Waste collecting device after processing of patch circuit board

Abstract

The invention discloses a waste collecting device after surface-mounted circuit board processing, and relates to the field of surface-mounted circuit boards, the waste collecting device comprises a processing table and a frame, the top of the frame is provided with a driving assembly, the output end of the driving assembly is connected with a sliding plate, and the bottom of the sliding plate is slidably provided with a solder paste head; a containing plate is arranged in the machining table, a fixing plate is arranged at the bottom of the containing plate of the machining table, a special-shaped groove is formed in the fixing plate, clamping plates are symmetrically arranged on the two sides of the containing plate, and a limiting block is arranged on one side of a sliding plate. A clamping plate slides downwards under the action of a special-shaped groove, so that kraft paper and a circuit board are limited by the clamping plate, an electric sliding rail continuously drives a placing plate to slide towards one side subsequently, limiting of the kraft paper is automatically relieved, and a scraper on a reciprocating screw rod can slide back and forth conveniently under meshing of a toothed rod and a fixed gear, so that the kraft paper is prevented from being scraped. And the solder paste on the kraft paper can be uniformly smeared.

Description

Technical Field

[0001] The present invention relates to the field of patch circuit boards, and specifically to a waste collection device for patch circuit boards after processing. Background Art

[0002] The production of circuit boards is a process of forming electronic products with specific functions through design, manufacturing, and assembly of electronic components. Among them, patch circuit boards are widely used. The current processing techniques for patch circuit boards are divided into four types, namely single-sided mounting process, double-sided mounting process, mixed mounting board mounting process, and double-sided mixed batch production mounting process. The single-sided mounting process includes incoming inspection, solder paste printing, inspection of printing effect, chip mounting, inspection of chip mounting effect, setting of vehicle reflow soldering process, reflow soldering, and inspection of soldering effect and final detection.

[0003] In the actual processing of existing patch circuit boards, the circuit boards are manually placed at the designated positions, and then kraft paper corresponding to the patch holes is attached to the upper surface of the circuit boards. The kraft paper and the circuit boards are clamped through a limiting mechanism. The staff applies solder paste on the kraft paper and manually levels it with a squeegee, which reduces the overall processing efficiency. Subsequently, the kraft paper is torn off, so that the solder paste is accurately and evenly located on the circuit board, facilitating the subsequent chip mounting by the staff. However, this working process is too wasteful of human and material resources. When collecting the waste kraft paper, it is necessary to manually release the limiting mechanism before it can be collected, which greatly increases the collection burden of the staff for the waste kraft paper.

[0004] In summary, the above structure needs to be manually leveled in the actual processing process, which reduces the overall processing efficiency, and when collecting the waste kraft paper, it is necessary to manually release the limiting mechanism before it can be collected, which greatly increases the collection burden of the staff for the waste kraft paper. Summary of the Invention

[0005] Based on this, the purpose of the present invention is to provide a waste collection device for patch circuit boards after processing, so as to solve the technical problems that manual leveling reduces the overall processing efficiency, and it is necessary to manually release the limiting mechanism before collecting the waste, which greatly increases the collection burden of the staff for the waste kraft paper.

[0006] To achieve the above object, the present invention provides the following technical solution: A waste collection device after processing a patch circuit board, including a processing table and a frame. The frame is located on the top of the processing table. A driving component is provided on the top of the frame, and the output end of the driving component penetrates into the frame and is connected to a sliding plate. A solder paste head is slidably arranged at the bottom of the sliding plate. An array of placing plates is slidably arranged inside the processing table, and a fixing plate is arranged at the bottom of the placing plate. A special-shaped groove is installed on the fixing plate, and an array of clamping plates cooperating with the special-shaped groove are symmetrically arranged on both sides of the placing plate; A limiting block is arranged on one side of the sliding plate, and a toothed rod is connected to one side of the limiting block. A reciprocating lead screw cooperating with the toothed rod is rotatably arranged on the processing table on one side of the frame through the engagement of a transmission component. A scraping plate is slidably arranged on the outer wall of the reciprocating lead screw.

[0007] By adopting the above technical solution, the placing plate is driven to move under the action of an electric slide rail. At this time, under the action of the special-shaped groove, the clamping plate slides downward, thereby completing the limiting work of the clamping plate on the kraft paper and the circuit board. After the subsequent coating is completed, the electric slide rail continues to drive the placing plate to slide to one side. At this time, the special-shaped groove causes the clamping plate to reset upward and jack up, thereby automatically releasing the limit on the kraft paper. Through the engagement of the toothed rod and the fixed gear, the transmission mechanism rotates, thereby causing the reciprocating lead screw to rotate, facilitating the reciprocating sliding of the scraping plate on the reciprocating lead screw, and realizing the even spreading of the solder paste on the previous group of kraft paper.

[0008] The present invention is further provided that the scraping plate includes a sliding plate and a rotating plate, and a driving motor is connected between the sliding plate and the rotating plate. The front end of the rotating plate is respectively provided with a first curved surface and a second curved surface. The inclination angle of the first curved surface in the vertical direction is 25° - 35°, and the inclination angle of the second curved surface in the horizontal direction is 30° - 50°.

[0009] Preferably, under the cooperation of the first curved surface and the second curved surface, when the turntable moves to one side, the solder paste will spread to both sides of the second curved surface. When the rotating plate moves to the middle position, the solder paste will spread to both sides of the second curved surface. At this time, under the action of electronic components, the rotating plate itself rotates, thereby realizing the more even spreading of the solder paste on the kraft paper.

[0010] The present invention is further provided that the driving component is a cylinder, and the cylinder is used to drive the sliding plate at the output end to slide up and down reciprocally.

[0011] Preferably, under the action of the cylinder, it is convenient for the staff to control the up and down sliding direction of the sliding plate, further improving the solder paste extrusion effect of the solder paste head at the bottom.

[0012] The present invention is further configured such that an electric slide rail is provided inside the processing table, and electric sliders cooperating with the electric slide rail are provided on both sides of the placement plate.

[0013] Preferably, under the action of the electric slide rail, the electric slider makes a fixed-distance slide inside the processing table, thereby driving the placement plate to move to a specified position each time.

[0014] The present invention is further configured such that clamping grooves are provided on both sides of the placement plate at the position of the clamping plates, and clamping blocks cooperating with the clamping grooves are slidably provided inside the clamping plates. An elastic component is provided at the bottom of the clamping block inside the clamping groove.

[0015] Preferably, when the clamping plate is in the special-shaped groove in the initial state, the internal elastic component is in a stretched state by itself. At this time, it is convenient for the staff to place the circuit board and kraft paper in the placement plate. When the electric slider slides towards the special-shaped groove, under the reset action of the elastic component itself, the clamping plate can move downward, thereby realizing the limiting work of the clamping plate on the circuit board and kraft paper, ensuring that the kraft paper will not shift in position on the circuit board during the subsequent coating process.

[0016] The present invention is further configured such that a fixed gear is engaged with one side of the toothed rod, and a transmission mechanism is connected to one end of the fixed gear, and the other end of the transmission mechanism is connected to the reciprocating lead screw.

[0017] Preferably, during the process of the toothed rod sliding to one side through the limit block, it will drive the fixed gear on one side to rotate. Thus, under the action of the transmission mechanism, the reciprocating lead screw on one side of the processing table located inside the frame rotates.

[0018] The present invention is further configured such that a sliding groove cooperating with the limit block is provided inside the frame.

[0019] Preferably, the cooperation of the limit block and the sliding groove ensures that the sliding plate slides in the vertical direction inside the frame, further preventing the sliding plate from tilting during the movement process.

[0020] The present invention is further configured such that the transmission mechanism includes a driving disk, a transmission belt, and a driven disk. The driving disk and the driven disk are connected by the transmission belt. One end of the driving disk is connected to the fixed gear, and one end of the driven disk is connected to the reciprocating lead screw. The diameter of the driving disk in the transmission mechanism is larger than the diameter of its driven disk.

[0021] Preferably, when the fixed gear rotates under the action of the toothed rod, it drives the driving disc at one end to rotate. Under the action of the transmission belt, the driven disc rotates accordingly, thereby driving the reciprocating screw rod to rotate. In the transmission mechanism, the diameter of the driving disc is larger than that of the driven disc. Therefore, during the rotation of the fixed gear, the reciprocating screw rod rotates at several times the rotation speed, ensuring that the scraper can slide back and forth on the kraft paper multiple times, improving the evenness of the solder paste applied on the kraft paper.

[0022] The present invention is further configured such that an electric suction cup is provided at the inner bottom of the clamping plate.

[0023] Preferably, during the process of the clamping plate sliding downward to limit the kraft paper and the circuit board, the electric suction cup contacts the kraft paper, and the electric suction cup is activated to adsorb the kraft paper. When the clamping plate slides upward to reset during the subsequent sliding process, the electric suction cup sucks up the processed kraft paper, facilitating the subsequent manipulator assembly to pick up the kraft paper, thereby completing the rapid collection of waste materials.

[0024] The present invention is further configured such that a rough surface is provided inside the placement plate.

[0025] Preferably, the setting of the rough surface increases the sliding friction between the placement plate and the circuit board, preventing the circuit board and the kraft paper from shifting in position during movement.

[0026] In summary, the present invention mainly has the following beneficial effects: In the present invention, a fixed plate is provided inside the processing table, and a special-shaped groove is provided on the fixed plate. The staff places the circuit board and the kraft paper on the placement plate, and then drives the solder paste head to slide down through the cylinder to squeeze the solder paste on the kraft paper. Subsequently, the placement plate is driven to move under the action of the electric slide rail. At this time, under the action of the special-shaped groove, the clamping plate slides downward, thereby completing the limiting work of the clamping plate on the kraft paper and the circuit board. After the subsequent coating is completed, the electric slide rail continues to drive the placement plate to slide to one side. At this time, the special-shaped groove causes the clamping plate to reset and lift upward, thereby automatically releasing the limit on the kraft paper. During this process, there is no need for manual clamping of the kraft paper by the staff, reducing the collection burden of the staff and facilitating the subsequent manipulator assembly to uniformly collect the kraft paper waste; In the present invention, a scraper is slidably provided on one side of the frame. When the solder paste head needs to extrude the solder paste onto a new set of circuit boards, the sliding plate will move downward. During this process, the transmission mechanism rotates under the meshing of the toothed rod and the fixed gear, thereby causing the reciprocating screw rod to rotate, facilitating the reciprocating sliding of the scraper on the reciprocating screw rod to evenly spread the solder paste on the previous set of kraft paper. During this processing process, there is no need for manual smearing, further reducing the overall processing burden and improving the overall processing efficiency; In the present invention, the scraping plate is divided into a sliding plate and a rotating plate. The front end of the rotating plate is provided with a first curved surface and a second curved surface. During the process of the reciprocating screw rod driving the turntable to slide to one side, since the toothed blocks are locally arranged on the toothed rod, only the sliding plate will be driven to move to the middle position of the placing plate. Under the cooperation of the first curved surface and the second curved surface, when the turntable moves to one side, the solder paste will spread to both sides of the second curved surface. When the rotating plate moves to the middle position, the solder paste will spread to both sides of the second curved surface. At this time, under the action of the electronic components, the rotating plate itself rotates, thereby realizing more uniform spreading of the solder paste on the kraft paper. In this process, the spreading uniformity of the solder paste on the kraft paper is improved, and further, the position of the solder paste on the circuit board is accurate and uniform. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is the front perspective view of the present invention; Figure 2 is the rear perspective view of the present invention; Figure 3 is the sectional view of the special-shaped groove of the present invention; Figure 4 is the top view of the present invention; Figure 5 is the structural schematic diagram of the placing plate of the present invention; Figure 6 is the structural schematic diagram of the transmission mechanism of the present invention; Figure 7 of the present invention Figure 2 is the enlarged view of A in; Figure 8 of the present invention Figure 3 is the enlarged view of B in; Figure 9 is the partial structural schematic diagram of the second embodiment of the present invention.

[0028] Description of the Reference Numerals: 1, processing table; 2, frame; 3, cylinder; 4, reciprocating screw rod; 5, placing plate; 6, electric slide rail; 7, fixing plate; 8, clamping plate; 9, transmission mechanism; 10, sliding plate; 11, solder paste head; 12, chute; 13, special-shaped groove; 14, electric slider; 15, limiting block; 16, toothed rod; 17, fixed gear; 18, scraping plate; 19, clamping block; 20, elastic component; 21, clamping groove; 22, sliding plate; 23, rotating plate; 2301, first curved surface; 2302, second curved surface. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0029] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as a limitation to the present invention.

[0030] The embodiments of the present invention will be described below according to its overall structure. Embodiment 1

[0031] Please refer to Figures 1 - 8 A waste collection device after processing a patch circuit board, including a processing table 1, a frame 2, a smearing mechanism, a sliding mechanism, a clamping mechanism and a transmission mechanism 9. A plurality of sets of placement plates 5 are slidably arranged inside the processing table 1. An electric slide rail 6 is arranged inside the processing table 1, and electric sliders 14 cooperating with the electric slide rail 6 are arranged on both sides of the placement plate 5. Under the action of the electric slide rail 6, the electric sliders 14 perform fixed-distance sliding inside the processing table 1, thereby driving the placement plate 5 to move to a specified position each time; The staff places the circuit board to be patched and kraft paper inside the placement plate 5 through the manipulator assembly. Then, the air cylinder 3 at the top of the frame 2 is started. Since the output end of the air cylinder 3 penetrates into the frame 2 and is connected to a sliding plate 10, and a solder paste head 11 is slidably arranged at the bottom of the sliding plate 10, a chute 12 cooperating with a limit block 15 is opened inside the frame 2. The cooperation between the limit block 15 and the chute 12 ensures that the sliding plate 10 slides vertically inside the frame 2. At this time, when the sliding plate 10 moves to a specified height, the solder paste in the solder paste head 11 is extruded onto the kraft paper for subsequent smearing. Then, the electric slide rail 6 is started to drive the placement plate 5 to slide to one side of the frame 2 until it slides to the bottom of the scraper 18. Since a fixing plate 7 is arranged at the bottom of the placement plate 5, a special-shaped groove 13 is installed on the fixing plate 7, and a plurality of sets of clamping plates 8 cooperating with the special-shaped groove 13 are symmetrically arranged on both sides of the placement plate 5. At this time, under the action of the special-shaped groove 13, the clamping plates 8 slide downward, thereby completing the limiting work of the clamping plates 8 on the kraft paper and the circuit board; And a new set of placement plates 5 will move back to the bottom of the frame 2. At this time, the air cylinder 3 will drive the sliding plate 10 at the output end to slide downward again. Since a limiting block 15 is provided on one side of the sliding plate 10, and a toothed rod 16 is connected to one side of the limiting block 15. A fixed gear 17 is engaged with one side of the toothed rod 16, and a transmission mechanism 9 is connected to one end of the fixed gear 17. The other end of the transmission mechanism 9 is connected to the reciprocating lead screw 4. During the process of the toothed rod 16 sliding to one side through the limiting block 15, it will drive the fixed gear 17 on one side to rotate. Thus, under the action of the transmission mechanism 9, the reciprocating lead screw 4 on one side of the frame 2 on the processing table 1 rotates. At this time, the scraper 18 can slide under the action of the reciprocating lead screw 4, so as to realize the uniform coating of the solder paste on the kraft paper at the bottom of the scraper 18. During this processing process, there is no need for manual coating, which further reduces the overall processing burden and improves the overall processing efficiency; Subsequently, after the air cylinder 3 extrudes the solder paste, it drives the sliding plate 10 to reset. During this process, the toothed rod 16 drives the fixed gear 17 to reverse, so that the scraper 18 follows to reset. At this time, the electric slide rail continues to drive the placement plate 5 to slide to one side. At this time, the special-shaped groove 13 makes the clamping plate 8 reset upward, thereby automatically releasing the limit on the kraft paper. During this process, there is no need for manual clamping of the kraft paper. At the same time, the kraft paper and the circuit board are separated and collected by the manipulator components on both sides. During this process, the collection burden of the staff is reduced, and it is convenient for the subsequent manipulator components to uniformly collect the kraft paper waste.

[0032] In the above embodiment, specifically, please refer to again Figure 3 and Figure 7 ., clamping grooves 21 are provided at the clamping plates 8 on both sides of the placement plate 5, and a clamping block 19 that cooperates with the clamping grooves 21 is slidably arranged inside the clamping plates 8. An elastic component 20 is arranged at the bottom of the clamping block 19 inside the clamping grooves 21. In the initial state, when the clamping plates 8 are in the special-shaped groove 13, the internal elastic component 20 is in a stretched state by itself. At this time, it is convenient for the staff to place the circuit board and the kraft paper in the placement plate 5. When sliding the electric slider 14 to one side of the special-shaped groove 13, under the reset action of the elastic component 20 itself, the clamping plate 8 can be moved downward, so as to realize the limiting work of the clamping plate 8 on the circuit board and the kraft paper, ensuring that the kraft paper will not shift in position on the circuit board during the subsequent coating process.

[0033] In the above embodiment, specifically, please refer to again Figure 1 and Figure 6, wherein the transmission mechanism 9 includes a driving disk, a transmission belt and a driven disk. One end of the driving disk is connected to the fixed gear 17, and one end of the driven disk is connected to the reciprocating lead screw 4. When the fixed gear 17 rotates under the action of the rack 16, it will drive the driving disk at one end to rotate. Through the action of the transmission belt, the driven disk will follow to rotate, thereby driving the reciprocating lead screw 4 to rotate. Since the diameter of the driving disk in the transmission mechanism 9 is larger than that of its driven disk, during the rotation of the fixed gear 17, the reciprocating lead screw 4 will rotate at a multiple rotation rate, ensuring that the scraper 18 can slide back and forth on the kraft paper multiple times, improving the evenness of the solder paste smeared on the kraft paper. Embodiment 2

[0034] Please refer to Figure 9 A waste collection device after processing a patch circuit board as shown. The overall structure is similar to that of Embodiment 1. The scraper 18 includes a sliding plate 22 and a rotating plate 23, and a driving motor is connected between the sliding plate 22 and the rotating plate 23. A first curved surface 2301 and a second curved surface 2302 are respectively arranged at the front end of the rotating plate 23. Since tooth blocks are locally arranged on one side of the rack 16, during the process of the sliding plate 10 driving the rack 16 to slide downward, the rack 16 will only drive the fixed gear 17 to rotate a certain number of turns. During this process, the reciprocating lead screw 4 rotates a certain number of turns, so that the sliding plate 22 can be driven to the middle position of the placement plate 5 every time it slides downward. During the process of the sliding plate 22 driving the rotating plate 23 to slide to one side, since the inclination angle of the first curved surface 2301 in the vertical direction is 30°, and the inclination angle of the second curved surface 2302 in the horizontal direction is 40°, under the cooperation of the first curved surface 2301 and the second curved surface 2302, when moving to one side, the solder paste will spread to both sides of the second curved surface 2302; When the rotating plate 23 moves to the middle position, the solder paste will spread to both sides of the second curved surface 2302. At this time, the rotating plate 23 rotates itself under the action of the driving motor, thereby realizing more evenly smearing the solder paste on the kraft paper. During this process, the evenness of the solder paste smeared on the kraft paper is improved, and further the position of the solder paste on the circuit board is accurate and uniform.

[0035] When the present invention is in specific operation: During use, the circuit board to be pasted and the kraft paper are placed on the top of the placement plate 5 by means of the manipulator assembly. Subsequently, the electric slide rail 6 inside the processing table is started. Under the action of the electric slide rail 6 and the electric slider 14, the placement plate 5 is driven to slide to one side to the bottom of the frame 2. At this time, the air cylinder 3 at the top of the frame 2 is started to drive the sliding plate 10 to slide downward. At this time, the solder paste head 11 moves to the top of the kraft paper, and the solder paste inside is extruded onto the kraft paper through the solder paste head 11. Subsequently, the air cylinder drives the sliding plate 10 to reset, and the electric slider 14 continues to move to one side. During this process, through the cooperation of the clamping plate 8 and the special-shaped groove 13, the clamping plate 8 slides downward, and the limiting work of the kraft paper and the circuit board is completed during this process, without manual limiting. At the same time, when the clamping plate 8 limits the kraft paper and the circuit board, the air cylinder 3 will drive the solder paste head 11 at the output end to continue to slide downward, and extrude the solder paste onto a new set of circuit boards and kraft paper to be pasted. Since a limiting block 15 is provided on one side of the sliding plate 10, the limiting block 15 drives the toothed rod 16 to slide downward. Under the cooperation of the fixed gear 17 and the transmission mechanism 9, the reciprocating screw rod on one side of the frame 2 rotates. During this process, the scraper 18 will smear the solder paste on the kraft paper in the limited state. Subsequently, when the air cylinder 3 resets, it drives the scraper 18 to reset to one side, and the placement plate 5 is moved to the position where the material is to be taken by means of the electric slide rail 6. At this time, the clamping plate 8 moves upward through the special-shaped groove 13 to release the limiting work on the circuit board and the kraft paper. At this time, the kraft paper and the circuit board are separated and taken and collected by means of the manipulator assembly. During this process, there is no need to manually limit and clamp the kraft paper, and it is convenient for the subsequent manipulator assembly to uniformly collect the kraft paper waste.

[0036] Although the embodiments of the present invention have been shown and described, the specific embodiments are only explanations of the present invention and are not limitations of the invention. The specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art can make modifications, substitutions and variations without creative contributions to the embodiments according to needs, but as long as they are within the scope of the claims of the present invention, they are protected by the patent law.

Claims

1. A waste collection device after processing a patch circuit board, comprising a processing table (1) and a frame (2), the frame (2) being located on top of the processing table (1), characterized in that: A driving component is provided at the top of the frame (2), and the output end of the driving component penetrates into the frame (2) and is connected to a sliding plate (10). A solder paste head (11) is slidably arranged at the bottom of the sliding plate (10). A plurality of placing plates (5) are slidably arranged inside the processing table (1), and a fixing plate (7) is arranged at the bottom of the placing plate (5). A special-shaped groove (13) is installed on the fixing plate (7), and a plurality of clamping plates (8) matched with the special-shaped groove (13) are symmetrically arranged on both sides of the placing plate (5). A limiting block (15) is arranged on one side of the sliding plate (10), and a toothed rod (16) is connected to one side of the limiting block (15). A reciprocating lead screw (4) matched with the toothed rod (16) is rotatably arranged on one side of the frame (2) on the processing table (1) through the meshing of a transmission component. A scraping plate (18) is slidably arranged on the outer wall of the reciprocating lead screw (4).

2. The waste collection device for a patch circuit board after processing according to claim 1, wherein: The scraping plate (18) comprises a sliding plate (22) and a rotating plate (23), and a driving motor is connected between the sliding plate (22) and the rotating plate (23). A first curved surface (2301) and a second curved surface (2302) are respectively arranged at the front end of the rotating plate (23), wherein the inclination angle of the first curved surface (2301) in the vertical direction is 25° - 35°, and the inclination angle of the second curved surface (2302) in the horizontal direction is 30° - 50°.

3. The waste collection device for a patch circuit board after processing according to claim 1, characterized in that: The driving component is a cylinder (3), and the cylinder (3) is used to drive the sliding plate (10) at the output end to slide up and down reciprocally.

4. The waste collection device for the processed patch circuit board according to claim 1, characterized in that: An electric slide rail (6) is arranged inside the processing table (1), and electric sliders (14) matched with the electric slide rail (6) are arranged on both sides of the placing plate (5).

5. The waste collection device for a patch circuit board after processing according to claim 1, characterized in that: Card slots (21) are formed at both sides of the placing plate (5) at the clamping plates (8), and clamping blocks (19) matched with the card slots (21) are slidably arranged inside the clamping plates (8). An elastic component (20) is arranged at the bottom of the clamping block (19) inside the card slot (21).

6. The waste collection device after processing of a patch circuit board according to claim 1, characterized in that: A fixed gear (17) is meshed with one side of the toothed rod (16), and a transmission mechanism (9) is connected to one end of the fixed gear (17). The other end of the transmission mechanism (9) is connected to the reciprocating lead screw (4).

7. A waste collection device for a patch circuit board after processing according to claim 1, characterized in that: A sliding groove (12) matched with the limiting block (15) is formed inside the frame (2).

8. The waste collection device for the processed patch circuit board according to claim 6, characterized in that: The transmission mechanism (9) comprises a driving disc, a transmission belt and a driven disc. The driving disc and the driven disc are connected by the transmission belt. One end of the driving disc is connected to the fixed gear (17), and one end of the driven disc is connected to the reciprocating lead screw (4). The diameter of the driving disc in the transmission mechanism (9) is larger than that of its driven disc.

9. The waste collection device after processing of a patch circuit board according to claim 1, wherein: An electric suction cup is arranged at the inner bottom of the clamping plate (8).

10. The waste collection device for a processed patch circuit board according to claim 1, wherein: A rough surface is arranged inside the placing plate (5).

Images