Laser TO with built-in lens and coupling method thereof

Abstract

The invention discloses a laser TO with a built-in lens and a coupling method thereof. The laser TO comprises a laser, a reflection collimation assembly, a coc substrate, a semiconductor cooler, a tube socket and a tube cap. The reflection collimation assembly comprises a reflection element and a collimation lens; the upper surface of the reflecting element is parallel to the upper surface of the coc substrate, and the collimating lens is mounted on the upper surface of the reflecting element; the semiconductor cooler is arranged at the upper part of the tube socket; the coc substrate is arranged on the cold surface of the semiconductor cooler; the bottom of the reflecting element is fixed on the coc substrate, and an emission port of the laser is aligned with a reflecting surface of the reflecting element; an included angle of a preset angle is formed between the reflecting surface of the reflecting element and the upper surface of the coc substrate; the tube cap covers the tube seat; the upper part of the tube cap is provided with an optical window which is coaxial with the collimating lens. According to the laser TO, the coupling efficiency and the coupling precision are improved, meanwhile, the patch welding process is reduced, and the cost is saved.

Description

Technical Field

[0001] The present invention relates to a laser TO with an embedded lens and a coupling method thereof. Background Art

[0002] The overall optical path structure principle of the existing laser TO is as follows: Laser is emitted by the laser. After being reflected by the reflection element, the laser is vertically reflected to the collimating lens, and then converted into convergent light for coupling at the device end. Summary of the Invention

[0003] In view of the above problems, the present invention provides a laser TO with an embedded lens and a coupling method thereof.

[0004] In a first aspect, an embodiment of the present invention provides a laser TO with an embedded lens, including a laser, a reflection collimation assembly, a coc substrate, a thermoelectric cooler, a header, and a cap;

[0005] The reflection collimation assembly includes a reflection element and a collimating lens;

[0006] The upper surface of the reflection element is parallel to the upper surface of the coc substrate, and the collimating lens is mounted on the upper surface of the reflection element;

[0007] The thermoelectric cooler is disposed on the upper part of the header;

[0008] The coc substrate is disposed on the cold surface of the thermoelectric cooler;

[0009] The laser is disposed on the coc substrate;

[0010] The bottom of the reflection element is fixed to the coc substrate, and the emission port of the laser is aligned with the reflection surface of the reflection element;

[0011] The reflection surface of the reflection element forms an included angle with a preset angle with the upper surface of the coc substrate, so that the emitted light of the laser can be vertically turned to the collimating lens;

[0012] The cap covers the header;

[0013] An optical window is provided on the upper part of the cap, and the optical window is coaxial with the collimating lens.

[0014] In one or some alternative embodiments, the reflection element is a glued prism or a reflection prism.

[0015] In one or some alternative embodiments, the laser TO with an embedded lens further includes a monitoring photodiode;

[0016] The monitoring photodiode is optically connected to the laser.

[0017] In one or some alternative embodiments, the laser TO with built-in lens further includes an adapter board;

[0018] The adapter board is electrically connected to the coc substrate and the header respectively.

[0019] In one or some alternative embodiments, the laser TO with built-in lens further includes a thermistor disposed on the coc substrate.

[0020] In a second aspect, an embodiment of the present invention provides a coupling method for the laser TO with built-in lens as described in the first aspect, including:

[0021] Mount a collimating lens on the upper surface of the reflecting element to obtain a reflecting collimating assembly;

[0022] Mount the laser on the coc substrate;

[0023] Power on the laser, place the reflecting collimating assembly on the coc substrate for position adjustment, perform the first lens dry coupling, and use a beam analyzer for preliminary light search and the first spot reading;

[0024] When the near-point spot diameter is less than a first preset threshold and the far-point spot diameter is less than a second preset threshold, perform lens wet coupling;

[0025] Remove the reflecting collimating assembly from the coc substrate and perform glue dispensing;

[0026] Place the glue-dispensed reflecting collimating assembly on the coc substrate, perform the lens dry coupling again, and use a beam analyzer for preliminary light search and the second spot reading;

[0027] When the near-point spot diameter is less than a first preset threshold and the far-point spot diameter is less than a second preset threshold, irradiate and cure the glue on the reflecting collimating assembly to obtain a coc substrate assembly;

[0028] Bake the coc substrate assembly at a preset temperature;

[0029] Connect the coc substrate assembly to a semiconductor cooler, fix the semiconductor cooler to the header, and fix the tube cap to the upper part of the header to seal the coc substrate assembly.

[0030] In one or some alternative embodiments, the coupling method for the laser TO with built-in lens further includes:

[0031] When irradiating and curing the glue on the reflecting collimating assembly, the errors in the X direction and the Y direction are between -100um and 100um.

[0032] In one or some alternative embodiments, before connecting the coc substrate assembly to the semiconductor refrigerator, fixing the semiconductor refrigerator to the header, and fixing the cap to the upper part of the header to seal the coc substrate assembly, the following steps are further included:

[0033] Mount the monitoring photodiode on the coc substrate.

[0034] In one or some alternative embodiments, before connecting the coc substrate assembly to the semiconductor refrigerator, fixing the semiconductor refrigerator to the header, and fixing the cap to the upper part of the header to seal the coc substrate assembly, the following steps are further included:

[0035] Mount the thermistor on the coc substrate.

[0036] In one or some alternative embodiments, before connecting the coc substrate assembly to the semiconductor refrigerator, fixing the semiconductor refrigerator to the header, and fixing the cap to the upper part of the header to seal the coc substrate assembly, the following steps are further included:

[0037] Fix the adapter board to the header and connect it to the coc substrate through wires.

[0038] The beneficial effects of the above technical solutions provided in the embodiments of the present invention at least include:

[0039] In the laser TO with an internal lens provided in the embodiments of the present invention, the collimating lens is mounted on the reflecting element, and a reflecting collimating assembly is integrated, so that collimated parallel light coupling can be achieved. Compared with the traditional post-capping coupling converging lens, the reflection and scattering losses of light inside the package are effectively reduced, and the coupling efficiency and coupling accuracy are greatly improved. At the same time, after integrating the collimating lens and the reflecting element into a reflecting collimating assembly and then mounting the whole on the coc substrate, the assembly is simpler, the chip soldering process is reduced, which is beneficial to cost saving.

[0040] Other features and advantages of the present invention will be described in the following specification, and some of them will become obvious from the specification or be understood by implementing the present invention. The objectives and other advantages of the present invention can be achieved and obtained through the structures specifically pointed out in the written specification and the drawings.

[0041] The technical solutions of the present invention will be further described in detail below through the drawings and embodiments. Description of the Drawings

[0042] The drawings are used to provide a further understanding of the present invention, and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation to the present invention. In the drawings:

[0043] Figure 1 Schematic diagram of the internal structure of the first type of laser TO with an internal lens provided in the embodiment of the present invention;

[0044] Figure 2 Schematic diagram of the internal structure of the second type of laser TO with an internal lens provided in the embodiment of the present invention;

[0045] Figure 3 Schematic diagram of the external structure of the laser TO with an internal lens provided in the embodiment of the present invention.

[0046] Reference numerals:

[0047] 1, header; 2, tube cap; 21, optical window; 3, adapter board; 4, COC substrate; 5, reflection collimation assembly; 6, thermistor; 7, laser; 8, monitoring photodiode; 9, semiconductor cooler. Detailed implementation manners

[0048] Hereinafter, exemplary embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided so that the present disclosure can be more thoroughly understood and the scope of the present disclosure can be completely conveyed to those skilled in the art.

[0049] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", "far", "near", "front", "rear", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0050] In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, the terms "mounted", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0051] The inventors found that in a traditional TO laser, the reflective element and the laser are arranged on the same plane, while the collimating lens is arranged on the top of the tube cap. The light emitted by the laser first reaches the reflective element and then is reflected by the reflective element to the collimating lens, resulting in a long optical path from the reflective element to the collimating lens and large optical path loss. Moreover, the laser, the reflective prism, and the reflective prism and the collimating lens need to be coupled sequentially, with complex assembly and many chip soldering processes, which will lead to low coupling efficiency.

[0052] Due to the low coupling efficiency, with such a lens coupling method, the overall requirements for the manufacturing accuracy and installation accuracy of the lens are very high, which is not conducive to improving economic efficiency.

[0053] Based on this, the embodiments of the present invention provide a TO laser with an internal lens and its coupling method, which will be described in detail through specific embodiments below.

[0054] Embodiment 1

[0055] The embodiments of the present invention provide a TO laser with an internal lens, including a laser 7, a reflective collimating assembly 5, a COC substrate 4, a semiconductor cooler 9, a header 1, and a tube cap 2;

[0056] The reflective collimating assembly 5 includes a reflective element and a collimating lens;

[0057] The upper surface of the reflective element is parallel to the upper surface of the COC substrate 4, and the collimating lens is mounted on the upper surface of the reflective element;

[0058] The semiconductor cooler 9 is arranged on the upper part of the header 1;

[0059] The COC substrate 4 is arranged on the cold surface of the semiconductor cooler 9;

[0060] The laser 7 is arranged on the COC substrate 4;

[0061] The bottom of the reflective element is fixed to the COC substrate 4, and the emission port of the laser 7 is aligned with the reflective surface of the reflective element;

[0062] The reflective surface of the reflective element forms an included angle with the upper surface of the COC substrate 4 at a preset angle, so that the emitted light of the laser 7 can be vertically turned to the collimating lens;

[0063] The bottom end of the tube cap 2 is fixed to the header 1;

[0064] An optical window 21 is arranged on the upper part of the tube cap 2, and the optical window 21 is coaxial with the collimating lens.

[0065] In the traditional TO laser, the cooperation between the reflecting element and the collimating lens is not efficient enough. To improve the coupling efficiency, the inventor tried to improve the traditional TO laser. Through experiments and statistics on the product data of existing TO lasers, it was found that: the lower the height of the cap, that is, the shorter the optical path between the reflecting element and the collimating lens, the smaller the optical path loss. However, the cap needs to cover all the components on the COC substrate 4, and its height cannot be infinitely reduced. Moreover, if the reflecting surface of the reflecting element is directly attached to the lens, interference and diffraction effects will also occur.

[0066] Based on this, in order to minimize the optical path loss and improve the coupling efficiency as much as possible, the inventor tried to directly integrate the reflecting element and the collimating lens into one body. Through multiple experimental verifications, it was obtained that when the optical path distance between the two optical elements in the TO laser is not less than 30 μm, interference and diffraction effects will not occur. Therefore, after the reflecting element and the collimating lens are bonded together, by reasonably setting the thickness of the reflecting element (i.e., the distance from the reflecting surface to the collimating lens), the optical path distance can be shortened as much as possible on the basis of ensuring that no interference and diffraction effects occur, reducing the optical path loss and improving the optical path efficiency.

[0067] The inventor verified that when the distance between the laser 7 and the reflecting collimating assembly 5 is set within the range of 30 μm - 70 μm, its coupling efficiency is the highest. The thickness of the reflecting element can be reasonably set according to the actual optical path requirements.

[0068] In a specific embodiment, the optical path length of the laser beam emitted by the laser 7 to the reflecting surface is 200 μm, and the optical path length from the reflecting surface to the collimating lens is 300 μm, which can achieve efficient coupling. The coupling efficiency can reach 60%, while the coupling efficiency of the existing conventional TO laser is 30%. It can be seen that the coupling efficiency has been greatly improved.

[0069] In the TO laser with an internal lens provided in the embodiment of the present invention, the collimating lens is mounted on the reflecting element, and a reflecting collimating assembly 5 is integrated, so that collimated parallel light coupling can be realized. Compared with the traditional post-capping coupling converging lens, the reflection and scattering losses of light in the package are effectively reduced, and the coupling efficiency and coupling accuracy are greatly improved. At the same time, after the collimating lens and the reflecting element are integrated into the reflecting collimating assembly 5 and then integrally mounted on the COC substrate 4, the assembly is simpler, the chip soldering process is reduced, which is beneficial to cost saving.

[0070] In the embodiment of the present invention, the laser 7 and the COC substrate 4 can be electrically connected by gold wire bonding or other means, which is convenient to power on the laser 7 to emit a laser beam. The reflecting collimating assembly 5 is used to reflect and collimate the laser beam. By reasonably setting the position and angle of the reflecting collimating assembly 5, precise control of the propagation direction and divergence angle of the laser beam can be achieved.

[0071] In the embodiments of the present invention, the cold surface of the semiconductor cooler 9 is closely attached to the back surface of the COC substrate 4, and can take away the heat generated by the laser 7 through heat conduction, thereby realizing the cooling treatment of the COC substrate 4.

[0072] In the embodiments of the present invention, the header 1 and the cap 2 together form the packaging housing of the laser 7, providing mechanical protection and optical sealing. The cap 2 covers the header 1, and ensures that the optical components inside the package are not affected by the external environment through a sealing ring or other sealing structures. An optical window 21 is provided on the cap 2 to facilitate the output and modulation of the laser beam.

[0073] In the embodiments of the present invention, the reflecting surface of the reflecting element is an inclined surface, and the included angle formed by the reflecting surface and the upper surface of the COC substrate 4 can be 45°. When the laser beam emitted by the laser 7 is parallel to the COC substrate 4, the laser beam emitted by the laser 7 can be vertically turned to the collimating lens, and after the divergence angle of the laser beam is adjusted by the collimating lens, it can be transmitted to the optical window 21 of the cap 2.

[0074] In the embodiments of the present invention, the laser TO with an internal lens further includes a monitoring photodiode 8. The monitoring photodiode 8 is fixed on the COC substrate 4 and is located on the side of the laser 7 away from the reflection collimation assembly 5, and the monitoring photodiode 8 is connected to the laser 7 through an optical signal. For example, it can be connected through an optical fiber, so that the optical signal emitted by the laser 7 will irradiate the monitoring photodiode 8 through the optical fiber. Specifically, the optical signal emitted by the laser 7 will irradiate the monitoring photodiode 8, and the monitoring photodiode 8 converts the received optical signal into an electrical signal for monitoring.

[0075] In the embodiments of the present invention, the laser TO with an internal lens further includes a thermistor 6 disposed on the COC substrate 4. The thermistor 6 can be disposed close to the laser 7 and is used to monitor the operating temperature of the laser 7 to ensure that it operates within an appropriate range. Since a large amount of heat is generated during the operation of the laser 7, if the temperature is too high, it may have an adverse effect on the performance and life of the laser 7. Therefore, by monitoring the temperature in real time through the thermistor 6, the operating state of the cooling system can be adjusted in time to ensure that the laser 7 operates at the optimal temperature. In addition, the thermistor 6 also has an overheat protection function: when the temperature of the laser 7 is too high, the resistance value of the thermistor 6 will change, thereby triggering a protection mechanism to prevent the laser 7 from being damaged due to overheating, which is of great significance for ensuring the stable operation of the laser 7 and extending the service life of the laser TO.

[0076] In an alternative embodiment, the laser TO with an internal lens further includes an adapter board 3, and the adapter board 3 is electrically connected to the COC substrate 4 and the header 1 respectively to realize the electrical connection between the COC substrate 4 and the header 1. Specifically, the COC substrate 4 and the adapter board 3 are connected by wires.

[0077] In an alternative embodiment, the reflective element may be a glued prism. Through a specific glued prism shape and angle, for example, an isosceles right prism, total internal reflection of light can occur inside the prism, making its optical path shorter, reducing losses, and thus improving the coupling efficiency. In this embodiment, a glued prism in the shape of a quadrangular prism with a rectangular cross-section is obtained by bonding two isosceles right prisms. In this way, it can be ensured that the bottom area of the reflection collimation assembly 5 is sufficient, so that the collimating lens can be mounted on the end face of the glued prism away from the COC substrate 4, improving the stability of the mounting.

[0078] In an alternative embodiment, the reflective element may be a reflecting prism in the shape of a quadrangular prism with a right trapezoidal cross-section. Moreover, the side corresponding to the short bottom edge of the right trapezoid is fixed to the COC substrate 4, the side corresponding to the long bottom edge is for mounting the collimating lens, and the side corresponding to the height is opposite to the emission port of the laser 7. In this way, on the premise of ensuring a relatively high coupling efficiency, the mounting difficulty can be reduced and costs can be saved.

[0079] Embodiment 2

[0080] Based on the same inventive concept, an embodiment of the present invention provides a coupling method for a laser TO with a built-in lens as described in Embodiment 1, including:

[0081] S101: Mount the collimating lens on the upper surface of the reflective element to obtain the reflection collimation assembly 5;

[0082] S102: Mount the laser 7 on the COC substrate 4;

[0083] S103: Power on the laser 7, place the reflection collimation assembly 5 on the COC substrate 4 for position adjustment, perform the first lens dry coupling, and use a beam analyzer for preliminary light search and the first spot reading;

[0084] S104: When the near-point spot diameter is less than the first preset threshold and the far-point spot diameter is less than the second preset threshold, perform lens wet coupling;

[0085] S105: Remove the reflection collimation assembly 5 from the COC substrate 4 and perform glue dispensing;

[0086] S106: Place the glue-dispensed reflection collimation assembly 5 on the COC substrate 4, perform the lens dry coupling again, and use a beam analyzer for preliminary light search and the second spot reading;

[0087] S107: When the near-point spot diameter is less than the first preset threshold and the far-point spot diameter is less than the second preset threshold, irradiate and cure the glue on the reflection collimation assembly 5 to obtain the COC substrate 4 assembly;

[0088] S108: Bake the COC substrate 4 component at a preset temperature;

[0089] S109: Connect the COC substrate 4 component to the semiconductor cooler 9, fix the semiconductor cooler 9 to the base 1, and fix the cap 2 to the upper part of the base 1 to seal the COC substrate 4 component.

[0090] In the embodiment of the present invention, during the dry coupling process, the reflection collimation component 5 is placed between the laser 7 and another optical element (such as an optical fiber), but no liquid medium is used to fill the gap. After the dry coupling is completed, the reflection loss is reduced through wet coupling, thereby further improving the coupling efficiency.

[0091] In the embodiment of the present invention, the first preset threshold can be 450um, and the second preset threshold can be 850um. The first preset threshold and the second preset threshold are obtained through simulation of the far and near light spots of the laser beam emitted by the laser passing through the collimating lens. If it exceeds the range, the isolator will block the light, resulting in a decrease in power and coupling efficiency.

[0092] In the embodiment of the present invention, the glue used for dispensing generally selects UV glue, so that it can be cured by ultraviolet irradiation. During dispensing, it is necessary to control the amount of glue to prevent excessive glue overflow, which may cause the overflow to block the light-emitting hole and affect light emission; at the same time, the amount of glue cannot be too small, otherwise it will cause poor shear force of the reflection collimation component 5.

[0093] In an alternative embodiment, when powering on the laser 7, it is necessary to meet: the normal state current source during power-on = 30mA, and the voltage is controlled within 1v - 2v.

[0094] In the embodiment of the present invention, before powering on the laser 7, placing the reflection collimation component 5 on the COC substrate 4 for position adjustment, performing the first lens dry coupling, and using a beam analyzer for preliminary light search and the first light spot reading, it may further include: measuring the height of the COC substrate 4 and performing image recognition, so as to facilitate subsequent control of the position and amount of the point UV glue, and prevent the TO from being scrapped due to interference with the laser after dispensing.

[0095] The coupling method of the laser TO with an internal lens provided by the embodiment of the present invention integrates the reflection element and the collimating lens, avoiding the process of blindly pasting the reflection prism and then sealing the cap, and then coupling the converging lens, reducing the mounting process, improving the mounting accuracy, and thus greatly improving the coupling efficiency.

[0096] In the embodiment of the present invention, when curing the glue on the reflection collimation component 5 by irradiation, it is necessary to ensure that the errors in the X and Y directions are between -100um - 100um, so as to ensure that the emission port of the laser 7 can be aligned with the reflection collimation component 5.

[0097] In the embodiment of the present invention, the baking temperature can be set to 120°C.

[0098] In the embodiment of the present invention, before connecting the COC substrate 4 assembly to the semiconductor cooler 9, fixing the semiconductor cooler 9 to the header 1, and fixing the cap 2 to the upper part of the header 1 to seal the COC substrate 4 assembly, it further includes:

[0099] Mount the monitoring photodiode 8 on the COC substrate 4. Specifically, place the TO semi-finished product with the COC substrate 4 mounted on the strip, use an automatic chip mounter to identify the monitoring photodiode 8, apply conductive silver paste at the corresponding position, and pick up and mount the monitoring photodiode 8.

[0100] In the embodiment of the present invention, before connecting the COC substrate 4 assembly to the semiconductor cooler 9, fixing the semiconductor cooler 9 to the header 1, and fixing the cap 2 to the upper part of the header 1 to seal the COC substrate 4 assembly, it further includes:

[0101] Mount the thermistor 6 on the COC substrate 4. Specifically, place the TO semi-finished product with the COC substrate 4 mounted on the strip, use an automatic chip mounter to identify the thermistor 6, apply conductive silver paste at the corresponding position, and pick up and mount the thermistor 6.

[0102] In the embodiment of the present invention, before connecting the COC substrate 4 assembly to the semiconductor cooler 9, fixing the semiconductor cooler 9 to the header 1, and fixing the cap 2 to the upper part of the header 1 to seal the COC substrate 4 assembly, it further includes:

[0103] Fix the adapter board 3 to the header 1 and connect it to the COC substrate 4 through wires. Specifically, first pick up the adapter board 3 onto the heating block, then place the AuSn solder sheet in the corresponding position, perform tin melting, and pick up the melted adapter board 3 and clamp it onto the header 1 to adjust the position for eutectic.

[0104] Obviously, those skilled in the art can make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. The present disclosure is not limited to the exact structure described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present disclosure is only limited by the appended claims. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention is also intended to include these modifications and variations.

Claims

1. A laser TO with a built-in lens, characterized in that, It includes a laser, a reflection collimation component, a COC substrate, a semiconductor refrigerator, a header, and a cap; The reflection collimation component includes a reflection element and a collimation lens; The upper surface of the reflection element is parallel to the upper surface of the COC substrate, and the collimation lens is mounted on the upper surface of the reflection element; The semiconductor refrigerator is disposed on the upper part of the header; The COC substrate is disposed on the cold surface of the semiconductor refrigerator; The laser is disposed on the COC substrate; The bottom of the reflection element is fixed to the COC substrate, and the emission port of the laser is aligned with the reflection surface of the reflection element; The reflection surface of the reflection element forms a preset angle with the upper surface of the COC substrate, so that the emitted light of the laser can be vertically turned to the collimation lens; The cap covers the header; An optical window is provided on the upper part of the cap, and the optical window is coaxial with the collimation lens.

2. The laser TO with an internal lens according to claim 1, characterized in that, The reflection element is a glued prism or a reflection prism.

3. The laser TO with an internal lens according to claim 1, characterized in that, It further includes a monitoring photodiode; The monitoring photodiode is optically connected to the laser.

4. The laser TO with a built-in lens according to claim 1, characterized in that, It further includes an adapter board; The adapter board is electrically connected to the COC substrate and the header respectively.

5. The laser TO with an internal lens according to claim 1, characterized in that, It further includes a thermistor disposed on the COC substrate.

6. A coupling method for a laser TO with an internal lens according to any one of claims 1-5, characterized in that, It includes: Mount the collimation lens on the upper surface of the reflection element to obtain a reflection collimation component; Mount the laser on the COC substrate; Power on the laser, place the reflection collimation component on the COC substrate for position adjustment, perform the first lens dry coupling, and use a beam analyzer for preliminary light search and the first spot reading; When the near - point spot diameter is less than the first preset threshold and the far - point spot diameter is less than the second preset threshold, perform lens wet coupling; Remove the reflection collimation component from the COC substrate and perform glue dispensing; Place the glue - dispensed reflection collimation component on the COC substrate, perform the lens dry coupling again, and use a beam analyzer for preliminary light search and the second spot reading; When the near - point spot diameter is less than the first preset threshold and the far - point spot diameter is less than the second preset threshold, irradiate and cure the glue on the reflection collimation component to obtain a COC substrate component; Bake the COC substrate component at a preset temperature; Connect the COC substrate component to the semiconductor refrigerator, fix the semiconductor refrigerator to the header, and fix the cap to the upper part of the header to seal the COC substrate component.

7. The coupling method of the laser TO with an internal lens according to claim 6, characterized in that It further includes: When irradiating and curing the glue on the reflection collimation component, the errors in the X - direction and Y - direction are between - 100μm and 100μm.

8. The coupling method of the laser TO with an internal lens according to claim 6, characterized in that, Before connecting the COC substrate component to the semiconductor refrigerator, fixing the semiconductor refrigerator to the header, and fixing the cap to the upper part of the header to seal the COC substrate component, it further includes: Mount the monitoring photodiode on the COC substrate.

9. The coupling method of the laser TO with an internal lens according to claim 6, characterized in that, Before connecting the COC substrate component to the semiconductor refrigerator, fixing the semiconductor refrigerator to the header, and fixing the cap to the upper part of the header to seal the COC substrate component, it further includes: Mount the thermistor on the COC substrate.

10. The coupling method of the laser TO with an internal lens according to claim 6, characterized in that, Before connecting the CoC substrate assembly to the semiconductor refrigerator, fixing the semiconductor refrigerator to the socket, and fixing the tube cap to the upper part of the socket to seal the CoC substrate assembly, it further includes: Fixing the adapter board to the socket and connecting it to the CoC substrate through wires.

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