High-frequency transformer tin soldering device

Abstract

The invention belongs to the technical field of welding, and particularly provides a high-frequency transformer tin soldering device which comprises a fixing base, a material transferring assembly, a scaling powder box, a tin soldering box and a pin shearing assembly, the scaling powder box, the tin soldering box and the pin shearing assembly are arranged on the fixing base, and the material transferring assembly comprises a rotating frame and a clamping mechanism; the clamping mechanism moves among the multiple stations along with the rotating frame, the high-frequency transformer can be transferred to the soldering flux station from the feeding station and then transferred to the soldering tin station, the high-frequency transformer subjected to soldering tin is moved to the pin shearing station, and the pin shearing assembly shears pins to be in proper lengths. The pin shearing assembly is arranged behind the tin soldering material box, the pins are firstly subjected to tin soldering and then are sheared into appropriate lengths, and the quality problem that soldering tin is gathered or adhered due to burrs generated when the pins are sheared firstly can be avoided. The soldering tin recovery box can collect and recover the cut pins and metal tin, and waste is avoided.

Description

Technical Field

[0001] The present invention belongs to the technical field of welding, and particularly relates to a soldering device for high-frequency transformers. Background Art

[0002] A transformer is a common electronic component, and transformers are required in common electrical equipment. A high-frequency transformer is a type of small transformer, referring to a power transformer with a working frequency exceeding 10 kHz. A high-frequency transformer mainly consists of a bobbin, a coil, a magnetic core, and pins. The pins are installed below the bobbin and are used to connect to the circuit board during subsequent installation.

[0003] There are multiple pairs of pins on a high-frequency transformer. When producing a high-frequency transformer, the pins (also known as pin feet) need to be cut to an appropriate length and then soldered. In the prior art, the cutting and soldering of transformer pins are carried out by different devices respectively, and additional labor is required to transfer materials between the two devices. For example, in the patent document with the Chinese patent publication number CN118371628A and the name of a cutting device for transformer skeleton pin wires, it is disclosed that the pins are cut by cutting blades before transformer assembly. Another example is the patent document with the Chinese patent publication number CN114669822A and the name of a soldering processing line for small transformers, which discloses that a feeding conveying mechanism, a flux tank, a tin bath, and a discharging conveying mechanism are arranged on a processing table to form a soldering processing line, and a guiding vibration mechanism is arranged on the processing table. When the transformer pin feet are separated from the molten metal tin, the molten tin adhering to the transformer pin feet converges into drops at the bottom of the pin feet under the action of gravity, and the guiding vibration mechanism is used to automatically vibrate and shake off the converged drops of molten tin for recovery. The problems existing in the above prior art are that the cutting and soldering of transformer pins are carried out by different devices respectively, additional labor is required to transfer materials between different devices, the degree of automation is low, and the production efficiency is not high. Summary of the Invention

[0004] An embodiment of the present invention provides a soldering device for high-frequency transformers, aiming to solve the problem that the pin cutting and pin soldering in the prior art are carried out on different devices respectively, resulting in a low degree of automation.

[0005] To achieve the above object, the technical solution adopted by the present invention is: to provide a soldering device for high-frequency transformers, including:

[0006] A fixed seat, which is provided with a feeding station, a flux station, a soldering station, a pin cutting station, and a discharging station at equal intervals along its circumferential direction;

[0007] The material transfer assembly includes a rotating frame and a clamping mechanism. The rotating frame is rotatably arranged at the central position of the fixed seat and extends radially along itself to form a plurality of arms. Each arm is provided with the clamping mechanism. The clamping mechanism includes a clamping unit and a lifting rod. The lifting rod is connected to the arm and can move vertically. The clamping unit is arranged at the lower end of the lifting rod, and the clamping unit is used for clamping and releasing the high-frequency transformer;

[0008] The flux cartridge is arranged at the flux station and is used for containing flux;

[0009] The solder cartridge is arranged at the soldering station and is used for containing metallic tin; and

[0010] The lead trimming assembly includes a lead trimming mechanism and a solder recovery box arranged at the lead trimming station. The lead trimming mechanism includes a lead trimming plate, a cutting knife, and a telescopic rod. The lead trimming plate is horizontally arranged above the solder recovery box and is provided with a through lead trimming hole for the insertion of leads. The cutting knife is arranged below the lead trimming plate, and the telescopic rod is arranged on the lead trimming plate and is used for driving the cutting knife to move horizontally.

[0011] In a possible implementation manner, a loading conveyor belt is arranged at the loading station, and an unloading conveyor belt is arranged at the unloading station. Below the discharge end of the loading conveyor belt, a lifting rod is arranged. The lifting rod is arranged to be vertically liftable and is used for lifting the workpiece to the clamping height of the clamping unit.

[0012] In a possible implementation manner, an annular positioning protrusion is arranged on the outer peripheral surface of the lifting rod. The positioning protrusion is located above the arm. A spring is sleeved on the outer periphery of the lifting rod. The spring abuts between the positioning protrusion and the arm and is configured with a pre-tightening force for moving the lifting rod upward; The material transfer assembly further includes:

[0013] A support column is erected at the central position of the fixed seat, and the rotating frame is rotationally matched with the support column; and

[0014] A baffle is horizontally arranged on the support column and is located above the rotating frame. The top end of the lifting rod abuts against the baffle. The baffle is respectively provided with downward guiding protrusions at the corresponding positions of the flux cartridge and the solder cartridge. During the movement of the lifting rod along with the rotating frame, the lifting rod passes through the guiding protrusions.

[0015] In a possible implementation manner, the end of the lifting rod for abutting against the baffle is a spherical surface.

[0016] In a possible implementation manner, the clamping unit includes:

[0017] A bi-directional cylinder is provided at the lower end of the lifting rod; and

[0018] Two clamping plates are respectively provided at two telescopic ends of the bi-directional cylinder, and a placement space for the workpiece is formed between the two clamping plates.

[0019] In a possible implementation manner, both the flux cartridge and the solder cartridge have a material storage groove, and the material storage groove is an arc-shaped groove arranged along the circumferential direction of the fixed seat.

[0020] In a possible implementation manner, the lead trimming mechanism further includes a lifting rod, and the lifting rod is provided on the solder recovery box for driving the lead trimming plate to lift.

[0021] In a possible implementation manner, the inside of the solder recovery box is hollow, and a plurality of drainage pipes are arranged side by side and spaced apart inside the solder recovery box. The drainage pipes penetrate through the top wall and the bottom wall of the solder recovery box, and the inner diameter of the drainage pipe is smaller than the diameter of the pin.

[0022] In a possible implementation manner, a heating chamber and a cooling chamber are formed inside the solder recovery box. The heating chamber is located above the cooling chamber, and a heat insulation plate is provided between the heating chamber and the cooling chamber. The upper end of the drainage pipe is placed in the heating chamber, the lower end of the drainage pipe is placed in the cooling chamber, and a receiving tray is provided below the drainage pipe.

[0023] In a possible implementation manner, both the heating chamber and the cooling chamber are provided with a liquid inlet and a liquid outlet.

[0024] Compared with the prior art, the beneficial effects of a high-frequency transformer soldering device provided by the present invention are:

[0025] A high-frequency transformer soldering device provided by the present invention includes a fixed seat, a material transfer assembly, a flux cartridge, a solder cartridge, and a lead trimming assembly. The flux cartridge, the solder cartridge, and the lead trimming assembly are respectively arranged on the fixed seat. The material transfer assembly includes a rotating frame and a clamping mechanism. The clamping mechanism moves with the rotating frame among multiple stations, and can transfer the high-frequency transformer from the loading station to the flux application station, so that the pins are attached with flux and then transferred to the soldering station, so that the metallic tin in the solder cartridge is attached to the pins. After soldering, the high-frequency transformer moves to the lead trimming station, the pins extend into the lead trimming holes, and the telescopic rod drives the cutter to move to shear the pins into appropriate lengths. The redundant pins after shearing fall into the solder recovery box below. The high-frequency transformer after soldering and lead trimming is transferred to the unloading station, and can enter subsequent processes such as inspection and packaging through the unloading station.

[0026] The present invention successively arranges a soldering flux cartridge, a solder cartridge, and a lead trimming assembly on a fixed base, and drives a high-frequency transformer through a rotating frame and a clamping mechanism to successively pass through the above-mentioned multiple stations, realizing an integrated operation of transfer, soldering, and lead trimming, with a higher degree of automation. The present invention arranges the lead trimming assembly behind the solder cartridge, and the leads are first soldered and then cut to an appropriate length. Compared with the operation mode of trimming the leads first and then soldering, it can avoid quality problems such as solder accumulation or adhesion caused by burrs generated during the first trimming, ensuring the solder quality of the leads. By arranging a solder recovery box under the lead trimming plate, it is possible to collect and recycle the cut leads and metal tin, avoiding waste. Description of the Drawings

[0027] Figure 1 Structural schematic diagram of the high-frequency transformer soldering device provided by the embodiment of the present application Figure 1 ;

[0028] Figure 2 is Figure 1 Partial enlarged view of part A in

[0029] Figure 3 Structural schematic diagram of the high-frequency transformer soldering device provided by the embodiment of the present application Figure 2 ;

[0030] Figure 4 Structural schematic diagram of the lead trimming assembly and the clamping mechanism in the embodiment of the present application;

[0031] Figure 5 Internal cross-sectional view of the lead trimming assembly and the clamping mechanism in the embodiment of the present application.

[0032] Description of the reference numerals:

[0033] 10, fixed base; 20, material transfer assembly; 21, rotating frame; 211, support arm; 22, clamping mechanism; 221, clamping unit; 2211, double-acting cylinder; 2212, clamping plate; 222, lifting rod; 223, spring; 23, support column; 24, baffle; 241, guiding protrusion; 30, soldering flux cartridge; 31, material storage groove; 40, solder cartridge; 50, lead trimming assembly; 51, lead trimming mechanism; 511, lead trimming plate; 5111, lead trimming hole; 512, cutting tool; 513, telescopic rod; 514, lifting rod; 52, solder recovery box; 521, drainage pipe; 522, heating chamber; 523, cooling chamber; 524, heat insulation plate; 525, liquid inlet; 526, liquid outlet; 53, receiving tray; 60, loading conveyor belt; 70, unloading conveyor belt; 80, high-frequency transformer. Detailed Embodiments

[0034] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clear and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0035] Please refer to Figures 1 to 5 together, and a high-frequency transformer soldering device provided by an embodiment of the present invention will be described below.

[0036] Please refer to Figure 1 、 Figure 2 and Figure 3 . An embodiment of the present invention provides a high-frequency transformer soldering device, including a fixed seat 10, a material transfer assembly 20, a flux cartridge 30, a solder cartridge 40 and a lead trimming assembly 50. The fixed seat 10 is provided with a loading station, a flux station, a soldering station, a lead trimming station and an unloading station at equal intervals along its circumferential direction; the material transfer assembly 20 includes a rotating frame 21 and a clamping mechanism 22. The rotating frame 21 is rotatably arranged at the center position of the fixed seat 10 and is formed with a plurality of arms 211 extending along its radial direction. A clamping mechanism 22 is provided on each arm 211. The clamping mechanism 22 includes a clamping unit 221 and a lifting rod 222. The lifting rod 222 is connected to the arm 211 and can move vertically. The lower end of the lifting rod 222 is provided with a clamping unit 221. The clamping unit 221 is used for clamping and releasing the high-frequency transformer 80; the flux cartridge 30 is arranged at the flux station and is used for containing flux. The flux can be rosin or other common flux materials; the solder cartridge 40 is arranged at the soldering station and is used for containing molten metal tin; the lead trimming assembly 50 includes a lead trimming mechanism 51 and a solder recovery box 52 arranged at the lead trimming station. The lead trimming mechanism 51 includes a lead trimming plate 511, a cutting knife 512 and a telescopic rod 513. The lead trimming plate 511 is horizontally arranged above the solder recovery box 52 and is provided with a through lead trimming hole 5111 for the insertion of leads. The cutting knife 512 is arranged below the lead trimming plate 511. The telescopic rod 513 is arranged on the lead trimming plate 511 and is used for driving the cutting knife 512 to move horizontally.

[0037] Compared with the prior art, the beneficial effects of a high-frequency transformer soldering device provided by an embodiment of the present invention are:

[0038] A soldering device for high-frequency transformers provided by an embodiment of the present invention includes a fixed base 10, a material transfer assembly 20, a flux cartridge 30, a solder cartridge 40, and a lead trimming assembly 50. The flux cartridge 30, the solder cartridge 40, and the lead trimming assembly 50 are respectively arranged on the fixed base 10. The material transfer assembly 20 includes a rotating frame 21 and a clamping mechanism 22. The clamping mechanism 22 moves with the rotating frame 21 among multiple stations, and can transfer the high-frequency transformer 80 from the loading station to the flux application station, so that flux adheres to the leads, and then transfer it to the soldering station, so that the metallic tin in the solder cartridge 40 adheres to the leads. After soldering, the high-frequency transformer 80 moves to the lead trimming station, the leads extend into the lead trimming holes 5111, and the telescopic rod 513 drives the cutting knife 512 to move to cut the leads into appropriate lengths. The redundant leads after cutting fall into the solder recovery box 52 below. The high-frequency transformer 80 after soldering and lead trimming is transferred to the unloading station, and can enter subsequent processes such as inspection and packaging through the unloading station.

[0039] In the embodiment of the present invention, the flux cartridge 30, the solder cartridge 40, and the lead trimming assembly 50 are sequentially arranged on the fixed base 10, and the rotating frame 21 and the clamping mechanism 22 drive the high-frequency transformer 80 to pass through the above-mentioned multiple stations in sequence, realizing the integrated operations of transfer, soldering, and lead trimming, with higher automation. In the present invention, the lead trimming assembly 50 is arranged behind the solder cartridge 40, and the leads are first soldered and then cut into appropriate lengths. Compared with the operation method of trimming the leads first and then soldering, it can avoid quality problems such as solder accumulation or adhesion caused by burrs generated during the first cutting, ensuring the solder quality of the leads. By arranging the solder recovery box 52 below the lead trimming plate 511, the cut leads and metallic tin can be collected and recycled, avoiding waste.

[0040] The fixed base 10 can be a metal or cement pedestal, which plays a role of supporting and fixing. The working area of the fixed base 10 is divided into a loading station, a flux application station, a soldering station, a lead trimming station, and an unloading station according to functions, and the above-mentioned multiple stations are evenly distributed along the circumferential direction. A material transfer assembly 20 is arranged at the central position of the fixed base 10. The material transfer assembly 20 includes a rotating frame 21 and a clamping mechanism 22, which can drive the high-frequency transformer 80 to pass through the above-mentioned multiple stations in sequence, completing the operations of loading, flux application, soldering, lead trimming, and unloading of the high-frequency transformer 80.

[0041] The rotating frame 21 can be driven to rotate by power equipment such as a driving motor or a hydraulic rotary motor. The rotating frame 21 extends outward to form a support arm 211, and each support arm 211 is provided with a clamping mechanism 22 for clamping and releasing the high-frequency transformer 80. According to the clamping range of the clamping mechanism 22 and the specific size of the high-frequency transformer 80, the clamping mechanism 22 can clamp one or more high-frequency transformers 80.

[0042] The clamping mechanism 22 includes a lifting rod 222 and a clamping unit 221 provided at the lower end of the lifting rod 222. The lifting rod 222 can move up and down, thereby changing the height of the clamping unit 221. Optionally, the lifting rod 222 can be an electric push rod, a pneumatic push rod or other driving rods that can extend and retract by themselves. Or, the lifting rod 222 can also be a rigid rod body, and other driving forms are used to drive the rod body to move vertically. There is no limitation on the specific structural form of the clamping unit 221, and it can be a fixture on the market that can clamp the high-frequency transformer 80.

[0043] The flux cartridge 30 and the solder cartridge 40 are both in the form of a box body, and the openings of the cartridges are all arranged upward so that the high-frequency transformer 80 can enter from top to bottom. The flux can be rosin or other common fluxes. A heating element is provided inside the solder cartridge 40, which can heat the metal tin to keep the metal tin in a liquid state.

[0044] The lead trimming mechanism 51 includes a lead trimming plate 511, a cutting knife 512 and a telescopic rod 513. Lead trimming holes 5111 corresponding to the leads one by one are formed on the lead trimming plate 511. The telescopic rod 513 is arranged on the lead trimming plate 511, and the telescopic rod 513 is connected to the cutting knife 512 and can drive the cutting knife 512 to move. When the high-frequency transformer 80 reaches the lead trimming station, the lifting rod 222 drives the high-frequency transformer 80 to descend or the lead trimming mechanism 51 drives the lead trimming plate 511 to rise, so that the leads of the high-frequency transformer 80 are inserted into the lead trimming holes 5111 by an appropriate length. The cutting edge of the cutting knife 512 faces the leads, and the telescopic rod 513 drives the cutting knife 512 to move to cut the leads. The cut redundant leads fall into the solder recovery box 52 below for collection, and the metal tin can be reused after being processed.

[0045] Please refer to Figures 1 to 3 , in some possible embodiments, a loading conveyor belt 60 is provided at the loading station, and an unloading conveyor belt 70 is provided at the unloading station. A lifting material rod is provided below the discharge end of the loading conveyor belt 60. The lifting material rod is arranged to be vertically liftable. When the high-frequency transformer 80 moves into place, the lifting material rod rises upward to lift the high-frequency transformer 80 to the clamping height of the clamping unit 221 for the clamping unit 221 to clamp. After the loading action is completed, the lifting material rod descends to the original position, and the loading conveyor belt 60 conveys the next batch of high-frequency transformers 80 to the loading station for waiting to be picked up and loaded.

[0046] Please refer to Figures 1 to 3, in some possible embodiments, an annular positioning protrusion is provided on the outer peripheral surface of the lifting rod 222. The positioning protrusion is located above the support arm 211. A spring 223 is sleeved on the outer periphery of the lifting rod 222. The spring 223 is in a compressed state. The spring 223 abuts between the positioning protrusion and the support arm 211 and is configured with a pre-tightening force to move the lifting rod 222 upward. The material transfer assembly 20 further includes a support column 23 and a baffle 24. The support column 23 is erected at the central position of the fixed seat 10, and the rotary frame 21 is rotationally matched with the support column 23; the baffle 24 is horizontally arranged on the support column 23 and is located above the rotary frame 21. The top end of the lifting rod 222 abuts against the baffle 24. The baffle 24 is respectively provided with downward guiding protrusions 241 at corresponding positions of the flux cartridge 30 and the solder cartridge 40. During the movement of the lifting rod 222 along with the rotary frame 21, the lifting rod 222 passes through the guiding protrusions 241. Under the pushing of the guiding protrusions 241, the lifting rod 222 can move downward, so that the pins of the high-voltage transformer clamped at the lower end can enter the flux cartridge 30 and the solder cartridge 40.

[0047] The shape of the guiding protrusion 241 can be a semi-circular shape, a triangular shape, a trapezoidal shape, etc. with the tip facing downward. The connection position between the guiding protrusion 241 and the baffle 24 should adopt an arc transition to prevent the lifting rod 222 from getting stuck during movement.

[0048] Please refer to Figures 1 to 3 , in some possible embodiments, the end of the lifting rod 222 for abutting against the baffle 24 is a spherical surface, which can reduce the frictional resistance between the lifting rod 222 and the baffle 24, and the top end of the lifting rod 222 is less likely to be worn.

[0049] Please refer to Figures 1 to 3 , in some possible embodiments, the clamping unit 221 includes a double-acting cylinder 2211 and two clamping plates 2212. The double-acting cylinder 2211 is arranged at the lower end of the lifting rod 222 and has two independently telescopic ends; the two clamping plates 2212 are respectively arranged at the two telescopic ends of the double-acting cylinder 2211. A receiving space for the workpiece is formed between the two clamping plates 2212. The double-acting cylinder 2211 controls the two clamping plates 2212 to approach or separate from each other, and can clamp or release the high-frequency transformer 80.

[0050] Please refer to Figure 1 and Figure 3 , considering that the movement trajectory of the high-frequency transformer 80 itself is an arc when passing through the flux application station and the loading station, in some possible embodiments, both the flux cartridge 30 and the solder cartridge 40 have a material receiving groove 31. The material receiving groove 31 is an arc-shaped groove arranged along the circumferential direction of the fixed seat 10 and is adapted to the movement trajectory of the high-frequency transformer 80.

[0051] Please refer to Figure 2 , Figure 4 andFigure 5 , in some possible embodiments, the pin cutting mechanism 51 further includes a lifting rod 514. The lifting rod 514 is disposed in the solder recovery box 52 and is used to drive the pin cutting plate 511 to lift and lower. After the pin cutting plate 511 rises to the in-place position, the bottom end of the pin is inserted into the corresponding pin cutting hole 5111, and the moving cutter 512 can cut off the pin with an excessive length.

[0052] Please refer to Figure 2 , Figure 4 and Figure 5 , in some possible embodiments, the interior of the solder recovery box 52 is hollow. A plurality of drainage pipes 521 are arranged side by side and spaced apart inside the solder recovery box 52. The drainage pipes 521 penetrate through the top wall and the bottom wall of the solder recovery box 52. The cut-off pins fall to the top end of the solder recovery box 52 and are then heated and melted. The molten metal tin can flow downward through the drainage pipes 521. The inner diameter of the drainage pipes 521 is smaller than the diameter of the pins. The drainage pipes 521 are made of a material with poor compatibility with metal tin to prevent metal tin from adhering to the inner wall of the drainage pipes 521 and causing blockage.

[0053] Please refer to Figure 2 , Figure 4 and Figure 5 , in some possible embodiments, a heating chamber 522 and a cooling chamber 523 are formed inside the solder recovery box 52. The heating chamber 522 is located above the cooling chamber 523, and a heat insulation plate 524 is provided between the heating chamber 522 and the cooling chamber 523. The heat insulation plate 524 can be an asbestos board or other heat insulation materials, or other composite plates with heat insulation and heat preservation functions. The upper end of the drainage pipe 521 is accommodated in the heating chamber 522 and extends out of the heating chamber 522. The lower end of the drainage pipe 521 is accommodated in the cooling chamber 523 and penetrates below the cooling chamber 523. A receiving tray 53 is provided below the drainage pipe 521. The receiving tray 53 is designed to be pull-out type, and the solder that solidifies upon cooling will fall onto the receiving tray 53.

[0054] The heating chamber 522 is connected through a pipeline to a heat transfer oil supply mechanism. The heat transfer oil makes the temperature at the top of the solder recovery box 52 higher than the melting point of the metal tin. The metal tin flows into the drainage pipe 521 in a liquid state. During the downward flow of the metal tin along the drainage pipe 521, it will solidify into a solid state and fall onto the receiving tray 53 below.

[0055] Please refer to Figure 2 , Figure 4 and Figure 5 , in some possible embodiments, both the heating chamber 522 and the cooling chamber 523 are provided with a liquid inlet 525 and a liquid outlet 526. The liquid inlet 525 and the liquid outlet 526 are connected through a pipeline to a heat transfer oil supply structure or a cooling water supply mechanism to enable the circulation of the heat transfer oil or the cooling water. The heat transfer oil supply structure or the cooling water supply mechanism is prior art, and its specific structure and working principle will not be elaborated herein.

[0056] It is understandable that each part in the above embodiments can be freely combined or deleted to form different combined embodiments. The specific content of each combined embodiment will not be elaborated here. After this explanation, it can be considered that the description of the present invention has recorded each combined embodiment and can support different combined embodiments.

[0057] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. A high-frequency transformer soldering device, characterized in that, Comprising: A fixed base (10) is provided with a loading station, a flux station, a soldering station, a lead trimming station, and an unloading station at equal intervals along its circumferential direction; A material transfer assembly (20), including a rotating frame (21) and a clamping mechanism (22). The rotating frame (21) is rotatably arranged at the central position of the fixed base (10) and is formed with a plurality of arms (211) extending along its radial direction. The clamping mechanism (22) is provided on each arm (211). The clamping mechanism (22) includes a clamping unit (221) and a lifting rod (222). The lifting rod (222) is connected to the arm (211) and can move vertically. The clamping unit (221) is provided at the lower end of the lifting rod (222), and the clamping unit (221) is used for clamping and releasing the high-frequency transformer (80); A flux cartridge (30) is arranged at the flux station for containing flux; A soldering tin cartridge (40) is arranged at the soldering station for containing metallic tin; and A lead trimming assembly (50), including a lead trimming mechanism (51) and a soldering tin recovery box (52) arranged at the lead trimming station. The lead trimming mechanism (51) includes a lead trimming plate (511), a cutting knife (512), and a telescopic rod (513). The lead trimming plate (511) is horizontally arranged above the soldering tin recovery box (52) and is provided with a through lead trimming hole (5111) for the insertion of leads. The cutting knife (512) is arranged below the lead trimming plate (511), and the telescopic rod (513) is arranged on the lead trimming plate (511) for driving the cutting knife (512) to move horizontally.

2. The solder device for high-frequency transformer according to claim 1, wherein A loading conveyor belt (60) is provided at the loading station, and an unloading conveyor belt (70) is provided at the unloading station. A lifting material rod is arranged below the discharge end of the loading conveyor belt (60). The lifting material rod is arranged to be vertically liftable and is used for lifting the workpiece to the clamping height of the clamping unit (221).

3. A high-frequency transformer soldering device according to claim 1, characterized in that, The lifting rod (222) is in sliding fit with the arm (211). An annular positioning protrusion is provided on the outer peripheral surface of the lifting rod (222). The positioning protrusion is located above the arm (211). A spring (223) is sleeved on the outer periphery of the lifting rod (222). The spring (223) abuts between the positioning protrusion and the arm (211) and is configured with a pre-tightening force for moving the lifting rod (222) upward; The material transfer assembly (20) further includes: A support column (23) is erected at the central position of the fixed base (10). The rotating frame (21) is in rotational fit with the support column (23); and The baffle plate (24) is horizontally arranged on the support column (23) and is located above the rotary frame (21). The top end of the lifting rod (222) abuts against the baffle plate (24). The baffle plate (24) is respectively provided with downward guiding protrusions (241) at corresponding positions of the flux cartridge (30) and the solder cartridge (40). During the movement of the lifting rod (222) along with the rotary frame (21), the lifting rod (222) passes through the guiding protrusion (241).

4. The solder device for a high-frequency transformer according to claim 3, characterized in that, The end of the lifting rod (222) for abutting against the baffle plate (24) is a spherical surface.

5. A high-frequency transformer soldering device according to claim 1, characterized in that, The clamping unit (221) includes: A double-acting cylinder (2211) arranged at the lower end of the lifting rod (222); and Two clamping plates (2212) respectively arranged at two telescopic ends of the double-acting cylinder (2211). An accommodating space for the workpiece is formed between the two clamping plates (2212).

6. The solder device for a high-frequency transformer according to claim 1, wherein, Both the flux cartridge (30) and the solder cartridge (40) have a material accommodating groove (31), and the material accommodating groove (31) is an arc-shaped groove arranged along the circumferential direction of the fixed seat (10).

7. A high-frequency transformer soldering device according to claim 1, characterized in that, The lead trimming mechanism (51) further includes a lifting rod (514). The lifting rod (514) is arranged on the solder recovery box (52) and is used to drive the lead trimming plate (511) to lift.

8. A high-frequency transformer soldering device according to claim 1, characterized in that, The inside of the solder recovery box (52) is hollow. A plurality of drainage pipes (521) are arranged side by side and at intervals inside the solder recovery box (52). The drainage pipes (521) penetrate through the top wall and the bottom wall of the solder recovery box (52), and the inner diameter of the drainage pipe (521) is smaller than the diameter of the lead.

9. The solder device for high-frequency transformer according to claim 8, wherein A heating chamber (522) and a cooling chamber (523) are formed inside the solder recovery box (52). The heating chamber (522) is located above the cooling chamber (523), and a heat insulation plate (524) is arranged between the heating chamber (522) and the cooling chamber (523). The upper end of the drainage pipe (521) is accommodated in the heating chamber (522), the lower end of the drainage pipe (521) is accommodated in the cooling chamber (523), and a receiving tray (53) is arranged below the drainage pipe (521).

10. A high-frequency transformer soldering device according to claim 9, characterized in that, Both the heating chamber (522) and the cooling chamber (523) are provided with a liquid inlet (525) and a liquid outlet (526).

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