Syringes, bushings, process kits, process chambers and related methods for gas flow in batch processing for semiconductor manufacturing

Abstract

Embodiments of the present disclosure relate to syringes, bushings, process kits, process chambers, and related methods for batch processing of gas flow in operations. In one or more embodiments, the liner facilitates airflow uniformity in batch processing. In one or more embodiments, a liner includes a plurality of inlet openings on an inlet side, the plurality of inlet openings extending into an outer face of the liner. The plurality of inlet openings includes a plurality of first inlet openings including a first column extending into the first side and a second column extending into the second side. The plurality of inlet openings includes a plurality of second inlet openings extending between the inner face and the outer face. The liner includes one or more outlet openings on an outlet side. The outlet side is opposite the inlet side. The one or more outlet openings extend into the inner face.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to injectors, bushings, process kits, process chambers, and related methods for gas flow in batch processing operations. In one or more embodiments, the bushing promotes gas flow uniformity in batch processing. Background Art

[0002] Semiconductor substrates are processed for a variety of applications, including the fabrication of integrated devices and microdevices. One method of processing a substrate involves depositing a material, such as a semiconductor or conductive material, onto a substrate surface. For example, epitaxy is a deposition process that deposits films of various materials onto a substrate surface within a processing chamber.

[0003] Non-uniformities can exist during processing. For example, gas flow can be non-uniform (e.g., gas concentration, gas temperature, and / or flow rate). Non-uniformities can hinder control and adjustability, thermal uniformity, and deposition uniformity, such as center-to-edge film thickness uniformity. Relatively complex deposition operations can exacerbate these issues.

[0004] Therefore, there is a need for improved apparatus and methods that facilitate reliably providing gas flow in a manner that promotes gas flow uniformity. Summary of the Invention

[0005] Embodiments of the present disclosure relate to injectors, bushings, process kits, process chambers, and related methods for gas flow in batch processing operations.

[0006] In one or more embodiments, a process kit adapted for placement in a process chamber includes a syringe. The syringe includes an inner surface, an outer surface opposite the inner surface, and a plurality of first injection openings extending between the inner surface and the outer surface. The plurality of first injection openings include a first row of the first injection openings and a second row of the first injection openings. The syringe includes a plurality of second injection openings extending between the inner surface and the outer surface. The plurality of second injection openings are aligned between the first row and the second row of the first injection openings. The process kit includes a first bushing sized and shaped to be placed within the syringe. The first bushing includes an inner surface, an outer surface opposite the inner surface of the first bushing, a first side surface between the first bushing inner surface and the first bushing outer surface, and a second side surface between the first bushing inner surface and the first bushing outer surface. The second side surface is opposite the first side surface. The first bushing includes a plurality of inlet openings on an inlet side of the first bushing. The plurality of inlet openings extend into the inner surface and the first side surface of the first bushing. The first bushing includes one or more outlet openings on an outlet side of the first bushing, the outlet side being opposite the inlet side, and the one or more outlet openings extending into the inner surface of the first bushing. The process kit includes a second liner sized and shaped to be at least partially supported by the first liner. The second liner includes an inner face, an outer face opposite the inner face of the second liner, a first side face between the second liner inner face and the second liner outer face, and a second side face between the second liner inner face and the second liner outer face. The second side face of the second liner is opposite the first side face of the second liner. The second liner includes a plurality of inlet openings on an inlet side of the second liner. The plurality of inlet openings of the second liner extend into the outer face of the second liner. The second liner includes one or more outlet openings on an outlet side of the second liner, the outlet side of the second liner being opposite the inlet side of the second liner. The one or more outlet openings extend into the inner face of the second liner.

[0007] In one or more embodiments, a liner adapted for placement in a processing chamber includes an inner face, an outer face opposite the inner face, a first side face between the inner face and the outer face, and a second side face between the inner face and the outer face. The second side face is opposite the first side face. The liner includes a plurality of inlet openings on an inlet side, the plurality of inlet openings extending into the outer face. The plurality of inlet openings includes a plurality of first inlet openings, the first inlet openings including a first row extending into the first side face and a second row extending into the second side face. The plurality of inlet openings includes a plurality of second inlet openings extending between the inner face and the outer face. The liner includes one or more outlet openings on an outlet side. The outlet side is opposite the inlet side. The one or more outlet openings extend into the inner face.

[0008] In one or more embodiments, a processing chamber suitable for semiconductor manufacturing includes a chamber body comprising an interior volume and an injector. The injector includes an inner face, an outer face opposite the inner face, and a plurality of first injection openings extending between the inner face and the outer face. The plurality of first injection openings include a first row of the first injection openings and a second row of the first injection openings. The injector includes a plurality of second injection openings extending between the inner face and the outer face. The plurality of second injection openings are aligned between the first row and the second row of the first injection openings. The processing chamber includes one or more heat sources configured to generate heat, and a substrate support assembly located in the interior volume. The substrate support assembly includes a plurality of lift pins and one or more substrate supports. The processing chamber includes a first bushing disposed within the injector. The first bushing includes an inner face, an outer face opposite the inner face of the first bushing, a first side face between the first bushing inner face and the first bushing outer face, and a second side face between the first bushing inner face and the first bushing outer face. The second side face is opposite the first side face. The first liner includes a plurality of inlet openings on the inlet side of the first liner, and the plurality of inlet openings extend into the inner surface and the first side surface of the first liner. The first liner includes one or more outlet openings on the outlet side of the first liner. The outlet side is opposite to the inlet side, and the one or more outlet openings extend into the inner surface of the first liner. The processing chamber includes a second liner at least partially supported by the first liner. The second liner includes an inner surface, an outer surface opposite to the inner surface of the second liner, a first side surface between the inner surface of the second liner and the outer surface of the second liner, and a second side surface between the inner surface of the second liner and the outer surface of the second liner. The second side surface of the second liner is opposite to the first side surface of the second liner. The second liner includes a plurality of inlet openings on the inlet side of the second liner. The plurality of inlet openings of the second liner extend into the outer surface of the second liner. The second liner includes one or more outlet openings on the outlet side of the second liner, and the outlet side of the second liner is opposite to the inlet side of the second liner. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] For a detailed understanding of the above-mentioned features of the present disclosure, a more detailed description of the present disclosure, briefly summarized above, may be obtained by reference to the embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that the drawings illustrate only exemplary embodiments and are therefore not to be considered limiting of its scope, which may admit to other equally effective embodiments.

[0010] Figure 1 is a schematic cross-sectional side view of a processing apparatus according to one or more embodiments.

[0011] Figure 2 According to one or more embodiments Figure 1 Schematic cross-sectional side view of the processing apparatus shown.

[0012] Figure 3According to one or more embodiments Figure 1 A schematic enlargement of the inlet side of the process plant is shown.

[0013] Figure 4 According to one or more embodiments Figure 1 A schematic enlarged view of the outlet side of the process plant is shown.

[0014] Figure 5 According to one or more embodiments Figure 1 Schematic partial top view of the processing equipment shown.

[0015] Figure 6 According to one or more embodiments Figure 1 Schematic fragmentary axonometric view of the inlet side of the process plant shown.

[0016] Figure 7 According to one or more embodiments Figure 1 Schematic partial axonometric cross-section of the inlet side of the process plant is shown.

[0017] Figure 8 According to one or more embodiments Figure 1 Schematic partial cross-sectional side view of the cross-flow side of the process equipment shown.

[0018] Figure 9 According to one or more embodiments Figure 1 Schematic partial cross-sectional side view of the cross-flow side of the process equipment shown.

[0019] Figure 10 According to one or more embodiments Figure 1 Schematic partial cross-sectional axonometric view of the processing apparatus shown.

[0020] Figure 11 According to one or more embodiments Figures 1 to 10 A schematic top axonometric view of the first bushing is shown.

[0021] Figure 12 According to one or more embodiments Figures 1 to 10 A schematic bottom isometric view of the first bushing is shown.

[0022] Figure 13 According to one or more embodiments Figures 1 to 10 A schematic top axonometric view of the second bushing is shown.

[0023] Figure 14 According to one or more embodiments Figures 1 to 10 A schematic bottom isometric view of the second bushing is shown.

[0024] Figure 15According to one or more embodiments Figures 1 to 10 A schematic top axonometric view of the third bushing is shown.

[0025] Figure 16 According to one or more embodiments Figures 1 to 10 A schematic bottom isometric view of the third bushing is shown.

[0026] Figure 17 According to one or more embodiments Figure 1 Schematic fragmentary axonometric view of the outlet side of the process plant shown.

[0027] Figure 18 According to one or more embodiments Figure 17 Schematic fragmentary axonometric view of the inlet side of the process plant shown.

[0028] Figure 19 According to one or more embodiments Figure 5 Schematic partial elevation view of the syringe shown.

[0029] Figure 20 is a schematic enlarged view of the inlet side of a processing device according to one or more embodiments.

[0030] Figure 21 According to one or more embodiments Figure 20 A schematic enlarged view of the outlet side of the treatment unit is shown.

[0031] Figure 22 According to one or more embodiments Figure 20 and 21 Schematic partial cross-sectional side view of the cross-flow side of the process plant is shown.

[0032] Figure 23 is a schematic block diagram of a method for processing a substrate for semiconductor manufacturing according to one embodiment.

[0033] To facilitate understanding, identical reference numerals have been used, where possible, to designate elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation. DETAILED DESCRIPTION

[0034] Embodiments of the present disclosure relate to liners, process kits, process chambers, and related methods for gas flow in batch processing operations. In one or more embodiments, the liner promotes gas flow uniformity in batch processing.

[0035] The present disclosure contemplates that terms such as "couples," "coupling," "couple," and "coupled" may include, but are not limited to, welding, fusing, melting together, interference fitting, and / or fastening, such as by using bolts, threaded connections, pins, and / or screws. The present disclosure contemplates that terms such as "couples," "coupling," "couple," and "coupled" may include, but are not limited to, integrally formed. The present disclosure contemplates that terms such as "couples," "coupling," "couple," and "coupled" may include, but are not limited to, direct coupling and / or indirect coupling, such as through components such as connecting rods, blocks, and / or frames.

[0036] Figure 1 FIG is a schematic cross-sectional side view of a processing device 100 according to one embodiment. For visual clarity, Figure 1 Not shown Figure 2 The processing apparatus 100 includes a processing chamber having a chamber body 130 defining an interior volume 124. The processing apparatus 100 includes a plate 109 disposed in the interior volume and at least partially defining a processing volume 128 of the interior volume 124. The plate 109 will be discussed further below.

[0037] The cassette 1030 is located in the processing volume 128 and is at least partially supported by a substrate support assembly 119 (such as a pedestal assembly). The cassette 1030 includes a cassette plate 1032 and multiple levels that support multiple substrates 107 for simultaneous processing (e.g., epitaxial deposition). The present disclosure contemplates that the cassette plate 1032 may be omitted. Figure 1 In the illustrated embodiment, the cassette 1030 supports three substrates 107. The cassette 1030 may support other numbers of substrates, including, but not limited to, two substrates 107, four substrates 107, six substrates 107, or eight substrates 107. In one or more embodiments, the cassette 1030 supports two substrates 107 or three substrates 107. The processing apparatus 100 includes an upper window 116, such as a dome, disposed between the lid 104 and the processing volume 128.

[0038] The processing apparatus 100 includes a lower window 115 disposed below a processing volume 128. One or more upper heat sources 106 are located above the processing volume 128 and the upper window 116. The one or more upper heat sources 106 can be radiant heat sources, such as lamps, for example, halogen lamps. The one or more upper heat sources 106 are disposed between the upper window 116 and the lid 104. The upper heat sources 106 are positioned to provide uniform heating to the substrate 107. One or more lower heat sources 138 are located below the processing volume 128 and the lower window 115. The one or more lower heat sources 138 can be radiant heat sources, such as lamps, for example, halogen lamps. The lower heat sources 138 are disposed between the lower window 115 and the floor 134 of the interior volume 124. The lower heat sources 138 are positioned to provide uniform heating to the substrate 107.

[0039] The present disclosure contemplates that other heat sources may be used in addition to or in place of the various heat sources described herein. For example, resistive heaters, light emitting diodes (LEDs), and / or lasers may be used in the various heat sources described herein.

[0040] Infrared radiation can penetrate upper window 116 and lower window 115 and / or plate 109, for example, transmitting at least 80% (e.g., at least 95%) of the infrared radiation. Upper window 116 and lower window 115 and / or plate 109 can be formed from a quartz material, such as clear quartz. In one or more embodiments, upper window 116 includes an inner window 193 and an outer window support 194. Inner window 193 can be a thin quartz window. Outer window support 194 supports inner window 193 and is at least partially seated within a support groove. In one or more embodiments, lower window 115 includes an inner window 187 and an outer window support 188. Inner window 187 can be a thin quartz window. Outer window support 188 supports inner window 187.

[0041] The substrate support assembly 119 is disposed in the processing volume 128. A plurality of bushings 307, 330, 350, 380 (hereinafter referred to as Figure 3 and 4The liner 307, 330, 350, 380 is disposed in the processing volume 128 and surrounds the substrate support assembly 119. The liner 307, 330, 350, 380 facilitates protecting the chamber body 130 from process chemistry in the processing volume 128. The chamber body 130 includes one or more sidewalls disposed at least partially between the upper window 116 and the lower window 115. The liner 307, 330, 350, 380 is disposed between the processing volume 128 and the chamber body 130. In one or more embodiments, the liner 307, 330, 350, 380 is formed from one or more of quartz (such as transparent quartz, e.g., clear quartz, opaque quartz, and / or black quartz), silicon carbide (SiC), and / or graphite coated with SiC.

[0042] The processing apparatus 100 includes a flow guiding structure 150 having one or more flow diverters 111 located outside the cartridge 1030 . Figure 1 Three flow dividers 111 are shown in FIG. Other numbers of flow dividers 111, such as two or four, may be used. The flow guide structure 150 divides the processing volume into a plurality of flow levels 153 ( Figure 1 In one or more embodiments, the flow guiding structure 150 includes at least two (such as at least three) flow levels 153 .

[0043] The flow guide structure 150 and / or the box 1030 are made of one or more of quartz (such as transparent quartz, for example, clear quartz, opaque quartz and / or black quartz), silicon carbide (SiC), or graphite coated with SiC.

[0044] Portions of the flow guiding structure 150 (eg, one or more flow splitters 111) may each serve as a preheating ring for each flow stage 153. The one or more flow splitters 111 may be referred to as one or more preheating rings.

[0045] As described below, the present disclosure contemplates that the flow directing structure 150 may be omitted.

[0046] The substrate support assembly 119 includes a first support frame 199 and a second support frame 198, with the second support frame 198 being at least partially positioned around the first support frame 199. The first support frame 199 includes arms coupled to the cassette 1030 such that raising and lowering the first support frame 199 raises and lowers the cassette 1030. A plurality of lift pins 189 are suspended from the cassette 1030. Lowering the cassette 1030 and / or raising the second support frame 198 causes the lift pins 189 to contact the arms of the second support frame 198. Continued lowering of the cassette 1030 and / or raising of the second support frame 198 causes the lift pins 189 to contact substrates in the cassette 1030, causing the lift pins 189 to lift the substrates in the cassette 1030. The bottom region 105 of the processing apparatus 100 is defined between the base plate 134 and the cassette 1030.

[0047] The first shaft 126 of the first support frame 199, the second shaft 125 of the second support frame 198, and the portion 151 of the lower window 115 extend through ports formed in the bottom 135 and the base plate 134 of the chamber body 130. Each shaft 125, 126 is coupled to one or more corresponding motors 164, which are configured to independently raise, lower, and / or rotate the cassette 1030 using the first support frame 199, and independently raise and lower the lift pins 189 using the second support frame 198. The first support frame 199 includes a first shaft 126 and a plurality of first arms 1021 configured to support the cassette 1030, which includes one or more substrate supports 112. The cassette 1030 includes a plurality of mounting posts 1081 that support the arcuate substrate supports 112. The second support frame 198 includes a second shaft 125 and a plurality of second arms 1022 configured to interface with and support the lift pins 189. The bellows assembly 158 surrounds and encloses a portion of the shafts 125 , 126 disposed outside of the chamber body 130 to facilitate reducing or eliminating vacuum leaks outside of the chamber body 130 .

[0048] The processing apparatus 100 may include one or more sensors 191, 192, 282, such as temperature sensors (e.g., optical pyrometers) or other metrology sensors that measure the temperature (or other parameters) within the processing apparatus 100 (e.g., the surface of the upper window 116, the surface of the plate assembly 300, and / or the temperature on one or more surfaces of the substrate 107, the flow guide structure 150, and / or the box 1030). The one or more sensors 191, 192 are disposed on the lid 104. Figure 2 One or more sensors 282 (eg, lower pyrometers) are shown disposed on the underside of the lower window 115. The one or more sensors 282 may be disposed near and / or on the bottom 135 of the chamber body 130.

[0049] In one or more embodiments, the upper sensors 191, 192 are oriented toward the top of the cassette 1030, the top of the plate 109, and / or the flow-guiding structure 150. In one or more embodiments, the side sensor 281 (e.g., a side temperature sensor) is oriented toward the substrate support 112 of the cassette 1030. In one or more embodiments, the lower sensor 282 is oriented toward the bottom of the cassette 1030 (e.g., the lower surface of the cassette plate 1032), the bottom of the plate 109, and / or the bottom of the flow-guiding structure 150.

[0050] The processing apparatus 100 includes a controller 1070 configured to control the processing apparatus 100 or its components. For example, the controller 1070 can control the operation of the components of the processing apparatus 100 by directly controlling the components or by controlling controllers associated with the components. In operation, the controller 1070 can collect data and feedback from the corresponding chambers to coordinate and control the performance of the processing apparatus 100.

[0051] Controller 1070 typically includes a central processing unit (CPU) 1071, memory 1072, and support circuits 1073. CPU 1071 can be any general-purpose processor suitable for use in an industrial environment. Memory 1072, or non-transitory computer-readable media, is accessible by CPU 1071 and can be one or more of the following: random access memory (RAM), read-only memory (ROM), a floppy disk, a hard disk, or any other form of local or remote digital memory. Support circuits 1073 are coupled to CPU 1071 and may include cache memory, clock circuits, input / output subsystems, power supplies, and the like.

[0052] The various methods (such as method 2300) and operations disclosed herein can generally be implemented as, for example, software routines, under the control of CPU 1071 by CPU 1071 executing computer instruction code stored in memory 1072 (or memory of a particular processing chamber). When the computer instruction code is executed by CPU 1071, CPU 1071 controls the components of processing apparatus 100 to perform operations according to the various methods and operations described herein. In one embodiment, which may be combined with other embodiments, memory 1072 (a non-transitory computer-readable medium) includes instructions stored therein that, when executed, enable the methods (such as method 2300) and operations (such as operations 2302-2312) described herein to be performed. For example, controller 1070 may communicate with a heat source, a gas source, and / or a vacuum pump of processing apparatus 100 to perform various operations.

[0053] Figure 2 According to one or more embodiments Figure 1 A schematic cross-sectional side view of processing apparatus 100 is shown. Figure 2 The cross-sectional view shown is relative to Figure 1 The cross-sectional view is shown rotated 55 degrees.

[0054] The processing apparatus 100 includes one or more side heat sources 118a, 118b (e.g., side lamps, side resistive heaters, side light emitting diodes, and / or side lasers) located outside the processing volume 128. The one or more second side heat sources 118b are located across the processing volume 128 opposite the one or more first side heat sources 118a.

[0055] For visual clarity, Figure 2 The flow guide structure 150 is not shown. In addition, the present disclosure contemplates that Figures 1 to 2 The flow guide structure 150 is omitted from the illustrated processing apparatus 100. In this embodiment, process gases and / or purge gases flow from the liners 330, 350, 380 into the outer annulus of the processing volume 128, then into the openings 216 between and outside the substrate supports 112 (e.g., arched supports) of the cassette 1030, and then into the gaps between the substrates 107. One or more process gases P1 flow out of the gaps, into the openings 216 on the exhaust side of the substrates 107 (between and outside the substrate supports 112), into the outer annulus of the processing volume 128, and out of the processing volume 128 through the liners 330, 350, 380. The present disclosure also contemplates that multiple lines (e.g., conduits) in the processing volume 128 may connect each of the liners 330, 350, 380 to each of the inlet openings of the cassette 1030.

[0056] In addition to the one or more sensors 191, 192 located above the processing volume 128 and above the second shielding plate 1062, the processing apparatus 100 may also include one or more sensors 281, such as temperature sensors (e.g., optical pyrometers) or other metrology sensors that measure the temperature (or other parameters) within the processing apparatus 100 (e.g., the temperature of the surface of the upper window 116, the surface of the plate 109 and / or the substrate 107, the plurality of windows 257, and / or one or more surfaces of the box 1030). The plurality of windows 257, if used, may be disposed in gaps between one or more of the liners 307, 330, 350, 380, or formed in such liners. The one or more sensors 281 are side sensors (e.g., side pyrometers) that are located outside the processing volume 128, outside the flow guide structure 150, and outside the plurality of windows 257. The one or more sensors 281 may, for example, be radially aligned with the plurality of windows 257 (e.g., Figure 2 shown).

[0057] One or more side sensors 281, such as one or more pyrometers, may be used to measure the temperature within the processing volume 128 from various sides of the processing volume 128. The side sensors 281 are arranged in multiple sensor levels ( Figure 2(Three sensor levels are shown in FIG. 1 ). In one or more embodiments, the number of sensor levels is equal to the number of heat source levels. Each side sensor 281 can be oriented horizontally or can be oriented (e.g., oriented downward at an angle) toward the substrate 107 and substrate support 112 at a corresponding level in the cassette 1030.

[0058] The present disclosure contemplates that the side heat sources 118a, 118b, the window 257, and / or the side sensor 281 may be omitted.

[0059] Figure 3 According to one or more embodiments Figure 1 A schematic enlarged view of the inlet side of the treatment plant 100 is shown.

[0060] The chamber body 130 includes a base 302 (such as a base ring). The base 302 can be rectangular or circular in shape. The insert 301 is partially positioned through the base 302. The processing kit includes a syringe 310 at least partially supported by the base 302. The syringe 310 includes an inner surface 311 and an outer surface 312 opposite the inner surface 311. The syringe 310 includes a plurality of first injection openings 313 extending between the inner surface 311 and the outer surface 312. The plurality of first injection openings 313 include a first column 314 of first injection openings 313 and a second column 315 of first injection openings 313. The syringe 310 includes a plurality of second injection openings 316 extending between the inner surface 311 and the outer surface 312. The plurality of second injection openings 316 are aligned between the first column 314 and the second column 315 of first injection openings 313. In one or more embodiments, the first injection openings 313 and the second injection openings 316 each include a hole. The syringe 310 includes an annular body 317, such as having the shape of a circular ring or a rectangular ring (e.g. Figure 5 In one or more embodiments, the syringe 310 can be referred to as an injection loop.

[0061] The processing kit includes a first bushing 330 sized and shaped to fit within the interior of the syringe 310 . The first bushing 330 is at least partially supported by the insert 301 . The first bushing 330 includes an inner face 331 and an outer face 332 opposite the inner face 331 of the first bushing 330 . The first bushing 330 includes a first side 333 positioned between the inner face 331 of the first bushing 330 and the outer face 332 of the first bushing 330 . The first bushing 330 includes a second side 334 positioned between the inner face 331 of the first bushing 330 and the outer face 332 of the first bushing 330 . The second side 334 is opposite the first side 333 . The first bushing 330 includes a plurality of inlet openings 335 on an inlet side of the first bushing 330 . The plurality of inlet openings 335 extend into the inner face 331 and the second side 334 of the first bushing 330 . In one or more embodiments, the inlet openings 335 of the first bushing 330 include grooves. The first bushing 330 includes an annular body 337, such as a circular ring (e.g. Figure 11 and 12 shown) or rectangular ring.

[0062] The process kit includes a second liner 350 sized and shaped to be at least partially supported by the first liner 330. The second liner 350 includes an inner surface 351 and an outer surface 352 opposite the inner surface 351 of the second liner 350. The second liner 350 includes a first side 353 located between the inner surface 351 of the second liner 350 and the outer surface 352 of the second liner 350. The second liner 350 includes a second side 354 located between the inner surface 351 of the second liner 350 and the outer surface 352 of the second liner 350. The second side 354 of the second liner 350 is opposite the first side 353 of the second liner 350. The second liner 350 includes a plurality of inlet openings 355 on an inlet side of the second liner 350. The plurality of inlet openings 355 of the second liner 350 extend into the outer surface 352 of the second liner 350.

[0063] In one or more embodiments, the plurality of inlet openings 355 of the second bushing 350 includes a first column 361 that extends into the first side 353 of the second bushing 350 and is configured (e.g., sized, shaped, and positioned along the second bushing 350) to align with the first column 314 of the first injection openings 313 of the syringe 310. In one or more embodiments, the plurality of inlet openings 355 of the second bushing 350 includes a second column 362 that extends into the second side 354 of the second bushing 350 and is configured (e.g., sized, shaped, and positioned along the second bushing 350) to align with the second column 315 of the first injection openings 313 of the syringe 310. In one or more embodiments, the inlet openings 355, including the first and second rows 361 and 362, are a plurality of first inlet openings, and the second bushing 350 includes a plurality of second inlet openings 363 extending between the inner face 351 of the second bushing 350 and the outer face 352 of the second bushing 350. The first row 361 of the plurality of first inlet openings 355 of the second bushing 350 includes a first groove extending into the outer face 352 and the first side 353 of the second bushing 350. The second row 362 of the plurality of first inlet openings 355 of the second bushing 350 includes a second groove extending into the outer face 352 and the second side 354 of the second bushing.

[0064] The plurality of second inlet openings 363 of the second bushing 350 are configured (eg, sized, shaped, and positioned along the second bushing 350) to align with the second injection opening 316 of the syringe 310. The second bushing 350 includes an annular body 357, such as a circular ring (eg, Figure 13 and 14 shown) or rectangular ring.

[0065] The process kit includes a third bushing 380 sized and shaped to be at least partially supported by the second bushing 350 . The third bushing 380 includes an inner surface 381 and an outer surface 382 opposite the inner surface 381 of the third bushing 380 . The third bushing 380 includes a first side 383 located between the inner surface 381 of the third bushing 380 and the outer surface 382 of the third bushing 380 , and a second side 384 located between the inner surface 381 of the third bushing 380 and the outer surface 382 of the third bushing 380 . The second side 384 of the third bushing 380 is opposite the first side 383 of the third bushing 380 . The second side 384 of the third bushing 380 includes a tapered section 385 . The third bushing 380 includes a plurality of inlet openings 386 on an inlet side of the third bushing 380 . The plurality of inlet openings 386 of the third bushing 380 extend into the first side 383 of the third bushing 380 . The plurality of inlet openings 386 of the third bushing 380 extend into the inner face 381 of the third bushing 380. In one or more embodiments, the plurality of inlet openings 386 of the third bushing 380 comprise grooves. The third bushing 380 comprises an annular body 390, such as a circular ring (e.g., Figure 15 and 16 shown) or rectangular ring.

[0066] The first, second, and third bushings 330, 350, and 380 are stacked vertically on top of each other. In one or more embodiments, the inner diameters of the bushings 330, 350, and 380 are substantially equal to each other (e.g., within 10% or less). The inner diameters of the bushings 330, 350, and 380 are defined by the inner faces 331, 351, and 381. In one or more embodiments, the outer diameters of the bushings 330, 350, and 380 are substantially equal to each other (e.g., within 10% or less). The outer diameters of the bushings 330, 350, and 380 are defined by the outer faces 332, 352, and 382.

[0067] The insert 301 and the base 302 can each include transfer openings 303 and 304 for transferring substrates therethrough. The openings 303 and 304 can be used to transfer substrates 107 into and out of the cartridge 1030, for example, into and out of the interior volume 124. In one or more embodiments, the openings 303 and 304 comprise slit valves. In one or more embodiments, the openings 303 and 304 can be connected to, interfaced with, or form part of any suitable valve capable of passing a substrate therethrough. The openings 303 and 304 are shown open and can be closed (e.g., using slit valves). In one or more embodiments, a first cover 398 covers the cooling channel 397 formed in the injector 310, while a second cover 396 covers the cooling channels 394 and 395 formed in the injector 310 and the base 302.

[0068] Figure 4According to one or more embodiments Figure 1 A schematic enlarged view of the outlet side of the treatment plant 100 is shown.

[0069] The first bushing 330 includes one or more outlet openings 336 on the outlet side of the first bushing 330. The outlet side is opposite the inlet side. The one or more outlet openings 336 extend into the inner face 331 of the first bushing 330. The one or more outlet openings 336 of the first bushing 330 include a groove section 338 extending into the inner face 331 of the first bushing 330. The one or more outlet openings 336 include a channel section 339 extending into the groove section 338.

[0070] The second bushing 350 includes one or more outlet openings 356 on the outlet side of the second bushing 350. The outlet side of the second bushing 350 is opposite the inlet side of the second bushing 350. The one or more outlet openings 356 of the second bushing 350 extend into the inner face 351 of the second bushing 350. The one or more outlet openings 356 of the second bushing 350 include a channel section 365 extending between the first side 353 and the second side 354 of the second bushing 350. The one or more outlet openings 356 of the second bushing 350 include a bore section 366 extending between the inner face 351 of the second bushing 350 and the channel section 365 of the second bushing 350.

[0071] The third bushing 380 includes one or more outlet openings 387 on the outlet side of the third bushing 380. The outlet side of the third bushing 380 is opposite the inlet side of the third bushing 380. The one or more outlet openings 387 of the third bushing 380 extend into the inner face 381 of the third bushing 380. The one or more outlet openings 387 of the third bushing 380 extend into the first side 383 of the third bushing 380. In one or more embodiments, the one or more outlet openings 387 of the third bushing 380 include a groove section 388 that extends into the inner face 381 and the first side 383 of the third bushing 380.

[0072] The insert 301 and the base 302 can each include transfer openings 303, 304 for transferring substrates therethrough. The openings 303, 304 can be used to transfer substrates 107 into and out of the cassette 1030, for example, into and out of the interior volume 124. In one or more embodiments, the openings 303, 304 comprise slit valves. In one or more embodiments, the openings 303, 304 can be connected to, interfaced with, or formed as part of any suitable valve capable of passing a substrate therethrough.

[0073] During operation (such as during epitaxial deposition operation), a first gas flow P1 is supplied to the processing volume 128 via the external supply conduit system 122, and a second gas flow P2 is supplied to the processing volume 128 via the internal supply conduit system 121. The first gas flow P1 comprises one or more process gases, while the second gas flow P2 comprises one or more purge gases. The internal supply conduit system 121 and the external supply conduit system 122 include a plurality of gas boxes 117 mounted to the injector 310. The present disclosure contemplates the use of a variety of supply conduit systems and / or gas boxes.

[0074] The first gas flow P1 is supplied from one or more gas sources 196 through one or more valves 183 (e.g. Figure 1 ), and the second gas flow P2 is supplied by one or more purge gas sources 129 through one or more valves 182.

[0075] The inlet opening 335, the second inlet opening 363, and the inlet opening 386 are configured to direct the first gas flow P1 and the second gas flow P2 in a generally radially inward direction toward the box 1030. The flow of the one or more process gases P1 can be divided into a plurality of flow levels 153. In one or more embodiments, the plate 109 separates the processing volume 128 from the upper portion 131 of the interior volume 124. For at least the uppermost flow level 153 (or a single flow level 153 if a single flow level 153 is used), the one or more process gases P1 can be directed (through the use of the plate 109) along a streamlined flow path to reduce or eliminate flow diversion away from the uppermost substrate 107 (or a single substrate 107 if a single substrate 107 is used). The plate assembly 300 can promote more uniform flow of the one or more process gases P1 along the uppermost flow level 153 relative to other flow levels 153 below the uppermost flow level 153.

[0076] The processing equipment 100 includes a common exhaust box 1092 (such as Figure 1 ). The first airflow P1 and the second airflow P2 flow out of the interior volume 124 through the bushings 307, 330, 350, 380 and one or more exhaust passages 308. The first airflow P1 and the second airflow P2 flow out of the interior volume 124 through the bushings 307, 330, 350, 380 and the one or more exhaust passages 308. Figure 1 One or more pumping devices 197, such as one or more vacuum pumps, are shown flowing from one or more exhaust passages 308 and through the common exhaust box 1092. The one or more exhaust passages 308 are at least partially defined by one or more exhaust structures 399 (e.g., boxes) in fluid communication with the common exhaust box 1092.

[0077] The one or more process gases in the first gas flow P1 may include, for example, a purge gas, a cleaning gas, and / or a deposition gas. The deposition gas may include, for example, one or more reactive gases carried in one or more carrier gases. The one or more reactive gases may include, for example, a silicon- and / or germanium-containing gas (such as silane (SiH4), disilane (Si2H6), dichlorosilane (SiH2Cl2), and / or germane (GeH4)), a chlorine-containing etching gas (such as hydrogen chloride (HCl)), and / or a dopant gas (such as phosphine (PH3) and / or diborane (B2H6)). The one or more purge gases in the first gas flow P1 and / or the second gas flow P2 may include, for example, one or more of argon (Ar), helium (He), nitrogen (N2), hydrogen chloride (HCl), and / or hydrogen (H2).

[0078] The second gas flow P2 can be supplied to the processing volume 128 through the second liner 350 and can also be supplied to the bottom region 105 of the interior volume 124 (e.g., Figure 1 As shown, a purge gas inlet is formed in one or more sidewalls of the chamber body 130 (e.g., formed below or circumferentially outside the insert 301), and the purge gas inlet directs the second gas flow P2 in a generally radially inward direction. The one or more purge gases of the second gas flow P2 can be supplied from a purge gas source 129 (e.g., Figure 1 The second gas flow P2 in the bottom region 105 can be directed upward. During the film formation process, the substrate support assembly 119 is positioned to facilitate the flow of the second gas flow P2 in the bottom region 105 generally along a flow path through the back side of the cassette 1030. The second gas flow in the bottom region 105 passes through one or more purge gas outlets 309 formed in the lower liner 307, through one or more exhaust channels 305 in the lower liner 307, and exits the bottom region 105 through one or more exhaust channels 308.

[0079] exist Figure 3 and 4In the illustrated embodiment, the cassette 1030 includes three substrate supports 112, three flow dividers 111, and three substrates 107. In one or more embodiments, a first gas flow P1 supplied from a first liner 330 flows over the upper surface of the first substrate (lower substrate 107), a second gas flow P2 supplied from a second liner 350 flows over the upper surface of the second substrate (middle substrate 107), and a first gas flow P1 supplied from a third liner 380 flows over the upper surface of the third substrate (upper substrate 107). In this embodiment, the upper surfaces of the first substrate 107 (lower substrate 107) and the third substrate 107 (upper substrate 107) are treated (e.g., for deposition) by the first gas flow P1, while the upper surface of the second substrate 107 (middle substrate 107) is cleaned by the second gas flow P2. The second substrate 107 (middle substrate 107) acts as a barrier between the first substrate 107 (lower substrate 107) and the third substrate 107 (upper substrate 107). The present disclosure contemplates the use of other barriers in place of the second substrate 107 (intermediate substrate 107). The processing apparatus 100 facilitates modularization of gas flow paths to reduce or eliminate contamination from barriers, such as the second substrate 107. For example, the second gas flow P2 can be supplied to the second flow level 153, while the first gas flow P1 is supplied to the first and third flow levels 153, and the window gas flow WP1 is supplied to the upper portion 131.

[0080] exist Figure 3 and 4 In the illustrated embodiment, the first bushing 330 includes a flange 349 that supports the first flow divider 111 (lower flow divider 111), and the second bushing 350 includes two flanges 378 and 379 that respectively support the second flow divider 111 (middle flow divider 111) and the third flow divider 111 (upper flow divider 111). The third bushing 380 includes a flange 377 that supports the plate 109.

[0081] Figure 5 According to one or more embodiments Figure 1 A schematic partial top view of the processing device 100 is shown. Figure 1 The cross section shown is roughly along Figure 5 The cross section shown is taken from section 1-1. Figure 2 The cross section shown is roughly along Figure 5 The section shown is taken along section 2-2.

[0082] Figure 6 According to one or more embodiments Figure 1 A schematic partial axonometric view of the inlet side of the treatment plant 100 is shown.

[0083] The second bushing 350 includes one or more outer inlet openings 371 (hereinafter Figure 13(two are shown in the figure), the inlet opening 371 extends to the second side surface 354. One or more outer inlet openings 371 are arranged on the circumferential outside of the inlet opening 355.

[0084] The third bushing 380 includes one or more second inlet openings 391 (hereinafter referred to as "second inlet openings") extending between the first side 383 and the tapered section 385 of the second side 384 of the third bushing 380. Figure 16 Two are shown in the figure). One or more second inlet openings 391 are arranged circumferentially outside the inlet opening 386. An arcuate passage 392 is arranged between the two second inlet openings 391. The arcuate passage 392 extends into the tapered section 385.

[0085] Window airflow WP1 (such as Figure 3 Window gas stream WP1 (shown in FIG. 1 ) is supplied to the upper portion 131 through one or more second gas inlet openings 391 and / or arcuate passages 392. Window gas stream WP1 includes one or more purge gases (such as the same or different purge gases as second gas stream P2). Window gas stream WP1 flows from the injector 310 to the one or more second inlet openings 391, and then to the one or more second inlet openings 391 of the third bushing 380. The gas flows through the one or more second inlet openings 391 and enters the arcuate passages 392 and / or the upper portion 131.

[0086] Figure 7 According to one or more embodiments Figure 1 A schematic partial cross-sectional axonometric view of the inlet side of the treatment plant 100 is shown. Figure 7 The cross section shown is roughly along Figure 5 The second inlet opening 363 includes a hole section 763 extending between the outer face 352 and a groove section 764 extending into the inner face 351 .

[0087] Figure 8 According to one or more embodiments Figure 1 A schematic partial cross-sectional side view of the cross-flow side of the process plant 100 is shown. Figure 8 The cross section shown is roughly along Figure 5 The cross section shown is taken at 8-8.

[0088] The syringe 310 includes a plurality of side injection openings 813 extending between the inner face 311 and the outer face 312 (including a first row of one or more side injection openings 813, e.g., the lower row, and a second row of one or more side injection openings 813, e.g., the upper row). In one or more embodiments, the side injection openings 813 comprise holes. The side injection openings 813 are in fluid communication with one or more gas sources, such as the one or more gas sources 196 (e.g., using one or more conduits).

[0089] The first liner 330 includes one or more side inlet openings 835 on the cross-flow side of the first liner 330. The one or more side inlet openings 835 extend into the inner face 331 and the second side face 334 of the first liner 330. In one or more embodiments, the one or more side inlet openings 835 of the first liner 330 include grooves. In one or more embodiments, the one or more side inlet openings 835 include one or more grooves.

[0090] The second liner 350 includes a plurality of side inlet openings 855 on the cross-flow side of the second liner 350. The plurality of side inlet openings 855 of the second liner 350 extend into the exterior face 352 of the second liner 350. In one or more embodiments, the side inlet openings 855 include grooves.

[0091] The third liner 380 includes one or more side inlet openings 886 on the cross-flow side of the third liner 380. The one or more side inlet openings 886 of the third liner 380 extend into the first side 383 of the third liner 380. The one or more side inlet openings 886 of the third liner 380 extend into the inner face 381 of the third liner 380. In one or more embodiments, the one or more side inlet openings 886 of the third liner 380 include grooves.

[0092] The third gas stream P3 is supplied to the side injection opening 813, flows through the side inlet opening 855, and flows through the one or more side inlet openings 835 and the one or more side inlet openings 886. The third gas stream P3 then flows into the processing volume 128 in a cross-flow relative to the first gas stream P1. The third gas stream P3 includes one or more process gases (such as the same or different process gases as the first gas stream P1) to provide a cross-flow relative to the first gas stream P1.

[0093] Figure 9 According to one or more embodiments Figure 1 A schematic partial cross-sectional side view of the cross-flow side of the process plant 100 is shown. Figure 8 The cross section shown is roughly along Figure 5 The one or more outlet openings 387 of the third bushing 380 include a channel section 389 extending between a groove section 388 and a tapered section 385 .

[0094] Figure 10 According to one or more embodiments Figure 1 A schematic partial cross-sectional axonometric view of the processing device 100 is shown. Figure 10 The cross section shown in Figure 610. A first alignment pin 1001 is disposed between the first bushing 330 and the second bushing 350. The first alignment pin 1001 facilitates alignment of the first bushing 330 and the second bushing 350 with each other and facilitates reducing or preventing relative rotation between the first bushing 330 and the second bushing 350. The first alignment pin 1001 is disposed in a retaining opening 1002 formed in the second side 334 of the first bushing 330 and in a retaining opening 1003 formed in the first side 353 of the second bushing 350.

[0095] A second alignment pin 1005 is disposed between the second bushing 350 and the third bushing 380. The second alignment pin 1005 facilitates alignment of the second bushing 350 and the third bushing 380 with each other and facilitates reducing or preventing relative rotation between the second bushing 350 and the third bushing 380. The second alignment pin 1005 is disposed in a retaining opening 1006 formed in the second side 354 of the second bushing 350 and in a retaining opening 1007 formed in the first side 383 of the third bushing 380. In one or more embodiments, the first and second alignment pins 1001, 1005 are formed of quartz.

[0096] For the sake of visual clarity, the second bushing 350 is Figure 10 The middle part is shown with a dotted line.

[0097] Figure 11 According to one or more embodiments Figures 1 to 10 A schematic top axonometric view of the first bushing 330 is shown. Figure 11 In the view shown, the inlet side of the first bushing 330 is located at the front 1101 of the view, while the outlet side of the first bushing 330 is located at the rear 1102 of the view.

[0098] Figure 12 According to one or more embodiments Figures 1 to 10 A schematic bottom isometric view of the first bushing 330 is shown. Figure 12 In the view shown, the inlet side of the first bushing 330 is located at the front 1201 of the view, while the outlet side of the first bushing 330 is located at the rear 1202 of the view.

[0099] Figure 11 and 1233 . A plurality of channel sections 339 are shown, separated by beams 340. A plurality of protrusions 341 protrude to separate the portions of the groove section 338. In one or more embodiments, the upper surfaces of the protrusions 341 are portions of the second side 334. The first bushing 330 includes a second groove section 342 extending into the inner surface 331 and the first side 333. The channel sections 339 extend between the groove sections 338 and the second groove section 342. The first bushing 330 includes a groove 343 formed on the inlet side, allowing the insert 301 to extend at least partially through the groove.

[0100] Figure 13 According to one or more embodiments Figures 1 to 10 A schematic top axonometric view of the second bushing 350 is shown. Figure 13 In the view shown, the inlet side of the second bushing 350 is located at the front 1301 of the view, while the outlet side of the second bushing 350 is located at the rear 1302 of the view.

[0101] like Figure 13 As shown, the plurality of second inlet openings 363 of the second liner are at least partially aligned between the rows of first inlet openings 355 of the second liner 350 .

[0102] Figure 14 According to one or more embodiments Figures 1 to 10 A schematic bottom isometric view of the second bushing 350 is shown. Figure 14 In the view shown, the outlet side of the second bushing 350 is located at the front 1401 of the view, while the inlet side of the second bushing 350 is located at the rear 1402 of the view.

[0103] Figure 15 According to one or more embodiments Figures 1 to 10 A schematic top axonometric view of the third bushing 380 is shown. Figure 15 In the view shown, the inlet side of the third bushing 380 is located at the front 1501 of the view, while the outlet side of the third bushing 380 is located at the rear 1502 of the view.

[0104] Figure 16 According to one or more embodiments Figures 1 to 10 A schematic bottom isometric view of the third bushing 380 is shown. Figure 16 In the view shown, the inlet side of the third bushing 380 is located at the front 1601 of the view, while the outlet side of the third bushing 380 is located at the rear 1602 of the view.

[0105] The third bushing 380 includes one or more handling openings 392a, 392b (two are shown) formed in the tapered section 385. The one or more handling openings 392a, 392b can be manipulated (e.g., by a user's hands and / or through the use of tools and / or robotics) to raise, lower, and otherwise position the third bushing 380. The third bushing 380 includes an outlet side slot 393 extending into the second side 384.

[0106] Figure 17 According to one or more embodiments Figure 1 A schematic partial axonometric view of the outlet side of the treatment plant 100 is shown.

[0107] exist Figure 17 In the embodiment shown, the outlet side groove 393 is omitted, and the channel section 389 is circular ( Figure 15 and 16 The diagram shows the groove shape). Figure 17 In the illustrated embodiment, the arcuate channel 392 is omitted, the one or more outer inlet openings 371 are omitted, and the one or more process openings 392a, 392b extend to the inner face 381.

[0108] Figure 18 According to one or more embodiments Figure 17 A schematic partial axonometric view of the inlet side of the treatment plant 100 is shown.

[0109] Figure 19 According to one or more embodiments Figure 5 A schematic partial elevation view of syringe 310 is shown.

[0110] The plurality of first injection openings 313 (arranged in the first row 314 and the second row 315) are arranged in five rows, as shown in FIG. Figure 19 In one or more embodiments, at least one of the plurality of second injection openings 316, such as at least some (in Figure 5 and 19 In one or more embodiments, at least one of the plurality of second injection openings 316 of the syringe 310, such as at least some of the plurality of second injection openings 316 (shown as numeral 316C in FIG. 1 , having four rows) is aligned at least partially between the rows of first injection openings 313. Figure 5 and 19 In one or more embodiments, at least one of the plurality of second injection openings 316 of the syringe 310, such as at least some of the plurality of second injection openings 316 (shown as numeral 316A in FIG. 1 ), is aligned circumferentially outward of the first injection opening 313. Figure 5 and 19316B) is directed upward to supply the window airflow WP1 to the inlet opening 371 and / or the second inlet opening 391 on the outside.

[0111] The objectives described herein facilitate providing multiple gas flow zones that can be independently controlled and adjusted for process uniformity. For example, a first row 314 of first injection openings 313 facilitates five gas flow zones for a first gas flow P1 supplied to a first (e.g., lower) flow stage 153, such that the first gas flow P1 has five gas flow zones aligned with the first flow stage 153 and above the first (e.g., lower) substrate 107. For another example, a second row 315 of first injection openings 313 facilitates five gas flow zones for the first gas flow P1 supplied to a third (e.g., upper) flow stage 153. For another example, a second injection opening 316C facilitates four gas flow zones for a second gas flow P2 supplied to a second (e.g., middle) flow stage 153. These zones can be independently adjusted and controlled to facilitate uniformity of process parameters.

[0112] Figure 20 FIG is a schematic enlarged view of the inlet side of a processing device 2000 according to one or more embodiments. The processing device 2000 is similar to Figures 1 to 3 The processing device 100 is shown, and includes one or more aspects, features, components, properties and / or operations thereof.

[0113] The processing kit of the processing apparatus 2000 includes a syringe 310 , a first bushing 2030 , a second bushing 2050 , and a third bushing 2080 .

[0114] The first bushing 2030 includes an inner face 2031, an outer face 2032, a first side face 2033, and a second side face 2034. The first bushing 2030 includes a plurality of inlet openings 2035 on the inlet side of the first bushing 2030. The plurality of inlet openings 2035 extend into the inner face 2031 and the second side face 2034 of the first bushing 2030. In one or more embodiments, the inlet openings 2035 of the first bushing 2030 include a groove section 2036 extending into the outer face 2032 and a hole section 2037 extending between the groove section 2036 and the inner face 2031. The inlet openings 2035 of the first bushing 2030 are aligned with the first column 314 of first injection openings 313.

[0115] The second bushing 2050 includes an inner face 2051, an outer face 2052, and a plurality of inlet openings 2055 located on the inlet side of the second bushing 2050. The plurality of inlet openings 2055 of the second bushing 2050 extend between the outer face 2052 and the inner face 2051 of the second bushing 350. The inlet openings 2055 are aligned with the second injection opening 316 of the syringe 310. In one or more embodiments, the inlet openings 2055 include holes.

[0116] The third bushing 2080 includes an inner face 2081, an outer face 2082, a first side face 2083, a second side face 2084, and a plurality of inlet openings 2086 on the inlet side of the third bushing 2080. The plurality of inlet openings 2086 of the third bushing 380 extend into the first side face 2083 of the third bushing 2080. The plurality of inlet openings 2086 of the third bushing 380 extend into the inner face 2081 of the third bushing 380. In one or more embodiments, the plurality of inlet openings 2086 of the third bushing 2080 include a groove section 2087 extending into the outer face 2082 and the first side face 2083, and a hole section 2088 extending between the groove section 2087 and the inner face 2081. The inlet openings 2086 of the third bushing 2080 are aligned with the first injection openings 313 of the second row 315.

[0117] Figure 21 According to one or more embodiments Figure 20 A schematic enlarged view of the outlet side of the processing device 2000 is shown.

[0118] The first liner 2030 includes one or more outlet openings 2041 on the outlet side of the first liner 2030. In one or more embodiments, the one or more outlet openings 2041 include one or more channel sections 2043 ( Figure 21 A single combined channel segment 2043 is shown in the figure), and multiple hole segments 2044 extending between the inner surface 2031 and one or more channel segments 2043.

[0119] The second liner 2050 includes one or more outlet openings 2056 on the outlet side of the second liner 2050. In one or more embodiments, the one or more outlet openings 2056 include one or more channel sections 2057 ( Figure 21 A single combined channel segment 2057 is shown in the figure), and multiple hole segments 2058 extending between the inner surface 2051 and one or more channel segments 2057.

[0120] The third bushing 2080 includes one or more outlet openings 2090 on the outlet side of the third bushing 2080. In one or more embodiments, the one or more outlet openings 2090 include one or more groove sections 2091 ( Figure 21 A single combined groove segment 2091 and a plurality of hole segments 2092 extending between the inner face 2081 and the one or more groove segments 2091 are shown in FIG.

[0121] Figure 22 According to one or more embodiments Figure 20 and 21 A schematic partial cross-sectional side view of the cross-flow side of the process plant 2000 is shown.

[0122] The first liner 2030 includes one or more side inlet openings 2235 on the cross-flow side of the first liner 2030. In one or more embodiments, the one or more side inlet openings 2235 include one or more groove segments 2236 extending into the second side 2034 and the outer face 2032, and one or more hole segments 2237 extending between the one or more groove segments 2236 and the inner face 2031.

[0123] The third liner 2080 includes one or more side inlet openings 2285 on the cross-flow side of the third liner 2080. The one or more side inlet openings 2285 of the third liner 2080 extend into the first side 2083 of the third liner 2080. In one or more embodiments, the one or more side inlet openings 2285 include one or more groove segments 2286 extending into the first side 2083 and the outer face 2082, and one or more hole segments 2287 extending between the one or more groove segments 2286 and the inner face 2081.

[0124] The second liner 2050 fluidly separates the third airflow P3 in the one or more side inlet openings 2235 from the third airflow P3 in the one or more side inlet openings 2285 .

[0125] exist Figures 20 to 22 In the illustrated embodiment, the first bushing 2030 includes two flanges 2048 and 2049 that respectively support the first flow divider 111 (lower flow divider 111) and the second flow divider 111 (middle flow divider 111). The third bushing 2080 includes two flanges 2098 and 2099 that respectively support the third flow divider 111 (upper flow divider 111) and the plate 109.

[0126] Figure 23 is a schematic block diagram of a method 2300 of processing a substrate for semiconductor manufacturing according to one embodiment.

[0127] Operation 2302 of method 2300 includes positioning one or more substrates in a processing volume of a chamber.

[0128] Operation 2304 includes heating one or more substrates. It is contemplated that operation 2304 may occur before, after, and / or simultaneously with operation 2306.

[0129] Operation 2306 includes flowing a gas into the processing volume. The flow of gas may include, for example, one or more of a first gas flow P1, a second gas flow P2, a third gas flow P3, and / or a window gas flow WP1.

[0130] Operation 2310 includes simultaneously depositing one or more layers on each of one or more substrates.

[0131] Operation 2312 includes exhausting the gas from the processing volume. During the flow of operation 2306 and / or the exhaust of operation 2312, the gas can follow various flow paths described herein.

[0132] Benefits of the present disclosure include providing modularity of gas flow paths; reliable gas flow uniformity with respect to gas parameters (e.g., gas concentration, gas temperature, and / or flow rate); parameter control and adjustability (such as zone adjustability); thermal uniformity; and deposition uniformity (such as center-to-edge film thickness uniformity). These benefits can be facilitated for relatively complex deposition operations, such as batch processing operations involving simultaneous processing of multiple substrates. Benefits also include increased film growth rates and enhanced device performance.

[0133] It is contemplated that one or more aspects disclosed herein may be combined. For example, one or more aspects, features, components, operations and / or characteristics of various embodiments of the following may be combined: the processing apparatus 100, the controller 1070, the syringe 310, the first bushing 330, Figure 13 and 14 The second bushing 350 embodiment shown, Figure 15 and 16 The third bushing 380 embodiment shown, Figure 17 and 18 The second bushing 350 embodiment shown, Figure 17 and 18 The illustrated embodiment of the third liner 380, the processing apparatus 2000, the first liner 2030, the second liner 2050, the third liner 2080, and / or the method 2300. Furthermore, it is contemplated that one or more aspects disclosed herein may include some or all of the aforementioned benefits.

[0134] While the foregoing is directed to embodiments of the disclosure, other embodiments of the disclosure may be devised without departing from the basic scope of the disclosure, the scope of which is determined by the claims that follow.

Claims

1. A process kit adapted for placement in a process chamber, the process kit comprising: A syringe, comprising: inner surface, an outer surface, the outer surface being opposite to the inner surface, a plurality of first injection openings extending between the inner face and the outer face, the plurality of first injection openings comprising a first column of the first injection openings and a second column of the first injection openings, and a plurality of second injection openings extending between the inner face and the outer face, the plurality of second injection openings aligned between the first column and the second column of the first injection openings; A first bushing, the first bushing being sized and shaped to be disposed within the syringe, the first bushing comprising: inner surface, an outer surface, the outer surface being opposite to the inner surface of the first bushing, a first side surface between the inner surface of the first bushing and the outer surface of the first bushing, a second side surface, the second side surface being between the inner surface of the first bushing and the outer surface of the first bushing, the second side surface being opposite to the first side surface, a plurality of inlet openings on an inlet side of the first liner, the plurality of inlet openings extending into the inner face and the second side face of the first liner, and one or more outlet openings, the one or more outlet openings on an outlet side of the first liner, the outlet side opposite the inlet side, and the one or more outlet openings extending into the interior face of the first liner; and a second bushing sized and shaped to be at least partially supported by the first bushing, the second bushing comprising: inner surface, an outer surface, said outer surface being opposite to said inner surface of said second bushing, a first side surface between the inner surface of the second bushing and the outer surface of the second bushing, a second side surface, the second side surface being between the inner surface of the second bushing and the outer surface of the second bushing, the second side surface of the second bushing being opposite to the first side surface of the second bushing, a plurality of inlet openings on an inlet side of the second liner, the plurality of inlet openings of the second liner extending into the outer face of the second liner, and One or more outlet openings, the one or more outlet openings on an outlet side of the second liner, the outlet side of the second liner opposite the inlet side of the second liner, the one or more outlet openings of the second liner extending into the inner face of the second liner. 2 . The process kit of claim 1 , wherein at least one of the plurality of second injection openings of the syringe is at least partially aligned between rows of the first injection openings. 3 . The process kit of claim 1 , wherein at least one of the plurality of second injection openings of the syringe is aligned circumferentially outward of the first injection opening. The process kit of claim 3 , wherein the first injection opening and the second injection opening each comprise a hole.

5. The process kit of claim 1 , wherein the one or more outlet openings of the first liner comprise: a groove section extending into the inner face of the first bushing; and A channel section extends into the groove section.

6. The process kit of claim 5, wherein the plurality of inlet openings of the first bushing comprise grooves.

7. The process kit of claim 1 , wherein the plurality of inlet openings of the second liner comprises: a first column extending into the first side of the second hub and configured to align with the first column of the first injection openings of the syringe, and A second column extends into the second side of the second hub and is configured to align with the second column of the first injection openings of the syringe.

8. The process kit of claim 7, wherein the plurality of inlet openings of the second liner comprises: a plurality of first inlet openings, the plurality of first inlet openings comprising the first and second columns of the second liner; and A plurality of second inlet openings extend between the inner face of the second bushing and the outer face of the second bushing, the plurality of second inlet openings of the second bushing being configured to align with the second injection opening of the syringe.

9. A processing kit as described in claim 8, wherein the first column of the plurality of first inlet openings of the second bushing includes a first groove extending into the outer surface and the first side of the second bushing, and the second column of the plurality of first inlet openings of the second bushing includes a second groove extending into the outer surface and the second side of the second bushing.

10. The process kit of claim 9, wherein the one or more outlet openings of the second liner comprise: a channel section extending between the first side and the second side of the second bushing; and A bore section extends between the inner face of the second bushing and the channel section of the second bushing.

11. The process kit of claim 1 , further comprising a third bushing sized and shaped to be at least partially supported by the second bushing, the third bushing comprising: inner surface; an outer surface, the outer surface being opposite to the inner surface of the third bushing; a first side surface, the first side surface being located between the inner surface of the third bushing and the outer surface of the third bushing; a second side surface located between the inner surface of the third bushing and the outer surface of the third bushing, the second side surface being opposite to the first side surface of the third bushing, wherein the second side surface of the third bushing includes a tapered section; a plurality of inlet openings on an inlet side of the third liner, the plurality of inlet openings of the third liner extending into the first side of the third liner; and One or more outlet openings, the one or more outlet openings on an outlet side of the third liner, the outlet side of the third liner opposite the inlet side of the third liner, the one or more outlet openings of the third liner extending into the inner face of the third liner.

12. The process kit of claim 11, wherein the plurality of inlet openings of the third liner extend into the inner face of the third liner, and the one or more outlet openings of the third liner extend into the first side face of the third liner.

13. The process kit of claim 12, wherein the plurality of inlet openings of the third liner comprise grooves, and the one or more outlet openings of the third liner comprise groove sections extending into the inner face and the first side face of the third liner.

14. A processing kit as described in claim 13, wherein the third bushing further includes one or more second inlet openings, the one or more second inlet openings extending between the tapered sections of the first side and the second side, and the one or more outlet openings of the third bushing further include a channel section, the channel section extending between the groove section and the tapered section.

15. A liner adapted for placement in a processing chamber, the liner comprising: inner surface; an outer surface, the outer surface being opposite to the inner surface; a first side surface, the first side surface being between the inner side surface and the outer side surface; a second side surface, the second side surface being between the inner side surface and the outer side surface, the second side surface being opposite to the first side surface; a plurality of inlet openings on an inlet side, the plurality of inlet openings extending into the exterior face, and the plurality of inlet openings comprising: a plurality of first inlet openings, the plurality of first inlet openings comprising a first row extending into the first side and a second row extending into the second side, and a plurality of second inlet openings extending between the inner face and the outer face; and One or more outlet openings are on an outlet side opposite the inlet side and extend into the interior face.

16. The bushing of claim 15, wherein the second plurality of inlet openings are at least partially aligned between rows of the first inlet openings.

17. The bushing of claim 16, wherein the first row of the first plurality of inlet openings includes a first groove extending into the exterior face and the first side, and the second row of the first plurality of inlet openings includes a second groove extending into the exterior face and the second side.

18. The bushing of claim 17, wherein the one or more outlet openings comprise: a channel section extending between the first side and the second side; and A bore section extends between the inner surface and the channel section.

19. A processing chamber suitable for semiconductor manufacturing, the processing chamber comprising: a chamber body comprising an interior volume and a syringe, the syringe comprising: inner surface, an outer surface, the outer surface being opposite to the inner surface, a plurality of first injection openings extending between the inner face and the outer face, the plurality of first injection openings comprising a first column of the first injection openings and a second column of the first injection openings, and a plurality of second injection openings extending between the inner face and the outer face, the plurality of second injection openings aligned between the first column and the second column of the first injection openings; one or more heat sources configured to generate heat; a substrate support assembly positioned within the interior volume, the substrate support assembly comprising: Multiple lifting masts, and one or more substrate supports; A first bushing is disposed inside the syringe, and the first bushing comprises: inner surface, an outer surface, the outer surface being opposite to the inner surface of the first bushing, a first side surface between the inner surface of the first bushing and the outer surface of the first bushing, a second side surface, the second side surface being between the inner surface of the first bushing and the outer surface of the first bushing, the second side surface being opposite to the first side surface, a plurality of inlet openings on an inlet side of the first liner, the plurality of inlet openings extending into the interior face and the second side face of the first liner, and one or more outlet openings, the one or more outlet openings on an outlet side of the first liner, the outlet side opposite the inlet side, the one or more outlet openings extending into the interior face of the first liner; and a second bushing, the second bushing being at least partially supported by the first bushing, the second bushing comprising: inner surface, an outer surface, said outer surface being opposite to said inner surface of said second bushing, a first side surface between the inner surface of the second bushing and the outer surface of the second bushing, a second side surface, the second side surface being between the inner surface of the second bushing and the outer surface of the second bushing, the second side surface of the second bushing being opposite to the first side surface of the second bushing, a plurality of inlet openings on an inlet side of the second liner, the plurality of inlet openings of the second liner extending into the outer face of the second liner, and One or more outlet openings on an outlet side of the second liner, the outlet side of the second liner opposite the inlet side of the second liner.

20. The processing chamber of claim 19, wherein the one or more outlet openings of the second liner extend into the inner face of the second liner.

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