Double-grid-mesh mechanism

Abstract

The invention relates to a double-grid-mesh mechanism, which comprises a conductive plate, a mounting plate and a plurality of first fastening bolts, and is characterized in that a first grid mesh is arranged on the conductive plate, a second grid mesh is arranged on the mounting plate, and the first grid mesh and the second grid mesh are oppositely arranged, so that the first grid mesh and the second grid mesh are assembled together in the form of two modules; an insulating via hole is formed in the matched conductive plate, a conductive interface is formed in the mounting plate, and an external conductive rod can penetrate through the insulating via hole and then is connected into the conductive interface to electrify the second grid mesh, so that the second grid mesh can take electricity without passing through a base of the ion source, or the wiring area of a circuit of the second grid mesh on the base of the ion source is reduced; according to the ion source base, the power taking mode of the second grid mesh is changed, the insulation requirement for the ion source base is reduced, the short circuit risk is reduced, the first fastening bolt penetrates through the first through hole of the mounting plate to be screwed into the first threaded hole of the conductive plate, assembly and disassembly are convenient, and checking, debugging, cleaning and maintenance can be rapidly conducted.

Description

Technical Field

[0001] The present invention relates to the technical field of ion sources, and in particular to a double-grid mechanism. Background Art

[0002] An ion source is a device that ionizes neutral atoms or molecules and extracts an ion beam. It is widely used in optical vacuum coating, fine polishing and etching of material surfaces, and other fields. The grid assembly is an important component in the ion extraction system of the ion source. After the grid assembly is assembled on the ion source, it can collect particles from the ion source and accelerate them by applying a high-voltage electric field, so that they form a charged high-energy particle beam in a specific direction, thereby generating a continuous stream of ion rays for surface processing of various materials.

[0003] When the existing integrated grid assembly is fixed to the base of the ion source, one metal grid piece is at the same potential as the base, while the other metal grid piece, through the base's insulation arrangement, has a different potential. Because the circuits of the two metal grid pieces with different potentials pass through the base, the insulation requirements of the base channel are very high, which can easily cause instantaneous discharge and short circuits. Furthermore, the grid assembly has different charged areas. The balance between increasing the electric field strength of the metal grid pieces and ensuring the insulation of the assembly can easily lead to a complex assembly structure, making assembly and disassembly time-consuming and labor-intensive, and increasing the difficulty of inspection and maintenance. Summary of the Invention

[0004] Based on this, it is necessary to provide a double-grid mechanism.

[0005] The technical solution of the present invention to solve the above technical problems is as follows: a double-grid mechanism, comprising:

[0006] A conductive plate, wherein a first grid is provided on the conductive plate, and a plurality of first threaded holes are formed on the conductive plate;

[0007] a mounting plate, the mounting plate being spaced apart from the conductive plate, the mounting plate being provided with a second grid, the second grid being arranged opposite to the first grid, the mounting plate being provided with a plurality of first through holes, the first through holes being arranged in a one-to-one correspondence with the first threaded holes;

[0008] a plurality of first fastening bolts, each of the first fastening bolts passing through one of the first through holes and then being screwed into one of the first threaded holes;

[0009] The conductive plate is provided with an insulating through-hole, and the mounting plate is provided with a conductive interface, and the conductive interface is used to connect a conductive rod passing through the insulating through-hole to energize the second grid.

[0010] In one embodiment, the double-grid mechanism further includes: an insulating limiter, a limit hole is provided on the conductive plate, a first end of the insulating limiter is inserted into the limit hole, and a second end of the insulating limiter is movably abutted against the mounting plate.

[0011] In one embodiment, the dual-grid mechanism further includes: a plurality of second fastening bolts, a plurality of second threaded holes are provided on the conductive plate, a plurality of second through holes are provided on the first grid, each second through hole is arranged in a one-to-one correspondence with each second threaded hole, and the first end of each second fastening bolt passes through a second through hole and is screwed into a second threaded hole.

[0012] In one embodiment, the double-grid mechanism further includes: a plurality of third fastening bolts, a plurality of third threaded holes are provided on the mounting plate, a plurality of third through holes are provided on the second grid, each of the third through holes is arranged in a one-to-one correspondence with each of the third threaded holes, and the first end of each of the third fastening bolts passes through a third through hole and is screwed into a third threaded hole.

[0013] In one embodiment, a plurality of first receiving holes are provided on the second grid, a plurality of first receiving grooves are provided on the mounting plate, each of the first receiving holes is connected to a first receiving groove to form a first countersunk hole, and the second end of each of the second fastening bolts is at least partially located in the first countersunk hole.

[0014] In one embodiment, a plurality of second receiving holes are provided on the first grid, a plurality of second receiving grooves are provided on the conductive plate, each of the second receiving holes is connected to a second receiving groove to form a second countersunk hole, and the second end of each of the third fastening bolts is at least partially located in the second countersunk hole.

[0015] In one embodiment, a positioning post is provided on the conductive plate, a positioning hole is opened on the mounting plate, and the positioning post is inserted into the positioning hole.

[0016] In one embodiment, a plurality of mounting countersunk through holes are formed on the conductive plate.

[0017] In one embodiment, a first through cavity is defined on the conductive plate, and a plurality of first grid holes are defined on the first grid mesh, each of the first grid holes is aligned with and communicated with the first through cavity.

[0018] In one embodiment, a second through cavity is provided on the mounting plate, and the second through cavity is aligned with the first through cavity. A plurality of second grid holes are provided on the second grid, and each second grid hole is aligned with and connected to the second through cavity, and each second grid hole is aligned with a first grid hole.

[0019] The beneficial effects of the present invention are as follows: the present invention provides a dual-grid mechanism, in which the first grid is arranged on a conductive plate, the second grid is arranged on a mounting plate, and the first grid and the second grid are arranged opposite to each other, so that the first grid and the second grid are assembled together in the form of two modules, an insulating through-hole is provided on the conductive plate, and a conductive interface is provided on the mounting plate. An external conductive rod can pass through the insulating through-hole and be connected to the conductive interface to energize the second grid, so that the second grid can be powered without passing through the base of the ion source, or the wiring area of ​​the circuit of the second grid in the base of the ion source is greatly reduced, the power supply method of the second grid is changed, the insulation requirements for the base of the ion source are reduced, and the risk of short circuit is reduced. At the same time, the first fastening bolt is screwed into the first threaded hole of the conductive plate through the first through-hole of the mounting plate, which is convenient for assembly and disassembly, so that inspection, troubleshooting, cleaning and maintenance can be carried out quickly. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 A schematic structural diagram of a double-grid mechanism according to an embodiment;

[0022] Figure 2 Schematic diagram of the three-dimensional exploded structure of a double-grid mechanism according to one embodiment;

[0023] Figure 3 Schematic diagram of the three-dimensional exploded structure of a double-grid mechanism according to one embodiment;

[0024] Figure 4 is a schematic structural diagram of a conductive plate and a first grid according to an embodiment;

[0025] Figure 5 A schematic structural diagram of a mounting plate and a second grid according to an embodiment;

[0026] Figure 6 Schematic diagram of the three-dimensional exploded structure of the conductive plate and the first grid according to one embodiment;

[0027] Figure 7 This is a schematic diagram of the three-dimensional exploded structure of the mounting plate and the second grid according to one embodiment.

[0028] In the accompanying drawings, 10, double grid mechanism; 20, conductive rod; 100, conductive plate; 101, first through cavity; 110, first threaded hole; 120, insulating through hole; 130, second threaded hole; 140, second receiving groove; 150, mounting countersunk through hole; 200, mounting plate; 201, second through cavity; 210, first through hole; 220, conductive interface; 230, third threaded hole; 240, first receiving groove; 300, first grid Mesh; 301, first grid hole; 310, second through hole; 320, second accommodating hole; 400, second grid; 401, second grid hole; 410, third through hole; 420, first accommodating hole; 510, insulating limiter; 520, limit hole; 600, first fastening bolt; 610, second fastening bolt; 620, third fastening bolt; 710, first countersunk hole; 720, second countersunk hole; 810, positioning column; 820, positioning hole. DETAILED DESCRIPTION

[0029] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present disclosure.

[0030] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly attached to the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0032] In one embodiment, Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 and Figure 7As shown, a double-grid mechanism 10 includes: a conductive plate 100, a mounting plate 200 and a plurality of first fastening bolts 600, wherein the conductive plate 100 is provided with a first grid 300, the conductive plate 100 is provided with a plurality of first threaded holes 110, the mounting plate 200 is spaced apart from the conductive plate 100, the mounting plate 200 is provided with a second grid 400, the second grid 400 is arranged opposite to the first grid 300, and the mounting plate 200 is provided with a plurality of first screw holes 110. The through holes 210 are arranged in a one-to-one correspondence with each first threaded hole 110, and each first fastening bolt 600 is threaded into a first threaded hole 110 after passing through a first through hole 210; wherein, the conductive plate 100 is provided with an insulating through hole 120, and the mounting plate 200 is provided with a conductive interface 220, and the conductive interface 220 is used to connect the conductive rod 20 after passing through the insulating through hole 120 to energize the second grid 400.

[0033] In this embodiment, the conductive plate 100 and the mounting plate 200 are spaced apart. By arranging the first grid 300 on the conductive plate 100 and the second grid 400 on the mounting plate 200, and arranging the first grid 300 and the second grid 400 opposite to each other, and cooperating with the first fastening bolt 600 passing through the first through hole 210 of the mounting plate 200 and being screwed into the first threaded hole 110 of the conductive plate 100, the first grid 300 and the second grid 400 can be assembled together in the form of two modules, which is not only convenient for assembly and disassembly, but also enables quick inspection, troubleshooting, cleaning and maintenance, thereby improving the stability of the double grid mechanism 10.

[0034] In this embodiment, an insulating through-hole 120 is provided on the conductive plate 100, and a conductive interface 220 is provided on the mounting plate 200. The external conductive rod 20 can pass through the insulating through-hole 120 and be connected to the conductive interface 220 to energize the second grid 400, so that the second grid 400 can draw power without passing through the base of the ion source, or greatly reduce the wiring area of ​​the circuit of the second grid in the base of the ion source, and change the power-drawing method of the second grid 400. In this way, the first grid 300 draws power from the base of the ion source, and the second grid 400 draws power by using the conductive rod 20, and the two modules are electrically insulated from each other, eliminating the complex insulation design of the ion source base, reducing the insulation requirements of the ion source base, and thus reducing the risk of short circuit.

[0035] It is worth noting that when the external conductive rod is mounted on the conductive interface of the mounting plate to energize the second grid, a circuit is arranged on the mounting plate to electrically connect the conductive rod to the second grid. This circuit structure can be a conductive structure such as a conductive wire and a conductive plate, and is not specifically limited in this embodiment. For example, a metal conductive plate can be provided on the mounting plate, and the metal conductive plate can be electrically connected to the conductive rod and the second grid, respectively, so that the second grid can be energized by the external conductive rod.

[0036] In one embodiment, Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 and Figure 7 As shown, the double-grid mechanism 10 also includes: an insulating limiter 510, a limit hole 520 is opened on the conductive plate 100, the first end of the insulating limiter 510 is inserted into the limit hole 520, and the second end of the insulating limiter 510 is movably abutted against the mounting plate 200. Specifically, the number of insulating stoppers 510 is set to be multiple, and the number of stop holes 520 is equal to the number of insulating stoppers 510. The stop holes 520 are evenly distributed on both sides of the conductive plate 100. With one end of the insulating stopper 510 inserted into the stop hole 520 and the other end abutting the mounting plate 200, the insulating stopper 510 can function to limit the distance between the conductive plate 100 and the mounting plate 200, so that a corresponding distance is maintained between the assembled conductive plate 100 and the mounting plate 200. This allows the first grid 300 and the second grid 400 to be spaced apart from each other, ensuring that the first grid 300 and the second grid 400 are electrically insulated from each other. At the same time, the insulating stoppers 510 can be easily replaced to adjust the distance between the first grid 300 and the second grid 400. It is worth noting that the shape and size of the insulating stopper 510 can be adjusted according to the different spacing requirements between the first grid 300 and the second grid 400, and are not specifically limited in this embodiment.

[0037] In one embodiment, Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 and Figure 7As shown, the conductive plate 100 is provided with a positioning post 810, and the mounting plate 200 is provided with a positioning hole 820, and the positioning post 810 is inserted into the positioning hole 820. Specifically, the number of positioning posts 810 is set to be multiple, and each positioning post 810 is evenly distributed at both ends of the conductive plate 100. The number of positioning holes 820 is equal to the number of positioning posts 810. By inserting the positioning posts 810 into the positioning holes 820, a positioning function can be achieved, which facilitates the alignment of the first threaded hole 110 on the conductive plate 100 with the first through hole 210 on the mounting plate 200, thereby enabling better assembly of the conductive plate 100 and the mounting plate 200.

[0038] In one embodiment, Figure 2 、 Figure 4 and Figure 6 As shown, the dual-grid mechanism 10 further includes: a plurality of second fastening bolts 610, a plurality of second threaded holes 130 are provided on the conductive plate 100, a plurality of second through holes 310 are provided on the first grid 300, and each second through hole 310 is arranged in a one-to-one correspondence with each second threaded hole 130, and the first end of each second fastening bolt 610 passes through a second through hole 310 and is screwed into a second threaded hole 130. Specifically, the number of the second threaded holes 130 is the same as the number of the second through holes 310, and the second threaded holes 130 are evenly distributed on both sides of the conductive plate 100. The second through holes 310 are correspondingly distributed on both sides of the first grid 300. Each second through hole 310 is aligned with and connected to a second threaded hole 130. The first end of the second fastening bolt 610 passes through the second through hole 310 and is screwed into the second threaded hole 130. The first grid 300 can be stably assembled on the conductive plate 100 through a threaded connection, and is convenient for disassembly for inspection, troubleshooting, cleaning, and maintenance.

[0039] In one embodiment, a first orientation hole is provided on the conductive plate, and a second orientation hole is provided on the first grid. The first orientation hole and the second orientation hole are movably aligned. When the first grid is assembled on the conductive plate, the first orientation hole and the second orientation hole are aligned, which can play an auxiliary positioning role and ensure that the first grid can be accurately assembled on the conductive plate.

[0040] In one embodiment, Figure 2 、 Figure 3 、 Figure 5 and Figure 7As shown, the double-grid mechanism 10 also includes: a plurality of third fastening bolts 620, a plurality of third threaded holes 230 are opened on the mounting plate 200, and a plurality of third through holes 410 are opened on the second grid 400, each of the third through holes 410 is arranged in a one-to-one correspondence with each of the third threaded holes 230, and the first end of each of the third fastening bolts 620 passes through one of the third through holes 410 and is screwed into one of the third threaded holes 230. Specifically, the number of the third threaded holes 230 is the same as the number of the third through holes 410, and the third threaded holes 230 are evenly distributed on both sides of the mounting plate 200. The third through holes 410 are correspondingly distributed on both sides of the second grid 400. Each third through hole 410 is aligned with and connected to a third threaded hole 230. The first end of the third fastening bolt 620 passes through the third through hole 410 and is screwed into the third threaded hole 230. The second grid 400 can be stably assembled on the mounting plate 200 by threaded connection, and is convenient for disassembly for inspection, troubleshooting, cleaning and maintenance.

[0041] In another embodiment of the mounting plate, the mounting plate includes an insulating plate and an auxiliary plate, the auxiliary plate being disposed on the insulating plate and disposed opposite the conductive plate. The insulating plate is provided with a plurality of mounting holes, and the auxiliary plate is provided with a third threaded hole. Each of the third threaded holes corresponds to and communicates with a mounting hole and a third through-hole, i.e., each of the third threaded holes is aligned with and communicates with a mounting hole and a third through-hole. The first end of the third fastening bolt is threaded through the third through-hole and the mounting hole in sequence and then screwed into the third threaded hole. The second grid can be assembled using the insulating plate and the auxiliary plate in combination, thereby avoiding situations where the threaded holes on the mounting plate fail due to the material of the mounting plate and the third fastening bolt cannot be effectively screwed in, thereby better assembling the second grid to the mounting plate. In this embodiment, the conductive interface is provided on the insulating plate, and the circuit structure is disposed on the insulating plate, i.e., the conductive structure is disposed on the insulating plate. Compared to the conductive plate, the insulating plate has lower thermal conductivity and a smaller circuit layout area, and the external conductive rod can energize the second grid through the conductive structure.

[0042] In one embodiment, a third orientation hole is provided on the mounting plate, and a fourth orientation hole is provided on the second grid. The third orientation hole is movably aligned with the fourth orientation hole. When the second grid is assembled on the mounting plate, the third orientation hole is aligned with the fourth orientation hole, which can play an auxiliary positioning role and ensure that the second grid can be accurately assembled on the mounting plate.

[0043] In one embodiment, Figure 3 、 Figure 5 and Figure 7As shown, a plurality of first receiving holes 420 are provided on the second grid 400, and a plurality of first receiving grooves 240 are provided on the mounting plate 200. Each of the first receiving holes 420 is connected to a first receiving groove 240 to form a first countersunk hole 710, and the second end of each of the second fastening bolts 610 is at least partially located in the first countersunk hole 710. Specifically, the number of the first accommodating holes 420 is equal to the number of the first accommodating grooves 240, and the first accommodating holes 420 are evenly distributed on both sides of the second grid 400, and the first accommodating grooves 240 are correspondingly distributed on both sides of the mounting plate 200. Each first accommodating hole 420 is aligned with and connected to a first accommodating groove 240 to form a first countersunk hole 710. The position of the first countersunk hole 710 corresponds to the position of the second fastening bolt 610 on the conductive plate 100. In this way, when the conductive plate 100 and the mounting plate 200 are assembled together, the second end of the second fastening bolt 610 protruding from the outer surface of the conductive plate 100 can be accommodated in the first countersunk hole 710, thereby better ensuring that there is an appropriate spacing between the assembled conductive plate 100 and the mounting plate 200.

[0044] In one embodiment, Figure 2 、 Figure 4 and Figure 6 As shown, a plurality of second receiving holes 320 are provided on the first grid 300, and a plurality of second receiving grooves 140 are provided on the conductive plate 100. Each of the second receiving holes 320 is connected to a second receiving groove 140 to form a second countersunk hole 720, and the second end of each of the third fastening bolts 620 is at least partially located in the second countersunk hole 720. Specifically, the number of the second accommodating holes 320 is equal to the number of the second accommodating grooves 140, and the second accommodating holes 320 are evenly distributed on both sides of the first grid 300, and the second accommodating grooves 140 are correspondingly distributed on both sides of the conductive plate 100. Each second accommodating hole 320 is aligned with a second accommodating groove 140 and is connected to form a second countersunk hole 720. The position of the second countersunk hole 720 corresponds to the position of the third fastening bolt 620 on the mounting plate 200. In this way, when the conductive plate 100 and the mounting plate 200 are assembled together, the second end of the third fastening bolt 620 protruding from the outer surface of the mounting plate 200 can be accommodated in the second countersunk hole 720, thereby better ensuring that there is an appropriate spacing between the assembled conductive plate 100 and the mounting plate 200.

[0045] In one embodiment, Figure 6 As shown, the conductive plate 100 is provided with a plurality of mounting countersunk through holes 150. Specifically, the mounting countersunk through holes 150 are evenly distributed at both ends of the conductive plate 100. External bolts are passed through the mounting countersunk through holes 150 and then screwed onto the base of the ion source, thereby enabling the conductive plate 100 to be mounted on the base of the ion source, thereby enabling the dual-grid mechanism 10 to be mounted on the base of the ion source.

[0046] In one embodiment, Figure 6 and Figure 7 As shown, the conductive plate 100 is provided with a first passage cavity 101, the first grid 300 is provided with a plurality of first grid holes 301, each of which is aligned with and connected to the first passage cavity 101, the mounting plate 200 is provided with a second passage cavity 201, the second passage cavity 201 is aligned with the first passage cavity 101, and the second grid 400 is provided with a plurality of second grid holes 401, each of which is aligned with and connected to the second passage cavity 201, and each second grid hole 401 is aligned with a first grid hole 301. Specifically, the first passage cavity 101, each first grid hole 301, each second grid hole 401, and the second passage cavity 201 are sequentially connected, capable of ejecting particles collected and accelerated from the ion source outward, forming an ion beam stream in a specific direction, which is used to sputter, etch, or impact the surfaces of various materials.

[0047] Compared with the prior art, the present invention has at least the following advantages:

[0048] The present invention provides a dual-grid mechanism, in which a first grid is arranged on a conductive plate and a second grid is arranged on a mounting plate, and the first grid and the second grid are arranged opposite each other, so that the first grid and the second grid are assembled together in the form of two modules, an insulating through-hole is provided on the conductive plate, and a conductive interface is provided on the mounting plate. An external conductive rod can pass through the insulating through-hole and then be connected to the conductive interface to energize the second grid, so that the second grid can draw power without passing through the base of the ion source, thereby changing the power supply method of the second grid, reducing the insulation requirements for the ion source base, and reducing the risk of short circuit. At the same time, a first fastening bolt is screwed into the first threaded hole of the conductive plate through the first through-hole of the mounting plate, which facilitates assembly and disassembly, thereby enabling rapid inspection, troubleshooting, cleaning, and maintenance.

[0049] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0050] The above-described embodiments merely represent several embodiments of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art could make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A double-grid mechanism, characterized in that: include: A conductive plate, wherein a first grid is provided on the conductive plate, and a plurality of first threaded holes are formed on the conductive plate; a mounting plate, the mounting plate being spaced apart from the conductive plate, the mounting plate being provided with a second grid, the second grid being arranged opposite to the first grid, the mounting plate being provided with a plurality of first through holes, the first through holes being arranged in a one-to-one correspondence with the first threaded holes; a plurality of first fastening bolts, each of the first fastening bolts passing through one of the first through holes and then being screwed into one of the first threaded holes; The conductive plate is provided with an insulating through-hole, and the mounting plate is provided with a conductive interface, and the conductive interface is used to connect a conductive rod passing through the insulating through-hole to energize the second grid.

2. The double-grid mechanism according to claim 1, characterized in that: Also includes: An insulating limiter is provided with a limit hole on the conductive plate, a first end of the insulating limiter is inserted into the limit hole, and a second end of the insulating limiter is movably abutted against the mounting plate.

3. The double-grid mechanism according to claim 1, characterized in that: Also includes: A plurality of second fastening bolts are provided, a plurality of second threaded holes are provided on the conductive plate, a plurality of second through holes are provided on the first grid, each second through hole is arranged in a one-to-one correspondence with each second threaded hole, and the first end of each second fastening bolt passes through a second through hole and is screwed into a second threaded hole.

4. The double-grid mechanism according to claim 3, characterized in that: Also includes: A plurality of third fastening bolts are provided, a plurality of third threaded holes are provided on the mounting plate, a plurality of third through holes are provided on the second grid, each of the third through holes is arranged in a one-to-one correspondence with each of the third threaded holes, and the first end of each of the third fastening bolts passes through a third through hole and is screwed into a third threaded hole.

5. The double-grid mechanism according to claim 4, characterized in that: A plurality of first receiving holes are provided on the second grid, and a plurality of first receiving grooves are provided on the mounting plate. Each of the first receiving holes is connected to a first receiving groove to form a first countersunk hole, and the second end of each of the second fastening bolts is at least partially located in the first countersunk hole.

6. The double-grid mechanism according to claim 5, characterized in that: A plurality of second receiving holes are provided on the first grid, a plurality of second receiving grooves are provided on the conductive plate, each of the second receiving holes is connected to a second receiving groove to form a second countersunk hole, and the second end of each of the third fastening bolts is at least partially located in the second countersunk hole.

7. The double-grid mechanism according to claim 1, characterized in that: The conductive plate is provided with a positioning post, the mounting plate is provided with a positioning hole, and the positioning post is inserted into the positioning hole.

8. The double-grid mechanism according to claim 1, characterized in that: The conductive plate is provided with a plurality of mounting countersunk through holes.

9. The double-grid mechanism according to claim 1, characterized in that: A first through cavity is formed on the conductive plate, and a plurality of first grid holes are formed on the first grid mesh. Each of the first grid holes is aligned with and communicated with the first through cavity.

10. The double-grid mechanism according to claim 9, characterized in that: A second through cavity is provided on the mounting plate, and the second through cavity is aligned with the first through cavity. A plurality of second grid holes are provided on the second grid, and each of the second grid holes is aligned with and communicates with the second through cavity, and each of the second grid holes is aligned with a first grid hole.

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