Circuit board structure for high-frequency signal transmission

Abstract

This application discloses a circuit board structure for high-frequency signal transmission, relating to the field of high-frequency signal conversion technology. It includes connectors, a conversion circuit board, sockets, pins, and a high-frequency connector. The pins are connected to the sockets via an interference fit and to the high-frequency connector via a snap-fit ​​connection. Each pin has a heat-conducting wire inside for heat conduction. A constant-weight solder block is located at the bottom of each pin, which melts when the pin tip is heated, allowing for soldering between the pin tip and the high-frequency connector. This design achieves the technical effects of accurate solder quantity control to avoid echoes caused by impedance changes, improved connection stability and reliability, reduced signal transmission loss, and improved signal transmission stability and efficiency.

Description

Technical Field

[0001] This invention relates to the field of high-frequency signal switching technology, and more particularly to a circuit board structure for high-frequency signal transmission. Background Technology

[0002] In high-frequency signal conversion and transmission, soldering is usually used to connect the high-frequency connector to the adapter board. However, it is difficult to accurately control the amount of solder at the solder joints during the soldering process. Too much or too little solder may cause the signal to echo during transmission.

[0003] Chinese invention patent CN119277645A discloses a high-frequency signal adapter board, including an adapter circuit board and a connector. The connector is also provided with a slot for fixing a high-frequency connector. The adapter circuit board is provided with several photosensitive plate contact points, insertion holes, and a high-frequency signal transmission microstrip line. The photosensitive plate contact points are connected to the connectors of the photosensitive plates. The insertion holes are provided with pins for connecting the high-frequency connector and the high-frequency signal transmission microstrip line. The other end of the high-frequency signal transmission microstrip line is connected to the photosensitive plate contact point. The bottom of the pin is engaged with the high-frequency connector, and the side wall of the pin is interference-fitted with the insertion hole. This invention ensures a reliable connection between the pin and the insertion hole by fixing the adapter circuit board and the connector, and by opening a frustum-shaped insertion hole on the adapter circuit board. Since the high-frequency signal transmission microstrip line and the high-frequency connector are connected by a plug-in connection, echo is avoided, and the accuracy of signal conversion is improved.

[0004] Traditional connection methods primarily rely on soldering. The impact of solder amount on signal transmission stems mainly from the microscopic mechanisms of impedance mismatch and signal reflection (echo). Furthermore, the aforementioned solutions, when transmitting high-frequency signals, primarily use interference fits for connection. While this improves transmission efficiency to some extent, in practical use, temperature variations can cause inconsistent dimensional changes between the pins and sockets due to differences in material thermal expansion coefficients. This can lead to multiple problems, such as interference fit failure or loosening, resulting in impaired signal transmission performance, fluctuations in contact impedance, signal reflection (echo) caused by impedance mismatch, and changes in parasitic parameters, affecting signal integrity. Moreover, considering long-term use or exposure to vibration, impact, or other external forces, material fatigue may occur, potentially leading to fatigue cracks and plating wear due to stress concentration. Simultaneously, the contact between the pins and sockets may change, with minute gaps or poor contact at the connection points affecting stable signal transmission. This results in signal loss during transmission, impacting signal integrity and quality, and negatively affecting the performance and lifespan of the high-frequency signal adapter board. Summary of the Invention

[0005] This application provides a circuit board structure for high-frequency signal transmission, which solves the technical problems in the prior art such as the generation of echoes caused by impedance changes due to inaccurate solder quantity control, reduced connection stability and reliability, increased signal loss during signal transmission, and reduced signal transmission stability and efficiency. It achieves the technical effects of accurate solder quantity control to avoid the generation of echoes caused by impedance changes, improved connection stability and reliability, reduced signal loss during signal transmission, and improved signal transmission stability and efficiency.

[0006] This application provides a circuit board structure for high-frequency signal transmission, including connectors, adapter circuit boards, sockets, pins and high-frequency connectors, wherein the pins are connected to the sockets via an interference fit and to the high-frequency connector via a snap-fit ​​connection.

[0007] Each of the pins is equipped with a heat-conducting wire for conducting heat; each of the pins has a constant weight of solder block at its bottom, which is used to melt the solder block by heating the pin tip, thereby achieving solder connection between the pin tip and the high-frequency connector.

[0008] Furthermore, a guide plate is fixed to the top of the high-frequency connector, and multiple small holes are evenly opened in the middle of the guide plate for soldering connection with the molten solder block.

[0009] Furthermore, the connector has mounting holes on its surface to provide mounting positions; the adapter circuit board has multiple photosensitive plate contact points fixed in the middle to connect the photosensitive plate to the high-frequency signal transmission microstrip line.

[0010] Furthermore, the connector also includes a high-frequency signal transmission microstrip line, a photosensitive plate, an insulating plate, and a light-gathering channel;

[0011] The adapter circuit board is a multilayer printed circuit board, fixed on the connector, and used to realize signal conversion and transmission; a light inlet channel is provided in the lower middle part of the connector, and a photosensitive plate is provided at the top of the light inlet channel. The photosensitive plate is connected to the photosensitive plate contact point on the adapter circuit board, and is used to receive external light signals and convert them into electrical signals.

[0012] Multiple high-frequency signal transmission microstrip lines are arranged on the adapter circuit board. One end of each line is connected to the contact point of the photosensitive board, and the other end is connected to the high-frequency connector via a pin. The high-frequency signal transmission microstrip lines adopt an equal-length design to achieve synchronous transmission of photosensitive signals. The insulating plate is arranged at the bottom of the adapter circuit board and has the same shape as the adapter circuit board. The insulating plate is used to prevent the circuit board from contacting other conductive objects and avoid short circuits.

[0013] Furthermore, the insertion hole has a frustum structure, and the diameter gradually decreases from the top to the bottom of the adapter circuit board, changing from 1.5mm to 1.2mm; the heat-conducting wire is made of copper wire, which is used to quickly melt the tin block after rapid heat conduction, thereby achieving soldering.

[0014] Furthermore, a groove is provided on the top of the high-frequency connector and on the conductive surface that engages with the pin. The groove has an arc-shaped structure and its shape and size are constant. It is used to control the shape and amount of solder after the solder block melts and to ensure the stability and reliability of the connection.

[0015] Furthermore, a conductive ball is fixed at the bottom of the heat-conducting wire, and the conductive ball is located inside the groove to ensure stable conductivity at the connection.

[0016] Furthermore, a fixing cap is fixed to the tip of the pin by a snap-fit ​​method. The shape and size of the fixing cap are constant to ensure that the amount of the second solder block is constant. The fixing cap contains a second solder block of constant weight, which is used to solder the insertion hole and the pin after melting.

[0017] Furthermore, the pin has multiple conductive grooves on its top and circumferentially. The conductive grooves are T-shaped, with their upper ends connected to the inside of the fixing cover and their two ends connected to the heat-conducting wire and the insertion hole, respectively. This allows the solder block to flow along the conductive grooves after melting, thus achieving multi-point welding.

[0018] Furthermore, the technical solution of the present invention also provides a soldering method for a circuit board structure for high-frequency signal transmission, the specific steps of which are as follows:

[0019] Step 1: Assemble the high-frequency signal adapter board and ensure that all components are securely and reliably connected;

[0020] Step 2: Invert the entire circuit board structure and heat-solder and degas the pins and sockets to create a negative pressure state inside. The molten solder block 2 flows into the socket through the conductive groove, filling the gap between the pin and the socket and helping to fill the channel between the pin and the high-frequency connector. The solder block 1 melts due to the heat conduction of the heat-conducting wire and flows quickly into the groove where the heat-conducting wire is located under the negative pressure.

[0021] Step 3: Place the entire circuit board upright, stop the negative pressure process, and quickly cool the pins and sockets to allow the molten solder at the pins and sockets to solidify quickly, thus achieving soldering.

[0022] Step 4: After placing it upright, heat the connection between the pin and the high-frequency connector. Once the solder melts, it flows into the groove through the guide plate, thus achieving a solder connection between the pin and the high-frequency connector.

[0023] Step 5: After the soldering connection is completed, the entire device is cooled to allow the solder joints to solidify quickly, ensuring the stability and reliability of the connection.

[0024] One or more technical solutions provided in this application have at least the following technical effects or advantages:

[0025] By employing a dual connection method combining interference fit and soldering, along with the precise design of the heat-conducting wire and the constant-weight solder block, the reliability and stability of the connection can be ensured. This effectively solves the technical problems in existing technologies, such as impedance changes caused by inaccurate solder quantity control leading to echo generation, reduced connection stability and reliability, increased signal transmission loss, and reduced signal transmission stability and efficiency. It achieves the technical effects of accurate solder quantity control to avoid echo generation caused by impedance changes, improved connection stability and reliability, reduced signal transmission loss, and improved signal transmission stability and efficiency. Attached Figure Description

[0026] Figure 1 This is an overall structural diagram of the circuit board structure for high-frequency signal transmission according to the present invention.

[0027] Figure 2 This is a three-dimensional cross-sectional view of the connector of the circuit board structure for high-frequency signal transmission according to the present invention.

[0028] Figure 3 This is a three-dimensional structural diagram of the adapter circuit board for high-frequency signal transmission according to the present invention.

[0029] Figure 4 The circuit board structure for high-frequency signal transmission according to the present invention Figure 3 Exploded view of the structure.

[0030] Figure 5 This is a three-dimensional structural diagram of the pins and high-frequency connectors of the circuit board structure used for high-frequency signal transmission according to the present invention.

[0031] Figure 6 This is a three-dimensional structural diagram of the high-frequency connector of the circuit board structure for high-frequency signal transmission according to the present invention.

[0032] Figure 7 This is a longitudinal full sectional view of the pins and high-frequency connectors of the circuit board structure for high-frequency signal transmission according to the present invention.

[0033] Figure 8 The circuit board structure for high-frequency signal transmission according to the present invention Figure 7 A magnified view of a portion of point A in the middle.

[0034] Figure 9 The circuit board structure for high-frequency signal transmission according to the present invention Figure 7A magnified view of a portion of point B in the middle.

[0035] In the diagram: 100, connector; 101, mounting hole; 102, photosensitive board contact point; 110, adapter circuit board; 120, insertion hole; 130, high-frequency signal transmission microstrip line; 140, photosensitive board; 150, insulating board; 160, light inlet channel; 200, pin; 210, heat-conducting wire; 211, conductive ball; 220, solder block one; 230, fixing cover; 240, solder block two; 250, conductive groove; 300, high-frequency connector; 310, conductive plate; 320, groove. Detailed Implementation

[0036] To facilitate understanding of the present invention, a more complete description of this application will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the invention. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to enable a more thorough and complete understanding of the disclosure of the present invention.

[0037] It should be noted that the terms "vertical," "horizontal," "up," "down," "left," "right," and similar expressions used in this article are for illustrative purposes only and do not represent the only possible implementation.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to limit the invention; the term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0039] Please see Figure 1 This is a schematic diagram of the overall structure of the circuit board structure for high-frequency signal transmission according to the present invention. The circuit board structure for high-frequency signal transmission in this application provides dual protection through the interference fit between the pins 200 and the sockets 120 and the solder connection, making the connection between the high-frequency signal transmission microstrip line 130 and the high-frequency connector 300 more robust and stable. It can resist the effects of vibration, impact and other external forces during long-term use, and reduce the decline in signal transmission performance caused by poor contact or loose connection. It achieves the technical effects of improved connection stability and reliability, reduced loss during signal transmission, and improved signal transmission stability and efficiency.

[0040] Example 1: As Figures 1 to 8As shown, the circuit board structure for high-frequency signal transmission in this application includes a connector 100, an adapter circuit board 110, a socket 120, a pin 200, and a high-frequency connector 300. The pin 200 is connected to the socket 120 by an interference fit and to the high-frequency connector 300 by a snap-fit ​​connection.

[0041] Each of the pins 200 is provided with a heat-conducting wire 210 for conducting heat; each of the pins 200 has a constant weight of solder block 220 at its bottom, which is used to melt the solder block 220 by heating the top of the pin 200, so as to achieve solder connection between the top of the pin 200 and the high-frequency connector 300.

[0042] The high-frequency connector 300 has a guide plate 310 fixed on its top. The guide plate 310 has multiple small holes evenly distributed in the middle for soldering with the molten solder block 220.

[0043] The connector 100 has mounting holes 101 on its surface to provide mounting positions; the adapter circuit board 110 has multiple photosensitive plate contact points 102 fixed in the middle to connect the photosensitive plate 140 to the high-frequency signal transmission microstrip line 130.

[0044] The connector 100 further includes a high-frequency signal transmission microstrip line 130, a photosensitive plate 140, an insulating plate 150, and a light-entry channel 160; the adapter circuit board 110 is a multilayer printed circuit board, fixed on the connector 100, and used to realize signal conversion and transmission; a light-entry channel 160 is provided in the lower middle part of the connector 100, and a photosensitive plate 140 is provided at the top of the light-entry channel 160. The photosensitive plate 140 is connected to the photosensitive plate contact point 102 on the adapter circuit board 110, and is used to receive external light signals and transmit them. The signal is converted into an electrical signal. Multiple high-frequency signal transmission microstrip lines 130 are arranged on the adapter circuit board 110. One end of each line is connected to the contact point 102 of the photosensitive board, and the other end is connected to the high-frequency connector 300 via a pin 200. The high-frequency signal transmission microstrip lines 130 are designed with equal lengths to achieve synchronous transmission of the photosensitive signal. The insulating plate 150 is located at the bottom of the adapter circuit board 110 and has the same shape as the adapter circuit board 110. The insulating plate 150 is used to prevent the circuit board from contacting other conductive objects and to avoid short circuits.

[0045] The insertion hole 120 has a frustum structure, and its diameter gradually decreases from the top to the bottom of the adapter circuit board 110, changing from 1.5mm to 1.2mm. The heat-conducting wire 210 is made of copper wire and is used to rapidly melt the solder block 220 after being heated, thus achieving soldering. The conductive plate 310 has a hollow structure, making the connection between the pin 200 and the high-frequency connector 300 more secure and stable.

[0046] Because high-frequency signals rely on a constant characteristic impedance during transmission, when the impedance at a solder joint decreases due to abrupt changes in geometry, the signal encounters an impedance discontinuity, and some energy is reflected back to the source, forming an echo (reflected wave), which reduces the quality and reliability of signal switching. Excessive solder can cause solder joints to form raised "spherical" or "mushroom-shaped" protrusions, leading to a sudden increase in the cross-sectional area of ​​the transmission line and altering its characteristic impedance. Insufficient solder can cause microcracks, voids, or incompletely wetted areas between the solder joint and the pin or PCB pad, potentially introducing additional contact resistance and capacitance. Incomplete connections are equivalent to high-impedance points in series, leading to increased impedance and also causing reflections. Therefore, using a constant-weight solder block (220) is crucial. It not only ensures stronger structural stability at the connection point but also maintains stable impedance at the solder joint, effectively preventing echoes and improving the transmission of high-frequency signals.

[0047] In actual operation, the steps of this embodiment are as follows:

[0048] Step 1: Assemble the high-frequency signal adapter board and ensure that all components are securely and reliably connected;

[0049] Step 2: Heat the pin 200 and the socket 120 to make the heat-conducting wire 210 conduct heat quickly and melt the solder block 220.

[0050] Step 3: The molten solder block 220 flows in through the small hole on the conductor plate 310 and is soldered to the high-frequency connector 300 to achieve a reliable connection between the high-frequency signal transmission microstrip line 130 and the high-frequency connector 300.

[0051] Step 4: After the soldering connection is completed, the device is cooled to allow the solder joints to solidify quickly, ensuring the stability and reliability of the connection.

[0052] The technical solutions described in the embodiments of this application have at least the following technical effects or advantages:

[0053] This application provides a constant-weight solder block 220 at the bottom of the pin 200 and a small hole on the guide plate 310 of the high-frequency connector 300. This allows the solder block 220 to flow precisely and evenly into the small hole after melting when heated, forming a reliable solder connection with the high-frequency connector 300. This method effectively solves the problem of inaccurate control of solder amount in traditional soldering processes, which leads to impedance changes and causes easy echoes. It reduces the interference of echoes on normal signal transmission and improves the quality and reliability of signal switching. Through the interference fit between the pin 200 and the socket 120 and the double guarantee of the solder connection, the connection between the high-frequency signal transmission microstrip line 130 and the high-frequency connector 300 is more robust and stable, and can resist the external forces such as vibration and impact during long-term use, reducing the degradation of signal transmission performance caused by poor contact or loose connection.

[0054] Meanwhile, the rapid heat conduction of the heat-conducting wire 210 allows the solder block 220 to melt quickly and uniformly, ensuring the reliability and stability of the connection under different temperature conditions. Furthermore, this connection method can reduce inconsistencies in dimensional changes caused by differences in the thermal expansion coefficients of materials, improving the adaptability of the high-frequency signal adapter board to temperature variations. By optimizing the connection method and improving its reliability and stability, signal loss and distortion during transmission are effectively reduced, enhancing the integrity and quality of signal transmission. This achieves the technical effects of improved connection stability and reliability, reduced signal loss during transmission, and increased signal transmission stability and efficiency.

[0055] Example 2: To improve the quality of soldering and the stability of the connection, this application proposes the following technical solution to address the above-mentioned technical problems:

[0056] like Figure 7 and Figure 8 As shown, a groove 320 is provided on the top of the high-frequency connector 300 and on the conductive surface that engages with the pin 200. The groove 320 has an arc-shaped structure and its shape and size are constant. It is used to control the shape and amount of solder after the solder block 220 is melted and to ensure the stability and reliability of the connection.

[0057] A conductive ball 211 is fixed at the bottom of the heat-conducting wire 210. The conductive ball 211 is located inside the groove 320 to ensure stable conduction at the connection.

[0058] This application, by setting a groove 320 with a defined size, ensures that its volume (i.e., the amount of solder after the solder block 220 melts) remains consistent. This allows for precise control of the shape and amount of the molten solder block 220 during the soldering process, thereby guaranteeing the stability and reliability of the connection. It also helps reduce connection problems caused by too much or too little solder, improving the reliability and quality of the connection. Furthermore, a conductive ball 211 is fixed to the bottom of the heat-conducting wire 210. The conductive ball 211 not only enhances the uniformity of heat conduction but also provides fixation and support after the solder melts, ensuring stable conductivity at the connection point. Simultaneously, the conductive ball 211 also helps control the amount of solder block 220, as its position within the groove 320 restricts the flow range of the solder block 220, further ensuring the consistency of the solder amount and the stability of the connection.

[0059] Example 3: Since the high-frequency connector 300 and the bottom of the pin 200 are connected by a snap-fit ​​method, loosening or gaps may occur during long-term use. To prevent loosening from causing a decrease in connection stability, this application proposes the following technical solution to address the above-mentioned technical problems:

[0060] like Figure 7 and Figure 9 As shown, the top of the pin 200 is fixed with a fixing cover 230 by a snap-fit ​​method. The shape and size of the fixing cover 230 are constant to ensure that the amount of the second solder block 240 is constant. The fixing cover 230 contains a second solder block 240 of constant weight. The second solder block 240 is used to solder the insertion hole 120 and the pin 200 after melting.

[0061] The pin 200 has multiple conductive grooves 250 on its top and around its circumference. The conductive grooves 250 are T-shaped, with their upper ends connected to the interior of the fixed cover 230 and their two ends connected to the heat-conducting wire 210 and the insertion hole 120, respectively. This allows the solder block 240 to flow along the conductive grooves 250 after melting, thus achieving multi-point welding.

[0062] This application fixes a retaining cover 230 to the pin 200 via a snap-fit ​​method. The shape and size of the retaining cover 230 are fixed, and a solder block 240 is provided inside the retaining cover 230. This means that the amount of the solder block 240 is also fixed, so the amount of the solder block 240 can be precisely controlled, avoiding connection problems caused by too much or too little solder. By precisely controlling the amount of the solder block 240 and the soldering connection method, electromagnetic radiation caused by poor connection or improper solder amount can be reduced, making the connection between the connector 120 (i.e., the adapter circuit board 110) and the pin 200 more stable and reliable, reducing connection problems caused by looseness or gaps, and helping to precisely control the amount and shape of the molten solder, avoiding connection problems caused by too much or too little solder. Stable connection and precise solder amount control help reduce loss and interference during signal transmission, thereby improving the performance and stability of signal transmission.

[0063] Example 4: To improve soldering quality and connection stability, making signal transmission faster and more convenient, and improving signal transmission stability, this application proposes the following technical solution to address the above-mentioned technical problems:

[0064] like Figures 5 to 9 As shown, the technical solution of the present invention also provides a soldering method for a circuit board structure for high-frequency signal transmission, the specific steps of which are as follows:

[0065] Step 1: Assemble the high-frequency signal adapter board and ensure that all components are securely and reliably connected;

[0066] Step 2: Invert the entire circuit board structure and heat-solder and degas the pins 200 and the sockets 120 to create a negative pressure state inside. The molten solder block 240 flows into the sockets 120 through the conductive groove 250, filling the gap between the pins 200 and the sockets 120, and helping to fill the channel between the pins 200 and the high-frequency connector 300. The solder block 220 melts due to the heat conduction of the heat-conducting wire 210 and flows quickly into the groove where the heat-conducting wire 210 is located under the negative pressure.

[0067] Step 3: Place the entire circuit board upright, stop the negative pressure process, and quickly cool the pins 200 and the sockets 120 to allow the molten solder blocks 240 at the pins 200 and the sockets 120 to solidify quickly, thus achieving soldering.

[0068] Step 4: After placing it upright, heat the connection between the pin 200 and the high-frequency connector 300. The solder block 220 melts and flows into the groove 320 through the guide plate 310, thus achieving the solder connection between the pin 200 and the high-frequency connector 300.

[0069] Step 5: After the soldering connection is completed, the entire device is cooled to allow the solder joints to solidify quickly, ensuring the stability and reliability of the connection.

[0070] This application optimizes the soldering process by evacuating the pin 200 from the socket 120 to create a negative pressure environment. This allows the molten solder 240 to flow smoothly under this negative pressure, passing through the conductive groove 250 into the socket 120 and filling the gap between the pin 200 and the socket 120. This process not only ensures precise control of the solder amount but also effectively avoids echo problems caused by excessive or insufficient solder, thereby reducing interference from echoes on normal signal transmission.

[0071] The negative pressure environment allows molten solder to flow smoothly to the required location, avoiding solder buildup and waste during the soldering process. It also helps reduce bubbles and defects generated during soldering, improving soldering quality. After the solder block 240 melts and fills the required position, rapid cooling solidifies it. This rapid cooling also helps reduce the heat-affected zone during soldering, protecting other parts of the circuit board from heat damage, achieving an efficient soldering process, and improving the integrity and quality of signal transmission. Furthermore, the rapid heat conduction of the heat-conducting wire 210 and the precise control of the solder amount by the groove 320 allow the connection structure to adapt to temperature changes to a certain extent, maintaining stable signal transmission performance.

[0072] This application maintains a constant and consistent mass of solder blocks 220 and 240 inside multiple pins 200 on the same adapter circuit board 110. By setting a uniform temperature and melting time, multiple connection points on the circuit board can be synchronously soldered simultaneously, greatly improving production efficiency and reducing the soldering time of individual connection points. This ensures that the amount of solder at each soldering point is consistent and stable, improving not only the stability of the amount of solder at each soldering position but also the soldering quality. Furthermore, ensuring the consistency of soldering parameters (such as temperature and time) improves the stability of soldering quality and reduces soldering quality problems caused by operational differences. By setting a uniform temperature setting, it ensures that each connection point on the circuit board is heated evenly, avoiding poor soldering caused by local overheating or underheating. By precisely controlling the melting time of the solder blocks, it ensures that the solder flows into the connection points in the optimal state, filling the gaps and forming a strong solder joint, reducing soldering errors caused by improper operation or fatigue.

[0073] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. For those skilled in the art, the present invention can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A circuit board structure for high-frequency signal transmission, comprising a connecting piece (100), a relay circuit board (110), a plug hole (120), a plug pin (200) and a high-frequency connector (300), the plug pin (200) is connected with the plug hole (120) through interference fit connection, the plug pin (200) is connected with the high-frequency connector (300) through clamping, characterized in that: Each of the pins (200) is internally provided with a heat conducting wire (210) for conducting heat; the bottom of each of the pins (200) is provided with a tin block one (220) with constant weight, for realizing the tin soldering connection between the top end of the pin (200) and the high-frequency connector (300) by heating the top end of the pin (200) to melt the tin block one (220); ​ The top end of the high-frequency connector (300) and the lead-in surface which is clamped with the pin (200) is provided with a groove (320), the groove (320) is an arc structure and its shape and size are constant, for controlling the shape and welding amount of the melted tin block one (220) and ensuring the stability and reliability of the connection; The bottom of the heat conducting wire (210) is fixed with a conductive ball (211), the conductive ball (211) is located in the groove (320), for ensuring the stable conduction of the connection; The top end of the pin (200) is fixed with a fixed cover (230) in a clamping manner, the shape and size of the fixed cover (230) are constant, for ensuring the constant amount of the tin block two (240); the inside of the fixed cover (230) is provided with a tin block two (240) with constant weight, the tin block two (240) is used for tin soldering connection between the pin (200) and the plug-in hole (120) after melting; The top of the pin (200) is provided with a plurality of conductive grooves (250) along the circumference thereof, the conductive grooves (250) are T-shaped structures, the upper end thereof is in communication with the inside of the fixed cover (230), and the two ends thereof are respectively in communication with the heat conducting wire (210) and the plug-in hole (120), for realizing the multi-point welding of the tin block two (240) after melting along the conductive grooves (250).

2. The circuit board structure for high-frequency signal transmission according to Claim 1, wherein The top of the high-frequency connector (300) is fixed with a lead-in plate (310), a plurality of small holes are uniformly provided in the middle of the lead-in plate (310), for tin soldering connection with the melted tin block one (220).

3. The circuit board structure for high-frequency signal transmission according to Claim 1, wherein The surface of the connecting piece (100) is provided with a mounting hole (101), for providing a mounting position; the middle of the relay circuit board (110) is fixed with a plurality of photosensitive plate contact points (102), for connecting the photosensitive plate (140) and the high-frequency signal transmission microstrip line (130).

4. The circuit board structure for high-frequency signal transmission according to Claim 3, wherein The connecting piece (100) further comprises a high-frequency signal transmission microstrip line (130), a photosensitive plate (140), an insulating plate (150), and a light inlet channel (160); The relay circuit board (110) is a multi-layer printed circuit board, which is fixed on the connecting piece (100), for realizing the relay and transmission of signals; the middle of the connecting piece (100) is provided below with a light inlet channel (160), the top of the light inlet channel (160) is provided with a photosensitive plate (140), the photosensitive plate (140) is connected with the photosensitive plate contact points (102) on the relay circuit board (110), for receiving external light signals and converting them into electrical signals; The high-frequency signal transmission microstrip line (130) is provided in multiple, and is connected with the photosensitive board contact point (102) at one end and connected with the high-frequency connector (300) through the pin (200) at the other end. The high-frequency signal transmission microstrip line (130) is designed with equal length, and is used for realizing synchronous transmission of photosensitive signals. The insulating plate (150) is provided at the bottom of the adapter circuit board (110), and has the same shape as the adapter circuit board (110). The insulating plate (150) is used for preventing the circuit board from contacting other conductive objects and avoiding short circuit.

5. The circuit board structure for high-frequency signal transmission according to Claim 1, wherein The plug-in hole (120) is a circular truncated cone structure, and the aperture gradually decreases from the top to the bottom of the adapter circuit board (110), and gradually changes from 1.5 mm to 1.2 mm. The heat-conducting wire (210) is made of copper wire, and is used for melting the tin block one (220) after being heated, so as to realize soldering.

6. A soldering method for a circuit board structure for high frequency signal transmission, characterized by, The circuit board structure for high-frequency signal transmission is assembled, and the connection of each component is firm and reliable. In step two, the circuit board is inverted, the pin (200) and the plug-in hole (120) are heated and welded, and the inside is in a negative pressure state. The melted tin block two (240) flows into the plug-in hole (120) through the through groove (250), fills the gap between the pin (200) and the plug-in hole (120), and assists in filling the channel between the pin (200) and the high-frequency connector (300). The tin block one (220) is melted by the heat conduction of the heat-conducting wire (210), and flows into the groove where the heat-conducting wire (210) is located under the action of negative pressure. In step three, the circuit board is placed in the normal direction, the negative pressure treatment is stopped, and the pin (200) and the plug-in hole (120) are cooled quickly, so that the melted tin block two (240) of the pin (200) and the plug-in hole (120) is quickly solidified, and the soldering treatment is realized. In step four, after the circuit board is placed in the normal direction, the pin (200) and the high-frequency connector (300) are heated, the tin block one (220) is melted, and flows into the groove (320) through the lead plate (310), so as to realize the soldering connection between the pin (200) and the high-frequency connector (300). In step five, after the soldering connection is completed, the whole device is cooled, so that the soldering point is quickly solidified, and the stability and reliability of the connection are ensured. ​

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