Printed circuit board and air conditioner having same

Abstract

An object of the present disclosure is to provide a printed circuit board that prevents a lead wire of a mounting component from being broken due to vibration of a weight component on a substrate. A printed circuit board (100) is provided with: a first member (10) which is a weight member for storing electrical energy or inductive energy; a second component (20) which is a power device having a plurality of leads (200); and a substrate (30) on which the first member (10) and the second member (20) are mounted. In the substrate (30), a slit (30a) is provided between the first member (10) and the second member (20), and the lead of the second member (20) is soldered to the substrate (30). In the printed circuit board (100), the propagation of vibration from the first member (10) having a weight to the second member (20) is suppressed by the slit (30a), so that the breakage of the lead (200) caused by the vibration can be prevented.

Description

Technical Field

[0001] The present disclosure relates to a printed circuit board. Background Art

[0002] Sometimes, gaps are provided around components for the purpose of alleviating the impact on the substrate when the components mounted on the substrate are subjected to shock or vibration. For example, in the printed circuit board described in Patent Document 1 (Japanese Utility Model Laid-Open No. 4-107875), discontinuous gaps are provided so as to surround the periphery of the mounting portion of a transformer as a heavy component, preventing the propagation of cracks. Summary of the Invention

[0003] Problems to be Solved by the Invention

[0004] If vibration repeatedly acts on the substrate, there is a case where the vibration of the heavy component is transmitted to a component separated from the heavy component, breaking the lead of the component.

[0005] However, in Patent Document 1, there is no countermeasure against the vibration caused by the heavy component for breaking the lead of the mounted component.

[0006] Means for Solving the Problems

[0007] The printed circuit board according to the first aspect includes a first component, a second component, and a substrate. The first component is a heavy component that stores electric energy or induces energy. The second component is a power device having a plurality of leads. The first component and the second component are mounted on the substrate, a gap is provided between the first component and the second component, and the leads of the second component are soldered to the substrate. [[ID=**]]

[0008] In this printed circuit board, the vibration from the first component having weight is suppressed from being transmitted to the second component through the gap, and thus, breakage of the lead caused by vibration can be prevented.

[0009] In the printed circuit board according to the second aspect, among the plurality of leads in the printed circuit board according to the first aspect, a first lead closest to the first component is included. The gap is provided between the first component and the first lead.

[0010] In this printed circuit board, the vibration from the first component having weight is suppressed from being transmitted to the second component through the gap, and thus, breakage of the first lead closest to the first component is prevented.

[0011] In the printed circuit board according to the third aspect, when vibration in a direction perpendicular to the substrate is applied, the stress of the first component on the first lead is greater than the stress on other components.

[0012] In the printed circuit board of the fourth aspect, among the printed circuit boards of any one of the first to third aspects, a plurality of first components are mounted on a substrate. The plurality of first components include first weight components. The first weight component is a weight component that causes the maximum stress on the lead when vibrating in a direction perpendicular to the substrate. A gap is provided between the first weight component and the second component.

[0013] In the printed circuit board of the fifth aspect, among the printed circuit boards of any one of the first to fourth aspects, the first component is any one of an electrolytic capacitor, a reactor, and a coil.

[0014] In the printed circuit board of the sixth aspect, among the printed circuit boards of any one of the first to fifth aspects, the second component is any one of an intelligent power module, an active filter module, an insulated gate bipolar transistor, a MOSFET, a diode, a thyristor, and a triac.

[0015] In the printed circuit board of the seventh aspect, among the printed circuit boards of any one of the first to sixth aspects, the first component is mounted at the central portion of the substrate.

[0016] In this printed circuit board, by positioning the first component at the central portion of the substrate, the substrate is likely to be deformed due to vibration. Therefore, the effect of forming a gap on the substrate is high.

[0017] In the printed circuit board of the eighth aspect, among the printed circuit boards of any one of the first to seventh aspects, the gap penetrates the substrate.

[0018] In the printed circuit board of the ninth aspect, among the printed circuit boards of any one of the first to eighth aspects, the width of the gap is in the range of 1.0 mm to 4.0 mm.

[0019] In this printed circuit board, both the processability of the gap and the prevention of vibration propagation can be satisfied.

[0020] In the printed circuit board of the tenth aspect, among the printed circuit boards of any one of the first to ninth aspects, the substrate is fixed to an object via a connecting component and the second component.

[0021] In this printed circuit board, the lead of the second component also functions as a connecting component. Therefore, compared with other mounted components, it is more susceptible to repeated fatigue caused by vibration. Therefore, by providing a gap between the first component and the second component to block vibration propagation, the lead is protected from repeated fatigue.

[0022] The air conditioner of the eleventh aspect has the printed circuit board of any one of the first to tenth aspects. Description of the Drawings

[0023] Figure 1Is a perspective view of an air conditioner having the printed circuit board of the present disclosure.

[0024] Figure 2 Is a circuit diagram of a power conversion circuit arranged in the printed circuit board of the present disclosure.

[0025] Figure 3 Is an internal perspective view of the electrical mounting box when observing the inside of the electrical mounting box from the direction in which the first side of the printed circuit board is the front.

[0026] Figure 4 Is when observing from the direction in which the first side is the front Figure 3 The external view of the printed circuit board shown.

[0027] Figure 5 Is when observing from the direction in which the second side is the front Figure 3 The external view of the printed circuit board shown.

[0028] Figure 6 Is a schematic cross - section of an electrical mounting box housing Figure 3 The printed circuit board.

[0029] Figure 7 Is the external view of the printed circuit board when observing from the direction in which the second side is the front, with the shape of the gap Figure 5 Changed.

[0030] Figure 8 Is the external view of the printed circuit board when observing from the direction in which the second side is the front, with the number of gaps Figure 7 Changed. Detailed implementation mode

[0031] (1) Structure of the printed circuit board 100

[0032] Figure 1 Is a perspective view of an air conditioner 1 having the printed circuit board 100 of the present disclosure. In Figure 1 The air conditioner 1 includes an indoor unit 4 and an outdoor unit 5. The indoor unit 4 and the outdoor unit 5 are connected by a refrigerant connection pipe 6.

[0033] The indoor unit 4, the outdoor unit 5, and the refrigerant connection pipe 6 form a refrigerant circuit. In the refrigerant circuit, for example, during cooling operation, heating operation, and dehumidifying operation, a vapor - compression refrigeration cycle is repeated.

[0034] The indoor unit 4 is installed on an indoor wall, but is not limited thereto, and may also be installed on the ceiling or the floor.

[0035] The outdoor unit 5 is installed outdoors and functions as a heat source unit for supplying heat energy to the indoor unit 4.

[0036] An electrical installation parts box is mounted on the indoor unit 4 and the outdoor unit 5, and a printed circuit board is housed in the electrical installation parts box. Here, the printed circuit board 100 of the outdoor unit 5 will be described as an example.

[0037] Figure 2 It is a circuit diagram of the power conversion circuit 110 arranged in the printed circuit board 100 of the present disclosure.

[0038] In Figure 2 the power conversion circuit 110 rectifies AC power into DC power, converts the DC power into AC power of a specified frequency, and supplies it to the motor M. The motor M drives, for example, a compressor provided in the refrigerant circuit of the air conditioner 1.

[0039] (1-1) Rectifying diode module 20a

[0040] The rectifying diode module 20a consists of four diodes D1a, D1b, D2a, and D2b to form a bridge circuit. Specifically, the diode D1a and the diode D1b, and the diode D2a and the diode D2b are respectively connected in series with each other.

[0041] The connection point of the diode D1a and the diode D1b is connected to one pole of the AC power supply AC. The connection point of the diode D2a and the diode D2b is connected to the other pole of the AC power supply AC.

[0042] The rectifying diode module 20a rectifies the AC power output from the AC power supply AC to generate DC power, and supplies it to the first to third electrolytic capacitors 10a to 10c.

[0043] (1-2) First to third electrolytic capacitors 10a to 10c

[0044] The first to third electrolytic capacitors 10a to 10c smooth the voltage rectified by the rectifying diode module 20a.

[0045] The second electrolytic capacitor 10b and the third electrolytic capacitor 10c are connected in series to perform smoothing and voltage doubling output, and together with the diode bridge rectifier circuit of the rectifying diode module 20a, they form a voltage doubler rectifier circuit.

[0046] The smoothed voltage based on the first to third electrolytic capacitors 10a to 10c is supplied to the intelligent power module 20b.

[0047] (1-3) Reactor 10d

[0048] As Figure 2As shown, the reactor 10d is provided on the AC power line, one end of which is connected to the input side (coil 10e) of the AC power supply AC, and the other end is connected to the diode bridge rectifier circuit of the rectifying diode module 20a. The function of the reactor 10d is to improve the power factor and suppress high-order harmonics.

[0049] (1-4)Coil 10e

[0050] The coil 10e is connected between the AC power supply AC and the reactor 10d. The coil 10e is a common-mode choke coil for removing common-mode noise.

[0051] (1-5)Intelligent power module 20b

[0052] The intelligent power module 20b incorporates a switching circuit 25 and a control circuit 26 and is packaged as one unit. Hereinafter, the intelligent power module 20b will be referred to as "IPM20b".

[0053] (1-5-1)Switching circuit 25

[0054] The three upper and lower arms of the switching circuit 25 corresponding to the drive coils Lu, Lv, and Lw of the U-phase, V-phase, and W-phase of the motor M are respectively connected in parallel to the output side of the first electrolytic capacitor 10a.

[0055] In Figure 2 the switching circuit 25 includes a plurality of IGBTs (Insulated Gate Bipolar Transistors, hereinafter simply referred to as transistors) Q3a, Q3b, Q4a, Q4b, Q5a, Q5b and a plurality of diodes D3a, D3b, D4a, D4b, D5a, D5b for commutation.

[0056] The transistor Q3a and the transistor Q3b, the transistor Q4a and the transistor Q4b, and the transistor Q5a and the transistor Q5b are respectively connected in series to form each upper and lower arm, and the output lines extend from the connection points NU, NV, NW thus formed to the drive coils Lu, Lv, Lw of the corresponding phases.

[0057] Each of the diodes D3a~D5b is connected in parallel with each of the transistors Q3a~Q5b in such a way that the collector terminal of the transistor is connected to the cathode terminal of the diode and the emitter terminal of the transistor is connected to the anode terminal of the diode.

[0058] The switching circuit 25 is applied with a DC voltage, and each of the transistors Q3a~Q5b is turned on and off at the timing indicated by the control circuit 26, thereby generating a drive voltage for driving the motor M. This drive voltage is output from the connection points NU, NV, NW of the transistor Q3a and the transistor Q3b, the transistor Q4a and the transistor Q4b, and the transistor Q5a and the transistor Q5b to the drive coils Lu, Lv, Lw of the motor M.

[0059] The (1-5-2) control circuit 26

[0060] Based on the command voltage from the inverter microcomputer 35, the control circuit 26 changes the on and off states of the transistors Q3a to Q5b of the switching circuit 25.

[0061] Specifically, the control circuit 26 generates gate control voltages Gu, Gx, Gv, Gy, Gw, and Gz in such a manner that a pulsed drive voltage with an arbitrary duty ratio is output from the switching circuit 25 to the motor M. The duty ratio is determined by the inverter microcomputer 35.

[0062] The generated gate control voltages Gu, Gx, Gv, Gy, Gw, and Gz are applied to the gate terminals of the respective transistors Q3a to Q5b.

[0063] The (1-6) inverter microcomputer 35

[0064] The inverter microcomputer 35 is connected to the voltage detection unit 32, the current detection unit 33, and the control circuit 26. Further, the inverter microcomputer 35 monitors the detection value of the voltage detection unit 32, and when the detection value of the voltage detection unit 32 exceeds a specified threshold value, it also performs protection control to turn off the transistors Q3a to Q5b.

[0065] The component arrangement on the printed circuit board 100

[0066] Figure 3 It is an internal perspective view of the electrical installation box 70 when observing the inside of the electrical installation box 70 from the direction in which the first surface 301 of the printed circuit board 100 is the front surface.

[0067] Moreover, Figure 4 It is a front view of the printed circuit board 100 when observing Figure 3 the printed circuit board 100 described above from the direction in which the first surface 301 is the front surface.

[0068] In Figure 3 and Figure 4 the substrate 30 is a printed wiring board. The substrate 30 has a first surface 301 as a mounting surface for components on the front surface. Further, the substrate 30 has a second surface 302 as a mounting surface for components on the back surface.

[0069] The first components 10 mounted on the first surface 301

[0070] In Figure 4 the first to third electrolytic capacitors 10a to 10c and the coil 10e are mounted on the first surface 301 of the substrate 30 as the first components 10.

[0071] Here, the second electrolytic capacitor 10b and the third electrolytic capacitor 10c are arranged counterclockwise from the first electrolytic capacitor 10a located approximately at the center of the substrate 30.

[0072] The first to third electrolytic capacitors 10a to 10c store electrical energy by applying a voltage between the terminals. The coil 10e stores inductive energy by passing a current through it.

[0073] The individual weights of the first to third electrolytic capacitors 10a to 10c and the coil 10e are larger than those of other components mounted on the first surface 301 of the substrate 30, and they are generally known as weight components.

[0074] Therefore, the first component 10 is defined as a weight component that stores electrical energy or inductive energy. In addition to electrolytic capacitors and coils, reactors and transformers also correspond to the first component 10. Figure 2 The reactor 10d described in the circuit diagram is not on the substrate 30, so it is not described in Figure 4 However, it is a weight component that stores inductive energy.

[0075] (2-2) The second component 20 mounted on the second surface 302

[0076] Figure 5 is the external view of the printed circuit board 100 when observing the printed circuit board 100 described Figure 3 from the direction in which the second surface 302 is the front surface.

[0077] In Figure 5 Three circles depicted by a double-dashed line indicate the positions of the first to third electrolytic capacitors 10a to 10c mounted on the first surface 301. And a rectangular frame depicted by a double-dashed line indicates the position of the coil 10e mounted on the first surface 301.

[0078] On the second surface 302 of the substrate 30, a rectifying diode module 20a and an IPM 20b are mounted as the second component 20.

[0079] The rectifying diode module 20a and the IPM 20b have a plurality of leads. For example, as Figure 5 shown, the IPM 20b has a package portion 150 and a plurality of leads 200 protruding from the package portion 150.

[0080] The rectifying diode module 20a and the IPM 20b are semiconductor elements for power supply and are generally known as power devices.

[0081] Therefore, the second component 20 is defined as a power device having a plurality of leads. In addition to the rectifying diode module and the IPM, the active filter module, the insulated gate bipolar transistor, the thyristor, and the triac also correspond to the second component 20.

[0082] As Figure 4 and Figure 5 shown, in the substrate 30, a gap 30a is provided between the first to third electrolytic capacitors 10a to 10c and the IPM 20b. The function of the gap 30a will be described in the section of “(4) Function of the gap” later.

[0083] (3) Fixing of the printed circuit board 100 to the electrical mounting box 70

[0084] Figure 6 is a schematic cross-sectional view of the electrical mounting box 70 housing Figure 3 the printed circuit board 100. In Figure 6 it, the first component 10 corresponds to the first electrolytic capacitor 10a, and the second component 20 corresponds to the IPM 20b.

[0085] As Figure 6 shown, the printed circuit board 100 is fixed in such a manner that the second surface 302 faces the wall 60 of the electrical mounting box 70 and the second surface 302 is separated from the wall surface of the wall 60 by a predetermined distance. The predetermined distance is set so that the components mounted on the second surface 302 and the metal components protruding through the second surface 302 from the first surface 301 do not interfere with the wall 60.

[0086] (3-1) Connecting member 40

[0087] In order to maintain the distance between the printed circuit board 100 and the wall 60 of the electrical mounting box 70 at this predetermined distance, a connecting member 40 is mounted at the corner of the printed circuit board 100. The connecting member 40 is made of resin. The connecting member 40 is rod-shaped and has a head 401, a main body portion 402, a positioning portion 403, an anti-disengagement portion 404, and a groove portion 405.

[0088] The connecting member 40 is driven from the outside of the wall 60 of the electrical mounting box 70 toward the inside until the head 401 contacts the outer surface of the wall 60. The positioning portion 403 protrudes radially from the outer periphery of the main body portion 402.

[0089] The anti-disengagement portion 404 is substantially conical and is located at the end of the main body portion 402. The groove portion 405 is formed from the end of the anti-disengagement portion 404 toward the positioning portion 403. The interval between the positioning portion 403 and the anti-disengagement portion 404 is slightly larger than the thickness of the substrate 30.

[0090] At the four corners of the printed circuit board 100, holding holes 310 are provided in advance for the anti-disengagement portions 404 of the connecting members 40 to be inserted.

[0091] The holding holes 310 are placed in such a way that they overlap with the ends of the anti-disengagement portions 404, and the printed circuit board 100 is pressed into the positioning portion 403. At this time, the ends of the anti-disengagement portions 404 are flexed in the direction of narrowing the width of the groove portion 405, and the periphery of the holding holes 310 converges between the positioning portion 403 and the anti-disengagement portions 404. As a result, the printed circuit board 100 is fixed to the electrical mounting box 70.

[0092] (3-2)Heat sink 50

[0093] However, not all of the four corners of the printed circuit board 100 are fixed to the electrical mounting box 70 via the connecting members 40.

[0094] Since the second component 20 such as the IPM20b generates a large amount of heat compared to other mounting components, as Figure 6 shown, on the surface that does not face the second surface 302, a heat sink 50 for heat dissipation is mounted by screws 90.

[0095] Moreover, since the second component 20 is located at a position closer to the corner of the second surface 302 than other mounting components, the second component 20 with the heat sink 50 is used as a positioning and connecting component for the substrate 30 with respect to the electrical mounting box 70.

[0096] The heat sink 50 mounted on the second component 20 is fixed to the electrical mounting box 70 in a state of passing through the electrical mounting box 70. However, the heat sink 50 is not directly fixed to the electrical mounting box 70, but an insulator 56 is interposed between the heat sink 50 and the electrical mounting box 70.

[0097] The insulator 56 is made of resin. A hole 70a for inserting the insulator 56 is provided in the wall 60 of the electrical mounting box 70. The insulator 56 is formed into a ring shape so as to cover the edge of the hole 70a from the inside of the hole 70a.

[0098] The ring-shaped insulator 56 is provided with a hole 56a for inserting the heat sink 50. The heat sink 50 passes through the hole 56a and protrudes to the outside of the electrical mounting box 70. The heat sink 50 and the insulator 56 are fastened by screws 90.

[0099] As described above, the second component 20 and the heat sink 50 function as connecting components for fixing the printed circuit board 100 to the electrical mounting box 70.

[0100] (4)Function of the gap

[0101] As described above, in the IPM 20b that serves as the second component 20, the lead wires 200 are soldered to the substrate 30, and the encapsulation portion 150 is fixed to the electrical mounting box 70 via the heat sink 50. Therefore, it is difficult for the IPM 20b to displace relative to both the substrate 30 and the electrical mounting box 70.

[0102] For example, when vibration is applied in the direction perpendicular to the substrate 30 (the plate thickness direction) and the first component 10, which is a weight component, vibrates, the vibration propagates to other mounting components on the substrate 30.

[0103] Since it is difficult for the IPM 20b to displace relative to both the substrate 30 and the electrical mounting box 70, relatively large stress acts repeatedly compared to other mounting components. In particular, since the strength of the lead wires 200 is weaker than that of the encapsulation portion 150, there is a possibility of breakage.

[0104] Therefore, in the present embodiment, as Figures 4 - 6 shown, a gap 30a is provided between the first component 10 and the second component 20 on the substrate 30. The gap 30a suppresses the propagation of vibration from the first component 10 with weight to the second component 20, and thus prevents breakage of the lead wires 200 caused by vibration.

[0105] Specifically, as Figure 5 shown, when the lead wire closest to the first to third electrolytic capacitors 10a to 10c, which are the first component 10, among the multiple lead wires 200 of the IPM 20a is set as the first lead wire 201, a gap 30a is provided between the first lead wire 201 and the first to third electrolytic capacitors 10a to 10c.

[0106] Considering both workability and prevention of vibration propagation, the width of the gap 30a is preferably in the range of 1.0 mm to 4.0 mm.

[0107] Moreover, the gap 30a preferably penetrates the substrate 30. In this case, the vibration propagation from the first component 10 is blocked by the penetrating gap 30a, suppressing the propagation to the second component 20.

[0108] (4-1) Regarding the length of the gap

[0109] The gap does not necessarily need to be set to cover the entire length between the first component (the first to third electrolytic capacitors 10a to 10c and the coil 10e) and the second component 20.

[0110] Figure 7 It is the external view of the second surface 302 of the printed circuit board 100 in which the length of the gap in Figure 5 is changed.

[0111] In Figure 7In [the structure], a gap 30b is provided between the first electrolytic capacitor 10a located at the central portion of the substrate 30 and the first lead 201, which is the lead closest to the first electrolytic capacitor 10a. Therefore, the gap 30b is shorter than Figure 5 the length of the gap 30a described in [reference], and is set to a length that only suppresses the vibration propagation from the first electrolytic capacitor 10a.

[0112] According to the applicant's experiment, it was found that the same effect as that of the gap 30a described in Figure 5 [reference] can be obtained through the gap 30b. Since the vibration amplitude of the first component (the first electrolytic capacitor 10a) located at the central portion of the substrate 30 in the first component 10 is the largest, it is considered that suppressing the vibration propagation from the first electrolytic capacitor 10a has the greatest effect. The length of the gap is preferably 15 mm to 30 mm.

[0113] (4-2) Number and position of gaps

[0114] Figure 8 is a front view of the second side 302 of the printed circuit board 100 in which the number of gaps in Figure 7 [reference] is changed.

[0115] In Figure 8 [the structure], a gap 30c is added between the first component 10, which is the coil 10e, farthest from the IPM 20b and the first lead 201 of the IPM 20b and near the coil 10e.

[0116] According to the applicant's experiment, it is known that, compared with the first electrolytic capacitor 10a located at the central portion of the substrate 30 where the vibration amplitude is the largest, the vibration propagation from the coil 10e, which is the farthest from the IPM 20b, sometimes becomes larger.

[0117] This is presumably due to the influence of the weight balance between the coil 10e and the first to third electrolytic capacitors 10a to 10c. In this case, by setting the gap 30c close to the coil 10e as the vibration source, the vibration propagation from the coil 10e can be effectively suppressed.

[0118] (5) Features

[0119] (5-1)

[0120] The printed circuit board 100 includes: a first component 10, which is a heavy component that stores electrical energy or inducts energy; a second component 20, which is a power device having a plurality of leads 200; and a substrate 30, to which the first component 10 and the second component 20 are mounted. In the substrate 30, gaps (30a, 30b, 30c) are provided between the first component 10 and the second component 20, and the leads 200 of the second component 20 are soldered to the substrate 30. In the printed circuit board 100, the vibration from the heavy first component 10 is suppressed from propagating to the second component 20 through the gaps (30a, 30b, 30c), and thus, breakage of the leads 200 caused by vibration can be prevented.

[0121] (5-2)

[0122] Gaps (30a, 30b, 30c) are provided between the first lead 201, which is the closest to the first component 10 among the plurality of leads 200 of the second component 20, and the first component 10.

[0123] (5-3)

[0124] When vibration is applied in a direction perpendicular to the substrate 30, the stress of the first component 10 on the first lead 201 is greater than the stress on other components.

[0125] (5-4)

[0126] Gaps (30a, 30b, 30c) are provided between the first component 10, which has the greatest stress on the lead 200 when vibration is applied in a direction perpendicular to the substrate 30 among the plurality of first components 10, and the second component 20.

[0127] (5-5)

[0128] The first component 10 is any one of an electrolytic capacitor, a reactor, and a coil.

[0129] (5-6)

[0130] The second component 20 is any one of an intelligent power module, an active filter module, an insulated gate bipolar transistor, a thyristor, and a triac.

[0131] (5-7)

[0132] In the printed circuit board 100, since the first component 10 is located at the center of the substrate 30, the substrate 30 is likely to be deformed by vibration, and thus, the effect of forming gaps (30a, 30b) in the substrate 30 is high.

[0133] (5-8)

[0134] The gaps 30a, 30b, 30c penetrate through the substrate 30.

[0135] (5 - 9)

[0136] As long as the widths of the gaps 30a, 30b, and 30c are within the range of 1.0 mm to 4.0 mm, both workability and prevention of vibration propagation can be satisfied.

[0137] (5 - 10)

[0138] The substrate 30 is fixed to the object via the connecting member 40 and the second member 20. Since the lead 200 of the second member 20 also functions as a connecting member, the second member 20 is more susceptible to repeated fatigue caused by vibration compared to other mounted components. Therefore, by providing gaps (30a, 30b, 30c) between the first member 10 and the second member 20, vibration propagation can be blocked and the lead 200 can be protected from repeated fatigue.

[0139] As described above, embodiments of the present disclosure have been described, but it should be understood that various changes in the mode and details can be made without departing from the gist and scope of the present disclosure described in the claims.

[0140] Industrial applicability

[0141] The gaps of the present disclosure are not limited to being applied to the printed circuit board mounted on the outdoor unit, and can also be applied to the printed circuit board mounted on the indoor unit of the air conditioner, the printed circuit board mounted on the refrigeration device other than the air conditioner, and the printed circuit board mounted on the electrical equipment.

[0142] Reference numeral description

[0143] 1 Air conditioner

[0144] 10 First member

[0145] 10a First electrolytic capacitor (first member)

[0146] 10b Second electrolytic capacitor (first member)

[0147] 1 Or Third electrolytic capacitor (first member)

[0148] 10d Reactor (first member)

[0149] 10e Coil 10e (first member)

[0150] 220 Second member

[0151] 20a Rectifying diode module (second member)

[0152] 20b Intelligent power module (IPM; second member)

[0153] 30 Substrate

[0154] 30a gap

[0155] 30b gap

[0156] 30c gap

[0157] 40 connecting member

[0158] 70 electrical installation box (object)

[0159] 100 printed circuit board

[0160] 200 lead

[0161] 201 first lead

[0162] Prior art documents

[0163] Patent documents

[0164] Patent Document 1: Japanese Utility Model Laid-Open Publication No. 4-107875

Claims

1. A printed circuit board (100), comprising: A first component (10), which is a weight component that stores electrical energy or inducts energy; A second component (20), which is a power device having a plurality of leads (200); and A substrate (30), on which the first component (10) and the second component (20) are mounted. A gap (30a, 30b, 30c) is provided between the first component (10) and the second component (20), and the leads (200) of the second component (20) are soldered to the substrate (30).

2. The printed circuit board (100) according to claim 1, wherein The plurality of leads (200) includes a first lead (201) closest to the first component (10), The gap (30a, 30b, 30c) is provided between the first component (10) and the first lead (201).

3. The printed circuit board (100) according to claim 2, wherein When vibration in a direction perpendicular to the substrate (30) is applied, the stress of the first component (10) on the first lead (201) is greater than the stress on other components.

4. The printed circuit board (100) according to any one of claims 1 to 3, wherein A plurality of the first components (10) are mounted on the substrate (30), The plurality of the first components (10) includes a first weight component that has the greatest stress on the leads (200) when vibration in a direction perpendicular to the substrate (30) is applied, The gap (30a, 30b, 30c) is provided between the first weight component and the second component (20).

5. The printed circuit board (100) according to any one of claims 1 to 4, wherein The first component (10) is any one of an electrolytic capacitor, a reactor, and a coil.

6. The printed circuit board (100) according to any one of claims 1 to 5, wherein The second component (20) is any one of an intelligent power module, an active filter module, an insulated gate bipolar transistor, a MOSFET, a diode, a thyristor, and a triac.

7. The printed circuit board (100) according to any one of claims 1 to 6, wherein The first component (20) is mounted on the central portion of the substrate (30).

8. The printed circuit board (100) according to any one of claims 1 to 7, wherein The gap (30a, 30b, 30c) penetrates the substrate (30).

9. The printed circuit board (100) according to any one of claims 1 to 8, wherein The width of the gap (30a, 30b, 30c) is in the range of 1.0 mm to 4.0 mm.

10. The printed circuit board (100) according to any one of claims 1 to 9, wherein The substrate (30) is fixed to an object (70) via a connecting component (40) and the second component (20).

11. An air conditioner device (1) having a printed circuit board (100) according to any one of claims 1 to 10.

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