Display temperature control circuit, display temperature control method, and display device

Abstract

A display temperature control circuit, a display temperature control method and a display device, the display temperature control circuit comprising a first power supply, a heating module, a shunt module, a detection module and a controller, the heating module being electrically connected with the first power supply and used for increasing the temperature of a circuit board; the shunt module being electrically connected with the first power supply and being arranged in parallel with the heating module; the detection module being used for detecting the temperature of the heating module; the controller being electrically connected with the detection module and the shunt module, and being used for controlling the shunt module to be connected or disconnected according to the temperature detected by the detection module, so that the temperature of the heating module is in a preset range. In a low-temperature or high-humidity environment, the heating module of the display temperature control circuit can heat and bake the circuit board, so that the circuit board can work normally; at the same time, the display temperature control circuit can control the temperature of the heating module to be in the preset range by connecting or disconnecting the shunt module, so that the temperature of the heating module is prevented from being too high, and a suitable working environment can be continuously provided for the circuit board.

Description

Temperature control circuit, temperature control method, and display device Technical Field

[0001] This application relates to the field of display device technology, specifically to a display temperature control circuit, a display temperature control method, and a display device. Background Technology

[0002] The display device includes a display panel, a main circuit board, circuit boards (including horizontal and vertical circuit boards), and a timing controller. The chips on the main circuit board receive the signals to be transmitted, process them, and then transmit them to the timing controller. The timing controller transmits the received data to the display panel through the circuit boards, thereby driving the display panel to display the data.

[0003] The circuit board is responsible for the transmission, distribution, and control of electrical signals. However, in cold or humid tropical regions, low temperatures or moisture can affect the normal operation of components on the circuit board, leading to poor signal transmission or signal distortion. Summary of the Invention

[0004] The purpose of this application is to provide a display temperature control circuit, display temperature control method, and display device that can continuously provide a suitable working environment for the circuit board.

[0005] To achieve the objectives of this application, the following technical solution is provided:

[0006] In a first aspect, this application provides a temperature control circuit for display, including a first power supply, a heating module, a shunt module, a detection module, and a controller. The heating module is electrically connected to the first power supply and is used to increase the temperature of the circuit board. The shunt module is electrically connected to the first power supply and is connected in parallel with the heating module. The detection module is used to detect the temperature of the heating module. The controller is electrically connected to the detection module and the shunt module and is used to control the shunt module to connect or disconnect according to the temperature detected by the detection module, so that the temperature of the heating module is within a preset range.

[0007] In one embodiment, the display temperature control circuit further includes a second power supply, the detection module is electrically connected to the second power supply, the detection module includes a thermistor, the controller is electrically connected to both the thermistor and the shunt module, and the controller is used to control the shunt module to connect or disconnect according to the voltage of the thermistor.

[0008] In one embodiment, the detection module further includes a first resistor and a second resistor. The thermistor is connected in parallel with the first resistor and then in series with the second resistor. The controller is connected to the end of the thermistor that is connected in parallel with the first resistor and is furthest from the second resistor.

[0009] In one embodiment, the current shunting module includes multiple current shunting units connected in parallel. Each current shunting unit includes a current shunting resistor and a switch connected in series. The controller is electrically connected to all of the switches and is used to control the switches to open or close.

[0010] Secondly, this application also provides a display temperature control method, applied to a display temperature control circuit as described in any one of the various embodiments of the first aspect, comprising:

[0011] The detection module detects the temperature of the heating module;

[0012] The controller controls the current shunt module to shunt the current output from the first power supply based on the temperature detected by the detection module, thereby controlling the current flowing through the heating module so that the temperature of the heating module is within a preset range.

[0013] In one embodiment, the current shunt module includes multiple current shunt units connected in parallel, each current shunt unit including a current shunt resistor and a switch connected in series. The controller is electrically connected to the multiple switches and is used to control the switches to open or close.

[0014] When the temperature of the heating module is lower than the first preset value, all the switches of the shunt units are turned off;

[0015] When the temperature of the heating module is higher than the first preset value but lower than the second preset value, at least some of the switches of the shunt units are closed. The number of switches closed by the plurality of shunt units increases as the ambient temperature rises. The second preset value is greater than the first preset value.

[0016] When the temperature of the heating module is higher than the second preset value, all the switches of the shunt units are closed.

[0017] In one embodiment, there are four shunt units, and the temperature of the heating module includes four preset values ​​T1, T2, T3 and T4 that increase sequentially.

[0018] When the temperature of the heating module is less than or equal to T1, the switches of all four shunt units are turned off.

[0019] When the temperature of the heating module is greater than T1 but less than or equal to T2, the switch of one of the current shunt units is closed, and the switches of the other three current shunt units are open.

[0020] When the temperature of the heating module is greater than T2 but less than or equal to T3, the switches of the two current shunt units are closed, and the switches of the other two current shunt units are open.

[0021] When the temperature of the heating module is greater than T3 but less than or equal to T4, the switches of the three current shunt units are closed, and the switch of the remaining current shunt unit is open.

[0022] When the temperature of the heating module is greater than T4, the switches of all four shunt units are closed.

[0023] Thirdly, this application also provides a display device, including a circuit board and a display temperature control circuit as described in any one of the various embodiments of the first aspect, wherein the heating module is disposed on the circuit board.

[0024] In one embodiment, the first power supply, the current shunt module, the detection module, and the controller are all disposed on the circuit board.

[0025] In one embodiment, the circuit board includes multiple stacked functional layers; the heating module is disposed on the functional layer, or the heating module is stacked with the functional layer.

[0026] By setting up parallel heating modules and shunt modules, the detection module detects the temperature of the heating modules, and the controller controls the connection or disconnection of the shunt modules based on the temperature detected by the detection module. In low-temperature or high-humidity environments, the heating modules can heat and bake the circuit board, enabling the circuit board to work normally and avoiding signal distortion. At the same time, the display temperature control circuit can control the temperature of the heating modules to be within a preset range by connecting or disconnecting the shunt modules, preventing the heating modules from overheating and continuously providing a suitable working environment for the circuit board. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0028] Figure 1 is a schematic diagram of a display temperature control circuit according to an embodiment;

[0029] Figure 2 is a flowchart of a display temperature control method according to an embodiment;

[0030] Figure 3 is a schematic diagram of a display device according to an embodiment;

[0031] Figure 4 is a cross-sectional schematic diagram of a circuit board and a heating module according to one embodiment;

[0032] Figure 5 is a cross-sectional schematic diagram of the circuit board and heating module according to another embodiment.

[0033] Explanation of reference numerals in the attached figures:

[0034] 1000 - Display device;

[0035] 100-Display temperature control circuit, 10-First power supply, 20-Heating module, 30-Shunting module, 31-Shunting unit, 40-Detection module, 50-Controller, 60-Second power supply, R1-Thermistor, R2-First resistor, R3-Second resistor, R4-Shunting resistor, SW-Switch;

[0036] 200 - Circuit board, 201 - Component layer, 202 - Power layer, 203 - Ground layer, 204 - Signal transmission layer;

[0037] 300 - Display panel;

[0038] 400 - Source Driver. Detailed Implementation

[0039] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0040] It should be noted that when a component is said to be "fixed" to another component, it can be directly on the other component or it can be in a middle component. When a component is said to be "connected" to another component, it can be directly connected to the other component or it may be in a middle component.

[0041] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. The terminology used in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0042] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0043] Referring to Figure 1, this embodiment of the invention provides a temperature control circuit 100, including a first power supply 10, a heating module 20, a shunt module 30, a detection module 40, and a controller 50. The heating module 20 is electrically connected to the first power supply 10 and is used to increase the temperature of the circuit board 200. The shunt module 30 is electrically connected to the first power supply 10 and is connected in parallel with the heating module 20. The detection module 40 is used to detect the temperature of the heating module 20. The controller 50 is electrically connected to the detection module 40 and the shunt module 30, and is used to control the shunt module 30 to connect or disconnect according to the temperature detected by the detection module 40, so that the temperature of the heating module 20 is within a preset range.

[0044] The first power supply 10 is used to power the heating module 20 and the shunt module 30. The first power supply 10 can be any power supply feasible in the art, and there is no specific limitation. Optionally, the first power supply 10 is a constant current source, that is, the first power supply 10 can output a stable current that does not change with load variations, which can meet the needs of precision electronic equipment. Optionally, the first power supply 10 can specifically be a linear constant current source, a switching constant current source, a mirror constant current source, an adjustable constant current source, a numerically controlled constant current source, etc.

[0045] The heating module 20 is used to convert electrical energy into heat energy, and the heat output of the heating module 20 increases with the increase of the current in the heating module 20. Optionally, the heating module 20 includes at least one heating element, which can be a heating wire, heating film, ceramic heating element, conductive coating, or other device that can generate heat when energized; there is no specific limitation. Optionally, the heating module 20 is disposed on or adjacent to the circuit board 200, and the heat emitted by the heating module 20 can bake the circuit board 200 to increase its temperature.

[0046] The shunt module 30 is used to shunt the current passing through the heating module 20 when connected, thereby controlling the magnitude of the current passing through the heating module 20 and thus controlling the temperature of the heating module 20. The shunt module 30 can be a single adjustable current loop, and the magnitude of the current passing through this loop can be adjusted. Alternatively, the shunt module 30 can include multiple adjustable loops, and the magnitude of the current passing through the shunt module 30 can be adjusted by controlling the number of loops connected. There is no specific limitation.

[0047] The detection module 40 is used to detect the temperature of the heating module 20 and transmit the detected signal to the controller 50. The controller 50 is used to control the shunt module 30 to connect or disconnect according to the detection signal from the detection module 40, so as to regulate the temperature of the heating module 20. Optionally, the detection module 40 can use any feasible temperature detection device in the art, such as a thermistor, thermocouple sensor, platinum resistance sensor, integrated temperature sensor, etc., without any specific limitation.

[0048] Specifically, when the detection module 40 detects that the temperature of the heating module 20 is lower than the preset value, the controller 50 controls the shunt module 30 to disconnect, so that all the current of the first power supply 10 flows through the heating module 20, and the heating module 20 can quickly heat up to the preset range; when the detection module 40 detects that the temperature of the heating module 20 is higher than the preset value, the controller 50 controls the shunt module 30 to connect, so that at least part of the current of the first power supply 10 flows through the shunt module 30, the current flowing through the heating module 20 decreases, and the heating temperature of the heating module 20 can be reduced, so as to control the temperature of the heating module 20 to be within the preset range.

[0049] The circuit board 200 in the display device 1000 is responsible for the transmission, distribution, and control of electrical signals. However, in low-temperature environments, the conductivity of the signal transmission lines loaded on the circuit board 200 deteriorates, their resistance increases, and signal attenuation may occur. At the same time, the signal lines become more brittle at low temperatures, affecting their mechanical properties and durability. In high-humidity environments, moisture may reduce the insulation performance of the signal transmission lines, which can then penetrate the interior of the signal transmission lines, causing changes in the dielectric constant and even corrosion, thus affecting their signal transmission function.

[0050] The display temperature control circuit 100 in this embodiment of the invention uses a parallel heating module 20 and a shunt module 30. A detection module 40 detects the temperature of the heating module 20, and a controller 50 controls the shunt module 30 to connect or disconnect based on the temperature detected by the detection module 40. In low-temperature or high-humidity environments, the heating module 20 can heat and bake the circuit board 200, enabling the circuit board 200 to work normally and avoiding signal distortion. At the same time, the display temperature control circuit 100 can control the temperature of the heating module 20 to be within a preset range by connecting or disconnecting the shunt module 30, preventing the temperature of the heating module 20 from becoming too high and continuously providing a suitable working environment for the circuit board 200.

[0051] In one embodiment, as shown in FIG1, the temperature control circuit 100 further includes a second power supply 60, a detection module 40 electrically connected to the second power supply 60, the detection module 40 including a thermistor R1, and a controller 50 electrically connected to both the thermistor R1 and the shunt module 30. The controller 50 is used to control the shunt module 30 to be connected or disconnected according to the voltage of the thermistor R1.

[0052] The second power supply 60 is used to power the detection module 40 and the controller 50. Optionally, the type of the second power supply 60 can be the same as that of the first power supply 10 mentioned above, and will not be described again.

[0053] The thermistor R1 is used to detect changes in resistance of the heating module 20 based on temperature. In this application, it functions as a temperature sensor, reflecting the temperature changes of the heating module 20. The thermistor R1 has high sensitivity, a wide operating range, and a small size, and its resistance changes significantly with temperature. Optionally, the thermistor R1 can be a metal oxide thermistor, a ceramic thermistor, a semiconductor thermistor, an organic thermistor, etc., and there is no specific limitation.

[0054] Optionally, the resistance value of the thermistor R1 can increase with increasing temperature (i.e., a positive temperature coefficient thermistor) or decrease with increasing temperature (i.e., a negative temperature coefficient thermistor), and there is no specific limitation. In this embodiment of the invention, a negative temperature coefficient thermistor is used, which will not be described in detail below.

[0055] Optionally, the thermistor R1 is disposed on the heating module 20, or the thermistor R1 overlaps with at least part of the heating module 20. After sensing a temperature change in the heating module 20, the thermistor R1 changes its resistance, converting this change into a change in the voltage across the thermistor R1. Upon receiving the voltage change signal from the thermistor R1, the controller 50 calculates the corresponding temperature of the heating module 20 based on the voltage value and controls the connection or disconnection of the shunt module 30 according to the temperature.

[0056] By setting the second power supply 60 and the thermistor R1, the controller 50 determines the temperature of the heating module 20 by the voltage of the thermistor R1, and controls the connection or disconnection of the shunt module 30 according to the obtained temperature. It can detect the temperature of the heating module 20 in real time and make corresponding adjustments in a timely manner, and can continuously provide a suitable working environment for the circuit board 200. The control logic of the temperature control circuit 100 is simple and efficient.

[0057] In one embodiment, as shown in FIG1, the detection module 40 further includes a first resistor R2 and a second resistor R3. The thermistor R1 is connected in parallel with the first resistor R2 and then connected in series with the second resistor R3. The controller 50 is connected to the end of the thermistor R1 and the first resistor R2 that is far away from the second resistor R3.

[0058] The first resistor R2 and the second resistor R3 can be any feasible electronic component with resistance value in the art, and there are no specific limitations. Optionally, the first resistor R2 and the second resistor R3 can be wire-wound resistors, metal film resistors, or other components that can be equivalent to resistors. Since the total resistance value in the parallel circuit is less than the resistance value of any single resistor, the combination of thermistor R1 and the first resistor R2 in parallel will be more sensitive to temperature changes, making thermistor R1 more responsive to temperature changes in the heating module 20. When the resistance value of thermistor R1 becomes too small with temperature changes, the resistance value of the thermistor R1 and the first resistor R2 in parallel will be even smaller, making it prone to damage when the current is too large. However, the second resistor R3, connected in series with the parallel thermistor R1 and the first resistor R2, can protect the circuit.

[0059] Furthermore, since the thermistor R1 is a nonlinear element, in order to facilitate temperature measurement, the thermistor R1 can be linearized by using the series-parallel resistor method. That is, in the embodiment of the present invention, the thermistor R1 is set in parallel with the first resistor R2, and then in series with the second resistor R3. Within a certain range, the total resistance of the thermistor R1 circuit can be made to show an approximately linear relationship with the change of temperature, making temperature measurement simple and effective.

[0060] Optionally, in the thermistor circuit (i.e., the circuit after thermistor R1 and the first resistor R2 are connected in parallel, and then connected in series with the second resistor R3), the end of the second resistor R3 that is furthest from the parallel connection of the thermistor R1 and the first resistor R2 is grounded. In this case, the change in the resistance value of the thermistor R1 circuit will be reflected at the front end of the thermistor R1 circuit (i.e., the end of the thermistor R1 and the first resistor R2 that is furthest from the second resistor R3). The controller 50 can reflect the change in the resistance value of the thermistor R1 circuit by detecting the voltage at the front end of the thermistor R1 circuit, and thus reflect the temperature change of the heating module 20. The detection method is simple and efficient.

[0061] Optionally, the specific correspondence between the front-end voltage and temperature of the thermistor circuit can be calculated based on actual conditions and measurements, and there are no specific restrictions.

[0062] In one embodiment, as shown in FIG1, the current shunt module 30 includes a plurality of current shunt units 31, which are arranged in parallel. Each current shunt unit 31 includes a current shunt resistor R4 and a switch SW arranged in series. The controller 50 is electrically connected to the plurality of switches SW and is used to control the switches SW to open or close.

[0063] Optionally, multiple shunt units 31 are connected in parallel, and each shunt unit 31 is connected in parallel with the heating module 20. The shunt resistor R4 can be any feasible resistor or component with a certain resistance value in the art, without limitation. The switch SW is used to control the connection or disconnection of the shunt resistor R4. When the switch SW is open, the shunt resistor R4 is disconnected; when the switch SW is closed, the shunt resistor R4 is connected. Part of the current from the first power supply 10 flows through the shunt resistor R4, instead of all flowing through the heating module 20, thus shunting the current to the heating module 20 and preventing excessive heating.

[0064] When the temperature of the heating module 20 is below the preset range, the switches SW of multiple shunt units 31 are all disconnected, and all the current from the first power supply 10 flows through the heating module 20, so that the heating module 20 heats up rapidly to increase the temperature of the circuit board 200. When the temperature of the heating module 20 is within the preset range, the controller 50 controls the switches SW of multiple shunt units 31 to connect or disconnect according to the temperature of the heating module 20 detected by the detection module 40, so that the temperature of the heating module 20 remains within the preset range. When the temperature of the heating module 20 is above the preset range, the switches SW of multiple shunt units 31 are all connected, that is, the overall current of the shunt module 30 is at its maximum value, which can maximize the current flowing from the first power supply 10 through the heating module 20, so as to quickly reduce the heat generated by the heating module 20, so that the temperature of the heating module 20 drops back to the preset range, and avoids damage to the circuit board 200 due to excessive temperature of the heating module 20.

[0065] By setting the shunt module 30 to include multiple shunt units 31 connected in parallel, the controller 50 controls the switches SW of the multiple shunt units 31 to open or close, so as to keep the temperature of the heating module 20 within a preset range, ensuring the normal operation of the circuit board 200. The control logic is simple and efficient.

[0066] This invention also provides a display temperature control method, as shown in Figure 2, applied to the display temperature control circuit 100 in this invention, including:

[0067] Step S10: The detection module 40 detects the temperature of the heating module 20;

[0068] In step S20, the controller 50 controls the current shunt module 30 to shunt the current output from the first power supply according to the temperature detected by the detection module 40, thereby controlling the current flowing through the heating module 20 so that the temperature of the heating module 20 is within a preset range.

[0069] The temperature control method in this embodiment of the invention uses a detection module 40 to detect the temperature of the heating module 20. The controller 50 controls the shunt module 30 to connect or disconnect based on the temperature of the heating module 20 detected by the detection module 40. In low-temperature or high-humidity environments, the heating module 20 can heat and bake the circuit board 200, enabling the circuit board 200 to work normally and avoiding signal distortion. At the same time, the temperature control circuit 100 can control the temperature of the heating module 20 to be within a preset range by connecting or disconnecting the shunt module 30, preventing the temperature of the heating module 20 from becoming too high and continuously providing a suitable working environment for the circuit board 200.

[0070] In one embodiment, the shunt module 30 includes a plurality of shunt units 31 arranged in parallel, and each shunt unit 31 includes a shunt resistor R4 and a switch SW arranged in series. Step S20 further includes:

[0071] When the temperature of the heating module 20 is lower than the first preset value, the switch SW of all shunt units 31 is turned off;

[0072] When the temperature of the heating module 20 is higher than the first preset value but lower than the second preset value, at least some of the switches SW of the shunt unit 31 are closed. The number of switches SW of the multiple shunt units 31 that are closed increases as the ambient temperature rises. The second preset value is greater than the first preset value.

[0073] When the temperature of the heating module 20 is higher than the second preset value, all switches SW of the shunt units 31 are closed.

[0074] Optionally, in this embodiment of the invention, the preset temperature range of the heating module 20 can be a range from a first preset value to a second preset value, or a partial range between the first and second preset values, without limitation. When the temperature of the heating module 20 is lower than the first preset value, the switches SW of the multiple shunt units 31 are all disconnected, and all the current from the first power supply 10 passes through the heating module 20, so that the heating module 20 heats up rapidly to increase the temperature of the circuit board 200; when the temperature of the heating module 20 is between the first and second preset values, the controller 50 controls the switches SW of the multiple shunt units 31 to connect or disconnect according to the temperature of the heating module 20 detected by the detection module 40, so that the temperature of the heating module 20 remains within the preset range; when the temperature of the heating module 20 is higher than the second preset value, the switches SW of the multiple shunt units 31 are all connected, that is, the overall current of the shunt module 30 is at its maximum value, which can maximize the current flowing through the heating module 20 from the first power supply 10, so as to quickly reduce the heat generated by the heating module 20, so that the temperature of the heating module 20 decreases and returns to the preset range, avoiding damage to the current board caused by the excessively high temperature of the heating module 20.

[0075] This temperature control method can adjust the number of connected units 31 in real time by detecting the temperature detected by the detection module 40, which can continuously provide a suitable working environment for the circuit board 200. The control logic is simple and efficient.

[0076] In one embodiment, there are four shunt units 31, and the temperature of the heating module 20 includes four preset values ​​T1, T2, T3 and T4 that increase sequentially.

[0077] When the temperature of the heating module 20 is less than or equal to T1, the switches SW of the four shunt units 31 are all turned off.

[0078] When the temperature of the heating module 20 is greater than T1 but less than or equal to T2, the switch SW of one shunt unit 31 is closed, and the switches SW of the other three shunt units 31 are open.

[0079] When the temperature of the heating module 20 is greater than T2 but less than or equal to T3, the switches SW of the two shunt units 31 are closed, and the switches SW of the other two shunt units 31 are open.

[0080] When the temperature of the heating module 20 is greater than T3 but less than or equal to T4, the switches SW of the three shunt units 31 are closed, and the switch SW of the remaining shunt unit 31 is open.

[0081] When the temperature of the heating module 20 is greater than T4, the switches SW of the four shunt units 31 are all closed.

[0082] Optionally, T1 is the first preset value, and T4 is the second preset value.

[0083] In one specific implementation, the preset temperature values ​​T1, T2, T3, and T4 of the heating module 20, along with their corresponding voltage values ​​and the number of times the switch SW is turned on, are as follows. The specific workflow of the temperature control method is shown below:

[0084] T1 is 40℃, and the front-end voltage of the thermistor R1 circuit corresponding to T1 is 2V; when the temperature of the heating module 20 is less than or equal to 40℃, all switches SW of the shunt unit 31 are in the open state, and the current output by the first power supply 10 passes through the heating module 20, and the temperature of the heating module 20 begins to rise.

[0085] T2 is 50℃, and the front-end voltage of the thermistor R1 circuit corresponding to T2 is 1.9V. When the temperature of the heating module 20 rises to between T1 and T2, the switch SW of one shunt unit 31 is closed, and the switches SW of the other three shunt units 31 are open. Part of the current flows to the ground through the conducting shunt unit 31, and the current through the heating module 20 decreases, thus reducing the rate at which the temperature of the heating module 20 rises.

[0086] T3 is 60℃, and the front-end voltage of the thermistor R1 circuit corresponding to T2 is 1.8V. When the temperature of the heating module 20 rises to between T2 and T3, the switches SW of the two shunt units 31 are closed, and the switches SW of the other two shunt units 31 are opened. The current through the heating module 20 is further reduced, and the rate of temperature rise of the heating module 20 is further reduced.

[0087] T4 is 70℃, and the front-end voltage of the thermistor R1 circuit corresponding to T4 is 1.7V. When the temperature of the heating module 20 rises to between T3 and T4, the switches SW of the three shunt units 31 are closed, and the switch SW of the remaining shunt unit 31 is open. The current through the heating module 20 is further reduced. At this time, the heat generated by the heating module 20 will be lower than the heat dissipation of the circuit board 200 itself, and the circuit board 200 begins to cool down to avoid the temperature of the heating area being too high and affecting the normal operation of the circuit board 200.

[0088] When the temperature of the heating module 20 rises to above 70°C, the switches SW of the four shunt units 31 are all closed, and the current through the heating module 20 is reduced to a minimum, so as to quickly reduce the temperature of the heating module 20.

[0089] Optionally, the preset temperature range of the heating module 20 can be 55℃~65℃. By controlling the temperature of the heating module 20 through the display temperature control method of this embodiment, the signal transmission lines on the circuit board 200 can be baked in low temperature or high humidity environments, ensuring that the dielectric constant of the signal transmission lines does not change, while avoiding excessively high operating temperatures of the circuit board 200, and continuously providing a suitable operating environment for the circuit board 200.

[0090] Please refer to Figure 3. This embodiment of the invention also provides a display device 1000, including a circuit board 200 and a display temperature control circuit 100 in this embodiment of the invention, with a heating module 20 disposed on the circuit board 200.

[0091] Optionally, the display device 1000 also includes a display panel 300, a main circuit board, a circuit board 200, and a timing controller 50 (TCON). The display panel 300 is equipped with a gate drive circuit and a source drive circuit, and the main circuit board is equipped with a system-on-a-chip (SOC). The circuit board 200, through signal transmission lines and other components mounted on it, undertakes the functions of transmitting, distributing, and controlling electrical signals. Optionally, the circuit board 200 includes a horizontal circuit board (X-Board, XB board) and a vertical circuit board (Y-Board, YB board), which are typically connected to the main circuit board and the circuit board 200 via a flexible flat cable (FFC) for signal transmission between them.

[0092] Optionally, the circuit board 200 includes a horizontal circuit board, which is typically located on one side of the display panel 300 along its length and is electrically connected to the source-level driving circuit on the display panel 300 via the source driver 400. When the display device 1000 is operating, the system-on-a-chip receives the image data signal to be transmitted and outputs the image data signal. Subsequently, the input signal is processed through the row expansion module and column expansion module, and the processed data is transmitted to the timing controller. The timing controller transmits the received data through the horizontal circuit board to the source driving circuit and gate driving circuit of the display panel 300, thereby driving the display panel 300 to display.

[0093] Optionally, the heating module 20 in the temperature control circuit 100 is mounted on the circuit board 200. The circuit board 200 can be a single, independent circuit board, or it can consist of multiple circuit boards arranged in parallel, i.e., the circuit board 200 includes multiple circuit boards arranged in parallel, with gaps between them. If it consists of multiple circuit boards arranged in parallel, the drive circuit board assembly can be mounted on any one of the circuit boards, and each pair of adjacent circuit boards is electrically connected through their respective connectors.

[0094] The display device 1000 in this embodiment of the invention employs the display temperature control circuit 100 of this embodiment. The heating module 20 of the display temperature control circuit 100 is disposed on the circuit board 200. In low temperature or high humidity environments, it can bake the signal transmission lines on the circuit board 200 to ensure that the dielectric constant of the signal transmission lines does not change. At the same time, it can increase the overall operating temperature of the circuit board 200 and even the display device 1000, so as to meet the normal operation of the display device 1000 in low temperature environments.

[0095] Optionally, the connection method between the heating module 20 and the circuit board 200 can be welding, bonding, snap-fitting, screwing, etc., and there is no specific limitation.

[0096] Optionally, the heating module 20 is mounted on the circuit board 200, while the rest of the display temperature control circuit 100, such as the first power supply 10, the shunt module 30, the detection module 40, and the controller 50, are externally mounted on the circuit board 200. This configuration allows the heating module 20 to have a larger heating area, reducing the space occupied by the other parts of the display temperature control circuit 100 on the circuit board 200. This effectively increases the operating temperature of the circuit board 200 or heats the signal transmission lines, preventing changes in the dielectric constant of the signal transmission lines due to moisture ingress, which could lead to signal transmission distortion.

[0097] Alternatively, in one embodiment, the first power supply 10, the shunt module 30, the detection module 40, and the controller 50 are all mounted on the circuit board 200. This results in a high degree of integration for the temperature control device, facilitating the assembly of the circuit board 200 with other components.

[0098] Please refer to Figures 4 and 5. The circuit board 200 includes multiple functional layers stacked together.

[0099] Optionally, the multiple functional layers include a device layer 201, a power layer 202, a ground layer 203, and a signal transmission layer 204. The device layer 201 is used to place electronic components and devices on the circuit board 200. The power layer 202 is mainly responsible for providing power and is a key part of the power distribution and return path in the circuit board 200. The ground layer 203 and the signal transmission layer 204 are used for ground lines and signal transmission lines. The signal transmission layer 204 is used to transmit high-speed point-to-point (P2P) signals and timing signals.

[0100] In one embodiment, referring to Figure 4, the heating module 20 is disposed on a functional layer. Optionally, the circuit board 200 includes four functional layers stacked in the X direction, which, from top to bottom in the X direction, are a device layer 201, a power layer 202, a ground layer 203, and a signal transmission layer 204. Since the signal transmission lines of the signal transmission layer 204 are susceptible to low temperature or high humidity environments, the signal transmission layer 204 is primarily baked to ensure the normal operating temperature of the signal transmission lines. Therefore, the heating module 20 is disposed on the ground layer 203 and overlaps with the signal transmission area of ​​the signal transmission layer 204 in the orthographic projection in the X direction. With this configuration, the heating module 20 can bake the signal transmission lines to prevent changes in the dielectric constant caused by moisture ingress, which could ultimately lead to signal distortion; at the same time, it increases the overall operating temperature of the circuit board 200, ensuring its normal operation in low-temperature environments.

[0101] Alternatively, in another embodiment, referring to Figure 5, the heating module 20 is stacked with the functional layers. Optionally, the circuit board 200 includes six functional layers stacked in the X direction. In addition to the device layer 201, power layer 202, ground layer 203, and signal transmission layer 204 stacked sequentially from bottom to top in the X direction, the heating module 20 is disposed as the fifth functional layer on the surface of the signal transmission layer 204 facing away from the ground layer 203 in the X direction, so as to heat the entire signal transmission layer 204, with a wider heating area and higher efficiency. At the same time, a ground layer 203 is stacked on the surface of the heating module 20 facing away from the signal transmission layer 204 as the sixth functional layer, which improves the electrical shielding effect of the circuit board 200.

[0102] Alternatively, the heating module 20 and the functional layer can also adopt any other feasible configuration method without restriction.

[0103] In the description of the embodiments of this application, it should be noted that the orientation or positional relationship of the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and other indicators are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0104] The above-disclosed embodiments are merely preferred embodiments of this application and should not be construed as limiting the scope of this application. Those skilled in the art will understand that all or part of the processes for implementing the above embodiments and equivalent variations made in accordance with the claims of this application are still within the scope of this application.

Claims

1. A temperature control circuit for display, characterized in that, include: First power source; A heating module is electrically connected to the first power supply, and the heating module is used to increase the temperature of the circuit board. A shunt module is electrically connected to the first power supply and is configured in parallel with the heating module. The shunt module includes multiple shunt units connected in parallel, and each shunt unit includes a shunt resistor and a switch connected in series. A detection module is used to detect the temperature of the heating module. A controller is electrically connected to the detection module and the multiple switches in the shunt module, and is used to control the switches to open or close. The controller controls the shunt module to connect or disconnect according to the temperature detected by the detection module, so that the temperature of the heating module is within a preset range.

2. The display temperature control circuit according to claim 1, characterized in that, The temperature control circuit also includes a second power supply. The detection module is electrically connected to the second power supply. The detection module includes a thermistor. The controller is electrically connected to both the thermistor and the shunt module. The controller is used to control the shunt module to connect or disconnect based on the voltage of the thermistor.

3. The display temperature control circuit according to claim 2, characterized in that, The detection module also includes a first resistor and a second resistor. The thermistor is connected in parallel with the first resistor and then in series with the second resistor. The controller is connected to the end of the thermistor that is connected in parallel with the first resistor and is furthest from the second resistor.

4. A display temperature control method, characterized in that, The display temperature control circuit as described in any one of claims 1 to 3 includes: a detection module detecting the temperature of the heating module; and a controller controlling a current shunt module to shunt the current output from the first power supply according to the temperature detected by the detection module, thereby controlling the magnitude of the current flowing through the heating module so that the temperature of the heating module is within a preset range.

5. The display temperature control method according to claim 4, characterized in that, The current shunting module includes multiple current shunting units connected in parallel. Each current shunting unit includes a current shunting resistor and a switch connected in series. The controller is electrically connected to each of the multiple switches and is used to control the switches to open or close. When the temperature of the heating module is lower than a first preset value, all the switches of the current shunting units are open. When the temperature of the heating module is higher than the first preset value but lower than a second preset value, at least some of the switches of the current shunting units are closed. The number of closed switches of the multiple current shunting units increases with the increase of ambient temperature. The second preset value is greater than the first preset value. When the temperature of the heating module is higher than the second preset value, all the switches of the shunt units are closed.

6. The display temperature control method according to claim 5, characterized in that, There are four current distribution units, and the temperature of the heating module includes four preset values ​​T1, T2, T3 and T4 that increase sequentially; when the temperature of the heating module is less than or equal to T1, the switches of the four current distribution units are all turned off. When the temperature of the heating module is greater than T1 but less than or equal to T2, the switch of one of the current shunt units is closed, and the switches of the other three current shunt units are open. When the temperature of the heating module is greater than T2 but less than or equal to T3, the switches of the two current shunt units are closed, and the switches of the other two current shunt units are open. When the temperature of the heating module is greater than T3 but less than or equal to T4, the switches of the three current shunt units are closed, and the switch of the remaining current shunt unit is open. When the temperature of the heating module is greater than T4, the switches of all four shunt units are closed.

7. A display device, characterized in that, It includes a circuit board and a display temperature control circuit as described in any one of claims 1 to 3, wherein the heating module is disposed on the circuit board.

8. The display device according to claim 7, characterized in that, The first power supply, the current shunt module, the detection module, and the controller are all mounted on the circuit board.

9. The display device according to claim 7, characterized in that, The circuit board includes multiple stacked functional layers; the heating module is disposed on the functional layer, or the heating module is stacked with the functional layer.

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