High-heat-dissipation double-sided aluminum substrate, manufacturing method thereof, electronic device and storage medium

Abstract

The application discloses a high-heat-dissipation double-sided aluminum substrate and a manufacturing method thereof, an electronic device and a storage medium, and relates to the technical field of packaging substrates. The method comprises the following steps: obtaining an aluminum substrate through cutting; performing first drilling on the aluminum substrate to obtain a first through hole; filling the first through hole with a first resin; arranging an isolation pad plate around the aluminum substrate to form a to-be-pressed substrate; pressing a semi-cured sheet and a copper foil on two sides of the to-be-pressed substrate through a pressing mechanism to form a packaging substrate; performing second drilling on the packaging substrate to form a second through hole penetrating through the first resin; performing first electroplating copper deposition on the packaging substrate to form a through hole in the second through hole; filling the through hole with a second resin and performing second electroplating copper deposition on the packaging substrate; manufacturing a circuit on the surface of the copper foil; and cutting off the isolation area and the isolation pad plate through a CNC device. According to the method, the heat dissipation capacity can be improved, and the demand of high-power and high-current electronic products can be met.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of packaging substrates, in particular to a high-heat-dissipation double-sided aluminum substrate, a manufacturing method thereof, an electronic device and a storage medium. BACKGROUND

[0002] At present, with the development of the electronic industry, high-power and high-current electronic products are increasingly widely used, and the requirements for packaging substrates as electronic component carriers are also increasingly high, one of which is the requirement for heat dissipation effect. Since the power and current of such electronic products are large, a large amount of heat will be generated, and if the heat dissipation problem cannot be properly solved, the performance of the product will be greatly affected. The currently used heat dissipation method is to embed a copper block inside the FR4 packaging substrate to dissipate heat by the copper block. Although this method has a certain heat dissipation effect, as the internal circuit design of the packaging substrate becomes more and more dense and the electronic components become more and more numerous, the amount of heat generated also increases, and the heat dissipation efficiency of this method cannot meet the demand. SUMMARY

[0003] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application provides a high-heat-dissipation double-sided aluminum substrate, a manufacturing method thereof, an electronic device and a storage medium, which can improve the heat dissipation capacity and meet the demand of high-power and high-current electronic products.

[0004] In one aspect, the manufacturing method of the high-heat-dissipation double-sided aluminum substrate according to the embodiments of the present application comprises the following steps:

[0005] Obtaining an aluminum substrate by cutting;

[0006] Drilling the aluminum substrate once to obtain a first through hole;

[0007] Filling a first resin in the first through hole;

[0008] Setting an isolation pad around the aluminum substrate to form a to-be-pressed substrate;

[0009] Pressing a prepreg and a copper foil on both sides of the to-be-pressed substrate by a pressing mechanism to form a packaging substrate, wherein the copper foil has an isolation area around it which is adapted to the isolation pad;

[0010] Drilling the packaging substrate twice to form a second through hole which penetrates the first resin;

[0011] Electroplating copper on the packaging substrate once to form a through hole;

[0012] Filling a second resin in the through hole and electroplating copper on the packaging substrate twice;

[0013] making a circuit on the surface of the copper foil;

[0014] cutting off the isolation area and the isolation pad by a CNC device.

[0015] According to some embodiments of the present application, the step of forming a package substrate by pressing the copper foil and the prepreg on both sides of the substrate to be pressed comprises:

[0016] pressing a first prepreg and a first copper foil on a first surface of the substrate to be pressed;

[0017] opening a groove on a second surface of the aluminum substrate;

[0018] setting a composite heat-conductive material on the inner wall of the groove;

[0019] pressing a second prepreg and a second copper foil on a second surface of the substrate to be pressed; the second prepreg is provided with a window matched with the groove, and the second copper foil is provided with a heat-conductive bump embedded in the groove.

[0020] According to some embodiments of the present application, the step of opening a groove on a second surface of the aluminum substrate comprises:

[0021] cleaning the aluminum substrate by using a cleaning agent;

[0022] uniformly coating photoresist on the aluminum substrate by using a spin coating method;

[0023] exposing and developing the photoresist to form a window;

[0024] immersing the aluminum substrate in an etching solution to etch the groove at the window;

[0025] removing the photoresist.

[0026] According to some embodiments of the present application, the method further comprises:

[0027] setting a solder resist layer on the surface of the copper foil;

[0028] opening a window on the solder resist layer to form a solder pad;

[0029] carrying out electroplating on the solder pad.

[0030] According to some embodiments of the present application, the step of drilling the aluminum substrate once to obtain a first through hole comprises:

[0031] obtaining a test sample plate;

[0032] setting a plurality of groups of measurement deflection target holes on the surface of the test sample plate;

[0033] According to the preset drilling tape coefficient, the test sample plate is drilled to obtain a test drilling hole corresponding to a first group of the offset target holes;

[0034] When the offset degree of the test drilling hole and the first group of the offset target holes exceeds a preset value, the drilling tape coefficient is adjusted;

[0035] According to the adjusted drilling tape coefficient, the test sample plate is drilled to obtain a test drilling hole corresponding to a next group of the offset target holes, and the process is repeated until the offset degree of the test drilling hole and the current group of the offset target holes is lower than the preset value, and a final drilling tape coefficient is obtained;

[0036] According to the final drilling tape coefficient, a drilling tape is obtained, and the aluminum substrate is drilled once according to the drilling tape to obtain the first through hole;

[0037] The aluminum substrate is soaked in an alkaline cleaning solution for cleaning to remove aluminum scraps.

[0038] According to some embodiments of the present application, after the circuit is made on the surface of the copper foil, the method further comprises:

[0039] The packaging substrate is subjected to circuit AOI detection;

[0040] The detected packaging substrate is subjected to target hole drilling.

[0041] According to some embodiments of the present application, the pressing mechanism comprises a rack, a lower pressing mechanism arranged on the surface of the rack, a lifting mechanism arranged on the rack and above the lower pressing mechanism, and a discharging device arranged on one side of the lower pressing mechanism, the lifting mechanism is provided with a liftable upper pressing mechanism, the lower pressing mechanism is provided with a positioning groove, the bottom of the positioning groove is provided with a jacking mechanism, and the upper pressing mechanism and the lower pressing mechanism are both provided with a heating device; the pressing mechanism is used to press the semi-cured sheet and the copper foil on the double sides of the to-be-pressed substrate to form a packaging substrate, comprising:

[0042] After the semi-cured sheet and the copper foil are sequentially stacked on the double sides of the to-be-pressed substrate, the to-be-pressed substrate is placed in the positioning groove;

[0043] After the lifting mechanism drives the upper pressing mechanism to descend to a preset height, the upper pressing mechanism continues to descend to contact the lower pressing mechanism;

[0044] After the heating device preheats the upper pressing mechanism and the lower pressing mechanism to a preset temperature, the upper pressing mechanism and the lower pressing mechanism are pressurized to a preset pressure to press the to-be-pressed substrate, the semi-cured sheet and the copper foil to form a packaging substrate;

[0045] After the pressing, the heating device gradually reduces the temperature, and after the temperature reduction is completed, the upper pressing mechanism rises, and the lifting mechanism drives the upper pressing mechanism to reset;

[0046] The jacking mechanism pushes the packaging substrate to rise and leave the lower pressing mechanism, and the blanking device blanks the packaging substrate.

[0047] On the other hand, according to the high-heat-dissipation double-sided aluminum substrate of the embodiment of the application, the high-heat-dissipation double-sided aluminum substrate is made by the high-heat-dissipation double-sided aluminum substrate manufacturing method.

[0048] On the other hand, the electronic device according to the embodiment of the application comprises:

[0049] The memory is configured to store program instructions;

[0050] The processor is configured to invoke the program instructions stored in the memory and execute the high-heat-dissipation double-sided aluminum substrate manufacturing method according to the obtained program instructions.

[0051] On the other hand, the storage medium according to the embodiment of the application stores computer executable instructions, and the computer executable instructions are used to make the computer execute the high-heat-dissipation double-sided aluminum substrate manufacturing method.

[0052] The high-heat-dissipation double-sided aluminum substrate and the manufacturing method thereof, the electronic device, and the storage medium have at least the following beneficial effects: the aluminum substrate is used to replace the traditional FR4 copper-clad substrate, has better heat dissipation performance, and has high mechanical strength and is not easy to bend, which can improve product quality and manufacturing yield and meet the needs of high-power and high-current electronic products; the multiple drilling and multiple hole plugging can realize the conduction of different layers of lines and ensure the strength of the substrate; the isolation pad and the isolation area can protect the aluminum substrate during the manufacturing process of the substrate.

[0053] Additional aspects and advantages of the application will be described in part below with reference to the description and will be apparent from the description, or will be learned by practice of the application. BRIEF DESCRIPTION OF DRAWINGS

[0054] The above and / or additional aspects and advantages of the application will become apparent and be readily understood from the description, taken in conjunction with the accompanying drawings, in which:

[0055] Figure 1 The step flow chart of the high-heat-dissipation double-sided aluminum substrate manufacturing method of the embodiment of the application;

[0056] Figure 2 The structure schematic diagram of the aluminum substrate of the embodiment of the application;

[0057] Figure 3 A structure diagram of a substrate to be pressed for an embodiment of the present application;

[0058] Figure 4 A structure diagram of a packaging substrate for an embodiment of the present application;

[0059] Figure 5 A structure diagram of a packaging substrate with isolation regions and isolation pads removed for an embodiment of the present application;

[0060] Figure 6 A structure diagram of a packaging substrate for another embodiment of the present application;

[0061] Figure 7 A structure diagram of a pressing mechanism for an embodiment of the present application. DETAILED DESCRIPTION

[0062] Embodiments of the present application are described in detail below with reference to the attached drawings. The same or similar components have the same reference numbers and symbols throughout the drawings, and a detailed description thereof will not be repeated. The embodiments described below are exemplary and are intended to explain the present application, and should not be understood as limiting the present application. The step numbers in the following embodiments are set only for the convenience of explanation, and the order between the steps is not limited in any way, and the execution order of each step in the embodiments can be adaptively adjusted according to the understanding of those skilled in the art.

[0063] In the description of the present application, it should be understood that the orientation description, such as the orientation or position relationship indicated by up, down, front, back, left, right, etc. is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be understood as limiting the present application.

[0064] The terms "first", "second", "third", and "fourth" and the like in the description and claims of the present application and the accompanying drawings are used to distinguish different objects, and are not intended to describe a particular order. In addition, the terms "comprise" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but can optionally include steps or units not listed, or can optionally include other steps or units inherent to the process, method, product or device.

[0065] Reference to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase "in an embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily mutually exclusive of one another. It is expressly understood that any of the embodiments described herein can be combined with any of the other embodiments unless specifically noted otherwise.

[0066] At present, with the development of electronic industry, high-power and high-current electronic products are more and more widely used, and the requirements for packaging substrates as electronic component carriers are also higher, one of which is the requirement for heat dissipation effect. Since the power and current of such electronic products are large, high heat will be generated, and if the heat dissipation problem cannot be properly solved, the performance of the product will be greatly affected. The heat dissipation method currently used is usually to embed a copper block inside the FR4 packaging substrate to dissipate heat by the copper block. Although this method has a certain heat dissipation effect, as the internal circuit design of the packaging substrate becomes more and more dense and the electronic components become more and more numerous, the heat generated is also more and more, and the heat dissipation efficiency of this method cannot meet the demand.

[0067] Therefore, the embodiment of the application provides a high-heat-dissipation double-sided aluminum substrate, a manufacturing method thereof, an electronic device and a storage medium. By using an aluminum substrate instead of a traditional FR4 copper-clad substrate, better heat dissipation performance is achieved, and the aluminum substrate has high mechanical strength and is not easy to bend, which can improve product quality and manufacturing yield and meet the demand of high-power and high-current electronic products. By drilling multiple times and plugging multiple times, the conduction of lines of different layers can be realized, and the strength of the substrate can be ensured. By setting an isolation pad and an isolation area, the aluminum substrate can be well protected in the manufacturing process of the substrate.

[0068] The high-heat-dissipation double-sided aluminum substrate, the manufacturing method thereof, the electronic device and the storage medium of the embodiment of the application will be described in detail below with reference to the accompanying drawings.

[0069] On the one hand, as shown in Figure 1 The manufacturing method of the high-heat-dissipation double-sided aluminum substrate according to the embodiment of the application includes the following steps:

[0070] Step S100: cutting to obtain an aluminum substrate 100;

[0071] Specifically, as shown in Figure 2As shown, the aluminum substrate 100 has opposite first and second surfaces 110 and 120. When a circuit board is to be manufactured, the aluminum substrate 100 is first cut to size according to the design size. Compared with a conventional FR4 copper-clad substrate, the aluminum substrate 100 has better heat dissipation and mechanical strength, which can significantly improve the heat dissipation of the subsequent circuit board and improve the impact resistance of the circuit board to avoid bending and other problems of the circuit board during manufacturing.

[0072] Step S200: Drilling the aluminum substrate 100 once to obtain a first through hole;

[0073] Specifically, the aluminum substrate 100 can be drilled by mechanical drilling or laser drilling to form a first through hole. In this example, in order to improve the accuracy of drilling, the above step S200 includes the following steps:

[0074] Step S210: Obtain a test sample;

[0075] Step S220: Set a plurality of groups of offset target holes on the surface of the test sample;

[0076] Step S230: According to the preset drilling band coefficient, the test sample is trial drilled to obtain a trial drilling hole corresponding to the first group of offset target holes;

[0077] Step S240: When the deviation of the trial drilling hole and the first group of offset target holes exceeds the preset value, adjust the drilling band coefficient;

[0078] Step S250: According to the adjusted drilling band coefficient, the test sample is trial drilled to obtain a trial drilling hole corresponding to the next group of offset target holes. Repeat the process until the deviation of the trial drilling hole and the current group of offset target holes is less than the preset value, and obtain the final drilling band coefficient;

[0079] Step S260: According to the final drilling band coefficient, the drilling band is obtained, and the aluminum substrate 100 is drilled once according to the drilling band to obtain a first through hole;

[0080] Step S270: Soak the aluminum substrate 100 in an alkaline cleaning solution for cleaning to remove aluminum chips.

[0081] Specifically, first, a test sample plate for testing the drilling accuracy is obtained, and the material and characteristics of the test sample plate are the same as those of the aluminum substrate 100. A plurality of offset target holes are arranged on the surface of the test sample plate. It should be noted that the plurality of offset target holes correspond to the first through holes, and the plurality of first through holes are divided into a plurality of groups, and each group of first through holes has a corresponding group of offset target holes. Then, according to the preset drilling tape coefficient, the test sample plate is drilled to obtain a test drilling hole corresponding to the first group of offset target holes. If the test drilling hole substantially coincides with the offset target hole, it indicates that the drilling tape coefficient is accurate, and the current drilling tape coefficient can be used to set the drilling tape and drill the aluminum substrate 100. If the test drilling hole deviates from the offset target hole to a large extent, it indicates that the drilling tape coefficient has an error, and the drilling tape coefficient needs to be adjusted according to the deviation between the test drilling hole and the offset target hole, and the next group of offset target holes of the test sample plate is drilled. Repeat this process until the test drilling hole substantially coincides with the offset target hole. At this time, the final drilling tape coefficient can be determined. Finally, according to the final drilling tape coefficient, the drilling tape is obtained, and the aluminum substrate 100 is drilled according to the drilling tape to obtain the first through hole. After drilling, the aluminum substrate 100 is soaked in an alkaline cleaning solution for cleaning to remove aluminum chips generated during drilling. By first using the test sample plate to determine the accurate drilling tape coefficient, and then drilling the aluminum substrate 100, the drilling accuracy can be improved, the product quality can be guaranteed, and the product yield can be improved.

[0082] Step S300: filling the first resin in the first through hole;

[0083] Specifically, before filling the first resin, the first through hole can be roughened to enhance the adhesion between the first resin and the hole wall. Then, the first resin is filled into the first through hole by printing, pressure injection or vacuum filling, etc. to ensure that the first through hole is completely filled. Then, the first resin is hardened by high temperature baking to form a stable solid structure. Then, the first resin is ground to remove the part of the first resin that exceeds the surface of the first through hole. By filling the first resin in the first through hole, the purpose of insulation can be achieved, and the strength of the substrate can be enhanced to avoid bending and deformation of the substrate due to external force. By filling the resin to level the hole surface, the multi-layer interconnection technology is realized.

[0084] Step S400: arranging the isolation pad plate 200 around the aluminum substrate 100 to form the to-be-bonded substrate 300;

[0085] Specifically, the isolation pad plate 200 can be arranged around the aluminum substrate 100 by adhesion or the like, so that the isolation pad plate 200 can play a protective role for the four sides of the aluminum substrate 100. Since the aluminum substrate 100 is entirely made of aluminum material, when the aluminum substrate 100 is placed in a liquid such as electroplating liquid or etching liquid in the subsequent process, the isolation pad plate 200 can prevent the four side frames of the aluminum substrate 100 from reacting with the liquid, causing pollution or damage to the aluminum substrate 100.

[0086] Step S500: Forming the packaging substrate 600 by pressing the copper foil 500 and the prepreg 400 on both sides of the substrate 300 to be pressed by the pressing mechanism 700; wherein the copper foil 500 has a reserved isolation area 510 around the periphery thereof, which is adapted to the isolation pad 200;

[0087] Specifically, before pressing, the surfaces of the substrate 300 to be pressed and the copper foil 500 are pretreated, and the pretreatment step includes cleaning and removing the oxidation layer and other impurities to improve the subsequent pressing effect. After the pretreatment is completed, as shown in Figure 4 the aluminum substrate 100, the prepreg 400 and the copper foil 500 are sequentially arranged in layers, and then the aluminum substrate 100, the prepreg 400 and the copper foil 500 are pressed by the pressing mechanism 700 to form the packaging substrate 600. It should be noted that the copper foil 500 has a reserved isolation area 510 around the periphery thereof, which is adapted to the isolation pad 200, and the isolation area 510 needs to be removed in the subsequent process and does not need to participate in the production of the circuit.

[0088] Step S600: Forming a second through hole penetrating the first resin by secondary drilling the packaging substrate 600;

[0089] Specifically, since the first through hole is filled with the first resin and belongs to an insulating hole, it cannot conduct the circuit on the upper and lower surfaces of the packaging substrate 600, therefore, in order to realize the conduction of the circuit of different layers of the packaging substrate 600, the packaging substrate 600 needs to be secondary drilled on the basis of the first through hole, penetrating the copper foil 400 and the first resin, to form the second through hole.

[0090] Step S700: Forming a conductive hole by one-time electroplating copper on the packaging substrate 600;

[0091] By chemically depositing copper on the packaging substrate 600, a layer of chemical copper is attached to the inner wall of the second through hole, providing a conductive basis for subsequent electroplating, and then electroplating the packaging substrate 600 to realize the metallization of the second through hole, thereby obtaining the conductive hole.

[0092] Step S800: Filling the second resin in the conductive hole and performing secondary electroplating copper on the packaging substrate 600;

[0093] Specifically, the second resin is filled into the through hole by printing or pressure injection or vacuum filling, etc., to ensure that the through hole is completely filled, and then the second resin is hardened by high temperature baking to form a stable solid structure; then, the second resin is ground to remove the part of the second resin overflowing the surface of the through hole. By filling the second resin in the through hole, the strength of the packaging substrate 600 can be enhanced to avoid bending and deformation of the packaging substrate 600 due to external force, and the surface of the hole is filled with resin to realize the multi-layer interconnection technology and facilitate the manufacturing of fine lines.

[0094] Step S900: manufacturing a line on the surface of the copper foil 500;

[0095] Specifically, a photosensitive dry film is attached to the surface of the copper foil 500, and then the photosensitive dry film is exposed and developed to form a line pattern, and then the copper foil 500 is etched according to the line pattern to form a line on the surface of the copper foil 500. The through hole is used to connect the lines on the upper and lower surfaces of the packaging substrate 600.

[0096] Step S1000: cutting off the isolation area 510 and the isolation pad 200 by the CNC equipment;

[0097] Specifically, as shown in Figure 5 After the isolation area 510 and the isolation pad 200 are cut off by the cutting equipment, the final required line board is obtained.

[0098] According to the manufacturing method of the high-heat-dissipation double-sided aluminum substrate, the aluminum substrate 100 is used instead of the traditional FR4 copper-clad substrate, which has better heat dissipation performance, and the aluminum substrate 100 has high mechanical strength and is not easy to bend, which can improve product quality and production yield and meet the needs of high-power and high-current electronic products; by drilling multiple times and plugging multiple times, the lines of different layers can be connected, and the strength of the substrate can be ensured; by setting the isolation pad 200 and the isolation area 510, the aluminum substrate 100 can be well protected in the manufacturing process of the substrate.

[0099] Further, as shown in Figure 6 In some embodiments of the present application, the step S500 of pressing the semi-cured sheet 400 and the copper foil 500 on the two surfaces of the substrate to be pressed 300 by the pressing mechanism 700 to form the packaging substrate 600 includes the following steps:

[0100] Step S510: pressing the first semi-cured sheet 410 and the first copper foil 530 on the first surface 110 of the substrate to be pressed 300;

[0101] Step S520: opening a groove on the second surface 120 of the aluminum substrate 100;

[0102] Step S530: setting a composite heat-conducting material 130 on the inner wall of the groove;

[0103] Step S540: pressing the second prepreg 420 and the second copper foil 540 on the second surface 120 of the substrate 300 to be pressed; the second prepreg 420 is provided with a window matched with the groove, and the second copper foil 540 is provided with a heat-conducting bump 520 matched with the groove.

[0104] Specifically, first, a groove is formed on the second surface 120 of the aluminum substrate 100, and a composite heat-conducting material 130 is set on the inner wall of the groove, so that the composite heat-conducting material can enhance the heat conduction, and avoid the reaction caused by the direct contact between the aluminum substrate 100 and the heat-conducting bump 520. By setting the heat-conducting bump 520 on the second copper foil, when pressed, the heat-conducting bump 520 can be embedded in the groove, so that the heat-conducting bump 520 is in contact with the aluminum substrate 100 through the composite heat-conducting material 130, thereby further enhancing the heat dissipation performance and efficiency of the packaging substrate 600.

[0105] In the present example, in order to form a groove on the second surface of the aluminum substrate 100, the following four steps are included:

[0106] (1) using a cleaning agent to clean the aluminum substrate 100;

[0107] (2) using a spin coating method to uniformly coat photoresist on the aluminum substrate 100;

[0108] (3) exposing and developing the photoresist to form a window;

[0109] (4) immersing the aluminum substrate 100 in an etching solution to etch a groove at the window;

[0110] (5) removing the photoresist.

[0111] Specifically, first, the cleaning agent is used to remove the grease and oxides of the aluminum substrate 100, then the aluminum substrate 100 is rinsed with deionized water and dried. Then, a spin coating method is used to uniformly coat photoresist on the surface of the aluminum substrate 100, ensuring uniform coating thickness. Then the photoresist is exposed and developed to form a window at the position where the groove is to be formed, while the positions where the groove is not to be formed are protected by the photoresist. Then the aluminum substrate 100 is immersed in an etching solution, and the depth of the groove is adjusted by controlling the etching time. The longer the time, the greater the depth. After etching, the aluminum substrate 100 is taken out and rinsed with deionized water, and then an appropriate solvent is used to remove the remaining photoresist protective layer.

[0112] Further, in some embodiments of the present application, after the circuit is made on the surface of the copper foil 500, it further includes:

[0113] performing circuit AOI detection on the packaging substrate 600;

[0114] The encapsulation substrate 600 after detection is punched with a hole.

[0115] The line AOI detection is performed on the encapsulation substrate 600, so as to detect whether there is a problem in the line, and the product with the problem is removed to avoid the defective product from flowing out. Then, the encapsulation substrate 600 after detection is punched with a hole, so as to facilitate the positioning of the encapsulation substrate 600 by the target hole in the subsequent process.

[0116] Further, in some embodiments of the present application, the method for manufacturing the high-heat-dissipation double-sided aluminum substrate further comprises the following steps:

[0117] A solder resist layer is arranged on the surface of the copper foil 500;

[0118] The solder resist layer is windowed to form a solder pad;

[0119] The solder pad is electroplated with gold.

[0120] Specifically, the solder resist layer can prevent the area that does not need to be welded from being accidentally welded in the welding process, so as to protect the circuit element and prevent the short circuit phenomenon from occurring. Meanwhile, the solder resist layer can protect the copper layer from oxidation and corrosion, thereby prolonging the service life of the circuit board. In order to arrange the solder resist layer, the solder resist layer can be formed by coating solder resist ink and performing UV curing on the solder resist ink. After the solder resist layer is formed, the solder resist layer is windowed by means of film pasting, exposure and development, so as to expose the position of the solder pad. In order to prevent the surface of the solder pad from being oxidized, the surface of the solder pad is electroplated with gold, so as to protect the solder pad and reduce the wear and damage of the solder pad in the welding process, thereby prolonging the service life of the solder pad. After the solder resist layer is arranged, characters can be arranged on the encapsulation substrate 600, and processes such as lead-free tin spraying are performed. Finally, the encapsulation substrate 600 is cut, molded, finally measured, packaged and stored.

[0121] Further, as shown in Figure 7 the pressing mechanism 700 comprises a rack 710, a lower pressing mechanism 720 arranged on the surface of the rack 710, a lifting mechanism 730 arranged on the rack 710 and located above the lower pressing mechanism 720, the lifting mechanism 730 is provided with a liftable upper pressing mechanism 740, a positioning groove 750 is arranged in the lower pressing mechanism 720, a jacking mechanism 760 is arranged at the bottom of the positioning groove 750, the upper pressing mechanism 740 and the lower pressing mechanism 720 are both provided with a heating device 770, and a discharging device (not shown in the figure) is arranged on one side of the lower pressing mechanism 720. The above-mentioned step S400: the double-sided prepreg 400 and the copper foil 500 of the to-be-pressed substrate 300 are pressed by the pressing mechanism 700 to form the encapsulation substrate 600, which comprises:

[0122] After the double sides of the substrate 300 to be pressed are sequentially stacked with the prepreg 400 and the copper foil 500, the substrate 300 is placed in the positioning groove 750;

[0123] After the lifting mechanism 730 drives the upper pressing mechanism 740 to descend to the preset height, the upper pressing mechanism 740 continues to descend to contact the lower pressing mechanism 720.

[0124] After the heating device 770 preheats the upper pressing mechanism 740 and the lower pressing mechanism 720 to the preset temperature, the upper pressing mechanism 740 and the lower pressing mechanism 720 are pressurized to the preset pressure to press the substrate 300 to be pressed, the prepreg 400 and the copper foil 500, and form the packaging substrate 600.

[0125] After the pressing, the heating device 770 gradually lowers the temperature, the upper pressing mechanism 740 rises, and the lifting mechanism 730 drives the upper pressing mechanism 740 to reset.

[0126] The jacking mechanism 760 pushes the packaging substrate 600 to rise and leave the lower pressing mechanism 720, and the unloading device unloads the second substrate 500.

[0127] Specifically, in the present example, the lifting mechanism 730 includes a lifting rod 731, a screw rod 732 and a driver 733, the lifting rod 731 is threadedly connected with the screw rod 732, and the driver 733 is used to drive the screw rod 732 to rotate, thereby driving the lifting rod 731 to rise or descend. When pressing is required, the lifting rod 731 descends to a certain height and remains unchanged, while the upper pressing mechanism 740 continues to descend to contact the lower pressing mechanism 720 for pressing. It should be noted that the upper pressing mechanism 740 is also provided with a telescopic air rod for driving the lifting of the upper pressing mechanism 740. During pressing, the heating device 770 preheats the upper pressing mechanism 740 and the lower pressing mechanism 720 to the preset temperature, so that the prepreg 400 softens, and then high pressure is applied to make it flow and fill the gap, and high temperature is maintained until the prepreg 400 is completely cured. Subsequently, the temperature is slowly lowered to prevent internal stress. After the temperature is lowered to a certain extent, the upper pressing mechanism 740 rises, and the lifting mechanism 730 drives the upper pressing mechanism 740 to reset; then, the jacking mechanism 760 pushes the packaging substrate 600 to leave the lower pressing mechanism 720, facilitating the unloading device to unload the packaging substrate 600. The unloading device can include a moving mechanism, a suction cup and an unloading platform. When unloading is required, the moving mechanism drives the suction cup to move above the positioning groove, and then drives the suction cup to descend to adsorb the packaging substrate 600, and then the moving mechanism drives the suction cup to move to the unloading platform for unloading.

[0128] On the other hand, the present application also provides a high-heat-dissipation double-sided aluminum substrate made by the high-heat-dissipation double-sided aluminum substrate manufacturing method described in the above aspect.

[0129] According to the high-heat-dissipation double-sided aluminum substrate provided by the embodiment of the present application, the aluminum substrate 100 is used to replace the traditional FR4 copper-clad substrate, so that the heat dissipation performance is better, and the aluminum substrate 100 has high mechanical strength and is not easy to bend, thereby improving the product quality and the production yield and meeting the demand of the electronic product with high power and high current; the drilling and plugging are performed for multiple times, so that the conduction of the lines of different layers is realized and the strength of the substrate is ensured; the isolation pad 200 and the isolation area 510 are arranged, so that the aluminum substrate 100 is well protected in the manufacturing process of the substrate.

[0130] It should be noted that the content in the above method embodiments is applicable to the present embodiment, the function specifically implemented by the present embodiment is the same as that of the above method embodiments, and the beneficial effects achieved by the present embodiment are also the same as those achieved by the above method embodiments.

[0131] On the other hand, the embodiment of the present application also provides an electronic device, comprising:

[0132] The processor can be implemented in a general-purpose central processing unit (CPU), a microprocessor, an application specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute related programs to implement the technical solutions provided by the present application.

[0133] The memory can be implemented in a read only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory can store an operating system and other application programs. When the technical solutions provided by the embodiments of the present application are implemented by software or firmware, the related program codes are stored in the memory and are called and executed by the processor to implement the method for manufacturing the high-heat-dissipation double-sided aluminum substrate.

[0134] The embodiment of the present application also provides a storage medium, which is a computer readable storage medium, and the storage medium stores a computer program. When the computer program is executed by the processor, the method for manufacturing the high-heat-dissipation double-sided aluminum substrate is implemented.

[0135] Memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. In addition, the memory can include a high-speed random access memory, and can also include a non-transitory memory, such as at least one magnetic disk storage device, a flash memory device, or other non-transitory solid-state memory device. In some embodiments, the memory can optionally include a memory disposed remotely relative to the processor, which can be connected to the processor through a network. Examples of the above network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof. The above-described device embodiments are only illustrative, and units described as separate components can or can not be physically separated, implemented in one place, or distributed to multiple network units. Part or all of the modules can be selected according to actual needs to achieve the purpose of the present embodiment.

[0136] Those of ordinary skill in the art can understand that all or some steps in the above disclosed method and system can be implemented as software, firmware, hardware, and appropriate combinations thereof. Some or all physical components can be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, which can include computer storage media (or non-transitory media) and communication media (or transitory media). As known to those of ordinary skill in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules, or other data. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tapes, magnetic disk storage, or other magnetic storage devices, or any other medium that can be used to store desired information and can be accessed by a computer. In addition, as known to those of ordinary skill in the art, communication media typically includes computer readable instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transport mechanisms, and can include any information delivery medium.

[0137] The above is a specific description of the preferred embodiment of the present application, but the present application is not limited to the above-described embodiments, and those skilled in the art can make various equivalent modifications or replacements without departing from the spirit of the present application. These equivalent modifications or replacements are all included in the scope defined by the claims of the present application.

Claims

1. A method for manufacturing a high heat dissipating double-sided aluminum substrate, characterized by, The method comprises the following steps: Obtaining an aluminum substrate by cutting; Drilling the aluminum substrate once to obtain a first through hole; Filling the first through hole with a first resin; Setting an isolation pad around the aluminum substrate to form a substrate to be laminated; Forming a packaging substrate by laminating prepreg and copper foil on both surfaces of the substrate to be laminated by a lamination mechanism, wherein the copper foil is provided with an isolation area matching the isolation pad around the copper foil; Forming a second through hole penetrating the first resin by drilling the packaging substrate twice; Forming a via hole by electroplating copper on the packaging substrate once; Filling the via hole with a second resin and electroplating copper on the packaging substrate twice; Making a circuit on the surface of the copper foil; Cutting off the isolation area and the isolation pad by a CNC device.

2. The method of claim 1, wherein the high heat dissipating double-sided aluminum substrate is made by the steps of: The step of forming a packaging substrate by laminating prepreg and copper foil on both surfaces of the substrate to be laminated by a lamination mechanism comprises: ​ Laminating a first prepreg and a first copper foil on a first surface of the substrate to be laminated; Setting a groove on a second surface of the aluminum substrate; Setting a composite heat-conducting material on the inner wall of the groove; Laminating a second prepreg and a second copper foil on the second surface of the substrate to be laminated; the second prepreg is provided with a window matching the groove, and the second copper foil is provided with a heat-conducting bump embedded in the groove.

3. The method of claim 2, wherein the high heat dissipating double-sided aluminum substrate is made by the steps of: The step of setting a groove on the second surface of the aluminum substrate comprises: ​ Cleaning the aluminum substrate with a cleaning agent; Uniformly coating photoresist on the aluminum substrate by spin coating; Exposing and developing the photoresist to form a window; Immersion of the aluminum substrate in etching solution to etch the groove at the window; Removing the photoresist.

4. The method of claim 1, wherein the high heat dissipating double-sided aluminum substrate is made by the steps of: The method further comprises: ​ Setting a solder resist layer on the surface of the copper foil; Windowing the solder resist layer to form a solder pad; Electroplating the solder pad.

5. The method of claim 1, wherein the high heat dissipating double-sided aluminum substrate is made by the steps of: The step of drilling the aluminum substrate once to obtain a first through hole comprises: ​ Obtaining a test sample plate; Setting a plurality of groups of measurement deviation target holes on the surface of the test sample plate; Trial drilling the test sample plate according to a preset drilling tape coefficient to obtain a trial drilling hole corresponding to a first group of measurement deviation target holes; Adjusting the drilling tape coefficient when the deviation degree of the trial drilling hole and the first group of measurement deviation target holes exceeds a preset value; Trial drilling the test sample plate according to the adjusted drilling tape coefficient to obtain a trial drilling hole corresponding to a next group of measurement deviation target holes, and repeating the process until the deviation degree of the trial drilling hole and the current group of measurement deviation target holes is lower than the preset value to obtain a final drilling tape coefficient; Obtaining a drilling tape according to the final drilling tape coefficient, and drilling the aluminum substrate once according to the drilling tape to obtain the first through hole; Soaking the aluminum substrate in an alkaline cleaning solution for cleaning to remove aluminum chips.

6. The method of claim 1, wherein the high heat dissipating double-sided aluminum substrate is made by the steps of: After making a circuit on the surface of the copper foil, the method further comprises: ​ Performing line AOI detection on the packaging substrate; Performing target hole drilling on the detected packaging substrate.

7. The method of claim 1, wherein the method further comprises: The pressing mechanism includes a frame, a lower pressing mechanism disposed on the surface of the frame, a lifting mechanism disposed on the frame and located above the lower pressing mechanism, and a feeding device disposed on one side of the lower pressing mechanism. The lifting mechanism is provided with a liftable upper pressing mechanism. The lower pressing mechanism is provided with a positioning groove. A lifting mechanism is provided at the bottom of the positioning groove. Both the upper pressing mechanism and the lower pressing mechanism are provided with heating devices. The process of bonding a prepreg and copper foil to both sides of the substrate to be bonded using a bonding mechanism to form a packaging substrate includes: After stacking the prepreg and copper foil on both sides of the substrate to be laminated, place it in the positioning groove. After the lifting mechanism drives the upper pressing mechanism to descend to a preset height, the upper pressing mechanism continues to descend until it contacts the lower pressing mechanism; After the heating device preheats the upper pressing mechanism and the lower pressing mechanism to a preset temperature, the upper pressing mechanism and the lower pressing mechanism apply pressure to a preset pressure to press the substrate to be pressed, the prepreg and the copper foil to form an encapsulation substrate; After pressing, the heating device gradually lowers the temperature. After the temperature is lowered, the upper pressing mechanism rises, and the lifting mechanism drives the upper pressing mechanism to reset. The lifting mechanism pushes the packaging substrate upward, away from the lower pressing mechanism, and the unloading device unloads the packaging substrate.

8. An electronic device, comprising: include: Memory, used to store program instructions; A processor is configured to call program instructions stored in the memory and execute the high heat dissipation double-sided aluminum substrate manufacturing method according to any one of claims 1-7.

9. A storage medium, characterized by The storage medium stores computer-executable instructions for causing a computer to perform the high heat dissipation double-sided aluminum substrate manufacturing method according to any one of claims 1-7.

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