Multi-layer vacuum packaging device and packaging method for semiconductor chips

Abstract

The present invention discloses a multi-layer vacuum packaging device and packaging method for semiconductor chips, relating to the technical field of semiconductor chip packaging devices, comprising a packaging machine, wherein a vacuum packaging chamber and a sealed chamber door sealed on the vacuum packaging chamber are provided on the packaging machine, and a vacuum pump is installed on the side of the packaging machine, an exhaust pipe of the vacuum pump passes through the outer wall of the vacuum packaging chamber and extends into the interior of the vacuum packaging chamber, a plurality of stacked packaging racks are arranged inside the vacuum packaging chamber, a supporting rack is slidingly provided inside the packaging rack, and a placement mold and a chip packaging component for placing the chip are provided inside the supporting rack; by arranging the vacuum packaging chamber, the vacuum pump, the packaging rack and the placement mold, the chip is placed for welding work using the packaging rack and the placement mold, and the vacuum pump extracts the vacuum state inside the vacuum packaging chamber to create a low-pressure or no-pressure environment.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip packaging devices, and in particular to a multi-layer vacuum packaging device and a packaging method for semiconductor chips. Background Art

[0002] Semiconductor chips are semiconductor devices that can achieve specific functions, manufactured by etching and wiring semiconductor sheets. Semiconductor packaging refers to the process of processing tested wafers into independent chips according to product model and functional requirements. The packaging process is as follows: the wafers from the front-end wafer process are cut into small chips through a dicing process. The cut chips are then glued to the corresponding islands on the substrate rack. Ultra-fine metal wires or conductive resin are then used to connect the chip's bonding pads to the corresponding pins on the substrate, forming the required circuit. The independent chips are then encapsulated and protected in a plastic shell. A series of operations are required after the plastic encapsulation. After the packaging is completed, the finished product is tested, usually through incoming inspection, testing, and packaging processes, and finally stored and shipped.

[0003] The current semiconductor vacuum packaging devices lack a cooling structure. The surface of the chip after being heated to high temperature is also hot, making it difficult for workers to demold and remove it, which affects efficiency and causes inconvenience in work. The chip needs to be transferred to a gas device for additional cooling. However, during the transfer process, it will come into contact with the air, which can easily cause dust to come into contact with the uncooled chip. The surface temperature of the uncooled chip is high, and impurities and pollutants in the dust can easily adhere to it, forming a contamination layer that is difficult to remove. These pollutants may damage the electrical performance of the chip, causing problems such as short circuits or open circuits. Summary of the Invention

[0004] In order to solve the defects of the prior art, the present invention provides a multi-layer vacuum packaging device and packaging method for semiconductor chips.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0006] The present invention provides a multi-layer vacuum packaging device for semiconductor chips, comprising:

[0007] A packaging machine, wherein the packaging machine is provided with a vacuum packaging cabin and a sealing cabin door sealed on the vacuum packaging cabin;

[0008] A vacuum pump is installed on the side of the packaging machine, and an exhaust pipe of the vacuum pump passes through the outer wall of the vacuum packaging chamber and extends into the interior of the vacuum packaging chamber;

[0009] Multiple stacked packaging racks are arranged inside the vacuum packaging chamber, and a supporting rack is slidably provided inside the packaging rack. A placement mold for placing chips and a chip package are provided inside the supporting rack, and a pusher assembly for helping to quickly remove the chips is provided inside the placement mold;

[0010] A heating cavity and a cooling cavity are respectively provided inside the packaging frame.

[0011] As a preferred technical solution of the present invention, an infrared heating element is provided inside the heating cavity, a heat conducting element is provided on the outer surface of the mold, and a heating channel is provided at a position of the support frame facing the heating cavity.

[0012] As a preferred technical solution of the present invention, the cooling cavity includes a mounting frame fixed to the bottom of the packaging frame, a heat dissipation pipe is coiled inside the mounting frame, the water inlet pipes and drain pipes of multiple heat dissipation pipes all pass through the outside of the vacuum packaging cabin, and are fixed with multi-way water pipes through connecting water pipes, and a condenser is provided on the outside of the packaging machine, a water pump is provided on the condenser, and the water suction pipe of the water pump is installed to the water outlet end of the condenser, the multi-way pipe on one side of the water inlet pipe of the water pump is fixedly connected to the water outlet end of the condenser, and the multi-way pipe on the other side is connected to the water inlet end of the condenser.

[0013] As a preferred technical solution of the present invention, the bottom of the mold is installed with a cooling plate used in conjunction with the cooling cavity.

[0014] As a preferred technical solution of the present invention, the pushing assembly includes a connecting plate that is fitted and slidably arranged in the placing mold, and a push rod is installed on the surface of the connecting plate facing the position in the groove of the placing mold. A connecting rod is fixed on the side of the connecting plate, and the connecting rod is slidably arranged in a strip slide opened on the placing mold, and a wedge block 1 is fixed at the end of the connecting rod, and a wedge block 2 used in conjunction with the wedge block 1 is installed in the vacuum packaging chamber.

[0015] As a preferred technical solution of the present invention, a plurality of electric push rods for pushing the placement mold to move up and down are provided at the bottom of the packaging rack, and the push rods are connected to the placement mold through a buffer assembly.

[0016] As a preferred technical solution of the present invention, the buffer assembly includes a buffer rack fitted with the output end of the push rod, a plurality of springs are fixed on the buffer rack, a sliding guide is fixed to the other end of the spring, and the mold is slidably arranged on the sliding guide.

[0017] As a preferred technical solution of the present invention, a plurality of the springs are each provided with a telescopic rod, and both ends of the telescopic rod are respectively fixedly mounted between the sliding guide frame and the buffer frame.

[0018] As a preferred technical solution of the present invention, a guide rod is fixed in the sliding guide frame, a slider is fixed at the bottom of the supporting bracket, and the slider is slidably arranged on the outer surface of the guide rod.

[0019] The present invention also provides a multi-layer vacuum packaging method for semiconductor chips, comprising the following steps:

[0020] S1. Remove the support bracket, pull out the support bracket and the placement mold, place the chip in the groove inside the placement mold, push the support bracket back into the box, close the sealing door, control the start of the vacuum pump, pump the inside of the vacuum packaging chamber to a vacuum state, and package the mold through the packaging part;

[0021] S2. Control the push rod to open, push the support bracket and the placement mold to the reinforcement cavity, control the infrared heating element to adjust the temperature, heat the placement mold through the heat conduction element, and control the chip packaging element to package the chip;

[0022] During the packaging process, the mold is pressed down by the spring, which acts as a buffer to reduce the pressure on the mold.

[0023] S4. After the packaging is completed, the water pump is controlled to pump the cooling water from the condenser into the heat dissipation pipe. The push rod is controlled downward to make the support frame drive the mold downward so that the cooling fins at the bottom of the mold come into contact with the heat dissipation pipe to achieve heat exchange and cool the mold.

[0024] S5. After the cooling work is completed, the support bracket slides in the sliding guide during the removal process. The wedge block 1 moves until the wedge block 2 is in contact with each other, which will drive the connecting plate to drive multiple ejector pins to move upward synchronously, ejecting the packaged chip and removing the chip.

[0025] The beneficial effects of the present invention are:

[0026] 1. In the present invention, a vacuum packaging chamber, a vacuum pump, a packaging rack and a placement mold are provided, and the packaging rack and the placement mold are used to place the chip for welding. The vacuum pump extracts the vacuum state inside the vacuum packaging chamber to create a low-pressure or no-pressure environment. This environment can effectively prevent the chip from being damaged by pollutants such as dust and moisture in the air during the packaging process, thereby improving the reliability and performance of the chip, avoiding the generation of bubbles inside the material, and ensuring the density and uniformity of the packaging structure.

[0027] 2. In the present invention, by providing a heating cavity and a cooling cavity, heating and cooling operations can be performed directly in the device without waiting for cooling, thereby avoiding contact with dust during the cooling operation of the transfer device, thereby affecting the packaging effect.

[0028] 3. In the present invention, a heating cavity and a cooling cavity are provided, and a connecting plate, a push rod, a connecting rod, a wedge block 1 and a wedge block 2 are provided. When the chip is taken out, the support frame and the placement mold are pulled out, and the wedge block 1 moves until it is in contact with the wedge block 2, which drives the connecting plate to drive multiple push rods to move upward synchronously, ejecting the packaged chip, quickly realizing the chip demolding work, and facilitating the chip removal. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0030] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0031] Figure 2 It is a schematic structural diagram of the overall invention from another angle.

[0032] Figure 3 Schematic diagram of the packaging frame.

[0033] Figure 4 Schematic diagram of the structure for placing the mold.

[0034] Figure 5 A schematic cross-sectional view of the packaging frame.

[0035] Figure 6 This is a structural diagram of the buffer rack.

[0036] Figure 7 A schematic diagram of the structure of the support frame.

[0037] Figure 8 A cross-sectional diagram of the mold placement.

[0038] Figure 9 Schematic diagram of the structure of the ejector rod.

[0039] Figure 10 Schematic diagram of the structure of the heat pipe.

[0040] Figure 11 This is a structural diagram of wedge block 2.

[0041] In the figure: 1. Packaging machine; 2. Vacuum packaging chamber; 3. Vacuum pump; 4. Packaging rack; 5. Mold placement; 6. Support rack; 7. Heating chamber; 8. Infrared heating element; 9. Buffer rack; 10. Telescopic rod; 11. Spring; 12. Push rod; 13. Sliding guide; 14. Guide rod; 15. Slider; 16. Mounting rack; 17. Heat pipe; 18. Cooling plate; 19. Connecting plate; 20. Push rod; 21. Connecting rod; 22. Wedge block 1; 23. Wedge block 2; 24. Connecting water pipe; 25. Multi-way water pipe; 26. Water pump; 27. Sealed cabin door; 28. Condenser. DETAILED DESCRIPTION

[0042] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0043] Example 1

[0044] like Figure 1-Figure 3 As shown, a multi-layer vacuum packaging device for semiconductor chips includes:

[0045] The packaging machine 1 is provided with a vacuum packaging chamber 2 and a sealed chamber door 27 sealed on the vacuum packaging chamber 2. A vacuum pump 3 is installed on the side of the packaging machine 1. The exhaust pipe of the vacuum pump 3 passes through the outer wall of the vacuum packaging chamber 2 and extends into the interior of the vacuum packaging chamber 2. A plurality of stacked packaging racks 4 are arranged inside the vacuum packaging chamber 2. A supporting bracket 6 is slidably provided inside the packaging rack 4. A placement mold 5 for placing chips and chip packaging components are provided inside the supporting bracket 6.

[0046] It should be noted that by setting up a vacuum packaging chamber 2, a vacuum pump 3, a packaging rack 4 and a placement mold 5, the chip is placed for welding using the packaging rack 4 and the placement mold 5. The vacuum pump 3 extracts the vacuum state from the inside of the vacuum packaging chamber 2 to create a low-pressure or no-pressure environment. This environment can effectively prevent the chip from being damaged by pollutants such as dust and moisture in the air during the packaging process, thereby improving the reliability and performance of the chip, avoiding the generation of bubbles inside the material, and ensuring the density and uniformity of the packaging structure.

[0047] like Figure 8 and Figure 9As shown, further, a pusher assembly for helping to quickly remove the chip is provided in the placement mold 5, and the pusher assembly includes a connecting plate 19 that is fitted and slidably arranged in the placement mold 5, and a push rod 20 is installed on the surface of the connecting plate 19 facing the position in the groove of the placement mold 5, and a connecting rod 21 is fixed to the side of the connecting plate 19, and the connecting rod 21 is slidably arranged in a strip slide opened on the placement mold 5, and a wedge block 1 22 is fixed to the end of the connecting rod 21, and a wedge block 23 used in conjunction with the wedge block 1 22 is installed in the vacuum packaging chamber 2;

[0048] It should be noted that by setting the connecting plate 19, the ejector rod 20, the connecting rod 21, the wedge block 1 22 and the wedge block 2 23, when the chip is taken out, the support frame 6 and the placement mold 5 are pulled out, and the wedge block 1 22 moves to fit the wedge block 2 23, which will drive the connecting plate 19 to drive multiple ejector rods 20 upward synchronously to eject the packaged chip, quickly realize the chip demolding work, and facilitate the removal of the chip.

[0049] like Figure 10 and Figure 11 As shown, further, a heating cavity 7 and a cooling cavity are respectively provided inside the packaging frame 4, an infrared heating element 8 is provided inside the heating cavity 7, a heat conducting element is provided on the outer surface where the mold 5 is placed, and a heating channel is provided at the position of the support frame 6 facing the heating cavity 7;

[0050] It should be noted that by providing an infrared heating element and a heat conducting element, and utilizing the cooperation of infrared rays and the heat conducting element, energy can be quickly transferred directly to the heated object, while facilitating temperature control.

[0051] like Figure 2 、 Figure 8 and Figure 9 As shown, further, the cooling cavity includes a mounting frame 16 fixed to the bottom of the packaging frame 4, and a heat dissipation pipe 17 is coiled inside the mounting frame 16. The water inlet pipes and drainage pipes of the multiple heat dissipation pipes 17 all pass through the outside of the vacuum packaging chamber 2 and are fixed with a multi-way water pipe 25 through a connecting water pipe 24. A condenser 28 is provided on the outside of the packaging machine 1, and a water pump 26 is provided on the condenser 28. The water pump pipe of the water pump 26 is installed to the water outlet end of the condenser. The multi-way pipe on one side of the water inlet pipe of the water pump 26 is fixedly connected to the water outlet end of the condenser, and the multi-way pipe on the other side is connected to the water inlet end of the condenser 28. A cooling plate 18 used in conjunction with the cooling cavity is installed at the bottom of the mold 5.

[0052] It should be noted that by setting up a condenser 28, a water pump 26, a multi-way pipe, a heat dissipation pipe 17 and a cooling fin 18, and by sending a high-temperature and high-pressure gaseous refrigerant into the heat dissipation pipe 17 through the multi-way pipe, the heat dissipation pipe 17 cooperates with the cooling fin 18 to evenly cool the placed mold 5 and quickly cool it.

[0053] like Figure 5 As shown, further, a plurality of electric push rods 12 for pushing the placement mold 5 up and down are provided at the bottom of the packaging frame 4, and the push rods 12 are connected to the placement mold 5 through a buffer assembly;

[0054] It should be noted that by setting up an electric push rod 12, the electric push rod 12 can be used to push the placed mold 5 up and down, and the position of the placed mold 5 can be adjusted so that the placed mold 5 is located inside the heating cavity or the cooling cavity, which is convenient for directly heating and cooling the mold without the need to use gas equipment separately, avoiding contact with external dust during the transfer work, and affecting the packaging effect.

[0055] like Figure 6 As shown, further, the buffer assembly includes a buffer frame 9 that is fitted with the output end of the push rod 12, a plurality of springs 11 are fixed on the buffer frame 9, and a sliding guide frame 13 is fixed to the other end of the spring 11, and the mold 5 is placed and slidably set on the sliding guide frame 13;

[0056] It should be noted that by setting the spring 11, during the packaging process, the mold 5 is pressed down by the spring 11, which acts as a buffer for the mold 5 and reduces the pressure on the mold.

[0057] like Figure 6 As shown, further, both ends of the telescopic rod 10 are fixedly mounted between the sliding guide frame 13 and the buffer frame 9;

[0058] It should be noted that, by providing the telescopic rod 10, the telescopic rod 10 is used to limit and guide the spring 11 and the sliding guide frame 13, thereby avoiding the problems of offset and displacement during their operation.

[0059] like Figure 6 and Figure 7 as well as Figure 10 , as shown further, it should be noted that a guide rod 14 is fixed in the sliding guide frame 13, a slider 15 is fixed to the bottom of the support bracket 6, and the slider 15 is slidably arranged on the outer surface of the guide rod 14;

[0060] It should be noted that, by providing the slider 15 and the guide rod 14 , the slider 15 and the guide rod 14 play a role in guiding and limiting the support bracket 6 during the movement of the support bracket 6 , thereby improving the stability of its movement.

[0061] Working process:

[0062] S1. Remove the support bracket 6, pull out the support bracket 6 and the placement mold 5, place the chip in the internal groove of the placement mold 5, and then push the support bracket 6 back into the box. Then close the sealing door, control and start the vacuum pump 3, evacuate the interior of the vacuum packaging chamber 2 to a vacuum state, and package the mold through the packaging part;

[0063] S2. Control the push rod 12 to open, push the support frame 6 and the placement mold 5 to the reinforced cavity, control the infrared heating element 8 to regulate the temperature, heat the placement mold 5 through the heat conductive element, and control the chip packaging element to package the chip;

[0064] S3. During the packaging process, the mold 5 is pressed downward, and the spring 11 acts as a buffer for the mold 5, reducing the pressure on the mold.

[0065] S4. After the packaging is completed, the water pump is controlled to pump the cooling water from the condenser 28 into the heat dissipation pipe 17. The push rod 12 is controlled downward to make the support frame 6 drive the placement mold 5 to move downward, so that the cooling fins 18 at the bottom of the placement mold 5 contact the heat dissipation pipe 17, realizing heat exchange and cooling the placement mold 5.

[0066] S5. After the cooling work is completed, the support bracket 6 slides in the sliding guide during the removal process, and the wedge block 1 22 moves to fit the wedge block 2 23, which will drive the connecting plate 19 to drive multiple ejector pins 20 upward synchronously to eject the packaged chip and remove the chip.

[0067] Finally, it should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or substitute equivalents for some of the technical features. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A multi-layer vacuum packaging device for semiconductor chips, characterized in that: include: A packaging machine (1), wherein a vacuum packaging chamber (2) and a sealing chamber door (27) are provided on the packaging machine (1) and sealed on the vacuum packaging chamber (2); A vacuum pump (3) is installed on the side of the packaging machine (1), and an exhaust pipe of the vacuum pump (3) passes through the outer wall of the vacuum packaging chamber (2) and extends into the interior of the vacuum packaging chamber (2); A plurality of stacked packaging racks (4) are arranged inside a vacuum packaging chamber (2), a supporting rack (6) is slidably provided inside the packaging rack (4), a placement mold (5) for placing chips and a chip packaging component are provided inside the supporting rack (6), and a pushing assembly for helping to quickly remove the chips is provided inside the placement mold (5); The pusher assembly includes a connecting plate (19) that is slidably arranged in the placement mold (5), a push rod (20) is installed on the surface of the connecting plate (19) at a position facing the groove of the placement mold (5), a connecting rod (21) is fixed on the side of the connecting plate (19), the connecting rod (21) is slidably arranged in a strip slideway opened on the placement mold (5), and a wedge block 1 (22) is fixed at the end of the connecting rod (21), and a wedge block 2 (23) used in conjunction with the wedge block 1 (22) is installed in the vacuum packaging chamber (2); A heating cavity (7) and a cooling cavity are respectively provided inside the packaging frame (4); The cooling cavity comprises a mounting frame (16) fixed to the bottom of the packaging frame (4), a heat dissipation pipe (17) is coiled inside the mounting frame (16), the water inlet pipes and the drain pipes of the plurality of heat dissipation pipes (17) all pass through the outside of the vacuum packaging chamber (2), and a multi-way water pipe (25) is fixed via a connecting water pipe (24), and a condenser (28) is provided outside the packaging machine (1), a water pump (26) is provided on the condenser (28), and the water pump (26) is installed to the water outlet end of the condenser (28), the multi-way pipe on one side of the water inlet pipe of the water pump (26) is fixedly connected to the water outlet end of the condenser (28), and the multi-way pipe on the other side is connected to the water inlet end of the condenser (28).

2. A multi-layer vacuum packaging device for semiconductor chips according to claim 1, characterized in that: An infrared heating element (8) is provided inside the heating cavity (7), a heat conducting element is provided on the outer surface of the placement mold (5), and a heating channel is provided at a position of the support frame (6) facing the heating cavity (7).

3. A multi-layer vacuum packaging device for semiconductor chips according to claim 2, characterized in that: The bottom of the placement mold (5) is provided with a cooling plate (18) used in conjunction with the cooling cavity.

4. The multi-layer vacuum packaging device for semiconductor chips according to claim 1, characterized in that: The bottom of the packaging frame (4) is provided with a plurality of electric push rods (12) for pushing the placement mold (5) to move up and down, and the push rods (12) are connected to the placement mold (5) via a buffer assembly.

5. The multi-layer vacuum packaging device for semiconductor chips according to claim 4, characterized in that: The buffer assembly comprises a buffer frame (9) fitted with the output end of the push rod (12), a plurality of springs (11) are fixed on the buffer frame (9), a sliding guide frame (13) is fixed to the other end of the spring (11), and the placement mold (5) is slidably arranged on the sliding guide frame (13).

6. The multi-layer vacuum packaging device for semiconductor chips according to claim 5, characterized in that: A telescopic rod (10) is provided inside each of the plurality of springs (11), and both ends of the telescopic rod (10) are respectively fixedly mounted between the sliding guide frame (13) and the buffer frame (9).

7. The multi-layer vacuum packaging device for semiconductor chips according to claim 6, characterized in that: A guide rod (14) is fixed inside the sliding guide frame (13), a slider (15) is fixed to the bottom of the support frame (6), and the slider (15) is slidably arranged on the outer surface of the guide rod (14).

8. A multi-layer vacuum packaging method for semiconductor chips, applied to the multi-layer vacuum packaging device for semiconductor chips according to any one of claims 1 to 7, characterized in that: The following steps are involved: S1, remove the support bracket (6), pull out the support bracket (6) and the placement mold (5), place the chip in the internal groove of the placement mold (5), and then push the support bracket (6) back into the box body, then close the sealing door, control the start of the vacuum pump (3), evacuate the inside of the vacuum packaging chamber (2) to a vacuum state, and perform packaging work on the mold through the packaging part; S2, control the push rod (12) to open, the push rod (12) pushes the support frame (6) and the placement mold (5) to the reinforced cavity, controls the infrared heating element (8) to adjust the temperature, heats the placement mold (5) through the heat conducting element, and controls the chip packaging element to package the chip; S3. During the packaging process, the placement mold (5) is pressed downward, and the spring (11) acts as a buffer for the placement mold (5), reducing the pressure on the mold; S4. After the packaging is completed, the water pump is controlled to pump the cooling water from the condenser (28) into the heat dissipation pipe (17), and the push rod (12) is controlled to move downward, so that the support frame (6) drives the placement mold (5) to move downward, so that the cooling plate (18) at the bottom of the placement mold (5) contacts the heat dissipation pipe (17), realizing heat exchange and cooling the placement mold (5); S5. After the cooling work is completed, the support frame (6) slides in the sliding guide during the removal process, and the wedge block (22) moves to fit the wedge block (23), which will drive the connecting plate (19) to drive multiple ejector pins (20) upward synchronously, ejecting the packaged chip and removing the chip.

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