars are stacked along the length direction of the tin replenishing box. A blanking port is opened at the bottom of the tin replenishing box. The tin replenishing box is connected with a blanking pipeline at the blanking port. The end of the blanking pipeline away from the tin replenishing box communicates with the tin liquid chamber. A pushing cylinder is installed at one end of the tin replenishing box away from the blanking port. The telescopic shaft of the pushing cylinder movably penetrates into the tin replenishing box and is connected to a pushing plate.

[0010] Furthermore, the flipping and clamping mechanism includes a flipping arm and a moving flipping arm which are oppositely arranged. The flipping arm is rotationally connected to the welding workbench through a first shaft. A second shaft is fixed to one end of the moving flipping arm away from the flipping arm. The second shaft movably penetrates through the welding workbench. Tooling grooves are formed on one side of the flipping arm close to the moving flipping arm and one side of the moving flipping arm close to the flipping arm. One end of the tooling groove is provided with an opening. A tooling pressing plate is arranged in the tooling groove. Pressing-down driving mechanisms are arranged at both ends of the top of the tooling pressing plate. The pressing-down driving mechanism includes a pressing-down shaft, a pressing-down spring and an electromagnet. A driving groove is formed on the inner top wall of the tooling groove corresponding to the position of the pressing-down driving mechanism. The electromagnet is installed in the driving groove. One end of the pressing-down shaft is slidably fitted in the driving groove and is connected with a permanent magnet, and the other end is connected with the tooling pressing plate. A pressing-down spring is arranged between the permanent magnet and the electromagnet, and the pressing-down spring is connected with the pressing-down shaft.

[0011] Furthermore, one end of the second shaft away from the moving flipping arm penetrates out of the welding workbench and is connected to the output shaft of a driving motor. The housing of the driving motor is installed on a driving base. The driving base is connected to the telescopic shaft of a driving cylinder. The cylinder body of the driving cylinder is installed on the welding workbench.

[0012] Furthermore, the flipping and clamping mechanism further includes a receiving plate and a mounting plate. Receiving electromagnets are embedded on the top surfaces of the flipping arm and the moving flipping arm. A plurality of magnets are embedded on one surface of the mounting plate. The plurality of magnets correspond to the plurality of receiving electromagnets one by one. The end surface of the mounting plate provided with the magnets is connected to the receiving plate through a receiving spring. The mounting plate is magnetically adsorbed on the flipping arm and the moving flipping arm, so that the receiving plate contacts the tube body end of the diode under the action of the receiving spring.

[0013] Furthermore, a push plate is arranged on the inner bottom wall of the tooling groove opening. The push plate is connected to the telescopic shaft of a push plate cylinder. The cylinder body of the push plate cylinder is installed on the welding workbench. The push plate is used for pushing the mounting plate out from the opening end of the tooling groove opening.

[0014] The beneficial effects of the present invention are as follows:

[0015] 1. Abandon the traditional welding method with a welding torch, melt the welding rod into tin liquid in the tin liquid cavity of the lifting box, and drip the tin liquid through the tin liquid dropper sleeve on the pin to weld the pin of the diode on the hole position of the circuit board. It can complete the welding operation of the diode in a narrow space, will not affect the adjacent pins, improve the welding quality, and at the same time can set corresponding tin liquid droppers according to the welding hole positions of the diodes, so as to complete the welding operations of multiple diodes at the same time and improve the welding efficiency.

[0016] 2. After the tin liquid is dropped into the welding hole position, the reciprocating motion of the vibration plate causes the tin liquid dropper to vibrate, so that the tin liquid adhering to the inner wall of the dropper falls, ensuring that the welding amount meets the requirements, avoiding the situation of insufficient welding, and at the same time avoiding the situation of tin liquid dripping when the tin liquid welding device is reset. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Structural schematic of a tin liquid type rapid welding system for a diode of the present invention Figure 1 ;

[0018] Figure 2 Internal structure schematic of the lifting box in a tin liquid type rapid welding system for a diode of the present invention;

[0019] Figure 3 For Figure 2 Enlarged view at B in

[0020] Figure 4 Structural schematic of a tin liquid type rapid welding system for a diode of the present invention Figure 2 ;

[0021] Figure 5 For Figure 4 Enlarged view at A in

[0022] Figure 6 Cooperation schematic of the lifting box and the vibration plate in a tin liquid type rapid welding system for a diode of the present invention;

[0023] Figure 7 Structural schematic of a tin liquid type rapid welding system for a diode of the present invention Figure 3 ;

[0024] Figure 8 Structural schematic of the flipping and clamping mechanism in a tin liquid type rapid welding system for a diode of the present invention;

[0025] Figure 9 For Figure 8 Enlarged view at C in

[0026] Figure 10 Structural schematic of a tin liquid type rapid welding system for a diode of the present invention Figure 4 ;

[0027] Figure 11 Internal structure schematic of the tin replenishing box in a tin liquid type rapid welding system for a diode of the present invention;

[0028] In the figure, 1 - welding workbench, 2 - tooling notch, 3 - lifting box, 4 - tin liquid dropper, 5 - tin liquid chamber, 6 - electric heating sheet, 7 - piston plate, 8 - connecting pipe, 9 - one-way pipe, 10 - dropping pipe, 11 - steel ball spring, 12 - steel ball, 13 - vibrating plate, 14 - through hole, 15 - rubber block, 16 - vibrating chute, 17 - guide rod, 18 - guide slider, 19 - spring, 20 - motor base, 21 - motor, 22 - cam, 23 - wedge surface, 24 - welding frame, 25 - first cylinder, 26 - lifting crossbeam, 27 - second cylinder, 28 - pressing rod, 29 - tin replenishing box, 30 - discharging opening, 31 - discharging pipeline, 32 - pushing cylinder, 33 - pushing plate, 34 - flipping arm, 35 - moving flipping arm, 36 - first shaft, 37 - second shaft, 38 - tooling slot, 39 - tooling pressing plate, 40 - pressing shaft, 41 - pressing spring, 42 - electromagnet, 43 - permanent magnet, 44 - driving motor, 45 - driving base, 46 - driving cylinder, 47 - receiving plate, 48 - mounting plate, 49 - receiving electromagnet, 50 - receiving spring, 51 - pushing plate, 52 - pushing plate cylinder. Detailed implementation mode

[0029] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings, but the protection scope of the present invention is not limited to the following.

[0030] Example 1:

[0031] As Figures 1 to 11As shown in the figure, a molten tin type rapid soldering system for a diode includes a soldering workbench 1. A tooling notch 2 is formed on the top surface of the soldering workbench 1. One end of the tooling notch 2 penetrates through the side wall of the soldering workbench 1. A flipping and clamping mechanism is arranged in the tooling notch 2. The flipping and clamping mechanism is used to clamp the circuit board carrying the diode. Above the soldering workbench 1, a molten tin type soldering device is provided. The molten tin type soldering device includes a lifting box 3 and a molten tin dropper 4. The lifting box 3 has the freedom to move in the height direction of the soldering workbench 1. A molten tin cavity 5 is arranged inside the lifting box 3. An electric heating sheet 6 is installed on the outer side wall of the lifting box 3. A piston plate 7 is slidably fitted in the molten tin cavity 5. A plurality of molten tin droppers 4 are connected to the bottom of the lifting box 3. The plurality of molten tin droppers 4 correspond one by one to the diode soldering points on the circuit board. The molten tin droppers 4 communicate with the molten tin cavity 5. The molten tin droppers 4 are sleeved on the pins of the diode and contact the circuit board. Under the pressure of the piston plate 7, the molten tin drips from the molten tin droppers 4 into the soldering points of the diode. The circuit board carrying the diode is tooled on the soldering workbench 1 through the flipping and clamping mechanism, making the pins of the diode face upward and exposed, facilitating the soldering operation of the pins of the diode by the molten tin type soldering device. The positions of the molten tin droppers 4 are set according to the soldering holes of the diodes on the circuit board, so that the plurality of molten tin droppers 4 correspond one by one to the soldering holes of the diodes. Tin bars or tin wires are added into the molten tin cavity 5 of the lifting box 3, and the tin bars or tin wires are melted into molten tin by the electric heating sheet 6. During soldering, the lifting box 3 moves downward, making the molten tin droppers 4 contact the circuit board corresponding to the soldering holes, and the pins of the diode are located inside the molten tin droppers 4. Then the piston plate 7 moves downward, making the molten tin drip out from the molten tin droppers 4. Under the action of the molten tin droppers 4, the dripping liquid can smoothly fall on the soldering holes, realizing the automatic soldering of the diode. Since the pins penetrate into the molten tin droppers 4, the dripping molten tin can wrap the pins for soldering. It is not necessary for the molten tin droppers 4 to move around the welding holes for soldering. Moreover, the occupied space of the molten tin droppers 4 is small, and the soldering operation of the diode can be completed in a narrow space without affecting the adjacent pins, improving the soldering quality. At the same time, corresponding molten tin droppers can be set according to the soldering holes of the diodes, so that the soldering operations of multiple diodes can be completed simultaneously, improving the soldering efficiency. Since the molten tin droppers 4 contact the circuit board, they can also block the outflow of the molten tin, making the molten tin accurately reach the position of the welding holes, effectively avoiding the problem of short circuit between the two pins of the diode and improving the soldering quality. It should be noted that since the molten tin is easy to solidify, in order to avoid the problem of solidification when the molten tin drips in the molten tin droppers 4, electrode wires are set, so that the electrode wires are connected to the outer wall of the molten tin droppers 4, and the molten tin droppers 4 are heated through the electrode wires to ensure that the molten tin will not solidify in the molten tin droppers 4 and can smoothly fall on the soldering holes of the diode.

[0032] Further, the tin - liquid soldering device further includes a soldering frame 24. A first cylinder 25 is vertically installed on the soldering frame 24. The telescopic shaft of the first cylinder 25 is connected to a lifting cross - beam 26. The lifting box 3 is fixedly installed on the lifting cross - beam 26. A second cylinder 27 is vertically installed on the lifting cross - beam 26. The telescopic shaft of the second cylinder 27 is connected to a pressing rod 28. The pressing rod 28 movably penetrates into the tin - liquid cavity 5 and is connected to a piston plate 7. By the telescopic movement of the first cylinder 25, the lifting cross - beam 26 moves up and down, causing the lifting box 3 to drive the tin - liquid dropper 4 to move up and down. When the lifting box 3 moves downward, it solders the diode. The second cylinder 27 drives the piston plate 7 to move through the pressing rod 28, pressing the tin liquid out of the tin - liquid cavity 5 to complete the soldering operation.

[0033] Embodiment Two:

[0034] Based on Embodiment One, as Figure 1 and Figure 11 shown, a tin - replenishing box 29 is installed on the lifting cross - beam 26. A number of tin bars are stacked along the length direction of the tin - replenishing box 29. A blanking port 30 is opened at the bottom of the tin - replenishing box 29. The tin - replenishing box 29 is connected to a blanking pipeline 31 at the blanking port 30. One end of the blanking pipeline 31 far from the tin - replenishing box 29 communicates with the tin - liquid cavity 5. A pushing cylinder 32 is installed at one end of the tin - replenishing box 29 far from the blanking port 30. The telescopic shaft of the pushing cylinder 32 movably penetrates into the tin - replenishing box 29 and is connected to a pushing plate 33. By judging the height of the tin liquid in the tin - liquid cavity 5 according to the telescopic length of the second cylinder 27, when the height of the tin liquid is lower than the set value, the pushing cylinder 32 drives the pushing plate 33 to move close to the tin bar, and the tin bar is pushed into the tin - liquid cavity 5 by the pushing plate 33 to complete the automatic tin - replenishing operation. Each time, one tin bar is added. After all the tin bars in the tin - replenishing box 29 are added, the operator stacks tin bars into the tin - replenishing box 29, so as to ensure that the tin liquid in the tin - liquid cavity 5 will not be interrupted.

[0035] Embodiment Three:

[0036] Based on Embodiment Two, as Figures 1 to 10As shown, the flip clamping mechanism includes a flip arm 34 and a movable flip arm 35 which are arranged opposite to each other. The flip arm 34 is rotatably connected to the welding workbench 1 through a first shaft 36. A second shaft 37 is fixed to the end of the movable flip arm 35 away from the flip arm 34. The second shaft 37 is movably arranged on the welding workbench 1. A tooling groove 38 is provided on the side of the flip arm 34 close to the movable flip arm 35 and on the side of the movable flip arm 35 close to the flip arm 34. An opening is provided at one end of the tooling groove 38. A tooling pressure plate 39 is provided in the tooling groove 38. Both ends of the top of the tooling pressure plate 39 are provided with a downward pressing drive mechanism. The downward pressing drive mechanism includes a downward pressing shaft 40, a downward pressing spring 41 and The electromagnet 42 and the inner top wall of the tooling slot 38 are provided with a driving slot corresponding to the position of the downward pressure driving mechanism. The electromagnet 42 is installed in the driving slot. One end of the downward pressure shaft 40 is slidably adapted to the driving slot and is connected to a permanent magnet 43. The other end is connected to the tooling pressure plate 39. A downward pressure spring 41 is arranged between the permanent magnet 43 and the electromagnet 42. The downward pressure spring 41 is connected to the downward pressure shaft 40. Since the flip arm 34 has only rotational freedom, the closed end of the tooling slot 38 of the flip arm 34 is taken as the coordinate origin. First, the circuit board carrying the diode is loaded between the flip arm 34 and the movable flip arm 35 so that the two ends of the circuit board are respectively located in the two tooling slots 38, and then Afterwards, the flip arm 35 is moved close to the flip arm 34, so as to adjust the position of the circuit board, so that the two ends of the circuit board contact the side walls of the two tooling grooves 38 respectively, and the positioning of the circuit board in the length direction is completed. Then, the circuit board is pushed so that one side of the circuit board contacts the sealed end of the tooling groove 38, and the positioning of the circuit board in the width direction is completed, so that the circuit board positioning tool is placed on the flip clamping mechanism, and it is also convenient to locate the position of the tin dropper 4. After the position of the circuit board is located, the coordinates of the soldering holes on it are also determined, so as to set the position of the tin dropper 4 according to the coordinates of the soldering holes, so that multiple tin droppers 4 correspond to multiple soldering holes one by one, and the batch production of the same circuit board is completed. After the board is positioned, the circuit board is fixed by the downward driving mechanism, and the electromagnet 42 is energized to generate a magnetic pole with the same magnetic property as the permanent magnet 43, so that the electromagnet 42 is energized to repel the permanent magnet 43, so that the downward pressing shaft 40 stretches the downward pressing spring 41 to drive the tooling pressure plate 39 to move close to the circuit board, so that the tooling pressure plate 39 contacts the circuit board to complete the fixing operation, and then the flip arm 34 and the movable flip arm 35 simultaneously drive the circuit board to rotate 180°, so that the pins of the diode are facing upwards and are in a state to be welded, and then all the diodes are welded by a tin liquid welding device, and finally the welded circuit board is removed, and the above operation is repeated to weld the diodes on the next circuit board.

[0037] Further, one end of the second shaft 37 away from the moving and flipping arm 35 passes through the welding workbench 1 and is connected to the output shaft of the driving motor 44. The housing of the driving motor 44 is mounted on the driving base 45. The driving base 45 is connected to the telescopic shaft of the driving cylinder 46. The cylinder block of the driving cylinder 46 is mounted on the welding workbench 1. The first shaft 36 is also driven by a motor. First, the driving cylinder 46 drives the moving and flipping arm 35 to move close to the flipping arm 34 to complete the tooling positioning of the circuit board. Then, the driving motor 44 drives the moving and flipping arm 35 to rotate 180° through the second shaft 37, so that the pins of the diode are in a state to be welded. After welding is completed, the flipping arm 34 and the moving and flipping arm 35 rotate back to perform the tooling for the next circuit board.

[0038] Embodiment 4:

[0039] On the basis of Embodiment 3, as Figures 1 to 9 shown, the flipping and clamping mechanism further includes a receiving plate 47 and a mounting plate 48. The top surfaces of the flipping arm 34 and the moving and flipping arm 35 are both embedded with receiving electromagnets 49. One side of the mounting plate 48 is embedded with a plurality of magnets. The plurality of magnets correspond to the plurality of receiving electromagnets 49 one by one. The end surface of the mounting plate 48 provided with the magnets is connected to the receiving plate 47 through a receiving spring 50. The mounting plate 48 is magnetically adsorbed on the flipping arm 34 and the moving and flipping arm 35, so that the receiving plate 47 contacts the body end of the diode under the action of the receiving spring 50. A push plate 51 is provided on the inner bottom wall of the tooling notch 2. The push plate 51 is connected to the telescopic shaft of the push plate cylinder 52. The cylinder block of the push plate cylinder 52 is mounted on the welding workbench 1. The push plate 51 is used to push the mounting plate 48 out from the open end of the tooling notch 2. Since the pins of the diode pass through the welding holes and are pre-arranged on the circuit board, during the flipping process of the circuit board, the diode may fall off. For this reason, after the circuit board positioning tooling is completed, the receiving plate 47 is installed first, and then the circuit board is flipped 180°. The mounting plate 48 is brought into contact with the flipping arm 34 and the moving and flipping arm 35. At this time, the receiving plate 47 will contact the body end of the diode and compress the receiving spring 50. Then, the receiving electromagnet 49 is energized to magnetically adsorb the magnet, thereby fixing the mounting plate 48 on the flipping arm 34 and the moving and flipping arm 35. At this time, the receiving plate 47 contacts the body end of the diode under the action of the receiving spring 50, thereby limiting the diode to ensure that the diode will not fall off during the flipping process of the circuit board. When the welding is completed, the diode is welded on the circuit board and will not fall off at this time. Then, the receiving electromagnet 49 is powered off, and the mounting plate 48 falls to the bottom of the tooling notch 2 under its own gravity. Then, the push plate cylinder 52 drives the push plate 51 to push the mounting plate 48 out of the tooling notch 2. At the same time, the flipping arm 34 and the moving and flipping arm 35 rotate back to unload the welded circuit board and tool the next circuit board.

[0040] Embodiment 5:

[0041] Based on Embodiment 4, as Figures 1 to 5 shown, the tin liquid dropper 4 includes a connecting pipe 8, a one-way pipe 9, and a dropping pipe 10. The two ends of the one-way pipe 9 are coaxially connected to the dropping pipe 10 and the connecting pipe 8 respectively. The end of the connecting pipe 8 away from the one-way pipe 9 communicates with the tin liquid chamber 5. The inner hole diameter of the connecting pipe 8 and the inner diameter of the dropping pipe 10 are both smaller than the inner hole diameter of the one-way pipe 9. A steel ball spring 11 is arranged in the one-way pipe 9. One end of the steel ball spring 11 is connected to the step formed by the one-way pipe 9 and the dropping pipe 10, and the other end is connected with a steel ball 12. Under the action of the steel ball spring 11, the steel ball 12 blocks the inner hole of the connecting pipe 8, so that the tin liquid dropper 4 can only conduct in one direction, that is, the tin liquid can only enter the tin liquid dropper 4 from the tin liquid chamber 5. When the piston plate 7 moves downward to squeeze the tin liquid, under the action of pressure, the steel ball 12 squeezes the steel ball spring 11 to compress, so that the inner hole of the connecting pipe 8 communicates with the inner hole of the one-way pipe 9, so that the tin liquid in the tin liquid chamber 5 can smoothly pass through the tin liquid dropper 4 and drip on the welding hole position of the circuit board. After the piston plate 7 stops moving, the steel ball 12 resets under the reaction force of the steel ball spring 11, so as to block the inner hole of the connecting pipe 8, so that the tin liquid in the tin liquid chamber 5 will not flow out, realizing a stable tin liquid type welding operation; it should be noted that the melting temperature of the solder is generally between 183°C and 227°C, and the temperature in the tin liquid chamber 5 needs to be above the solder melting temperature to ensure that the solder is always in a liquid state. The steel ball spring 11 is made of a high-temperature alloy material, and the temperature resistance range is between 300°C and 950°C, so that the steel ball spring 11 can be used in a high-temperature environment. Secondly, because the tin liquid dropper 4 is under the action of the electrode wire, the temperature in the one-way pipe 9 is higher than the tin liquid melting temperature, which can ensure that the solder in the one-way pipe 9 is in a liquid state and will not affect the compression and reset of the steel ball spring 11.

[0042] Embodiment 6:

[0043] Based on Embodiment 5, as Figures 1 to 7As shown in the figure, a vibration dropping mechanism is provided on the lifting box 3. The vibration dropping mechanism includes a vibration plate 13. The vibration plate 13 has a degree of freedom to move in the horizontal direction. A through hole 14 is provided in the vibration plate 13 at a position corresponding to the tin liquid dropper 4. The tin liquid dropper 4 passes through the through hole 14. A rubber block 15 is fixed on the inner wall of the through hole 14. A vibration sliding groove 16 is provided at the bottom of the lifting box 3. A guide rod 17 is fixed in the vibration sliding groove 16. A guide slider 18 is slidably penetrated on the guide rod 17. A spring 19 is sleeved on the guide rod 17. The two ends of the spring 19 are respectively connected to the guide slider 18 and the lifting box 3. A motor base 20 is provided on the side wall of the lifting box 3. A motor 21 is installed on the motor base 20. The output shaft of the motor 21 is connected to a cam 22. A wedge surface 23 is provided on the top surface of the vibration plate 13 near one end of the cam 22. The wedge surface 23 is located on the rotation path of the cam 22. When the tin liquid dropper 4 contacts the circuit board, the vibration dropping mechanism acts to vibrate the tin liquid dropper 4, so that the tin liquid in the tin liquid dropper 4 can be maximally pressed against the welding position, avoiding the situation of insufficient soldering. At the same time, when the lifting box 3 resets, the residual tin liquid in the tin liquid dropper 4 is prevented from dropping on the non-welding position of the circuit board. The specific vibration principle is as follows: The motor 21 drives the cam 22 to rotate, so that the eccentric end of the cam 22 presses the wedge surface 23 of the vibration plate 13. Under the action of the wedge surface 23, the vibration plate 13 presses the spring 19 to drive the rubber block 15 to move closer to the tin liquid dropper 4, so that the rubber block 15 impacts the tin liquid dropper 4. When the eccentric end of the cam 22 moves away from the wedge surface 23, the vibration plate 13 moves away from the tin liquid dropper 4 under the reaction force of the spring 19. Repeating like this, under the rotation of the cam 22, the rubber block 15 quickly impacts the tin liquid dropper 4 multiple times, causing the tin liquid dropper 4 to vibrate, so that the residual tin liquid in the tin liquid dropper 4 drops off.

Claims

1. A tin liquid type rapid soldering system for a diode, characterized in that, It includes a welding workbench (1). A tooling notch (2) is formed on the top surface of the welding workbench (1). One end of the tooling notch (2) penetrates through the side wall of the welding workbench (1). A flipping and clamping mechanism is arranged in the tooling notch (2). The flipping and clamping mechanism is used to clamp the circuit board carrying the diode. Above the welding workbench (1), a tin - liquid type welding device is provided. The tin - liquid type welding device includes a lifting box (3) and a tin - liquid dropper (4). The lifting box (3) has a degree of freedom to move along the height direction of the welding workbench (1). A tin - liquid cavity (5) is arranged inside the lifting box (3). An electric heating sheet (6) is installed on the outer side wall of the lifting box (3). A piston plate (7) is slidably fitted in the tin - liquid cavity (5). A plurality of the tin - liquid droppers (4) are connected to the bottom of the lifting box (3). The plurality of tin - liquid droppers (4) correspond one - to - one with the welding points of the diodes on the circuit board. The tin - liquid dropper (4) communicates with the tin - liquid cavity (5). The tin - liquid dropper (4) is sleeved on the pin of the diode and contacts the circuit board. Under the pressure of the piston plate (7), the tin liquid drops from the tin - liquid dropper (4) into the welding points of the diode; A vibration dropping mechanism is arranged on the lifting box (3). The vibration dropping mechanism includes a vibration plate (13). The vibration plate (13) has a degree of freedom to move along the horizontal direction. A through - hole (14) is formed in the vibration plate (13) at a position corresponding to the tin - liquid dropper (4). The tin - liquid dropper (4) passes through the through - hole (14). A rubber block (15) is fixed on the inner wall of the through - hole (14); A vibration sliding groove (16) is formed at the bottom of the lifting box (3). A guide rod (17) is fixed in the vibration sliding groove (16). A guide slider (18) is slidably penetrated on the guide rod (17). A spring (19) is sleeved on the guide rod (17). The two ends of the spring (19) are respectively connected to the guide slider (18) and the lifting box (3). A motor seat (20) is arranged on the side wall of the lifting box (3). A motor (21) is installed on the motor seat (20). The output shaft of the motor (21) is connected to a cam (22). A wedge - shaped surface (23) is arranged on the top surface of the vibration plate (13) near one end of the cam (22). The wedge - shaped surface (23) is located on the rotation path of the cam (22).

2. The tin liquid type rapid soldering system for a diode according to claim 1, wherein The tin liquid dropper (4) includes a connecting pipe (8), a one-way pipe (9) and a dropping pipe (10). The two ends of the one-way pipe (9) are coaxially connected to the dropping pipe (10) and the connecting pipe (8) respectively. One end of the connecting pipe (8) away from the one-way pipe (9) communicates with the tin liquid chamber (5). The inner hole diameter of the connecting pipe (8) and the inner diameter of the dropping pipe (10) are both smaller than the inner hole diameter of the one-way pipe (9). A steel ball spring (11) is arranged in the one-way pipe (9). One end of the steel ball spring (11) is connected to the step formed by the one-way pipe (9) and the dropping pipe (10), and the other end is connected with a steel ball (12). Under the action of the steel ball spring (11), the steel ball (12) blocks the inner hole of the connecting pipe (8).

3. The tin liquid type rapid soldering system for a diode according to claim 1, characterized in that, The tin liquid type soldering device further includes a soldering frame (24). A first cylinder (25) is vertically installed on the soldering frame (24). The telescopic shaft of the first cylinder (25) is connected to a lifting cross beam (26). The lifting box (3) is fixedly installed on the lifting cross beam (26). A second cylinder (27) is vertically installed on the lifting cross beam (26). The telescopic shaft of the second cylinder (27) is connected to a pressing rod (28). The pressing rod (28) movably penetrates into the tin liquid chamber (5) and is connected to the piston plate (7).

4. The solder bath type rapid soldering system for a diode according to claim 3, wherein A tin replenishing box (29) is installed on the lifting cross beam (26). A plurality of tin bars are stacked along the length direction of the tin replenishing box (29). A blanking port (30) is opened at the bottom of the tin replenishing box (29). The tin replenishing box (29) is connected with a blanking pipeline (31) at the blanking port (30). One end of the blanking pipeline (31) away from the tin replenishing box (29) communicates with the tin liquid chamber (5). A pushing cylinder (32) is installed at one end of the tin replenishing box (29) away from the blanking port (30). The telescopic shaft of the pushing cylinder (32) movably penetrates into the tin replenishing box (29) and is connected to a pushing plate (33).

5. A tin liquid type rapid soldering system for a diode according to claim 1, characterized in that, The flipping and clamping mechanism includes a flipping arm (34) and a movable flipping arm (35) which are oppositely arranged. The flipping arm (34) is rotationally connected to the welding workbench (1) through a first shaft (36). A second shaft (37) is fixed at one end of the movable flipping arm (35) away from the flipping arm (34). The second shaft (37) movably penetrates through the welding workbench (1). A tooling groove (38) is formed on one side of the flipping arm (34) close to the movable flipping arm (35) and on one side of the movable flipping arm (35) close to the flipping arm (34). One end of the tooling groove (38) is provided with an opening. A tooling pressing plate (39) is arranged in the tooling groove (38). Pressing-down driving mechanisms are arranged at both ends of the top of the tooling pressing plate (39). The pressing-down driving mechanism includes a pressing-down shaft (40), a pressing-down spring (41) and an electromagnet (42). A driving groove is formed on the inner top wall of the tooling groove (38) corresponding to the position of the pressing-down driving mechanism. The electromagnet (42) is installed in the driving groove. One end of the pressing-down shaft (40) is slidably fitted in the driving groove and is connected with a permanent magnet (43), and the other end is connected with the tooling pressing plate (39). A pressing-down spring (41) is arranged between the permanent magnet (43) and the electromagnet (42), and the pressing-down spring (41) is connected with the pressing-down shaft (40).

6. A tin liquid type rapid soldering system for a diode according to claim 5, characterized in that, One end of the second shaft (37) away from the movable flipping arm (35) penetrates through the welding workbench (1) and is connected to the output shaft of a driving motor (44). The housing of the driving motor (44) is installed on a driving base (45). The driving base (45) is connected to the telescopic shaft of a driving cylinder (46). The cylinder body of the driving cylinder (46) is installed on the welding workbench (1).

7. The tin liquid type rapid soldering system for a diode according to claim 6, characterized in that The flipping and clamping mechanism further includes a receiving plate (47) and a mounting plate (48). Receiving electromagnets (49) are embedded on the top surfaces of both the flipping arm (34) and the movable flipping arm (35). A plurality of magnets are embedded on one surface of the mounting plate (48). The plurality of magnets correspond to the plurality of receiving electromagnets (49) one by one. The end surface of the mounting plate (48) provided with the magnets is connected to the receiving plate (47) through a receiving spring (50). The mounting plate (48) is magnetically adsorbed on the flipping arm (34) and the movable flipping arm (35), so that the receiving plate (47) contacts the body end of the diode under the action of the receiving spring (50).

8. A tin liquid type rapid soldering system for a diode according to claim 7, characterized in that, A push plate (51) is arranged on the inner bottom wall of the tooling groove opening (2). The push plate (51) is connected to the telescopic shaft of a push plate cylinder (52). The cylinder body of the push plate cylinder (52) is installed on the welding workbench (1). The push plate (51) is used for pushing the mounting plate (48) out from the opening end of the tooling groove opening (2).

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