Power conversion device

Abstract

There is provided a power conversion apparatus including: a power element; a housing in which the power element is disposed; a cooling flow path provided in the housing to allow a cooling fluid to flow therethrough to cool the housing, and having a plurality of contact enhancing portions to increase a contact area between the housing and the cooling fluid; and a heat exchanger disposed between the power element and the housing to exchange heat between the housing and the power element. The power conversion device according to the present disclosure is provided with a contact enhancing portion on a cooling flow path to increase a contact area between a housing and a cooling fluid to improve cooling performance of the cooling flow path, thereby improving cooling performance of a power element during heat exchange between the housing and the power element through a heat exchanger. Therefore, the heat dissipation performance of the power element can be improved.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to a power conversion device, and more particularly to a power conversion device that improves cooling and heat dissipation performance. Background Art

[0002] Generally, a power conversion device receives a DC current from a high-voltage battery, converts the DC current into an AC current, and supplies the AC current to a motor, while adjusting the amplitude and phase of the AC current to control the torque and speed of the motor.

[0003] Since the performance of the power conversion device may decrease or the power conversion device may be damaged when the temperature rises to a predetermined level or exceeds a predetermined level due to heat generated by power components (e.g., insulated gate bipolar transistors (IGBTs), metal-oxide-semiconductor field-effect transistors (MOSFETs), etc.) that convert the DC current from the high-voltage battery into an AC current, the power conversion device requires a cooling system.

[0004] However, since the cooling device needs to be fitted to a housing in which power components with cooling tubes are installed and coolant flows in or out through the cooling tubes, the installation operation may be troublesome. In addition, the cooling device has a circular cross-section, which does not have a great cooling effect on the power components, resulting in poor heat dissipation performance of the power components. Therefore, it is necessary to improve this problem.

[0005] The background art of the present disclosure is disclosed in Korean Patent No. 10-1922991 (registered on November 22, 2018, entitled "Power Component Cooling Device for Power Conversion Device"). Summary of the Invention

[0006] Various embodiments relate to a power conversion device that improves cooling and heat dissipation performance.

[0007] In an embodiment of the present disclosure, a power conversion device includes: a power component; a housing in which the power component is disposed; a cooling flow path disposed in the housing to allow a cooling fluid to flow through the cooling flow path to cool the housing, and the cooling flow path having a plurality of contact enhancement portions to increase the contact area between the housing and the cooling fluid; and a heat exchanger disposed between the power component and the housing to exchange heat between the housing and the power component.

[0008] The power conversion device may further include a vortex generator disposed in the housing, connected to the cooling flow path, and configured to generate a vortex of the cooling fluid flowing through the cooling flow path.

[0009] The vortex generators may be provided as annular recesses on the housing and spaced apart from each other in the longitudinal direction of the cooling flow path.

[0010] The cooling flow path may include: a body that allows a cooling fluid to flow therethrough and is provided in contact with the housing; and a plurality of contact enhancement portions that protrude from an outer surface of the body and are spaced apart from each other circumferentially, thereby allowing the cooling fluid to flow therethrough and being in contact with the housing.

[0011] The vortex generators may be connected to the body and the contact enhancement portions of the cooling flow path.

[0012] The housing may include: a housing body that is in contact with a first contact surface of each of the heat exchanger and the contact enhancement portions and includes vortex generators provided on an inner surface of the housing body; and a plurality of housing extensions that protrude from the inner surface of the housing body and are spaced apart from each other circumferentially, the plurality of housing extensions being provided between the plurality of contact enhancement portions and being in contact with the body of the cooling flow path and second and third contact surfaces of the contact enhancement portions.

[0013] The housing body and the housing extensions may be cooled by the cooling fluid flowing through at least one of the body and the contact enhancement portions of the cooling flow path.

[0014] The power conversion device according to the present disclosure is provided with contact enhancement portions on the cooling flow path to increase the contact area between the housing and the cooling fluid, so as to improve the cooling performance of the cooling flow path, thereby improving the cooling performance of the power components during heat exchange between the housing and the power components through the heat exchanger. Therefore, the heat dissipation performance of the power components can be improved.

[0015] In addition, since the cooling flow path is integrally formed in the housing, it is not necessary to install a separate cooling device on the housing. Therefore, the reduction in the number of components can reduce the cost of the components, and can simplify the assembly process and reduce the assembly time. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic diagram showing a power conversion device according to an embodiment of the present disclosure;

[0017] Figure 2 is a sectional view taken along line A-A' of Figure 1 ;

[0018] Figure 3 is Figure 2 an enlarged view of the main part of

[0019] Figure 4 is a side view showing a power conversion device according to an embodiment of the present disclosure;

[0020] Figure 5 is a view showing a power conversion device according to an embodiment of the present disclosure, in which a cooling fluid flows through a cooling flow path; and

[0021] Figure 6 is a view observed from different directions of Figure 5 . Detailed Embodiments

[0022] Hereinafter, a power conversion device will be described with reference to the accompanying drawings through various exemplary embodiments.

[0023] In the specification and the drawings, for clarity and convenience, the thickness of the lines and the size of the constituent elements in the drawings may be enlarged. In addition, the following terms will be defined in consideration of their functions in the present disclosure, and these terms may vary according to the intention and habit of the user or operator. Therefore, the terms should be defined based on the content of the entire specification.

[0024] Figure 1 is a schematic view showing a power conversion device according to an embodiment of the present disclosure; Figure 2 is a sectional view taken along line A - A' of Figure 1 ; Figure 3 is Figure 2 an enlarged view of the main part of Figure 4 is a side view showing a power conversion device according to an embodiment of the present disclosure; Figure 5 is a view showing a power conversion device according to an embodiment of the present disclosure, in which a cooling fluid flows through a cooling flow path; and Figure 6 is a view observed from different directions of Figure 5 .

[0025] Now referring to Figures 1 to 6 , a power conversion device 1 according to an embodiment of the present disclosure includes a power element 100, a housing 200, a cooling flow path 300, and a heat exchanger 400.

[0026] The power conversion device may include a plurality of power elements 100. The plurality of power elements 100 are disposed in the housing 200 and are spaced apart from each other along the cooling flow path 300. The power element 100 may include an insulated gate bipolar transistor (IGBT), a metal - oxide - semiconductor field - effect transistor (MOSFET), etc., and may be in contact with a plurality of heat exchangers 400 respectively.

[0027] The power element 100 is disposed in the housing 200. The housing 200 has a cooling flow path 300 formed therein. Here, the cooling flow path 300 extends in the Y - axis direction in the housing 200, and the power elements 100 are disposed in the housing 200 such that the power elements are spaced apart from each other along the cooling flow path 300.

[0028] The housing 200 may include a housing body 210 and a housing extension 220. The housing body 210 abuts a first contact surface 321 of the heat exchanger 400 and the contact enhancement portion 320, and has a plurality of vortex generators 500 on the inner surface of the housing body 210, which will be described later.

[0029] The plurality of vortex generators 500 are longitudinally arranged on the inner surface of the housing body 210 and are spaced apart from each other. Here, the vortex generator 500 may be formed as an annular depression.

[0030] The housing extensions 220 project from the inner surface of the housing body 210 and are circumferentially spaced apart from each other, such that the housing extensions are arranged between the plurality of contact enhancement portions 320 in such a way that the housing extensions contact the main body 310 of the cooling flow path and the opposing lateral contact surfaces 322 and 323 of the contact enhancement portion 320, namely the second contact surface and the third contact surface.

[0031] The housing extension 220 may have a first housing extension surface 221, a second housing extension surface 222, and a third housing extension surface 223. The first housing extension surface 221 may contact the main body 310 of the cooling flow path 300. Accordingly, the first housing extension surface 221 may be cooled by the cooling fluid flowing through the main body 310 of the cooling flow path.

[0032] The second housing extension surface 222 may contact the second contact surface 322 of the contact enhancement portion 320, and the third housing extension surface 223 may contact the third contact surface 323 of the contact enhancement portion 320. Accordingly, the second housing extension surface 222 and the third housing extension surface 223 may be cooled by the cooling fluid flowing through the contact enhancement portion 320.

[0033] The housing body 210 and the housing extensions 220 may be cooled by the cooling fluid flowing through at least one of the main body 310 of the cooling flow path and the contact enhancement portion 320. In other words, the housing 200 may be directly cooled by the cooling fluid flowing through the cooling flow path 300, which can improve the cooling efficiency.

[0034] The cooling flow path 300 is provided inside the housing 200 to allow the cooling fluid to flow therethrough to cool the housing 200, and the cooling flow path 300 has contact enhancement portions 320 to increase the contact area between the housing 200 and the cooling fluid.

[0035] The cooling flow path 300 is provided in the housing 200 in the Y-axis direction such that the cooling fluid flows therethrough. The cooling fluid may be introduced into one of the two ends of the cooling flow path, may flow through the interior of the cooling flow path 300, and may be discharged from the other end of the cooling flow path 300.

[0036] Thus, since the cooling flow path 300 is integrally formed in the housing 200, there is no need to install a separate cooling device to the housing 200. Therefore, the reduction in the number of components can reduce the cost of the components, and can simplify the assembly process and reduce the assembly time.

[0037] In addition, since the cooling flow path 300 is provided with a contact enhancement portion 320 that increases the contact area between the housing 200 and the cooling fluid, the cooling performance of the cooling flow path 300 can be improved to increase the cooling performance of the power element 100 during heat exchange between the housing 200 and the power element 100 through the heat exchanger 400. Therefore, the heat dissipation performance of the power element 100 can be improved.

[0038] The cooling flow path 300 may have a cross-section in a spline shape and may include a main body 310 and a plurality of contact enhancement portions 320 (see Figure 2 and Figure 3 ). The main body 310 of the cooling flow path is in contact with the housing 200, and the cooling fluid flows through the main body.

[0039] The main body 310 of the cooling flow path is formed in the housing 200 and has a cylindrical shape. The main body 310 of the cooling flow path is disposed in the housing 200 in the Y-axis direction. The cooling fluid flowing through the main body 310 of the cooling flow path is in contact with the housing 200.

[0040] The main body 310 of the cooling flow path may be in contact with a plurality of housing extension portions 220 provided on the housing 200. In other words, the cooling fluid flowing through the main body 310 of the cooling flow path may be in contact with the first housing extension surface 221 of the housing extension portion 220.

[0041] The plurality of contact enhancement portions 320 protrude from the outer surface of the main body 310 of the cooling flow path and are spaced apart from each other in the circumferential direction such that the contact enhancement portions are in contact with the housing 200 and the cooling fluid flows around the contact enhancement portions. The contact enhancement portions 320 may be in contact with the housing body 210 of the housing 200 and the plurality of housing extension portions 220. In other words, the cooling fluid flowing through the corresponding contact enhancement portions 320 may be in contact with the housing body 210 and the plurality of housing extension portions 220. The contact enhancement portions 320 may be in contact with the housing body 210 and the second housing extension surface 222 and the third housing extension surface 223 of the housing extension portion 220.

[0042] Therefore, compared with a conventional cooling flow path having a simple circular cross-section, since the cooling flow path 300 has a larger contact area with the housing 200, the cooling performance of the cooling flow path 300 can be improved.

[0043] In addition, since the cooling flow path 300 has a spline-shaped cross section, the flow rate of the cooling fluid is slowed down by the plurality of contact enhancement portions 320 to improve the cooling efficiency. Therefore, during the heat exchange between the heat exchanger 400 passing through the housing 200 and the power element 100, the cooling performance of the power element 100 can be improved, thereby improving the heat dissipation performance of the power element 100.

[0044] For example, the contact area between the housing and a conventional cooling flow path with a circular cross section having a radius of 6.5 mm and a length of 150 mm can be calculated as 6126.11 mm 2 . Specifically, the formula for obtaining the contact area between the cooling flow path and the housing can be 6.5 × 2 × 3.14 × 150, which is calculated as 6126.11 mm 2 .

[0045] On the other hand, the contact area between the housing 200 and the spline-shaped cooling flow path 300 with a radius of 6.5 mm and a length of 150 mm can be calculated as 9943.761 mm 2 .

[0046] That is to say, since the outer ring spline area is 3640.857 mm 2 , and the inner ring spline area is 2102.904 mm 2 , the spline tooth surface can have an area of 4200 mm 2 . Based on this, the contact area between the cooling flow path 300 and the housing 200 is calculated as 9943.761 mm 2 .

[0047] Specifically, the formula for obtaining the outer ring spline area is 2 × 6.5 × 3.14 × (15.282 / 360) × 14× 150, which is calculated as 3640.857 mm 2 . Here, 15.282 can be the outer ring spline angle θ1 of the contact enhancement portion 320, and 14 can be the number of the contact enhancement portions 320 (see Figure 2 and Figure 3 ).

[0048] The formula for obtaining the inner ring spline area can be 2 × 5.5 × 3.14 × (10.431 / 360) × 14 ×150, which is calculated as 2102.904 mm 2 . Here, 10.431 can be the inner ring spline angle θ2 of the housing extension portion 220, and 14 can be the number of the housing extension portions 220 (see Figure 2 and Figure 3 ).

[0049] The formula for obtaining the spline tooth surface area can be 1 × 14 × 2 × 150, which calculates to 4200 mm 2 Here, 1 is the length of each of the second housing extension surface 222 and the third housing extension surface 223 of the housing extension 220, i.e., 1 mm, and 2 can be the number of the second housing extension surface 222 and the third housing extension surface 223.

[0050] The contact area between the cooling flow path 300 and the housing 200 according to the present disclosure is 9943.761 mm 2 This can be greater than the contact area of 6126.11 mm between a conventional cooling flow path with a circular cross-section and a housing according to the related art 2 。

[0051] Thus, compared with the conventional cooling flow path, the cooling flow path 300 according to the present disclosure has a greater contact area with the housing 200, thereby improving the cooling efficiency of the cooling flow path 300.

[0052] Therefore, during heat exchange between the housing 200 and the power element 100 through the heat exchanger 400, the cooling performance of the power element 100 can be increased, thereby improving the heat dissipation performance of the power element 100.

[0053] The heat exchanger 400 is disposed between the power element 100 and the housing 200 to exchange heat between the housing 200 and the power element 100. As the heat exchanger 400 transfers the heat generated by the power element 100 to the housing 200, the cooling flow path 300 disposed in the housing 200 can cool the heat transferred to the housing 200.

[0054] As the heat transferred to the housing 200 is cooled, heat exchange occurs between the housing 200 and the power element 100 through the heat exchanger 400, thereby cooling the power element 100.

[0055] The power conversion device 1 may further include a plurality of eddy current generators 500. The eddy current generators 500 are formed in the housing 200 and are thus connected to the cooling flow path 300 such that eddies of the cooling fluid are generated when the cooling fluid flows through the cooling flow path 300. The eddy current generators 500 are connected to the main body 310 of the cooling flow path and the contact enhancement portion 320 of the cooling flow path 300.

[0056] The eddy current generators 500 are formed as annular depressions on the housing 200, and the annular depressions are spaced apart from each other in the longitudinal direction of the cooling flow path 300. The eddy current generators 500 may be spaced apart from each other in the Y-axis direction on the housing 200.

[0057] Thus, as the cooling fluid flows through the eddy current generator 500 when passing through the cooling flow path 300, an eddy current of the cooling fluid is generated, thereby further improving the cooling effect of the cooling flow path 300.

[0058] Therefore, during heat exchange between the housing 200 and the power element 100 through the heat exchanger 400, the cooling performance of the power element 100 can be further enhanced, which can further improve the heat dissipation performance of the power element 100.

[0059] Although the present disclosure has been described with reference to the embodiments shown in the drawings, the embodiments of the present disclosure are for illustrative purposes only, and those skilled in the art will understand that various modification schemes and other equivalent embodiments can be obtained from the embodiments.

Claims

1. A power conversion device, comprising: A power component; A housing, wherein the power component is disposed in the housing; A cooling flow path disposed in the housing to allow a cooling fluid to flow through the cooling flow path to cool the housing, and the cooling flow path has a plurality of contact enhancement portions to increase the contact area between the housing and the cooling fluid; And A heat exchanger disposed between the power component and the housing to exchange heat between the housing and the power component.

2. The power conversion device according to claim 1, further comprising an eddy current generator disposed in the housing, connected to the cooling flow path, and generating an eddy current of the cooling fluid flowing through the cooling flow path.

3. The power conversion device according to claim 2, wherein, The eddy current generator is provided as an annular depression on the housing and is spaced apart from each other in the longitudinal direction of the cooling flow path.

4. The power conversion device according to claim 3, wherein, The cooling flow path includes: A main body that allows the cooling fluid to flow through and is provided in contact with the housing; and The plurality of contact enhancement portions that protrude from the outer surface of the main body and are spaced apart from each other in the circumferential direction, allow the cooling fluid to flow through, and are in contact with the housing.

5. The power conversion device according to claim 4, wherein, The eddy current generator is connected to the main body and the contact enhancement portions of the cooling flow path.

6. The power conversion device according to claim 5, wherein, The housing includes: A housing body that is in contact with a first contact surface of each of the heat exchanger and the contact enhancement portions and includes the eddy current generator disposed on the inner surface of the housing body; and A plurality of housing extensions that protrude from the inner surface of the housing body and are spaced apart from each other in the circumferential direction, the plurality of housing extensions are disposed between the plurality of contact enhancement portions and are in contact with the main body of the cooling flow path and the second and third contact surfaces of the contact enhancement portions.

7. The power conversion device according to claim 6, wherein, The housing body and the housing extensions are cooled by the cooling fluid flowing through at least one of the main body and the contact enhancement portions of the cooling flow path.

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