Automatic swaying tray material taking and placing equipment for semiconductor chip processing

Abstract

The invention belongs to the field of semiconductor chip processing, and particularly relates to automatic swaying tray material taking and placing equipment for semiconductor chip processing. The invention discloses automatic swaying tray material taking and placing equipment for semiconductor chip processing. The automatic swaying tray material taking and placing equipment comprises a mounting plate, a first electric track, a sliding plate, an arc-shaped track and the like, first electric rails are vertically and symmetrically arranged in the middle of the front side of the mounting plate through bolts, a sliding plate is fixed between sliding blocks of the first electric rails through bolts, an arc-shaped rail is horizontally mounted on the sliding plate through bolts, and a swing arm is slidably connected to the arc-shaped rail. The three functions of material taking, machining and material placing can be achieved through different rotating angles of the swing arm, in the material taking process, the material placing mechanism can automatically place materials down, through cooperation of the positioning mechanism and the automatic opening mechanism, the materials are automatically positioned, manual interference is not needed, and after material machining is completed, the machining efficiency is greatly improved. The automatic opening mechanism automatically loosens the materials, and meanwhile the material pushing mechanism jacks up the materials.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor chip processing, and particularly relates to an automatic turntable loading and unloading device for semiconductor chip processing. Background Art

[0002] In modern semiconductor manufacturing processes, automated handling of wafers (uncut silicon wafers) and other related materials is one of the key factors in improving production efficiency and ensuring product quality. Traditional material handling methods usually rely on manual operation or semi-automated systems. These methods are not only inefficient but also prone to introducing human errors, resulting in unstable product quality and even damage to high-value wafer materials.

[0003] During the wafer loading and unloading process, due to the lack of precision in existing positioning technologies, manual calibration is often required to ensure correct wafer placement. This manual operation is not only time-consuming but also prone to introducing errors, affecting product consistency and quality.

[0004] Therefore, there is an urgent need to develop an automatic turntable loading and unloading device for semiconductor chip processing that can automatically load and unload materials and position them. Summary of the Invention

[0005] To overcome the above-mentioned shortcomings of the prior art, the present invention provides an automatic turntable loading and unloading device for semiconductor chip processing that can automatically load and unload materials and position them.

[0006] The technical implementation solution of the present invention is: an automatic turntable loading and unloading device for semiconductor chip processing, including a mounting plate, a first electric track, a sliding plate, an arc track, a swing arm, a rotating motor, and a positioning mechanism. The first electric tracks are symmetrically arranged vertically in the middle of the front side of the mounting plate. A sliding plate is fixed between the sliders of the first electric tracks. An arc track is horizontally installed on the sliding plate. A swing arm is slidably connected to the arc track. The end of the swing arm is rotatably connected to the mounting plate. A material placement groove is provided at the top of the swing arm. A rotating motor is fixedly connected to the mounting plate below the rotation point of the swing arm. The output shaft of the rotating motor is fixedly connected to the swing arm. A positioning mechanism is provided at the position of the placement groove of the swing arm. The positioning mechanism includes a clamping plate and a first spring. The clamping plates are symmetrically slidably connected to the swing arm at the position of the placement groove. A first spring is connected between the clamping plate and the swing arm.

[0007] Optionally, the positioning mechanism further includes a micro air pump, an air pipe, and an airbag. The micro air pump is fixedly connected to the swing arm below the clamping plate. Airbags are provided on the inner sides of the clamping plates. An air pipe is connected between the airbag and its adjacent micro air pump.

[0008] Optionally, it further includes a feeding mechanism. The feeding mechanism is arranged on the left part of the mounting plate and includes a material frame, a hinged plate, an insertion plate, a double-shaft motor, a lead screw, and a connecting rod. The material frame is fixedly connected to the front side left part of the mounting plate. The lower parts of the left and right sides of the material frame are both rotatably provided with hinged plates. One-word holes are opened on both the left and right parts of the hinged plate. Insertion plates are slidably arranged on the left and right walls of the material frame inside the one-word holes. The upper insertion plate is slidably connected to the adjacent one-word hole through a shaft. When the hinged plate rotates, it can drive the upper and lower insertion plates on the same side to move in opposite directions. A double-shaft motor is fixedly connected to the side of the material frame. The output shafts of the double-shaft motor are connected with lead screws through couplings. The ends of the lead screws are rotatably connected to the material frame. Connecting rods are threadedly connected to the lead screws. The connecting rods are slidably connected to the material frame. The connecting rods are fixedly connected to the adjacent insertion plates.

[0009] Optionally, it further includes an automatic spreading mechanism. An automatic spreading mechanism is arranged between the top of the clamping plate and the left and right lower parts of the front side of the mounting plate. The automatic spreading mechanism includes a spreading rod and a pushing block. Pushing blocks are arranged on the top of the clamping plate. The spreading rods are symmetrically arranged on the front side lower part of the mounting plate by bolts on the left and right.

[0010] Optionally, the spreading rod is below the material frame. The top view of the spreading rod is in a funnel-shaped cross-section, and the retracting end of the spreading rod faces the clamping plate.

[0011] Optionally, it further includes a pushing mechanism. A pushing mechanism is arranged between the swing arm and the right part of the front side of the mounting plate. The pushing mechanism includes a cushion block, a second spring, a T-shaped guide rod, and a Z-shaped rod. A T-shaped guide rod is vertically slidably arranged in the middle of the placement groove of the swing arm. A cushion block is connected to the top end of the T-shaped guide rod. A second spring is connected between the lower part of the T-shaped guide rod and the bottom of the swing arm. A Z-shaped rod is fixedly connected to the mounting plate on the right side of the T-shaped guide rod.

[0012] Optionally, the middle part of the Z-shaped rod is an inclined surface that slopes upward to the right.

[0013] Optionally, it further includes a material taking mechanism. A material taking mechanism is fixedly connected to the mounting plate above the Z-shaped rod. The material taking mechanism includes a second electric track, a telescopic cylinder, and an electric suction cup. A second electric track is fixedly connected to the mounting plate above the Z-shaped rod. A telescopic cylinder is vertically fixedly connected to the slider of the second electric track. The output end at the bottom of the telescopic cylinder is connected with an electric suction cup.

[0014] The present invention has the following advantages: By rotating the swing arm at different angles, the present invention can achieve three functions of material taking, processing, and material discharging. During the process of material taking, the material discharging mechanism can automatically put down the material. Through the cooperation of the positioning mechanism and the automatic expansion mechanism, the material is automatically positioned without manual intervention. After the material processing is completed, the automatic expansion mechanism automatically releases the material, and at the same time, the material pushing mechanism pushes up the material to facilitate material taking. It achieves the functions of automatic material taking, automatically transporting the material to the processing work, and automatically sending away the material after processing, realizes the integration of material taking, processing, and material discharging, improves work efficiency, and reduces labor intensity. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional structural schematic diagram of the present invention when taking materials.

[0016] Figure 2 It is a three-dimensional structural schematic diagram of the present invention when discharging materials.

[0017] Figure 3 It is a three-dimensional structural schematic diagram of the swing arm moving and rotating components of the present invention.

[0018] Figure 4 It is a three-dimensional structural schematic diagram of the positioning mechanism of the present invention.

[0019] Figure 5 It is a three-dimensional structural schematic diagram of the automatic expansion mechanism of the present invention.

[0020] Figure 6 It is a three-dimensional structural schematic diagram of the material discharging mechanism of the present invention.

[0021] Figure 7 It is a three-dimensional structural schematic diagram of the material pushing mechanism of the present invention.

[0022] Figure 8 It is a three-dimensional structural schematic diagram of the material taking mechanism of the present invention.

[0023] The meanings of the reference numerals in the drawings: 1: mounting plate, 2: first electric track, 3: sliding plate, 4: arc track, 5: swing arm, 6: rotating motor, 7: positioning mechanism, 71: clamping plate, 72: first spring, 73: micro air pump, 74: air pipe, 75: airbag, 8: material discharging mechanism, 81: material frame, 82: hinged plate, 83: slotted hole, 84: inserting plate, 85: double-shaft motor, 86: lead screw, 87: connecting rod, 9: automatic expansion mechanism, 91: expanding rod, 92: pushing block, 10: material pushing mechanism, 1011: cushion block, 1012: second spring, 1013: T-shaped guide rod, 1014: Z-shaped rod, 11: material taking mechanism, 1101: second electric track, 1102: telescopic cylinder, 1103: electric suction cup. DETAILED DESCRIPTION OF THE INVENTION

[0024] Reference to embodiments in this text means that the specific features, structures, or characteristics described in connection with the embodiments can be included in at least one embodiment of the present invention. The phrase appearing at various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0025] Embodiment: An automatic turntable loading and unloading device for semiconductor chip processing, as Figures 1 - 4 shown, includes a mounting plate 1, a first electric track 2, a sliding plate 3, an arc track 4, a swing arm 5, a rotating motor 6, and a positioning mechanism 7. The middle part of the front side of the mounting plate 1 is symmetrically provided with the first electric track 2 up and down by bolts. A sliding plate 3 is fixedly connected between the sliders of the first electric track 2 by bolts. The first electric track 2 drives the sliding plate 3 to move horizontally. The sliding plate 3 is horizontally installed with an arc track 4 by bolts. A swing arm 5 is slidably connected to the arc track 4. The end of the swing arm 5 is rotatably connected to the mounting plate 1. A material placement groove is provided at the top of the swing arm 5. A rotating motor 6 is fixedly connected to the mounting plate 1 below the rotation point of the swing arm 5 by bolts. The output shaft of the rotating motor 6 is fixedly connected to the swing arm 5. The rotating motor 6 can drive the swing arm 5 to rotate. A positioning mechanism 7 is provided at the placement groove position of the swing arm 5.

[0026] As Figure 4 shown, the positioning mechanism 7 includes a clamping plate 71, a first spring 72, a micro air pump 73, an air pipe 74, and an airbag 75. The clamping plates 71 are symmetrically and slidably connected to the swing arm 5 at the placement groove position. A first spring 72 is connected between the clamping plate 71 and the swing arm 5. A micro air pump 73 is fixedly connected to the swing arm 5 below the clamping plate 71 by bolts. Airbags 75 are provided on the inner sides of the clamping plates 71. An air pipe 74 is connected between the airbag 75 and the adjacent micro air pump 73. The micro air pump 73 can inject gas into the airbag 75 and release the gas in the airbag 75.

[0027] As Figure 6As shown in the figure, it further includes a feeding mechanism 8. The feeding mechanism 8 is arranged at the left part of the mounting plate 1. The feeding mechanism 8 includes a material frame 81, a hinge plate 82, a plug board 84, a double-shaft motor 85, a lead screw 86 and a connecting rod 87. The left part of the front side of the mounting plate 1 is fixedly connected with the material frame 81 by bolts. Hinge plates 82 are rotatably arranged at the lower parts on both the left and right sides of the material frame 81. One-word holes 83 are formed in both the left and right parts of the hinge plate 82. Plug boards 84 are slidably arranged on the left and right walls of the material frame 81 inside the one-word holes 83. The upper plug board 84 is slidably connected with the adjacent one-word hole 83 through a shaft. When the hinge plate 82 rotates, it can drive the upper and lower plug boards 84 on the same side to move in opposite directions. The side of the material frame 81 is fixedly connected with the double-shaft motor 85 by bolts. A lead screw 86 is connected to the output shaft of the double-shaft motor 85 through a coupling. The end of the lead screw 86 is rotatably connected with the material frame 81. Connecting rods 87 are threadedly connected to the lead screw 86. The connecting rods 87 are slidably connected with the material frame 81. The connecting rods 87 are fixedly connected with the adjacent plug boards 84. By controlling the rotation of the double-shaft motor 85, the connecting rods 87 can be driven to approach or separate, so that the upper plug boards 84 approach or separate from each other, and the lower plug boards 84 are driven to separate or approach each other.

[0028] As Figure 2 and Figure 5 shown in the figure, it further includes an automatic spreading mechanism 9. An automatic spreading mechanism 9 is arranged between the top of the clamping plate 71 and the left and right parts of the lower front side of the mounting plate 1. The automatic spreading mechanism 9 includes a spreading rod 91 and a pushing block 92. Pushing blocks 92 are arranged on the top of the clamping plate 71. Spreading rods 91 are symmetrically arranged on the lower front side of the mounting plate 1 by bolts on the left and right. The spreading rods 91 are below the material frame 81. The top view of the spreading rod 91 is funnel-shaped in cross-section, and the retracting end of the spreading rod 91 faces the clamping plate 71.

[0029] As Figure 7 shown in the figure, it further includes a pushing mechanism 10. A pushing mechanism 10 is arranged between the swing arm 5 and the right part of the front side of the mounting plate 1. The pushing mechanism 10 includes a cushion block 1011, a second spring 1012, a T-shaped guide rod 1013 and a Z-shaped rod 1014. A T-shaped guide rod 1013 is vertically slidably arranged in the middle of the placing groove of the swing arm 5. The top end of the T-shaped guide rod 1013 is connected with the cushion block 1011. The upper surface of the cushion block 1011 is flush with the bottom surface of the placing groove. A second spring 1012 is connected between the lower part of the T-shaped guide rod 1013 and the bottom of the swing arm 5. A Z-shaped rod 1014 is fixedly connected to the mounting plate 1 on the right side of the T-shaped guide rod 1013 by bolts. The middle part of the Z-shaped rod 1014 is an inclined surface sloping upward to the right.

[0030] Figure 8 ​As shown, it also includes a material picking mechanism 11, and the mounting plate 1 above the Z-shaped rod 1014 is fixedly connected to the material picking mechanism 11 by bolts. The material picking mechanism 11 includes a second electric rail 1101, a telescopic cylinder 1102 and an electric suction cup 1103. The mounting plate 1 above the Z-shaped rod 1014 is fixedly connected to the second electric rail 1101 by bolts, and the telescopic cylinder 1102 is vertically fixedly connected to the slider of the second electric rail 1101 by bolts. The output end at the bottom of the telescopic cylinder 1102 is connected to the electric suction cup 1103, and the telescopic cylinder 1102 can drive the electric suction cup 1103 to move vertically.

[0031] During use: the semiconductor chip to be processed is placed in the material frame 81, and then the sliding plate 3 and the device thereon are driven to move to the left by the first electric track 2, so that the push block 92 moves to the left. When the push block 92 moves to the left and contacts the opening rod 91, under the action of the opening rod 91, the push block 92 moves outward and separates, driving the clamping plate 71 to move outward, and the first spring 72 is compressed. When the placement slot of the swing arm 5 moves to the bottom of the material frame 81, the first electric track 2 is controlled to stop working. At this time, the dual-axis motor 85 is controlled to rotate, driving the connecting rod 87 to move closer to each other, and then driving the upper insert plate 84 to move closer. The upper insert plates 84 move closer to each other to support the material above the lowest semiconductor chip, and at the same time, the upper insert plate 84 is close to When close, due to the action of the hinged plate 82, the lower plug-in plates 84 are separated from each other, and the lowest semiconductor chip falls into the placement slot of the swing arm 5 because there is no support from the plug-in plate 84. Then the dual-axis motor 85 is controlled to drive the connecting rods 87 to separate and reset, and then drive the plug-in plate 84 to reset. The semiconductor chip falls on the lower plug-in plate 84, and then the sliding plate 3 and the upper device are driven to the right to the middle of the mounting plate 1 through the first electric track 2. At this time, the push block 92 leaves the support rod 91, and the first spring 72 is reset, driving the clamping plate 71 to move inward to clamp the material and position it. If the edge of the material cannot be clamped by a hard object, gas can be injected into the airbag 75 through the micro air pump 73 to expand the airbag 75 to prevent the material from being crushed.

[0032] When the sliding plate 3 and the device thereon move to the middle of the mounting plate 1, the rotary motor 6 is controlled to rotate 90 degrees counterclockwise, so that the swing arm 5 rotates 90 degrees to transport the material to the processing work for processing. After the material is processed, the rotary motor 6 is controlled to rotate 90 degrees counterclockwise again. Figure 2Subsequently, the first electric rail 2 drives the sliding plate 3 and the devices thereon to move to the right. During the rightward movement of the sliding plate 3, the pushing block 92 contacts the right-side spreading rod 91, causing the clamping plate 71 to open. Subsequently, the bottom end of the T-shaped guide rod 1013 contacts the upwardly inclined surface of the Z-shaped rod 1014, and the T-shaped guide rod 1013 moves upward, compressing the second spring 1012. The upward movement of the T-shaped guide rod 1013 drives the cushion block 1011 to move upward, lifting the material. At this time, the telescopic cylinder 1102 is controlled to extend, driving the electric suction cup 1103 to move downward to suck up the material. Then, the telescopic cylinder 1102 resets. Next, the second electric rail 1101 moves the telescopic cylinder 1102 to the right to the discharging position, and the electric suction cup 1103 is controlled to stop working, and the material is put down. At this time, the second electric rail 1101 drives the telescopic cylinder 1102 to reset, and at the same time, the first electric rail 2 drives the sliding plate 3 and the devices thereon to move to the middle of the mounting plate 1. The pushing block 92 separates from the clamping plate 71, the clamping plate 71 resets, the T-shaped guide rod 1013 separates from the Z-shaped rod 1014, and the T-shaped guide rod 1013 and the devices thereon reset. Subsequently, the rotating motor 6 is controlled to rotate clockwise by 180 degrees, and the above operations are continued to be repeated for the conveying and processing of the material.

[0033] Although the present invention has been described in detail with reference to the above embodiments, it is obvious to those skilled in the art from this disclosure that various changes or modifications can be made to the present invention without departing from the principle and spirit scope defined by the claims. Therefore, the detailed description of the embodiments of this disclosure is only used to explain, rather than to limit the present invention, and the scope of protection is defined by the content of the claims.

Claims

1. An automatic turntable loading and unloading device for semiconductor chip processing, comprising a mounting plate (1), a first electric track (2), a sliding plate (3), an arc track (4), a swing arm (5), a rotating motor (6) and a positioning mechanism (7). The first electric tracks (2) are symmetrically arranged up and down in the middle of the front side of the mounting plate (1), and the sliding plate (3) is fixed between the sliders of the first electric tracks (2). It is characterized in that: On one side of the sliding plate (3) away from the first electric track (2), an arc track (4) is horizontally installed. A swing arm (5) is slidably connected to the arc track (4). The end of the swing arm (5) is rotatably connected to the mounting plate (1). A material placement groove is formed at the top of the swing arm (5). Below the rotation point of the swing arm (5) and on the mounting plate (1), a rotation motor (6) is fixedly connected. The output shaft of the rotation motor (6) is fixedly connected to the rotation part of the swing arm (5). A positioning mechanism (7) is arranged at the placement groove position of the swing arm (5). The positioning mechanism (7) includes a clamping plate (71) and a first spring (72). The clamping plates (71) are symmetrically and slidably connected to the swing arm (5) at the position of the placement groove. A first spring (72) is connected between the clamping plate (71) and the swing arm (5).

2. The automatic turntable loading and unloading equipment for semiconductor chip processing according to claim 1, characterized in that: The positioning mechanism (7) further includes a micro air pump (73), an air pipe (74), and an airbag (75). The micro air pump (73) is fixedly connected to the swing arm (5) below the clamping plate (71). Airbags (75) are arranged on the inner sides of the clamping plates (71). An air pipe (74) is connected between the airbag (75) and the adjacent micro air pump (73).

3. An automatic turntable pick - and - place device for semiconductor chip processing according to claim 1, characterized in that: It further includes a feeding mechanism (8). The feeding mechanism (8) is arranged at the left part of the mounting plate (1). The feeding mechanism (8) includes a material frame (81), a hinge plate (82), an insertion plate (84), a double-shaft motor (85), a lead screw (86), and a connecting rod (87). The material frame (81) is fixedly connected to the front side left part of the mounting plate (1). Hinge plates (82) are rotatably arranged at the lower parts of the left and right sides of the material frame (81). One-word holes (83) are formed in the left and right parts of the hinge plate (82). Insertion plates (84) are slidably arranged on the left and right walls of the material frame (81) inside the one-word holes (83). The insertion plates (84) are two arranged up and down. The upper insertion plate (84) is slidably connected to the adjacent one-word hole (83) through a shaft. When the hinge plate (82) rotates, it can drive the upper and lower insertion plates (84) on the same side to move in opposite directions. A double-shaft motor (85) is fixedly connected to the side of the material frame (81). The output shaft of the double-shaft motor (85) is connected to a lead screw (86) through a coupling. The end of the lead screw (86) is rotatably connected to the material frame (81). Connecting rods (87) are threadedly connected to the lead screw (86). The connecting rods (87) are slidably connected to the material frame (81). The connecting rods (87) are fixedly connected to the adjacent insertion plates (84).

4. An automatic turntable loading and unloading device for semiconductor chip processing according to claim 3, characterized in that: It further includes an automatic spreading mechanism (9). An automatic spreading mechanism (9) is arranged between the top of the clamping plate (71) and the left and right sides of the lower part of the front side of the mounting plate (1). The automatic spreading mechanism (9) includes a spreading rod (91) and a pushing block (92). Pushing blocks (92) are arranged on the tops of the clamping plates (71). The spreading rods (91) are symmetrically arranged on the lower part of the front side of the mounting plate (1) through bolts.

5. An automatic turntable pick - and - place device for semiconductor chip processing according to claim 4, characterized in that: The spreading rod (91) is below the material frame (81). The top view of the spreading rod (91) has a funnel-shaped cross-section. The retracting end of the spreading rod (91) faces the clamping plate (71).

6. The automatic turntable loading and unloading equipment for semiconductor chip processing according to claim 4, characterized in that: It further includes a material pushing mechanism (10). A material pushing mechanism (10) is arranged between the swing arm (5) and the right part of the front side of the mounting plate (1). The material pushing mechanism (10) includes a cushion block (1011), a second spring (1012), a T-shaped guide rod (1013) and a Z-shaped rod (1014). A T-shaped guide rod (1013) is vertically and slidably arranged in the middle of the placement groove of the swing arm (5). A cushion block (1011) is connected to the top end of the T-shaped guide rod (1013). A second spring (1012) is connected between the lower part of the T-shaped guide rod (1013) and the bottom of the swing arm (5). A Z-shaped rod (1014) is fixedly connected to the mounting plate (1) on the right side of the T-shaped guide rod (1013).

7. An automatic turntable loading and unloading device for semiconductor chip processing according to claim 6, characterized in that: The middle part of the Z-shaped rod (1014) is an inclined surface that slopes upward to the right.

8. An automatic turntable loading and unloading device for semiconductor chip processing according to claim 6, characterized in that: It further includes a material taking mechanism (11). A material taking mechanism (11) is fixedly connected to the mounting plate (1) above the Z-shaped rod (1014). The material taking mechanism (11) includes a second electric rail (1101), a telescopic cylinder (1102) and an electric suction cup (1103). A second electric rail (1101) is fixedly connected to the mounting plate (1) above the Z-shaped rod (1014). A telescopic cylinder (1102) is vertically fixedly connected to the slider of the second electric rail (1101). The output end at the bottom of the telescopic cylinder (1102) is connected to an electric suction cup (1103).

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