High-speed VCSEL semiconductor chip packaging device capable of adjusting internal air pressure and packaging method

Abstract

The invention relates to the technical field of semiconductor chip packaging, in particular to a high-speed VCSEL semiconductor chip packaging device capable of adjusting internal air pressure and a packaging method.The high-speed VCSEL semiconductor chip packaging device comprises an operation table, a bonding structure is arranged in the middle of the operation table, a positioning structure is arranged on the bonding structure, a clamping structure is arranged on the inner side of the bonding structure, and the clamping structure is connected with a releasing structure; an overturning structure is connected between the operation table and the bonding structure, and an abutting structure is arranged on the bottom side of the operation table; a sealing environment capable of adjusting air pressure can be conveniently provided in the chip packaging process through the bonding structure, the accuracy of the position of the chip can be guaranteed through the positioning structure, the positioning effect of the chip can be improved through the clamping structure, the chip can be rapidly fixed or released through the releasing structure, and the chip packaging efficiency is improved. The arrangement seat can be controlled to perform 180-degree reciprocating overturning action through the overturning structure, the accuracy of the rotating angle is ensured, and bonding between the chip and the shell can be completed through the abutting structure.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip packaging, and in particular to a high-speed VCSEL semiconductor chip packaging device and packaging method capable of adjusting internal air pressure. Background Art

[0002] Packaging involves connecting the circuit pins on a silicon chip to external connectors with wires to facilitate connections to other devices. This process not only installs, secures, seals, and protects the chip, enhancing electrical and thermal performance, but also connects the internal chip to the external circuitry by connecting wires through the chip's contacts to the pins of the package casing. These pins, in turn, connect to other components via wires on the printed circuit board. The chip must be isolated from the outside world to prevent impurities in the air from corroding the chip's circuitry and degrading its electrical performance. Furthermore, packaged chips are easier to install and transport.

[0003] Since the chip generates heat during operation, it is necessary to glue the chip to a shell for heat dissipation and protection by dispensing glue. The packaging requirements for chips in different application scenarios are also different. At the same time, the bubbles generated in the bonding process between the shell and the chip will cause the thermal conductivity of the shell to decrease. Therefore, chips with high heat dissipation requirements require bonding under vacuum or low vacuum conditions to avoid the generation of bubbles. However, existing packaging equipment usually has a large space, which makes the vacuuming speed slow, thereby reducing production efficiency. At the same time, the packaging of chips of different specifications often requires a lot of debugging work. Summary of the Invention

[0004] In view of the problems in the prior art, the present invention provides a high-speed VCSEL semiconductor chip packaging device and packaging method capable of adjusting internal air pressure.

[0005] The technical solution adopted by the present invention to solve the technical problem is: a high-speed VCSEL semiconductor chip packaging device with adjustable internal air pressure, comprising an operating table, a bonding structure provided in the middle of the operating table, a positioning structure provided on the bonding structure, a clamping structure provided on the inner side of the bonding structure, a release structure connected to the clamping structure, a flip structure connected between the operating table and the bonding structure, and an interference structure provided on the bottom side of the operating table;

[0006] Specifically, the bonding structure includes a placement seat, the middle part of the operating table is rotatably connected to the placement seat, the bottom side of the placement seat is provided with a lifting seat, a connecting sleeve is provided between the lifting seat and the placement seat, the connecting sleeve and the lifting seat are both slidably connected to the middle part of the operating table, a push plate is provided on the bottom side of the lifting seat, the placement seat, the connecting sleeve and the placement seat are equal in width, the top and bottom ends of the connecting sleeve are fixedly connected with sealing gaskets, and an exhaust pipe is installed on the side of the connecting sleeve.

[0007] Specifically, a vacuum pump is installed on the side of the operating table, the end of the exhaust pipe passes through the operating table and is connected to the vacuum pump, and both ends of the connecting sleeve are fixedly connected to the operating table with a first spring.

[0008] Specifically, the positioning structure includes a placement slot, a plurality of placement slots are opened on the top side of the placement seat, and the placement seat is slidably connected to a limit block on both sides of the placement slot, and the inner side of the placement seat is rotatably connected to a shaft rod, and a plurality of threaded sleeves are fixedly connected to the shaft rod, and the thread directions on both sides of the threaded sleeves are opposite, and the two sides of the threaded sleeves are respectively threadedly connected to the two limit blocks set in the same placement slot, and the top side of the placement seat is rotatably connected to the adjustment rod, and the end of the shaft rod is fixedly connected to a bevel gear, and the side surface of the bevel gear is meshed with the end of the adjustment rod.

[0009] Specifically, the clamping structure includes a clamping rod, and a clamping rod is slidably connected to each side of the placement seat. The end of the clamping rod is in an "L"-shaped structure. The side of the clamping rod is rotatably connected to two connecting rods, and the end of the connecting rod located on the same side of the two clamping rods is rotatably connected to a traction block. The end of the traction block is slidably connected to the placement seat, and a second spring is fixedly connected between the traction block and the placement seat.

[0010] Specifically, the middle part of the seating seat is rotatably connected to a rotary block, a first torsion spring is fixedly connected between the rotary block and the seating seat, the bottom side of the rotary block is a cam-shaped structure, the middle part of the clamping rod is fixedly connected to a resistance slide, the resistance slide is slidably connected to the inner side of the seating seat, and the side surfaces of the rotary block respectively resist the resistance slides on both sides.

[0011] Specifically, the release structure includes a release rod, the middle part of the rotary block is slidably connected to the release rod, the bottom end of the release rod is a square structure, the bottom end of the release rod is fixedly connected to a locking plate, a third spring is fixedly connected between the locking plate and the placement seat, and a locking block is respectively provided on both sides of the release rod on the locking plate, and a locking hole is opened on the rotary block, and the locking block is engaged with the rotary block through the locking hole.

[0012] Specifically, the flip structure includes a limiting slide groove, a limiting slide groove is provided on one side of the operating table, the operating table is slidably connected to the inner slide through the limiting slide groove, a driving screw is threadedly connected to one side of the inner slide, the driving screw is rotatably connected to the operating table, a guide groove of a "human" shaped structure is provided on the inner slide, the end of the placement seat is slidably connected to the inner slide through the guide groove, the end of the placement seat is rotatably connected to the pulling slider, the middle part of the pulling slider is slidably connected to the side sliding rod, the side sliding rod and the pulling slider are fixedly connected with a fourth spring, and the end of the side sliding rod is slidably connected to the inner slide.

[0013] Specifically, the interference structure includes a threaded plate, the inner side of the lifting seat is slidably connected to the threaded plate, the middle part of the threaded plate is threadedly connected to an adjusting screw, the adjusting screw and the lifting seat are rotatably connected, the top side of the lifting seat is slidably connected to a pressure plate, a fifth spring is fixedly connected between the pressure plate and the threaded plate, and a positioning plate is provided on the pressure plate.

[0014] Specifically, each end of the lifting seat is fixedly connected to a sliding column, and both sides of the end of the sliding column are planar structures. A rotating block is rotatably connected to the sliding column, and a second torsion spring is fixedly connected between the rotating block and the lifting seat. A limiting arc groove is provided on the side of the rotating block, and the rotating block is slidably connected to the lifting seat through the limiting arc groove. A side sliding groove is provided on the side of the operating table, and the rotating block and the sliding column are both slidably connected to the operating table through the side sliding groove.

[0015] A method for operating a high-speed VCSEL semiconductor chip packaging device capable of adjusting internal gas pressure comprises the following steps:

[0016] S1: First, the bonding structure on the operating table provides a sealed environment with quickly adjustable air pressure for the chip after dispensing. This ensures the air pressure environment during the bonding process according to the chip type and controls bubbles in the adhesive.

[0017] S2: After the chip is placed on the mounting seat, the positioning structure and the clamping structure can fix the chip according to the chip specifications to ensure the accuracy of glue dispensing and subsequent bonding. The release structure can facilitate the control of the clamping structure, thereby facilitating the inversion of the chip and subsequent packaging with the shell;

[0018] S3: After the chip is placed, the direction of the chip can be flipped through the flip structure, so that the operating position can be sealed through the connecting sleeve, thereby realizing the adjustment of the air pressure of the bonding environment. The push of the push plate makes the bonding structure complete a tight contact connection. At the same time, the contact structure can apply appropriate pressure between the shell and the chip dispensing surface to promote the bonding between the two. Combined with the adjustment of the air pressure, the bubbles in the glue can be effectively controlled to ensure a tight connection between the shell and the chip and to ensure good thermal conductivity and protection.

[0019] The beneficial effects of the present invention are:

[0020] (1) The high-speed VCSEL semiconductor chip packaging device and packaging method with adjustable internal air pressure described in the present invention have an adhesive structure in the middle of the operating table, which can conveniently provide a sealed environment with adjustable air pressure during the chip packaging process, thereby controlling the generation of bubbles.

[0021] (2) The high-speed VCSEL semiconductor chip packaging device and packaging method with adjustable internal air pressure described in the present invention have a positioning structure on the bonding structure, a clamping structure on the inner side of the bonding structure, and a release structure connected to the clamping structure. The positioning structure can be adjusted according to the specifications of the chip to ensure the accuracy of the chip position. The clamping structure can further improve the positioning effect of the chip and fix the chip at the same time. The release structure can quickly fix or release the chip, making it convenient to place or extract the chip.

[0022] (3) The high-speed VCSEL semiconductor chip packaging device and packaging method with adjustable internal air pressure described in the present invention has a flip structure connected between the operating table and the bonding structure. The flip structure can control the placement seat to perform a 180-degree reciprocating flip movement to ensure the accuracy of the rotation angle.

[0023] (4) The present invention describes a high-speed VCSEL semiconductor chip packaging device and packaging method with adjustable internal air pressure. The bottom side of the operating table is provided with a resistance structure, which can complete the bonding between the chip and the shell, and at the same time provide a sealed environment for the bonding process, thereby avoiding external influences and adjusting the air pressure as needed. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention will be further described below with reference to the accompanying drawings and examples.

[0025] Figure 1 A schematic diagram of the overall structure provided by the present invention;

[0026] Figure 2 This is a schematic diagram of the connection structure between the operating table and the push plate shown in the present invention;

[0027] Figure 3 for Figure 2 The enlarged structural diagram of part A is shown;

[0028] Figure 4 for Figure 2 The enlarged structural diagram of part B is shown;

[0029] Figure 5 for Figure 3 The enlarged structural diagram of part C is shown;

[0030] Figure 6 This is a schematic diagram of the connection structure between the operating table and the placement seat shown in the present invention;

[0031] Figure 7 This is a schematic diagram of the connection structure between the placement seat and the rotating block shown in the present invention;

[0032] Figure 8 This is a schematic diagram of the connection structure between the operating table and the vacuum pump shown in the present invention;

[0033] Figure 9 for Figure 8 The enlarged structural diagram of the D portion shown;

[0034] Figure 10 This is a schematic diagram of the connection structure between the lifting seat and the pressure plate shown in the present invention;

[0035] Figure 11 It is a structural schematic diagram of the rotating block shown in the present invention;

[0036] Figure 12 It is a structural schematic diagram of the operating table shown in the present invention;

[0037] Figure 13 for Figure 12 The enlarged structural diagram of part E is shown.

[0038] In the figure: 1. operating table; 2. bonding structure; 201. placement seat; 202. connecting sleeve; 203. lifting seat; 204. push plate; 205. exhaust pipe; 206. sealing gasket; 207. first spring; 208. vacuum pump; 3. positioning structure; 301. placement groove; 302. adjustment rod; 303. bevel gear; 304. shaft; 305. threaded sleeve; 306. limit block; 4. clamping structure; 401. traction block; 402. second spring; 403. connecting rod; 404. rotating block; 405. first torsion spring; 406. clamping rod; 407. contact slide; 5. release Release structure; 501, locking plate; 502, third spring; 503, engaging hole; 504, engaging block; 505, release rod; 6, flip structure; 601, inner slide; 602, pulling slider; 603, side slide bar; 604, fourth spring; 605, driving screw; 606, guide groove; 607, limiting slide groove; 7, interference structure; 701, side slide groove; 702, pressure plate; 703, fifth spring; 704, threaded plate; 705, adjusting screw; 706, positioning plate; 707, slide column; 708, rotating block; 709, second torsion spring; 710, limiting arc groove. DETAILED DESCRIPTION

[0039] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0040] like Figure 1 、 Figure 3 、 Figure 4 、 Figure 10 As shown, a high-speed VCSEL semiconductor chip packaging device with adjustable internal air pressure according to the present invention includes an operating platform 1, a bonding structure 2 is provided in the middle of the operating platform 1, a positioning structure 3 is provided on the bonding structure 2, a clamping structure 4 is provided on the inner side of the bonding structure 2, and a release structure 5 is connected to the clamping structure 4. A flip structure 6 is connected between the operating platform 1 and the bonding structure 2, and an interference structure 7 is provided on the bottom side of the operating platform 1;

[0041] Specifically, such as Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 13As shown, the bonding structure 2 includes a placement seat 201, the middle part of the operating table 1 is rotatably connected to the placement seat 201, a lifting seat 203 is provided on the bottom side of the placement seat 201, a connecting sleeve 202 is provided between the lifting seat 203 and the placement seat 201, the connecting sleeve 202 and the lifting seat 203 are both slidably connected to the middle part of the operating table 1, a push plate 204 is provided on the bottom side of the lifting seat 203, the placement seat 201, the connecting sleeve 202 and the placement seat 201 have the same width, the top and bottom ends of the connecting sleeve 202 are fixedly connected with sealing gaskets 206, an exhaust pipe 205 is installed on the side of the connecting sleeve 202, a vacuum pump 208 is installed on the side of the operating table 1, the end of the exhaust pipe 205 passes through the operating table 1 and is connected to the vacuum pump 208, and both ends of the connecting sleeve 202 are fixedly connected to the operating table 1 with a first spring 207;

[0042] The user places the chip to be packaged on the placement seat 201 and fixes it, and then uses the glue dispensing equipment on the top side to dispense glue. At this time, the placement seat 201 is turned over, and the shell to be installed is placed on the lifting seat 203. The bottom side of the operating table 1 is provided with a push plate 204 driven by a hydraulic rod. When the push plate 204 rises, the push plate 204 will drive the lifting seat 203 to rise synchronously until the lifting seat 203 moves to the position of the connecting sleeve 202. At this time, as the lifting seat 203 continues to rise, the connecting sleeve 202 will conflict with the placement seat 201 that has been turned over, and the connecting sleeve 202 will be connected. The sealing gaskets 206 arranged on both sides of the connecting sleeve 202 can ensure the sealing of the inner side of the connecting sleeve 202. At the same time, the bonding between the shell and the chip is completed by rising the lifting seat 203. At the same time, in order to control the bubbles in the glue, the user can vacuum the inside of the connecting sleeve 202 through the exhaust pipe 205 connected to the vacuum pump 208 to change the air pressure inside the connecting sleeve 202. Since the internal space of the connecting sleeve 202 is relatively small, a sealed environment can be quickly formed by rising the lifting seat 203, which can conveniently provide good packaging effects for different types of chips.

[0043] Specifically, such as Figure 3 、 Figure 7 As shown, the positioning structure 3 includes a placement groove 301, and a plurality of placement grooves 301 are opened on the top side of the placement seat 201. The placement seat 201 is slidably connected to a limit block 306 on both sides of the placement groove 301. The inner side of the placement seat 201 is rotatably connected to a shaft rod 304, and a plurality of threaded sleeves 305 are fixedly connected to the shaft rod 304. The threads on both sides of the threaded sleeve 305 are in opposite directions, and the two sides of the threaded sleeve 305 are respectively threadedly connected to the two limit blocks 306 set in the same placement groove 301. The top side of the placement seat 201 is rotatably connected to the adjustment rod 302, and the end of the shaft rod 304 is fixedly connected to the bevel gear 303. The side surface of the bevel gear 303 meshes with the end of the adjustment rod 302.

[0044] In order to ensure the accuracy of the chip packaging process, a plurality of placement slots 301 for chip placement are provided on the placement seat 201. At the same time, the user can rotate the adjustment rod 302 on the side to drive the shaft 304 to rotate through the transmission effect of the bevel gear 303. The plurality of threaded sleeves 305 on the shaft 304 are respectively threadedly connected with the limit blocks 306 in different placement slots 301. Since the threads on both sides of the threaded sleeve 305 are in opposite directions, the distance between the limit blocks 306 can be adjusted as the threaded sleeve 305 rotates, which facilitates the packaging operation of chips of different specifications.

[0045] Specifically, such as Figure 3 、 Figure 5 、 Figure 7 As shown, the clamping structure 4 includes a clamping rod 406, and a clamping rod 406 is slidably connected to each of the two sides of the placement seat 201, and the end of the clamping rod 406 is an "L"-shaped structure. The side of the clamping rod 406 is rotatably connected to the two connecting rods 403, and the end of the connecting rod 403 located on the same side of the two clamping rods 406 is rotatably connected to the traction block 401, and the end of the traction block 401 is slidably connected to the placement seat 201. A second spring 402 is fixedly connected between the traction block 401 and the placement seat 201, and the middle part of the placement seat 201 is rotatably connected to the rotating block 404, and the first torsion spring 405 is fixedly connected between the rotating block 404 and the placement seat 201. The bottom side of the rotating block 404 is a cam-shaped structure, and the middle part of the clamping rod 406 is fixedly connected to the interference slide 407, which is slidably connected to the inner side of the placement seat 201, and the side surfaces of the rotating block 404 respectively interfere with the interference slides 407 on both sides;

[0046] When placing the chip, the user can rotate the rotary block 404 located in the middle of the placement seat 201. The cam structure on the bottom side of the rotary block 404 pushes the resistance slide 407 to open the clamping rods 406 on both sides. A first torsion spring 405 is connected between the rotary block 404 and the placement seat 201. When the user releases the rotary block 404, the clamping rod 406 can push the chip to the middle position of the placement slot 301. At the same time, due to the "L"-shaped structure at the end of the clamping rod 406, the chip can be prevented from falling out.

[0047] Specifically, such as Figure 3 、 Figure 5 、 Figure 7 As shown, the release structure 5 includes a release rod 505, and the middle part of the rotary block 404 is slidably connected to the release rod 505. The bottom end of the release rod 505 is a square structure. The bottom end of the release rod 505 is fixedly connected to the locking plate 501. A third spring 502 is fixedly connected between the locking plate 501 and the placement seat 201. The locking plate 501 is provided with a clamping block 504 on both sides of the release rod 505. The rotary block 404 is provided with a clamping hole 503. The clamping block 504 is clamped with the rotary block 404 through the clamping hole 503.

[0048] In order to facilitate the control of the clamping rod 406 through the rotary block 404, when the user rotates the rotary block 404 90 degrees, the clamping rod 406 will be fully opened. At this time, the placement slot 301 is fully opened, and the locking block 504 on the locking plate 501 will also be engaged with the locking hole 503 on the rotary block 404, thereby fixing the position of the clamping rod 406, making it convenient for the user to extract or place the chip. After placement is completed, the user can press the release rod 505 in the middle of the rotary block 404, and the square part at the end of the release rod 505 will be disengaged from the rotary block 404. At the same time, the locking block 504 will be disengaged from the locking hole 503. Under the action of the first torsion spring 405, the rotary block 404 rotates, thereby releasing the clamping rods 406 on both sides, clamping the chip in the middle, and facilitating operation.

[0049] Specifically, such as Figure 4 、 Figure 9 As shown, the flip structure 6 includes a limiting slide groove 607, a limiting slide groove 607 is provided on one side of the operating platform 1, and the operating platform 1 is slidably connected to the inner slide 601 through the limiting slide groove 607, and a driving screw 605 is threadedly connected to one side of the inner slide 601, and the driving screw 605 is rotatably connected to the operating platform 1, and a guide groove 606 of a "human" structure is provided on the inner slide 601, and the end of the placement seat 201 is slidably connected to the inner slide 601 through the guide groove 606, and the end of the placement seat 201 is rotatably connected to the pulling slider 602, and the middle part of the pulling slider 602 is slidably connected to the side sliding rod 603, and a fourth spring 604 is fixedly connected between the side sliding rod 603 and the pulling slider 602, and the end of the side sliding rod 603 is slidably connected to the inner slide 601;

[0050] After fixing the chip in the placement groove 301 on the placement seat 201, the user can rotate the drive shaft through the motor installed on the side of the operating table 1. At this time, the drive shaft will drive the inner slide 601 with the same threaded connection to slide to the other side of the limiting slide groove 607. During this process, the end of the placement seat 201 will slide in the guide groove 606 of the "human" shape structure. At the same time, combined with the traction effect of the fourth spring 604 on the pulling slider 602 at the end of the placement seat 201, the placement seat 201 can complete a 180-degree flip effect, which is convenient for sealing the chip through the connecting sleeve 202.

[0051] Specifically, such as Figure 10 、 Figure 11 、 Figure 13As shown, the interference structure 7 includes a threaded plate 704, the inner side of the lifting seat 203 is slidably connected to the threaded plate 704, the middle part of the threaded plate 704 is threadedly connected to the adjusting screw 705, the adjusting screw 705 is rotatably connected to the lifting seat 203, the top side of the lifting seat 203 is slidably connected to the pressure plate 702, the pressure plate 702 and the threaded plate 704 are fixedly connected with a fifth spring 703, a positioning plate 706 is provided on the pressure plate 702, and the two ends of the lifting seat 203 are respectively fixedly connected with a sliding plate. Column 707, both sides of the end of the sliding column 707 are flat structures, the sliding column 707 is rotatably connected to the rotating block 708, the rotating block 708 is fixedly connected to the lifting seat 203 with a second torsion spring 709, the side of the rotating block 708 is provided with a limiting arc groove 710, the rotating block 708 is slidably connected to the lifting seat 203 through the limiting arc groove 710, and the side of the operating table 1 is provided with a side sliding groove 701, the rotating block 708 and the sliding column 707 are both slidably connected to the operating table 1 through the side sliding groove 701;

[0052] After completing the setting of the placement seat 201, the user needs to place the positioning plate 706 that matches the shell specifications on the surface of the pressure plate 702, and then place the shell to be connected on the inner side of the positioning plate 706 to ensure the accuracy of the packaging. The user can then rotate the adjusting screw 705 located in the middle of the lifting seat 203 to adjust the height of the inner threaded plate 704 to change the elastic state of the fifth spring 703, and then adjust the pressure applied to the shell during the bonding process to ensure the firmness of the bonding. During this process, for the convenience of operation, the user can rotate the lifting seat 203 at a small angle between the rotating blocks 708 on both sides, where the limiting arc groove 710 will limit the maximum rotation angle of the lifting seat 203, and the second torsion spring 709 will The position of the lifting seat 203 will be restored. After the adjustment is completed, the lifting seat 203 returns to the vertical state, and the push plate 204 is continuously lifted by the hydraulic rod on the bottom side. The rotating blocks 708 and the sliding columns 707 on both sides of the lifting plate will slide in the side slide grooves 701 until the lifting seat 203 contacts the lower surface of the connecting sleeve 202. The lifting seat 203 continues to rise, and finally the two ends of the connecting sleeve 202 will contact the placement seat 201 and the lifting seat 203 respectively through the sealing gasket 206 to achieve a sealed environment at the packaging position. On the other hand, in order to reduce the bubbles inside the colloid, the user can also use the vacuum pump 208 to evacuate the inside of the connecting sleeve 202, control the air pressure therein, and ensure the packaging effect of the chip.

[0053] A method for operating a high-speed VCSEL semiconductor chip packaging device capable of adjusting internal gas pressure comprises the following steps:

[0054] S1: First, the bonding structure 2 on the operating table 1 can provide a sealed environment with quickly adjustable air pressure for the chip after dispensing, thereby ensuring the air pressure environment during the bonding process according to the type of chip to control bubbles in the adhesive;

[0055] S2: After the chip is placed on the mounting seat 201, the positioning structure 3 and the clamping structure 4 can fix the chip according to the chip specifications to ensure the accuracy of glue dispensing and subsequent bonding. The release structure 5 can facilitate the control of the clamping structure 4, thereby facilitating the inversion of the chip and subsequent packaging with the shell;

[0056] S3: After the chip is placed, the direction of the chip can be flipped through the flip structure 6, so that the operating position is sealed through the connecting sleeve 202, thereby realizing the adjustment of the air pressure of the bonding environment. The push of the push plate 204 allows the bonding structure 2 to complete a tight contact connection. At the same time, the contact structure 7 can apply appropriate pressure between the shell and the chip glue surface to promote the bonding between the two. Combined with the adjustment of the air pressure, the bubbles in the glue can be effectively controlled to ensure a tight connection between the shell and the chip and to ensure good thermal conductivity and protection.

[0057] When the present invention is in use, first, a rotatable placement seat 201 is provided in the middle of the operating table 1. The user places the chip to be packaged on the placement seat 201 and fixes it, and then uses the glue dispensing device on the top side to dispense glue. At this time, the placement seat 201 is turned over, and the shell to be installed is placed on the lifting seat 203. The bottom side of the operating table 1 is provided with a push plate 204 driven by a hydraulic rod. When the push plate 204 rises in height, the push plate 204 will drive the lifting seat 203 to rise synchronously until the lifting seat 203 moves to the position of the connecting sleeve 202. At this time, as the lifting seat 203 continues to rise, the connecting sleeve 202 will conflict with the placement seat 201 that has been flipped over. The sealing gaskets 206 provided on both sides of the connecting sleeve 202 can ensure that the connecting sleeve The sealing of the inner side of 202 is improved, and the bonding between the shell and the chip is completed by rising the lifting seat 203. At the same time, in order to control the bubbles in the glue, the user can vacuum the inner side of the connecting sleeve 202 through the exhaust pipe 205 connected to the vacuum pump 208 to change the air pressure in the connecting sleeve 202. Since the internal space of the connecting sleeve 202 is small, a sealed environment can be quickly formed by rising the lifting seat 203, which can conveniently provide good packaging effects for different types of chips. In order to ensure the accuracy of the chip packaging process, a plurality of placement slots 301 for chip placement are provided on the placement seat 201. At the same time, the user can rotate the adjustment rod 302 on the side to drive the shaft through the transmission effect of the bevel gear 303. 304 is rotated, and multiple threaded sleeves 305 on the shaft 304 are respectively threadedly connected with the limit blocks 306 in different placement grooves 301. Since the threads on both sides of the threaded sleeve 305 are in opposite directions, the distance between the limit blocks 306 can be adjusted as the threaded sleeve 305 is rotated, which is convenient for the packaging operation of chips of different specifications. A clamping rod 406 is also provided on both sides of the placement seat 201. The two clamping rods 406 are kept in a clamping state by the connecting rod 403 and the traction block 401 on the bottom side. When placing the chip, the user can rotate the rotary block 404 located in the middle of the placement seat 201. The cam structure on the bottom side of the rotary block 404 pushes the resisting slide 407 to make the clamping rods 406 on both sides open, and the rotary block 404 and the placement The first torsion spring 405 is connected between the seats 201. When the user releases the rotary block 404, the clamping rod 406 can push the chip to the middle position of the placement slot 301. At the same time, due to the "L"-shaped structure at the end of the clamping rod 406, the chip can be prevented from falling out. In order to facilitate the control of the clamping rod 406 by the rotary block 404, when the user rotates the rotary block 404 ninety degrees, the clamping rod 406 will be fully opened. At this time, the placement slot 301 is fully opened. At the same time, the locking block 504 on the locking plate 501 will also be engaged with the locking hole 503 on the rotary block 404, thereby fixing the position of the clamping rod 406, making it convenient for the user to extract or place the chip. After the placement is completed, the user can press the release lever 505 in the middle of the rotary block 404.The square part at the end of the release rod 505 disengages from the rotary block 404, and the locking block 504 disengages from the locking hole 503. Under the action of the first torsion spring 405, the rotary block 404 rotates, thereby releasing the clamping rods 406 on both sides to clamp the chip in the middle, which is convenient for operation. After the chip is fixed in the placement groove 301 on the placement seat 201, the user can rotate the drive shaft through the motor installed on the side of the operating table 1. At this time, the drive shaft will drive the inner slide 601 with the same threaded connection to slide to the other side of the limiting slide groove 607. During this process, the end of the placement seat 201 will be The "human" shaped structure slides in the guide groove 606, and at the same time, combined with the traction effect of the fourth spring 604 on the pulling slider 602 at the end of the placement seat 201, the placement seat 201 can be turned 180 degrees, which is convenient for sealing the chip through the connecting sleeve 202. After completing the setting of the placement seat 201, the user needs to place the positioning plate 706 that matches the shell specifications on the surface of the pressure plate 702, and then place the shell to be connected on the inner side of the positioning plate 706 to ensure the accuracy of the packaging. The user can then turn the adjusting screw located in the middle of the lifting seat 203 to ensure the accuracy of the packaging. The rod 705 adjusts the height of the inner threaded plate 704 to change the elastic state of the fifth spring 703, thereby adjusting the pressure applied to the shell during the bonding process to ensure the firmness of the bonding. During this process, for the convenience of operation, the user can rotate the lifting seat 203 at a small angle between the rotating blocks 708 on both sides, wherein the limiting arc groove 710 will limit the maximum rotation angle of the lifting seat 203, and the second torsion spring 709 will restore the position of the lifting seat 203. After the adjustment is completed, the lifting seat 203 returns to the vertical state, and the push plate 20 is pushed by the hydraulic rod on the bottom side. 4 continues to lift, and the rotating blocks 708 and slide posts 707 on both sides of the lifting plate will slide in the side slide grooves 701 until the lifting seat 203 contacts the lower surface of the connecting sleeve 202. The lifting seat 203 continues to rise, and eventually the two ends of the connecting sleeve 202 will tightly contact the placement seat 201 and the lifting seat 203 respectively through the sealing gasket 206, achieving a sealed environment at the packaging position. On the other hand, in order to reduce bubbles inside the colloid, the user can also use the vacuum pump 208 to evacuate the inside of the connecting sleeve 202 and control the air pressure therein to ensure the chip packaging effect.

[0058] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0059] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A high-speed VCSEL semiconductor chip packaging device with adjustable internal air pressure, characterized in that: It comprises an operating table (1), wherein a bonding structure (2) is provided in the middle of the operating table (1); The bonding structure (2) comprises a seating seat (201), the middle part of the operating table (1) is rotatably connected to the seating seat (201), a lifting seat (203) is provided on the bottom side of the seating seat (201), a connecting sleeve (202) is provided between the lifting seat (203) and the seating seat (201), the connecting sleeve (202) and the lifting seat (203) are both slidably connected to the middle part of the operating table (1), a push plate (204) is provided on the bottom side of the lifting seat (203), the seating seat (201), the connecting sleeve (202) and the seating seat (201) are of equal width, the top and bottom ends of the connecting sleeve (202) are fixedly connected to sealing gaskets (206), and an exhaust pipe (205) is installed on the side of the connecting sleeve (202).

2. The high-speed VCSEL semiconductor chip packaging device with adjustable internal air pressure according to claim 1, characterized in that: A vacuum pump (208) is installed on the side of the operating table (1), the end of the exhaust pipe (205) passes through the operating table (1) and is connected to the vacuum pump (208), and a first spring (207) is fixedly connected between the two ends of the connecting sleeve (202) and the operating table (1).

3. The high-speed VCSEL semiconductor chip packaging device with adjustable internal air pressure according to claim 1, characterized in that: The bonding structure (2) is provided with a positioning structure (3), and the positioning structure (3) includes a placement groove (301). The top side of the placement seat (201) is provided with multiple placement grooves (301). The placement seat (201) is slidably connected to a limit block (306) on both sides of the placement groove (301). The inner side of the placement seat (201) is rotatably connected to a shaft (304). The shaft (304) is fixedly connected with multiple threaded sleeves (305). The thread directions of the two sides of the threaded sleeve (305) are opposite, and the two sides of the threaded sleeve (305) are respectively threadedly connected to two limit blocks (306) provided in the same placement groove (301). The top side of the placement seat (201) is rotatably connected to an adjustment rod (302). The end of the shaft (304) is fixedly connected to a bevel gear (303). The side surface of the bevel gear (303) is meshed with the end of the adjustment rod (302).

4. The high-speed VCSEL semiconductor chip packaging device with adjustable internal air pressure according to claim 1, characterized in that: A clamping structure (4) is provided on the inner side of the bonding structure (2), and the clamping structure (4) includes a clamping rod (406). A clamping rod (406) is slidably connected to each of the two sides of the placement seat (201). The ends of the clamping rod (406) are in an "L"-shaped structure. The sides of the clamping rod (406) are rotatably connected to two connecting rods (403). The ends of the connecting rods (403) located on the same side of the two clamping rods (406) are rotatably connected to a traction block (401). The ends of the traction block (401) are slidably connected to the placement seat (201), and a second spring (402) is fixedly connected between the traction block (401) and the placement seat (201).

5. The high-speed VCSEL semiconductor chip packaging device with adjustable internal air pressure according to claim 4, characterized in that: The middle part of the seating seat (201) is rotatably connected to a rotary block (404), a first torsion spring (405) is fixedly connected between the rotary block (404) and the seating seat (201), the bottom side of the rotary block (404) is a cam-shaped structure, the middle part of the clamping rod (406) is fixedly connected to a contact slide (407), the contact slide (407) is slidably connected to the inner side of the seating seat (201), and the side surfaces of the rotary block (404) respectively contact the contact slides (407) on both sides.

6. The high-speed VCSEL semiconductor chip packaging device with adjustable internal air pressure according to claim 5, characterized in that: The clamping structure (4) is connected to a release structure (5), and the release structure (5) includes a release rod (505). The middle part of the rotary block (404) is slidably connected to the release rod (505). The bottom end of the release rod (505) is a square structure. The bottom end of the release rod (505) is fixedly connected to a locking plate (501). A third spring (502) is fixedly connected between the locking plate (501) and the placement seat (201). A locking block (504) is respectively provided on the locking plate (501) on both sides of the release rod (505). A locking hole (503) is opened on the rotary block (404). The locking block (504) is engaged with the rotary block (404) through the locking hole (503).

7. The high-speed VCSEL semiconductor chip packaging device with adjustable internal air pressure according to claim 1, characterized in that: A flip structure (6) is connected between the operating table (1) and the bonding structure (2), and the flip structure (6) includes a limiting slide groove (607). A limiting slide groove (607) is provided on one side of the operating table (1). The operating table (1) is slidably connected to an inner slide plate (601) via the limiting slide groove (607). A driving screw rod (605) is threadedly connected to one side of the inner slide plate (601). The driving screw rod (605) is rotatably connected to the operating table (1). A "manual" is provided on the inner slide plate (601). The guide groove (606) of the ''-shaped structure is provided, the end of the seating seat (201) is slidably connected to the inner slide plate (601) through the guide groove (606), the end of the seating seat (201) is rotatably connected to the pulling slider (602), the middle of the pulling slider (602) is slidably connected to the side sliding rod (603), a fourth spring (604) is fixedly connected between the side sliding rod (603) and the pulling slider (602), and the end of the side sliding rod (603) is slidably connected to the inner slide plate (601).

8. The high-speed VCSEL semiconductor chip packaging device with adjustable internal air pressure according to claim 1, characterized in that: The bottom side of the operating table (1) is provided with a resistance structure (7), and the resistance structure (7) includes a threaded plate (704), the inner side of the lifting seat (203) is slidably connected to the threaded plate (704), the middle part of the threaded plate (704) is threadedly connected to an adjusting screw (705), the adjusting screw (705) is rotatably connected to the lifting seat (203), the top side of the lifting seat (203) is slidably connected to a pressure plate (702), a fifth spring (703) is fixedly connected between the pressure plate (702) and the threaded plate (704), and a positioning plate (706) is provided on the pressure plate (702).

9. The high-speed VCSEL semiconductor chip packaging device with adjustable internal air pressure according to claim 8, characterized in that: The two ends of the lifting seat (203) are respectively fixedly connected to a sliding column (707), and the two sides of the end of the sliding column (707) are planar structures. A rotating block (708) is rotatably connected to the sliding column (707), and a second torsion spring (709) is fixedly connected between the rotating block (708) and the lifting seat (203). A limiting arc groove (710) is provided on the side of the rotating block (708), and the rotating block (708) is slidably connected to the lifting seat (203) through the limiting arc groove (710). A side sliding groove (701) is provided on the side of the operating table (1), and the rotating block (708) and the sliding column (707) are both slidably connected to the operating table (1) through the side sliding groove (701).

10. The method for operating a high-speed VCSEL semiconductor chip packaging device with adjustable internal air pressure according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1: First, the adhesive structure (2) on the operating table (1) can provide a sealed environment with a rapidly adjustable air pressure for the chip to be glued, thereby ensuring the air pressure environment during the bonding process according to the type of chip to control bubbles in the glue; S2: After the chip is placed on the mounting seat (201), the positioning structure (3) and the clamping structure (4) can be used to fix the chip according to the chip specifications to ensure the accuracy of glue dispensing and subsequent bonding. The release structure (5) can be used to conveniently control the clamping structure (4), thereby facilitating the inversion of the chip and subsequent packaging with the shell; S3: After the chip is placed, the direction of the chip can be flipped through the flip structure (6), so that the operating position can be sealed through the connecting sleeve (202), thereby achieving the adjustment of the air pressure of the bonding environment. The push of the push plate (204) allows the bonding structure (2) to complete a tight contact connection. At the same time, the contact structure (7) can apply appropriate pressure between the shell and the chip glue surface to promote the bonding between the two. Combined with the adjustment of the air pressure, the bubbles in the glue can be effectively controlled to ensure a tight connection between the shell and the chip and to ensure good thermal conductivity and protection effects.

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