Display module and display device

Abstract

The invention provides a display module and a display device.The display module comprises a display panel, the display panel is provided with a display side and a non-display side which are arranged oppositely, the display panel comprises a display area and a binding area located on one side of the display area, and the binding area is connected with a flexible circuit board in a binding mode; the backboard is at least partially arranged on the non-display side of the display panel, the flexible circuit board extends and is attached to the surface of the side, away from the display panel, of the backboard, and the flexible circuit board comprises a first surface attached to the backboard and a second surface opposite to the first surface; at least one of the first surface and the second surface is provided with at least one copper exposing area; wherein at least part of the copper exposing area is in conduction connection with the back plate; and / or at least one of the first surface and the second surface is covered with an electromagnetic shielding layer, and the electromagnetic shielding layer covers and conducts at least part of the copper exposing area. According to the display module and the display device provided by the invention, the performance and the stability of the display module can be improved.

Description

Technical Field

[0001] The present disclosure relates to the field of display technologies, and particularly to a display module and a display device. Background Art

[0002] For a display module, electrostatic discharge (ESD) risk and electromagnetic compatibility (EMC) are two important considerations, which directly affect the performance and reliability of the device. Summary of the Invention

[0003] To solve at least one of the above-mentioned related technical problems, embodiments of the present disclosure provide a display module and a display device.

[0004] The technical solutions provided by the embodiments of the present disclosure are as follows:

[0005] In a first aspect, embodiments of the present disclosure provide a display module, including:

[0006] A display panel having a display side and a non-display side disposed opposite to each other. The display panel includes a display area and a bonding area located on one side of the display area. A flexible circuit board is bonded and connected in the bonding area; and

[0007] A backplane, at least part of which is disposed on the non-display side of the display panel, and the flexible circuit board extends and adheres to a surface of the backplane facing away from the display panel. The flexible circuit board includes a first surface adhered to the backplane and a second surface opposite to the first surface. At least one exposed copper area is provided on at least one of the first surface and the second surface; wherein,

[0008] At least part of the exposed copper area is conductively connected to the backplane; and / or,

[0009] An electromagnetic shielding layer is covered on at least one of the first surface and the second surface, and the electromagnetic shielding layer covers and conducts at least part of the exposed copper area.

[0010] Exemplarily, the backplane is provided with a perforation near the bonding area, and the flexible circuit board extends through the perforation and then adheres to a surface of the backplane facing away from the display panel.

[0011] Exemplarily, the backplane is grounded, a first exposed copper area is provided on the first surface, and the first surface and the backplane are adhered by a conductive adhesive, and the conductive adhesive covers at least part of the first exposed copper area to conduct the first exposed copper area and the backplane.

[0012] Exemplarily, alignment marks are provided on at least one of the surface of the backplane facing away from the display panel and the first surface, and the alignment marks are used to align the conductive adhesive with the first exposed copper area.

[0013] Exemplarily, the flexible circuit board has a first end connecting the bonding area and a second end disposed opposite to the first end. The alignment marks include a first positioning mark provided on the surface of the backplane facing away from the display panel, wherein,

[0014] the first positioning mark is configured to position the conductive adhesive and the backplane at least in a first direction and a second direction. The first direction is the direction from the first end to the second end, and the second direction is perpendicular to the first direction and parallel to the surface of the backplane away from the display panel.

[0015] Exemplarily, the first positioning mark at least includes two sub - marks spaced apart along the second direction. Each sub - mark includes a first branch extending along the first direction and a second branch extending along the second direction. The first branch intersects with the second branch, and the two sub - marks enclose a positioning cavity defining the position of the conductive adhesive.

[0016] Exemplarily, the first positioning mark has a first height in a third direction perpendicular to the surface of the backplane away from the display panel, and the conductive adhesive has a first thickness in the third direction. The first height is less than or equal to the first thickness.

[0017] Exemplarily, the alignment marks further include:

[0018] a second positioning mark located on the surface of the backplane away from the display panel; and

[0019] a third positioning mark provided on the first surface. The second positioning mark and the third positioning mark are in alignment cooperation for aligning the flexible circuit board and the backplane.

[0020] Exemplarily, the flexible circuit board has a first end connecting the bonding area and a second end disposed opposite to the first end. Both the second positioning mark and the third positioning mark include alignment marks extending along the second direction to position the flexible circuit board and the backplane at least in the first direction;

[0021] wherein, the first direction is the direction from the first end to the second end; the second direction is perpendicular to the first direction and parallel to the surface of the backplane away from the display panel.

[0022] Exemplarily, the second positioning mark and the third positioning mark have a predetermined length along the second direction, and the first surface has a predetermined width along the second direction at the position where the third positioning mark is disposed, wherein the predetermined length is greater than or equal to 2 / 3 of the predetermined width.

[0023] Exemplarily, the flexible circuit board has a first end connecting the bonding area and a second end disposed opposite to the first end, and at least a part of the conductive adhesive is disposed in the area on the first surface close to the first end.

[0024] Exemplarily, the second end is a free end without an assembled printed circuit board.

[0025] Exemplarily, at least one second copper exposed area is provided on the second surface, the electromagnetic shielding layer is covered on the second surface, and the electromagnetic shielding layer covers at least a part of the second copper exposed area.

[0026] Exemplarily, the backplane is a metal casting.

[0027] In a second aspect, an embodiment of the present disclosure further provides a display device, which includes the display module as described above.

[0028] The beneficial effects brought by the embodiments of the present disclosure are as follows:

[0029] In the display module and the display device provided by the embodiments of the present disclosure, by providing a copper exposed area on the surface of the flexible circuit board, and by conducting at least a part of the copper exposed area with the backplane and / or covering an electromagnetic shielding layer on the surface of the flexible circuit board and covering and conducting the electromagnetic shielding layer with at least a part of the copper exposed area, the static electricity risk is reduced, the electromagnetic compatibility is improved, and the electromagnetic compatibility performance and display stability of the display module are enhanced. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic partial cross-sectional structure diagram of a display module in some embodiments of the present disclosure;

[0031] Figure 2 A schematic structural diagram of the backplane of the display module from the back view angle in some embodiments of the present disclosure;

[0032] Figure 3 A schematic structural diagram of the back surface of the backplane in the display module in some embodiments of the present disclosure;

[0033] Figure 4 Indicating Figure 3 A partial enlarged view of the dashed box E in

[0034] Figure 5 A schematic diagram of the first surface of the flexible circuit board in some embodiments of the present disclosure;

[0035] Figure 6 Schematic diagram showing the alignment relationship between the flexible circuit board and the backplane of the display module in some embodiments of the present disclosure;

[0036] Figure 7 Schematic diagram of the second surface of the flexible circuit board in some embodiments of the present disclosure;

[0037] Figure 8 Indicates Figure 7 Cross-sectional view taken along the F-F' direction in

[0038] Figure 9 Second schematic diagram of the first surface of the flexible circuit board in some embodiments of the present disclosure. Detailed implementation manners

[0039] To make the objectives, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. Apparently, the described embodiments are some, but not all, of the embodiments of the present disclosure. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present disclosure without creative efforts shall fall within the scope of protection of the present disclosure.

[0040] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the ordinary meanings understood by those of ordinary skill in the art belonging to the field of the present disclosure. The "first", "second" and similar terms used in the present disclosure do not denote any order, quantity or importance, but are only used to distinguish different components. Similarly, the terms such as "a", "an" or "the" do not denote a quantity limitation, but mean that there is at least one. The terms such as "comprising" or "including" mean that the elements or items appearing before the term cover the elements or items listed after the term and their equivalents, without excluding other elements or items. The terms such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The terms such as "upper", "lower", "left" and "right" are only used to indicate relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0041] In the embodiments of the present disclosure, features such as "parallel", "perpendicular", and "identical" include the strictly defined features of "parallel", "perpendicular", "identical", etc., as well as cases with certain tolerances such as "substantially parallel", "substantially perpendicular", "substantially identical", etc. Considering measurement and tolerances related to the measurement of specific quantities (e.g., limitations of the measurement system), it means within the acceptable deviation range for a specific value determined by those of ordinary skill in the art. For example, "substantially" can mean within one or more standard deviations, or within 3% or 5% of the value.

[0042] In addition, in this document, unless otherwise defined, the terms "substantially", "essentially", "about", and "approximately" are used to describe and account for small variations. When used in conjunction with an event or situation, these terms can cover both the exact occurrence of the event or situation and the approximate occurrence of the event or situation. For example, when used with a numerical value, these terms can include a variation range of less than or equal to 10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, less than or equal to ±0.05%. The term "substantially coplanar" can mean that two surfaces are arranged along the same plane within a micron range, for example, within 40μm, 30μm, 20μm, 10μm, or 1μm along the same plane.

[0043] It should be understood that in the exemplary embodiments of the present disclosure, when a layer or element is referred to as being on another layer or substrate, it may be that the layer or element is directly on the other layer or substrate, or there may be an intermediate layer between the layer or element and the other layer or substrate. "A and B are arranged on the same layer" means that after A and B are formed into a film layer for forming a specific pattern using the same film-forming process, a layer structure is formed through a single patterning process using the same mask.

[0044] In this document, the expression "terminal" refers to the part of a chip or circuit board that is electrically connected to external leads, traces, electrodes, etc., including but not limited to the pad of the chip.

[0045] For a display module, electrostatic (ESD) risk and electromagnetic compatibility (EMC) are two important considerations, which directly affect the performance and reliability of the device. The performance and reliability of the display device can be improved by improving the anti-static and electromagnetic compatibility performance of the flexible circuit board on the display panel. Therefore, it is necessary to optimize the structure of the flexible circuit board in combination with the overall structure of the display module to improve the electrostatic and electromagnetic compatibility (EMC) performance.

[0046] Such as Figure 1As shown, the display module provided by the embodiment of the present disclosure includes a display panel 100 and a back panel 200. The display panel 100 has a display side and a non-display side disposed opposite to each other. The display side refers to the side of the display panel 100 used to display the picture. The non-display side refers to the side disposed opposite to the display side.

[0047] The back plate 200 is at least partially disposed on the non-display side of the display panel 100. For example, see Figure 1 As shown, the back plate 200 may include a bottom plate 210 and side plates 220 . The bottom plate 210 is located at a non-display side of the display panel 100 , and the side plates 220 may be located around the display panel 100 .

[0048] The display panel 100 includes a display area AA and a peripheral area located outside the display area AA. The display area AA is provided with pixels for displaying images. The peripheral area is provided with a driving circuit and a conductive line for achieving the purpose of driving pixels.

[0049] The peripheral area includes a binding area DP located on at least one side of the display area AA, and the binding area DP can be bound and connected to the flexible circuit board 300. For example, the binding area DP can be provided with binding pins and signal lines, and the binding pins can be bound to the flexible circuit board 300. The binding area DP can also be bound and connected to a driver chip, or the driver chip can also be integrated on the flexible circuit board 300, which is not limited in the embodiment of the present application.

[0050] The peripheral area or the flexible circuit board 300 may include a bending area B. Figure 1 As shown in the example, a bending area B is provided on the flexible circuit board 300. A conductive circuit is provided on the same side of the bending area B as the display side. When the bending area B is not bent, the side of the bending area B on which the conductive circuit is provided is on the same side as the display side. When the bending area B is bent, the flexible circuit board 300 can be driven to extend to the side surface of the back plate 200 away from the display panel 100, and the flexible circuit board 300 is attached to the side surface of the back plate 200 away from the display panel 100. For the convenience of description, the side surface of the back plate 200 away from the display panel 100 is referred to as the back side 240 of the back plate 200 below.

[0051] The flexible circuit board 300 includes a first surface 310 and a second surface 320 which are arranged opposite to each other. When the bending area B is not bent, the second surface 320 (the front side of the flexible circuit board 300) is on the same side as the display side of the display panel 100. When the bending area B is bent, the first surface 310 (the back side of the flexible circuit board 300) is attached to the back surface 240 of the backplane 200.

[0052] In some embodiments, please refer to Figures 5 to 9 , at least one exposed copper area T is provided on at least one of the first surface 310 and the second surface 320, and at least part of the exposed copper area T is conductively connected to the backplane 200. For example, the backplane 200 can be partially or integrally grounded. In this way, by conducting the exposed copper area T to the backplane 200, the exposed copper area T can be grounded to timely conduct away the static electricity of the flexible circuit board 300 and reduce the static electricity risk.

[0053] In other embodiments, as Figure 7 and Figure 8 shown, an electromagnetic shielding layer 330 is covered on at least one of the first surface 310 and the second surface 320, and the electromagnetic shielding layer 330 covers and conducts at least part of the exposed copper area T. For example, the electromagnetic shielding layer 330 can be a shielding coating, or an electromagnetic shielding tape, etc. In this way, by covering the electromagnetic shielding layer 330 on the surface of the flexible circuit board 300 and making the electromagnetic shielding layer 330 cover and conduct at least part of the exposed copper area T, the electromagnetic compatibility of the display module can be improved.

[0054] In other embodiments, at least part of the exposed copper area T is conductively connected to the backplane 200, an electromagnetic shielding layer 330 is covered on at least one of the first surface 310 and the second surface 320, and the electromagnetic shielding layer 330 covers and conducts at least part of the exposed copper area T. In this way, by conducting the exposed copper area T to the backplane 200, the exposed copper area T can be grounded to timely conduct away the static electricity of the flexible circuit board 300 and reduce the static electricity risk, and by covering the electromagnetic shielding layer 330 on the surface of the flexible circuit board 300 and making the electromagnetic shielding layer 330 cover and conduct at least part of the exposed copper area T, the electromagnetic compatibility of the display module can be improved.

[0055] In some embodiments, at least one of the exposed copper areas T is respectively provided on the first surface 310 and the second surface 320, and the exposed copper area T on one of the first surface 310 and the second surface 320 is conductively connected to the backplane 200, and the exposed copper area T on the other one is covered and conducted by the electromagnetic shielding layer 330.

[0056] For example, since the first surface 310 is attached to the back surface 240 of the back plate 200, and the second surface 320 faces away from the back surface 240 of the back plate 200, at least one exposed copper region T can be provided on the first surface 310 and is electrically connected to the back plate 200, while at least one second exposed copper region T2 is provided on the second surface 320 and is covered with the electromagnetic shielding layer 330. However, this is not a limitation.

[0057] Taking the in-vehicle display module as an example, there are various ways to ship the display module. For example, in one shipping method, a printed circuit board is assembled on the flexible circuit board 300. In this case, both the flexible circuit board 300 and the printed circuit board can be entirely covered with conductive tape on the front side (i.e., the side facing away from the display panel 100) to improve the static electricity problem.

[0058] In another shipping method, the printed circuit board of the display module may need to be integrated with the printed circuit boards of other system ends of products such as vehicles, that is, a two-in-one board design. At this time, the flexible circuit board 300 can be shipped as an empty board. Shipping an empty board means shipping the flexible circuit board 300 without an assembled printed circuit board. In this empty-board shipping method, the two-in-one printed circuit board design has a high integration level but a weak anti-interference ability and does not meet the requirements of electrostatic or electromagnetic compatibility (ESD / EMC) tests with relatively high requirements. Moreover, during electrostatic or electromagnetic compatibility tests, it is often strongly related to the printed circuit board and structural design of the entire display module. Once the electrostatic or electromagnetic compatibility test fails, it will incur relatively high design change costs.

[0059] Therefore, for the display module using the empty-board shipping method, the embodiments of the present disclosure perform an overall structure optimization design for improving the anti-static performance and electromagnetic compatibility of the display module.

[0060] Taking Figures 2 to 4 as an example, in some embodiments, the back plate 200 is provided with a through hole 230 near the bonding area DP. After passing through the through hole 230, the flexible circuit board 300 extends and is attached to the back surface 240 of the back plate 200 (i.e., the surface on the side away from the display panel 100).

[0061] In this way, it is convenient to expose the flexible circuit board 300 outside the back plate 200 for subsequent assembly with the printed circuit board. For example, the flexible circuit board 300 can be an empty board without an assembled printed circuit board. In other words, the display module can be shipped in the empty-board shipping method. However, this is not a limitation. In practical applications, in some application scenarios, when the flexible circuit board 300 is assembled with the printed circuit board, the flexible circuit board 300 can also pass through the through hole 230 and then extend and be attached to the back surface 240 of the back plate 200.

[0062] In the above-mentioned empty board shipping method, the flexible circuit board 300 needs to be subsequently assembled with a printed circuit board. The second surface 320 (front side) of the flexible circuit board 300 is not easy to be attached with a conductive tape or the like for grounding and anti-static treatment, which will interfere with the structural design. Therefore, in some embodiments, for example, Figure 5 As shown, at least one copper-exposed area T is disposed on the first surface 310. For ease of description, the copper-exposed area T disposed on the first surface 310 is referred to as a first copper-exposed area T1. The back plate 200 is grounded, and the first surface 310 and the back plate 200 can be bonded together by a conductive adhesive 400, and the conductive adhesive 400 covers at least a portion of the first copper-exposed area T1, so as to conduct electricity between the first copper-exposed area T1 and the back plate 200.

[0063] By adopting the above scheme, a first copper exposed area T1 can be set on the back side (i.e., the first surface 310) of the flexible circuit board 300, and the conductive adhesive 400 attached between the flexible circuit board 300 and the back plate 200 is directly used to achieve the purpose of connecting the first copper exposed area T1 with the back plate 200. The structure is simple and the assembly is convenient. The structural connection relationship between the back plate 200, the conductive adhesive 400 and the flexible circuit board 300 is cleverly used to achieve an anti-static effect.

[0064] It should be noted that the back plate 200 is grounded, and there are multiple ways to ground the back plate 200. For example, the back plate 200 can be connected to the grounding system of the display module through a wire or a conductive point; or, grounding points are set at multiple positions on the back plate 200. The grounding method of the back plate 200 is not limited here. The back plate 200 can be made of a conductive material such as metal. For example, the back plate 200 can be a metal die-casting.

[0065] In addition, in order to ensure that the first copper exposed area T1 can be correctly attached to the conductive adhesive 400 after the flexible circuit board 300 is bent in the bending area B, in some embodiments, as shown in the figure, a positioning mark 500 can be provided on at least one of the back side 240 (the side surface facing away from the display panel 100) of the back plate 200 and the first surface 310, and the positioning mark 500 can be used to align the conductive adhesive 400 with the first copper exposed area T1.

[0066] Specifically, in some embodiments, Figure 2 and Figure 5As shown, the flexible circuit board 300 has a first end 300a and a second end 300b that are oppositely arranged. The first end 300a is bound and connected to the bonding area DP, and the second end 300b can be used to assemble a printed circuit board. Specifically, the second end 300b can be electrically connected to the printed circuit board through a connector, such as a snap fastener or a connector with a gap structure. The embodiments of the present application do not make specific limitations on this.

[0067] As Figures 3 to 4 shown, the alignment mark 500 includes a first positioning mark 510 provided on a surface of the backplane 200 facing away from the display panel 100. The first positioning mark 510 is configured to position the conductive adhesive 400 and the backplane 200 at least in a first direction Y and a second direction X. Among them, the first direction Y is the direction pointing from the first end 300a to the second end 300b, and the second direction X is perpendicular to the first direction Y and parallel to a surface of the backplane 200 facing away from the display panel 100.

[0068] In the above solution, by positioning the fitting position of the conductive adhesive 400 on the backplane 200, the position of the conductive adhesive 400 can be ensured to be accurate, so as to ensure that the position of the conductive adhesive 400 coincides with and conducts with the first exposed copper area T1.

[0069] For example, as Figure 4 shown, the first positioning mark 510 at least includes two sub - marks 511 spaced apart along the second direction X. Each sub - mark 511 includes a first branch 5111 extending along the first direction Y and a second branch 5112 extending along the second direction X. The first branch 5111 intersects with the second branch 5112, and the two sub - marks 511 enclose a positioning cavity that defines the position of the conductive adhesive 400. For example, as Figure 4 shown, the sub - mark 511 can be a right - angled mark. However, it is not limited thereto, and the sub - mark 511 can also be other patterns such as a cross - shaped mark.

[0070] In addition, it should be noted that the first exposed copper area T1, as a grounding structure on the flexible circuit board 300, can be connected to the grounding line on the flexible circuit board 300, and the specific position of the first exposed copper area T1 can be determined according to the specific circuit of the flexible circuit board 300. For example Figure 9 and Figure 5 schematically show two embodiments in which the first exposed copper areas T1 on two flexible circuit boards with different structures are distributed at different positions.

[0071] Please refer to Figure 4 and Figure 5As shown, in some embodiments, at least two of the first exposed copper regions T1 may be spaced apart along the second direction X on the flexible circuit board 300. The conductive adhesive 400 may extend in a strip shape along the second direction X so as to coincide with at least two of the first exposed copper regions T1 in position to achieve conduction while meeting the requirement of the bonding area. However, the positions of the first exposed copper regions T1, the shape of the conductive adhesive 400, etc. are not limited thereto.

[0072] In some exemplary embodiments, the first positioning mark 510 has a first height in a third direction perpendicular to the surface of the backplane 200 away from the display panel 100, and the conductive adhesive 400 has a first thickness in the third direction, and the first height is less than or equal to the first thickness. In this way, good close contact can be ensured between the conductive adhesive 400 and the flexible circuit board 300.

[0073] In addition, in some exemplary embodiments, as Figure 4 and Figure 5 shown, the alignment mark 500 further includes: a second positioning mark 520 located on the surface of the backplane 200 away from the display panel 100; and a third positioning mark 530 provided on the first surface 310, and the second positioning mark 520 and the third positioning mark 530 are in alignment cooperation for aligning the flexible circuit board 300 and the backplane 200.

[0074] Adopting the above solution, after the flexible circuit board 300 is bent in the bending region B, the relative positions of the flexible circuit board 300 and the backplane 200 can be positioned through the second positioning mark 520 and the third positioning mark 530 to ensure accurate alignment between the conductive adhesive 400 and the first exposed copper region T1.

[0075] For example, as Figures 4 to 6 shown, the flexible circuit board 300 has a first end 300a connecting the bonding region DP and a second end 300b disposed opposite to the first end 300a. Both the second positioning mark 520 and the third positioning mark 530 include alignment marks 500 extending along the second direction X to position the flexible circuit board 300 and the backplane 200 in alignment at least in the first direction Y; wherein, the first direction Y is the direction pointing from the first end 300a to the second end 300b; the second direction X is perpendicular to the first direction Y and parallel to the surface of the backplane 200 away from the display panel 100.

[0076] Since the first end 300a of the flexible circuit board 300 is bonded to the bonding area DP and extends out through the through hole 230, the bonding area DP and the through hole 230 can play a certain limiting role in the second direction X for the flexible circuit board 300. Therefore, the flexible circuit board 300 can be limited only in the first direction Y to ensure that the first exposed copper area T1 coincides with the position of the conductive adhesive 400.

[0077] For example, as Figures 4 to 6 shown, the second positioning mark 520 and the third positioning mark 530 can be elongated marks extending along the second direction X. In this way, space can be saved. Of course, it can be understood that through the pattern design of the second positioning mark 520 and the third positioning mark 530, the flexible circuit board 300 can also be limited in both the first direction Y and the second direction X.

[0078] In addition, if the lengths of the second positioning mark 520 and the third positioning mark 530 along the second direction X are too short, it may cause errors in the limiting in the first direction Y. Therefore, as shown in the figure, exemplarily, the second positioning mark 520 and the third positioning mark 530 have a predetermined length along the second direction X, and the first surface 310 has a predetermined width along the second direction X at the position where the third positioning mark 530 is provided, where the predetermined length is greater than or equal to 2 / 3 of the predetermined width. In this way, the lengths of the second positioning mark 520 and the third positioning mark 530 along the second direction X are long enough to ensure accurate limiting of the flexible circuit board 300 in the first direction Y.

[0079] It can be understood that the above is only an exemplary description of the alignment mark 500, and the specific pattern of the alignment mark 500 is not limited thereto.

[0080] In addition, in the case where the flexible circuit board 300 is shipped as an empty board, the second end 300b of the flexible circuit board 300 can be a free end without an assembled printed circuit board to facilitate the assembly of the printed circuit board. If the conductive adhesive 400 is provided at a position close to the second end 300b, the conductive adhesive 400 is likely to be separated from the flexible circuit board 300 during the assembly of the printed circuit board. Therefore, in some exemplary embodiments, as Figures 4 to 6 shown, at least part of the conductive adhesive 400 is provided in the area of the first surface 310 close to the first end 300a. However, it is not limited thereto.

[0081] In addition, in the above embodiments, by providing a first exposed copper area T1 on the back surface (the first surface 310) of the flexible circuit board 300, conduction with the backplane 200 is achieved to realize the anti-static effect. In some exemplary embodiments, such as Figure 7 and Figure 8 as shown, at least one second exposed copper area T2 may be provided on the front surface (the second surface 320) of the flexible circuit board 300. The electromagnetic shielding layer 330 is covered on the second surface 320, and the electromagnetic shielding layer 330 covers at least a part of the second exposed copper area T2. In this way, by covering the electromagnetic shielding layer 330 on the front surface of the flexible circuit board 300, the electromagnetic compatibility can be improved. For the specific position of the second exposed copper area T2, a reasonable selection is made according to the circuit layout of the flexible circuit board. For example Figure 7 illustrates a distribution position of the second exposed copper area T2, but it is not limited thereto.

[0082] The electromagnetic shielding coating can adopt various structures and materials. For example, a conductive coating, a composite material, or a bonded shielding material, etc.

[0083] For example, the conductive coating can be selected from a metal coating or a conductive polymer and other conductive coatings.

[0084] For example, the metal coating can be selected from metal materials such as silver, copper, and aluminum, which are sprayed or electroplated on the second surface 320 of the flexible circuit board 300 to form a conductive coating, providing a good electromagnetic shielding effect.

[0085] For example, the conductive polymer can be selected from a polymer material doped with conductive fillers (such as carbon black and conductive fibers), which is coated on the second surface 320 of the flexible circuit board 300 to achieve a certain shielding effect. For example, the composite material can include a metal-polymer composite material or a multi-layer structure, etc.

[0086] For example, the metal-polymer composite material can be a combination of metal particles or a mesh structure and a polymer, and a composite material that is both light and has shielding performance can be obtained. For example, the multi-layer structure can be a coating of multiple different materials on the flexible circuit board 300. For example, a conductive polymer is used inside and a metal coating is used on the outer layer to improve the shielding efficiency.

[0087] For example, the bonded shielding material can include a metal foil or a shielding film, etc. The metal foil can be a metal foil (such as an aluminum foil or a nickel foil) bonded to the surface of the flexible circuit board 300 to provide an effective shielding effect. For example, the shielding film can be a specially designed electromagnetic shielding film material, which can effectively suppress electromagnetic radiation.

[0088] Among them, in the case of shipping the empty board, no printed circuit board is assembled on the flexible circuit board 300. In order to avoid structural interference, the electromagnetic shielding layer 330 can be implemented by using a conductive coating.

[0089] In addition, as Figures 7 to 8 shown, the flexible circuit board 300 may include a substrate board 301, at least one conductive layer 302 disposed on the substrate board 301, and an insulating layer 303 covering the conductive layer 302, etc. For example, as Figure 8 shown, the flexible circuit board 300 may include two conductive layers 302 respectively disposed on opposite sides of the substrate board 301, and the conductive layers 302 are used to form the circuits on the flexible circuit board 300. Each conductive layer 302 is covered with an insulating layer 303. An opening is provided on the insulating layer 303 to expose the conductive layer 302, forming the exposed copper area T.

[0090] In addition, the embodiments of the present disclosure also provide a display device, which includes the display module provided by the embodiments of the present disclosure. The display device includes, but is not limited to, display devices with display functions such as in-vehicle displays, smart phones, monitors, notebook computers, tablet computers, electronic photo frames, dash cams, smart wearable devices, etc. Other essential components of the display device (such as driver chips) should be understood by those of ordinary skill in the art and will not be elaborated here, nor should they be regarded as a limitation to the present disclosure. Since the principle of solving problems of this display device is similar to that of the above-mentioned display module, therefore, the embodiments of the display device provided by the embodiments of the present disclosure can refer to the embodiments of the above-mentioned display module provided by the embodiments of the present disclosure and will not be elaborated here.

[0091] The following points need to be explained:

[0092] (1) The drawings of the embodiments of the present disclosure only relate to the structures involved in the embodiments of the present disclosure, and other structures can refer to the usual designs.

[0093] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is enlarged or reduced, that is, these drawings are not drawn according to the actual scale. It can be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element can be "directly" on or under the other element or there can be an intermediate element.

[0094] (3) Without conflict, the embodiments of the present disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0095] The above is only a specific implementation manner of the present disclosure, but the protection scope of the present disclosure is not limited thereto. The protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A display module, characterized in that, Comprising: A display panel having a display side and a non-display side disposed opposite to each other. The display panel includes a display area and a bonding area located on one side of the display area, and a flexible circuit board is bonded and connected in the bonding area; and A backplane, at least part of which is disposed on the non-display side of the display panel, and the flexible circuit board extends and adheres to a surface of the backplane facing away from the display panel. The flexible circuit board includes a first surface adhered to the backplane and a second surface disposed opposite to the first surface, and at least one exposed copper area is provided on at least one of the first surface and the second surface; wherein, At least part of the exposed copper area is conductively connected to the backplane; and / or, An electromagnetic shielding layer is covered on at least one of the first surface and the second surface, and the electromagnetic shielding layer covers and conducts at least part of the exposed copper area.

2. The display module according to claim 1, wherein The backplane is provided with a through hole at a position close to the bonding area. After passing through the through hole, the flexible circuit board extends and adheres to a surface of the backplane facing away from the display panel.

3. The display module according to claim 1, wherein The backplane is grounded. A first exposed copper area is provided on the first surface. The first surface and the backplane are adhered by a conductive adhesive, and the conductive adhesive covers at least part of the first exposed copper area to conduct the first exposed copper area and the backplane.

4. The display module according to claim 3, wherein, Alignment marks are provided on at least one of a surface of the backplane facing away from the display panel and the first surface, and the alignment marks are used to align the conductive adhesive with the first exposed copper area.

5. The display module according to claim 4, characterized in that, The flexible circuit board has a first end connecting the bonding area and a second end disposed opposite to the first end. The alignment marks include a first positioning mark provided on a surface of the backplane facing away from the display panel. Among them, The first positioning mark is configured to position the conductive adhesive and the backplane at least in a first direction and a second direction. The first direction is the direction from the first end to the second end, and the second direction is perpendicular to the first direction and parallel to a surface of the backplane away from the display panel.

6. The display module according to claim 5, wherein The first positioning mark at least includes two sub-marks spaced apart along the second direction. Each sub-mark includes a first branch extending along the first direction and a second branch extending along the second direction. The first branch intersects with the second branch, and the two sub-marks enclose a positioning cavity defining the position of the conductive adhesive.

7. The display module according to claim 5, characterized in that, The first positioning mark has a first height in a third direction perpendicular to a surface of the backplane away from the display panel, and the conductive adhesive has a first thickness in the third direction. The first height is less than or equal to the first thickness.

8. The display module according to claim 4, wherein The alignment marks further include: A second positioning mark located on a surface of the backplane away from the display panel; and A third positioning mark provided on the first surface. The second positioning mark and the third positioning mark are in alignment cooperation for aligning the flexible circuit board and the backplane.

9. The display module according to claim 8, wherein The flexible circuit board has a first end connected to the bonding area and a second end disposed opposite to the first end. Both the second positioning mark and the third positioning mark include alignment marks extending in the second direction to position the flexible circuit board and the backplane in alignment at least in the first direction. Wherein, the first direction is the direction pointing from the first end to the second end; the second direction is perpendicular to the first direction and parallel to the surface of the backplane away from the display panel.

10. The display module according to claim 9, wherein, The second positioning mark and the third positioning mark have a predetermined length in the second direction, and the first surface has a predetermined width in the second direction at the position where the third positioning mark is provided, wherein the predetermined length is greater than or equal to 2 / 3 of the predetermined width.

11. The display module according to claim 3, wherein The flexible circuit board has a first end connected to the bonding area and a second end disposed opposite to the first end. At least part of the conductive adhesive is disposed in the area on the first surface near the first end.

12. The display module according to claim 11, wherein The second end is a free end without an assembled printed circuit board.

13. The display module according to claim 1, wherein, At least one second copper exposed area is provided on the second surface. The electromagnetic shielding layer is covered on the second surface, and the electromagnetic shielding layer covers at least part of the second copper exposed area.

14. The display module according to claim 1, wherein The backplane is a metal casting.

15. A display device, characterized in that, Including the display module according to any one of claims 1 to 14.

Images