BGA chip packaging method

Abstract

The invention belongs to the technical field of chip packaging, and particularly relates to a BGA (Ball Grid Array) chip packaging method, which comprises the following steps of S1, stacking a plurality of substrates in a storage assembly, and pushing the substrate on the uppermost layer into a preset position in a rotary heating assembly through a substrate feeding assembly; s2, the rotary heating assembly rotates by 90 degrees, the substrate is transferred to the position below the carrying assembly, and the carrying assembly transfers the chip to the upper end of the substrate; s3, the rotary heating assembly continues to rotate by 90 degrees, the substrate on which the chip is pressed is transferred to a heating table, and the heating table conducts heating welding on the substrate and the chip; and S4, the rotary heating assembly continues to rotate by 90 degrees, the whole body after the substrate and the chip are welded is transferred to the position below the discharging assembly, the discharging assembly peels the whole body from the rotary heating assembly, and the substrate feeding assembly continuously pushes the substrate into the rotary heating assembly, so that the carrying assembly, the heating table and the discharging assembly can work efficiently at the same time, the packaging efficiency is improved, and the packaging cost is reduced. In addition, the automation degree of the whole BGA chip packaging process is high, and the labor cost is reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip packaging, and in particular relates to a BGA chip packaging method. Background Art

[0002] Existing chip packaging is mostly done manually, which has low packaging efficiency and precision, and is prone to errors, resulting in material waste.

[0003] For example, the patent application number CN201410448579.8 discloses a BGA rework and packaging method, comprising the following steps: 1) removing the BGA chip to be repaired from the printed circuit board; 2) cleaning the pads on the printed circuit board; 3) applying solder paste and flux to the printed circuit board; 4) mounting a new BGA chip, aligning each solder ball on the new BGA chip with the pads on the printed circuit board; 5) performing hot air reflow soldering on the mounted printed circuit board and the new BGA chip using a set rework reflow curve. However, the disadvantage of this technical solution is that the packaging efficiency is low. In addition, the chip packaging has a low degree of automation, requires manual operation, and has low precision. Summary of the Invention

[0004] The purpose of the present invention is to provide a BGA chip packaging method to solve the problems in the prior art. The specific technical solutions are as follows:

[0005] A BGA chip packaging method comprises the following steps:

[0006] S1. Stack multiple substrates in a storage assembly, and push the top substrate into a preset position in a rotating heating assembly through a substrate feeding assembly;

[0007] S2, the rotary heating assembly rotates 90 degrees, transfers the substrate to the bottom of the transport assembly, and the transport assembly transfers the chip to the upper end of the substrate;

[0008] S3, the rotating heating assembly continues to rotate 90 degrees, and the substrate with the chip pressed is transferred to the heating table, and the heating table heats the substrate and the chip for welding;

[0009] S4. The rotating heating assembly continues to rotate 90 degrees, and the substrate and chip are transferred to the bottom of the unloading assembly after welding. The unloading assembly peels them off from the rotating heating assembly.

[0010] Furthermore, in step S2, the chip with the solder joint facing upward is transported by the conveying assembly, flipped 180 degrees by the flipping assembly, and the handling assembly transfers the flipped chip to the upper end of the substrate.

[0011] Furthermore, the storage assembly includes a shell, on which two threaded rods are threadedly connected, and the front ends of the two threaded rods are rotatably connected to baffles, and the two baffles slide in the shell, and multiple substrates are stacked between the two baffles, and a bottom plate is fixed at the lower end of the shell, and a spring is provided between the lowest substrate and the bottom plate, and scale lines are provided on the side of the shell, and the pointers set on the sides of the two baffles both point to the scale lines.

[0012] Furthermore, the substrate feeding assembly includes a support plate 1, which is fixed on the shell, and a limit plate is slidably connected to the support plate 1. A pressure plate is fixed on the side of the limit plate, and the pressure plate slides on the shell. One side of the pressure plate rests on the side of the topmost substrate, and the other side of the pressure plate is connected to a cylinder 1, which is fixed on the shell. The limit plate is rotatably connected to one end of the inner rotating rod, and the other end of the inner rotating rod is rotatably connected to a rotating wheel.

[0013] Furthermore, a limiting frame is fixed on the support plate 1, a bending frame is slidably connected inside the limiting frame, and a second spring is provided between the limiting frame and the bending frame.

[0014] Furthermore, the rotating heating assembly includes motor five, which is fixed at the bottom of the heating device. A heating platform is provided on the heating device. A middle-layer fixed plate is fixed on the heating device. The upper surface of the middle-layer fixed plate is flush with the upper surface of the heating platform. The output end of motor five is connected to the rotating disk through a central rotating column. Four clamping grooves are provided on the rotating disk. Two clamping plates are provided in the clamping grooves. Both clamping plates are slidably connected to the rotating disk. A spring three is provided between the rotating disk and the clamping plate. A material taking trough is provided on the rotating disk.

[0015] Furthermore, the transmission component includes a support frame, the support frame is fixedly connected to motor 1, the output end of motor 1 is connected to the driving shaft, the driving shaft is connected to the conveyor belt transmission, the conveyor belt is connected to the driven shaft transmission, and both the driving shaft and the driven shaft are rotatably connected to the support frame.

[0016] Furthermore, the flipping assembly includes a motor bracket, the lower end of the support bracket is fixedly connected to the support bracket by a locking nut, motor 2 is fixed to the side of the motor bracket, the output end of motor 2 is connected to the rotating shaft, the rotating shaft is fixedly connected to the rotating plate, the rotating plate is threadedly connected to the threaded rod, a suction cup support rod is rotatably connected inside the threaded rod, and suction cup 1 is fixed to the lower end of the suction cup support rod.

[0017] Furthermore, the transport assembly includes motor three, which is fixed at the end of the support frame, the output end of motor three is connected to the slide, the slide slides in the support frame, the slide is fixedly connected to the bracket, the bracket is fixedly connected to motor four, the output end of motor four is connected to the rotating rod, the rotating rod is rotatably connected to the vertical rod, the bracket is slidably connected to the slider, the slider is slidably connected to the vertical rod, and a suction cup two is fixed to the lower end of the vertical rod.

[0018] Furthermore, the unloading assembly includes a slide plate, which is fixed on the middle fixed plate, and a support plate 2 is fixed on the upper end of the slide plate, which is fixedly connected to the cylinder 2, and the output end of the cylinder 2 is connected to the pull block, which is slidably connected to the upper end of the paddle, and the paddle slides in the inclined groove provided in the slider 2, and a rubber pad is fixed to the lower end of the paddle, and the slider 2 slides on the support plate 2, and a locking screw is threaded on the slider 2, and the lower end of the locking screw is against the support plate 2.

[0019] The advantages of the present invention are:

[0020] Multiple substrates are stacked in the storage component, and the top substrate is pushed into the preset position in the rotary heating component through the substrate feeding component. The rotary heating component rotates 90 degrees to transfer the substrate to the bottom of the conveying component. The conveying component transfers the chip to the upper end of the substrate. The solder joints on the substrate correspond to the solder joints on the chip one by one. The rotary heating component continues to rotate 90 degrees to transfer the substrate with the chip to the heating table. The heating table heats and welds the substrate and the chip. The rotary heating component continues to rotate 90 degrees. The whole welded substrate and chip are transferred to the bottom of the unloading component. The unloading component peels it off from the rotary heating component. As the rotary heating component continues to rotate, the substrate feeding component continuously pushes the substrate into the rotary heating component, which can realize the efficient operation of the conveying component, heating table and unloading component at the same time, improve the packaging efficiency, and have high packaging precision. In addition, the BGA chip packaging process has a high degree of automation, which reduces labor costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A flow chart of the BGA chip packaging of the present invention;

[0022] Figure 2 It is a schematic diagram of the overall structure of the present invention;

[0023] Figure 3 Schematic diagram of the storage component structure of the present invention Figure 1 ;

[0024] Figure 4 Schematic diagram of the storage component structure of the present invention Figure 2 ;

[0025] Figure 5 Schematic diagram of the storage component structure of the present invention Figure 3 ;

[0026] Figure 6 Schematic diagram of the substrate feeding assembly structure of the present invention Figure 1 ;

[0027] Figure 7 Schematic diagram of the substrate feeding assembly structure of the present invention Figure 2 ;

[0028] Figure 8This is a schematic diagram of the structure of the flip assembly of the present invention;

[0029] Figure 9 It is a schematic diagram of the structure of the handling assembly of the present invention;

[0030] Figure 10 The structure of the rotary heating component of the present invention is schematically shown. Figure 1 ;

[0031] Figure 11 The structure of the rotary heating component of the present invention is schematically shown. Figure 2 ;

[0032] Figure 12 It is a structural schematic diagram of the unloading assembly of the present invention;

[0033] Figure 13 It is a structural schematic diagram of the unloading assembly of the present invention;

[0034] Figure 14 for Figure 13 A partial enlarged view of the middle part;

[0035] Description of the marks in the figure:

[0036] Storage assembly 1; housing 101; threaded rod 102; baffle 103; pointer 104; scale line 105; bottom plate 106; spring 1 107; conveyor assembly 2; support frame 201; motor 1 202; driving shaft 203; driven shaft 204; conveyor belt 205; rotary heating assembly 3; heating device 301; heating table 302; motor 5 303; central rotating column 304; rotating disk 305; middle fixed plate 306; clamping plate 307; spring 308; material trough 309; clamping groove 310; unloading assembly 4; slide plate 401; support plate 2 402; cylinder 2 403; pull block 404; pick 405; slider 2 40 6; inclined groove 407; rubber pad 408; locking screw 409; substrate feeding assembly 5; support plate 1 501; cylinder 1 502; pressure plate 503; limit plate 504; inner rotating rod 505; rotating wheel 506; limit frame 507; bending frame 508; spring 2 509; flip assembly 6; motor bracket 601; locking nut 602; motor 2 603; rotating shaft 604; rotating plate 605; suction cup support rod 606; threaded rod 607; suction cup 1 608; transport assembly 7; motor 3 701; slide 702; bracket 703; motor 4 704; rotating rod 705; slider 706; vertical rod 707; suction cup 2 708; substrate 8. DETAILED DESCRIPTION

[0037] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0038] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0039] Example 1

[0040] like Figures 1-14 As shown, a BGA chip packaging method includes the following steps:

[0041] S1. Stack multiple substrates 8 in the storage assembly 1, and push the top substrate 8 into a preset position in the rotating heating assembly 3 through the substrate feeding assembly 5;

[0042] S2, the rotary heating assembly 3 rotates 90 degrees to transfer the substrate 8 to the bottom of the conveying assembly 7, and the conveying assembly 7 transfers the chip to the upper end of the substrate 8;

[0043] S3, the rotary heating assembly 3 continues to rotate 90 degrees, and the substrate 8 with the chip pressed thereon is transferred to the heating table 302, and the heating table 302 heats and welds the substrate 8 and the chip;

[0044] S4, the rotating heating assembly 3 continues to rotate 90 degrees, and the substrate 8 and the chip after welding are transferred to the bottom of the unloading assembly 4, and the unloading assembly 4 peels it off from the rotating heating assembly 3;

[0045] The working principle of the above technical solution is as follows: multiple substrates 8 are stacked in the storage component 1, and the uppermost substrate 8 is pushed into the preset position in the rotary heating component 3 by the substrate feeding component 5. The rotary heating component 3 rotates 90 degrees to transfer the substrate 8 to the bottom of the conveying component 7, and solder paste and flux are coated on the substrate 8. The conveying component 7 transfers the chip to the upper end of the substrate 8. The solder joints on the substrate 8 correspond one to one with the solder joints on the chip. The rotary heating component 3 continues to rotate 90 degrees to transfer the substrate 8 with the chip to the heating table 302. The heating table 302 heats and welds the substrate 8 and the chip. The rotary heating component 3 continues to rotate 90 degrees. The substrate 8 and the chip are transferred to the bottom of the unloading component 4 after welding. The unloading component 4 peels it off from the rotary heating component 3. As the rotary heating component 3 continues to rotate, the substrate feeding component 5 continuously pushes the substrate 8 into the rotary heating component 3, which can realize the efficient operation of the conveying component 7, the heating table 302 and the unloading component 4 at the same time, thereby improving the packaging efficiency. In addition, the BGA chip packaging process has a high degree of automation, which reduces labor costs.

[0046] Example 2

[0047] like Figures 1-14 As shown, in step S2, the chip with the solder joint facing upward is transported by the conveying assembly 2, flipped 180 degrees by the flipping assembly 6, and the handling assembly 7 transfers the flipped chip to the upper end of the substrate 8;

[0048] The working principle of the above technical solution is: the chip with the solder joints facing upwards is transported by the conveying component 2, and after being flipped 180 degrees by the flipping component 6, the solder joints of the chip are facing downwards, and the handling component 7 sucks the back of the chip and transfers the chip to the upper end of the substrate 8, so that the solder joints of the chip are facing the solder joints on the substrate 8, which is convenient for welding the two.

[0049] Example 3

[0050] like Figures 1-14 As shown, the storage assembly 1 includes a shell 101, two threaded rods 102 are threadedly connected to the shell 101, and the front ends of the two threaded rods 102 are rotatably connected to baffles 103. The two baffles 103 slide in the shell 101, and a plurality of substrates 8 are stacked between the two baffles 103. A bottom plate 106 is fixed to the lower end of the shell 101, and a spring 107 is provided between the bottom substrate 8 and the bottom plate 106. A scale line 105 is provided on the side of the shell 101, and pointers 104 provided on the sides of the two baffles 103 both point to the scale line 105.

[0051] The working principle of the above technical solution is as follows: multiple substrates 8 are stacked between two baffles 103. Under the elastic force of spring 107, the uppermost substrate 8 always rests on the inner wall of support plate 1 501. The two threaded rods 102 are rotated to change the distance between the two baffles 103, thereby adapting to substrates 8 of different widths. The distance between the two baffles 103 can be calculated by the position of the two pointers 104 pointing to the scale line 105. Spring 107 can be replaced by a cylinder.

[0052] Example 4

[0053] like Figures 1-14 As shown, the substrate feeding assembly 5 includes a support plate 501, which is fixed on the housing 101. A limit plate 504 is slidably connected to the support plate 501. A pressure plate 503 is fixed to the side of the limit plate 504. The pressure plate 503 slides on the housing 101. One side of the pressure plate 503 rests on the side of the uppermost substrate 8. The other side of the pressure plate 503 is connected to a cylinder 502. The cylinder 502 is fixed on the housing 101. The limit plate 504 is rotatably connected to one end of an inner rotating rod 505. The other end of the inner rotating rod 505 is rotatably connected to a rotating wheel 506.

[0054] The support plate 1 501 is fixed with a limiting frame 507, a bending frame 508 is slidably connected to the limiting frame 507, and a second spring 509 is provided between the limiting frame 507 and the bending frame 508;

[0055] The working principle of the above technical solution is as follows: the air cylinder 1 502 is started to drive the pressure plate 503 and the limit plate 504 to move toward the direction of the rotating heating component 3. The side of the pressure plate 503 pushes the uppermost substrate 8 into the rotating heating component 3. The bottom of the pressure plate 503 is against the upper surface of the second substrate 8 to prevent the second substrate 8 from moving up. When the rotating wheel 506 contacts the bending frame 508, the bending frame 508 squeezes the rotating wheel 506 to move down, driving the inner rotating rod 505 and the limit plate 504 to rotate. The rotating wheel 506 moves down to squeeze the substrate 8 to move down until it fits on the upper surface of the middle fixed plate 306. The substrate 8 cannot move further downward. The rotating wheel 506 squeezes the bending frame 508 to move up in the limit frame 507, driving the spring 2 509 After the pressing plate 503 is compressed, when the substrate 8 is pushed to the preset position in the rotating heating component 3, the cylinder 1 502 is started again to drive the pressure plate 503 and the limit plate 504 to move away from the rotating heating component 3. When the bottom of the pressure plate 503 is separated from the upper surface of the second substrate 8, under the elastic force of the spring 107, multiple substrates 8 are driven to move upward, and the upper surface of the second substrate 8 is against the inner wall of the support plate 1 501. Repeat the above operation to push the second substrate 8 into the preset position in the rotating heating component 3. Under the cooperation of the rotating wheel 506 and the bending frame 508, substrates 8 of different thicknesses can be pushed into the rotating heating component 3, and the lower surface of the substrate 8 is tightly attached to the middle fixed plate 306.

[0056] Example 5

[0057] like Figures 1-14 As shown, the rotary heating assembly 3 includes a motor 5 303, which is fixed to the bottom of the heating device 301. The heating device 301 is provided with a heating platform 302. A middle fixing plate 306 is fixed to the heating device 301. The upper surface of the middle fixing plate 306 is flush with the upper surface of the heating platform 302. The output end of the motor 5 303 is connected to the rotating disk 305 through the central rotating column 304. The rotating disk 305 is provided with four clamping grooves 310. Two clamping plates 307 are provided in the clamping grooves 310. The two clamping plates 307 are both slidably connected to the rotating disk 305. A spring 308 is provided between the rotating disk 305 and the clamping plates 307. The rotating disk 305 is provided with a material taking trough 309.

[0058] The working principle of the above technical solution is as follows: the substrate 8 is pushed into the clamping groove 310 by the pressing plate 503, and the substrate 8 squeezes the two clamping plates 307 to move toward both ends, driving the spring three 308 to be compressed, driving the back of the substrate 8 to be tightly attached to the middle fixed plate 306, starting the motor five 303 to drive the central rotating column 304 to rotate 90 degrees, driving the rotating disk 305 to rotate 90 degrees, and the substrate 8 is transferred to the bottom of the conveying assembly 7. The conveying assembly 7 transfers the chip to the upper end of the substrate 8, and starting the motor five 303 again to drive the central rotating column 304 to rotate 90 degrees again, driving the rotating disk 305 to rotate 90 degrees again, and the substrate 8 is moved to the heating table 302. The surface is fitted with the upper surface of the heating table 302, and the heating device 301 is started. The substrate 8 and the chip are heated by the heating table 302. The solder joints on the substrate 8 and the chip are heated and welded. The motor 5 303 is started again to drive the central rotating column 304 to rotate 90 degrees again, and drive the rotating disk 305 to rotate 90 degrees again. The substrate 8 is moved to the bottom of the unloading component 4 after the substrate 8 and the chip are welded. The unloading component 4 peels it off from the rotating heating component 3. Every time the rotating disk 305 rotates 90 degrees, the pressing plate 503 pushes a substrate 8 into the clamping groove 310, so that the four clamping grooves 310 on the rotating disk 305 work at the same time, thereby improving work efficiency.

[0059] Example 6

[0060] like Figures 1-14 As shown, the transmission assembly 2 includes a support frame 201, the support frame 201 is fixedly connected to the motor 1 202, the output end of the motor 1 202 is connected to the driving shaft 203, the driving shaft 203 is connected to the conveyor belt 205 in a transmission-coordinated manner, the conveyor belt 205 is connected to the driven shaft 204 in a transmission-coordinated manner, and the driving shaft 203 and the driven shaft 204 are both rotatably connected to the support frame 201;

[0061] The flip assembly 6 includes a motor bracket 601, the lower end of the support frame 201 is fixedly connected to the support frame 201 by a locking nut 602, a second motor 603 is fixed to the side of the motor bracket 601, the output end of the second motor 603 is connected to the rotating shaft 604, the rotating shaft 604 is fixedly connected to the rotating plate 605, the rotating plate 605 is threadedly connected to the threaded rod 607, a suction cup support rod 606 is rotatably connected to the threaded rod 607, and a suction cup 1 608 is fixed to the lower end of the suction cup support rod 606;

[0062] The working principle of the above technical solution is as follows: start the motor 1 202, drive the driving shaft 203h to rotate, drive the conveyor belt 205 to rotate, drive the driven shaft 204 to rotate, and the chip with the solder joint facing upward moves forward through the conveyor belt 205. When the chip moves to the preset position, start the motor 2 603, drive the rotating shaft 604 to rotate counterclockwise, drive the rotating plate 605 to rotate along with the rotating shaft 604z, drive the suction cup 1 608 to move downward, and the suction cup 1 608 sucks the chip. Start the motor 2 603 again, drive the rotating shaft 604 to rotate clockwise, drive the rotating plate 605 to rotate along with the rotating shaft 604, and the suction cup 1 608 drives the chip to flip. At this time, the solder joint of the chip faces downward, completing the 180-degree flip of the chip.

[0063] Turn the locking nut 602 to separate the locking nut 602 from the support frame 201, and then slide the flip assembly 6 on the support frame 201 to change the position of the chip picking and flipping to adapt to the optimal handling position of the handling assembly 7. After the position adjustment of the flip assembly 6 is completed, re-tighten the locking nut 602 to squeeze the inner side of the locking nut 602 against the support frame 201, thereby fixing the flip assembly 6 to the support frame 201;

[0064] Rotate the threaded rod 607, and a threaded rotation occurs between the threaded rod 607 and the rotating plate 605, driving the threaded rod 607 to rise or fall, driving the suction cup support rod 606 to rise or fall, and then changing the height of the suction cup 1 608 to adapt to the suction of chips of different thicknesses.

[0065] Example 7

[0066] like Figures 1-14 As shown, the transport assembly 7 includes a third motor 701, which is fixed to the end of the support frame 201, an output end of the third motor 701 connected to a slide 702, which slides in the support frame 201, and the slide 702 is fixedly connected to a bracket 703, which is fixedly connected to a fourth motor 704, an output end of the fourth motor 704 connected to a rotating rod 705, which is rotatably connected to a vertical rod 707, a bracket 703 slidably connected to a slider 706, which is slidably connected to a vertical rod 707, and a second suction cup 708 is fixed to the lower end of the vertical rod 707;

[0067] The working principle of the above technical solution is: start motor three 701, drive the slide 702 to move, drive the bracket 703 to move, drive the suction cup two 708 to move above the chip flipped by the flip component 6, start motor four 704, drive the rotating rod 705 to rotate, drive the rotating rod 705 and the vertical rod 707 to rotate, drive the vertical rod 707 to move downward in the slider 706, drive the slider 706 to slide on the bracket 703, drive the suction cup two 708 to suck the chip, drive the rotating rod 705 to rotate in the opposite direction through motor four 704, and drive the suction cup two 708 to transfer the chip to the substrate 8.

[0068] Example 8

[0069] like Figures 1-14 As shown, the unloading assembly 4 includes a slide plate 401, which is fixed on the middle fixed plate 306, and a second support plate 402 is fixed to the upper end of the slide plate 401, and the second support plate 402 is fixedly connected to the second cylinder 403, and the output end of the second cylinder 403 is connected to the pull block 404, and the pull block 404 is slidably connected to the upper end of the paddle 405, and the paddle 405 slides in the inclined groove 407 provided in the second slider 406, and a rubber pad 408 is fixed to the lower end of the paddle 405, and the second slider 406 slides on the second support plate 402, and a locking screw 409 is threadedly connected to the second slider 406, and the lower end of the locking screw 409 is against the second support plate 402;

[0070] The working principle of the above technical solution is as follows: the second cylinder 403 is started, and the second cylinder 403 drives the pulling block 404 to move forward, drives the paddle 405 to slide on the inclined groove 407, drives the rubber pad 408 to move upward, and the lower end of the paddle 405 is higher than the upper surface of the chip. The pulling block 404 continues to migrate, and drives the second slider 406 to move forward on the second support plate 402. After the paddle 405 and the second slider 406 move to the preset position, the pulling block 404h is pulled backward by the second cylinder 403, drives the paddle 405 to slide in the inclined groove 407, drives the lower end of the paddle 405 and the rubber pad 408 to move downward, and the lower end of the paddle 405 and the rubber pad 408 move into the material taking trough 309;

[0071] Continue to pull the pull block 404 backward, driving the pick 405 to move backward, driving the second slider 406 to move backward, driving the pick 405 to hook the edge of the substrate 8, pulling the substrate 8 with the chip soldered thereon to move backward, and the rubber pad 408 directly contacts the edge of the substrate 8 to prevent damage to the substrate 8 when pulling the substrate 8. The substrate 8 with the chip soldered thereon slides out from the slide plate 401 and is collected;

[0072] The friction between the second slider 406 and the second support plate 402 can be changed by rotating the locking screw 409 .

[0073] It will be understood that the present invention is described by way of some embodiments, and it will be appreciated by those skilled in the art that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. In addition, under the teachings of the present invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are intended to be protected by the present invention.

Claims

1. A BGA chip packaging method, characterized in that: The following steps are involved: S1, stacking a plurality of substrates (8) in a storage assembly (1), and pushing the uppermost substrate (8) into a preset position in a rotating heating assembly (3) through a substrate feeding assembly (5); S2, the rotary heating component (3) rotates 90 degrees to transfer the substrate (8) to the bottom of the conveying component (7), and the conveying component (7) transfers the chip to the upper end of the substrate (8); S3, the rotating heating component (3) continues to rotate 90 degrees, and the substrate (8) with the chip pressed thereon is transferred to the heating platform (302), and the heating platform (302) heats and welds the substrate (8) and the chip; S4, the rotating heating component (3) continues to rotate 90 degrees, and the substrate (8) and the chip are transferred as a whole after welding to the bottom of the unloading component (4), and the unloading component (4) peels it off from the rotating heating component (3).

2. A BGA chip packaging method according to claim 1, characterized in that: In step S2, the chip with the solder joint facing upward is transported by the conveying assembly (2), flipped 180 degrees by the flipping assembly (6), and the handling assembly (7) transfers the flipped chip to the upper end of the substrate (8).

3. A BGA chip packaging method according to claim 1, characterized in that: The storage assembly (1) comprises a shell (101), two threaded rods (102) are threadedly connected to the shell (101), the front ends of the two threaded rods (102) are rotatably connected to baffles (103), the two baffles (103) are slid in the shell (101), a plurality of base plates (8) are stacked between the two baffles (103), a bottom plate (106) is fixed at the lower end of the shell (101), a spring (107) is provided between the bottommost base plate (8) and the bottom plate (106), a scale line (105) is provided on the side of the shell (101), and pointers (104) provided on the sides of the two baffles (103) both point to the scale line (105).

4. A BGA chip packaging method according to claim 3, characterized in that: The substrate feeding assembly (5) includes a support plate (501), which is fixed on the shell (101). A limit plate (504) is slidably connected to the support plate (501). A pressure plate (503) is fixed on the side of the limit plate (504). The pressure plate (503) slides on the shell (101). One side of the pressure plate (503) rests on the side of the uppermost substrate (8). The other side of the pressure plate (503) is connected to the cylinder (502). The cylinder (502) is fixed on the shell (101). The limit plate (504) is rotatably connected to one end of the inner rotating rod (505). The other end of the inner rotating rod (505) is rotatably connected to a rotating wheel (506).

5. A BGA chip packaging method according to claim 4, characterized in that: A limiting frame (507) is fixed on the support plate (501), a bending frame (508) is slidably connected inside the limiting frame (507), and a second spring (509) is provided between the limiting frame (507) and the bending frame (508).

6. A BGA chip packaging method according to claim 1, characterized in that: The rotary heating assembly (3) comprises a motor (303) which is fixed to the bottom of a heating device (301). A heating platform (302) is provided on the heating device (301). A middle fixed plate (306) is fixed on the heating device (301). The upper surface of the middle fixed plate (306) is flush with the upper surface of the heating platform (302). The output end of the motor (303) is connected to a rotating disk (305) through a central rotating column (304). The rotating disk (305) is provided with four clamping grooves (310). Two clamping plates (307) are provided in the clamping grooves (310). Both clamping plates (307) are slidably connected to the rotating disk (305). A spring (308) is provided between the rotating disk (305) and the clamping plates (307). The rotating disk (305) is provided with a material taking trough (309).

7. A BGA chip packaging method according to claim 2, characterized in that: The transmission assembly (2) comprises a support frame (201), the support frame (201) is fixedly connected to a motor 1 (202), the output end of the motor 1 (202) is connected to a driving shaft (203), the driving shaft (203) is connected to a conveyor belt (205) in a transmission-coordinated manner, the conveyor belt (205) is connected to a driven shaft (204) in a transmission-coordinated manner, and both the driving shaft (203) and the driven shaft (204) are rotationally connected to the support frame (201).

8. A BGA chip packaging method according to claim 7, characterized in that: The flip assembly (6) includes a motor bracket (601), the lower end of the support bracket (201) is fixedly connected to the support bracket (201) through a locking nut (602), a second motor (603) is fixed to the side of the motor bracket (601), the output end of the second motor (603) is connected to a rotating shaft (604), the rotating shaft (604) is fixedly connected to a rotating plate (605), the rotating plate (605) is threadedly connected to a threaded rod (607), a suction cup support rod (606) is rotatably connected inside the threaded rod (607), and a suction cup (608) is fixed to the lower end of the suction cup support rod (606).

9. A BGA chip packaging method according to claim 8, characterized in that: The transport assembly (7) comprises a third motor (701), which is fixed to the end of the support frame (201), an output end of the third motor (701) is connected to a slide (702), the slide (702) slides in the support frame (201), the slide (702) is fixedly connected to a bracket (703), the bracket (703) is fixedly connected to a fourth motor (704), an output end of the fourth motor (704) is connected to a rotating rod (705), the rotating rod (705) is rotatably connected to a vertical rod (707), the bracket (703) is slidably connected to a slider (706), the slider (706) is slidably connected to the vertical rod (707), and a second suction cup (708) is fixed to the lower end of the vertical rod (707).

10. The BGA chip packaging method according to claim 6, characterized in that: The unloading assembly (4) comprises a slide plate (401), which is fixed on the middle fixed plate (306), a second support plate (402) is fixed on the upper end of the slide plate (401), the second support plate (402) is fixedly connected to the second cylinder (403), the output end of the second cylinder (403) is connected to the pull block (404), the pull block (404) is slidably connected to the upper end of the paddle (405), the paddle (405) slides in an inclined groove (407) provided in the second slider (406), a rubber pad (408) is fixed on the lower end of the paddle (405), the second slider (406) slides on the second support plate (402), a locking screw (409) is threadedly connected to the second slider (406), and the lower end of the locking screw (409) is against the second support plate (402).

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