Chip rubber coating and embedded chip conveyor belt prepared from same

Abstract

The invention relates to the field of chip rubber coating, in particular to chip rubber coating and an embedded chip conveyor belt prepared from the chip rubber coating, natural rubber and butadiene rubber are put into a torque rheometer, then an activating agent, a composite wave-transparent agent, modified rice husks and paraffin oil are sequentially added, mixing and standing are carried out, sulfur, a scorch retarder and an accelerant are added, mixing is carried out, tabletting is carried out through an open mill, cooling is carried out, and the chip rubber coating is obtained. The chip encapsulation is obtained; lignin and silicon dioxide are extracted and precipitated from rice husks by adopting an alkali liquor extraction and acid liquor co-precipitation method, a nanoscale sphere-like lignin-silicon dioxide hybrid material is obtained through self-assembly of intermolecular hydrogen bonds to serve as pretreated rice husks, the pretreated rice husks are subjected to hydroformylation, and then phosphorus-amine ionic liquid is grafted; silicon nitride, glass fibers and aramid fibers are compounded to serve as a wave-transparent agent, epoxidation is conducted on the wave-transparent agent, and then phosphorus-amine ionic liquid is grafted.

Description

Technical Field

[0001] The present invention relates to the technical field of chip encapsulation, in particular to a chip encapsulation and an embedded chip conveyor belt prepared using the same. Background Art

[0002] On a belt conveyor, the conveyor belt is a key component for conveying objects. Its basic shape is flat. Due to its long service life, the maintenance of the conveyor belt information has always been a difficult problem. The promotion of embedded chip conveyor belts will help solve the problem of difficult maintenance of conveyor belt information. With the embedding of special chip labels, maintenance personnel only need to use the corresponding machine to scan out the information of the corresponding conveyor belt.

[0003] Existing embedded chip conveyor belts are mostly divided into two types: plastic surface and rubber surface. Traditional embedded chip rubber conveyor belts also have problems such as limited flame retardancy and corrosion resistance. The addition of a large amount of flame retardant fillers will affect the mechanical strength of the rubber belt. At the same time, the material itself has a greater interference with the chip signal. Summary of the Invention

[0004] The object of the present invention is to provide a chip encapsulation and an embedded chip conveyor belt prepared therefrom, so as to solve the problems in the prior art.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0006] A method for preparing chip encapsulation comprises the following steps:

[0007] Natural rubber and butadiene rubber are put into a torque rheometer, and then an activator, a composite wave-transmitting agent, modified rice husks and paraffin oil are added in sequence, mixed and allowed to stand, sulfur, a scorch retarder and an accelerator are added, mixed and pressed into sheets using an open mill, and cooled to obtain a chip encapsulation.

[0008] Furthermore, the activator is obtained by compounding zinc oxide, stearic acid and lauric acid in a mass ratio of 1:1:1.

[0009] Furthermore, the accelerator is one of a sulfenamide accelerator and a thiuram accelerator, or a combination thereof.

[0010] Furthermore, the raw materials of the chip encapsulation are, by mass, 80 parts of natural rubber, 20 parts of butadiene rubber, 3-6 parts of activator, 6-12 parts of composite wave-transmitting agent, 8-16 parts of modified rice husk, 5-10 parts of paraffin oil, 1-3 parts of sulfur, 0.8-1 parts of anti-scorch agent, and 0.5-1 parts of accelerator.

[0011] Furthermore, the preparation of the composite wave-transmitting agent includes the following steps:

[0012] (1) Silicon nitride, glass fiber, and aramid fiber are compounded in a mass ratio of 1:1:1 to obtain a wave-transmitting agent; the wave-transmitting agent, 3-[(2,3)-epoxypropyloxy]propylmethyldimethoxysilane, and ethanol are mixed, ultrasonically treated for 20-30 minutes, deionized water and ammonia water are added, and ultrasonic dispersion is performed for 2-3 hours to obtain an epoxidized wave-transmitting agent;

[0013] (2) Mix the epoxidized wave-transmitting agent, phosphorus-amine ionic liquid, N,N-dimethylformamide, and triethylamine, heat to 70-80°C and keep warm for 5-6 hours, cool, and dry to obtain a composite wave-transmitting agent.

[0014] Furthermore, the preparation of modified rice husks includes the following steps:

[0015] 1) Mixing rice husks and a sulfuric acid solution, heating the mixture to 98-100° C. and maintaining the temperature for 3-4 hours, filtering the mixture, washing the mixture until neutral, and drying the mixture to obtain pretreated rice husks; mixing the pretreated rice husks and a NaOH solution, boiling and refluxing the mixture for 4 hours, filtering the mixture to obtain an extract, mixing the extract, deionized water, and ethanol in a volume ratio of 2:1:1, adding sulfuric acid solution to adjust the pH to 9 while stirring, adding polyethylene glycol, ultrasonically treating the mixture for 2-3 minutes, adding sulfuric acid solution to adjust the pH to 3, allowing the mixture to stand for 20-30 minutes, filtering the mixture, washing the mixture, and drying the mixture for 24 hours to obtain pretreated rice husks;

[0016] 2) Mix the pretreated rice husks, sodium periodate, and isopropyl alcohol, protect from light, and incubate at 50-60°C for 8-10 hours. Add ethylene glycol solution and continue incubating for 20-30 minutes. Wash and freeze-dry to obtain the aldehyde-treated rice husks.

[0017] 3) Mixing a phosphorus-amine ionic liquid, acetic acid, and N,N-dimethylformamide, stirring at 18-25° C. for 20-30 minutes, adding a mixture of formaldehyded rice husks and N,N-dimethylformamide, and maintaining the mixture at 58-62° C. for 18-20 hours, cooling, filtering, washing, and drying to obtain modified rice husks.

[0018] Further, the preparation of the phosphorus-amine ionic liquid comprises the following steps:

[0019] A. Under a nitrogen atmosphere, mix acrylamide, imidazole, and toluene, add triethylamine, and heat to 108-111°C for 23-24 hours. Filter, wash, and dry to obtain 1-(3-amino-3-oxypropyl)-imidazole.

[0020] B. Mix 1-(3-amino-3-oxypropyl)-imidazole and anhydrous ethanol, add 1-bromopropane at 18-25°C, raise the temperature to 68-72°C and keep warm for 23-24 hours, rotary evaporate, add acetonitrile, filter, rotary evaporate, and dry to obtain 1-(3-amino-3-oxypropyl)-3-propyl-imidazole bromide;

[0021] C. Mix 1-(3-amino-3-oxypropyl)-3-propyl-imidazolium bromide, sodium hypophosphite, and deionized water, heat to 78-82°C and maintain for 23-24 hours, distill under reduced pressure, transfer to anhydrous methanol and soak for 3-4 hours, filter, and distill under reduced pressure to obtain a phosphorus-amine ionic liquid.

[0022] Furthermore, an embedded chip conveyor belt is prepared by encapsulating a chip, and the preparation includes the following steps:

[0023] The belt core is immersed in PVC impregnating rubber material for treatment and plasticized to obtain a plasticized belt core. The chip is extruded and coated on the plasticized belt core, and vulcanized to obtain an embedded chip conveyor belt.

[0024] Furthermore, the composition of the PVC impregnated rubber material is, by weight, 100 parts of polyvinyl chloride paste resin, 30-35 parts of environmentally friendly plasticizer, 9-19 parts of epoxy soybean oil, 5-10 parts of modified rice husk, and 2-4 parts of calcium zinc composite stabilizer.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] The present invention provides a chip encapsulation and an embedded chip conveyor belt prepared therefrom. Through formulation and process optimization, a chip encapsulation with high flame retardancy, high wear resistance and good mechanical strength is prepared, thereby greatly improving various performances of the embedded chip conveyor belt.

[0027] In the present invention, natural rubber with high elasticity, high tensile strength and insulation is used as the main rubber, and butadiene rubber with good wear resistance is selected for blending to prepare a chip encapsulation with both high tensile strength and wear resistance. Zinc oxide, stearic acid and lauric acid are compounded as an activator, a certain amount of paraffin oil is added to adjust the hardness of the chip encapsulation, sulfur is used as a vulcanizing agent, and a certain amount of scorch retarder and accelerator are added as additives to improve the performance of the chip encapsulation.

[0028] Based on green production, rice husk, a cheap and easily available biomass raw material, is selected as a reinforcing agent. In order to improve the performance of the reinforcing agent, lignin and silica are extracted and precipitated from the rice husk by alkaline extraction and acid co-precipitation. Nano-sized spherical lignin-silica hybrid materials are obtained as pretreated rice husks through intermolecular hydrogen bond self-assembly. In order to improve the uniformity of the dispersion of the pretreated rice husk in the chip encapsulation and improve the bonding strength between the pretreated rice husk and the base material in the chip encapsulation, the pretreated rice husk is first treated with sodium periodate to make it aldehyde-ylated, and then the aldehyde-amino reaction is used to graft phosphorus-amine ionic liquid to give it high flame retardancy, antistatic properties and multiple active sites. When added to the chip encapsulation, it can firmly adhere to the chip encapsulation, giving the chip encapsulation excellent mechanical strength, aging resistance, high flame retardancy, antistatic properties and wear resistance, thereby reducing the use of non-renewable carbon black filler, which is in line with the current green environmental protection concept.

[0029] In the present invention, silicon nitride, glass fiber, and aramid fiber are compounded as a wave-transmitting agent, thereby reducing the absorption of electromagnetic waves in the rubber material, thereby increasing the communication distance. To improve the uniformity of the dispersion of the wave-transmitting agent in the chip encapsulation, 3-[(2,3)-epoxypropyloxy]propylmethyldimethoxysilane is first epoxidized, and then a phosphorus-amine ionic liquid is grafted using an epoxy-amino reaction. By controlling their mass ratio, the polarity of the surface is reduced, thereby improving the uniformity of the dispersion of the wave-transmitting agent in the chip encapsulation. At the same time, the modified rice husk synergistically improves the wear resistance and flame retardancy of the chip encapsulation. DETAILED DESCRIPTION

[0030] The following will provide a clear and complete description of the technical solutions of the present invention in conjunction with the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0031] It should be noted that if the embodiments of the present invention involve directional indications such as up, down, left, right, front, and back, such directional indications are only used to explain a specific posture, such as the relative position relationship between components, the movement status, etc. If the specific posture changes, the directional indication will also change accordingly. In addition, the technical solutions between the various embodiments may be combined with each other, but they must be based on the premise that they can be implemented by ordinary technicians in this field. If the combination of technical solutions is mutually inconsistent or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0032] The technical solutions of the present invention are further described in detail below with reference to specific embodiments. It should be understood that the following embodiments are merely used to explain the present invention and are not intended to limit the present invention.

[0033] Example 1: A method for preparing a chip encapsulation, comprising the following steps:

[0034] Natural rubber and butadiene rubber are put into a torque rheometer, and then an activator, a composite wave-transmitting agent, modified rice husks, and paraffin oil are added in sequence, mixed, allowed to stand, sulfur, a scorch retarder, and an accelerator are added, mixed, and sheeted using an open mill, and cooled to obtain a chip encapsulation.

[0035] The activator is prepared by mixing zinc oxide, stearic acid and lauric acid in a mass ratio of 1:1:1;

[0036] The accelerator is a mixture of a sulfenamide accelerator and a thiuram accelerator in a mass ratio of 1:1.

[0037] The raw materials of the chip encapsulation are as follows: 80 parts of natural rubber, 20 parts of butadiene rubber, 3 parts of activator, 6 parts of composite wave-transmitting agent, 8 parts of modified rice husk, 5 parts of paraffin oil, 1 part of sulfur, 0.8 parts of scorch retarder, and 0.5 parts of accelerator.

[0038] The preparation of the composite wave-transmitting agent comprises the following steps:

[0039] (1) Silicon nitride, glass fiber, and aramid fiber were compounded in a mass ratio of 1:1:1 to obtain a wave-transmitting agent; 3 g of the wave-transmitting agent, 1 mL of 3-[(2,3)-epoxypropyloxy]propylmethyldimethoxysilane, and 30 mL of ethanol were mixed and ultrasonically treated for 20 min. 1 mL of deionized water and 2 drops of ammonia were added and ultrasonically dispersed for 2 h to obtain an epoxidized wave-transmitting agent;

[0040] (2) Mix 3 g of epoxidized wave-transmitting agent, 0.2 g of phosphorus-amine ionic liquid, 20 mL of N,N-dimethylformamide, and 3 mL of triethylamine, heat to 70 °C and keep warm for 6 h, cool, and dry to obtain a composite wave-transmitting agent;

[0041] The preparation of the modified rice husk comprises the following steps:

[0042] 1) 2 g of rice husks and 10 mL of 3.6% sulfuric acid solution were mixed, heated to 98°C and kept warm for 4 h, filtered, washed until neutral, and dried to obtain pretreated rice husks; 10 g of pretreated rice husks and 70 mL of 8% NaOH solution were mixed, boiled and refluxed for 4 h, filtered and separated to obtain an extract, the extract, deionized water, and ethanol were mixed in a volume ratio of 2:1:1, and 1 mol / L sulfuric acid solution was added to adjust the pH to 9 under stirring, 1 g of polyethylene glycol was added, ultrasonically treated for 2 min, 1 mol / L sulfuric acid solution was added to adjust the pH to 3, and the mixture was allowed to stand for 20 min, filtered, washed, and dried for 24 h to obtain pretreated rice husks;

[0043] 2) Mix 2 g of pretreated rice husks, 150 mL of 0.1 mol / L sodium periodate, and 6 mL of isopropanol, protect from light, and incubate at 50°C for 10 h. Add 1 mL of 0.1 mol / L ethylene glycol solution and continue incubating for 20 min. Wash and freeze-dry to obtain the aldehyde-treated rice husks.

[0044] 3) 1.5 g of phosphorus-amine ionic liquid, 30 mL of 10% acetic acid, and 10 mL of N,N-dimethylformamide were mixed and stirred at 18°C for 30 min. A mixture of 0.9 g of formaldehyde-treated rice husks and 10 mL of N,N-dimethylformamide was added and the mixture was kept at 58°C for 20 h. The mixture was cooled, filtered, washed, and dried to obtain modified rice husks.

[0045] The preparation of the phosphorus-amine ionic liquid comprises the following steps:

[0046] A. Under nitrogen atmosphere, mix 3.5 g acrylamide, 3.4 g imidazole, and 75 mL toluene, add 0.6 mL triethylamine, and heat to 108°C for 24 h. Filter, wash, and dry to obtain 1-(3-amino-3-oxypropyl)-imidazole.

[0047] B. Mix 7 g of 1-(3-amino-3-oxypropyl)-imidazole and 50 mL of anhydrous ethanol, add 7.4 g of 1-bromopropane at 18°C, raise the temperature to 68°C and keep warm for 24 h, rotary evaporate, add 50 mL of acetonitrile, filter, rotary evaporate, and dry to obtain 1-(3-amino-3-oxypropyl)-3-propyl-imidazole bromide;

[0048] C. Mix 13.1 g of 1-(3-amino-3-oxypropyl)-3-propyl-imidazolium bromide, 4.4 g of sodium hypophosphite, and 50 mL of deionized water, heat to 78-82°C and maintain for 23 h, distill under reduced pressure, transfer to 50 mL of anhydrous methanol and soak for 3 h, filter, and distill under reduced pressure to obtain a phosphorus-amine ionic liquid.

[0049] Example 2: A method for preparing a chip encapsulation, comprising the following steps:

[0050] Natural rubber and butadiene rubber are put into a torque rheometer, and then an activator, a composite wave-transmitting agent, modified rice husks, and paraffin oil are added in sequence, mixed, allowed to stand, sulfur, a scorch retarder, and an accelerator are added, mixed, and sheeted using an open mill, and cooled to obtain a chip encapsulation.

[0051] The activator is prepared by mixing zinc oxide, stearic acid and lauric acid in a mass ratio of 1:1:1;

[0052] The accelerator is a mixture of a sulfenamide accelerator and a thiuram accelerator in a mass ratio of 1:1.

[0053] The raw materials of the chip encapsulation are as follows: 80 parts of natural rubber, 20 parts of butadiene rubber, 4 parts of activator, 9 parts of composite wave-transmitting agent, 12 parts of modified rice husk, 7 parts of paraffin oil, 2 parts of sulfur, 0.9 parts of scorch retarder, and 0.8 parts of accelerator.

[0054] The preparation of the composite wave-transmitting agent comprises the following steps:

[0055] (1) Silicon nitride, glass fiber, and aramid fiber were compounded in a mass ratio of 1:1:1 to obtain a wave-transmitting agent; 3 g of the wave-transmitting agent, 1 mL of 3-[(2,3)-epoxypropyloxy]propylmethyldimethoxysilane, and 30 mL of ethanol were mixed and ultrasonically treated for 25 min. 1 mL of deionized water and 2 drops of ammonia were added and ultrasonically dispersed for 2.5 h to obtain an epoxidized wave-transmitting agent;

[0056] (2) Mix 3 g of epoxidized wave-transmitting agent, 0.2 g of phosphorus-amine ionic liquid, 20 mL of N,N-dimethylformamide, and 3 mL of triethylamine, heat to 75 °C and keep warm for 5.5 h, cool, and dry to obtain a composite wave-transmitting agent;

[0057] The preparation of the modified rice husk comprises the following steps:

[0058] 1) Mix 2 g of rice husk and 10 mL of 3.6% sulfuric acid solution, heat to 99°C and keep warm for 3.5 h, filter, wash until neutral, and dry to obtain pretreated rice husk; mix 10 g of pretreated rice husk and 70 mL of 8% NaOH solution, boil and reflux for 4 h, filter and separate to obtain an extract, mix the extract, deionized water, and ethanol in a volume ratio of 2:1:1, add 1 mol / L sulfuric acid solution to adjust the pH to 9 under stirring, add 1 g of polyethylene glycol, ultrasonically treat for 2.5 min, add 1 mol / L sulfuric acid solution to adjust the pH to 3, let stand for 25 min, filter, wash, and dry for 24 h to obtain pretreated rice husk;

[0059] 2) Mix 2 g of pretreated rice husks, 150 mL of 0.1 mol / L sodium periodate, and 6 mL of isopropyl alcohol, protect from light, and incubate at 55°C for 9 h. Add 1 mL of 0.1 mol / L ethylene glycol solution and continue incubating for 25 min. Wash and freeze-dry to obtain the aldehyde-treated rice husks.

[0060] 3) 1.5 g of phosphorus-amine ionic liquid, 30 mL of 10% acetic acid, and 10 mL of N,N-dimethylformamide were mixed and stirred at 20°C for 25 min. A mixture of 0.9 g of formaldehyde-treated rice husks and 10 mL of N,N-dimethylformamide was added and the mixture was kept at 60°C for 19 h. The mixture was cooled, filtered, washed, and dried to obtain modified rice husks.

[0061] The preparation of the phosphorus-amine ionic liquid comprises the following steps:

[0062] A. Under nitrogen atmosphere, mix 3.5 g acrylamide, 3.4 g imidazole, and 75 mL toluene. Add 0.6 mL triethylamine and heat to 109°C for 23.5 h. Filter, wash, and dry to obtain 1-(3-amino-3-oxypropyl)-imidazole.

[0063] B. Mix 7 g of 1-(3-amino-3-oxypropyl)-imidazole and 50 mL of anhydrous ethanol, add 7.4 g of 1-bromopropane at 20°C, raise the temperature to 70°C and keep warm for 23.5 h, rotary evaporate, add 50 mL of acetonitrile, filter, rotary evaporate, and dry to obtain 1-(3-amino-3-oxypropyl)-3-propyl-imidazole bromide;

[0064] C. Mix 13.1 g of 1-(3-amino-3-oxypropyl)-3-propyl-imidazole bromide, 4.4 g of sodium hypophosphite, and 50 mL of deionized water, heat to 80°C and maintain for 23.5 h, distill under reduced pressure, transfer to 50 mL of anhydrous methanol and soak for 3.5 h, filter, and distill under reduced pressure to obtain a phosphorus-amine ionic liquid.

[0065] Example 3: A method for preparing a chip encapsulation, comprising the following steps:

[0066] Natural rubber and butadiene rubber are put into a torque rheometer, and then an activator, a composite wave-transmitting agent, modified rice husks, and paraffin oil are added in sequence, mixed, allowed to stand, sulfur, a scorch retarder, and an accelerator are added, mixed, and sheeted using an open mill, and cooled to obtain a chip encapsulation.

[0067] The activator is prepared by mixing zinc oxide, stearic acid and lauric acid in a mass ratio of 1:1:1;

[0068] The accelerator is a mixture of a sulfenamide accelerator and a thiuram accelerator in a mass ratio of 1:1.

[0069] The raw materials of the chip encapsulation are as follows: 80 parts of natural rubber, 20 parts of butadiene rubber, 6 parts of activator, 12 parts of composite wave-transmitting agent, 16 parts of modified rice husk, 10 parts of paraffin oil, 3 parts of sulfur, 1 part of anti-scorch agent, and 1 part of accelerator.

[0070] The preparation of the composite wave-transmitting agent comprises the following steps:

[0071] (1) Silicon nitride, glass fiber, and aramid fiber were compounded in a mass ratio of 1:1:1 to obtain a wave-transmitting agent; 3 g of the wave-transmitting agent, 1 mL of 3-[(2,3)-epoxypropyloxy]propylmethyldimethoxysilane, and 30 mL of ethanol were mixed and ultrasonically treated for 30 min. 1 mL of deionized water and 2 drops of ammonia were added and ultrasonically dispersed for 3 h to obtain an epoxidized wave-transmitting agent;

[0072] (2) Mix 3 g of epoxidized wave-transmitting agent, 0.2 g of phosphorus-amine ionic liquid, 20 mL of N,N-dimethylformamide, and 3 mL of triethylamine, heat to 80 °C and keep warm for 5 h, cool, and dry to obtain a composite wave-transmitting agent;

[0073] The preparation of the modified rice husk comprises the following steps:

[0074] 1) Mix 2 g of rice husk and 10 mL of 3.6% sulfuric acid solution, heat to 100°C and keep warm for 3 h, filter, wash until neutral, and dry to obtain pretreated rice husk; mix 10 g of pretreated rice husk and 70 mL of 8% NaOH solution, boil and reflux for 4 h, filter and separate to obtain an extract, mix the extract, deionized water, and ethanol in a volume ratio of 2:1:1, add 1 mol / L sulfuric acid solution to adjust the pH to 9 under stirring, add 1 g of polyethylene glycol, ultrasonically treat for 3 min, add 1 mol / L sulfuric acid solution to adjust the pH to 3, let stand for 30 min, filter, wash, and dry for 24 h to obtain pretreated rice husk;

[0075] 2) Mix 2 g of pretreated rice husks, 150 mL of 0.1 mol / L sodium periodate, and 6 mL of isopropyl alcohol, protect from light, and incubate at 60°C for 8 h. Add 1 mL of 0.1 mol / L ethylene glycol solution and continue incubating for 30 min. Wash and freeze-dry to obtain the aldehyde-treated rice husks.

[0076] 3) 1.5 g of phosphorus-amine ionic liquid, 30 mL of 10% acetic acid, and 10 mL of N,N-dimethylformamide were mixed and stirred at 25°C for 20 min. A mixture of 0.9 g of formaldehyde-treated rice husks and 10 mL of N,N-dimethylformamide was added and the mixture was kept at 62°C for 18 h. The mixture was cooled, filtered, washed, and dried to obtain modified rice husks.

[0077] The preparation of the phosphorus-amine ionic liquid comprises the following steps:

[0078] A. Under nitrogen atmosphere, mix 3.5 g acrylamide, 3.4 g imidazole, and 75 mL toluene. Add 0.6 mL triethylamine and heat to 111°C for 23 h. Filter, wash, and dry to obtain 1-(3-amino-3-oxypropyl)-imidazole.

[0079] B. Mix 7 g of 1-(3-amino-3-oxypropyl)-imidazole and 50 mL of anhydrous ethanol, add 7.4 g of 1-bromopropane at 25°C, raise the temperature to 72°C and keep warm for 23 h, rotary evaporate, add 50 mL of acetonitrile, filter, rotary evaporate, and dry to obtain 1-(3-amino-3-oxypropyl)-3-propyl-imidazole bromide;

[0080] C. Mix 13.1 g of 1-(3-amino-3-oxypropyl)-3-propyl-imidazole bromide, 4.4 g of sodium hypophosphite, and 50 mL of deionized water, heat to 82°C and maintain for 23 h, distill under reduced pressure, transfer to 50 mL of anhydrous methanol and soak for 4 h, filter, and distill under reduced pressure to obtain a phosphorus-amine ionic liquid.

[0081] Comparative Example 1: Using Example 3 as the control group, pretreated rice husks were used instead of modified rice husks, and other processes were normal.

[0082] Comparative Example 2: Taking Example 3 as the control group, the composite wave-transmitting agent was replaced with a wave-transmitting agent, and the other processes were normal.

[0083] Comparative Example 3: Example 3 was used as a control group, in which phosphorus-amine ionic liquid was not prepared and other processes were normal.

[0084] The chip encapsulation in the embodiment and the comparative example is prepared into an embedded chip conveyor belt, and the preparation method includes the following steps:

[0085] The belt core is immersed in a PVC impregnation rubber compound for immersion treatment and plasticization to obtain a plasticized belt core. The chip is extruded and coated on the plasticized belt core, and vulcanized to obtain an embedded chip conveyor belt. The PVC impregnation rubber compound is composed of 100 parts of polyvinyl chloride paste resin, 30 parts of environmentally friendly plasticizer, 10 parts of epoxy soybean oil, 5 parts of modified rice husk, and 3 parts of calcium-zinc composite stabilizer in parts by weight.

[0086] Source of raw materials (for example only):

[0087] Natural rubber HC4760: Tianmen Hengchang Chemical Co., Ltd.; butadiene rubber BR9000: Kangdis Chemical (Hubei) Co., Ltd.; paraffin oil XK0340: Hubei Xinkang Pharmaceutical Chemical Co., Ltd.; sulfur S-80: Guangzhou Wanchun Chemical Co., Ltd.; scorch retarder CTP: Shandong Ruiqi Chemical Co., Ltd.; sulfenamide accelerator 4979-32-2: Hubei Rishengchang New Materials Technology Co., Ltd.; thiuram accelerator TETD: Nanjing Bermuda Biotechnology Co., Ltd.; polyvinyl chloride paste resin A00287: Wuhan Jiyesheng Chemical Co., Ltd.; environmentally friendly plasticizer DPGDB (99%): Hubei Chengfeng Chemical Co., Ltd.; epoxidized soybean oil S50881: Shanghai Yuanye Biotechnology Co., Ltd.; calcium zinc composite stabilizer (99%): Hubei Xinrunde Chemical Co., Ltd.; aramid fiber (200 mesh, 99%): Nantong Runfeng Petrochemical Co., Ltd.; rice husk: commercially available; zinc oxide Z111836, stearic acid S108289, lauric acid L305740, silicon nitride S431558, glass fiber F770994, 3-[(2,3)-epoxypropyloxy]propylmethyldimethoxysilane G134407, polyethylene glycol P103723, ethylene glycol E103319, acrylamide A108465, imidazole I108707; Aladdin reagent; ethanol, ammonia water, N,N-dimethylformamide, sodium hypophosphite, triethylamine, sulfuric acid, NaOH solution, sodium periodate, isopropyl alcohol, acetic acid, toluene, 1-bromopropane, acetonitrile, methanol, analytical grade: commercially available.

[0088] Performance test: The chip encapsulation prepared in the embodiment and comparative example was subjected to performance test:

[0089] The chip encapsulation was vulcanized to prepare a sample; the vulcanization working conditions were: 135°C for 22 minutes:

[0090] Impact strength: The notched cantilever beam impact strength value was measured by making a 60mm×13mm×4mm specimen and cutting a V-shaped notch. Flame retardancy: The vertical burning performance test was conducted using a horizontal vertical burning tester in accordance with GB / T10707-2008.

[0091] Wear resistance: Refer to GB / T1689-2014, fix it on the rubber wheel shaft, pre-grind it in a clockwise direction for 20 minutes, weigh its mass m1, and weigh it m2 after running 1.6 km, and calculate the wear volume;

[0092] Communication distance test of embedded chip conveyor belt: Embedded electronic chip specifications: size: 3mm × 100mm (including antenna), operating frequency: 860MHz-960MHz, sensitivity: -18dBm standard, can identify the reading distance of not less than 5 meters, repeated read and write times: 100,000 times, embedded electronic chip is placed in the weft direction, 10cm from the horizontal edge of the conveyor belt, and 2mm from the working surface. When using a handheld card reader, if it can accurately read the information in the chip at a distance of 1 meter from the working surface of the embedded chip, it is qualified; otherwise, it is unqualified. The test results are shown in Table 1.

[0093] Table 1

[0094]

[0095] The present invention provides a chip encapsulation and an embedded chip conveyor belt prepared therefrom. Through formulation and process optimization, a chip encapsulation with high flame retardancy, high wear resistance and good mechanical strength is prepared, thereby greatly improving various performances of the embedded chip conveyor belt.

[0096] Example 3 is compared with Comparative Example 1 and Comparative Example 3. Based on green production, rice husk, a cheap and easily available biomass raw material, is selected as a reinforcing agent. In order to improve the performance of the reinforcing agent, lignin and silica are extracted and precipitated from the rice husk by alkali extraction and acid co-precipitation. Nano-sized spherical lignin-silica hybrid materials are obtained as pretreated rice husks through intermolecular hydrogen bond self-assembly. In order to improve the uniformity of dispersion of the pretreated rice husk in the chip encapsulation and improve the bonding strength between the pretreated rice husk and the base material in the chip encapsulation, the pretreated rice husk is first treated with sodium periodate to formaldehyde, and then the aldehyde-amino reaction is used to graft phosphorus-amine ionic liquid to give it high flame retardancy and multiple active sites. When it is added to the chip encapsulation, it can be firmly attached to the chip encapsulation, giving the chip encapsulation excellent mechanical strength, high flame retardancy and wear resistance, thereby reducing the use of non-renewable carbon black filler, which is in line with the current green environmental protection concept.

[0097] Example 3 is compared with Comparative Examples 2 and 3. In the present invention, silicon nitride, glass fiber, and aramid fiber are compounded as a wave-transmitting agent to reduce the absorption of electromagnetic waves in the rubber material, thereby increasing the communication distance. In order to improve the uniformity of the dispersion of the wave-transmitting agent in the chip encapsulation, 3-[(2,3)-epoxypropyloxy]propylmethyldimethoxysilane is first epoxidized, and then the epoxy-amino reaction is used to graft the phosphorus-amine ionic liquid. By controlling their mass ratio, the polarity of the surface is reduced, thereby improving the uniformity of the dispersion of the wave-transmitting agent in the chip encapsulation. At the same time, the modified rice husk is synergistically used to improve the wear resistance and flame retardancy of the chip encapsulation.

[0098] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structural transformations made using the present invention specification under the inventive concept of the present invention, or any direct / indirect application in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A method for preparing chip encapsulation, characterized in that: The steps include: Natural rubber and butadiene rubber are put into a torque rheometer, and then an activator, a composite wave-transmitting agent, modified rice husks and paraffin oil are added in sequence, mixed and allowed to stand, sulfur, a scorch retarder and an accelerator are added, mixed and pressed into sheets using an open mill, and cooled to obtain a chip encapsulation.

2. The method for preparing a chip encapsulation according to claim 1, characterized in that: The activator is prepared by mixing zinc oxide, stearic acid and lauric acid in a mass ratio of 1:1:

1.

3. The method for preparing a chip encapsulation according to claim 1, characterized in that: The accelerator is one of a sulfenamide accelerator and a thiuram accelerator, or a combination thereof.

4. The method for preparing a chip encapsulation according to claim 1, characterized in that: Calculated by mass, the raw materials of the chip encapsulation are: 80 parts of natural rubber, 20 parts of butadiene rubber, 3-6 parts of activator, 6-12 parts of composite wave-transmitting agent, 8-16 parts of modified rice husk, 5-10 parts of paraffin oil, 1-3 parts of sulfur, 0.8-1 parts of anti-scorch agent, and 0.5-1 parts of accelerator.

5. The method for preparing a chip encapsulation according to claim 1, characterized in that: The preparation of the composite wave-transmitting agent comprises the following steps: (1) Silicon nitride, glass fiber, and aramid fiber are compounded in a mass ratio of 1:1:1 to obtain a wave-transmitting agent; the wave-transmitting agent, 3-[(2,3)-epoxypropyloxy]propylmethyldimethoxysilane, and ethanol are mixed, ultrasonically treated for 20-30 minutes, deionized water and ammonia water are added, and ultrasonic dispersion is performed for 2-3 hours to obtain an epoxidized wave-transmitting agent; (2) Mix the epoxidized wave-transmitting agent, phosphorus-amine ionic liquid, N,N-dimethylformamide, and triethylamine, heat to 70-80°C and keep warm for 5-6 hours, cool, and dry to obtain a composite wave-transmitting agent.

6. The method for preparing chip encapsulation according to claim 1, characterized in that: The preparation of the modified rice husk comprises the following steps: 1) Mix rice husks and sulfuric acid solution, heat to 98-100°C and keep warm for 3-4 hours, filter, wash until neutral, and dry to obtain pretreated rice husks; The pretreated rice husk and NaOH solution were mixed, boiled and refluxed for 4 hours, and filtered to obtain an extract. The extract, deionized water, and ethanol were mixed in a volume ratio of 2:1:

1. Under stirring, sulfuric acid solution was added to adjust the pH to 9. Polyethylene glycol was added and ultrasonicated for 2-3 minutes. The pH was adjusted to 3 by adding sulfuric acid solution, and the mixture was allowed to stand for 20-30 minutes. The mixture was filtered, washed, and dried for 24 hours to obtain the pretreated rice husk. 2) Mix the pretreated rice husks, sodium periodate, and isopropyl alcohol, protect from light, and incubate at 50-60°C for 8-10 hours. Add ethylene glycol solution and continue incubating for 20-30 minutes. Wash and freeze-dry to obtain the aldehyde-treated rice husks. 3) Mixing a phosphorus-amine ionic liquid, acetic acid, and N,N-dimethylformamide, stirring at 18-25° C. for 20-30 minutes, adding a mixture of formaldehyded rice husks and N,N-dimethylformamide, and maintaining the mixture at 58-62° C. for 18-20 hours, cooling, filtering, washing, and drying to obtain modified rice husks.

7. The method for preparing a chip encapsulation according to claim 5 or 6, characterized in that: The preparation of the phosphorus-amine ionic liquid comprises the following steps: A. Under a nitrogen atmosphere, mix acrylamide, imidazole, and toluene, add triethylamine, and heat to 108-111°C for 23-24 hours. Filter, wash, and dry to obtain 1-(3-amino-3-oxypropyl)-imidazole. B. Mix 1-(3-amino-3-oxypropyl)-imidazole and anhydrous ethanol, add 1-bromopropane at 18-25°C, raise the temperature to 68-72°C and keep warm for 23-24 hours, rotary evaporate, add acetonitrile, filter, rotary evaporate, and dry to obtain 1-(3-amino-3-oxypropyl)-3-propyl-imidazole bromide; C. Mix 1-(3-amino-3-oxypropyl)-3-propyl-imidazolium bromide, sodium hypophosphite, and deionized water, heat to 78-82°C and maintain for 23-24 hours, distill under reduced pressure, transfer to anhydrous methanol and soak for 3-4 hours, filter, and distill under reduced pressure to obtain a phosphorus-amine ionic liquid.

8. A chip encapsulation, characterized in that: The invention is prepared by the preparation method according to any one of claims 1 to 6.

9. An embedded chip conveyor belt, characterized in that: The chip encapsulation is prepared by the chip encapsulation as claimed in claim 8, and the preparation comprises the following steps: The belt core is immersed in PVC impregnating rubber material for treatment and plasticized to obtain a plasticized belt core. The chip is extruded and coated on the plasticized belt core, and vulcanized to obtain an embedded chip conveyor belt.

10. The embedded chip conveyor belt according to claim 9, characterized in that: The composition of the PVC impregnated rubber material is as follows: 100 parts of polyvinyl chloride paste resin, 30-35 parts of environmentally friendly plasticizer, 9-19 parts of epoxy soybean oil, 5-10 parts of modified rice husk, and 2-4 parts of calcium-zinc composite stabilizer in parts by weight.

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