Chip mounting device for semiconductor chip processing

Abstract

The invention discloses a surface mounting device for semiconductor chip processing, and relates to the technical field of semiconductor chip processing. The chip mounting device for semiconductor chip processing comprises a table top, and the top of the rear side of the table top is fixedly connected with feeding equipment; a first rotating shaft is rotationally connected into the left side of the feeding equipment, a motor is rotationally connected to the rear side of the first rotating shaft, a circular ring is fixedly connected to the front side of the first rotating shaft, a spherical protruding block is fixedly connected to the outer side of the circular ring, a first pushing block is slidably connected to the upper side of the spherical protruding block, and the top of the first pushing block is slidably connected with a first hydraulic block. The top of the first hydraulic block is movably connected with a gear through a transmission piece, a second rotating shaft is fixedly connected into the gear, and a limiting plate is fixedly connected to the side face of the second rotating shaft. According to the chip mounting device for semiconductor chip processing, a motor is started to cooperate with a rotating shaft I, a circular ring, a spherical bump, a hydraulic block I, a push block I, a gear, a rotating shaft II and a limiting plate, so that the limiting plate rotates, and a chip does not overturn during feeding.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip processing, in particular to a chip placement device for semiconductor chip processing. Background Art

[0002] Mounting device: also known as "mounting machine" or "surface mounting system". In the production line, it is configured after the dispensing machine or screen printing machine. It is a device that accurately places surface mount components on the PCB pads by moving the mounting head.

[0003] Chinese patent CN119673832B, authorized and published on April 18, 2025, discloses a chip placement device for semiconductor chip processing, comprising a movable base, a motorized push rod fixedly mounted on the bottom of the movable base, a chip placement head mechanism fixedly mounted on the output end of the motorized push rod, a chip placement body adsorbed on the chip placement head mechanism, a heating assembly provided on the chip placement head mechanism, and the movable base provided on the movable assembly. In the aforementioned application document, the feeding device is prone to flipping the chip when feeding it into the feeding device, preventing the subsequent chip gluing and curing processes from being completed, thereby affecting the equipment's production yield. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the present invention provides a chip placement device for semiconductor chip processing, which solves the problems raised in the above background technology. To achieve the above objectives, the present invention is implemented through the following technical solutions: A chip placement device for semiconductor chip processing, comprising: A table top, a baffle is fixedly connected to the top of the rear side of the table top, a turntable is rotatably connected to the top of the table top, a feeding device with an automatic feeding function is fixedly connected to the rear side of the top of the table top, a heating and curing device is fixedly connected to the top of the left side of the table top, and a feeding device is fixedly connected to the top of the rear side of the table top; The left side of the feeding device is internally rotatably connected to a rotating shaft 1, the rear side of the rotating shaft 1 is rotatably connected to a motor, the front side of the rotating shaft 1 is fixedly connected to a circular ring, the outer side of the circular ring is fixedly connected to a spherical bump, the front side of the baffle is fixedly connected to a hydraulic block 1, the bottom of the hydraulic block 1 is slidably connected to a push block 1, the bottom of the push block 1 is slidably connected to the spherical bump, the top of the hydraulic block 1 is movably connected to the gear through a transmission member, the interior of the gear is fixedly connected to a rotating shaft 2, the side of the rotating shaft 2 is fixedly connected to a limiting plate, and the side of the rotating shaft 2 is rotatably connected to the baffle. By setting the limiting plate, when the feeding device feeds the chip into the feeding device, one side of the chip is first lifted and then lowered, so that the chip will not flip over, and the subsequent adsorption process, gluing process, and curing process of the chip can be carried out smoothly, thereby improving the yield rate of the equipment and improving the working efficiency of the equipment.

[0005] Preferably, the transmission component includes a hose 1, a hydraulic block 2, and a rack. One end of the hose 1 is fixedly connected to the hydraulic block 1, and the other end of the hose 1 is fixedly connected to the hydraulic block 2. The left side of the hydraulic block 2 is slidably connected to a rack, and the front side of the rotating shaft 2 is fixedly connected to a gear, and the rack is engaged with the gear.

[0006] Preferably, a gluing device is fixedly connected to the top right side of the table, four fixed supporting feet with the function of supporting the table are fixedly connected to the bottom of the table, a chip picker is fixedly connected to the top rear side of the table, a material receiving device is provided at the bottom right side of the feeding device, a static electricity removal component is fixedly connected to the top left side of the table, eight processing holes are opened on the surface of the turntable, and the bottom of each processing hole is slidably connected to an automatic lifting component.

[0007] Preferably, the number of the spherical bumps is three, each of the spherical bumps is distributed around the center of the ring, and a telescopic fixing rod is fixedly connected to the bottom of the material receiving device.

[0008] Preferably, the static electricity removal component includes a push block 2, a hydraulic block 3, a hose 2, a hydraulic block 4, a push block 3, a valve, an air outlet, and an ion blower. The bottom of the push block 2 is fixedly connected to the top of the limit plate, the top of the push block 2 is slidably connected to the hydraulic block 3, the top of the hydraulic block 3 is fixedly connected to one end of the hose 2, the other end of the hose 2 is fixedly connected to the side of the hydraulic block 4, the left side of the hydraulic block 4 is slidably connected to the push block 3, the front side of the push block 3 is fixedly connected to the valve, the bottom of the valve is movably connected to the top of the ion blower, and the front side of the ion blower is provided with an air outlet. Through the provision of the static electricity removal component, the static electricity generated when the chip picker picks up the chip and when the chip is transported by the feeding equipment is removed, so that the chip will not be damaged due to static electricity during the subsequent gluing process and heating and curing process. At the same time, the static electricity generated by human intervention in the equipment maintenance process is removed, so that the yield rate of the equipment is improved and the working efficiency of the equipment is improved.

[0009] Preferably, the interior of the second hose is communicated with the interior of the second hydraulic block, and the interior of the second hose is communicated with the interior of the third hydraulic block.

[0010] Preferably, the air outlet on the front side of the ion blower faces the chip picker, the rear side of the hydraulic block 2 is fixedly connected to the front side of the baffle, and the bottom of the hydraulic block 3 is fixedly connected to the table through a support rod.

[0011] Preferably, the automatic lifting assembly includes a hose three, a hydraulic block five, a push block four, a slide bar, a lifting plate, and a spring. One side of the hose three is fixedly connected to the top of the hydraulic block three, and the other side of the hose three is fixedly connected to the side of the hydraulic block five. The top of the hydraulic block five is slidably connected to a push block four. The bottom of each processing hole is fixedly connected to two springs. The top of the spring is fixedly connected to a lifting plate. The side of the lifting plate is slidably connected to the processing hole. The bottom of the lifting plate is fixedly connected to a slide bar. The slide bar is slidably connected to the turntable through a slide groove provided inside the turntable. The top of the push block four is slidably connected to the slide bar. By setting the automatic lifting assembly, the chip is brought as close to the heating curing device as possible during the thermal curing process, thereby improving the thermal curing efficiency of the chip and the working efficiency of the device.

[0012] Preferably, the number of the springs is sixteen, with every two of the springs forming a group, the number of the lifting plates is eight, the number of the sliding rods is sixteen, with every two of the sliding rods forming a group, and a spherical slider is fixedly connected to the bottom of each group of sliding rods.

[0013] Preferably, the size of the lifting plate is consistent with the size of the processing hole.

[0014] The present invention provides a chip placement device for semiconductor chip processing. It has the following beneficial effects: The chip placement device for semiconductor chip processing, when the device is working, starts the motor, cooperates with the rotating shaft 1, the circular ring, the spherical bump, the push block 1, the hydraulic block 1, the hose 1, the hydraulic block 2, the rack, and the gear, so that the limit plate rotates cyclically by a certain angle, so that when the chip enters the feeding device, one side of the chip is first lifted and then lowered, so that the chip will not flip over, thereby improving the yield rate of the equipment and improving the working efficiency of the equipment.

[0015] The chip placement device for semiconductor chip processing is designed such that when the device is working, the limit plate rotates, and the push block 2, hydraulic block 3, hose 2, hydraulic block 4, and push block 3 are coordinated to cause the valve to open and close cyclically, so that the ion wind generated by the ion blower is blown out when the chip is picked up by the chip picker to the processing hole, thereby removing the static electricity generated during the chip transmission or picking process, and allowing the subsequent chip processing process to proceed smoothly.

[0016] The chip placement device for semiconductor chip processing, when the device is working, when the limit plate rotates, it cooperates with push block 2, hydraulic block 3, hose 3, hydraulic block 5, push block 4, slide bar, lifting plate, and spring, so that the chip is lifted by the lifting plate to approach the heating and curing device when it rotates below the heating and curing device, thereby improving the efficiency of the chip thermal curing process and the working efficiency of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention; Figure 2 It is a schematic diagram of the overall cross-sectional three-dimensional structure of the present invention; Figure 3 For the present invention Figure 2 A in the middle is an enlarged structural diagram; Figure 4 It is a schematic diagram of the three-dimensional structure of some components of the present invention; Figure 5 This is a schematic diagram of the structure of the static electricity removal component of the present invention; Figure 6 For the present invention Figure 5 The enlarged structural diagram at B in the middle; Figure 7 This is a schematic structural diagram of the automatic lifting assembly of the present invention; Figure 8 For the present invention Figure 7 Enlarged structural diagram at point C in the middle.

[0018] In the picture: 100, table; 101, baffle; 200, turntable; 300, feeding equipment; 400, glue coating equipment; 500, chip picker; 600, heating and curing device; 700, material receiving equipment; 800, feeding equipment; 901, motor; 902, rotating shaft 1; 903, ring; 904, spherical bump; 905, push block 1; 906, hydraulic block 1; 907, hose 1; 908, hydraulic block 2; 909, rack; 910, gear; 911, rotating shaft 2; 912, limit plate; 1000, static electricity removal assembly; 1001, push block 2; 1002, hydraulic block 3; 1003, hose 2; 1004, hydraulic block 4; 1005, push block 3; 1006, valve; 1007, air outlet; 1008, ion blower 1100. Automatic lifting assembly; 1101. Hose three; 1102. Hydraulic block five; 1103. Push block four; 1104. Sliding rod; 1105. Lifting plate; 1106. Spring. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0020] For example 1, please refer to Figures 1-4, a chip placement device for semiconductor chip processing, comprising: a table 100, a baffle 101 fixedly connected to the top of the rear side of the table 100, the baffle 101 is provided so that the rotating shaft 2 911 and the hydraulic block 2 908 can be fixed, thereby making the operation of the equipment more stable, and at the same time, the position of the chip can be limited when the chip enters the feeding device 800, so that the subsequent chip picker 500 can pick up the chip more accurately, the right top of the table 100 is fixedly connected to the glue coating device 400, the bottom of the table 100 is fixedly connected to four fixed support feet with the function of supporting the table 100, the rear top of the table 100 is fixedly connected to the chip picker 500, the right bottom of the feeding device 800 is provided with a receiving device 700, the left top of the table 100 is fixedly connected to the static electricity removal component 1000, the surface of the turntable 200 is provided with eight processing holes, and the bottom of each processing hole is slidably connected to an automatic lifting component 1100, and a glue coating device 400 is provided so that the chip is driven by the turntable 200 When it is transferred to the glue coating device 400, it can be automatically coated with glue, so that the subsequent curing process of the chip can proceed smoothly. A chip picker 500 is set, so that when the unprocessed chip is transported to the middle position by the feeding device 800, it can be adsorbed and picked up by the chip picker 500 and put into the processing hole of the turntable 200. The top of the table 100 is rotatably connected to the turntable 200, and the top rear side of the table 100 is fixedly connected with a feeding device 300 with an automatic feeding function. The feeding device 300 is set to automatically transport the unprocessed chip into the feeding device 800, saving manpower. The left top of the table 100 is fixedly connected with a heating and curing device 600. The heating and curing device 600 is set so that the glue can be automatically heated and cured after the chip is coated, thereby achieving the function of packaging the chip and protecting the chip. The top of the rear side of the table 100 is fixedly connected with a feeding device 800. The feeding device 800 is set so that both the unprocessed and processed chips can be automatically conveyed to the subsequent material receiving device 700, saving manpower.The left inner side of the feeding device 800 is rotatably connected to a rotating shaft 902, and the rear side of the rotating shaft 902 is rotatably connected to a motor 901. The motor 901 is set so that the motor 901 provides power for the limit plate 912 and the feeding device 800 and the feeding device 300. The front side of the rotating shaft 902 is fixedly connected to a circular ring 903, and the outer side of the circular ring 903 is fixedly connected to a spherical bump 904. There are three spherical bumps 904, and each spherical bump 904 is distributed around the center of the circular ring 903. The bottom of the receiving device 700 is fixedly connected to a telescopic fixing rod, and the front side of the baffle 101 is fixedly connected to a hydraulic block 906. The bottom of the hydraulic block 906 is slidably connected to a push block 905. The bottom of the push block 905 is slidably connected to the spherical bump 904, and the top of the hydraulic block 906 is movably connected to the gear 910 through a transmission member. It includes hose 1 907, hydraulic block 2 908, and rack 909. One end of hose 1 907 is fixedly connected to hydraulic block 1 906, and the other end of hose 1 907 is fixedly connected to hydraulic block 2 908. Rack 909 is slidably connected to the left side of hydraulic block 2 908. Gear 910 is fixedly connected to the front of rotating shaft 2 911. Rack 909 meshes with gear 910. Rotating shaft 2 911 is fixedly connected to the inside of gear 910. The side of rotating shaft 2 911 is fixedly connected to limit plate 912. The side of rotating shaft 2 911 is rotatably connected to baffle 101. The limit plate 912 is provided so that when the feeding device 300 feeds the chip into the feeding device 800, one side of the chip is first lifted and then lowered, preventing the chip from flipping. This allows the chip's subsequent adsorption, gluing, and curing processes to proceed smoothly, thereby improving the device's yield rate and operating efficiency.

[0021] When in use, the feeding device 800, the feeding device 300, and the receiving device 700 are started to feed the chips from the feeding device 300 into the feeding device 800. At this time, the motor 901 is started to rotate the shaft 1 902 clockwise, the ring 903 is rotated clockwise, the spherical protrusion 904 is in contact with the push block 1 905, the push block 1 905 slides upward, the hydraulic block 1 906 is compressed, and the pressure inside the hydraulic block 1 906 is transmitted to the inside of the hydraulic block 2 908 through the hose 1 907, so that the hydraulic block 2 908 is compressed, the rack 909 is pushed to the left, the gear 910 is rotated clockwise, the shaft 2 911 is rotated clockwise, and the limit plate 912 is rotated clockwise, thereby Before the chip is fed into the feeding device 800, the right side of the chip is lifted. When the spherical bump 904 separates from the push block 1 905, the push block 1 905 slides downward, the hydraulic block 1 906 is restored, and the pressure inside the hydraulic block 1 906 is transmitted to the inside of the hydraulic block 2 908 through the hose 1 907, so that the hydraulic block 2 908 is restored, the rack 909 is pushed to the right, the gear 910 rotates counterclockwise, the rotating shaft 2 911 rotates counterclockwise, and the limit plate 912 rotates counterclockwise. After the chip is completely moved to the limit plate 912, it automatically falls to the feeding device 800 due to gravity, so that the chip will not flip over, so that the subsequent processing of the chip can be carried out smoothly and the yield rate of the equipment is improved.

[0022] For example 2, please refer to Figure 1-Figure 7On the basis of Example 1, the static electricity removal component 1000 includes a push block 2 1001, a hydraulic block 3 1002, a hose 2 1003, a hydraulic block 4 1004, a push block 3 1005, a valve 1006, an air outlet 1007, and an ion blower 1008. The bottom of the push block 2 1001 is fixedly connected to the top of the limit plate 912, the top of the push block 2 1001 is slidably connected to the hydraulic block 3 1002, and the top of the hydraulic block 3 1002 is fixedly connected to one end of the hose 2 1003. The other end of the hose 2 1003 is fixedly connected to the side of the hydraulic block 4 1004. The interior of the hose 2 1003 is connected to the interior of the hydraulic block 3 1002. The interior of the hose 2 1003 is connected to the interior of the hydraulic block 4 1004. The hose 2 1003 is set so that the pressure inside the hydraulic block 3 1002 can be transmitted to the interior of the hydraulic block 4 1004 to achieve the purpose of power transmission. The left side of the hydraulic block 4 1004 is slidably connected to the push block 3 1005. The push block 3 1005 is connected to the push block 3 1004. A valve 1006 is fixedly connected to the front side of 005, and the bottom of the valve 1006 is movably connected to the top of the ion fan 1008. An air outlet 1007 is provided on the front side of the ion fan 1008. The air outlet 1007 is provided so that the ion wind generated by the ion fan 1008 can be directed toward the chip processing hole, thereby making the static electricity removal process more thorough. The air outlet 1007 on the front side of the ion fan 1008 is directed toward the side of the chip picker 500, the rear side of the hydraulic block three 1002 is fixedly connected to the front side of the baffle 101, and the bottom of the hydraulic block four 1004 is fixedly connected to the table 100 through a support rod. A static electricity removal component 1000 is provided to remove the static electricity generated when the chip picker 500 picks up the chip and the chip is transported by the feeding device 800, so that the chip will not be damaged due to static electricity during the subsequent gluing process and heating and curing process. At the same time, the static electricity generated by human intervention in the maintenance of the equipment is removed, thereby improving the yield rate of the equipment and improving the working efficiency of the equipment.

[0023] During use, based on Example 1, when the limit plate 912 rotates clockwise, the push block 2 1001 slides, the hydraulic block 3 1002 is compressed, and the internal pressure of the hydraulic block 3 1002 is transmitted to the inside of the hydraulic block 4 1004 through the hose 2 1003, so that the hydraulic block 4 1004 is compressed, the push block 3 1005 is pushed out, the valve 1006 is opened, and the ion wind generated by the ion blower 1008 blows toward the chip in the processing hole, so that the chip picker 500 picks up the chip and the static electricity generated by the chip when the feeding equipment 800 transports it is removed, so that the chip will not be damaged due to static electricity in the subsequent gluing process and heating and curing process, and at the same time, the static electricity generated by human intervention in the maintenance of the equipment is removed, so that the yield rate of the equipment is improved, and the working efficiency of the equipment is improved.

[0024] For example three, please refer to Figures 1-8On the basis of embodiment one and embodiment two, the automatic lifting assembly 1100 includes a hose three 1101, a hydraulic block five 1102, a push block four 1103, a slide bar 1104, a lifting plate 1105, and a spring 1106. One side of the hose three 1101 is fixedly connected to the top of the hydraulic block three 1002, and the other side of the hose three 1101 is fixedly connected to the side of the hydraulic block five 1102. The top of the hydraulic block five 1102 is slidably connected with the push block four 1103. Two springs 1106 are fixedly connected to the bottom of each processed hole. The springs 1106 are provided to provide a reset power when the lifting plate 1105 needs to be lowered after being lifted by the slide bar 1104. The number of springs 1106 is sixteen, and every two springs 1106 form a group. The number of lifting plates 1105 is eight, and the number of slide bars 1104 is sixteen, and every two slide bars 1104 form a group. The bottom of the slide bar 1104 is fixedly connected with a spherical slider, and the spherical slider is set so that the slide bar 1104 is driven to rotate by the turntable 200. When the slide bar 1104 contacts the push block four 1103, it will not get stuck, so that the subsequent lifting of the lifting plate 1105 is not affected. The top of the spring 1106 is fixedly connected with the lifting plate 1105. The size of the lifting plate 1105 is consistent with the size of the processing hole. The side of the lifting plate 1105 is slidably connected to the processing hole. The bottom of the lifting plate 1105 is fixedly connected with the slide bar 1104. The slide bar 1104 is slidably connected to the turntable 200 through the slide groove opened inside the turntable 200. The top of the push block four 1103 is slidably connected with the slide bar 1104. Through the setting of the automatic lifting component 1100, when the chip undergoes the thermal curing process, the chip is as close to the heating curing device 600 as possible, so that the thermal curing efficiency of the chip is improved, and the working efficiency of the device is improved.

[0025] During use, based on Example 1 and Example 2, when the limit plate 912 rotates clockwise, the push block 2 1001 slides, the hydraulic block 3 1002 is compressed, and the internal pressure of the hydraulic block 3 1002 is transmitted to the inside of the hydraulic block 5 1102 through the hose 3 1101, so that the hydraulic block 5 1102 is compressed, and the push block 4 1103 is pushed out, and the slide bar 1104 moves upward, and the lifting plate 1105 moves upward, so that the chip is lifted, so that the chip is close to the heating and curing device 600, thereby improving the thermal curing efficiency of the chip and the working efficiency of the device. When the heating is completed, the turntable 200 rotates, so that the slide bar 1104 moves away from the push block 4 1103. Under the tension of the spring 1106, the slide bar 1104 automatically descends, so that the lifting plate 1105 descends, so that the chip returns to the normal position of the processing hole, so as not to affect the subsequent finished product being picked up and collected.

[0026] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A chip bonding device for semiconductor chip processing, characterized in that: include: A table top, a baffle is fixedly connected to the top of the rear side of the table top, a turntable is rotatably connected to the top of the table top, a feeding device with an automatic feeding function is fixedly connected to the rear side of the top of the table top, a heating and curing device is fixedly connected to the top of the left side of the table top, and a feeding device is fixedly connected to the top of the rear side of the table top; The left side of the feeding equipment is rotatably connected to a rotating shaft 1, the rear side of the rotating shaft 1 is rotatably connected to a motor, the front side of the rotating shaft 1 is fixedly connected to a circular ring, the outer side of the circular ring is fixedly connected to a spherical bump, the front side of the baffle is fixedly connected to a hydraulic block 1, the bottom of the hydraulic block 1 is slidably connected to a push block 1, the bottom of the push block 1 is slidably connected to the spherical bump, the top of the hydraulic block 1 is movably connected to the gear through a transmission member, the interior of the gear is fixedly connected to a rotating shaft 2, the side of the rotating shaft 2 is fixedly connected to a limiting plate, and the side of the rotating shaft 2 is rotatably connected to the baffle.

2. A chip bonding device for semiconductor chip processing according to claim 1, characterized in that: The transmission part includes a hose 1, a hydraulic block 2, and a rack. One end of the hose 1 is fixedly connected to the hydraulic block 1, and the other end of the hose 1 is fixedly connected to the hydraulic block 2. The left side of the hydraulic block 2 is slidably connected to a rack, and the front side of the rotating shaft 2 is fixedly connected to a gear, and the rack is engaged with the gear.

3. The chip bonding device for semiconductor chip processing according to claim 1, wherein: A gluing device is fixedly connected to the top right side of the table, four fixed support legs with the function of supporting the table are fixedly connected to the bottom of the table, a chip picker is fixedly connected to the top rear side of the table, a material receiving device is provided at the bottom right side of the feeding device, a static electricity removal component is fixedly connected to the top left side of the table, eight processing holes are opened on the surface of the turntable, and the bottom of each processing hole is slidably connected to an automatic lifting component.

4. The chip bonding device for semiconductor chip processing according to claim 1, wherein: The number of the spherical bumps is three, and each of the spherical bumps is distributed around the center of the ring. A telescopic fixing rod is fixedly connected to the bottom of the material receiving device.

5. The chip bonding device for semiconductor chip processing according to claim 3, characterized in that: The static electricity removal component includes a push block 2, a hydraulic block 3, a hose 2, a hydraulic block 4, a push block 3, a valve, an air outlet, and an ion fan. The bottom of the push block 2 is fixedly connected to the top of the limit plate, the top of the push block 2 is slidably connected to the hydraulic block 3, the top of the hydraulic block 3 is fixedly connected to one end of the hose 2, the other end of the hose 2 is fixedly connected to the side of the hydraulic block 4, the left side of the hydraulic block 4 is slidably connected to the push block 3, the front side of the push block 3 is fixedly connected to the valve, the bottom of the valve is movably connected to the top of the ion fan, and the front side of the ion fan is provided with an air outlet.

6. The chip bonding device for semiconductor chip processing according to claim 5, characterized in that: The interior of the second hose is communicated with the interior of the third hydraulic block, and the interior of the second hose is communicated with the interior of the fourth hydraulic block.

7. The chip bonding device for semiconductor chip processing according to claim 5, characterized in that: The air outlet on the front side of the ion blower faces the chip picker, the rear side of the hydraulic block three is fixedly connected to the front side of the baffle, and the bottom of the hydraulic block four is fixedly connected to the table through a support rod.

8. The chip bonding device for semiconductor chip processing according to claim 3, characterized in that: The automatic lifting assembly includes a hose three, a hydraulic block five, a push block four, a slide rod, a lifting plate, and a spring. One side of the hose three is fixedly connected to the top of the hydraulic block three, and the other side of the hose three is fixedly connected to the side of the hydraulic block five. The top of the hydraulic block five is slidably connected to a push block four. The bottom of each of the processed holes is fixedly connected to two springs. The top of the spring is fixedly connected to a lifting plate. The side of the lifting plate is slidably connected to the processed hole. The bottom of the lifting plate is fixedly connected to a slide rod. The slide rod is slidably connected to the turntable through a slide groove opened inside the turntable. The top of the push block four is slidably connected to the slide rod.

9. The chip bonding device for semiconductor chip processing according to claim 8, characterized in that: The number of the springs is sixteen, with two of the springs forming a group; the number of the lifting plates is eight; the number of the sliding rods is sixteen, with two of the sliding rods forming a group; and a spherical slider is fixedly connected to the bottom of each group of sliding rods.

10. The chip bonding device for semiconductor chip processing according to claim 8, characterized in that: The size of the lifting plate is consistent with the size of the processing hole.

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