Impact sheet assembly manufactured based on advanced packaging process and manufacturing method

Abstract

The invention provides a slapper assembly manufactured based on an advanced packaging process and a manufacturing method, and belongs to the field of electronic component manufacturing, the advanced packaging adapter plate process is adopted, and through holes are formed in a wafer silicon or glass substrate through a TSV method or a TGV method; metalizing the through hole by adopting an electroplating process; carrying out metal patterning processing on the explosion bridge foil; the wafer with the explosion bridge foil is bonded with another wafer processed through the TSV method or the TGV method, and the effect of thickening the emission sheet is achieved; preparing a flyer layer on the wafer based on a spin coating and photoetching mode, and carrying out graphical processing on the flyer layer; carrying out photoetching on the flyer layer to obtain an acceleration chamber, wherein the acceleration chamber is made of polyimide; and scribing and releasing the current interface to obtain the impact sheet assembly. According to the invention, direct surface-mount soldering sealing with a fuse ignition circuit can be realized through an advanced packaging technology, and the connection is more reliable and efficient compared with the traditional pin type connection.

Description

Technical Field

[0001] The present invention belongs to the field of electronic component manufacturing, and specifically relates to an impact piece assembly manufactured based on an advanced packaging process and a manufacturing method thereof. Background Art

[0002] With the continuous development of the electronics industry, packaging technology is also constantly innovating. From the single package in the past to the current multi-package, and then to the popularization of high-speed communication, high-quality display, and highly integrated micro-devices, packaging technology has developed from the original wire viscoelastic to hybrid packaging and 3D packaging. The current status and development trend of chip packaging process research has attracted increasing attention. With the continuous advancement of science and technology, packaging technology is also constantly developing. This is an indispensable part of the chip production process, and research and development should be emphasized.

[0003] Intelligent pyrotechnics are an inevitable requirement for the development of modern warfare and modern weapons, and are also the main development trend in the future. The integration of missile-borne pyrotechnics and fuze systems is the inevitable result of following the trend.

[0004] In the prior art, with the rapid development of electronic technology, a variety of electronic circuit solutions have been directly contributed, and the design and manufacturing technology concepts of fuzes have also made a qualitative leap. In the fuze system, the impact piece assembly is widely used in the detonation system of high-value weapons and equipment due to its high intrinsic safety, that is, high excitation energy. The impact piece assembly in the prior art has a low degree of integration during the manufacturing process, and generally uses a pin-type connection, resulting in poor reliability, which is easy to cause failure to detonate and affect the use of the blasting device. Summary of the invention

[0005] The present invention aims to provide an impact piece assembly with low cost, high reliability and adaptability to large-scale production by utilizing advanced packaging technology.

[0006] The impact piece assembly includes: an acceleration chamber, a flying piece layer, an explosion bridge foil reflector and a conductive through hole; The reflective sheet is arranged at the bottom of the impact sheet assembly, the explosive bridge foil is arranged at the top of the reflective sheet, and the flying sheet layer is attached to the upper surface of the explosive bridge foil; the acceleration chamber is obtained by photolithography at the upper end of the flying sheet layer; the flying sheet layer and the acceleration chamber are made of polyimide respectively.

[0007] It should be further explained that the explosive bridge foil is made of copper, aluminum, gold, or a mixture of any two of the single substances, or a mixture of the three.

[0008] It should be further explained that a through hole is provided on the acceleration chamber, and the center of the acceleration chamber through hole is arranged colinearly with the center of the explosion bridge foil.

[0009] The present invention also provides a manufacturing method based on an advanced packaging process, and the method includes: Step 1: Adopt an advanced packaging interposer process, and open through-holes on a wafer silicon or glass substrate by means of the TSV method or the TGV method; Step 2: Metallize the through-holes by means of an electroplating process; Step 3: Perform metal patterning on the explosive bridge foil; Step 4: Bond the wafer silicon with the explosive bridge foil to another wafer silicon processed by the TSV method or the TGV method to achieve the effect of thickening the emitter sheet; Step 5: On the wafer, a flyer layer is prepared based on spin coating and photolithography, and the flyer layer is patterned; Step 6: An acceleration chamber is obtained by photolithography on the flyer layer, and the material of the acceleration chamber is polyimide; Step 7: Dice to release the current interface to obtain an impact sheet assembly.

[0010] It should be further noted that before Step 2, after opening the through-holes based on TSV, the impact sheet assembly is thermally oxidized to form a silicon dioxide enhanced insulation protection layer.

[0011] It should be further noted that in Step 3, the metal patterning is performed by electroplating or sputtering, and the explosive bridge foil is made of copper, aluminum, gold single elements, or any two single elements are mixed, or three are mixed.

[0012] It should be further noted that in Step 5, the thickness of the flyer layer is 25um, and the material used is polyimide.

[0013] It should be further noted that in Step 4, before bonding, the two bonding surfaces are subjected to CMP polishing treatment.

[0014] It should be further noted that in Step 6, on the flyer layer, polyimide photoresist is spin-coated and lithographed multiple times, and combined with an overlay process, so that the obtained acceleration chamber has a thickness of 400um to 600um.

[0015] It should be further noted that before Step 1, the wafer silicon or glass substrate is cleaned, surface contaminants are removed, and then an isolation layer is coated, and the isolation layer is made of silicon dioxide insulating material.

[0016] From the above technical solutions, it can be seen that the present invention has the following advantages: The impact sheet assembly provided by the present invention based on the advanced packaging process uses the through-hole process of the TSV method or the TGV method to form conductive through-holes on the substrate, having the characteristics of high integration, short connection length, and low parasitic effect.

[0017] The percussion sheet assembly of the present invention can also be directly surface-mounted and sealed with the fuse firing circuit through an advanced packaging process, which is more reliable and efficient than the traditional pin-type connection.

[0018] Moreover, the process adopted by the present invention is based on the wafer-level advanced packaging process, which has a high process compatibility with MEMS and microelectronics technologies, facilitating wafer-level integration with MEMS IMU inertial measurement units and control circuit chips, and facilitating the subsequent development of miniaturized intelligent fuse systems. Description of the Drawings

[0019] In order to more clearly illustrate the technical solutions of the present invention, the drawings required for description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0020] Figure 1 It is a schematic diagram of the overall structure of the percussion sheet assembly; Figure 2 It is a schematic diagram of the explosion process of the percussion sheet assembly; Figure 3 It is a roadmap of the manufacturing method based on the advanced packaging process.

[0021] Explanation of the Reference Numerals in the Drawings: 1 - acceleration chamber, 2 - flyer layer, 3 - exploding bridge foil, 4 - reflector, 5 - conductive via hole. Detailed Embodiments

[0022] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0023] In the impact sheet component fabricated based on the advanced packaging process involved in this embodiment, the term "comprising" or "may comprise" that can be used in various embodiments of the present disclosure indicates the presence of the disclosed functions, operations, or elements, and does not limit the addition of one or more functions, operations, or elements. Further, as used in various embodiments of the present disclosure, the terms "comprising", "having", and their cognates are only intended to indicate a specific feature, number, step, operation, element, component, or combination of the foregoing items, and should not be construed as precluding the existence or addition of one or more other features, numbers, steps, operations, elements, components, or combinations of the foregoing items first.

[0024] It should be noted that: in the description of the impact sheet component fabricated based on the advanced packaging process provided by the present invention, when a component is "connected" to another component, the first component may be directly connected to the second component, and a third component may be "connected" between the first component and the second component. Conversely, when a component is "directly connected" to another component, it can be understood that there is no third component between the first component and the second component.

[0025] When the present invention describes each component of the impact sheet component, the terms used are only for the purpose of describing a specific embodiment and are not intended to limit the various embodiments of the present disclosure. As used herein, the singular form is also intended to include the plural form unless the context clearly indicates otherwise. Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the various embodiments of the present disclosure belong. The terms (such as those defined in a commonly used dictionary) will be interpreted as having the same meaning as the contextual meaning in the relevant technical field and will not be interpreted as having an idealized meaning or an overly formal meaning unless clearly defined in the various embodiments of the present disclosure.

[0026] Please refer to Figure 1 The figure shows a schematic diagram of an impact sheet component fabricated based on the advanced packaging process in a specific embodiment. The advanced packaging technology of this embodiment is oriented to the RDL Interposer rewiring substrate technology for 3D packaging, and combines metal thin film and polymer molding technology as well as via electrode technology.

[0027] Specifically, the impact piece assembly includes: an acceleration chamber 1, a flying piece layer 2, an explosion bridge foil 3, a reflective sheet 4, and a conductive through hole 5; the impact piece assembly can be based on a wafer silicon or glass substrate as a substrate, the reflective sheet 4 is arranged at the bottom of the impact piece assembly, and the explosion bridge foil 3 is arranged on the top of the reflective sheet 4. The explosion bridge foil 3 is made of copper, aluminum, gold, or a mixture of any two of the single substances, or a mixture of the three.

[0028] The flying sheet layer 2 is attached to the upper surface of the explosive bridge foil 3; the accelerating chamber 1 is obtained by photolithography on the upper end of the flying sheet layer 2; the flying sheet layer 2 and the accelerating chamber 1 are made of polyimide respectively. The reflecting sheet 4 is made of silicon material or glass. A through hole is opened on the accelerating chamber 1, and the center of the through hole of the accelerating chamber 1 is arranged in a collinear manner with the center of the explosive bridge foil 3.

[0029] like Figure 2 As shown, the driving energy of the flying sheet layer 2 in this embodiment is generated by the metal film bridge. When a high-voltage electric pulse is applied, the explosive bridge foil 3 will cause a plasma electric explosion, thereby driving the flying sheet layer, which can be about 400um in a very small distance through the acceleration chamber, to accelerate to a speed of more than 2Km / s, and bombard the end face of the starting charge, forming a short pulse impact, triggering the explosion of the insensitive explosive. It can be seen that this embodiment has the characteristics of high safety, high quality consistency, and low cost.

[0030] The following is an embodiment of a manufacturing method based on an advanced packaging process provided in an embodiment of the present disclosure. The manufacturing method and the impact piece assembly of the above-mentioned embodiments belong to the same inventive concept. For details not described in detail in the embodiment of the manufacturing method based on the advanced packaging process, reference can be made to the embodiment of the above-mentioned impact piece assembly.

[0031] Methods include: Step 1: Use the advanced packaging interposer process and open through holes on the wafer silicon or glass substrate using the TSV method or TGV method.

[0032] The TSV method (Through Silicon Via) here is the through-silicon via technology. The TSV method is to make vertical conduction between chips and wafers; the TSV method can achieve vertical electrical interconnection of silicon vias by filling conductive materials such as copper, tungsten, and polysilicon. The TGV method is the abbreviation of Through-Glass Via, which is a vertical electrical interconnection through a glass substrate.

[0033] Specifically, a wafer silicon or a glass substrate is used as the base for fabricating the impact sheet component. Before fabrication, the base is prepared first. Specifically, it may include steps such as cleaning, removing surface contaminants, and coating a protective layer, etc., to ensure the cleanliness and flatness of the base surface; an isolation layer is fabricated on the base. In this example, the isolation layer can be made of silicon dioxide insulating material.

[0034] The function of the isolation layer is to ensure that the materials around the conductive vias will not make electrical connections with other parts; secondly, photolithography technology is used to define the positions of the conductive vias on the isolation layer.

[0035] In this embodiment, a photosensitizer is also coated on the isolation layer, and a photolithography light source is used to irradiate through a mask template, causing a chemical change in the area of the conductive vias of the photosensitizer. After the above-mentioned photolithography is completed, methods such as chemical etching or physical etching are used to remove the areas of the isolation layer that are not protected by photolithography. This can form the initial holes for the conductive vias, and the diameter of the initial holes is 50um; then, a metal conductive material is deposited and filled inside and around the conductive vias.

[0036] Exemplarily speaking, the metal filling of the vias can be achieved through an electroplating process.

[0037] Step 2: Metallize the vias using an electroplating process; Before this step, if the wafer processed by the TSV method needs to be subjected to a thermal oxidation treatment to form a silicon dioxide enhanced insulating protective layer. Since the TGV method itself is a glass substrate, no further thermal oxidation treatment is required.

[0038] Step 3: Perform metal patterning on the explosive bridge foil; Among them, the metal patterning is carried out by electroplating or sputtering methods. The explosive bridge foil is made of copper, aluminum, gold single elements, or any two single elements mixed, or three mixed.

[0039] Step 4: Bond the wafer silicon with the explosive bridge foil to another wafer silicon processed by the TSV method or the TGV method to achieve the effect of thickening the emitter sheet; Before bonding, the two bonding surfaces are subjected to CMP polishing treatment. In this way, CMP polishing on the bonding surface can improve the reliability and performance of bonding and reduce the mismatch or defects between materials. Subsequently, the two polished bonding surfaces are bonded to achieve the effect of thickening the reflective layer.

[0040] Step 5: On the wafer, a flyer layer is fabricated based on spin coating and photolithography, and the flyer layer is patterned; The thickness of the flyer layer here is 25um, and the material used is polyimide. Baking curing can also promote the cross-linking reaction of polyimide molecules, increasing the strength, hardness and thermal stability of the polyimide flyer layer.

[0041] Step 6: Obtain an acceleration chamber on the flyer layer through photolithography. The material of the acceleration chamber is polyimide. According to the embodiment of the present application, Step 6 changes the previous method of bonding the acceleration chamber and the flyer layer, and directly forms the acceleration chamber on the flyer layer through photolithography technology. The material is polyimide. This can effectively improve the system integration and reduce the process cost.

[0042] In this step, to form the polyimide acceleration chamber, a photoresist with a suitable viscosity needs to be selected to achieve a suitable spin coating thickness of 400um to 600um. If the viscosity is insufficient, the polyimide photoresist can be spin coated multiple times and combined with the overlay process to reach the corresponding thickness of the acceleration chamber.

[0043] Step 7: Scribe and release the current interface to obtain an impact sheet assembly.

[0044] It should be understood that the magnitudes of the sequence numbers of the steps in the above embodiments do not mean the order of execution. The order of execution of each process should be determined by its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.

[0045] Combined with Figure 3 As shown, in an embodiment of the present invention, a possible embodiment will be given below to non-restrictively elaborate on its specific implementation scheme.

[0046] S1. Prepare the substrate. This includes steps such as cleaning, removing surface contaminants and coating a protective layer to ensure the cleanliness and flatness of the substrate surface; then prepare an isolation layer on the substrate.

[0047] S2. Prepare a metal thin film explosive bridge foil. The preparation of the explosive bridge foil is completed through electroplating or magnetron sputtering methods, combined with photolithography and etching processes. S3. Prepare a conductive through-hole wafer using the TSV method or the TGV method. S4. Bond and integrate the explosive bridge foil substrate with the conductive through-hole wafer to connect the conductive through-hole wafer with the explosive bridge foil. S5. Spin coat and expose and cure the polyimide photoresist to form a polyimide flyer layer. S6. Spin coat the polyimide photoresist, and after patterning the acceleration chamber structure through a mask, obtain an impact sheet assembly.

[0048] The impact sheet assembly manufactured according to the above manufacturing method based on advanced packaging technology contains a metal thin film bridge. When a high-voltage electrical pulse is applied, the explosive bridge foilFigure 1 Plasma electroexplosion will occur in Figure 1 , thus driving the polymer film. Within an extremely small distance (less than 1 mm), that is, within an extremely small distance (about 400 μm) in the acceleration chamber, it is accelerated to a speed above 2 km / s and bombards the end face of the initiating charge, forming a short-pulse impact to trigger the explosion of the insensitive explosive. This embodiment has the characteristics of high safety, high quality consistency, and low cost.

[0049] It should be understood that in the impact sheet assembly fabricated based on the advanced packaging process provided by the present invention, when it is stated that a certain element or layer is "on", "connected" or "coupled" to another element or layer, it may be directly on the other element or layer, directly connected or coupled to the other element or layer, or there may be intermediate elements or layers. On the contrary, when it is stated that a certain element is "directly on", "directly connected" or "directly coupled" to another element or layer, there are no intermediate elements or layers. Similar numbers in all the drawings indicate similar elements. As used herein, the term "and / or" includes any and all combinations of one or more of the related listed items.

[0050] The terms used herein are for the purpose of describing specific embodiments only and are not intended to limit the expressions in this document. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that when used in this specification, the term "comprises" refers to the presence of the stated features, integers, steps, operations, elements and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or their combinations.

[0051] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the broadest scope consistent with the principles and novel features disclosed herein.

Claims

1. An impact sheet component manufactured based on an advanced packaging process, characterized in that, include: An accelerating chamber (1), a flying sheet layer (2), an explosion bridge foil (3), a reflecting sheet (4), and a conductive through hole (5); The reflective sheet (4) is arranged at the bottom of the impact sheet assembly, the explosive bridge foil (3) is arranged on the top of the reflective sheet (4), and the flying sheet layer (2) is attached to the upper surface of the explosive bridge foil (3); the acceleration chamber (1) is obtained by photolithography at the upper end of the flying sheet layer (2); The flying sheet layer (2) and the accelerating chamber (1) are made of polyimide respectively.

2. The percussion sheet assembly fabricated based on the advanced packaging process according to claim 1, wherein The explosive bridge foil (3) is made of copper, aluminum, gold as a single substance, or a mixture of any two of the single substances, or a mixture of the three.

3. The percussion sheet assembly manufactured based on the advanced packaging process according to claim 1, wherein A through hole is provided on the acceleration chamber (1), and the center of the through hole of the acceleration chamber (1) is arranged colinearly with the center of the explosion bridge foil (3).

4. A manufacturing method based on an advanced packaging process, characterized in that, The method is used to make the impact plate assembly as claimed in any one of claims 1 to 3; Methods include: Step 1: Use advanced packaging interposer technology and open through holes on the wafer silicon or glass substrate through the TSV method or TGV method; Step 2: Metallize the through holes using electroplating process; Step 3: Perform metal patterning on the explosive bridge foil; Step 4: Bonding the silicon wafer with the exploded bridge foil to another silicon wafer processed by the TSV method or the TGV method to achieve the effect of thickening the emitter; Step 5: On the wafer, a flyer layer is prepared by spin coating and photolithography, and the flyer layer is patterned; Step 6: Obtain an acceleration chamber on the flying sheet layer by photolithography, wherein the material of the acceleration chamber is polyimide; Step 7: Slice to release the current interface and obtain the impact piece assembly.

5. The manufacturing method based on advanced packaging technology according to claim 4, characterized in that: Before step 2, the method also includes performing a thermal oxidation treatment on the impact plate assembly after opening a through hole based on TSV to form a silicon dioxide enhanced insulating protection layer.

6. The manufacturing method based on advanced packaging technology according to claim 4, characterized in that: In step 3, the metal patterning process is performed by electroplating or sputtering, and the explosive bridge foil is made of copper, aluminum, gold, or a mixture of any two of the single substances, or a mixture of the three.

7. The manufacturing method based on advanced packaging technology according to claim 4, characterized in that: In step 5, the thickness of the flying sheet layer is 25 um, and the material used is polyimide.

8. The manufacturing method based on advanced packaging technology according to claim 4, characterized in that: In step 4, before bonding, the two bonding surfaces are subjected to CMP polishing.

9. The manufacturing method based on advanced packaging technology according to claim 4, characterized in that: In step 6, polyimide photoresist is used on the flying sheet layer for multiple spin coating and photolithography, and combined with an overlay process, so that the obtained acceleration chamber thickness is 400um to 600um.

10. The manufacturing method based on advanced packaging technology according to claim 4, characterized in that: Before step 1, the process also includes: cleaning the silicon wafer or glass substrate, removing surface contaminants, and then coating an isolation layer, where the isolation layer is made of silicon dioxide insulating material.

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