Ball grid array (BGA) device prying device and method

Abstract

The invention discloses a BGA device prying device and method.The prying device comprises a pulling assembly and a vacuum assembly, the pulling assembly comprises a shell part, an inner core part and a pulling part, the shell part is provided with a movable groove, a connecting hole and a guide groove, the inner core part is arranged in the movable groove, and a vacuum channel in the inner core part is connected with the vacuum assembly through a first vacuum opening; a sealing piece is arranged on the bottom end face of the inner core piece, a hollow channel of the sealing piece is communicated with a second vacuum opening of the vacuum channel, the threaded end of the pulling piece is in threaded connection with a threaded hole of the inner core piece, a limiting piece is arranged at the threaded end to limit movement of the pulling piece, and the bottom end of the shell piece is connected to the surface of the circuit board in a pressed mode. The vacuum assembly is used for extracting gas in the vacuum channel and the hollow channel so that the BGA device can be adsorbed to the sealing piece, the pulling piece is rotated through the holding end so that the threaded end can rotate to drive the inner core piece to move in the direction away from the BGA device, the BGA device can be rapidly and completely separated from the circuit board, and the test time is greatly shortened.

Description

Technical Field

[0001] The present invention relates to the technical field of BGA device soldering quality detection, and particularly to a BGA device prying device and method. Background Art

[0002] The BGA dyeing test is a process for detecting the soldering quality of BGA (Ball Grid Array) packaged devices and is also a detection technology commonly used in the field of electronic manufacturing. The main purpose of this technology is to inspect whether there are defects such as open soldering or breakage during the surface mount technology (SMT) process of electronic components. When performing the dyeing test, generally, the PCB board needs to be immersed in a dye with strong permeability and coloring property first, and then vacuum dried. The dye will color the cracks and other defects in the solder balls. Finally, the BGA device is separated from the PCB board, and the fracture surface of the solder balls is observed and analyzed.

[0003] In the dyeing test, after the PCB board is colored, the BGA device needs to be separated from the PCB board by mechanical force. There are three traditional separation methods:

[0004] The first method is to pry the BGA device from the PCB board with tweezers or a pair of sharp-nose pliers. However, with the development of process technology, electronic components are getting thinner and thinner. It is difficult to control the force when prying the components with tweezers or sharp-nose pliers, and the force can only be exerted at one point, resulting in the need to repeat the prying action many times. Moreover, the edge of the BGA device is often pried and broken. This method not only easily damages the BGA device but also has a very low separation efficiency, affecting the overall efficiency of the test.

[0005] The second method is to use a spatula to separate the BGA device. Although this method increases the contact area between the prying device and the BGA device and reduces the damage to its edge, when using the spatula, the force on the BGA device is uneven, and a situation may occur where some parts of the BGA device are locally damaged and detached, while some other parts of the BGA device still remain on the board, also resulting in the inability to observe the complete fracture situation of the solder balls.

[0006] The third method is to directly bond glue to the BGA device, wait for the glue to dry and become firm, and then pull off the BGA device, or use glue to bond the BGA device to the force application fixture, and then pull off the BGA device by applying force evenly through the fixture. This method can pull off the BGA device completely, but it has relatively high requirements for the tensile strength of the selected glue after solidification. The solidification time of the glue generally exceeds 6 hours, which results in relatively low test efficiency. Moreover, a large amount of glue will remain on the surface of the BGA device pulled off with glue, and these glues are generally very difficult to remove. The BGA device pulled off by this method cannot be used for other tests anymore. Summary of the Invention

[0007] The object of the present invention is to provide a BGA device prying device, which can quickly and completely separate the BGA device from the circuit board, protect the BGA device from damage, facilitate the reuse of the BGA device for other tests, and greatly reduce the test time, effectively improving the test efficiency.

[0008] Another object of the present invention is to provide a method for prying a BGA device, which can quickly and completely separate the BGA device from the circuit board, protect the BGA device from damage, facilitate the reuse of the BGA device for other tests, and greatly reduce the test time, effectively improving the test efficiency.

[0009] To achieve the above object, the present invention discloses a BGA device prying device for prying a BGA device soldered on the surface of a circuit board. The prying device includes:

[0010] A pulling component and a vacuum component. The pulling component includes a housing member, a core member and a pulling member. The vacuum component is provided with a vacuum tube;

[0011] Both end faces of the housing member are respectively provided with a movable groove and a connection hole. The side wall of the housing member is provided with a guide groove extending vertically. The movable groove communicates with the connection hole and the guide groove respectively;

[0012] The core member is movably arranged in the movable groove along the vertical direction. A vacuum channel is arranged in the core member. Both ends of the vacuum channel extend to the side wall and the bottom end face of the core member and are respectively formed as a first vacuum port and a second vacuum port. The first vacuum port is arranged corresponding to the guide groove and is connected to the vacuum tube. Threaded holes and seals are respectively arranged on the top end face and the bottom end face of the core member. The seal is provided with a hollow channel communicating with the second vacuum port;

[0013] The pulling member includes a threaded end and a holding end. The threaded end partially passes through the connection hole and is threadedly connected to the threaded hole. A limiting member pressing on the top end face of the housing member is arranged on the part of the threaded end that does not pass through the connection hole. The limiting member is used to limit the movement of the pulling member in the direction close to the core member;

[0014] The vacuum component is used to extract the gas in the vacuum channel and the hollow channel through the vacuum tube, so that the BGA device is adsorbed on the seal. The bottom end of the housing member is pressed on the surface of the circuit board. When the pulling member is rotated through the holding end, the threaded end is used to rotationally drive the core member to move away from the BGA device, so that the BGA device is separated from the circuit board.

[0015] Optionally, each of the four outer side walls of the outer shell member is provided with a guide groove communicating with the movable groove, and each guide groove extends downward to the bottom end surface of the outer shell member.

[0016] Optionally, the limiting member includes a first limiting nut and a second limiting nut, and the first limiting nut and the second limiting nut are threadedly connected to the threaded end in a vertically adjustable manner, so that the two end surfaces of the second limiting nut are respectively in contact with the first limiting nut and the top end surface of the outer shell member.

[0017] Optionally, a first gasket is further provided between the first limiting nut and the second limiting nut, and a second gasket is further provided between the second limiting nut and the top end surface of the outer shell member.

[0018] Optionally, the sealing member is an O-ring, and the O-ring is detachably fixedly connected to the bottom end surface of the inner core member by an adhesive.

[0019] Optionally, an installation channel is provided around the second vacuum port on the bottom end surface of the inner core member, the sealing member is installed in the installation channel, and the thickness of the sealing member is greater than the depth of the installation channel.

[0020] Optionally, a middle portion and an annular portion surrounding the middle portion are provided by extending downward from the bottom end surface of the inner core member, an installation channel is formed between the middle portion and the annular portion, and the height of the middle portion is less than the height of the annular portion.

[0021] Optionally, the vacuum assembly includes a vacuum generator, a solenoid valve, and an air compressor. The vacuum generator includes a vacuum end and an air inlet end. The vacuum end is connected to the vacuum tube. The two ends of the solenoid valve are respectively connected to the air inlet end and the output end of the air compressor to control the connection or disconnection between the two. The vacuum generator is used to extract the air in the vacuum channel and the hollow channel communicated with the vacuum tube by using the compressed air output by the air compressor.

[0022] To achieve the above another object, the present invention discloses a method for prying up a BGA device, using the BGA device prying-up device as described above to pry up the BGA device soldered on the surface of a circuit board. The steps of the prying-up method include:

[0023] Press the bottom end of the outer shell member against the surface of the circuit board;

[0024] Adjust the height of the pulling member so that the sealing member of the inner core member fits against the BGA device;

[0025] Adjust the position of the limiting member on the threaded end so that the limiting member presses against the top end surface of the outer shell member;

[0026] Control the vacuum component to extract the gas in the vacuum channel and the hollow channel through the vacuum tube, so that the BGA device is adsorbed on the seal;

[0027] Rotate the holding end of the extraction part, so that the threaded end rotates to drive the inner core part to move away from the BGA device until the BGA device is separated from the circuit board.

[0028] In the present invention, an extraction component equipped with a vacuum component is set to pry up the BGA device from the surface of the circuit board. The extraction component includes a housing part, an inner core part and an extraction part. The housing part is provided with a movable groove, a connection hole and a guide groove. The inner core part is movably arranged in the movable groove in the vertical direction. A vacuum channel is arranged in the inner core part. The vacuum channel is connected to the vacuum tube of the vacuum component through a first vacuum port corresponding to the guide groove. A seal is arranged on the bottom end surface of the inner core part. The hollow channel of the seal is communicated with the second vacuum port of the vacuum channel. The extraction part includes a threaded end and a holding end. The threaded end partially passes through the connection hole and is threadedly connected to the threaded hole on the top end surface of the inner core part. A limiting part pressing on the top end surface of the housing part is arranged on the threaded end to limit the movement of the extraction part. The bottom end of the housing part is pressed on the surface of the circuit board. The vacuum component is used to extract the gas in the vacuum channel and the hollow channel, so that the BGA device is adsorbed on the seal. By rotating the extraction part through the holding end, the threaded end rotates to drive the inner core part to move away from the BGA device, so as to quickly and completely separate the BGA device from the circuit board, protect the BGA device from damage, facilitate the reuse of the BGA device for other tests, and greatly reduce the test time, effectively improving the test efficiency. Description of the Drawings

[0029] Figure 1 It is a three-dimensional structure diagram of the BGA device prying-up device in the embodiment of the present invention.

[0030] Figure 2 It is a first exploded structure diagram of the extraction component and the circuit board in the BGA device prying-up device in the embodiment of the present invention.

[0031] Figure 3 It is a sectional structure diagram of the extraction component and the circuit board in the BGA device prying-up device in the embodiment of the present invention.

[0032] Figure 4 It is a second exploded structure diagram of the extraction component and the circuit board in the BGA device prying-up device in the embodiment of the present invention. Detailed Embodiments

[0033] To describe in detail the technical content, structural features, achieved purposes and effects of the present invention, the following is described in detail in combination with the embodiments and with reference to the drawings.

[0034] Please refer to Figures 1 to 4, the present invention discloses a BGA device prying device for prying a BGA device 102 soldered on the surface of a circuit board 101. The prying device includes:

[0035] a pulling component 1 and a vacuum component 2. The pulling component 1 includes a housing part 11, a core part 12 and a pulling part 13. The vacuum component 2 is provided with a vacuum tube 21;

[0036] The two end faces of the housing part 11 are respectively provided with a movable groove 111 and a connection hole 112. The side wall of the housing part 11 is provided with a guide groove 113 extending vertically. The movable groove 111 is respectively communicated with the connection hole 112 and the guide groove 113;

[0037] The core part 12 is movably arranged in the movable groove 111 in the vertical direction. A vacuum channel 121 is arranged in the core part 12. The two ends of the vacuum channel 121 respectively extend to the side wall and the bottom end face of the core part 12 and are respectively formed as a first vacuum port 122 and a second vacuum port 123. The first vacuum port 122 is arranged corresponding to the guide groove 113 and is connected with the vacuum tube 21. The top end face and the bottom end face of the core part 12 are respectively provided with a threaded hole 124 and a seal 125. The seal 125 is provided with a hollow channel 1251 communicated with the second vacuum port 123;

[0038] The pulling part 13 includes a threaded end 131 and a gripping end 132. The threaded end 131 partially passes through the connection hole 112 and is threadedly connected with the threaded hole 124. The part of the threaded end 131 that does not pass through the connection hole 112 is provided with a limiting part 14 pressed against the top end face of the housing part 11. The limiting part 14 is used to limit the pulling part 13 from moving towards the direction close to the core part 12;

[0039] The vacuum component 2 is used to extract the gas in the vacuum channel 121 and the hollow channel 1251 through the vacuum tube 21, so that the BGA device 102 is adsorbed on the seal 125. The bottom end of the housing part 11 is pressed against the surface of the circuit board 101. When the pulling part 13 is rotated through the gripping end 132, the threaded end 131 is used to rotate and drive the core part 12 to move away from the BGA device 102, so that the BGA device 102 is separated from the circuit board 101.

[0040] In the present invention, a pulling component 1 cooperated with a vacuum component 2 is provided to pry up a BGA device 102 from the surface of a circuit board 101. The pulling component 1 includes a housing part 11, a core part 12 and a pulling part 13. The housing part 11 is provided with a movable slot 111, a connection hole 112 and a guide slot 113. The core part 12 is movably arranged in the movable slot 111 in the vertical direction. A vacuum channel 121 is arranged in the core part 12. The vacuum channel 121 is connected to a vacuum tube 21 of the vacuum component 2 through a first vacuum port 122 corresponding to the guide slot 113. A sealing part 125 is arranged on the bottom end surface of the core part 12. A hollow channel 1251 of the sealing part 125 communicates with a second vacuum port 123 of the vacuum channel 121. The pulling part 13 includes a threaded end 131 and a gripping end 132. The threaded end 131 partially passes through the connection hole 112 and is threadedly connected to a threaded hole 124 on the top end surface of the core part 12. A limiting part 14 pressing on the top end surface of the housing part 11 is arranged on the threaded end 131 to limit the movement of the pulling part 13. The bottom end of the housing part 11 presses on the surface of the circuit board 101. The gas in the vacuum channel 121 and the hollow channel 1251 is extracted by the vacuum component 2, so that the BGA device 102 is adsorbed on the sealing part 125. The pulling part 13 is rotated through the gripping end 132 to make the threaded end 131 rotate to drive the core part 12 to move away from the BGA device 102, so as to quickly and completely separate the BGA device 102 from the circuit board 101, protect the BGA device 102 from being damaged, facilitate the reuse of the BGA device 102 for other tests, and greatly reduce the test time, effectively improving the test efficiency.

[0041] Referring to Figures 1 to 4 , guide slots 113 communicating with the movable slot 111 are arranged on four outer side walls of the housing part 11. Each guide slot 113 extends downward to the bottom end surface of the housing part 11 to form a four-sided hollowed-out effect, which is conducive to avoiding the obstruction of components to the housing part 11 and realizing arbitrary placement.

[0042] Specifically, in this embodiment, both the housing part 11 and the core part 12 are in a cuboid shape and are made of stainless steel. Among them, the bottom end surface of the housing part 11 is arranged in a plane, which is convenient for the pulling component 1 to be stably placed on the circuit board 101 welded with various electronic components, so as to apply force to the BGA device 102 evenly. And the bottom end surface of the core part 12 is also arranged in a plane, which is conducive to the pulling force acting evenly on the upper surface of the BGA device 102 when the pulling part 13 applies an upward pulling force to the core part 12, and the problem of damage to the BGA device 102 caused by uneven force will not occur.

[0043] Referring to Figures 1 to 4, the limiting member 14 includes a first limiting nut 141 and a second limiting nut 142. The first limiting nut 141 and the second limiting nut 142 are threadedly connected to the threaded end 131 in a vertically adjustable manner, so that the two end faces of the second limiting nut 142 are respectively in contact with the first limiting nut 141 and the top end face of the housing member 11.

[0044] Specifically, in this embodiment, the positions of the first limiting nut 141 and the second limiting nut 142 on the threaded end 131 of the pulling member 13 determine the length of the threaded end 131 of the pulling member 13 extending into the movable groove 111. And the inner core member 12 is threadedly engaged with the threaded end 131 of the pulling member 13 through the threaded hole 124 and is connected within the movable groove 111 of the housing member 11. Therefore, the depth of the threaded end 131 screwed into the threaded hole 124 of the inner core member 12 can be changed by adjusting the positions of the first limiting nut 141 and the second limiting nut 142 on the threaded end 131, so as to adjust the height of the inner core member 12 within the housing member 11. Furthermore, the space for placing the BGA device 102 within the housing member 11 can be flexibly controlled, enabling it to be compatible with various BGA devices 102 of different thicknesses, thereby improving the applicability of the prying device. And in cooperation with the vacuum assembly 2, a force is applied to the upper surface of the BGA device 102 through vacuum suction to achieve the purpose of separating the BGA device 102 from the circuit board 101, such that when using the prying device to pry up the BGA device 102, there is no need to consider the problem of the distance between the BGA device 102 and the circuit board 101 being too close.

[0045] Furthermore, a first gasket 143 is provided between the first limiting nut 141 and the second limiting nut 142, and a second gasket 144 is provided between the second limiting nut 142 and the top end face of the housing member 11, effectively reducing the wear of the first limiting nut 141, the second limiting nut 142 and the top end face of the housing member 11 and extending the service life.

[0046] Refer to Figures 1 to 4 , the seal 125 is an O-ring, and the O-ring is detachably fixed to the bottom end face of the inner core member 12 through an adhesive.

[0047] Specifically, in this embodiment, the adhesive is a special glue, which facilitates the replacement of O-rings of different sizes, and further adapts to BGA devices 102 of different areas, achieving the purpose of making the prying device adaptable to BGA devices 102 of different areas and achieving the effect of repeated use to reduce costs.

[0048] Refer to Figures 1 to 4 , an installation channel 126 is provided around the second vacuum port 123 on the bottom end face of the inner core member 12. The seal 125 is installed in the installation channel 126, and the thickness of the seal 125 is greater than the depth of the installation channel 126.

[0049] Further, a middle part 127 and an annular part 128 surrounding the middle part 127 are downwardly extended from the bottom end surface of the inner core member 12. An installation channel 126 is formed between the middle part 127 and the annular part 128, and the height of the middle part 127 is less than the height of the annular part 128.

[0050] Specifically, in this embodiment, the sealing member 125 is made of elastic rubber material. When the sealing member 125 is attached to the upper surface of the BGA device 102, a sealed space can be formed between the middle part 127 and the upper surface of the BGA device 102. This sealed space is communicated with the vacuum channel 121 through the second vacuum port 123, so that the vacuum channel 121 of the inner core member 12 is isolated from the outside. With the cooperation of the vacuum assembly 2, the gas pressure in this sealed space and the vacuum channel 121 decreases, and the gas pressure in the space other than the sealing member 125 is relatively large, thus forming a pressure difference, generating a vacuum suction force between the upper surface of the BGA device 102 and the sealing member 125, and realizing the prying up of the BGA device 102 with the assistance of the prying-up assembly 1. The sealing member 125 and the BGA device 102 can be easily separated without adhesives, without damaging the surface of the BGA device 102, and the subsequent separated BGA device 102 can also be subjected to other tests.

[0051] Refer to Figures 1 to 4 , the vacuum assembly 2 includes a vacuum generator 22, a solenoid valve 23, and an air compressor 24. The vacuum generator 22 includes a vacuum end 221 and an air inlet end 222. The vacuum end 221 is connected with a vacuum tube 21. Two ends of the solenoid valve 23 are respectively connected with the air inlet end 222 and the output end of the air compressor 24 to control their connection or disconnection. The vacuum generator 22 is used to extract the air in the vacuum channel 121 and the hollow channel 1251 connected with the vacuum tube 21 by using the compressed air output by the air compressor 24.

[0052] Specifically, in this embodiment, the solenoid valve 23 is a switch for controlling the inner core member 12 to switch to the vacuum state to adsorb the BGA device 102. After the air compressor 24 and the vacuum generator 22 are connected by using the solenoid valve 23, the high-speed air flow of the air compressor 24 can reduce the air pressure at the vacuum end 221 of the vacuum generator 22 connected with the vacuum tube 21, and then generate a vacuum suction force on the upper surface of the BGA device 102, so that the BGA device 102 is closely attached to the sealing member 125.

[0053] Please refer to Figures 1 to 4 , the present invention discloses a method for prying up a BGA device, which uses the BGA device prying-up device as described above to pry up the BGA device 102 soldered on the surface of the circuit board 101. The steps of the prying-up method include:

[0054] 101. Press the bottom end of the outer shell member 11 against the surface of the circuit board 101;

[0055] Specifically, in the dyeing test, when separating the BGA device 102 from the circuit board 101 by using the BGA device prying method, first, the outer shell 11 needs to be vertically and closely attached to the circuit board 101, and the seal 125 of the inner core 12 is aligned with the upper surface of the BGA device 102.

[0056] 102. Adjust the height of the extraction member 13 so that the seal 125 of the inner core 12 fits with the BGA device 102;

[0057] 103. Adjust the position of the limiting member 14 on the threaded end 131 so that the limiting member 14 is crimped on the top end surface of the outer shell 11;

[0058] Specifically, by clockwise tightening the first limiting nut 141 and the second limiting nut 142 on the threaded end 131, the depth of the threaded end 131 of the extraction member 13 screwed into the inner core 12 is fixed.

[0059] 104. Control the vacuum assembly 2 to extract the gas in the vacuum channel 121 and the hollow channel 1251 through the vacuum tube 21, so that the BGA device 102 is adsorbed on the seal 125;

[0060] Specifically, by opening the solenoid valve 23, the vacuum generator 22 generates a vacuum suction force, so that the seal 125 on the bottom end surface of the inner core 12 is closely attached to the upper surface of the BGA device 102.

[0061] 105. Rotate the holding end 132 of the extraction member 13 so that the threaded end 131 rotates to drive the inner core 12 to move away from the BGA device 102 until the BGA device 102 is separated from the circuit board 101.

[0062] Specifically, clockwise rotate the holding end 132 of the extraction member 13, so that the threaded end 131 of the extraction member 13 applies an upward lifting force to the inner core 12 through the threaded fit with the threaded hole 124, and cooperates with the outer shell 11 to apply a downward force to the circuit board 101. The directions of the two acting forces are opposite, so that the BGA device 102 is separated from the circuit board 101.

[0063] Specifically, after the separation is completed, by closing the solenoid valve 23, the vacuum suction force of the inner core 12 on the BGA device 102 is cancelled, so that the BGA device 102 falls off and separates from the seal 125. Furthermore, the BGA device 102 that is completely separated from the circuit board 101 can be placed under a microscope, and the solder ball fracture surface can be observed to analyze the area and distribution of the solder joint fracture.

[0064] The above-disclosed are only the preferred embodiments of the present invention. Of course, the scope of rights of the present invention cannot be limited thereby. Therefore, equivalent changes made according to the scope of the patent application of the present invention still fall within the scope covered by the present invention.

Claims

1. A BGA device prying device, characterized in that For prying up a BGA device soldered to the surface of a circuit board, the prying-up device includes: A pulling-out component and a vacuum component. The pulling-out component includes a housing part, an inner core part, and a pulling-out part. The vacuum component is provided with a vacuum tube; Both end faces of the housing part are respectively provided with a movable groove and a connection hole. A guide groove extending vertically is provided on the side wall of the housing part. The movable groove communicates with the connection hole and the guide groove respectively; The inner core part is movably arranged in the movable groove in the vertical direction. A vacuum channel is arranged in the inner core part. Both ends of the vacuum channel extend to the side wall and the bottom end face of the inner core part respectively and are respectively formed as a first vacuum port and a second vacuum port. The first vacuum port is arranged corresponding to the guide groove and is connected to the vacuum tube. A threaded hole and a seal are respectively arranged on the top end face and the bottom end face of the inner core part. The seal is provided with a hollow channel communicating with the second vacuum port; The pulling-out part includes a threaded end and a gripping end. The threaded end partially passes through the connection hole and is threadedly connected to the threaded hole. A limiting part pressing on the top end face of the housing part is arranged on the part of the threaded end that does not pass through the connection hole. The limiting part is used to limit the pulling-out part from moving in the direction close to the inner core part; The vacuum component is used to extract the gas in the vacuum channel and the hollow channel through the vacuum tube, so that the BGA device is adsorbed on the seal. The bottom end of the housing part is pressed on the surface of the circuit board. When the pulling-out part is rotated through the gripping end, the threaded end is used to rotationally drive the inner core part to move away from the BGA device in the direction away from the BGA device, so that the BGA device is separated from the circuit board.

2. The BGA device prying device according to claim 1, characterized in that A guide groove communicating with the movable groove is provided on each of the four outer side walls of the housing part. Each guide groove extends downward to the bottom end face of the housing part.

3. The BGA device prying device according to claim 1, wherein, The limiting part includes a first limiting nut and a second limiting nut. The first limiting nut and the second limiting nut are threadedly connected to the threaded end in a vertically adjustable manner, so that both end faces of the second limiting nut are respectively abutted against the first limiting nut and the top end face of the housing part.

4. The BGA device prying device according to claim 3, characterized in that, A first gasket is further arranged between the first limiting nut and the second limiting nut. A second gasket is further arranged between the second limiting nut and the top end face of the housing part.

5. The BGA device prying device according to claim 1, wherein, The seal is an O-ring, and the O-ring is detachably fixedly connected to the bottom end face of the inner core part through an adhesive.

6. The BGA device prying device according to claim 1, characterized in that An installation channel is arranged around the second vacuum port on the bottom end face of the inner core part. The seal is installed in the installation channel, and the thickness of the seal is greater than the depth of the installation channel.

7. The BGA device prying device according to claim 6, characterized in that, A middle part and an annular part surrounding the middle part extend downward from the bottom end face of the inner core part. An installation channel is formed between the middle part and the annular part. The height of the middle part is less than the height of the annular part.

8. The BGA device prying device according to claim 1, wherein The vacuum assembly includes a vacuum generator, a solenoid valve and an air compressor. The vacuum generator includes a vacuum end and an air inlet end. The vacuum end is connected to the vacuum tube. The two ends of the solenoid valve are respectively connected to the air inlet end and the output end of the air compressor to control the connection or disconnection between the two. The vacuum generator is used to use the compressed air output by the air compressor to extract the air in the vacuum channel and the hollow channel connected to the vacuum tube.

9. A method for prying up a BGA device, characterized in that, A BGA device soldered on the surface of a circuit board is lifted up using the BGA device lifting device according to any one of claims 1 to 8, wherein the lifting method comprises: Pressing the bottom end of the housing member onto the surface of the circuit board; Adjusting the height of the lifting member so that the sealing member of the inner core member fits the BGA device; Adjusting the position of the stopper at the threaded end so that the stopper is pressed against the top end surface of the housing member; Controlling the vacuum assembly to extract gas in the vacuum channel and the hollow channel through the vacuum tube, so that the BGA device is adsorbed on the sealing member; The gripping end of the pulling member is rotated so that the threaded end is rotated to drive the inner core member to move in a direction away from the BGA device until the BGA device is separated from the circuit board.

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