Integrated circuit circuit board precise wiring control method and circuit board thereof

Abstract

The present invention provides a method for controlling precise wiring of an integrated circuit circuit board and the circuit board thereof, relating to the technical field of circuit board design. The method comprises: obtaining circuit board information, wherein the circuit board information includes signal frequency, current intensity, and circuit board temperature; obtaining circuit board impedance information, wherein the circuit board impedance information includes load end impedance, source end impedance, and transmission line characteristic impedance; determining a first control parameter based on current intensity; determining a second control parameter based on circuit board temperature; determining a third control parameter based on signal frequency and impedance information; and determining a control scheme based on the first control parameter, the second control parameter, and the third control parameter. According to the present invention, wiring can be controlled based on the three aspects of signal frequency, current intensity, and circuit board temperature, thereby improving the accuracy of integrated circuit circuit board wiring and the quality of signal transmission.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board design, and in particular to a precise wiring control method for an integrated circuit circuit board and the circuit board thereof. Background Art

[0002] In the related art, CN111225493B discloses a wiring structure of a circuit board and a circuit board, which relates to the field of circuit board design technology and is invented to solve the problem of high impedance of single-panel PDN in the prior art. This solution provides a wiring structure of a circuit board, wherein a processor and a capacitor are provided on one side surface of the circuit board, and the wiring structure includes a first connection structure and a second connection structure, wherein the first connection structure and the second connection structure are both located inside the circuit board, the first connection structure is used to connect the power supply end of the processor with the power supply end of the capacitor, and the second connection structure is used to connect the ground end of the processor with the ground end of the capacitor, and the projections of the first connection structure and the second connection structure on a first plane perpendicular to the circuit board can form at least two annular areas, and the magnetic field directions of the two annular areas are the same. This solution provides a wiring structure of a circuit board for connecting a processor and a capacitor.

[0003] CN107734849B discloses a wiring method and circuit board, comprising: S1: using the differential routing principle, calculating the routing length of the I2C routing on the outer layer of the circuit board and designing the routing pattern of the I2C routing on the outer layer of the circuit board; S2: using the differential routing principle, calculating the routing length of the I2C routing on the inner layer of the circuit board; S3: based on the routing length calculated in step S2, designing the routing pattern of the I2C routing on the inner layer of the circuit board using the non-differential routing principle. The circuit board includes a circuit board body and I2C routing, wherein the I2C routing includes an outer I2C routing and an inner I2C routing, wherein the outer I2C routing utilizes a differential routing method, and the inner I2C routing utilizes a non-differential routing method. By retaining the routing length and routing pattern of the outer layer of the circuit board under the differential principle and replacing the routing pattern of the inner layer with the non-differential routing method, the routing space is significantly saved without affecting signal transmission quality.

[0004] Based on the above related technologies, routing space can be saved. However, the related technologies do not consider the impact of the circuit board's temperature, current, and signal frequency on wiring. That is, it is impossible to accurately wire the integrated circuit circuit board based on the three aspects of circuit board temperature, current, and signal frequency. Summary of the Invention

[0005] The present invention provides an integrated circuit circuit board precise wiring control method and a circuit board thereof, which can solve the technical problem that related technologies cannot precisely wire the integrated circuit circuit board according to the three aspects of circuit board temperature, current and signal frequency.

[0006] According to a first aspect of the present invention, there is provided a method for controlling precise wiring of an integrated circuit circuit board, comprising:

[0007] Acquiring circuit board information, wherein the circuit board information includes: signal frequency, current intensity, and circuit board temperature;

[0008] Acquiring circuit board impedance information, wherein the circuit board impedance information includes: load end impedance, source end impedance, and transmission line characteristic impedance;

[0009] determining a first control parameter according to the current intensity;

[0010] determining a second control parameter according to the circuit board temperature;

[0011] determining a third control parameter according to the signal frequency and the impedance information;

[0012] A control scheme is determined according to the first control parameter, the second control parameter, and the third control parameter.

[0013] According to the present invention, determining the first control parameter according to the current intensity includes:

[0014] Determine the allowable current density and actual cross-sectional area of ​​the conductor;

[0015] determining a minimum cross-sectional area according to the allowable current density and the current intensity;

[0016] A first control parameter is determined according to the minimum cross-sectional area and the actual cross-sectional area.

[0017] According to the present invention, determining the second control parameter according to the circuit board temperature includes:

[0018] Obtain the normal temperature resistivity of the conductor in the first historical experimental cycle;

[0019] Get the temperature coefficient of the wire material;

[0020] Determining the real-time resistivity of the wire according to the normal-temperature resistivity of the wire, the temperature coefficient, and the temperature of the circuit board;

[0021] A second control parameter is determined according to the circuit board temperature and the real-time resistivity of the wire.

[0022] According to the present invention, determining the second control parameter according to the circuit board temperature and the real-time resistivity of the wire includes:

[0023] Determining the real-time resistance of the conductor according to the real-time resistivity of the conductor;

[0024] Obtain the initial spacing, thermal expansion coefficient, and initial line width of the conductor material;

[0025] A second control parameter is determined according to the initial spacing, the initial line width, the thermal expansion coefficient, and the circuit board temperature.

[0026] According to the present invention, determining the second control parameter according to the initial spacing, the initial line width, the thermal expansion coefficient, and the circuit board temperature includes:

[0027] According to the formula

[0028]

[0029] Determine the second control parameter Wea, where max is the maximum value function, μ j is the preset weight, Ls j,j+1 is the initial spacing between the jth wire and the j+1th wire, S j,o is the initial width of the jth conductor, Ce j is the thermal expansion coefficient of the jth wire, S j+1,o The initial width of the j+1th conductor, Ce j+1 is the thermal expansion coefficient of the j+1th wire, Cbt is the circuit board temperature, t T is the preset temperature, m is the number of wires, j≤m, and both j and m are positive integers.

[0030] According to the present invention, determining a third control parameter according to the signal frequency and the impedance information includes:

[0031] Determining whether the signal is a high-frequency signal according to the signal frequency;

[0032] In the case where the signal is a high-frequency signal, determining a third control parameter according to the impedance information;

[0033] When the signal is not a high-frequency signal, the third control parameter is determined to be -1.

[0034] According to the present invention, when the signal is a high-frequency signal, determining the third control parameter according to the impedance information includes:

[0035] Obtain historical load end impedance, historical source end impedance and historical transmission line characteristic impedance in historical experimental cycles;

[0036] Acquiring experimental information in a historical experimental cycle, wherein the experimental information includes: experimental temperature, experimental signal frequency, and hygroscopicity of experimental materials;

[0037] determining a first relationship function, a second relationship function, and a third relationship function according to the experimental temperature, the experimental signal frequency, the hygroscopicity of the experimental material, the historical load end impedance, the historical source end impedance, and the historical transmission line characteristic impedance;

[0038] Determining an offset load terminal impedance, an offset source terminal impedance, and an offset transmission line characteristic impedance according to the first relationship function, the second relationship function, and the third relationship function;

[0039] A third control parameter is determined according to the offset load end impedance, the offset source end impedance, and the offset transmission line characteristic impedance.

[0040] According to the present invention, determining the first relationship function, the second relationship function, and the third relationship function based on the experimental temperature, the experimental signal frequency, the hygroscopicity of the experimental material, the historical load end impedance, the historical source end impedance, and the historical transmission line characteristic impedance includes:

[0041] According to the formula

[0042]

[0043] Determine the first undetermined coefficient equation A of the first relationship function, the second undetermined coefficient equation B of the second relationship function, and the third undetermined coefficient equation C of the third relationship function, wherein Lei k,1 is the historical load terminal impedance at the beginning of the kth historical experimental cycle, Lei k,e is the historical load terminal impedance at the end of the kth historical experimental cycle, ESf k is the experimental signal frequency of the kth historical experimental cycle, ET k is the experimental temperature of the kth historical experimental cycle, EMa k is the hygroscopicity of the experimental material in the kth historical experimental cycle, Si k,1 is the historical source impedance at the beginning of the kth historical experimental cycle, Si k,e is the historical source impedance at the end of the kth historical experimental cycle, Ci k,1 is the historical transmission line characteristic impedance at the beginning of the kth historical experimental cycle, Ci k,e is the historical transmission line characteristic impedance at the end of the kth historical experimental cycle, ESf T is the preset signal frequency threshold, ET T is the preset experimental temperature threshold, EMa Tis the preset material hygroscopicity threshold, α1, α2, α3, α4, α5 and α6 are the first undetermined coefficients of the first undetermined coefficient equation A, β1, β2, β3, β4, β5 and β6 are the second undetermined coefficients of the second undetermined coefficient equation B, θ1, θ2, θ3, θ4, θ5 and θ6 are the third undetermined coefficients of the third undetermined coefficient equation C;

[0044] Solving the first undetermined coefficient, the second undetermined coefficient, and the third undetermined coefficient according to the experimental temperature, the experimental signal frequency, the hygroscopicity of the experimental material, the historical load end impedance, the historical source end impedance, and the historical transmission line characteristic impedance to obtain solution values ​​of the first undetermined coefficient, the second undetermined coefficient, and the third undetermined coefficient;

[0045] The first relationship function, the second relationship function and the third relationship function are determined according to the solved values ​​of the first undetermined coefficient, the second undetermined coefficient and the third undetermined coefficient, and the first undetermined coefficient equation A, the second undetermined coefficient equation B and the third undetermined coefficient equation C.

[0046] According to the present invention, determining a third control parameter according to the offset load end impedance, the offset source end impedance, and the offset transmission line characteristic impedance includes:

[0047] determining a load end reflection coefficient according to the offset load end impedance and the offset transmission line characteristic impedance;

[0048] determining a source end reflection coefficient according to the offset source end impedance and the offset transmission line characteristic impedance;

[0049] A third control parameter is determined according to the load end reflection coefficient and the source end reflection coefficient.

[0050] According to a second aspect of the present invention, an integrated circuit circuit board is provided, comprising: a signal layer, a power layer, a ground layer and a protective layer, and the integrated circuit board precise wiring control method is used to perform wiring control.

[0051] Technical Effect: According to the present invention, an integrated circuit circuit board can be simulated and run, and the signal frequency, current intensity, and circuit board temperature during the simulated operation of the circuit board can be obtained. The wiring can then be controlled based on these three factors, thereby improving the accuracy of the integrated circuit circuit board wiring and the quality of signal transmission. When determining the second control parameter, the second control parameter can be determined based on the initial spacing, initial line width, thermal expansion coefficient, and circuit board temperature. During the calculation process, the most severe degradation of the integrated circuit circuit board's overall operational function can be determined based on the reduction in spacing between individual adjacent wire combinations. This takes into account the cumulative effects of high-density wiring, improving the accuracy and objectivity of the second control parameter. When determining the first relationship function, the second relationship function and the third relationship function, the first relationship function, the second relationship function and the third relationship function can be determined based on the experimental temperature, the experimental signal frequency, the hygroscopicity of the experimental material, the historical load end impedance, the historical source end impedance and the historical transmission line characteristic impedance, accurately describing the influence of the experimental temperature, the experimental signal frequency and the hygroscopicity of the experimental material on the load end impedance offset degree, the source end impedance offset degree and the transmission line characteristic impedance offset degree, thereby improving the comprehensiveness and accuracy of the first relationship function, the second relationship function and the third relationship function. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Figure 1 A schematic diagram exemplarily illustrates a flow chart of a method for controlling precise wiring of an integrated circuit circuit board according to an embodiment of the present invention;

[0053] Figure 2 exemplarily shows a flow chart of calculating the second control parameter according to an embodiment of the present invention;

[0054] Figure 3 The flowchart of calculating the third control parameter according to an embodiment of the present invention is exemplarily shown. DETAILED DESCRIPTION

[0055] The following specific embodiments are used to describe the technical solution of the present invention in detail. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.

[0056] Figure 1 A flow chart of a method for controlling precise wiring of an integrated circuit circuit board according to an embodiment of the present invention is exemplarily shown. The method includes:

[0057] Step S1, obtaining circuit board information, wherein the circuit board information includes: signal frequency, current intensity and circuit board temperature;

[0058] Step S2, obtaining circuit board impedance information, wherein the circuit board impedance information includes: load end impedance, source end impedance and transmission line characteristic impedance;

[0059] Step S3, determining a first control parameter according to the current intensity;

[0060] Step S4, determining a second control parameter according to the circuit board temperature;

[0061] Step S5, determining a third control parameter according to the signal frequency and the impedance information;

[0062] Step S6: determining a control scheme according to the first control parameter, the second control parameter, and the third control parameter.

[0063] According to the precise wiring control method for an integrated circuit circuit board according to an embodiment of the present invention, a simulation operation can be performed on the integrated circuit circuit board to obtain the signal frequency, current intensity and circuit board temperature during the simulation operation of the circuit board, and the wiring is controlled based on the three aspects of signal frequency, current intensity and circuit board temperature, thereby improving the accuracy of the wiring of the integrated circuit circuit board and the quality of signal transmission.

[0064] According to an embodiment of the present invention, in step S1, circuit board information is acquired, wherein the circuit board information includes: signal frequency, current intensity, and circuit board temperature.

[0065] For example, use a time domain reflectometer (TDR) to simulate the waveform, convert it to the frequency domain through Fourier transform, identify key frequency components (e.g., signal frequency), use power simulation tools (e.g., Cadence Voltus) to estimate the current intensity based on the circuit design (gate-level netlist or RTL code), use thermal analysis software (e.g., Cadence Celsius) to import the PCB layout and material thermal conductivity, simulate the temperature distribution under different working conditions, and obtain the circuit board temperature.

[0066] According to an embodiment of the present invention, in step S2, circuit board impedance information is acquired, wherein the circuit board impedance information includes: load end impedance, source end impedance, and transmission line characteristic impedance.

[0067] For example, use VNA to directly measure the load end impedance, calculate the source end impedance through the AC injection method, and use EDA tools to simulate and calculate the transmission line characteristic impedance.

[0068] According to an embodiment of the present invention, in step S3, a first control parameter is determined according to the current intensity.

[0069] According to one embodiment of the present invention, step S3 includes:

[0070] Step S31, determining the allowable current density and actual cross-sectional area of ​​the conductor;

[0071] Step S32, determining a minimum cross-sectional area according to the allowable current density and the current intensity;

[0072] Step S33: determining a first control parameter according to the minimum cross-sectional area and the actual cross-sectional area.

[0073] For example, an IPC-2152 calculator (such as the Saturn PCB Toolkit) can be used to quickly calculate the allowable current density of a conductor. The actual cross-sectional area of ​​the conductor is determined based on the designed width of the conductor on the PCB and the thickness of the PCB copper foil (e.g., 1oz copper ≈ 0.035mm, 2oz copper ≈ 0.07mm). The minimum cross-sectional area is determined based on the current density formula and the ratio of the current intensity to the allowable current density. Excessive current density increases the heat generated per unit area, raising the conductor temperature, potentially causing insulation damage or material melting. Therefore, the conductor cross-sectional area needs to be increased to reduce the current density. The minimum cross-sectional area is the cross-sectional area required for safe operation of the conductor. For example, if the allowable current density of a copper conductor is 5A / square millimeter and the current is 10A, a cross-sectional area of ​​at least 2 square millimeters is required. The first control parameter is determined by subtracting the minimum cross-sectional area from the actual cross-sectional area. The first control parameter represents the size relationship between the actual cross-sectional area and the minimum cross-sectional area. When the first control parameter is less than 0, it indicates that the actual cross-sectional area is less than the minimum cross-sectional area, and the conductor may not operate safely, requiring adjustment of the actual cross-sectional area. When the first control parameter is greater than 0, it indicates that the conductor can operate safely.

[0074] According to an embodiment of the present invention, in step S4, a second control parameter is determined according to the circuit board temperature.

[0075] According to one embodiment of the present invention, step S4 includes:

[0076] Step S41, obtaining the normal temperature resistivity of the conductor in the first historical experimental cycle;

[0077] Step S42, obtaining the temperature coefficient of the conductor material;

[0078] Step S43, determining the real-time resistivity of the wire according to the room-temperature resistivity of the wire, the temperature coefficient, and the temperature of the circuit board;

[0079] Step S44: determining a second control parameter according to the circuit board temperature and the real-time resistivity of the wire.

[0080] For example, in the first historical experimental cycle, the room-temperature resistivity of the wire is measured at room temperature (e.g., 20 degrees Celsius); the temperature coefficient of the wire material is obtained by referring to the temperature characteristic specifications of metal wires in international standards (e.g., IEEE, IEC); the room-temperature resistivity, temperature coefficient, and circuit board temperature of the wire are substituted into the resistivity temperature coefficient formula to determine the real-time resistivity of the wire, that is, the resistivity of the wire at the current circuit board temperature; based on the circuit board temperature and the real-time resistivity of the wire, a second control parameter is calculated. The second control parameter represents the degree of decline in the overall operating function of the circuit board due to the increase in the circuit board temperature. The larger the second control parameter, the more serious the decline in the overall operating function of the circuit board.

[0081] Figure 2 The flowchart of the second control parameter calculation according to the embodiment of the present invention is exemplarily shown.

[0082] According to one embodiment of the present invention, step S44 includes:

[0083] Step S441, determining the real-time resistance of the conductor according to the real-time resistivity of the conductor;

[0084] Step S442, obtaining the initial spacing, thermal expansion coefficient, and initial line width of the conductor material;

[0085] Step S443 : determining a second control parameter according to the initial spacing, the initial line width, the thermal expansion coefficient, and the circuit board temperature.

[0086] For example, the real-time resistivity of the wire is substituted into the resistance formula of the conductor to determine the real-time resistance of the wire; the thermal expansion coefficient of the wire material is obtained according to the material manual and process design kit, and the initial line width and initial spacing of the wire material are obtained according to the layout design file; the second control parameter is calculated based on the initial line width, initial spacing, thermal expansion coefficient and circuit board temperature.

[0087] According to one embodiment of the present invention, step S443 includes: determining the second control parameter Wea according to formula (1),

[0088]

[0089] Among them, max is the maximum value function, μ j is the preset weight, Ls j,j+1 is the initial spacing between the jth wire and the j+1th wire, S j,o is the initial width of the jth conductor, Ce j is the thermal expansion coefficient of the jth wire, S j+1,o The initial width of the j+1th conductor, Ce j+1 is the thermal expansion coefficient of the j+1th wire, Cbt is the circuit board temperature, t Tis the preset temperature, m is the number of wires, j≤m, and both j and m are positive integers.

[0090] According to one embodiment of the present invention, S j,o ×Ce j ×(Cbt-t T ) is the expansion of the width of the j-th wire, where the preset temperature t T Can be set to 20 degrees Celsius, S j+1,o ×Ce j+1 ×(Cbt-t T ) is the expansion of the width of the j+1th wire, is the reduction in spacing between the jth and j+1th conductors, The ratio is the relative difference between the initial spacing between the jth and j+1th wires and the reduction in spacing between the jth and j+1th wires. The smaller the ratio, the greater the reduction in spacing between the jth and j+1th wires, and the greater the possibility of causing short circuit or signal crosstalk.

[0091] It means taking the maximum value of the sum of the products of the reduction degree of the spacing between m-1 adjacent wires and the corresponding weights. For example, when the spacing between the first and second adjacent wires is The value of is 0.5, the corresponding value between the second and third adjacent wires is 0.6, and the corresponding value between the third and fourth adjacent wires is 0.4. The preset weights are μ1, μ2, and μ3, and μ1<μ2<μ3, then

[0092] The value of is 0.6μ3+0.5μ2+0.4μ1, which means that when there are more adjacent wires with a larger reduction in spacing in the integrated circuit circuit board, the impact on the operating function of the integrated circuit circuit board will become more serious as the number of adjacent wires with a larger reduction in spacing increases. j The change of μ is a combination of exponential function and linear function. j The linear function part of the change shows that the reduction degree of the spacing between the single adjacent wire combination is getting larger, which makes the overall operating function of the integrated circuit board decrease at a uniform rate. j The exponential function portion of the change in indicates that as the number of adjacent wire combinations with a greater degree of spacing reduction increases, the impact on the degree of degradation of the overall operating function of the integrated circuit circuit board accelerates and increases at a non-uniform rate. The above-mentioned situation of finding the maximum value by allocating weights can be used to determine the situation where the overall operating function of the integrated circuit circuit board is most seriously degraded.

[0093] In this way, the second control parameter can be determined based on the initial spacing, initial line width, thermal expansion coefficient and circuit board temperature. During the calculation process, the most serious condition of the overall operational function degradation of the integrated circuit circuit board can be determined based on the reduction in spacing between single adjacent wire combinations. This takes into account the cumulative effect in high-density wiring, thereby improving the accuracy and objectivity of the second control parameter.

[0094] According to an embodiment of the present invention, in step S5, a third control parameter is determined according to the signal frequency and the impedance information.

[0095] According to one embodiment of the present invention, step S5 includes:

[0096] Step S51, determining whether the signal is a high-frequency signal according to the signal frequency;

[0097] Step S52: if the signal is a high-frequency signal, determine a third control parameter according to the impedance information;

[0098] Step S53: When the signal is not a high-frequency signal, the third control parameter is determined to be -1.

[0099] For example, a signal with a frequency greater than 100kHz is determined to be a high-frequency signal (such as radio frequency, high-speed digital signal); for high-frequency signals, it is necessary to control impedance matching, reduce skin effect and parasitic capacitance, and determine the third control parameter based on the impedance information; for low-frequency signals, the line width and spacing can be appropriately relaxed, but crosstalk must be avoided, and the third control parameter is determined to be -1. The third control parameter indicates that the processing method is determined based on the high-frequency signal and the low-frequency signal. When the third control parameter is -1, it indicates that the signal is a low-frequency signal and crosstalk needs to be avoided. When the third control parameter is greater than or equal to 0, it indicates that the signal is a high-frequency signal and it is necessary to determine whether the impedance is matched, and the control method is determined based on the determination result.

[0100] Figure 3 The flowchart of calculating the third control parameter according to an embodiment of the present invention is exemplarily shown.

[0101] According to one embodiment of the present invention, step S52 includes:

[0102] Step S521, obtaining historical load end impedance, historical source end impedance and historical transmission line characteristic impedance in a historical experiment cycle;

[0103] Step S522, obtaining experimental information in a historical experimental period, wherein the experimental information includes: experimental temperature, experimental signal frequency, and hygroscopicity of experimental materials;

[0104] Step S523, determining a first relationship function, a second relationship function, and a third relationship function according to the experimental temperature, the experimental signal frequency, the hygroscopicity of the experimental material, the historical load end impedance, the historical source end impedance, and the historical transmission line characteristic impedance;

[0105] Step S524, determining an offset load end impedance, an offset source end impedance, and an offset transmission line characteristic impedance according to the first relationship function, the second relationship function, and the third relationship function;

[0106] Step S525 : determining a third control parameter according to the offset load end impedance, the offset source end impedance, and the offset transmission line characteristic impedance.

[0107] For example, in the historical experimental cycle, the environmental factors are adjusted, and the historical load end impedance, historical source end impedance and historical transmission line characteristic impedance under different environmental conditions are obtained through detection instruments (such as multimeters and impedance analyzers); the experimental temperature, experimental signal frequency and experimental material hygroscopicity in the historical experimental cycle are obtained, wherein the hygroscopicity of the experimental material can be determined by the difference between the mass of the material after moisture absorption and the absolute dry mass of the material and the absolute dry mass of the material; the historical load end impedance, historical source end impedance and historical transmission line characteristic impedance are all related to temperature, signal frequency and material hygroscopicity to a certain extent. For example, an increase in temperature leads to an increase in dielectric constant, an increase in capacitance, and a decrease in impedance. Based on the above correlation, the first A first relationship function, a second relationship function, and a third relationship function are provided; the load terminal impedance, ambient temperature, signal frequency, and material hygroscopicity of the current integrated circuit circuit board are substituted into the first relationship function to obtain a ratio of a difference between the load terminal impedance and the load terminal impedance after shifting to the load terminal impedance; and the load terminal impedance is determined based on the ratio and the load terminal impedance, i.e., the shifted load terminal impedance; similarly, the source terminal impedance, transmission line characteristic impedance, ambient temperature, signal frequency, and material hygroscopicity of the current integrated circuit circuit board are substituted into the second relationship function and the third relationship function respectively to determine the shifted source terminal impedance and the shifted transmission line characteristic impedance; and a third control parameter is determined based on the shifted load terminal impedance, the shifted source terminal impedance, and the shifted transmission line characteristic impedance.

[0108] According to one embodiment of the present invention, step S523 includes: determining a first undetermined coefficient equation A of the first relationship function, a second undetermined coefficient equation B of the second relationship function, and a third undetermined coefficient equation C of the third relationship function according to formula (2),

[0109]

[0110] Among them, Lei k,1 is the historical load terminal impedance at the beginning of the kth historical experimental cycle, Lei k,eis the historical load terminal impedance at the end of the kth historical experimental cycle, ESf k is the experimental signal frequency of the kth historical experimental cycle, ET k is the experimental temperature of the kth historical experimental cycle, EMa k is the hygroscopicity of the experimental material in the kth historical experimental cycle, Si k,1 is the historical source impedance at the beginning of the kth historical experimental cycle, Si k,e is the historical source impedance at the end of the kth historical experimental cycle, Ci k,1 is the historical transmission line characteristic impedance at the beginning of the kth historical experimental cycle, Ci k,e is the historical transmission line characteristic impedance at the end of the kth historical experimental cycle, ESf T is the preset signal frequency threshold, ET T is the preset experimental temperature threshold, EMa T is the preset material hygroscopicity threshold, α1, α2, α3, α4, α5 and α6 are the first undetermined coefficients of the first undetermined coefficient equation A, β1, β2, β3, β4, β5 and β6 are the second undetermined coefficients of the second undetermined coefficient equation B, θ1, θ2, θ3, θ4, θ5 and θ6 are the third undetermined coefficients of the third undetermined coefficient equation C;

[0111] Solving the first undetermined coefficient, the second undetermined coefficient, and the third undetermined coefficient according to the experimental temperature, the experimental signal frequency, the hygroscopicity of the experimental material, the historical load end impedance, the historical source end impedance, and the historical transmission line characteristic impedance to obtain solution values ​​of the first undetermined coefficient, the second undetermined coefficient, and the third undetermined coefficient;

[0112] The first relationship function, the second relationship function and the third relationship function are determined according to the solved values ​​of the first undetermined coefficient, the second undetermined coefficient and the third undetermined coefficient, and the first undetermined coefficient equation A, the second undetermined coefficient equation B and the third undetermined coefficient equation C.

[0113] According to one embodiment of the present invention, is the ratio of the experimental signal frequency of the kth historical experimental cycle to the preset signal frequency threshold, indicating the experimental signal frequency condition of the kth historical experimental cycle. The preset signal frequency threshold can be set to 100kHz. is the ratio of the experimental temperature of the kth historical experimental cycle to the preset experimental temperature threshold, indicating the experimental temperature condition of the kth historical experimental cycle. The preset temperature threshold can be set to 20 degrees Celsius. It is the ratio of the hygroscopicity of the experimental material in the kth historical experimental cycle to the preset material hygroscopicity threshold, indicating the hygroscopicity of the material in the kth historical experimental cycle, wherein the preset material hygroscopicity threshold can be set to 10%.

[0114] According to one embodiment of the present invention, Indicates the historical load terminal impedance deviation degree of the kth historical experimental cycle, It indicates that the degree of historical load end impedance deviation in the kth historical experimental cycle is positively correlated with the experimental signal frequency condition in the kth historical experimental cycle. For example, the increase in frequency leads to a significant increase in the conductor loss resistance (Rac), and the real part (resistance component) of the equivalent impedance increases, causing the impedance to rise slightly. It indicates that the historical load end impedance deviation degree of the kth historical experimental cycle has a negative correlation with the experimental temperature condition of the kth historical experimental cycle. For example, the increase in temperature increases the dielectric constant of the dielectric material and the capacitance, resulting in a decrease in impedance. The degree of historical load end impedance shift in the kth historical experimental cycle is negatively correlated with the hygroscopicity of the material in the kth historical experimental cycle. For example, the greater the hygroscopicity of the experimental material, the more moisture it absorbs from the air, the greater the dielectric constant, and the lower the impedance. Based on the above correlation, the first undetermined coefficient equation A of the first relationship function can be obtained. Similarly, Indicates the historical source end impedance deviation degree of the kth historical experimental cycle, It means that the historical source end impedance deviation degree of the kth historical experimental cycle has a positive correlation with the experimental signal frequency condition of the kth historical experimental cycle. It means that the historical source end impedance deviation degree of the kth historical experimental cycle is negatively correlated with the experimental temperature condition of the kth historical experimental cycle. It indicates that the historical source end impedance offset degree of the kth historical experimental cycle is negatively correlated with the hygroscopicity of the material of the kth historical experimental cycle. Based on the above correlation, the second undetermined coefficient equation B of the second relationship function can be obtained. Indicates the degree of deviation of the characteristic impedance of the historical transmission line in the kth historical experimental cycle, It means that the degree of characteristic impedance deviation of the historical transmission line in the kth historical experimental cycle is positively correlated with the experimental signal frequency condition in the kth historical experimental cycle. It means that the degree of characteristic impedance deviation of the historical transmission line in the kth historical experimental cycle is negatively correlated with the experimental temperature condition in the kth historical experimental cycle. It indicates that the degree of characteristic impedance shift of the historical transmission line in the kth historical experimental cycle is negatively correlated with the hygroscopicity of the material in the kth historical experimental cycle. Based on the above correlation, the third undetermined coefficient equation C of the third relationship function can be obtained.

[0115] According to one embodiment of the present invention, a fitting can be performed based on multiple parameters involved in the above-mentioned first undetermined coefficient equation, that is, based on the experimental temperature, experimental signal frequency, experimental material hygroscopicity, and historical load-end impedance, to solve the above-mentioned multiple first undetermined coefficients. There are six first undetermined coefficients, namely, α1, α2, α3, α4, α5, and α6. Based on the experimental temperature, experimental signal frequency, experimental material hygroscopicity, and historical load-end impedance of at least six historical experimental cycles, the above six first undetermined coefficients are solved to obtain the solution values ​​of the above six first undetermined coefficients. The solution values ​​of the above six first undetermined coefficients are then substituted into the first undetermined coefficient equation A to determine the first relationship function.

[0116] According to one embodiment of the present invention, fitting can be performed based on multiple parameters involved in the above second undetermined coefficient equation, that is, fitting can be performed based on the experimental temperature, experimental signal frequency, experimental material hygroscopicity, and historical source end impedance to solve the above multiple second undetermined coefficients. There are six second undetermined coefficients, namely, β1, β2, β3, β4, β5, and β6. Based on the experimental temperature, experimental signal frequency, experimental material hygroscopicity, and historical source end impedance of at least six historical experimental cycles, the above six second undetermined coefficients are solved to obtain the solution values ​​of the above six second undetermined coefficients, and the solution values ​​of the above six second undetermined coefficients are substituted into the second undetermined coefficient equation B to determine the second relationship function.

[0117] According to one embodiment of the present invention, a fitting can be performed based on multiple parameters involved in the third undetermined coefficient equation, that is, based on the experimental temperature, experimental signal frequency, experimental material hygroscopicity, and historical transmission line characteristic impedance, to solve the above multiple third undetermined coefficients. There are six third undetermined coefficients, namely, θ1, θ2, θ3, θ4, θ5, and θ6. Based on the experimental temperature, experimental signal frequency, experimental material hygroscopicity, and historical transmission line characteristic impedance of at least six historical experimental cycles, the above six third undetermined coefficients are solved to obtain the solution values ​​of the above six third undetermined coefficients. The solution values ​​of the above six third undetermined coefficients are then substituted into the third undetermined coefficient equation C to determine the third relationship function.

[0118] In this way, the first relationship function, the second relationship function and the third relationship function can be determined according to the experimental temperature, the experimental signal frequency, the hygroscopicity of the experimental material, the historical load end impedance, the historical source end impedance and the historical transmission line characteristic impedance, which accurately describes the influence of the experimental temperature, the experimental signal frequency and the hygroscopicity of the experimental material on the load end impedance offset degree, the source end impedance offset degree and the transmission line characteristic impedance offset degree, thereby improving the comprehensiveness and accuracy of the first relationship function, the second relationship function and the third relationship function.

[0119] According to one embodiment of the present invention, step S525 includes:

[0120] Step S5251, determining a load end reflection coefficient according to the offset load end impedance and the offset transmission line characteristic impedance;

[0121] Step S5252, determining a source end reflection coefficient according to the offset source end impedance and the offset transmission line characteristic impedance;

[0122] Step S5253: Determine a third control parameter according to the load end reflection coefficient and the source end reflection coefficient.

[0123] For example, the offset load end impedance and the offset transmission line characteristic impedance are substituted into the reflection coefficient formula to determine the load end reflection coefficient; the offset source end impedance and the offset transmission line characteristic impedance are substituted into the reflection coefficient formula to determine the source end reflection coefficient; a preset reflection coefficient threshold is determined (for example, the preset reflection coefficient threshold can be set to 0.3, indicating acceptable matching and little impact on the signal), and a load end reflection result is determined based on the preset reflection coefficient threshold and the load end reflection coefficient. When the preset reflection coefficient threshold is greater than or equal to the load end reflection coefficient, it indicates that the load end is matched and the load end reflection result is 0; when the preset reflection coefficient threshold is less than the load end reflection coefficient, it indicates that the load end is not matched and the load end reflection result is 1; and a source end reflection result is determined based on the preset reflection coefficient threshold and the source end reflection coefficient. When the preset reflection coefficient threshold is greater than or equal to the source end reflection coefficient, it indicates that the source end is matched and the source end reflection result is 0; when the preset reflection coefficient threshold is less than the source end reflection coefficient, it indicates that the source end is not matched and the source end reflection result is 1; and a third control parameter is determined based on the sum of the source end reflection result and the load end reflection result.

[0124] According to an embodiment of the present invention, in step S6, a control scheme is determined according to the first control parameter, the second control parameter and the third control parameter.

[0125] For example, if the first control parameter is greater than 0, no control is required; if the first control parameter is less than or equal to 0, the wire width is increased to increase the cross-sectional area of ​​the wire; if the second control parameter is greater than the preset second control parameter threshold (for example, e), it indicates that the overall operating function of the integrated circuit circuit board has declined significantly and the spacing between the wires needs to be increased; if the second control parameter is less than the preset second control parameter threshold, it indicates that the overall operating function of the integrated circuit circuit board has declined slightly and no control is required; if the third control parameter is -1, it indicates that the signal is a low-frequency signal, and an RC filter is added to the low-frequency signal input or output to suppress high-frequency noise crosstalk; if the third control parameter is greater than 0, it indicates that there is a source mismatch or a load mismatch, and the source end is terminated in series or the load end is terminated in parallel.

[0126] According to an embodiment of the present invention, a precise routing control method for an integrated circuit circuit board can simulate an integrated circuit circuit board, obtain the signal frequency, current intensity, and circuit board temperature during the simulated operation, and control routing based on these three factors, thereby improving the accuracy of the integrated circuit circuit board routing and the quality of signal transmission. When determining the second control parameter, the second control parameter can be determined based on the initial spacing, initial line width, thermal expansion coefficient, and circuit board temperature. During the calculation process, the most severe degradation of the overall operational function of the integrated circuit circuit board can be determined based on the reduction in spacing between individual adjacent wire combinations. This takes into account the cumulative effects of high-density routing and improves the accuracy and objectivity of the second control parameter. When determining the first relationship function, the second relationship function and the third relationship function, the first relationship function, the second relationship function and the third relationship function can be determined based on the experimental temperature, the experimental signal frequency, the hygroscopicity of the experimental material, the historical load end impedance, the historical source end impedance and the historical transmission line characteristic impedance, accurately describing the influence of the experimental temperature, the experimental signal frequency and the hygroscopicity of the experimental material on the load end impedance offset degree, the source end impedance offset degree and the transmission line characteristic impedance offset degree, thereby improving the comprehensiveness and accuracy of the first relationship function, the second relationship function and the third relationship function.

[0127] According to one embodiment of the present invention, an integrated circuit circuit board is provided, comprising: a signal layer, a power layer, a ground layer and a protective layer, and the integrated circuit board precise wiring control method is used to perform wiring control.

[0128] The present invention may be a method, an apparatus, a system and / or a computer program product. The computer program product may include a computer-readable storage medium carrying computer-readable program instructions for executing various aspects of the present invention.

[0129] Those skilled in the art will appreciate that the embodiments of the present invention described above and shown in the accompanying drawings are intended to be illustrative only and are not intended to limit the present invention. The objectives of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and illustrated in the embodiments. Any variations or modifications may be made to the embodiments of the present invention without departing from the principles described.

Claims

1. A method for precise wiring control of an integrated circuit circuit board, characterized in that: include: Acquiring circuit board information, wherein the circuit board information includes: signal frequency, current intensity, and circuit board temperature; Acquiring circuit board impedance information, wherein the circuit board impedance information includes: load end impedance, source end impedance, and transmission line characteristic impedance; determining a first control parameter according to the current intensity; determining a second control parameter according to the circuit board temperature; determining a third control parameter according to the signal frequency and the impedance information; determining a control scheme according to the first control parameter, the second control parameter, and the third control parameter; Determining a control scheme according to the first control parameter, the second control parameter, and the third control parameter includes: If the first control parameter is greater than 0, no control is required; if the first control parameter is less than or equal to 0, the wire width is increased to increase the cross-sectional area of ​​the wire; If the second control parameter is greater than a preset second control parameter threshold, the spacing between the wires needs to be increased; if the second control parameter is less than the preset second control parameter threshold, no control is required; If the third control parameter is -1, an RC filter is added to the low-frequency signal input or output to suppress high-frequency noise crosstalk. If the third control parameter is greater than 0, the source end is terminated in series or the load end is terminated in parallel.

2. The integrated circuit circuit board precise wiring control method according to claim 1, characterized in that: Determining a first control parameter according to the current intensity includes: Determine the allowable current density and actual cross-sectional area of ​​the conductor; determining a minimum cross-sectional area according to the allowable current density and the current intensity; A first control parameter is determined according to the minimum cross-sectional area and the actual cross-sectional area.

3. The integrated circuit circuit board precise wiring control method according to claim 1, characterized in that: Determining a second control parameter according to the circuit board temperature includes: Obtain the normal temperature resistivity of the conductor in the first historical experimental cycle; Get the temperature coefficient of the wire material; Determining the real-time resistivity of the wire according to the normal-temperature resistivity of the wire, the temperature coefficient, and the temperature of the circuit board; A second control parameter is determined according to the circuit board temperature and the real-time resistivity of the wire.

4. The integrated circuit circuit board precise wiring control method according to claim 3, characterized in that: Determining a second control parameter according to the circuit board temperature and the real-time resistivity of the wire includes: Determining the real-time resistance of the conductor according to the real-time resistivity of the conductor; Obtain the initial spacing, thermal expansion coefficient, and initial line width of the conductor material; A second control parameter is determined according to the initial spacing, the initial line width, the thermal expansion coefficient, and the circuit board temperature.

5. The integrated circuit circuit board precise wiring control method according to claim 4, characterized in that: Determining a second control parameter according to the initial spacing, the initial line width, the thermal expansion coefficient, and the circuit board temperature includes: According to the formula Determine the second control parameter Wea, where max is the maximum value function, μ j is the preset weight, Ls j,j+1 is the initial spacing between the jth wire and the j+1th wire, S j,o is the initial width of the jth conductor, Ce j is the thermal expansion coefficient of the jth wire, S j+1,o The initial width of the j+1th conductor, Ce j+1 is the thermal expansion coefficient of the j+1th wire, Cbt is the circuit board temperature, t T is the preset temperature, m is the number of wires, j≤m, and both j and m are positive integers.

6. The integrated circuit circuit board precise wiring control method according to claim 1, characterized in that: Determining a third control parameter according to the signal frequency and the impedance information includes: Determining whether the signal is a high-frequency signal according to the signal frequency; In the case where the signal is a high-frequency signal, determining a third control parameter according to the impedance information; When the signal is not a high-frequency signal, the third control parameter is determined to be -1.

7. The integrated circuit circuit board precise wiring control method according to claim 6, characterized in that: In the case where the signal is a high-frequency signal, determining a third control parameter according to the impedance information includes: Obtain historical load end impedance, historical source end impedance and historical transmission line characteristic impedance in historical experimental cycles; Acquiring experimental information in a historical experimental cycle, wherein the experimental information includes: experimental temperature, experimental signal frequency, and hygroscopicity of experimental materials; determining a first relationship function, a second relationship function, and a third relationship function according to the experimental temperature, the experimental signal frequency, the hygroscopicity of the experimental material, the historical load end impedance, the historical source end impedance, and the historical transmission line characteristic impedance; Determining an offset load terminal impedance, an offset source terminal impedance, and an offset transmission line characteristic impedance according to the first relationship function, the second relationship function, and the third relationship function; A third control parameter is determined according to the offset load end impedance, the offset source end impedance, and the offset transmission line characteristic impedance.

8. The integrated circuit circuit board precise wiring control method according to claim 7, characterized in that: Determining a first relationship function, a second relationship function, and a third relationship function according to the experimental temperature, the experimental signal frequency, the hygroscopicity of the experimental material, the historical load end impedance, the historical source end impedance, and the historical transmission line characteristic impedance includes: According to the formula Determine the first undetermined coefficient equation A of the first relationship function, the second undetermined coefficient equation B of the second relationship function, and the third undetermined coefficient equation C of the third relationship function, wherein Lei k,1 is the historical load terminal impedance at the beginning of the kth historical experimental cycle, Lei k,e is the historical load terminal impedance at the end of the kth historical experimental cycle, ESf k is the experimental signal frequency of the kth historical experimental cycle, ET k is the experimental temperature of the kth historical experimental cycle, EMa k is the hygroscopicity of the experimental material in the kth historical experimental cycle, Si k,1 is the historical source impedance at the beginning of the kth historical experimental cycle, Si k,e is the historical source impedance at the end of the kth historical experimental cycle, Ci k,1 is the historical transmission line characteristic impedance at the beginning of the kth historical experimental cycle, Ci k,e is the historical transmission line characteristic impedance at the end of the kth historical experimental cycle, ESf T is the preset signal frequency threshold, ET T is the preset experimental temperature threshold, EMa T is the preset material hygroscopicity threshold, α1, α2, α3, α4, α5 and α6 are the first undetermined coefficients of the first undetermined coefficient equation A, β1, β2, β3, β4, β5 and β6 are the second undetermined coefficients of the second undetermined coefficient equation B, θ1, θ2, θ3, θ4, θ5 and θ6 are the third undetermined coefficients of the third undetermined coefficient equation C; Solving the first undetermined coefficient, the second undetermined coefficient, and the third undetermined coefficient according to the experimental temperature, the experimental signal frequency, the hygroscopicity of the experimental material, the historical load end impedance, the historical source end impedance, and the historical transmission line characteristic impedance to obtain solution values ​​of the first undetermined coefficient, the second undetermined coefficient, and the third undetermined coefficient; The first relationship function, the second relationship function and the third relationship function are determined according to the solved values ​​of the first undetermined coefficient, the second undetermined coefficient and the third undetermined coefficient, and the first undetermined coefficient equation A, the second undetermined coefficient equation B and the third undetermined coefficient equation C.

9. The integrated circuit circuit board precise wiring control method according to claim 7, characterized in that: Determining a third control parameter according to the offset load end impedance, the offset source end impedance, and the offset transmission line characteristic impedance includes: determining a load end reflection coefficient according to the offset load end impedance and the offset transmission line characteristic impedance; determining a source end reflection coefficient according to the offset source end impedance and the offset transmission line characteristic impedance; A third control parameter is determined according to the load end reflection coefficient and the source end reflection coefficient.

10. An integrated circuit circuit board, characterized in that: include: The signal layer, power layer, ground layer and protective layer are controlled by wiring using the method described in claims 1-9.

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