Conductive copper film
By adding a hardened layer and a dense layer to the conductive copper film and adding nanoparticles to the surface of the hardened layer, the problem of easy scratches and poor binding force during the production process is solved, which improves hardness and binding force and improves production yield.
Patent Information
- Application Number
- CN202510395334.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-31
- Publication Date
- 2025-07-04
AI Technical Summary
The existing conductive copper films are prone to scratches during the production process, resulting in a degradation of performance, and the bonding strength between the metal copper layer and the PET substrate is poor and easy to fall off.
A hardened layer is added to the conductive copper film, and a tight layer is provided between the hardened layer and the copper layer. At the same time, nanoparticles are added to the surface of the hardened layer, so that some nanoparticles are protruded to enhance binding force.
The hardness of the conductive copper film and the bonding force between the copper layer and the hardened layer are improved, the fall off of the metal copper layer is reduced, and the product production yield is improved.
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Figure CN120261022A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of conductive films, and particularly relates to a conductive copper film. Background Art
[0002] A conductive film is usually laminated on a touch screen or a display screen. The conductive copper film is one of the conductive films. In the existing conductive copper film, there is no hardening layer between the metal copper layer and the PET substrate, so the combination of the metal copper layer and the PET substrate is very good. However, due to the absence of the hardening layer, the metal copper layer is prone to scratches during the production process, resulting in damaged product performance and decreased yield. If a hardening layer is added between the metal copper layer and the PET substrate of the conductive copper film, although the scratches generated by the metal copper layer during the production process can be greatly reduced, ensuring product performance and production yield, due to the poor bonding force between the metal copper layer and the hardening layer, the phenomenon of metal copper layer peeling may occur, especially after the ring test.
[0003] The information disclosed in this background art section is only intended to enhance the overall understanding of the present invention and should not be regarded as an admission or any form of suggestion that this information constitutes prior art already known to those of ordinary skill in the art. Summary of the Invention
[0004] The purpose of the present invention is to provide a conductive copper film, which can enhance the hardness of the conductive copper film and at the same time improve the bonding force between the copper layer and the hardening layer.
[0005] To achieve the above purpose, the technical solution provided by a specific embodiment of the present invention is as follows: A conductive copper film includes a substrate, and a functional layer is provided on at least one surface of the substrate. The functional layer includes a hardening layer, an adhesion layer, and a copper layer that are sequentially laminated on the substrate. The hardening layer includes nanoparticles, and a part of the nanoparticles protrudes from the surface of the hardening layer facing the adhesion layer.
[0006] In one or more embodiments of the present invention, the substrate has two opposite surfaces, and one of the functional layers is provided on each of the two surfaces.
[0007] In one or more embodiments of the present invention, the average particle size of the nanoparticles is less than or equal to 1000 nm.
[0008] In one or more embodiments of the present invention, the ratio of the height h of the nanoparticles protruding from the surface of the hardening layer to the average particle size d of the nanoparticles is 0.1 - 0.7.
[0009] In one or more embodiments of the present invention, the nanoparticles include at least one of inorganic particles and organic particles;
[0010] The inorganic particles include at least one of silica particles, alumina particles, titanium oxide particles, tin oxide particles, zirconium oxide particles, aluminum sulfate particles, magnesium sulfate particles, calcium carbonate particles, and magnesium carbonate particles;
[0011] The organic particles include at least one of spherical silicone resin particles, acrylic resin particles, and hard plastic particles.
[0012] In one or more embodiments of the present invention, the adhesion layer is made of an adhesion material, and the adhesion material is silicon, an oxide of silicon, a metal, or a metal oxide.
[0013] In one or more embodiments of the present invention, when the adhesion material is silicon or a metal, the thickness of the adhesion layer is less than or equal to 10 nm; when the adhesion material is an oxide of silicon or a metal oxide, the thickness of the adhesion layer is less than or equal to 50 nm.
[0014] In one or more embodiments of the present invention, the nanoparticles are inorganic particles, and the inorganic particles are inorganic oxide particles; in the same functional layer, the raw material of the inorganic particles in the hardening layer is the same as the adhesion material of the adhesion layer, or the raw material of the inorganic particles in the hardening layer is an oxide of the adhesion material of the adhesion layer, or the raw material of the inorganic particles in the hardening layer and the adhesion material of the adhesion layer are homologous oxides.
[0015] In one or more embodiments of the present invention, the hardening layer is made of a hardening agent and nanoparticles, and the raw material components of the hardening agent include an adhesive resin, a photoinitiator, and a leveling agent.
[0016] In one or more embodiments of the present invention, a bottom blackening layer is provided between the adhesion layer and the copper layer, and a top blackening layer is provided on the side of the copper layer facing away from the adhesion layer.
[0017] Compared with the prior art, the conductive copper film of the present invention increases the hardness of the entire conductive copper film by adding a hardening layer between the copper layer and the substrate. Additionally, by adding an adhesion layer between the hardening layer and the copper layer and adding nanoparticles to the hardening layer, and making some of the nanoparticles protrude from the surface of the hardening layer to cooperate with the adhesion layer, the bonding force between the hardening layer and the copper layer is increased. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0019] Figure 1 Schematic structural diagram of a conductive copper film in an example of the present invention;
[0020] Figure 2 Schematic structural diagram of a conductive copper film in an example of the present invention;
[0021] Figure 3 Schematic structural diagram of a functional layer in an example of the present invention.
[0022] Description of main reference numerals:
[0023] 1, substrate; 2, functional layer; 21, hardening layer; 211, nanoparticles; 22, adhesion layer; 23, copper layer; 24, bottom blackening layer; 25, top blackening layer. Detailed implementation manners
[0024] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0025] As Figures 1 to 3 shown, the conductive copper film of the present invention includes a substrate 1, and a functional layer 2 is provided on at least one surface of the substrate 1. The functional layer 2 includes a hardening layer 21, an adhesion layer 22, and a copper layer 23 that are sequentially stacked on the substrate 1. The hardening layer 21 includes nanoparticles 211, and a part of the nanoparticles 211 protrudes from the surface of the hardening layer 21 facing the adhesion layer 22.
[0026] By adding the hardening layer 21 between the copper layer 23 and the substrate 1, the hardness of the entire conductive copper film is increased. In addition, by adding the adhesion layer 22 between the hardening layer 21 and the copper layer 23 and adding the nanoparticles 211 to the hardening layer 21, and making a part of the nanoparticles 211 protrude from the surface of the hardening layer 21 to play a supporting and "riveting" role, the protruding nanoparticles 211 cooperate with the adhesion layer 22 to increase the bonding force between the hardening layer 21 and the copper layer 23.
[0027] It can be understood that a part of the nanoparticles 211 protruding from the hardening layer 21 means that the hardening layer 21 contains a number of nanoparticles 211, and a part of the nanoparticles 211 located on the surface of the hardening layer 21 protrudes from the hardening layer 21.
[0028] As Figure 2 shown in the example, the substrate 1 has two opposite surfaces, and a functional layer 2 is provided on each of the two surfaces. As Figure 1In the illustrated example, a functional layer 2 is provided only on one surface of the substrate 1.
[0029] Specifically, the substrate 1 can be a common PET substrate 1 on the market. The copper layer 23 is a copper single element layer.
[0030] Specifically, the average particle size of the nanoparticles 211 is less than or equal to 1000 nm; preferably, the average particle size of the nanoparticles 211 is less than or equal to 200 nm; most preferably, the average particle size of the nanoparticles 211 is less than or equal to 50 - 100 nm. If the average particle size of the nanoparticles 211 is too large, it will not only affect the light transmittance and visibility, but also lead to a decrease in the adhesion between the hardening layer 21 and the adhesion layer 22. The average particle size of the nanoparticles 211 can be measured by dynamic light scattering method, laser diffraction method, electron microscopy method or atomic force microscopy method.
[0031] Furthermore, the height by which the nanoparticles 211 protrude from the surfaces of the first hardening layer 21 and the second hardening layer 21 is h, the average particle size of the nanoparticles 211 is d, and the ratio of the height h to the average particle size d is 0.1 - 0.7. Preferably, the ratio of the height h to the average particle size d is 0.1 - 0.4; most preferably, the ratio of the height h to the average particle size d is 0.1 - 0.3.
[0032] Among them, if the ratio of the height h to the average particle size d is greater than 0.7, the nanoparticles 211 are likely to peel off from the hardening layer 21, and the bonding force between the hardening layer 21 and the adhesion layer 22 will decrease; if the ratio of the height h to the average particle size d is less than 0.1, the adhesion effect between the hardening layer 21 and the adhesion layer 22 cannot be achieved.
[0033] There are many processes to make the nanoparticles 211 partially protrude from the hardening layer 21. For example, during the process of adding the nanoparticles 211 to the raw material of the hardening layer 21, the sedimentation of the nanoparticles 211 can be controlled by coating means, so that some of the nanoparticles 211 protrude from the surface of the hardening layer 21. It is also possible to normally add the nanoparticles 211 to the raw material of the hardening layer 21 (at this time, almost all the nanoparticles 211 are inside the hardening layer 21), and then perform an etching process on the surface of the hardening layer 21 to make the nanoparticles 211 protrude from the surface of the hardening layer 21. The etching process can be plasma Plusma treatment, ion etching, corona treatment, UV light etching, and chemical treatment such as alkali washing, acid washing, etc.
[0034] Specifically, the adhesion layer 22 is made of an adhesion material, and the adhesion materials are all silicon, silicon oxides, metals or metal oxides. For example, the adhesion materials are Si and metals such as Al, Ti, Sn, Zr, etc., and the corresponding oxides are SiOx, Al2Ox, TiOx, SnOx, ZrOx, etc.
[0035] The silicon oxide may be SiO2 or oxygen-deficient silicon oxide, namely SiOx, where 0<x<2. Similarly, the metal oxide may be aluminum oxide, for example, which is represented by Al2Ox, where 0<x≤3.
[0036] The thickness of the adhesion layer 22 needs to be considered from the perspective of adhesion and light transmittance, that is, when the adhesion material is silicon or metal, the thickness of the adhesion layer 22 is less than or equal to 10nm; preferably, the thickness of the adhesion layer 22 is 0.1-5nm; most preferably, the thickness of the adhesion layer 22 is 0.1-2nm; when the adhesion material is silicon oxide or metal oxide, the thickness of the adhesion layer 22 is less than or equal to 50nm; preferably, the thickness of the adhesion layer 22 is 1-10nm; most preferably, the thickness of the adhesion layer 22 is 1-5nm.
[0037] Specifically, the nanoparticles 211 include at least one of inorganic particles and organic particles; the inorganic particles include at least one of silica particles, aluminum oxide particles, titanium oxide particles, tin oxide particles, zirconium oxide particles, aluminum sulfate particles, magnesium sulfate particles, calcium carbonate particles and magnesium carbonate particles; the organic particles include at least one of spherical silicone resin particles, acrylic resin particles and hard plastic particles.
[0038] Preferably, the inorganic particles are inorganic oxide particles, and more preferably, the inorganic particles are silicon dioxide particles or aluminum oxide (Al2O3) particles.
[0039] Preferably, the organic particles are PMMA (polymethyl methacrylate) particles.
[0040] Most preferably, the nanoparticles 211 are silica particles.
[0041] When the nanoparticles 211 are inorganic oxide particles, in the same functional layer 2, the raw material of the inorganic particles in the hardening layer 21 is the same as the adhesion material of the adhesion layer 22, or the raw material of the inorganic particles in the hardening layer 21 is the oxide of the adhesion material of the adhesion layer 22, or the raw material of the inorganic particles in the hardening layer 21 and the adhesion material of the adhesion layer 22 are the same oxides.
[0042] It should be noted that the homologous oxide of the present invention refers to an oxide with the same atomic composition ratio of the constituent elements but different atomic composition ratios. For example, when the nanoparticle 211 is a silicon dioxide particle, the adhesion material can be a silicon single substance, silicon dioxide, or underoxygenated silicon oxide, that is, SiOx, 0<x<2. Among them, underoxygenated silicon oxide and silicon dioxide are homologous oxides to each other. Such a choice is conducive to better affinity between the nanoparticle 211 and the adhesion layer 22, so that the hardening layer 21 and the adhesion layer have better adhesion.
[0043] The hardened layer 21 is prepared from a hardener and nanoparticles 211. The raw material components of the hardener include an adhesive resin, a photoinitiator, and a leveling agent.
[0044] Among them, the adhesive resin may include at least one of UV-curable resins, thermosetting resins, and thermoplastic resins.
[0045] Specifically, the UV-curable resins include epoxy acrylate, polyurethane acrylate resin, polyester acrylate resin, amino acrylate resin, photoimageable alkali-soluble resin, etc. The thermosetting resins include phenolic resin, epoxy resin, polyimide resin, unsaturated polyester resin, etc. The thermoplastic resins include polyethylene resin, polypropylene resin, polyvinyl chloride resin, polystyrene resin, silicone resin, etc.
[0046] The photoinitiator and the leveling agent can be common photoinitiators and leveling agents on the market. Among them, for example, radical photoinitiators are recommended for the photoinitiator, such as 1173 (2-hydroxy-2-methyl-1-phenylpropanone), 184 (1-hydroxycyclohexyl phenyl ketone) cleavage photoinitiators, and BP (benzophenone) hydrogen abstraction photoinitiators. The leveling agent can be at least one of BYK 333 polyether-modified silicone, BYK358N polyacrylate, BYK3550 silicone-modified acrylate leveling agent, Efka 3750 polyacrylate, Efka 3777 and other fluorocarbon-modified polymer leveling agents.
[0047] It can be understood that the hardener can also be a common hardener used as a raw material for the hardened layer on the market.
[0048] Such as Figure 3 In the example shown, in the same functional layer 2, a bottom blackening layer 24 is provided between the adhesion layer 22 and the copper layer 23, and a top blackening layer 25 is provided on the side of the copper layer 23 facing away from the adhesion layer 22.
[0049] The materials of the bottom blackening layer 24 and the top blackening layer 25 can both be at least one of copper oxide and copper nitride. The functions of the bottom blackening layer 24 and the top blackening layer 25 are to reduce the reflectivity of the copper film. After etching the circuit, the reflectivity difference between the circuit area and the non-circuit area can be reduced, thereby reducing the circuit visualization effect.
[0050] The blackening layer can be prepared by vacuum sputtering. It can directly be that a copper target is introduced with argon, oxygen, and nitrogen for reactive sputtering to obtain a copper nitride layer 23, a copper oxide layer 23, or a mixed layer of copper nitride and copper oxide, which is the blackening layer. It can also directly use a copper nitride, copper oxide target or a mixed target for sputtering to obtain the blackening layer. Considering the economic cost, it is preferably the method of using a copper target to introduce reactive gas for sputtering to obtain the blackening layer. The preparation methods of the bottom blackening layer 24 and the top blackening layer 25 can be the same or different.
[0051] The conductive copper film of the present invention will be introduced in detail below in combination with specific examples and comparative examples.
[0052] Example 1
[0053] A 50-μm-thick PET substrate was used, and a hardener was coated on both opposite sides. The main body of the hardener was Dow acrylate resin 7657, the solid content of the acrylate resin was 25%, a photoinitiator 1173 (1% of the mass of the acrylate resin) and a leveling agent BYK358N (0.2% of the mass of the acrylate resin) were added, and at the same time, SiO2 particles (IPA-ST-L silica sol particles from Nissan Chemical Industries, Ltd. of Japan, with a solid content ratio of 30% and a particle size of about 50 nm) were added. Then, UV light curing (1500 MJ energy) and thermal curing (120 °C * 3 min) were carried out to form a 3-μm hardening layer. The surface of the hardening layer was treated with Plusma to make the SiO2 particles protrude from the surface of the hardening layer. The coatings on both sides were the same.
[0054] By means of vacuum coating, a 1-nm adhesion layer (Si) was deposited on both sides of the hardening layer, and then a bottom blackening layer, a copper layer, and a top blackening layer were sequentially deposited on the adhesion layer. The thickness of the copper layer was 450 nm, and the thicknesses of both the bottom blackening layer and the top blackening layer were 30 nm. The sample preparation was completed, and the coatings on both sides were the same, obtaining the structure as Figure 2 shown.
[0055] Example 2
[0056] A 50-μm-thick PET substrate was used, and a hardener was coated on one side. The main body of the hardener was Dow acrylate resin 7657, the solid content of the acrylate resin was 25%, a photoinitiator 184 (1% of the mass of the acrylate resin) and a leveling agent Efka3750 (0.2% of the mass of the acrylate resin) were added, and at the same time, Al2O3 particles (UVH-D-AL dispersion particles from Halima of Japan, with a solid content ratio of 30% and a particle size of about 60 nm) were added. Then, UV light curing (1500 MJ energy) and thermal curing (120 °C * 3 min) were carried out to form a 3-μm hardening layer. The surface of the hardening layer was treated with Plusma to make the SiO2 particles protrude from the surface of the hardening layer.
[0057] By means of vacuum coating, a 1-nm adhesion layer (Al) was deposited on the hardening layer, and then a bottom blackening layer, a copper layer, and a top blackening layer were sequentially deposited on the adhesion layer. The thickness of the copper layer was 400 nm, and the thicknesses of both the bottom blackening layer and the top blackening layer were 20 nm. The sample preparation was completed, obtaining the structure as Figure 1 shown.
[0058] Comparative Example 1
[0059] Use a 50-μm-thick PET substrate, apply a hardener on both sides. The main body of the hardener is Dow acrylate resin 7657, the solid content of the acrylate resin is 25%, add photoinitiator 1173 (1% of the mass of the acrylate resin) and leveling agent BYK358N (0.2% of the mass of the acrylate resin) into it, then carry out UV light curing (1500 MJ energy) and thermal curing (120 °C * 3 min) to form a 3-μm-thick hardening layer. Then, successively deposit an underlying blackening layer, a copper layer, and an overlying blackening layer on the hardener. The thickness of the copper layer is 450 nm, and the thicknesses of both the underlying blackening layer and the overlying blackening layer are 30 nm, and the sample preparation is completed. The coatings and deposits on both sides are consistent.
[0060] Comparative Example 2
[0061] Use a 50-μm-thick PET substrate, apply a hardener on it. The main body of the hardener is Dow acrylate resin 7657, the solid content of the acrylate resin is 25%, add a photoinitiator (1% of the mass of the acrylate resin) and leveling agent BYK358N (0.2% of the mass of the acrylate resin) into it, then carry out UV light curing (1500 MJ energy) and thermal curing (120 °C * 3 min) to form a 3-μm-thick hardening layer. Then, successively deposit an underlying blackening layer thickness and an overlying blackening layer on the hardening layer. The thickness of the copper layer is 400 nm, and the thicknesses of both the underlying blackening layer and the overlying blackening layer are 20 nm, and the sample preparation is completed.
[0062] Comparative Example 3
[0063] Use a 50-μm-thick PET substrate, apply a hardener on it. The main body of the hardener is Dow acrylate resin 7657, the solid content of the acrylate resin is 25%, add photoinitiator 184 (1% of the mass of the acrylate resin) and leveling agent BYK358N (0.2% of the mass of the acrylate resin) into it. Then carry out UV light curing (1500 MJ energy) and thermal curing (120 °C * 3 min) to form a 3-μm-thick hardening layer.
[0064] By means of vacuum coating, deposit a 1-nm adhesion layer (Si) on the hardening layer, and then successively deposit an underlying blackening layer thickness and an overlying blackening layer on the adhesion layer. The thickness of the copper layer is 450 nm, and the thicknesses of both the underlying blackening layer and the overlying blackening layer are 30 nm, and the sample preparation is completed.
[0065] Comparative Example 4
[0066] Use a 50-μm-thick PET substrate, apply a hardener on it. The main body of the hardener is Dow acrylate resin 7657, the solid content of the acrylate resin is 25%, add a photoinitiator (1% of the mass of the acrylate resin) and a leveling agent (0.2% of the mass of the acrylate resin), and at the same time add SiO2 particles (use IPA-ST-L silica sol particles of Nissan Chemical of Japan, with a solid content ratio of 30% and a particle size of about 50 nm). Then carry out UV light curing (1500 MJ energy) and thermal curing (120 °C * 3 min) to form a 3-μm hardening layer. Use Plusma to treat the surface of the hardening layer to make the SiO2 particles protrude from the surface of the hardening layer.
[0067] Then, deposit a bottom blackening layer and a top blackening layer on the hardening layer in sequence. The thickness of the copper layer is 450 nm, and the thicknesses of both the bottom blackening layer and the top blackening layer are 30 nm, and the sample preparation is completed.
[0068] It should be noted that the blackening layers in the above-mentioned examples and comparative examples are all prepared by the method of sputtering with a copper target and introducing argon and nitrogen to obtain the blackening layer.
[0069] Next, perform the following performance tests on the samples in Example 1 and 2 and Comparative Examples 1-4:
[0070] (1) Cu layer adhesion test: ASTM D3359, cross cutter, 3M 681 tape.
[0071] (2) Boiling water adhesion test: ASTM D3359, cross cutter, 3M 681 tape, water bath at 100 °C water temperature.
[0072] (3) Humidity chamber adhesion test: Place the sample in a constant temperature and humidity chamber (constant temperature 85 °C, constant humidity 85% RH), cross cutter, 3M 681 tape.
[0073] The following data as shown in the table are obtained:
[0074]
[0075]
[0076] Among them, the numbers after the adhesion in the above table correspond to the test time. For example, 5B, 2h in the boiling water adhesion of Example 1 means that according to the test standard of ASTM D3359, the boiling water adhesion of the sample after 2 h in a water bath at 100 °C is 5B.
[0077] It can be seen from the data in the above table that the adhesion of the samples in Example 1 and Example 2 of the present invention is significantly better than that of the samples in Comparative Examples 1-4. That is, the conductive copper film of the present invention has a high interlayer bonding force.
[0078] It is obvious to those skilled in the art that the present invention is not limited to the details of the above-described exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, in any regard, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Accordingly, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present invention. Any reference signs in the claims should not be construed as limiting the claims concerned.
[0079] In addition, it should be understood that although this specification is described in terms of embodiments, not every embodiment only contains an independent technical solution. This narrative manner of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
Claims
1. A conductive copper film, characterized in that, It includes a substrate, and a functional layer is provided on at least one surface of the substrate. The functional layer includes a hardening layer, an adhesion layer, and a copper layer that are sequentially laminated on the substrate. The hardening layer includes nanoparticles, and a part of the nanoparticles protrudes from the surface of the hardening layer facing the adhesion layer.
2. The conductive copper film according to claim 1, wherein The substrate has two opposite surfaces, and one of the functional layers is provided on each of the two surfaces.
3. The conductive copper film according to claim 1, characterized in that, The average particle size of the nanoparticles is less than or equal to 1000 nm.
4. The conductive copper film according to claim 1, wherein The ratio of the height h of the nanoparticles protruding from the surface of the hardening layer to the average particle size d of the nanoparticles is 0.1 to 0.
7.
5. The conductive copper film according to claim 1, wherein The nanoparticles include at least one of inorganic particles and organic particles; The inorganic particles include at least one of silica particles, alumina particles, titanium oxide particles, tin oxide particles, zirconium oxide particles, aluminum sulfate particles, magnesium sulfate particles, calcium carbonate particles, and magnesium carbonate particles; The organic particles include at least one of spherical silicone resin particles, acrylic resin particles, and hard plastic particles.
6. The conductive copper film according to claim 1, wherein The adhesion layer is made of an adhesion material, and the adhesion material is silicon, an oxide of silicon, a metal, or a metal oxide.
7. The conductive copper film according to claim 6, wherein, When the adhesion material is silicon or a metal, the thickness of the adhesion layer is less than or equal to 10 nm; when the adhesion material is an oxide of silicon or a metal oxide, the thickness of the adhesion layer is less than or equal to 50 nm.
8. The conductive copper film according to claim 6, wherein The nanoparticles are inorganic particles, and the inorganic particles are inorganic oxide particles; in the same functional layer, the raw material of the inorganic particles in the hardening layer is the same as the adhesion material of the adhesion layer, or the raw material of the inorganic particles in the hardening layer is an oxide of the adhesion material of the adhesion layer, or the raw material of the inorganic particles in the hardening layer and the adhesion material of the adhesion layer are homologous oxides.
9. The conductive copper film according to claim 1, wherein The hardening layer is made of a hardening agent and nanoparticles, and the raw material components of the hardening agent include an adhesive resin, a photoinitiator, and a leveling agent.
10. The conductive copper film according to claim 1, wherein In the same functional layer, a bottom blackening layer is provided between the adhesion layer and the copper layer, and a top blackening layer is provided on the side of the copper layer facing away from the adhesion layer.