Modularized high-strength efficient heat dissipation circuit board

Abstract

The invention discloses a modularized high-strength efficient heat dissipation circuit board. The modularized high-strength efficient heat dissipation circuit board comprises a first circuit board unit, a second circuit board unit, a third circuit board unit and a reinforcing connection unit. According to the circuit board provided by the invention, a mode of modular assembly of a plurality of circuit boards is adopted, so that modular work is realized, and the maintenance cost can be reduced when maintenance is needed. The reinforced connection of a plurality of modules can be realized through the reinforced connection unit, and the heat dissipation of each module can be realized.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and more specifically, to a modular high-strength and efficient heat dissipation circuit board. Background Art

[0002] A circuit board can carry various electronic components and connect these components through wires, pads and other structures to form a complete circuit system. Circuit boards play a crucial role in electronic devices. They provide support and connection for electronic components and are indispensable components in electronic devices.

[0003] Existing circuit boards are often a single whole board, on which a microprocessor, a power module, a sensor module and other required working modules are integrated. However, during use, if one of the modules is damaged, it is often difficult to replace the faulty module alone, but the entire circuit board needs to be replaced, resulting in high maintenance costs. If a general method of using multiple circuit boards connected by data lines is adopted, although it is convenient for individual replacement and maintenance of modules and can reduce maintenance costs, when multiple circuit boards are installed in the corresponding device, their overall strength is difficult to guarantee. And the heat generated by different modules during operation and the required heat dissipation requirements are different, and it is difficult to dissipate heat specifically for different modules. Summary of the Invention

[0004] The present invention aims to overcome the defects of the prior art and provides a modular high-strength and efficient heat dissipation circuit board.

[0005] To achieve the above object, the present invention provides the following technical solution: A circuit board includes a first circuit board unit, a second circuit board unit, a third circuit board unit and a reinforcement connection unit; the first circuit board unit includes a first circuit board, a first socket unit and a first plug socket are installed at the first circuit board, the second circuit board unit includes a second circuit board, a second socket unit and a second plug socket are installed at the second circuit board, the third circuit board unit includes a third circuit board, a first interface unit and a second interface unit are installed at the third circuit board; a connection line is connected between the first plug socket and the second plug socket; the reinforcement connection unit includes a first connection part, a second connection part and a third connection part.

[0006] Further, the first interface unit can be plugged into the first socket unit; the second interface unit can be plugged into the second socket unit.

[0007] Further, the first connection part is fixedly connected to the first circuit board, the second connection part is fixedly connected to the second circuit board, and the third connection part is fixedly connected to the third circuit board.

[0008] Further, the third connection part is fixedly connected to both the first connection part and the second connection part.

[0009] Further, the connection line includes a first plug that mates with the first socket, a second plug that mates with the second socket, and a data line that connects the first plug and the second plug.

[0010] Further, a first shielding cover is hingedly mounted at the first circuit board, and a second shielding cover is hingedly mounted at the second circuit board; the first connection portion includes a first tube portion, a first fixing plate, and a first connecting plate. The first tube portion has a first groove portion, and a first heat conducting plate is mounted at the first groove portion; the second connection portion includes a second tube portion, a second fixing plate, and a second connecting plate. The second tube portion has a second groove portion, and a second heat conducting plate is mounted at the second groove portion; the third connection portion includes a covering plate, a first support plate, two support feet, and two second support plates.

[0011] Thus, the first and second shielding covers can prevent the first circuit board unit and the second circuit board unit from being interfered by the current at the third circuit board unit.

[0012] Further, both the first fixing plate and the first connecting plate are fixedly connected to the first tube portion.

[0013] Further, the first heat conducting plate can abut against the first shielding cover.

[0014] Further, the first fixing plate is fixedly connected to the first circuit board, and the first connecting plate is fixedly connected to both the first circuit board and the third circuit board.

[0015] Further, both the second fixing plate and the second connecting plate are fixedly connected to the second tube portion.

[0016] Further, the second heat conducting plate can abut against the second shielding cover.

[0017] Further, the second fixing plate is fixedly connected to the second circuit board, and the second connecting plate is fixedly connected to both the second circuit board and the third circuit board.

[0018] Further, the first support plate, the two support feet, and the two second support plates are all fixedly connected to the third circuit board.

[0019] Further, the first tube portion is fixedly connected to one of the second support plates, and the second tube portion is fixedly connected to the other second support plate.

[0020] Further, one side of the first shielding cover is hinged to the first circuit board; one side of the second shielding cover is hinged to the second circuit board.

[0021] Further, through hole portions are provided at the first circuit board, the second circuit board, and the third circuit board.

[0022] Thereby, it is convenient to install the first circuit board, the second circuit board, and the third circuit board at corresponding devices.

[0023] Furthermore, the cross-sections of the first support plate, the support feet, and the second support plate are all L-shaped.

[0024] Furthermore, air outlet gaps are formed between the first support plate and the two support feet.

[0025] Furthermore, an air inlet gap is formed between the two second support plates.

[0026] Furthermore, it further includes two pressing units; a U-shaped connecting part is connected between the first pipe part and the second pipe part, and the U-shaped connecting part includes a first convex plate, a second convex plate, and a third connecting plate; the first heat conducting plate is hinged to the first groove part, and the second heat conducting plate is hinged to the second groove part; the pressing unit includes a first L-shaped sliding seat, a first pressing plate, a first limiting rod, an inserting rod, a second L-shaped sliding seat, a second pressing plate, and a second limiting rod, and a jack is provided at the second limiting rod; the first L-shaped sliding seat has a first slot, and the second L-shaped sliding seat has a second slot.

[0027] Furthermore, locking bolts are provided at both the first L-shaped sliding seat and the second L-shaped sliding seat.

[0028] Furthermore, the first pressing plate is fixedly connected to the first L-shaped sliding seat, the first limiting rod is fixedly connected to the first pressing plate, and the inserting rod is fixedly connected to the first limiting rod.

[0029] Furthermore, the second pressing plate is fixedly connected to the second L-shaped sliding seat, the second limiting rod is fixedly connected to the second pressing plate, and the jack cooperates with the inserting rod.

[0030] Furthermore, the two pressing units respectively cooperate with the first connecting part and the second connecting part.

[0031] Furthermore, the first convex plate is fixedly connected to the first pipe part, and the second convex plate is fixedly connected to the second pipe part.

[0032] Furthermore, the third connecting plate connects the first convex plate and the second convex plate.

[0033] Furthermore, the third connecting plate is fixedly connected to the third circuit board.

[0034] Furthermore, the inserting rod has a rubber coating.

[0035] Thereby, the friction force when the inserting rod and the slot cooperate is increased, and the inserting rod can only be disengaged from the slot under the action of an external force.

[0036] Furthermore, the third circuit board has a rectangular notch.

[0037] Furthermore, the rectangular notch is located between the first convex plate and the second convex plate.

[0038] This makes the first circuit board and the second circuit board farther from the core components at the third circuit board, avoiding interference to the first circuit board and the second circuit board.

[0039] Further, the slots of the first L-shaped sliding seat and the second L-shaped sliding seat of the pressing unit cooperating with the first connecting portion are inserted by the first convex plate; the slots of the first L-shaped sliding seat and the second L-shaped sliding seat of the pressing unit cooperating with the second connecting portion are inserted by the second convex plate.

[0040] Further, both the first pressing plate and the second pressing plate are in an elastic bent shape.

[0041] Thus, the first pressing plate and the second pressing plate have a certain downward pressure, so that the first heat conducting plate abuts against the first shielding cover and the second heat conducting plate abuts against the second shielding cover, thereby achieving better heat conduction.

[0042] Further, a first heat conducting pad and a plurality of first heat radiating fins are provided at the first heat conducting plate.

[0043] Thus, heat dissipation of the first circuit board can be achieved.

[0044] Further, a second heat conducting pad and a plurality of second heat radiating fins are provided at the second heat conducting plate.

[0045] Thus, heat dissipation of the second circuit board can be achieved.

[0046] Further, a plurality of third heat radiating fins are provided at the covering plate; the plurality of first heat radiating fins all have first limiting holes, and the plurality of second heat radiating fins all have second limiting holes.

[0047] Thus, the third heat radiating fins can achieve heat dissipation of the third circuit board.

[0048] Further, the first limiting holes can be inserted by a first limiting rod and a second limiting rod; the second limiting holes can be inserted by the first limiting rod and the second limiting rod.

[0049] Further, a plurality of sensor interface units are installed at the first circuit board.

[0050] Further, a microprocessor and a wireless communication unit are installed at the second circuit board.

[0051] Further, a charging socket, a battery unit, a battery management circuit, and a DC / DC converter are installed at the third circuit board.

[0052] Further, the plurality of sensor interface units include a temperature sensor interface and a humidity sensor interface.

[0053] Furthermore, the multiple sensor interface units include a gas sensor interface and an acceleration sensor interface.

[0054] Furthermore, two first limiting rods are fixedly connected to the first pressing plate, and two second limiting rods are fixedly connected to the second pressing plate.

[0055] Furthermore, each first heat dissipation fin has two first limiting holes, and each second heat dissipation fin has two second limiting holes.

[0056] Furthermore, the first fixing plate, the first connecting plate, the second fixing plate, the second connecting plate, the third connecting plate, the first supporting plate, the two supporting feet, and the two second supporting plates all have bolt through holes, and the first circuit board, the second circuit board, and the third circuit board all have threaded holes that cooperate with the bolt through holes.

[0057] Furthermore, the first connecting portion and the first circuit board are fixedly connected by bolts.

[0058] Furthermore, the second connecting portion and the second circuit board are fixedly connected by bolts.

[0059] Furthermore, the third connecting portion and the third circuit board are fixedly connected by bolts.

[0060] Furthermore, the first heat conducting plate, the second heat conducting plate, and the cover plate are all made of metal materials.

[0061] Preferably, it is made of copper-aluminum alloy.

[0062] Furthermore, the first pipe portion and the second pipe portion are both made of metal materials.

[0063] Preferably, it is made of copper-aluminum alloy.

[0064] Beneficial effects:

[0065] 1. For the circuit board of the present application, a modular assembly method of multiple circuit boards is adopted to achieve modular operation, thereby reducing the maintenance cost when maintenance is required.

[0066] 2. For the circuit board of the present application, the reinforcement connection unit can achieve the reinforcement connection of multiple modules and can also achieve the heat dissipation of each module. Description of the Drawings

[0067] Figure 1 is a schematic diagram of the circuit board;

[0068] Figure 2 is an enlarged view of area A;

[0069] Figure 3 is an enlarged view of area B;

[0070] Figure 4 Schematic diagram of the separation of the first L-shaped sliding seat and the second L-shaped sliding seat;

[0071] Figure 5 Enlarged view of area C;

[0072] Figure 6 Enlarged view of area D;

[0073] Figure 7 Schematic diagram of the opening of the first and second heat conducting plates and the first and second shielding covers;

[0074] Figure 8 Enlarged view of area E;

[0075] Figure 9 Schematic diagram of the separation of the reinforcement connection unit from the first, second, and third circuit board units;

[0076] Figure 10 Enlarged view of area F;

[0077] Figure 11 Schematic diagram of the separation of the first, second, and third circuit board units;

[0078] Figure 12 Enlarged view of area G;

[0079] Figure 13 Enlarged view of area H.

[0080] Explanation of reference numerals: First circuit board 1.1; First socket unit 1.2; First wire socket 1.3; First shielding cover 1.4; Sensor interface unit 1.5; Second circuit board 2.1; Second socket unit 2.2; Second wire socket 2.3; Second shielding cover 2.4; Third circuit board 3.1; Rectangular notch 3.1.1; First interface unit 3.2; Second interface unit 3.3; Charging socket 3.4; Battery unit 3.5; First tube part 4.1; First fixing plate 4.2; First connecting plate 4.3; First heat conducting plate 5; First heat conducting pad 5.1; First heat dissipating fin 5.2; First limiting hole 5.2.1; Second tube part 6.1; Second fixing plate 6.2; Second connecting plate 6.3; Second heat conducting plate 7; Second heat dissipating fin 7.1; Second limiting hole 7.1.1; Cover plate 8.1; First support plate 8.2; Support foot 8.3; Second support plate 8.4; Third heat dissipating fin 8.5; Third connecting plate 9; First L-shaped sliding seat 10.1; First pressing plate 10.2; First limiting rod 10.3; Plug rod 10.4; Second L-shaped sliding seat 10.5; Second pressing plate 10.6; Second limiting rod 10.7; Locking bolt 10.8. Specific implementation mode

[0081] Embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where like or similar reference numerals denote like or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present invention, and should not be construed as limiting the present invention.

[0082] The present invention provides a modular high-strength and efficient heat-dissipating circuit board as shown in the figure, which includes a first circuit board unit, a second circuit board unit, a third circuit board unit, and a reinforcement connection unit; the first circuit board unit includes a first circuit board 1.1, a first socket unit 1.2 and a first socket base 1.3 are installed at the first circuit board 1.1, the second circuit board unit includes a second circuit board 2.1, a second socket unit 2.2 and a second socket base 2.3 are installed at the second circuit board 2.1, the third circuit board unit includes a third circuit board 3.1, a first interface unit 3.2 capable of being inserted into the first socket unit 1.2 and a second interface unit 3.3 capable of being inserted into the second socket unit 2.2 are installed at the third circuit board 3.1; a connection wire (not shown in the figure) is connected between the first socket base 1.3 and the second socket base 2.3; the reinforcement connection unit includes a first connection part fixedly connected to the first circuit board 1.1, a second connection part fixedly connected to the second circuit board 2.1, and a third connection part fixedly connected to the third circuit board 3.1, and the third connection part is fixedly connected to both the first connection part and the second connection part. A first shielding cover 1.4 is hingedly installed at the first circuit board 1.1, and a second shielding cover 2.4 is hingedly installed at the second circuit board 2.1; the first connection part includes a first pipe part 4.1, a first fixing plate 4.2 connected to the first pipe part 4.1, and a first connecting plate 4.3 connected to the first pipe part 4.1. The first pipe part 4.1 has a first groove part, and a first heat-conducting plate 5 capable of abutting against the first shielding cover 1.4 is installed at the first groove part. The first fixing plate 4.2 is fixedly connected to the first circuit board 1.1, and the first connecting plate 4.3 is fixedly connected to both the first circuit board 1.1 and the third circuit board 3.1; the second connection part includes a second pipe part 6.1, a second fixing plate 6.2 connected to the second pipe part 6.1, and a second connecting plate 6.3 connected to the second pipe part 6.1. The second pipe part 6.1 has a second groove part, and a second heat-conducting plate 7 capable of abutting against the second shielding cover 2.4 is installed at the second groove part. The second fixing plate 6.2 is fixedly connected to the second circuit board 2.1, and the second connecting plate 6.3 is fixedly connected to both the second circuit board 2.1 and the third circuit board 3.1; the third connection part includes a cover plate 8.1, a first support plate 8.2, two support feet 8.3, and two second support plates 8.4, and the first support plate 8.2, the two support feet 8.3, and the two second support plates 8.4 are all fixedly connected to the third circuit board 3.1.

[0083] The cross-sections of the first support plate 8.2, the support feet 8.3 and the second support plate 8.4 are all L-shaped; air outlet gaps are formed between the first support plate 8.2 and the two support feet 8.3; an air inlet gap is formed between the two second support plates 8.4. A first heat conduction pad 5.1 and a plurality of first heat dissipation fins 5.2 are provided at the first heat conduction plate 5; a second heat conduction pad and a plurality of second heat dissipation fins 7.1 are provided at the second heat conduction plate 7; a plurality of third heat dissipation fins 8.5 are provided at the covering plate 8.1. The circuit board further includes two pressing units which respectively cooperate with the first connection part and the second connection part; a U-shaped connection part is connected between the first pipe part 4.1 and the second pipe part 6.1. The U-shaped connection part includes a first convex plate fixedly connected to the first pipe part 4.1, a second convex plate fixedly connected to the second pipe part 6.1, and a third connecting plate 9 connecting the first convex plate and the second convex plate. The third connecting plate 9 is fixedly connected to the third circuit board 3.1; the first heat conduction plate 5 is hinged to the first groove part, and the second heat conduction plate 7 is hinged to the second groove part; the pressing unit includes a first L-shaped sliding seat 10.1, a first pressing plate 10.2 connected to the first L-shaped sliding seat 10.1, a first limiting rod 10.3 fixedly connected to the first pressing plate 10.2, a plug rod 10.4 connected to the first limiting rod 10.3, a second L-shaped sliding seat 10.5, a second pressing plate 10.6 connected to the second L-shaped sliding seat 10.5, and a second limiting rod 10.7 fixedly connected to the second pressing plate 10.6. A jack cooperating with the plug rod 10.4 is provided at the second limiting rod 10.7; a first slot is provided at the first L-shaped sliding seat 10.1, a second slot is provided at the second L-shaped sliding seat 10.5, a plurality of first heat dissipation fins 5.2 each have a first limiting hole 5.2.1, and a plurality of second heat dissipation fins 7.1 each have a second limiting hole 7.1.1; locking bolts 10.8 are provided at both the first L-shaped sliding seat 10.1 and the second L-shaped sliding seat 10.5.

[0084] A plurality of sensor interface units 1.5 are installed at the first circuit board 1.1; a microprocessor and a wireless communication unit are installed at the second circuit board 2.1; a charging socket 3.4, a battery unit 3.5, a battery management circuit, and a DC / DC converter are installed at the third circuit board 3.1. Two first limiting rods 10.3 are fixedly connected to the first pressing plate 10.2, and two second limiting rods 10.7 are fixedly connected to the second pressing plate 10.6; each first heat dissipation fin 5.2 has two first limiting holes 5.2.1, and each second heat dissipation fin 7.1 has two second limiting holes 7.1.1. Bolt through holes are provided at the first fixing plate 4.2, the first connecting plate 4.3, the second fixing plate 6.2, the second connecting plate 6.3, the third connecting plate 9, the first supporting plate 8.2, the two supporting feet 8.3, and the two second supporting plates 8.4, and threaded holes for cooperating with the bolt through holes are provided at the first circuit board 1.1, the second circuit board 2.1, and the third circuit board 3.1.

[0085] Working principle: The circuit board of this application consists of a first circuit board unit, a second circuit board unit, and a third circuit board unit, so that the circuit board can be composed of multiple modular circuit boards. In the embodiment of this application, the third circuit board unit supplies power to the first circuit board unit and the second circuit board unit. A variety of sensors can be connected and installed at the first circuit board unit (the sensors can be connected to the sensor interface unit through sensor connecting wires and connectors), and communication with the microprocessor can be achieved through the connecting wires. The microprocessor can achieve overall control and data processing, and the remote communication unit can achieve remote communication. The first circuit board unit and the third circuit board unit, and the second circuit board unit and the third circuit board unit can be directly plugged and unplugged, and the first circuit board unit and the second circuit board unit are connected by connecting wires.

[0086] Moreover, the first connection part, the second connection part, and the third connection part are fixedly connected to the first circuit board, the second circuit board, and the third circuit board respectively, so that the connection between the first circuit board unit, the second circuit board unit, and the third circuit board unit is strengthened, making the entire circuit board more stable. The first circuit board unit has a first shielding cover, and the second circuit board unit has a second shielding cover, so that the first circuit board unit and the second circuit board unit can be prevented from being interfered by the current at the third circuit board unit. The first heat conducting plate abuts against the first shielding cover, and the second heat conducting plate abuts against the second shielding cover, so that the first heat dissipation fins at the first heat conducting plate and the second heat dissipation fins at the second heat conducting plate can dissipate heat from the first and second circuit boards. The third heat dissipation fins at the cover plate of the third circuit board can also dissipate heat from the third circuit board. During actual use, the third circuit board has higher heat dissipation requirements due to the installation of battery units, DC / DC converters, etc., while the heat dissipation requirements of the first circuit board and the second circuit board are relatively low. Therefore, the first pipe part and the second pipe part can be used to connect the air flow generating device (such as a cooling fan or a ventilation pipe with cooling air flow) at the device where the circuit board is located. The cooling air flow of the first and second pipe parts can quickly take away the heat of the first and second heat conducting plates. Moreover, the cooling air flow will directly blow the space between the third circuit board and the cover plate from the other ends of the first and second pipe parts, so that a better heat dissipation effect can be obtained at the position of the third circuit board.

[0087] In addition, the first shielding cover and the second shielding cover of the present application are hinged, and the first heat conducting plate and the second heat conducting plate are also hinged. When the first L-shaped sliding seat and the second L-shaped sliding seat of the pressing unit approach each other, the insertion rod and the insertion hole can cooperate with each other, thereby playing a role in limiting and pressing the heat conducting plate and the shielding cover. On the one hand, the shielding cover and the heat conducting plate are limited and pressed, and on the other hand, better heat conduction effect can be achieved by pressing. After the first L-shaped sliding seat and the second L-shaped sliding seat move away from each other, the heat conducting plate and the shielding cover can be easily opened, so that when maintenance is needed, the circuit board can be easily maintained.

[0088] Although the present invention has been illustrated and described with respect to the preferred embodiments, those skilled in the art should understand that various changes and modifications can be made to the present invention as long as they do not exceed the scope defined by the claims of the present invention.

Claims

1. A modular high-strength and highly efficient heat-dissipating circuit board, characterized in that, It includes a first circuit board unit, a second circuit board unit, a third circuit board unit, and a reinforcement connection unit; the first circuit board unit includes a first circuit board, where a first socket unit and a first socket base are installed; the second circuit board unit includes a second circuit board, where a second socket unit and a second socket base are installed; the third circuit board unit includes a third circuit board, where a first interface unit and a second interface unit are installed; a connection wire is connected between the first socket base and the second socket base; the reinforcement connection unit includes a first connection part, a second connection part, and a third connection part.

2. The modular high-strength and highly efficient heat-dissipating circuit board according to claim 1, characterized in that, A first shielding cover is hingedly installed on the first circuit board, and a second shielding cover is hingedly installed on the second circuit board; the first connection part includes a first pipe part, a first fixing plate, and a first connecting plate, where a first groove part is provided on the first pipe part, and a first heat conducting plate is installed at the first groove part; the second connection part includes a second pipe part, a second fixing plate, and a second connecting plate, where a second groove part is provided on the second pipe part, and a second heat conducting plate is installed at the second groove part; the third connection part includes a covering plate, a first support plate, two support feet, and two second support plates.

3. The modular high-strength and highly efficient heat-dissipating circuit board according to claim 2, wherein The cross-sections of the first support plate, the support feet, and the second support plates are all L-shaped; air outlet gaps are formed between the first support plate and the two support feet; an air inlet gap is formed between the two second support plates.

4. The modular high-strength and highly efficient heat-dissipating circuit board according to claim 2, wherein It further includes two pressing units; a U-shaped connection part is connected between the first pipe part and the second pipe part, and the U-shaped connection part includes a first convex plate, a second convex plate, and a third connecting plate; the first heat conducting plate is hinged to the first groove part, and the second heat conducting plate is hinged to the second groove part; the pressing unit includes a first L-shaped sliding seat, a first pressing plate, a first limiting rod, a plug rod, a second L-shaped sliding seat, a second pressing plate, and a second limiting rod, where a jack is provided at the second limiting rod; the first L-shaped sliding seat has a first slot, the second L-shaped sliding seat has a second slot, and locking bolts are provided at both the first L-shaped sliding seat and the second L-shaped sliding seat.

5. The modular high-strength and high-efficiency heat dissipation circuit board according to claim 4, wherein The first heat conducting plate is provided with a first heat conducting pad and a plurality of first heat dissipation fins; the second heat conducting plate is provided with a second heat conducting pad and a plurality of second heat dissipation fins; the covering plate is provided with a plurality of third heat dissipation fins; a plurality of first heat dissipation fins all have first limiting holes, and a plurality of second heat dissipation fins all have second limiting holes.

6. The modular high-strength and highly efficient heat-dissipating circuit board according to claim 4, characterized in that, A plurality of sensor interface units are installed on the first circuit board; a microprocessor and a wireless communication unit are installed on the second circuit board; a charging socket, a battery unit, a battery management circuit, and a DC-DC converter are installed on the third circuit board.

7. The modular high-strength and highly efficient heat-dissipating circuit board according to claim 4, wherein Two first limiting rods are fixedly connected to the first pressing plate, and two second limiting rods are fixedly connected to the second pressing plate; each first heat dissipation fin has two first limiting holes, and each second heat dissipation fin has two second limiting holes.

8. The modular high-strength and highly efficient heat-dissipating circuit board according to claim 4, wherein Bolt through holes are provided at the first fixing plate, the first connecting plate, the second fixing plate, the second connecting plate, the third connecting plate, the first support plate, the two support feet, and the two second support plates, and threaded holes matching the bolt through holes are provided on the first circuit board, the second circuit board, and the third circuit board.

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