Semiconductor particle mounting device

Abstract

The invention relates to the field of circuit production, and discloses a semiconductor particle mounting device which comprises a shell, a conveying mechanism, a bearing mechanism and a blocking mechanism. According to the invention, firstly, two rotating plates are rotated, so that the rotating plates are located right above the PCB, at the moment, a rubber block is pushed by an inclined push block to move downwards, so that the bottom of the rubber block extends out of the rotating plates, then gas is injected into a shell, a sliding column slides upwards and then abuts against the bottom surface of the PCB, and when the PCB abuts against the bottom surface of the rubber block, the rubber block is pushed by the inclined push block to move downwards. The internal pressure of the shell is increased when gas is continuously injected into the shell, so that a first pressure valve is opened, the telescopic end of the air cylinder is driven to stretch out at the moment, a lifting frame moves upwards, the two sides of the PCB are clamped through cooperation of the lifting frame and a rail frame, and meanwhile due to the fact that a sliding column abuts against the PCB and components welded to the back face of the PCB from the bottom, the PCB is clamped through the sliding column. Therefore, the pressure applied to the PCB by the chip mounter is counteracted, and the PCB is prevented from being bent due to stress accumulation in the high-speed chip mounting process.

Description

Technical Field

[0001] The present application relates to the field of circuit production technology, and in particular to a semiconductor particle mounting device. Background Art

[0002] With the development of the semiconductor industry, the size of components on circuit boards is getting smaller and smaller, and the number is gradually increasing. At the same time, in order to reduce the area of ​​the circuit board, the electrical components are soldered on both sides of the PCB. As a result, traditional manual or semi-automatic placement machines are no longer able to meet production needs. Therefore, high-speed placement machines are now used for placement production. In the actual production process, multiple PCBs are assembled to improve efficiency in production processes such as SMT placement and wave soldering.

[0003] During the design phase of a PCB, in order to prevent creepage during use, holes or slots are punched or cut into the PCB to increase the creepage distance between two conductive components. When mounting a double-sided PCB, two sets of upper and lower pressure plates are used to clamp the PCB from both sides. At this time, the bottom of the PCB is suspended. Although the pressure applied to the PCB by the placement machine during the placement process is very small, due to the high-speed operation of the placement device, the PCB is subjected to multiple impacts in a short period of time, resulting in mechanical stress accumulation, which causes deformation of the PCB. When the placement head squeezes the part of the PCB near the slot, the PCB is prone to breakage, thereby affecting the production qualification rate. At the same time, in order to reduce the use of materials such as copper, nickel, and gold and facilitate later segmentation during the production process of non-rectangular PCBs (such as circular PCBs) or PCBs that are panelized, the nearby blank areas are removed in advance. Such PCBs will also have the above-mentioned problems when being placed. Summary of the Invention

[0004] The present application proposes a semiconductor particle placement device, which has the advantage of ensuring placement accuracy and is used to solve the problem of PCB boards being bent and deformed by impact during high-speed placement.

[0005] To achieve the above-mentioned purpose, the present application adopts the following technical solution: a semiconductor particle mounting device, comprising a housing, the housing comprising a base and an upper cover, and further comprising:

[0006] A conveying mechanism, the conveying mechanism comprising a track frame symmetrically fixedly connected to the top surface of the base, and a first sliding groove is formed on the outer side surface of the track frame;

[0007] A supporting mechanism, the supporting mechanism comprising a fixing plate fixedly sleeved on the top surface of the base, a housing fixedly connected to the fixing plate, air inlets being provided on two symmetrical sides of the housing, the housing being open at the top and a mounting plate fixedly connected to the top thereof, a plurality of sliding posts being slidably sleeved on the mounting plate;

[0008] The blocking mechanism includes two centrally symmetrical rotating shafts and a limit frame. The rotating shaft passes through the top surface of the base. The rotating shaft is fixedly sleeved with a rotating plate and a synchronous wheel from top to bottom. A synchronous belt is connected between the two synchronous wheels. The bottom of one of the rotating shafts is connected to a drive motor.

[0009] Preferably, the left and right sides of the shell are fixedly connected with interconnected first pressure valves, a cylinder is fixedly connected inside the track frame, a first pipe is connected between the cylinder and the exhaust port of the first pressure valve, and a second pressure valve is fixedly connected to the first pipe.

[0010] Preferably, the opening pressure value of the second pressure valve is greater than the opening pressure value of the first pressure valve, and the exhaust port of the second pressure valve is connected to the outside.

[0011] Preferably, the carrying mechanism further comprises a lifting frame, the outer side surface of the lifting frame is fixedly connected to a plurality of sliders, the sliders are slidably connected in the first sliding groove, and the telescopic end of the cylinder is fixedly connected to the bottom surface of the lifting frame.

[0012] Preferably, the track frame has multiple sections of conveyor belts fixedly installed on the side facing the supporting mechanism, and the top surface of the lifting frame is fixedly connected with symmetrical rubber strips. After the lifting frame slides upward, it pushes part of the conveyor belt upward.

[0013] Preferably, the rotating plate is a hollow structure, and the rotating plate is parallel to the track frame in the initial position. A through groove is provided on the bottom surface of the rotating plate, and a rubber block is slidably connected to the inside of the rotating plate. The rubber block is partially located in the through groove, and a second spring is elastically connected between the rubber block and the inner bottom surface of the rotating plate so that the bottom surface of the rubber block is coplanar with the bottom surface of the rotating plate in the initial position.

[0014] Preferably, the rotating plate is slidably sleeved with a push rack toward the side of the supporting mechanism in the initial position, and a first spring is elastically connected between the push rack and the inner side surface of the rotating plate.

[0015] Preferably, the rubber block is fixedly connected to a sloped block perpendicular to the symmetrical side of the push frame, the slope of the sloped block is inclined upward, and the push frame is fixedly connected to an inclined push block on the side facing the rubber block. After the push frame slides into the rotating plate, the rubber block slides downward and its bottom end extends out of the rotating plate.

[0016] Preferably, when the slide post is fully extended, the vertical height of the top surface of the slide post is greater than the vertical height of the track frame.

[0017] Preferably, a feeder and a driver are fixedly connected to the top surface of the shell, and a mounter is installed on the driver.

[0018] The beneficial effects of the present invention are as follows:

[0019] 1. In the present invention, the supporting mechanism and the blocking mechanism are provided, and the two rotating plates are first rotated so that the rotating plates are located directly above the PCB. At this time, the rubber block is pushed downward by the oblique push block, so that the bottom surface of the rubber block extends out of the rotating plate. Then, gas is injected into the shell. As the gas is injected, the slide column slides upward. At this time, the slide column abuts against the bottom surface of the PCB. As the slide column continues to slide upward, when the PCB abuts against the bottom surface of the rubber block, further injection of gas into the shell will cause the internal pressure to increase, thereby opening the first pressure valve. At this time, further inward injection of gas will drive the telescopic end of the cylinder to extend, thereby moving the lifting frame upward. The two sides of the PCB are clamped by the cooperation of the lifting frame and the track frame. At the same time, because the slide column abuts the PCB and the components soldered on the back side of the PCB from the bottom, the pressure applied by the mounter to the PCB is offset, thereby preventing the PCB from bending due to stress accumulation during the high-speed mounting process, which causes the components on the back side of the PCB to fall off.

[0020] 2. Secondly, through the provision of sliding posts, after the sliding posts extend upward, when the top surface of the sliding posts does not contact the PCB, the height of the top end will exceed the top surface of the track frame. At this time, these fully extended sliding posts will contact the side of the PCB, and the position of the PCB will be limited by the cooperation of multiple sliding posts, thereby avoiding displacement of the PCB during the mounting process and ensuring the mounting accuracy of components. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings, which constitute a part of the specification, illustrate embodiments disclosed in the present application and, together with the description, serve to explain the principles disclosed in the present application in a clear and understandable manner.

[0022] The present disclosure can be more clearly understood from the following detailed description with reference to the accompanying drawings, in which:

[0023] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 This is a schematic diagram of the structure of the present invention without the upper cover;

[0025] Figure 3 For the present invention Figure 2 Enlarged view of point A in the middle;

[0026] Figure 4 This is a schematic cross-sectional view of the carrying mechanism of the present invention;

[0027] Figure 5 For the present invention Figure 4 Enlarged view of point B in the middle;

[0028] Figure 6 It is a schematic structural diagram of the carrying mechanism and the blocking mechanism of the present invention;

[0029] Figure 7 It is a schematic diagram of the cross-sectional structure of the blocking mechanism.

[0030] Among them: 1. Shell; 11. Base; 12. Upper cover; 13. Feeder; 14. Driver; 15. SMT; 2. Conveying mechanism; 21. Track frame; 22. Conveyor belt; 23. First slide; 3. Carrying mechanism; 31. Fixing plate; 32. Shell; 33. Air inlet; 34. Mounting plate; 35. Slide column; 36. First pressure valve; 37. First pipeline; 38. Cylinder; 39. Second pressure valve; 310. Lifting frame; 311. Rubber strip; 4. Blocking mechanism; 41. Rotating shaft; 42. Rotating plate; 43. Limiting frame; 44. Synchronous wheel; 45. Synchronous belt; 46. Driving motor; 47. Pushing frame; 48. Oblique pushing block; 49. Rubber block; 410. Through slot; 411. First spring; 412. Second spring. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0032] like Figures 1 to 7 As shown, the semiconductor particle mounting device of this embodiment includes a housing 1, which includes a base 11 and an upper cover 12, and further includes:

[0033] The conveying mechanism 2 includes a track frame 21 symmetrically fixedly connected to the top surface of the base 11, and a first sliding groove 23 is formed on the outer side of the track frame 21;

[0034] The carrying mechanism 3 includes a fixing plate 31 fixedly sleeved on the top surface of the base 11. A housing 32 is fixedly connected to the fixing plate 31. Air inlets 33 are symmetrically provided on two sides of the housing 32. The housing 32 is open at the top and fixedly connected to a mounting plate 34 at the top. A plurality of slide posts 35 are slidably sleeved on the mounting plate 34. The number, position, and shape of the slide posts 35 can be adjusted according to various parameters of the PCB during actual production and processing.

[0035] The blocking mechanism 4 includes two centrally symmetrical rotating shafts 41 and a limit frame 43. The rotating shaft 41 passes through the top surface of the base 11. The rotating shaft 41 is fixedly sleeved with a rotating plate 42 and a synchronous wheel 44 from top to bottom. A synchronous belt 45 is connected between the two synchronous wheels 44. The bottom of one rotating shaft 41 is connected to a drive motor 46.

[0036] In the present invention, by providing the supporting mechanism 3 and the blocking mechanism 4, the two rotating plates 42 are first rotated so that the rotating plates 42 are located directly above the PCB. At this time, the rubber block 49 is pushed downward by the oblique push block 48, so that the bottom surface of the rubber block 49 extends out of the rotating plate 42. Then, gas is injected into the housing 32. As the gas is injected, the slide post 35 slides upward. At this time, the slide post 35 abuts against the bottom surface of the PCB. As the slide post 35 continues to slide upward, when the PCB abuts against the bottom surface of the rubber block 49, gas is continued to be injected into the housing 32. The body will cause its internal pressure to increase, thereby opening the first pressure valve 36. At this time, continuing to inject gas inward will drive the telescopic end of the cylinder 38 to extend, thereby moving the lifting frame 310 upward. The lifting frame 310 and the track frame 21 cooperate to clamp both sides of the PCB board. At the same time, since the sliding column 35 presses against the PCB and the components soldered on the back of the PCB from the bottom, it offsets the pressure applied to the PCB by the mounter 15, thereby preventing the PCB from bending due to stress accumulation during the high-speed mounting process, causing the components on the back of the PCB to fall off.

[0037] Secondly, through the provision of the slide post 35, after the slide post 35 extends upward, when the top surface of the slide post 35 is not in contact with the PCB, the height of its top end will exceed the top surface of the track frame 21. At this time, after these fully extended slide posts 35 come into contact with the side of the PCB, the position of the PCB will be limited by the cooperation of multiple slide posts 35, thereby avoiding displacement of the PCB during the mounting process and ensuring the mounting accuracy of components.

[0038] Among them, the left and right sides of the outer shell 32 are fixedly connected with the first pressure valve 36, the track frame 21 is fixedly connected with a cylinder 38, a first pipe 37 is connected between the cylinder 38 and the exhaust port of the first pressure valve 36, and the first pipe 37 is fixedly connected to the second pressure valve 39. The opening pressure value of the second pressure valve 39 is greater than the opening pressure value of the first pressure valve 36, and the exhaust port of the second pressure valve 39 is connected to the outside world.

[0039] By providing the first pressure valve 36 and the cylinder 38, when gas is injected into the housing 32, after the slide 35 abuts against the back of the PCB, continuing to inject gas into the housing 32 will cause the air pressure in the housing 32 to rise. At this time, the first pressure valve 36 opens, thereby preventing the slide 35 abutting against the back of the PCB from continuing to extend. At the same time, as the first pressure valve 36 opens, gas is injected into the cylinder 38, causing the cylinder 38 to be driven to extend, thereby causing the lifting frame 310 to clamp the two sides of the PCB to prevent the PCB from shifting during the mounting process.

[0040] Among them, the supporting mechanism 3 also includes a lifting frame 310, and the outer side surface of the lifting frame 310 is fixedly connected to multiple sliders, which are slidably connected in the first slide groove 23. The telescopic end of the cylinder 38 is fixedly connected to the bottom surface of the lifting frame 310, and the track frame 21 is fixedly installed with multiple sections of conveyor belts 22 facing the side of the supporting mechanism 3. The top surface of the lifting frame 310 is fixedly connected with symmetrical rubber strips 311. After the lifting frame 310 slides upward, it pushes part of the conveyor belt 22 upward.

[0041] The lifting frame 310 is located between the upper and lower conveyor belts 22. When the lifting frame 310 slides upward, it will contact the conveyor belt 22 and lift the conveyor belt 22 upward together, thereby fixing the PCB through the friction between the conveyor belt 22 and the PCB, preventing the PCB from being displaced during subsequent work.

[0042] Among them, the rotating plate 42 is a hollow structure. The rotating plate 42 is parallel to the track frame 21 in the initial position. A through groove 410 is provided on the bottom surface of the rotating plate 42. A rubber block 49 is slidably connected to the inside of the rotating plate 42. Part of the rubber block 49 is located in the through groove 410. A second spring 412 is elastically connected between the rubber block 49 and the inner bottom surface of the rotating plate 42 so that the bottom surface of the rubber block 49 is coplanar with the bottom surface of the rotating plate 42 in the initial position. The rotating plate 42 is slidably sleeved with a push rack 47 toward the side of the supporting mechanism 3 in the initial position. A first spring 411 is elastically connected between the push rack 47 and the inner side surface of the rotating plate 42. The rubber block 49 is fixedly connected to an inclined block perpendicular to the symmetrical side of the push rack 47. The inclined surface of the inclined block is inclined upward. The push rack 47 is fixedly connected to the side of the rubber block 49 with an inclined push block 48. After the push rack 47 slides into the rotating plate 42, the rubber block 49 slides downward and its bottom end extends out of the rotating plate 42.

[0043] Through the blocking mechanism 4, after the conveying mechanism 2 conveys the PCB to the mounting station, the driving motor 46 is turned on to rotate the rotating plate 42 from parallel to the track frame 21 to perpendicular to the track frame 21. At this time, the rotating plate 42 is located directly above the PCB. At the same time, the push frames 47 on the sides of the two rotating plates 42 contact each other, so that the rubber blocks 49 in the two rotating plates 42 extend downward. When the rubber blocks 49 contact the PCB downward, the friction between the two prevents the PCB from being slightly displaced, thereby ensuring that when the sliding column 35 extends upward, the PCB and the components on the board will not be pushed due to the different contact time between the sliding column 35 and the components, thereby ensuring that the mounting accuracy meets the standard.

[0044] When the slide post 35 is fully extended, the vertical height of the top surface of the slide post 35 is greater than the vertical height of the track frame 21 .

[0045] By making the top surface of the slide post 35 higher than the track frame 21 when it is fully extended, when the slide post 35 is extended, the slide post 35 that is not in contact with the bottom surface of the PCB abuts against the edge of the PCB through the side surface, thereby restricting the PCB from moving.

[0046] The top surface of the housing 1 is also fixedly connected with a feeder 13 and a driver 14 , and the driver 14 is mounted with a mounter 15 .

[0047] Working principle:

[0048] When using this device to mount PCBs, the conveying mechanism 2 is first used to transport the PCB to the mounting station. Then, the driving motor 46 drives the two rotating shafts 41 to rotate, thereby rotating the rotating plate 42 to above the mounting station. At this time, the rubber block 49 in the rotating plate 42 extends and contacts the PCB, thereby preventing the PCB from being displaced through the friction between the two.

[0049] Gas is then injected into the housing 32 to extend the slide 35. When the top of the slide 35 abuts the bottom surface of the PCB or is fully extended, continued injection of gas will cause the air pressure in the housing 32 to rise, thereby opening the first pressure valve 36. At this time, continued input of air will drive the cylinder 38 to extend, thereby moving the lifting frame 310 upward, and then fixing it from both sides of the PCB. At this time, the PCB is fixed under the abutment of the slide 35.

[0050] Then, the chip mounter 15 is used to mount the PCB. At this time, the pressure applied by the chip mounter 15 to the PCB will be offset by the slide column 35, thereby preventing the PCB from being deformed due to internal stress accumulation.

[0051] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A semiconductor particle mounting device, comprising a housing (1), wherein the housing (1) comprises a base (11) and an upper cover (12), characterized in that: Also includes: A conveying mechanism (2), the conveying mechanism (2) comprising a track frame (21) symmetrically fixedly connected to the top surface of the base (11), and a first sliding groove (23) is provided on the outer side surface of the track frame (21); A carrying mechanism (3), the carrying mechanism (3) comprising a fixing plate (31) fixedly sleeved on the top surface of the base (11), a housing (32) fixedly connected inside the fixing plate (31), air inlets (33) being provided on two symmetrical sides of the housing (32), the housing (32) being open at the top and a mounting plate (34) fixedly connected at the top thereof, a plurality of sliding posts (35) being slidably sleeved on the mounting plate (34); The blocking mechanism (4) comprises two centrally symmetrical rotating shafts (41) and a limiting frame (43); the rotating shaft (41) passes through the top surface of the base (11); the rotating shaft (41) is fixedly sleeved with a rotating plate (42) and a synchronous wheel (44) from top to bottom; a synchronous belt (45) is connected between the two synchronous wheels (44); and the bottom of one rotating shaft (41) is connected to a driving motor (46).

2. The semiconductor particle mounting device according to claim 1, characterized in that: The left and right sides of the housing (32) are fixedly connected to a first pressure valve (36) in communication with each other, the track frame (21) is fixedly connected to a cylinder (38), a first pipe (37) is connected between the cylinder (38) and the exhaust port of the first pressure valve (36), and a second pressure valve (39) is fixedly connected to the first pipe (37).

3. The semiconductor particle mounting device according to claim 2, characterized in that: The opening pressure value of the second pressure valve (39) is greater than the opening pressure value of the first pressure valve (36), and the exhaust port of the second pressure valve (39) is connected to the outside.

4. The semiconductor particle mounting device according to claim 3, characterized in that: The carrying mechanism (3) further comprises a lifting frame (310), the outer side surface of the lifting frame (310) being fixedly connected to a plurality of sliders, the sliders being slidably connected in the first sliding groove (23), and the telescopic end of the cylinder (38) being fixedly connected to the bottom surface of the lifting frame (310).

5. The semiconductor particle mounting device according to claim 4, characterized in that: The track frame (21) is fixedly mounted with multiple sections of conveyor belts (22) on the side facing the bearing mechanism (3); the top surface of the lifting frame (310) is fixedly connected with symmetrical rubber strips (311); and the lifting frame (310) pushes part of the conveyor belt (22) upwards after sliding upwards.

6. The semiconductor particle mounting device according to claim 5, characterized in that: The rotating plate (42) is a hollow structure. The rotating plate (42) is parallel to the track frame (21) in the initial position. A through slot (410) is provided on the bottom surface of the rotating plate (42). A rubber block (49) is slidably connected to the inside of the rotating plate (42). Part of the rubber block (49) is located in the through slot (410). A second spring (412) is elastically connected between the rubber block (49) and the inner bottom surface of the rotating plate (42) so that the bottom surface of the rubber block (49) and the bottom surface of the rotating plate (42) are coplanar in the initial position.

7. The semiconductor particle mounting device according to claim 6, characterized in that: The rotating plate (42) is slidably sleeved with a push frame (47) toward the side of the supporting mechanism (3) in the initial position, and a first spring (411) is elastically connected between the push frame (47) and the inner side surface of the rotating plate (42).

8. The semiconductor particle mounting device according to claim 7, characterized in that: The rubber block (49) is fixedly connected to a slope block perpendicular to the symmetrical side of the push frame (47), the slope of the slope block is inclined upward, and the push frame (47) is fixedly connected to an inclined push block (48) on the side facing the rubber block (49). After the push frame (47) slides into the rotating plate (42), the rubber block (49) slides downward and its bottom end extends out of the rotating plate (42).

9. The semiconductor particle mounting device according to claim 8, characterized in that: When the slide post (35) is fully extended, the vertical height of the top surface of the slide post (35) is greater than the vertical height of the track frame (21).

10. The semiconductor particle mounting device according to claim 9, characterized in that: The top surface of the housing (1) is also fixedly connected to a feeder (13) and a driver (14), and a patch device (15) is installed on the driver (14).

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