Device for cooling electronic component, in particular of motor vehicle

Abstract

The invention relates to a device for cooling an electronic component (14), in particular an electronic component (14) of a motor vehicle, comprising at least one steam chamber (22), which comprises at least one connection surface (24), which is designed to be in heat-conducting contact with the electronic component (14) to be cooled, said connection surface (24) being designed to be movable, the steam chamber (22) is configured such that the coupling surface (24) can apply a force to the electronic component (14) to be cooled, the steam chamber (22) comprising at least one means (30, 34, 36) for applying the force.

Description

Technical Field

[0001] The present invention relates to a device for cooling electronic components, in particular electronic components of a motor vehicle. Background Art

[0002] DE 10 2021 203 625 A1 relates to a semiconductor device. The semiconductor device has at least one semiconductor device. The semiconductor device also has at least one heat sink. The semiconductor device is thermally conductively connected to the heat sink. According to the invention, the semiconductor device has a mating support, wherein the heat sink is at least indirectly connected to the mating support. The semiconductor device also has a pressing element, wherein the pressing element is arranged in an intermediate space extending between the semiconductor device and the mating support. The pressing element has a plastic foam designed to expand. The plastic foam is designed to generate pressure upon expansion and press the semiconductor element against the heat sink, and is supported relative to the mating support therewith. Summary of the Invention

[0003] The object of the present invention is to ensure reliable heat dissipation of electronic components.

[0004] The heat transfer between the electronic component to be cooled and the heat sink can be improved in such a way that the coupling surface is designed to be movable, so that the coupling surface can exert a force on the electronic component to be cooled, wherein the vapor chamber includes at least one mechanism for exerting a force. Thereby, just when cooling a control device with high power, the heat path can be optimized. In the case of the selected combination, the functions for gap minimization and heat dissipation are integrated and combined in one component, namely the vapor chamber, to save space and cost.

[0005] In an advantageous refinement, the coupling surface is designed such that the coupling surface can exert a force on the electronic component to be cooled by prestress. Through this elastic action, sufficient force for gap minimization can be achieved particularly simply. Particularly advantageously, a spring and / or at least one collapsible wall portion and / or at least one snap mechanism are provided as the mechanism for exerting a force.

[0006] Particularly advantageously, the vapor chamber is connected to the circuit board and / or to the housing, in particular by cooperation with at least one fixing mechanism, wherein the electronic component to be cooled is arranged on the circuit board. Thereby, a compact component can be realized, which particularly robustly ensures gap minimization.

[0007] Particularly advantageously, the coupling surface is designed to be movable in a film-like manner. Thereby, a large area can be achieved for heat transfer. Particularly advantageously, the coupling surface is made of a flexible material, whereby the flexible material can particularly well adapt to the profile of the surface of the electronic component to be cooled.

[0008] In an advantageous improved form, the joining surface is designed to be movable relative to the base body of the steam chamber by means of at least one bellows. Thereby, a planar movement of the joining surface relative to the surface of the electronic component to be cooled can be achieved particularly simply.

[0009] In an advantageous improved form, the steam chamber includes at least one extension for receiving at least one fixing mechanism for fixing to a circuit board and / or a housing. Thereby, a particularly stable mounting of the steam chamber can be achieved.

[0010] In an advantageous improved form, the steam chamber has a cavity at least partially filled with a cooling medium, and heat is dissipated from the joining surface by switching the aggregation state of the cooling medium. Thereby, effective heat dissipation can already be achieved with a relatively small temperature difference.

[0011] In an advantageous improved form, it is proposed that the spring includes at least one capillary-shaped structure. Thereby, specific typical functions for the steam chamber can be integrated.

[0012] Other advantageous improved forms can be derived from the description. Description of the Drawings

[0013] Figure 1 Schematic view showing a device having a spring inside a steam chamber

[0014] Figure 2 Schematic view showing another embodiment of a device having a collapsible wall portion or jacket of a steam chamber

[0015] Figure 3 Schematic view showing another embodiment of a device having a snap-in mechanism of a steam chamber. Detailed Description of the Invention

[0016] The present invention is schematically illustrated according to an embodiment and will be described in detail below with reference to the drawings.

[0017] In Figure 1 a cross-sectional view of a first embodiment of a device for cooling an electronic component 14 is shown. The electronic component 14 to be cooled is located on a circuit board 12. For heat dissipation, the surface of the electronic component 14 is thermally connected to a steam chamber 22 by means of a heat-conducting agent 20 (such as a heat-conducting paste, etc.). The steam chamber 22 includes a joining surface 24 for thermally connecting the electronic component 14. The joining surface 24 is designed to be movable relative to the surface of the electronic component 14. In the embodiment according to Figure 1 , this is achieved, for example, by a movable side surface in the form of a bellows 33, for example. The joining surface 24 protrudes relative to the base body of the steam chamber 22 in the direction of the electronic component 14 to be cooled in order to achieve a minimum gap (TIM gap minimization) between the steam chamber 22 and the electronic component 14. In the embodiment according toFigure 1 In an embodiment, this is additionally achieved in such a way that a mechanism for generating a force acting on the joint surface 24 in the direction of the electronic component 14 is provided inside the steam chamber 22. The mechanism for generating the force is, for example, a spring 30. The spring 30 is itself arranged, for example, via a projection 32 for receiving the spring 30 or an extension of the joint surface between opposite sides of the joint surface 24. The joint surface 24 is designed to be movable relative to the mating support or projection 32 of the spring 30. The steam chamber 22 is connected to the circuit board 26 or the housing 18 by fixing means 26 (such as screws), and the fixing means projects through the circuit board 12 and / or an opening in the housing 18 that at least partially surrounds the circuit board 12.

[0018] According to Figure 2 the embodiment of Figure 1 differs from the embodiment of

[0019] According to Figure 3 the embodiment of

[0020] in that, in order to apply a force to the joint surface 24, at least a collapsible wall portion 34 or jacket is provided laterally of the joint surface 24. By means of the collapsible wall portion 34, a certain relative movement of the joint surface 24 relative to the fastening member, such as the extension 28 or the body of the steam chamber 22, is achieved. If the steam chamber 22 is screwed onto the circuit board 12 by the fixing means 26, a corresponding force is applied to the joint surface 24 in the direction of the surface of the electronic component 14 to be cooled. The collapsible wall portion 34 is preferably designed such that, even in the installed state of the steam chamber 22, the joint surface 24 presses in the direction of the surface of the electronic component 14 to be cooled. This can be achieved, for example, by an elastic design of the section 34. This can be done by bending, but can also be done by the elasticity of the material or the medium pressure. Other possibilities are also conceivable. differs from the previous embodiments in that the joint surface 24 can be pressed against the surface of the electronic component 14 to be cooled by a snap mechanism 36. As shown by the dashed line, the joint surface 24 is shown in a state in which the snap mechanism 36 has not yet pressed against the surface of the electronic component 14 to be cooled. The snap mechanism 36 can be formed in the form of a diaphragm, for example, made of a metal sheet or configured as a toggle lever mechanism.A common feature of all embodiments is that the joint surface 24 of the vapor chamber 22 is configured to be recessed or movable. The joint surface 24 can move relative to the electronic component 14 to be cooled, and can reduce the gap height, for example, by moving in a film-like manner. Here, this force is generated either by a spring 30 integrated in the vapor chamber 22 (which may have a capillary structure for the function of the vapor chamber 22) or by the elastic properties of the jacket 34 itself. In corresponding embodiments, a snap effect or snap mechanism 36 can also be used, which applies a force and minimizes the thermal gap between the joint surface 24 and the surface of the electronic component 14 to be cooled or the heat-conducting element 20 arranged thereon (such as thermal paste, flexible heat-conducting pad, etc.).

[0021] The vapor chamber 22 includes a heat-conducting medium, and the heat-conducting medium ensures particularly efficient heat dissipation through a phase change. For example, water is used as the heat-dissipating medium, and the water is filled into the vapor chamber 22 under negative pressure or in a vacuum, and then the vapor chamber 22 is hermetically sealed. The heat medium evaporates at the hottest surface of the vapor chamber 22, that is, the joint surface 24. Here, heat is removed from this site. The vapor migrates in the internal space of the vapor chamber 22 to the cold inner surface or cooling surface of the vapor chamber 22, for example, to the upper side of the vapor chamber 22. Therefore, the cooling surface has a slightly lower temperature than the other inner surfaces of the vapor chamber 22. A temperature difference of only a few Kelvin between the coldest and hottest sites is sufficient for heat dissipation. The vapor condenses at the cooling surface while releasing heat. Via the generally particularly large inner surface of the vapor chamber, for example, this can be achieved by introducing sintered metal or copper as a common heat conductor, and the condensed liquid can be conveyed back to the heat source through corresponding capillary action, where the cooling medium evaporates again. The columnar support extends inside the vapor chamber 22, and the support is arranged between the upper side and the lower side of the vapor chamber 22. In the embodiment according to Figure 1 capillaries can be formed in the spring 30.

[0022] The electronic component 14 to be cooled is particularly preferably a high-performance processor, a multi-core processor, or a highly integrated circuit (SoC, system on chip), which is characterized by high power losses. For example, these electronic components can be used in the fields of computers or servers, vehicle electronics, or aviation and aerospace.

Claims

1. A device for cooling an electronic component (14), in particular an electronic component of a motor vehicle, the device comprising at least one vapor chamber (22), the vapor chamber comprising at least one connection surface (24) which is designed for thermally contacting the electronic component (14) to be cooled, characterized in that, The joint surface (24) is designed to be movable such that the joint surface (24) can exert a force on the electronic component (14) to be cooled, wherein the vapor chamber (22) includes at least one mechanism (30, 34, 36) for exerting the force.

2. The device according to claim 1, characterized in that, The joint surface (24) is designed such that the joint surface can exert a force on the electronic component (14) to be cooled by prestress.

3. The device according to any one of the preceding claims, characterized in that, The vapor chamber (22) is connected to the circuit board (12) and / or to the housing (18), in particular by cooperation with at least one fixing mechanism (26), wherein the electronic component (14) to be cooled is arranged on the circuit board.

4. The device according to any one of the preceding claims, characterized in that, The spring (30) and / or at least one collapsible wall portion (34) and / or at least one snap mechanism (36) are provided as the mechanism for exerting the force.

5. The device according to any one of the preceding claims, characterized in that, The joint surface (24) is designed to be movably in the form of a membrane.

6. The device according to any one of the preceding claims, characterized in that, The joint surface (24) is made of a flexible material.

7. The device according to any one of the preceding claims, characterized in that, The joint surface (24) is designed to be movable relative to the base body of the vapor chamber (22) by means of at least one bellows (33).

8. The device according to any one of the preceding claims, characterized in that, The vapor chamber (22) includes at least one extension (28) for receiving at least one fixing mechanism (26) for fixing to the circuit board (12) and / or the housing (18).

9. The device according to any one of the preceding claims, characterized in that, The vapor chamber (22) has a cavity at least partially filled with a cooling medium, wherein heat is dissipated from the joint surface (24) by switching the aggregation state of the cooling medium.

10. The device according to any one of the preceding claims, characterized in that, The spring (30) includes at least one capillary-shaped structure.

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