A semiconductor module strength detection device

Abstract

The present invention relates to the field of semiconductor production technology, and discloses a semiconductor module strength detection device, including a high-temperature strength detection equipment body and a semiconductor module body. In the process of performing high-temperature strength detection on the semiconductor module body, the present invention can place the high-temperature resistant rubber sleeve on the detection head body on the metal substrate on which the semiconductor module body is installed, and then start the micro-motor body. At this time, with the cooperation of the wrapping detection component, the high-temperature resistant rubber sleeve can wrap the semiconductor module body, and the wrapping of the high-temperature resistant rubber sleeve can prevent the erosion of external dust and corrosive liquids, thereby protecting the semiconductor module body undergoing high-temperature strength detection. At the same time, multiple temperature sensor patches can be tightly attached to the side of the semiconductor module, and the metal sensor on the temperature sensor body can contact the top of the semiconductor module, thereby adapting to semiconductor module bodies of different shapes.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production, and in particular to a semiconductor module strength detection device. Background Art

[0002] The semiconductor module is a device that uses certain semiconductor materials as working materials to produce stimulated emission. It is part of the semiconductor laser. Its working principle is to achieve non-equilibrium carrier population inversion between the energy bands (conduction band and valence band) of the semiconductor material, or between the energy bands of the semiconductor material and the energy levels of impurities (acceptor or donor) through a certain excitation method. When a large number of electrons in the population inversion state recombine with holes, stimulated emission occurs. There are three main excitation methods for semiconductor lasers, namely electrical injection, optical pumping, and high-energy electron beam excitation.

[0003] In the patent application with application announcement number CN116577624A, it includes a detection body, a movable plate, a display light, a positive electrode plate and a negative electrode plate, etc.; the top of the detection body is connected to the movable plate in a sliding manner up and down, the front side of the movable plate is fixedly connected to the display light, the bottom of the movable plate is connected to at least two positive electrode plates in a sliding manner up and down, the top of the detection body is connected to negative electrode plates with the same number as the positive electrode plates, and the upper and lower positions of the negative electrode plates and the positive electrode plates correspond one to one, the detection body is electrically connected to the positive electrode plates and the negative electrode plates, and the sinking mechanism and the first elastic member cooperate to enable the positive electrode plates and the negative electrode plates to adaptively adjust to semiconductors of different thicknesses, and the adjustment of their positions can be carried out in stages, so that the connection of the semiconductor is more stable.

[0004] In the patents or prior art including the above, semiconductor modules may generate high local heat during use, so high-temperature strength testing equipment is required to perform temperature detection. In the case of a relatively harsh detection environment, corrosive liquid splashing and dust coverage usually occur during detection, which leads to inaccurate temperature detection. At the same time, the splashing of corrosive liquid will cause corrosion on the surface of the semiconductor module. When splashed with corrosive liquid containing acidic substances, the acidic substances will chemically react with copper and constantan to form corrosion products on the surface of the thermal resistor, increase the resistance of the hot electrode, affect the temperature measurement accuracy of the thermocouple, and cause measurement errors to reach several degrees Celsius or even higher. Summary of the Invention

[0005] The problem to be solved by the present invention is that most existing temperature detection devices may experience temperature deviation when performing detection in a relatively harsh detection environment.

[0006] To solve the above technical problems, the technical solution of the present invention is as follows: a semiconductor module strength testing device, comprising a high-temperature strength testing device body and a semiconductor module body, the high-temperature strength testing device body being provided with a testing head body connected via a connecting line, a temperature sensor body being slidably disposed within the testing head body, a sensor outer cylinder being fixedly disposed on the inner wall of the testing head body and slidably connected to the temperature sensor body, a side sensor receiver being mounted on the curved outer wall of the sensor outer cylinder, and a wrapped testing assembly being provided on the testing head body;

[0007] The wrapped detection component includes a micro-motor body installed on the top of the detection head body, the output end of the micro-motor body is connected to a driving cylinder through a rotating shaft, and an air pump piston seat is sleeved inside the driving cylinder, an air pressure cylinder is fixedly provided on the arc-shaped outer wall of the sensor outer cylinder, and the bottom of the air pump piston seat is axially slidably connected to the inner wall of the air pressure cylinder, a guide block is fixedly provided on the arc-shaped inner wall of the driving cylinder, an arc-shaped guide groove matching the guide block is opened on the arc-shaped outer wall of the air pump piston seat, and the guide block slides inside the arc-shaped guide groove, a high-temperature resistant rubber sleeve is fixedly provided at the bottom end of the side sensor receiver, a plurality of air guide tubes are fixedly provided between the air pressure cylinder and the high-temperature resistant rubber sleeve, and each air guide tube passes through the inner wall of the air pressure cylinder to the inner wall of the high-temperature resistant rubber sleeve, a plurality of temperature sensor patches are installed on the inner wall of the high-temperature resistant rubber sleeve, and a magnetic suction component is provided under the driving cylinder.

[0008] Preferably, a metal sensor is installed at the bottom end of the temperature sensor body, and a piston piece is fixedly provided on the side wall of the metal sensor, and the piston piece is axially slidably connected to the inner wall of the sensor outer cylinder.

[0009] Preferably, one end of the connecting line is connected to the temperature sensor body, a movable groove matching the temperature sensor body is opened inside the outer cylinder of the sensor, a spring fixing ring is fixedly provided on the arc-shaped outer wall of the temperature sensor body, and a reset spring is fixedly provided between the bottom of the spring fixing ring and the outer cylinder of the sensor, and an inner piston groove matching the piston plate is opened inside the outer cylinder of the sensor.

[0010] Preferably, an outer piston groove matching the vacuum piston seat is provided inside the air pressure cylinder, a plurality of air outlet holes are provided on the air pressure cylinder, and the plurality of air outlet holes are respectively connected to a plurality of air guide tubes, and the inner piston groove is connected to the interior of the high temperature resistant rubber sleeve.

[0011] Preferably, one end of each temperature sensing patch is connected to the side sensor receiver through a wire, a keel frame is fixedly provided at the bottom of the side sensor receiver, and a high-temperature resistant rubber sleeve is sleeved on the keel frame, and a rubber sealing strip is fixedly provided at the bottom of the high-temperature resistant rubber sleeve.

[0012] Preferably, the driving cylinder is located inside the detection head body, and the sensor outer cylinder is located between the outside of the temperature sensor body and the inside of the driving cylinder.

[0013] Preferably, the magnetic assembly includes a connecting cylinder fixed on the arc-shaped outer wall of the driving cylinder, a magnetic movable cylinder is fixedly provided on the arc-shaped outer wall of the side sensor receiver, a lower fixed cylinder is fixedly provided at the bottom end of the connecting cylinder, and the lower fixed cylinder is located inside the magnetic movable cylinder, a plurality of trapezoidal pushing blocks are fixedly provided on the circumference of the lower fixed cylinder, a magnetic ring is axially slidably connected to the inside of the magnetic movable cylinder, and the magnetic ring is slidably connected to the plurality of trapezoidal pushing blocks.

[0014] Preferably, the plurality of trapezoidal pushing blocks are distributed in a circular array on the lower fixed cylinder, the inner wall of the magnetic ring is provided with pushing clamping grooves matching the plurality of trapezoidal pushing blocks, an isolation plate is fixedly provided at the bottom end of the magnetic movable cylinder, and the magnetic ring is located above the isolation plate.

[0015] Preferably, the semiconductor module body is located inside the high-temperature resistant rubber sleeve, a metal substrate is provided at the bottom of the semiconductor module body, and the isolation thin plate is in contact with the top of the metal substrate.

[0016] Compared with the prior art, the technical solution of the present invention has the following advantages:

[0017] (1) In the process of high-temperature strength testing of the semiconductor module body, the present invention can place the high-temperature resistant rubber sleeve on the detection head body on the metal substrate on which the semiconductor module body is installed, and then start the micro-motor body. At this time, the high-temperature resistant rubber sleeve can wrap the semiconductor module body with the cooperation of the wrapping detection component, and the wrapping of the high-temperature resistant rubber sleeve can prevent the erosion of external dust and corrosive liquid, thereby protecting the semiconductor module body undergoing high-temperature strength testing. At the same time, multiple temperature sensor patches can be tightly attached to the side of the semiconductor module, and the metal sensor on the temperature sensor body can contact the top of the semiconductor module, thereby adapting to semiconductor module bodies of different shapes. Modules of different shapes can enter the testing link in turn, without interrupting the production process due to equipment mismatch, thereby improving the smoothness and efficiency of high-temperature testing of semiconductor modules.

[0018] (2) The present invention starts the micro-motor body and, with the cooperation of the magnetic component, allows multiple trapezoidal pushing blocks to simultaneously enter the multiple pushing and clamping grooves provided on the magnetic ring. The bottom of the magnetic ring can contact the top of the isolation sheet, and the magnetic ring can adsorb the metal substrate, thereby achieving the purpose of improving the stability of the detection head body and achieving the purpose of fixing it according to different semiconductor high-temperature strength detection environments. Compared with most traditional hand-held fixing methods, the magnetic fixing method will not cause wear or scratches on the surface of the equipment or the detection environment, which helps to extend the service life of the metal substrate and reduce the maintenance and replacement costs caused by wear of the metal substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0020] Figure 2 This is a schematic diagram of the connection structure between the wrapped detection component and the magnetic attraction component of the present invention;

[0021] Figure 3 This is a schematic diagram of the cross-sectional structure of the detection head body of the present invention;

[0022] Figure 4 For the present invention Figure 3 A partial enlarged view of middle A;

[0023] Figure 5 This is a schematic structural diagram of the wrapped detection assembly of the present invention;

[0024] Figure 6 For the present invention Figure 5 A partial enlarged view of middle B;

[0025] Figure 7 This is a schematic diagram of the arc guide groove structure of the present invention;

[0026] Figure 8 This is a schematic diagram of the connection structure between the air guide tube and the high-temperature resistant rubber sleeve of the present invention;

[0027] Figure 9 This is a bottom view of the high temperature resistant rubber sleeve of the present invention;

[0028] Figure 10 This is a schematic diagram of the structure of the magnetic attraction component of the present invention;

[0029] Figure 11 This is a schematic diagram of the connection structure between the trapezoidal pushing block and the magnetic ring of the present invention;

[0030] Figure 12 It is a schematic diagram of the structure of the magnetic ring of the present invention.

[0031] Figure: 1. High-temperature strength testing device body; 11. Testing head body; 12. Connecting wires; 13. Temperature sensor body; 131. Sensor outer cylinder; 132. Return spring; 133. Metal sensor; 134. Piston plate; 14. Side sensor receiver; 15. Temperature sensor patch; 16. Semiconductor module body;

[0032] 2. Wrapped detection assembly; 21. Micro motor body; 22. Driving cylinder; 221. Guide block; 23. Air pressure cylinder; 231. Air guide tube; 24. Pumping piston seat; 241. Arc guide groove; 25. High-temperature resistant rubber sleeve;

[0033] 3. Magnetic assembly; 31. Connecting cylinder; 32. Lower fixed cylinder; 321. Trapezoidal pushing block; 33. Magnetic movable cylinder; 34. Magnetic ring; 341. Pushing and clamping slot. DETAILED DESCRIPTION

[0034] To make the purpose, technical solutions and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0035] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the usual meanings understood by persons of ordinary skill in the field to which this disclosure belongs. The words “including” or “comprising” and the like used in this disclosure mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. The words “connected” or “connected” and the like are not limited to physical or mechanical connections, but may also include electrical connections, whether direct or indirect. “Up”, “down”, “left”, “right” and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0036] like Figures 1 to 12 As shown, the present invention provides a semiconductor module strength testing device, including a high-temperature strength testing device body 1 and a semiconductor module body 16. The high-temperature strength testing device body 1 is provided with a testing head body 11 connected by a connecting line 12. A temperature sensor body 13 is slidably provided inside the testing head body 11. A sensor outer cylinder 131 slidably connected to the temperature sensor body 13 is fixedly provided on the inner wall of the testing head body 11. A side sensor receiver 14 is installed on the curved outer wall of the sensor outer cylinder 131. A wrapped detection component 2 is provided on the testing head body 11.

[0037] The wrapped detection component 2 includes a micro motor body 21 installed on the top of the detection head body 11, the output end of the micro motor body 21 is connected to the driving cylinder 22 through a rotating shaft, the driving cylinder 22 is internally sleeved with an air pumping piston seat 24, a pneumatic cylinder 23 is fixedly provided on the arc-shaped outer wall of the sensor outer cylinder 131, and the bottom of the air pumping piston seat 24 is axially slidably connected to the inner wall of the pneumatic cylinder 23, a guide block 221 is fixedly provided on the arc-shaped inner wall of the driving cylinder 22, and a guide block 221 is provided on the arc-shaped outer wall of the air pumping piston seat 24. The guide block 221 is matched with the arc-shaped guide groove 241, and the guide block 221 slides inside the arc-shaped guide groove 241. A high-temperature resistant rubber sleeve 25 is fixedly provided at the bottom end of the side sensor receiver 14. A plurality of air guide tubes 231 are fixedly provided between the air pressure cylinder 23 and the high-temperature resistant rubber sleeve 25, and each air guide tube 231 passes through the inner wall of the air pressure cylinder 23 to the inner wall of the high-temperature resistant rubber sleeve 25. A plurality of temperature sensing patches 15 are installed on the inner wall of the high-temperature resistant rubber sleeve 25. A magnetic attraction component 3 is provided below the driving cylinder 22;

[0038] A metal sensor 133 is installed at the bottom end of the temperature sensor body 13, and a piston piece 134 is fixedly provided on the side wall of the metal sensor 133, and the piston piece 134 is axially slidably connected to the inner wall of the sensor outer cylinder 131;

[0039] One end of the connecting line 12 is connected to the temperature sensor body 13. A movable groove that matches the temperature sensor body 13 is opened inside the sensor outer cylinder 131. A spring fixing ring is fixedly installed on the curved outer wall of the temperature sensor body 13, and a return spring 132 is fixedly installed between the bottom of the spring fixing ring and the sensor outer cylinder 131. An inner piston groove that matches the piston plate 134 is opened inside the sensor outer cylinder 131.

[0040] The air cylinder 23 is provided with an outer piston groove matching the air extraction piston seat 24. The air cylinder 23 is provided with a plurality of air outlet holes, which are respectively connected to a plurality of air guide tubes 231. The inner piston groove is connected to the interior of the high-temperature resistant rubber sleeve 25.

[0041] One end of each temperature sensing patch 15 is connected to the side sensor receiver 14 through a wire. A keel is fixedly provided at the bottom of the side sensor receiver 14, and a high-temperature resistant rubber sleeve 25 is sleeved on the keel. A rubber sealing strip is fixedly provided at the bottom of the high-temperature resistant rubber sleeve 25.

[0042] The driving cylinder 22 is located inside the detection head body 11, and the sensor outer cylinder 131 is located between the outside of the temperature sensor body 13 and the inside of the driving cylinder 22;

[0043] The magnetic assembly 3 includes a connecting cylinder 31 fixed to the curved outer wall of the driving cylinder 22, a magnetic movable cylinder 33 fixedly provided on the curved outer wall of the side sensor receiver 14, a lower fixed cylinder 32 fixedly provided at the bottom end of the connecting cylinder 31, and the lower fixed cylinder 32 is located inside the magnetic movable cylinder 33, and a plurality of trapezoidal pushing blocks 321 are fixedly provided on the circumference of the lower fixed cylinder 32, a magnetic ring 34 is axially slidably connected to the inside of the magnetic movable cylinder 33, and the magnetic ring 34 is slidably connected to the plurality of trapezoidal pushing blocks 321;

[0044] Multiple trapezoidal pushing blocks 321 are distributed in an annular array on the lower fixed cylinder 32. The inner wall of the magnetic ring 34 is provided with pushing and clamping grooves 341 that match the multiple trapezoidal pushing blocks 321. An isolation plate is fixedly installed at the bottom end of the magnetic movable cylinder 33, and the magnetic ring 34 is located above the isolation plate.

[0045] The semiconductor module body 16 is located inside the high temperature resistant rubber sleeve 25. A metal substrate is provided at the bottom of the semiconductor module body 16, and the isolation plate is in contact with the top of the metal substrate.

[0046] When inspecting the semiconductor module body 16, the high-temperature resistant rubber sleeve 25 provided at the bottom of the inspection head body 11 can be tightly attached to the top of the metal substrate, and the micro-motor body 21 can be started. At this time, the driving cylinder 22 can be driven to rotate around the connection position with the inspection head body 11 under the connection of the rotating shaft, and then the guide block 221 fixed on the arc-shaped inner wall of the driving cylinder 22 can be driven to make a circular motion. At this time, the guide block 221 can slide along the arc-shaped guide groove 241 provided on the arc-shaped outer wall of the vacuum piston seat 24, and at the same time push the vacuum piston seat 24 to slide axially from bottom to top inside the air pressure cylinder 23. At this time, the air between the high-temperature resistant rubber sleeve 25 and the semiconductor module body 16 enters the interior of the air pressure cylinder 23 through multiple air guide tubes 231, and at the same time, negative pressure is generated inside the high-temperature resistant rubber sleeve 25, which can cause the high-temperature resistant rubber sleeve 25 to deform, and finally The semiconductor module body 16 is wrapped, and the wrapping of the high-temperature resistant rubber sleeve 25 can prevent the erosion of external dust and corrosive liquids, thereby protecting the semiconductor module body 16. At the same time, the temperature sensing patch 15 arranged on the inner wall of the high-temperature resistant rubber sleeve 25 can contact the peripheral side of the semiconductor module body 16. At the same time, the negative pressure inside the high-temperature resistant rubber sleeve 25 can make the piston plate 134 slide from top to bottom, thereby moving the metal sensor 133 and the temperature sensor body 13 fixed to the piston plate 134, and finally making the bottom of the metal sensor 133 close to the top of the semiconductor module body 16. At this time, the temperature sensor body 13 and the side sensor receiver 14 can detect the temperature of the top and peripheral side of the semiconductor module body 16, thereby achieving the purpose of adapting to semiconductor module bodies 16 of different shapes;

[0047] When the driving cylinder 22 rotates, the lower fixed cylinder 32 can be driven to rotate around the connection position with the magnetic movable cylinder 33 under the connection of the connecting cylinder 31, and at the same time, the multiple trapezoidal pushing blocks 321 fixedly connected to the lower fixed cylinder 32 can be driven to slide inside the magnetic movable cylinder 33. When the multiple trapezoidal pushing blocks 321 simultaneously enter the multiple pushing and clamping grooves 341 opened on the magnetic ring 34, the bottom of the magnetic ring 34 can contact the top of the isolation plate. At this time, the magnetic ring 34 can adsorb the metal substrate, thereby achieving the purpose of improving the stability of the detection head body 11 and achieving the purpose of being fixed according to different detection environments.

[0048] The working principle and usage process of the present invention are as follows: First, the high-temperature resistant rubber sleeve 25 provided at the bottom of the detection head body 11 is tightly attached to the top of the metal substrate, and by starting the micro-motor body 21, the driving cylinder 22 can be driven to rotate around the connection position with the detection head body 11 under the connection of the rotating shaft, and then the guide block 221 fixed to the arc-shaped inner wall of the driving cylinder 22 is driven to make a circular motion. At this time, the guide block 221 can slide along the arc-shaped guide groove 241 provided on the arc-shaped outer wall of the vacuum piston seat 24, and at the same time push the vacuum piston seat 24 to slide axially from bottom to top inside the air pressure cylinder 23. At this time, the air between the high-temperature resistant rubber sleeve 25 and the semiconductor module body 16 enters the interior of the air pressure cylinder 23 through multiple air guide tubes 231, and at the same time, negative pressure is generated inside the high-temperature resistant rubber sleeve 25, which can cause the high-temperature resistant rubber sleeve 25 to deform, thereby protecting the semiconductor module body 16. At the same time, the temperature sensor patch 15 provided on the inner wall of the high-temperature resistant rubber sleeve 25 can be connected to the semiconductor module body 16 side, at the same time, the negative pressure inside the high-temperature resistant rubber sleeve 25 can make the piston plate 134 slide from top to bottom, and then the metal sensor 133 and the temperature sensor body 13 fixed to the piston plate 134 move, and finally make the bottom of the metal sensor 133 close to the top of the semiconductor module body 16. At this time, the temperature sensor body 13 and the side sensor receiver 14 can detect the temperature of the top and surrounding sides of the semiconductor module body 16. When the driving cylinder 22 rotates, it can drive the lower fixed cylinder 32 to rotate around the connection position with the magnetic movable cylinder 33 under the connection of the connecting cylinder 31, and at the same time drive the multiple trapezoidal pushing blocks 321 fixedly connected to the lower fixed cylinder 32 to slide inside the magnetic movable cylinder 33. When the multiple trapezoidal pushing blocks 321 simultaneously enter the multiple pushing and clamping grooves 341 opened on the magnetic ring 34, the bottom of the magnetic ring 34 can contact the top of the isolation plate. At this time, the magnetic ring 34 can adsorb the metal substrate.

[0049] The above embodiments are merely exemplary embodiments of the present invention and are not intended to limit the scope of the present invention. The scope of protection of the present invention is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present invention within the spirit and scope of protection of the present invention, and such modifications or equivalent substitutions shall also be deemed to fall within the scope of protection of the present invention.

Claims

1. A semiconductor module strength detection device, comprising a high-temperature strength detection device body (1) and a semiconductor module body (16), characterized in that: The high-temperature strength detection device body (1) is provided with a detection head body (11) connected via a connecting line (12), a temperature sensor body (13) is slidably provided inside the detection head body (11), a sensor outer cylinder (131) slidably connected to the temperature sensor body (13) is fixedly provided on the inner wall of the detection head body (11), a side sensor receiver (14) is installed on the arc-shaped outer wall of the sensor outer cylinder (131), and a wrapped detection component (2) is provided on the detection head body (11); The wrapped detection assembly (2) includes a micro motor body (21) mounted on the top of the detection head body (11), the output end of the micro motor body (21) is connected to a driving cylinder (22) via a rotating shaft, the driving cylinder (22) is internally sleeved with an air pumping piston seat (24), an air pressure cylinder (23) is fixedly provided on the arc-shaped outer wall of the sensor outer cylinder (131), and the bottom of the air pumping piston seat (24) is axially slidably connected to the inner wall of the air pressure cylinder (23), a guide block (221) is fixedly provided on the arc-shaped inner wall of the driving cylinder (22), and a guide block (221) is provided on the arc-shaped outer wall of the air pumping piston seat (24) The guide block (221) is provided with an arc-shaped guide groove (241) matching the guide block (221), and the guide block (221) slides inside the arc-shaped guide groove (241), a high-temperature resistant rubber sleeve (25) is fixedly provided at the bottom end of the side sensor receiver (14), a plurality of air guide tubes (231) are fixedly provided between the air pressure cylinder (23) and the high-temperature resistant rubber sleeve (25), and each air guide tube (231) passes through the inner wall of the air pressure cylinder (23) to the inner wall of the high-temperature resistant rubber sleeve (25), a plurality of temperature sensing patches (15) are installed on the inner wall of the high-temperature resistant rubber sleeve (25), and a magnetic attraction component (3) is provided below the driving cylinder (22).

2. The semiconductor module strength detection device according to claim 1, characterized in that: A metal sensor (133) is installed at the bottom end of the temperature sensor body (13), and a piston plate (134) is fixedly provided on the side wall of the metal sensor (133), and the piston plate (134) is axially slidably connected to the inner wall of the sensor outer cylinder (131).

3. A semiconductor module strength detection device according to claim 1 or 2, characterized in that: One end of the connecting line (12) is connected to the temperature sensor body (13); a movable groove matching the temperature sensor body (13) is provided inside the sensor outer cylinder (131); a spring fixing ring is fixedly provided on the arc-shaped outer wall of the temperature sensor body (13); a return spring (132) is fixedly provided between the bottom of the spring fixing ring and the sensor outer cylinder (131); an inner piston groove matching the piston plate (134) is provided inside the sensor outer cylinder (131).

4. The semiconductor module strength detection device according to claim 3, wherein: The air pressure cylinder (23) is provided with an outer piston groove matching the air extraction piston seat (24), the air pressure cylinder (23) is provided with a plurality of air outlet holes, and the plurality of air outlet holes are respectively connected to a plurality of air guide tubes (231), and the inner piston groove is connected to the interior of the high temperature resistant rubber sleeve (25).

5. The semiconductor module strength detection device according to claim 1, wherein: One end of each temperature sensing patch (15) is connected to the side sensor receiver (14) through a wire, a keel frame is fixedly provided at the bottom of the side sensor receiver (14), and a high-temperature resistant rubber sleeve (25) is sleeved on the keel frame, and a rubber sealing strip is fixedly provided at the bottom of the high-temperature resistant rubber sleeve (25).

6. The semiconductor module strength detection device according to claim 1, characterized in that: The driving cylinder (22) is located inside the detection head body (11), and the sensor outer cylinder (131) is located between the outside of the temperature sensor body (13) and the inside of the driving cylinder (22).

7. The semiconductor module strength detection device according to claim 1, wherein: The magnetic attraction component (3) includes a connecting cylinder (31) fixed on the arc-shaped outer wall of the driving cylinder (22); a magnetic attraction movable cylinder (33) is fixedly provided on the arc-shaped outer wall of the side sensor receiver (14); a lower fixed cylinder (32) is fixedly provided at the bottom end of the connecting cylinder (31), and the lower fixed cylinder (32) is located inside the magnetic attraction movable cylinder (33); a plurality of trapezoidal pushing blocks (321) are fixedly provided on the circumferential side of the lower fixed cylinder (32); a magnetic attraction ring (34) is axially slidably connected inside the magnetic attraction movable cylinder (33), and the magnetic attraction ring (34) is slidably connected to the plurality of trapezoidal pushing blocks (321).

8. The semiconductor module strength detection device according to claim 7, characterized in that: The plurality of trapezoidal pushing blocks (321) are distributed in an annular array on the lower fixed cylinder (32); the inner wall of the magnetic ring (34) is provided with a pushing clamping groove (341) matching the plurality of trapezoidal pushing blocks (321); an isolation thin plate is fixedly provided at the bottom end of the magnetic movable cylinder (33), and the magnetic ring (34) is located above the isolation thin plate.

9. The semiconductor module strength detection device according to claim 8, characterized in that: The semiconductor module body (16) is located inside the high-temperature resistant rubber sleeve (25), a metal substrate is provided at the bottom of the semiconductor module body (16), and the isolation thin plate is in contact with the top of the metal substrate.

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