Inverter box body heat dissipation device convenient to maintain

Abstract

The invention is suitable for the technical field of inverters, and provides an inverter box body heat dissipation device convenient to maintain, which comprises a box body frame and a heating source, the heat conduction substrate is arranged right behind the heating source; a fin layer is arranged on the outer side wall of the heat conduction substrate, a flow guide layer is arranged on the side, away from the heat conduction substrate, of the fin layer, and the flow guide layer is in inserted fit with the fin layer through a buckle; according to the invention, the copper-aluminum composite board heat conduction substrate, the fin layer, the flow guide layer, the filter layer and other heat dissipation modules are adopted, the rapid connection design, the flexibly adjusted flow guide fin and piezoelectric ceramic transducer cleaning technology and the efficient three-layer filter structure are combined, the heat dissipation efficiency is improved, and the heat dissipation efficiency is improved. A dual-circulation heat dissipation system is constructed by cooperating with a heat dissipation fan and a micro axial fan, so that the heat dissipation efficiency and the system stability are greatly improved, meanwhile, maintenance and management are facilitated, and stable operation of the inverter in a clean and efficient working environment is ensured.

Description

Technical Field

[0001] The present invention belongs to the technical field of inverters, and particularly relates to a heat dissipation device for an inverter box body that is convenient for maintenance. Background Art

[0002] With the rapid development of power electronics technology, inverters, as key devices connecting energy supply and loads, play an irreplaceable role in ensuring the safe and efficient operation of power systems in terms of their performance stability and reliability. However, a large amount of heat generated during the operation of inverters has become a key factor restricting the performance of inverters. If this heat cannot be effectively dissipated, it will lead to an increase in the internal temperature of the inverter, resulting in overheating, which will not only reduce its working efficiency but also may cause permanent damage to the device and shorten its service life.

[0003] Traditional heat dissipation devices, such as heat sinks or single fans, although they can alleviate the heat dissipation problem of inverters to a certain extent, their limitations are becoming increasingly prominent. Especially in complex and changeable working conditions, a single heat dissipation mode often has difficulty flexibly meeting the changing heat dissipation requirements. The specific manifestations are as follows:

[0004] 1. The heat dissipation path is fixed, resulting in local overheating or energy consumption waste, uneven heat dissipation, and affecting the heat dissipation efficiency.

[0005] 2. Excessive dust accumulation, and the fixed structure makes the disassembly and cleaning of the device complicated, and the maintenance cycle becomes longer.

[0006] 3. The degree of intelligence is low, and the dynamic optimization of the heat dissipation effect cannot be achieved. These problems seriously restrict the improvement of the heat dissipation performance of inverters and have become the key factors restricting their wide application. Summary of the Invention

[0007] The present invention provides a heat dissipation device for an inverter box body that is convenient for maintenance, aiming to solve the problems of the existing inverter heat dissipation device with a fixed heat dissipation path, resulting in uneven heat dissipation and energy consumption waste; difficult dust accumulation to clean, cumbersome maintenance and long cycle; insufficient intelligence and inability to achieve dynamic optimization of the heat dissipation effect.

[0008] The present invention is implemented as follows. A heat dissipation device for an inverter box that is convenient for maintenance includes: a box frame and a heat source; a heat conduction substrate disposed directly behind the heat source; a fin layer provided on the outer sidewall of the heat conduction substrate, and heat conduction silicone gaskets are provided on both sides of the heat conduction substrate in contact with the heat source and the fin layer: wherein, the fin layer includes: a plurality of aluminum alloy fins fixed to the heat conduction substrate by brazing, and the plurality of aluminum alloy fins are arrayed and extend horizontally along the heat conduction substrate. The distance between every two adjacent aluminum alloy fins is 3 mm, and the surface of the aluminum alloy fins is coated with a graphene-based heat conduction coating, and the thickness of the graphene-based heat conduction coating is 20 μm; a flow guiding layer is provided on the side of the fin layer away from the heat conduction substrate, and the flow guiding layer is inserted and cooperated with the fin layer through a buckle: a flow guiding vane and a stepping motor are provided on the flow guiding layer, and the surface of the flow guiding vane is coated with a water-repellent coating; the output end of the stepping motor is key-fixed to the end of the flow guiding vane, and the deflection angle of the flow guiding vane is between +±30°; a filter layer is provided on the side of the fin layer away from the flow guiding layer, and the filter layer is slidably cooperated with the flow guiding layer through a slide rail; the filter layer includes: an activated carbon adsorption layer, a HEPA filter screen, and an electrostatic electret filter membrane. The activated carbon adsorption layer, the HEPA filter screen, and the electrostatic electret filter membrane are laminated and compounded by hot melt adhesive to form a composite filter membrane with a total thickness ≤1.5 mm.

[0009] Preferably, a piezoelectric ceramic transducer is adhesively fixed to the inner side of the flow guiding vane by epoxy resin, and an acoustic wave focusing array is formed by grooving on the surface of the piezoelectric ceramic transducer.

[0010] Preferably, the outer surface of the flow guiding vane is coated with a VTRP electret coating, and the VTRP electret coating is subjected to 40 kHz high-frequency polarization treatment to form a gradient charge field from +500 V / μm at the inlet to -500 V / μm at the outlet.

[0011] Preferably, 4 groups of heat dissipation fans are provided on the inner wall of the box frame, and a flow guiding partition is provided directly below the heat dissipation fans. The flow guiding partition is inclined at an angle of 25° from left to right relative to the horizontal plane, with a front end height of 25 mm and a rear end height of 15 mm, forming a downwardly inclined air flow guiding structure.

[0012] Preferably, a transmission module is integrated in the box frame, and the transmission module includes a dust sensor, a temperature and humidity sensor, and a main controller.

[0013] Preferably, the cross section of the slide rail is an isosceles trapezoid, and it is injection-molded with POM material and plated with a hard chromium layer.

[0014] Preferably, the heat conduction substrate is made of a copper-aluminum composite plate.

[0015] Preferably, 2 groups of heat dissipation fans are provided in the middle of the box frame, and the other 2 groups of fans are distributed on both sides of the middle heat dissipation fans, forming a 15° angle with the ends of the blades of the middle heat dissipation fans.

[0016] Preferably, a micro axial flow fan is nested inside the flow guiding partition board, forming a double heat dissipation structure with the four groups of heat dissipation fans.

[0017] Compared with the prior art, the embodiments of the present application mainly have the following beneficial effects:

[0018] First: The present invention uses a copper-aluminum composite plate as the heat conduction substrate, and combines three heat dissipation modules: a fin layer, a flow guiding layer, and a filtering layer, significantly improving the heat conduction and dissipation efficiency; ensuring that the heat generated during the operation of the inverter can be quickly captured by the heat conduction substrate and efficiently dissipated through the large heat dissipation area of the fin layer, effectively preventing overheating, thus ensuring the stable operation of the inverter; a quick connection mode is adopted between the fin layer, the flow guiding layer, and the filtering layer. This design not only enhances the overall performance of the heat dissipation system but also greatly facilitates subsequent replacement and maintenance work; users can easily disassemble and recombine these modules, not only reducing the maintenance cost but also improving the work efficiency, making the maintenance management of the inverter more convenient and efficient.

[0019] Second: The flow guiding fins of the present invention have the ability to flexibly adjust the air flow direction, can optimize the air flow path according to the actual heat dissipation requirements. At the same time, the directional sound waves generated by the piezoelectric ceramic transducer play an important role in promoting air flow. This characteristic not only enhances the heat dissipation effect but also effectively assists in cleaning the surfaces of the fin layer and the flow guiding layer, reducing the accumulation of dust and dirt;

[0020] In addition, the three-layer filtering structure adopted by the present invention, including an activated carbon adsorption layer, a HEPA filter, and an electret filter membrane, can efficiently filter dust, particles, and harmful gases in the air, ensuring the continuous cleanliness of the air inside the inverter box. This design not only provides a stable and high-quality working environment for the inverter but also helps to extend its service life and improve the reliability and performance of the overall system.

[0021] Third: The present invention constructs an efficient double-cycle heat dissipation structure through the collaborative work of the heat dissipation fans and the micro axial flow fans. This structure can flexibly adapt to the heat dissipation requirements under different working conditions by precisely adjusting the rotation speed of the heat dissipation fans and the deflection angle of the flow guiding fins, thus ensuring that the heat dissipation device always maintains the best heat dissipation effect state. This design not only improves the heat dissipation efficiency but also enhances the stability and adaptability of the system. Description of the Drawings

[0022] Figure 1 is a three-dimensional structure schematic diagram of the present invention;

[0023] Figure 2 is a three-dimensional structure schematic diagram of the present invention;

[0024] Figure 3It is a schematic diagram of the three-dimensional structure of the present invention;

[0025] Figure 4 It is a side view of the present invention;

[0026] Figure 5 It is a front view of the present invention;

[0027] Figure 6 It is a schematic diagram of the side sectional structure of the present invention;

[0028] Figure 7 It is a schematic diagram of the front sectional structure of the present invention;

[0029] Figure 8 It is the present invention Figure 5 The enlarged structure schematic diagram at position A of;

[0030] In the figure: 1. Box body frame; 2. Heat source; 3. Heat conduction substrate; 4. Fin layer; 5. Heat conduction silicone gasket; 6. Aluminum alloy fin; 7. Flow guiding layer; 8. Buckle; 9. Flow guiding wing; 10. Stepper motor; 11. Filter layer; 12. Slide rail; 13. Activated carbon adsorption layer; 14. HEPA filter; 15. Electrostatic electret filter membrane; 16. Piezoelectric ceramic transducer; 17. Cooling fan; 18. Flow guiding partition; 19. Transmission module; 20. Micro axial flow fan. Detailed implementation manners

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs; the terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above drawings are intended to cover non-exclusive inclusion. The terms "first", "second", etc. in the specification and claims of this application or the above drawings are used to distinguish different objects and not to describe a specific order.

[0032] Reference to "embodiment" herein means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of this application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0033] The embodiment of the present invention provides an inverter box body heat dissipation device that is convenient for maintenance, as Figures 1-6As shown in the figure, it includes: a box body frame 1 and a heat source 2; a heat conduction substrate 3 arranged directly behind the heat source 2; a fin layer 4 is arranged on the outer side wall of the heat conduction substrate 3, and heat conduction silicone gaskets 5 are arranged on both sides of the heat conduction substrate 3 in contact with the heat source 2 and the fin layer 4: Among them, the fin layer 4 includes: a number of aluminum alloy fins 6 fixed on the heat conduction substrate 3 by brazing, and the number of aluminum alloy fins 6 are arrayed and extend horizontally along the heat conduction substrate 3. The distance between every two adjacent aluminum alloy fins 6 is 3 mm. The surface of the aluminum alloy fins 6 is coated with a graphene-based heat conduction coating, and the thickness of the graphene-based heat conduction coating is 20 μm; a diversion layer 7 is arranged on the side of the fin layer 4 away from the heat conduction substrate 3, and the diversion layer 7 is inserted and matched with the fin layer 4 through a buckle 8: A diversion vane 9 and a stepping motor 10 are arranged on the diversion layer 7, and the surface of the diversion vane 9 is coated with a water-repellent coating; the output end of the stepping motor 10 is key-fixed to the end of the diversion vane 9, and the deflection angle of the diversion vane 9 is between +±30°; a filter layer 11 is arranged on the side of the fin layer 4 away from the diversion layer 7, and the filter layer 11 is slidably matched with the diversion layer 7 through a slide rail 12; the filter layer 11 includes: an activated carbon adsorption layer 13, a HEPA filter 14 and an electrostatic electret filter membrane 15. The activated carbon adsorption layer 13, the HEPA filter 14 and the electrostatic electret filter membrane 15 are laminated and compounded by hot melt adhesive to form a composite filter membrane with a total thickness ≤1.5 mm.

[0034] It should be noted that due to the fixed heat dissipation path of the existing inverter heat dissipation device, it causes uneven heat dissipation and energy consumption waste; dust accumulation is difficult to clean, the maintenance is cumbersome and the cycle is long; the lack of intelligence makes it impossible to dynamically optimize the heat dissipation effect. Through the design of the high-efficiency heat dissipation module of the copper-aluminum composite heat conduction substrate 3 and the fin layer 4, the diversion layer 7, and the filter layer 11, this solution significantly improves the heat conduction and dissipation efficiency, ensures the stable operation of the inverter, and greatly facilitates the maintenance and replacement of the heat dissipation system, reduces costs, and improves work efficiency. At the same time, the flexible adjustment of the diversion vane 9 and the directional sound wave technology of the piezoelectric ceramic transducer 16 enhance the heat dissipation effect and clean the heat dissipation surface, while the three-layer filter structure ensures the cleanliness and high quality of the inverter working environment and extends the service life. In addition, the double-cycle heat dissipation structure in which the heat dissipation fan 17 and the micro axial flow fan 20 work together flexibly adapts to different working conditions, ensures the best heat dissipation effect, and improves the heat dissipation efficiency and system stability.

[0035] Specifically, in this embodiment, the solution mainly includes: a box body frame 1 and a heat source 2; a heat conduction substrate 3 is installed directly behind the heat source 2, and the heat conduction substrate 3 plays a key role in conducting the heat generated by the heat source 2; on the outer side wall of the heat conduction substrate 3, a fin layer 4 is designed to increase the heat dissipation area and improve the heat dissipation efficiency; the fin layer 4 is composed of a plurality of aluminum alloy fins 6 fixed on the heat conduction substrate 3 by brazing technology. The aluminum alloy fins 6 extend horizontally along the heat conduction substrate 3 in an array form, and the distance between every two adjacent fins is precisely controlled at 3 mm to ensure the best heat dissipation effect and air circulation;

[0036] To further improve the heat conduction performance, a graphene-based heat conduction coating with a thickness of 20 μm is also coated on the surface of the aluminum alloy fins 6. The graphene-based heat conduction coating has excellent heat conduction performance and can quickly conduct the heat absorbed by the aluminum alloy fins 6;

[0037] On the outer side of the fin layer 4, a diversion layer 7 is provided. The diversion layer 7 is in plug-in fit with the fin layer 4 through a buckle 8, which is convenient for disassembly and maintenance; a diversion vane 9 and a stepping motor 10 are installed on the diversion layer 7; a hydrophobic coating is coated on the surface of the diversion vane 9 to prevent water vapor or dust from adhering and affecting its working efficiency; the output end of the stepping motor 10 is fixedly connected to the end of the diversion vane 9 through a key, so that the stepping motor 10 can drive the diversion vane 9 to deflect within a range of ±30°, thereby adjusting the direction and speed of air flow and optimizing the heat dissipation effect;

[0038] On the side of the diversion layer 7 away from the fin layer 4, a filter layer 11 is also provided. The filter layer 11 is in sliding fit with the diversion layer 7 through a slide rail 12, which is convenient for replacement and maintenance; the filter layer 11 is composed of three layers: an activated carbon adsorption layer 13, a HEPA filter 14, and an electrostatic electret filter membrane 15. They are laminated and compounded through hot melt adhesive to form a composite filter membrane with a total thickness not exceeding 1.5 mm; this composite filter membrane can not only effectively filter out dust and particles in the air, but also adsorb harmful gases to ensure the cleanliness of the air inside the inverter box body frame 1 and the stability of the heat dissipation efficiency.

[0039] In a further preferred embodiment of the present invention, as Figures 1-2 shown, a piezoelectric ceramic transducer 16 is fixedly bonded to the inner side of the diversion vane 9 through epoxy resin, and an acoustic focusing array is formed by grooving on the surface of the piezoelectric ceramic transducer 16.

[0040] In this embodiment, the piezoelectric ceramic transducer 16 is a device that can convert electrical energy into mechanical energy. Its surface is specially grooved to form an acoustic focusing array. This design enables the piezoelectric ceramic transducer 16 to generate directional sound waves when powered on. These sound waves not only help enhance air flow and improve heat dissipation efficiency, but also play a role in cleaning the surfaces of the fin layer 4 and the flow guiding layer 7 to prevent the accumulation of dust and particles.

[0041] In a further preferred embodiment of the present invention, as Figures 1-2 shown, the outer surface of the flow guiding fin 9 is coated with a VTRP electret coating. The VTRP electret coating is subjected to 40 kHz high-frequency polarization treatment to form a gradient charge field from +500 V / μm at the inlet to -500 V / μm at the outlet.

[0042] In this embodiment, the VTRP electret coating is subjected to 40 kHz high-frequency polarization treatment to form a gradient charge field from +500 V / μm at the inlet to -500 V / μm at the outlet. This gradient charge field not only helps further enhance air flow and improve heat dissipation efficiency, but also captures particles in the air through the electrostatic effect and works in cooperation with the subsequent filter layer 11 to achieve more efficient air purification.

[0043] In a further preferred embodiment of the present invention, as Figures 1-2 shown, the inner wall of the cabinet frame 1 is provided with 4 groups of cooling fans 17. A flow guiding partition 18 is arranged directly below the cooling fans 17. The flow guiding partition 18 is inclined at an angle of 25° from left to right relative to the horizontal plane, with a front end height of 25 mm and a rear end height of 15 mm, forming a downward-inclined air flow guiding structure.

[0044] In this embodiment, the cooling fans 17 not only accelerate the air flow inside the cabinet frame 1, but also help take away the heat from the fin layer 4 and the flow guiding layer 7 more quickly. A flow guiding partition 18 is arranged directly below the cooling fans 17. The flow guiding partition 18 is inclined at an angle of 25° from left to right relative to the horizontal plane, with a front end height of 25 mm and a rear end height of 15 mm, forming a downward-inclined air flow guiding structure. This design enables the air flow blown by the cooling fans 17 to flow along the inclined direction of the flow guiding partition 18 and pass through the fin layer 4 and the flow guiding layer 7 more smoothly, thereby improving the heat dissipation efficiency.

[0045] In a further preferred embodiment of the present invention, as Figures 1-2 shown, a transmission module 19 is integrated inside the cabinet frame 1. The transmission module 19 includes a dust sensor, a temperature and humidity sensor, and a main controller.

[0046] In this embodiment, the dust sensor is used to monitor the dust concentration inside the cabinet frame 1 in real time. When the dust concentration exceeds the preset threshold, the main controller will activate the corresponding cleaning mechanism, such as increasing the deflection frequency of the guide vanes 9 or activating the piezoelectric ceramic transducer 16 for acoustic cleaning. The temperature and humidity sensor is used to monitor the temperature and humidity inside the cabinet frame 1 to ensure that the inverter operates under suitable environmental conditions. The main controller, as the core of the entire drive module 19, is responsible for receiving sensor data, processing information, and issuing control commands to achieve the efficient and intelligent operation of the heat dissipation device.

[0047] In a further preferred embodiment of the present invention, as Figures 1-2 shown, the cross-section of the slide rail 12 is an isosceles trapezoid, which is injection-molded from POM material and plated with a hard chromium layer.

[0048] In this embodiment, the cross-section of the slide rail 12 is designed as an isosceles trapezoid, which not only ensures the stable cooperation between the slide rail and the slider, but also facilitates installation and disassembly. The slide rail is injection-molded from POM material, and the POM material has excellent wear resistance, self-lubrication, and mechanical strength, which can meet the stability and durability requirements of the slide rail during long-term use. In addition, a hard chromium layer is plated on the surface of the slide rail 12, further improving its hardness and wear resistance and extending its service life.

[0049] In a further preferred embodiment of the present invention, as Figures 1-2 shown, the heat-conducting substrate 3 is a copper-aluminum composite plate.

[0050] In this embodiment, the copper-aluminum composite plate combines the high heat conductivity of copper and the light weight and corrosion resistance of aluminum, enabling the heat-conducting substrate 3 to quickly conduct the heat generated by the heat source 2 while maintaining a relatively light weight and good corrosion resistance.

[0051] In a further preferred embodiment of the present invention, as Figures 1-2 shown, two sets of cooling fans 17 are arranged in the middle of the cabinet frame 1, and the other two sets of fans are distributed on both sides of the middle cooling fans 17, forming a 15° angle with the ends of the blades of the middle cooling fans 17.

[0052] In this embodiment, this layout enables the airflow generated by the cooling fans 17 to form a more uniform and efficient flow pattern, which not only accelerates the air flow inside the cabinet frame 1 but also helps to carry away the heat on the fin layer 4 and the guide layer 7 more quickly.

[0053] In a further preferred embodiment of the present invention, as Figures 1-2 shown, a micro axial flow fan 20 is nested inside the guide partition 18, forming a double heat dissipation structure with the four sets of cooling fans 17.

[0054] In this embodiment, the micro axial flow fan 20 can accelerate the air flow below the diversion partition 18, helping to carry away the heat on the fin layer 4 and the diversion layer 7 more quickly, and also contributing to discharging the heat inside the cabinet frame 1 more rapidly.

[0055] Working principle: In order to effectively dissipate heat, the present invention installs a heat conducting substrate 3 directly behind the heat source 2. The heat conducting substrate 3 is made of a high-performance copper-aluminum composite plate material, ensuring rapid heat conduction.

[0056] On the outer sidewall of the heat conducting substrate 3, a fin layer 4 is designed. The fin layer 4 is used to increase the heat dissipation area and improve the heat dissipation efficiency. The fin layer 4 is composed of multiple aluminum alloy fins 6 fixed to the heat conducting substrate 3 by brazing technology. The fin layer 4 extends horizontally along the heat conducting substrate 3 in an array form, and the spacing is precisely controlled to ensure the best heat dissipation effect and air circulation. To further enhance the heat conduction performance, a graphene-based heat conducting coating with a thickness of 20 μm is also coated on the surface of the aluminum alloy fins 6.

[0057] On the outer side of the fin layer 4, a diversion layer 7 is provided. The diversion layer 7 is in plug-in fit with the fin layer 4 through a buckle 8, facilitating disassembly and maintenance. A diversion vane 9 and a stepper motor 10 are installed on the diversion layer 7. The diversion vane 9 can deflect to adjust the air flow direction. At the same time, the hydrophobic coating and VTRP electret coating on its surface enhance the air flow and heat dissipation efficiency.

[0058] Particularly, a piezoelectric ceramic transducer 16 is also fixedly bonded to the inner side of the diversion vane 9 by epoxy resin, which is used to generate directional sound waves to enhance the air flow and clean the surfaces of the fin layer 4 and the diversion layer 7.

[0059] On the side of the diversion layer 7 away from the fin layer 4, a filter layer 11 is provided. The filter layer 11 is in sliding fit with the diversion layer 7 through a slide rail 12, facilitating replacement and maintenance. The slide rail 12 is injection molded from POM material and plated with a hard chromium layer, ensuring the stability and durability of the slide rail. The filter layer 11 is composed of three layers: an activated carbon adsorption layer 13, a HEPA filter 14, and an electrostatic electret filter membrane 15, which can effectively filter dust, particles, and harmful gases in the air, keeping the air inside the cabinet frame 1 clean.

[0060] To further enhance the heat dissipation effect, 4 groups of heat dissipation fans 17 are provided on the inner wall of the cabinet frame 1, constituting the main heat dissipation structure. Among them, 2 groups of heat dissipation fans 17 are provided in the middle of the cabinet frame 1, and the other 2 groups of fans are distributed on both sides of the middle heat dissipation fans 17, forming a 15° angle with the blade ends of the middle heat dissipation fans 17. This layout helps to form a more uniform and efficient air flow.

[0061] In addition, a diversion partition 18 is provided directly below the cooling fan 17. These diversion partitions 18 are inclined at an angle of 25° relative to the horizontal plane, forming a downward-inclined air flow guiding structure; a micro axial flow fan 20 is nested inside the diversion partition 18. These micro axial flow fans 20 and the four groups of cooling fans 17 together constitute a double cooling structure, further improving the cooling efficiency; the micro axial flow fan 20 can accelerate the air flow below the diversion partition 18, helping to take away the heat on the fin layer 4 and the diversion layer 7 faster, and also contributing to discharging the heat inside the cabinet frame 1 faster;

[0062] A transmission module 19 is also integrated inside the cabinet frame 1, including a dust sensor, a temperature and humidity sensor, and a main controller; the dust sensor is used to monitor the dust concentration inside the cabinet frame 1 in real time, the temperature and humidity sensor is used to monitor the temperature and humidity, and the main controller is responsible for receiving the sensor data, processing the information, and sending control instructions to achieve the efficient and intelligent operation of the cooling device.

[0063] It should be noted that, for the foregoing embodiments, for the sake of simple description, they are all expressed as a series of action combinations. However, those skilled in the art should know that the present invention is not limited by the described action sequence, because according to the present invention, certain steps may be adopted in other sequences or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily essential to the present invention.

[0064] In several embodiments provided by the present application, it should be understood that the disclosed device can be implemented in other ways. For example, the device embodiments described above are only illustrative. For example, the above division of units can be realized in other ways during actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point, the displayed or discussed coupling or communication connection between each other can be through some interfaces. The indirect coupling or communication connection between devices or units can be in the form of telecommunications or other forms.

[0065] The units described as separate components may or may not be physically separated. The components displayed as units may or may not be physical units, that is, they can be located in one place, or they can be distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0066] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than limiting the protection scope of the invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on these embodiments, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention. Although the present invention has been described in detail with reference to the above embodiments, those of ordinary skill in the art can still, without conflict and without creative efforts, combine, add, delete or make other adjustments to the features in the embodiments of the present invention according to the circumstances, so as to obtain different technical solutions that essentially do not deviate from the concept of the present invention, and these technical solutions also belong to the scope of protection of the present invention.

Claims

1. An inverter box heat dissipation device that is easy to maintain, characterized in that: include: Box frame and heat source; A heat-conducting substrate disposed directly behind the heat source; The outer wall of the heat-conducting substrate is provided with a fin layer, and the side of the heat-conducting substrate that contacts the heat source and the fin layer is provided with a heat-conducting silicone gasket: The fin layer includes: A plurality of aluminum alloy fins are fixed on a heat-conducting substrate by brazing, and an array of the aluminum alloy fins extends laterally along the heat-conducting substrate, and a distance between every two adjacent aluminum alloy fins is 3 mm. A graphene-based heat-conducting coating is coated on the surface of the aluminum alloy fins, and the thickness of the graphene-based heat-conducting coating is 20 μm; A guide layer is provided on the side of the fin layer away from the heat-conducting substrate, and the guide layer is plugged and matched with the fin layer through a buckle: The guide layer is provided with guide vanes and a stepper motor, and the surface of the guide vanes is coated with a hydrophobic coating; The output end of the stepper motor is fixedly connected to the end key of the guide fin, and the deflection angle of the guide fin is between +±30°; A filter layer is arranged on the side of the fin layer away from the guide layer, and the filter layer is slidably matched with the guide layer through a slide rail; The filter layers include: The activated carbon adsorption layer, the HEPA filter and the electrostatic electret filter membrane are laminated and compounded by hot melt adhesive to form a composite filter membrane with a total thickness of ≤1.5mm.

2. The inverter box heat dissipation device that is easy to maintain as claimed in claim 1, characterized in that: A piezoelectric ceramic transducer is fixed on the inner side of the guide fin by epoxy resin bonding, and grooves are formed on the surface of the piezoelectric ceramic transducer to form a sound wave focusing array.

3. The inverter box heat dissipation device that is easy to maintain as claimed in claim 2, characterized in that: The outer surface of the guide fin is coated with a VTRP electret coating, which is treated with a 40kHz high-frequency polarization to form a gradient charge field from +500V / μm at the inlet to -500V / μm at the outlet.

4. The inverter box heat dissipation device that is easy to maintain as claimed in claim 1, characterized in that: There are 4 groups of cooling fans on the inner wall of the box frame, and a guide baffle is arranged directly below the cooling fan. The guide baffle is inclined at an angle of 25° from left to right relative to the horizontal plane. The front end height is 25mm and the rear end height is 15mm, forming a downward inclined airflow guide structure.

5. The inverter box heat dissipation device that is easy to maintain as claimed in claim 4, characterized in that: A transmission module is integrated in the box frame, and the transmission module includes a dust sensor, a temperature and humidity sensor and a main controller.

6. The inverter box heat dissipation device that is easy to maintain as claimed in claim 1, characterized in that: The cross section of the slide rail is an isosceles trapezoid, made of POM material injection molding and plated with hard chrome.

7. The inverter box heat dissipation device that is easy to maintain as claimed in claim 1, characterized in that: The thermal conductive substrate is made of copper-aluminum composite plate.

8. The inverter box heat dissipation device that is easy to maintain as claimed in claim 5, characterized in that: Two of the cooling fans are located in the middle of the chassis frame, and the other two fans are located on both sides of the central cooling fan, forming a 15° angle with the ends of the central cooling fan blades.

9. The inverter box heat dissipation device that is easy to maintain as claimed in claim 8, characterized in that: A micro axial-flow fan is embedded inside the guide baffle, forming a dual cooling structure with four sets of cooling fans.

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