A wafer inspection device for semiconductor production

Abstract

The present invention discloses a wafer detection device for semiconductor production, which relates to the technical field of wafer production detection. It includes a transfer component for transferring semi-finished wafers. The transfer component drives the transfer of wafers and automatically classifies the wafers when defective products appear. A front detection component is arranged on the side of the transfer component. The front detection component detects the wafers through an optical system and automatically cleans the optical system. The front detection component timely detects the defects of the wafers, avoiding the continuous processing of wafers with defects and causing greater losses. A back detection component for analyzing the metallization of the back of the wafer is arranged at the lower end of the front detection component. A detection head is arranged on the back detection component and can be adjusted at multiple angles. The present invention detects both the upper and lower surfaces of the wafer simultaneously and improves the detection accuracy of the wafer at the same time.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer production detection, and particularly relates to a wafer detection device for semiconductor production. Background Art

[0002] The detection of wafers during the production process is crucial. Its core lies in ensuring product quality, improving the yield rate, and optimizing the process. By real-time monitoring of microscopic defects such as line width deviation and particle contamination in key processes such as lithography, etching, and deposition, the detection technology can intercept defective products from flowing into subsequent processes, avoiding waste of resources and sharp increase in costs. At the same time, the detection data can be accurately fed back to process control to optimize parameter settings and improve the process stability. In advanced processes, the early identification of nanoscale defects is the core to ensure the performance and reliability of chips. The detection sensitivity needs to reach the sub-micron level, so as to support the high-precision manufacturing requirements of the semiconductor industry, reduce the overall production cost, and accelerate the product listing cycle. Summary of the Invention

[0003] In view of the above technical problems, the present invention discloses a wafer detection device for semiconductor production.

[0004] The technical solution adopted by the present invention to solve the above technical problems is as follows: A wafer detection device for semiconductor production includes a transfer component. The transfer component includes a detachable recovery rack and a placement rack. The recovery rack is used to place wafers with defects, and the placement rack is used to place wafers under processing. A pick-up mechanism for transferring wafers is provided on the outer shell. A front detection component is provided inside the transfer component. The front detection component includes camera one and camera two, as well as a locking frame, a locking plate, and a cleaning frame one that are slidably installed on the outer shell. The support plate drives the wafer to move. There is an opening at the lower end of the support plate. Camera one is provided on detection frame one, and camera two is provided on detection frame two. A swing block is also rotatably provided on the outer shell. A group of limiting blocks two are slidably provided at both ends of the swing block. One group of limiting blocks two is rotatably connected to the locking plate, and the other group of limiting blocks two is rotatably connected to the locking frame. Two groups of limiting plates are slidably provided inside the locking frame. The cleaning frame one is in contact with the locking plate. A back detection component is provided at the lower end of the front detection component. The back detection component includes a mounting disk slidably installed on the outer shell. An adjusting mechanism and a detection head are provided on the mounting disk.

[0005] Further, the pick-up mechanism includes an adjusting plate one slidably installed inside the outer shell. An adjusting column one is slidably provided on the adjusting plate one. A pick-up and placement plate one is rotatably provided at the lower end of the adjusting column one. A pick-up and placement plate two is slidably provided on the pick-up and placement plate one.

[0006] Further, an adjusting disc one is slidably arranged on the support plate, a placing disc is rotatably arranged on the adjusting disc one, multiple adsorption blocks are arranged on the placing disc, and openings are arranged at the lower ends of the placing disc and the adjusting disc one.

[0007] Further, a cleaning ring and a cleaning plate are slidably arranged on the cleaning frame one, a wiping disc is slidably arranged in the cleaning ring, and a blowing frame is slidably arranged on the side of the cleaning ring.

[0008] Further, a mounting block is rotatably arranged on the cleaning plate, and multiple blowing heads are arranged on the mounting block.

[0009] Further, a torsion spring is arranged at the position of the rotating shaft of the swinging block and the housing, and an electromagnet block is arranged on the limiting plate.

[0010] Further, the adjusting mechanism includes a support disc slidably mounted on the mounting disc, an adjusting disc two is slidably arranged on the support disc, a mounting column is rotatably arranged on the support disc, a limiting ball is rotatably arranged in the mounting column, the limiting ball slides in the limiting groove, and a detection head is arranged at the other end of the limiting ball.

[0011] Further, a cleaning frame two is slidably arranged on the side of the adjusting disc two, and multiple air blowing openings are arranged on the cleaning frame two.

[0012] Advantages compared with the prior art: The transfer component provided by the present invention automatically transfers the wafers in production, and will recycle the wafers with defects, and ensure the stability of the wafers during the movement. The front detection component provided by the present invention detects the wafers through an optical system, improves the detection accuracy of the wafers, and the front detection component automatically cleans the camera one and the camera two, improves the cleanliness of the camera one and the camera two, and fixes the position of the detection component on the back of the limiting block two while detecting the camera one and the camera two, avoiding the deviation of the wafers during the wiping process of the camera one and the camera two, improving the detection coherence and the accuracy of the wafer position. The back detection component provided by the present invention detects the metallization condition of the back of the limiting ball through an infrared camera, and by changing the angle of the detection head, enhances the shadow effect of the surface microstructure and magnifies the visibility of the defects through the gray scale difference. Description of the Drawings

[0013] Figure 1 It is the right view of the overall structure of the present invention.

[0014] Figure 2 For the present invention Figure 1 The sectional view of the structure in the A-A direction.

[0015] Figure 3Schematic diagram of the transfer component structure of the present invention.

[0016] Figure 4 Schematic diagram of the first adjusting plate structure of the present invention.

[0017] Figure 5 Right view of the front detection component structure of the present invention.

[0018] Figure 6 Schematic diagram of the front detection component structure of the present invention.

[0019] Figure 7 Schematic diagram of the cleaning rack structure of the present invention.

[0020] Figure 8 Schematic diagram of the back detection component structure of the present invention.

[0021] Figure 9 Partial structure schematic diagram of the back detection component of the present invention.

[0022] Figure 10 Cross-sectional view of the back detection component structure of the present invention.

[0023] Reference numerals: 1 - transfer component; 2 - front detection component; 3 - back detection component; 101 - outer shell; 102 - baffle; 103 - ventilation port; 104 - recovery rack; 105 - placement rack; 106 - mounting rack; 107 - first adjusting column; 108 - first adjusting plate; 109 - picking and placing plate one; 110 - picking and placing plate two; 201 - first detection rack; 202 - second detection rack; 203 - support plate; 204 - first adjusting disk; 205 - placement disk; 206 - wafer; 207 - locking rack; 208 - swinging block; 209 - first limiting block; 210 - second limiting block; 211 - locking plate; 212 - first cleaning rack; 213 - first camera; 214 - second camera; 215 - adsorption block; 216 - cleaning ring; 217 - cleaning plate; 218 - limiting plate; 219 - wiping disk; 220 - blowing rack; 221 - mounting block; 222 - blowing head; 223 - limiting rod; 301 - mounting disk; 302 - support disk; 303 - second adjusting disk; 304 - limiting groove; 305 - mounting column; 306 - limiting ball; 307 - detection head; 308 - second cleaning rack; 309 - air outlet. Detailed implementation manners

[0024] Reference Figures 1 to 10A wafer detection device for semiconductor production as shown, includes a transfer component 1 for placing the wafer 206. The transfer component 1 can drive the wafer 206 to move and place the wafer 206 at the working position. A front detection component 2 for detecting the wafer is arranged on the side of the transfer component 1. The front detection component 2 detects the wafer 206 through an optical detection system, and drives the wafer 206 to move while detecting to improve the detection range and efficiency of the wafer 206. The front detection component 2 can automatically clean the optical system, and fix the position of the support plate 203 while cleaning, to avoid being unable to accurately locate the detection position of the wafer 206 after cleaning. A back detection component 3 for detecting the back of the wafer 206 is arranged at the lower end of the front detection component 2. The back detection component 3 is provided with a detection head 307 with adjustable angles to improve the detection accuracy of the back of the wafer 206.

[0025] The transfer component 1 includes a housing 101. A set of baffles 102 are slidably arranged on both sides of the housing 101. The baffles 102 enclose the inside of the housing 101. A set of recovery racks 104 and placement racks 105 are detachably arranged inside the housing 101. The two sets of baffles 102 are respectively aligned with the recovery rack 104 and the placement rack 105. The placement rack 105 places the wafers 206 being processed. The recovery rack 104 is used to place the wafers with defects after detection. Two ventilation openings 103 are arranged at the upper end of the housing 101. An installation rack 106 is arranged inside the housing 101. An adjusting plate 108 is slidably arranged on the installation rack 106. An adjusting column 107 is slidably arranged on the adjusting plate 108. A pick-and-place plate 109 is rotatably arranged inside the adjusting column 107. A pick-and-place plate 110 is slidably arranged on the pick-and-place plate 109. A vacuum suction head is arranged on the pick-and-place plate 110. The pick-and-place plate 110 fixes the wafer 206 through vacuum suction to prevent the wafer 206 from falling during movement. After placing the recovery rack 104 and the placement rack 105 inside the housing 101, drive the adjusting plate 108 to slide on the installation rack 106, adjust the position of the adjusting column 107 according to the height of the wafer to be taken. Drive the adjusting column 107 to slide on the adjusting plate 108. The adjusting column 107 drives the pick-and-place plate 109 to move. After the pick-and-place plate 109 and the pick-and-place plate 110 are aligned with the height of the wafer to be taken, drive the pick-and-place plate 110 to slide on the pick-and-place plate 109. The pick-and-place plate 110 inserts into the bottom of the wafer 206. Start the vacuum suction head on the pick-and-place plate 110 to complete the fixation of the pick-and-place plate 110 and the wafer 206, to prevent the wafer 206 from falling during the movement of the pick-and-place plate 110. Drive the pick-and-place plate 110 to reset. Drive the pick-and-place plate 109 to rotate on the adjusting column 107. The pick-and-place plate 109 drives the pick-and-place plate 110 to rotate. The pick-and-place plate 110 drives the wafer 206 to move and place the wafer 206 at the working position.

[0026] The front detection component 2 includes a support plate 203 slidably mounted on the housing 101. An adjustment disk 204 is slidably arranged on the support plate 203. A placement disk 205 is rotatably arranged on the adjustment disk 204. Multiple groups of adsorption blocks 215 are arranged on the placement disk 205. Openings are provided at the lower ends of the support plate 203, the adjustment disk 204, and the placement disk 205. After placing the wafer 206 on the placement disk 205, start the adsorption blocks 215, and the adsorption blocks 215 adsorb the wafer 206 to complete the fixation of the placement disk 205 and the wafer 206. The moving direction of the support plate 203 on the housing 101 is perpendicular to the moving direction of the adjustment disk 204 on the support plate 203. Drive the support plate 203 to approach the second pick-and-place plate 110. The second pick-and-place plate 110 places the wafer 206 on the placement disk 205. Start the adsorption blocks 215 to work, and the adsorption blocks 215 adsorb the wafer 206. Drive the support plate 203 to reset. The support plate 203 drives the wafer 206 to reach below the first camera 213 and the second camera 214. Drive the support plate 203 and the adjustment disk 204 to move to complete the adjustment of the position of the wafer 206, ensuring the detection range of the first camera 213 and the second camera 214 for the wafer 206 and avoiding missing positions. A first cleaning frame 212 is slidably arranged in the housing 101. A cleaning plate 217 is slidably arranged on one side of the first cleaning frame 212. A mounting block 221 is rotatably arranged on the cleaning plate 217. Multiple groups of air nozzles 222 are arranged on the mounting block 221. Drive the cleaning plate 217 to slide on the first cleaning frame 212. The cleaning plate 217 drives the mounting block 221 to move to below the second camera 214. Drive the mounting block 221 to rotate on the cleaning plate 217. The mounting block 221 drives the air nozzles 222 to rotate. After the air nozzles 222 are aligned with the second camera 214, drive the second detection frame 202 to move. The second detection frame 202 drives the second camera 214 to fit with the first cleaning frame 212, and the air nozzles 222 wipe the second camera 214. A cleaning ring 216 is slidably arranged on the first cleaning frame 212. A wiping disk 219 is slidably arranged inside the cleaning ring 216. A blowing frame 220 is slidably arranged on the side of the cleaning ring 216. The blowing frame 220 blows and cleans the upper end of the first camera 213. The cleaning ring 216 wipes the lower end of the first camera 213. The wiping disk 219 wipes the inside of the first camera 213 to complete the cleaning of the first camera 213. The front detection component 2 further includes a first detection frame 201 and a second detection frame 202 slidably mounted on the housing 101. The second camera 214 is rotatably mounted at the lower end of the second detection frame 202. The first camera 213 is mounted at the lower end of the first detection frame 201. Both the first camera 213 and the second camera 214 detect defects in the production process of the wafer 206 through an optical vision system. Multiple groups of limit rods 223 are arranged at one end of the first cleaning frame 212 close to the locking plate 211. The limit rods 223 are in contact with the locking plate 211, and the first cleaning frame 212 pushes the locking plate 211 to move. The front detection component 2 further includes a locking frame 207 slidably mounted at the bottom of the housing 101.Two groups of limit plates 218 are slidably arranged inside the locking frame 207. Springs are arranged between the two groups of limit plates 218 and the locking frame 207. Electromagnet blocks are arranged on the limit plates 218. A swing block 208 is rotatably arranged on the inner wall of the housing 101. A group of first limit blocks 209 and second limit blocks 210 are respectively slidably arranged at both ends of the swing block 208. The first limit block 209 is rotatably connected to the locking frame 207, and the second limit block 210 is rotatably connected to the locking plate 211. The locking plate 211 is slidably installed inside the housing 101. A torsion spring is arranged at the position of the rotating shaft of the swing block 208 and the housing 101. When the locking plate 211 moves, the locking plate 211 drives the second limit block 210 to move. The second limit block 210 drives the swing block 208 to rotate on the housing 101. When the swing block 208 rotates, it drives the first limit block 209 to rotate. The first limit block 209 drives the locking frame 207 to move. When the locking frame 207 approaches the support plate 203, the support plate 203 is inserted between the two groups of limit plates 218. The two groups of limit plates 218 are pressed against the support plate 203 by the deformation restoring force of the spring. When the electromagnet blocks on the limit plates 218 are started, the limit plates 218 and the support plate 203 are fixed to prevent the support plate 203 from shifting.

[0027] The back detection component 3 includes a mounting disk 301 slidably mounted on the housing 101. A support disk 302 is slidably arranged on the mounting disk 301. An adjusting disk II 303 is slidably arranged on the support disk 302. A limiting groove 304 is arranged inside the adjusting disk II 303. A mounting post 305 is rotatably arranged on the support disk 302. A limiting ball 306 is rotatably arranged on the mounting post 305. The limiting ball 306 slides in the limiting groove 304. The other end of the limiting ball 306 is provided with a detection head 307. The detection head 307 performs metallization analysis on the back of the wafer 206 during processing through infrared rays. A cleaning frame II 308 is slidably arranged on the side of the adjusting disk II 303. Multiple air blowing openings 309 are arranged on the cleaning frame II 308. The air blowing openings 309 blow air to clean the back of the wafer 206, avoiding dust on the back of the wafer 206 from affecting the detection accuracy. When detecting the back of the wafer 206, drive the mounting disk 301 to slide on the housing 101, and the mounting disk 301 drives the back detection component 3 to move. When the back detection component 3 reaches the working position, drive the support disk 302 to slide on the mounting disk 301, and the support disk 302 drives the adjusting disk II 303 and the detection head 307 to approach the wafer 206. When the position of the detection head 307 needs to be adjusted, drive the adjusting disk II 303 to slide on the support disk 302. The adjusting disk II 303 drives the limiting groove 304 to move. The limiting groove 304 drives the limiting ball 306 to rotate along the axis of the limiting ball 306 on the mounting post 305. At the same time, the limiting ball 306 drives the detection head 307 to rotate to adjust the deflection angle of the detection head 307. When the orientation of the detection head 307 needs to be adjusted, drive the mounting post 305 to rotate on the adjusting disk II 303. The mounting post 305 drives the limiting ball 306 to rotate along the axis of the mounting post 305. The limiting ball 306 drives the detection head 307 to rotate to change the orientation of the detection head 307, completing the adjustment of the angle of the detection head 307. The multi-angle incident light combined with infrared reflection spectroscopy analysis can eliminate the measurement errors caused by the surface roughness of the metal on the back of the wafer or the interface reflection, improving the detection accuracy.

[0028] Working principle: During operation, two groups of baffles 102 on the driving housing 101 are opened, and the wafers to be produced are placed on the placement rack 105. Both the recycling rack 104 and the placement rack 105 are placed inside the housing 101. The driving baffle 102 moves to enclose the housing 101 to prevent the detection environment from being contaminated. The driving adjustment plate one 108 slides on the mounting rack 106, and the driving adjustment column one 107 slides on the adjustment plate one 108 to adjust the position of the pick-and-place plate one 109. The driving pick-and-place plate one 109 rotates on the adjustment column one 107 to align the pick-and-place plate one 109 with a group of wafers 206 to be removed. The driving pick-and-place plate two 110 slides on the pick-and-place plate one 109, and the pick-and-place plate two 110 moves to the lower end of the wafer 206. The driving adjustment column one 107 slides on the adjustment plate one 108, and the adjustment column one 107 drives the pick-and-place plate one 109 and the pick-and-place plate two 110 to fit the wafer 206. The vacuum suction head on the pick-and-place plate two 110 is started, and the pick-and-place plate two 110 completes the adsorption of the wafer 206. At this time, the driving support plate 203 and the adjustment disk one 204 move, and the adjustment disk one 204 drives the placement disk 205 to approach the pick-and-place plate two 110. The driving adjustment plate one 108, the adjustment column one 107, and the pick-and-place plate one 109 move, and the pick-and-place plate two 110 places the wafer 206 on the placement disk 205. The adsorption block 215 is started to work, and the adsorption block 215 adsorbs the wafer 206 on the placement disk 205 to complete the fixation of the wafer 206.

[0029] The driving support plate 203 and the adjustment disk one 204 move, the adjustment disk one 204 drives the placement disk 205 to move, the placement disk 205 drives the wafer 206 to move, the driving placement disk 205 rotates, the placement disk 205 drives the wafer 206 to rotate, the position of the wafer 206 is adjusted, and the wafer 206 is driven to reach below the camera one 213 and the camera two 214. The driving detection rack one 201 and the detection rack two 202 move, the detection rack one 201 drives the camera one 213 to approach the wafer 206, the detection rack two 202 drives the camera two 214 to approach the wafer 206, and the wafer 206 is detected. The position of the wafer 206 is changed through the support plate 203, the adjustment disk one 204, and the placement disk 205, and the detection of the surface defects of the wafer 206 is completed through the camera one 213 and the camera two 214. If there are no defects in the detected wafer 206, the driving adjustment plate one 108, the adjustment column one 107, and the pick-and-place plate one 109 move, and the detected wafer 206 is placed on the placement rack 105. If defects are detected on the surface of the wafer 206, the wafer 206 is placed on the recycling rack 104.

[0030] Meanwhile, start the detection head 307 to detect the back of the wafer 206. When the position of the detection head 307 needs to be adjusted, drive the adjustment disk two 303 to slide on the support disk 302. The adjustment disk two 303 drives the limit groove 304 to move. The limit groove 304 drives the limit ball 306 to rotate along the axis of the limit ball 306 on the mounting post 305. At the same time, the limit ball 306 drives the detection head 307 to rotate to adjust the deflection angle of the detection head 307. When the orientation of the detection head 307 needs to be adjusted, drive the mounting post 305 to rotate on the adjustment disk two 303. The mounting post 305 drives the limit ball 306 to rotate along the axis of the mounting post 305. The limit ball 306 drives the detection head 307 to rotate to change the orientation of the detection head 307, completing the adjustment of the angle of the detection head 307, improving the detection accuracy of the back of the wafer. At the same time, drive the cleaning frame two 308 to slide on the adjustment disk two 303. The cleaning frame two 308 drives the air blowing port 309 to move. When the air blowing port 309 is started, the air blowing port 309 cleans the back of the wafer 206.

[0031] During the detection process, when the camera one 213 or the camera two 214 is contaminated, drive the detection frame one 201 and the detection frame two 202 to reset. At the same time, drive the cleaning frame one 212 to slide on the housing 101. The cleaning frame one 212 drives the limit rod 223 to move. The limit rod 223 pushes the locking plate 211 to move. The locking plate 211 drives the limit block two 210 to move. The limit block two 210 drives the swing block 208 to rotate on the housing 101. When the swing block 208 rotates, it drives the limit block one 209 to rotate. The limit block one 209 drives the locking frame 207 to move. When the locking frame 207 approaches the support plate 203, the support plate 203 is inserted between the two sets of limit plates 218. The two sets of limit plates 218 are in close contact with the support plate 203 through the deformation restoring force of the spring. At the same time, when the electromagnet block on the limit plate 218 is started, the limit plate 218 and the support plate 203 are fixed to prevent the support plate 203 from shifting. When the cleaning of the camera one 213 and the camera two 214 is completed, drive the cleaning frame one 212 to reset and turn off the electromagnet block on the limit plate 218. At this time, the support of the cleaning frame one 212 for the locking plate 211 is released. At this time, the swing block 208 drives the locking frame 207 to reset through the deformation restoring force of the torsion spring, releasing the limit on the support plate 203. Drive the support plate 203, the adjustment disk one 204 and the placement disk 205 to move, so that the camera one 213 and the camera two 214 continue to detect the wafer 206.

Claims

1. A wafer inspection device for semiconductor production, comprising a transfer assembly (1), characterized in that: The described transfer component (1) includes a detachable recovery rack (104) and a placement rack (105). The recovery rack (104) is used to place defective wafers (206), and the placement rack (105) is used to place wafers (206) being processed. A pick-up mechanism for transferring the wafers (206) is provided on the outer shell (101). A front detection component (2) is provided inside the transfer component (1). The front detection component (2) includes a first camera (213), a second camera (214), and a support plate (203), a locking frame (207), a locking plate (211), and a first cleaning frame (212) that are slidably mounted on the outer shell (101). The support plate (203) drives the wafer (206) to move, and an opening is provided at the lower end of the support plate (203). A swinging block (208) is also rotatably provided on the outer shell (101). A group of second limiting blocks (210) are slidably provided at both ends of the swinging block (208). One group of second limiting blocks (210) is rotatably connected to the locking plate (211), and the other group of second limiting blocks (210) is rotatably connected to the locking frame (207). Two groups of limiting plates (218) are slidably provided inside the locking frame (207). The first cleaning frame (212) is in contact with the locking plate (211). A back detection component (3) is provided at the lower end of the front detection component (2). The back detection component (3) includes a mounting disk (301) that is slidably mounted on the outer shell (101). An adjusting mechanism and a detection head (307) are provided on the mounting disk (301). A cleaning ring (216) and a cleaning plate (217) are slidably provided on the first cleaning frame (212). A wiping disk (219) is slidably provided inside the cleaning ring (216). A blowing frame (220) is slidably provided on the side of the cleaning ring (216). A mounting block (221) is rotatably provided on the cleaning plate (217). A plurality of blowing heads (222) are provided on the mounting block (221). The adjusting mechanism includes a support disk (302) that is slidably mounted on the mounting disk (301). An adjusting disk two (303) is slidably provided on the support disk (302). A mounting column (305) is rotatably provided on the support disk (302). A limiting ball (306) is rotatably provided inside the mounting column (305). A limiting groove (304) is provided inside the adjusting disk two (303). The limiting ball (306) slides in the limiting groove (304). The other end of the limiting ball (306) is provided with a detection head (307).

2. The wafer inspection device for semiconductor production according to claim 1, characterized in that: The pick-up mechanism includes an adjusting plate one (108) that is slidably mounted inside the outer shell (101). An adjusting column one (107) is slidably provided on the adjusting plate one (108). A pick-up and placing plate one (109) is rotatably provided at the lower end of the adjusting column one (107). A pick-up and placing plate two (110) is slidably provided on the pick-up and placing plate one (109).

3. The wafer inspection device for semiconductor production according to claim 2, wherein: An adjusting disk I (204) is slidably arranged on the described support plate (203), a placing disk (205) is rotatably arranged on the adjusting disk I (204), multiple groups of adsorption blocks (215) are arranged on the placing disk (205), and openings are arranged at the lower ends of both the placing disk (205) and the adjusting disk I (204).

4. A wafer inspection device for semiconductor production according to claim 3, wherein: A torsion spring is arranged at the rotating shaft position of the described swing block (208) and the housing (101), and an electromagnet block is arranged on the limiting plate (218).

5. A wafer inspection device for semiconductor production according to claim 1, characterized in that: A cleaning frame II (308) is slidably arranged on the side of the described adjusting disk II (303), and multiple groups of air blowing ports (309) are arranged on the cleaning frame II (308).

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