Drilling device for multilayer circuit board

Abstract

The invention discloses a drilling device for a multilayer circuit board. The drilling device comprises a drilling table and a driving part, a drilling tool is arranged on the drilling table, and the driving part comprises a multi-shaft rotation driving part and three independent drilling cutters arranged at the output end of the multi-shaft rotation driving part. The drilling tool comprises a vacuum positioning seat, a plurality of vacuum adsorption grooves are formed in the vacuum positioning seat, material slag collecting channels are arranged on the vacuum positioning seat and the drilling table and correspond to the holes of the multi-layer circuit board, and the material slag collecting channels are connected with a negative pressure collector. According to the drilling device for the multi-layer circuit board, the multi-shaft rotation driving part is arranged to drive the three independent drilling cutters, drilling of the multi-layer circuit board on the vacuum positioning seat is completed at a time, machining accumulated errors are reduced, and machining precision is guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board production, in particular to a drilling device for a multi-layer circuit board. Background Art

[0002] During the production process of multi-layer circuit boards, wiring holes need to be opened for the three windings respectively, so they need to be drilled. Traditional drilling devices can only process single holes, and three holes are drilled in three times. However, the cumulative error of the three times of single-hole processing is large. For multi-layer circuit boards, higher precision drilling is required. Summary of the Invention

[0003] In order to address the deficiencies in the prior art, the present invention provides a drilling device for a multi-layer circuit board. The drilling device for a multi-layer circuit board drives three independent drilling cutters by providing a multi-axis rotary drive unit, thereby completing drilling of the multi-layer circuit board on a vacuum positioning seat at one time, reducing cumulative machining errors, and ensuring machining accuracy.

[0004] To achieve the above object, the present invention adopts the following technical solutions:

[0005] The present invention provides a drilling device for a multi-layer circuit board, comprising a drilling table and a driving unit;

[0006] The drilling table is provided with a drilling tool, and the driving part includes a multi-axis rotary driving part and three independent drilling cutters provided at the output end of the multi-axis rotary driving part;

[0007] The drilling tooling includes a vacuum positioning seat, which is provided with multiple vacuum adsorption grooves. The vacuum positioning seat and the drilling table are provided with slag collection channels at the opening positions corresponding to the multi-layer circuit boards, and the slag collection channels are connected to a negative pressure collector.

[0008] Before drilling, the multi-layer circuit board is placed on a vacuum positioning seat and is adsorbed, fixed and positioned by multiple vacuum adsorption grooves. The multi-axis rotary drive unit drives three independent drilling cutters to drill three wiring holes on the multi-layer circuit board at one time. The drilling residue is transferred to the residue collection channel and collected by the negative pressure collector.

[0009] The multi-layer circuit board drilling device of the present invention is provided with a multi-axis rotary drive unit to drive three independent drilling cutters, thereby completing drilling of the multi-layer circuit board on the vacuum positioning seat at one time, reducing machining cumulative errors and ensuring machining accuracy.

[0010] In a further technical solution, a positioning ring is provided on the vacuum positioning seat, the inner diameter of the positioning ring matches the outer diameter, shape and size of the multi-layer circuit board to be drilled, and an inclined surface is provided between the inner diameter and the upper side of the positioning ring.

[0011] The positioning ring allows the multi-layer circuit board to automatically slide down the inclined surface of the positioning ring with the suction of the vacuum adsorption groove when it is placed, and finally enter the predetermined position, achieving fast and accurate positioning.

[0012] In a further technical solution, the plurality of vacuum adsorption grooves are independently connected to a negative pressure pump.

[0013] Independent negative pressure ensures the vacuum adsorption effect.

[0014] In a further technical solution, the drilling table is further provided with an air nozzle facing the vacuum positioning seat.

[0015] The setting of the air nozzle enables the vacuum positioning seat to be blown after the drilling is completed to clean the drill cuttings, which are mainly composed of glass fiber and resin with a particle size of 5-500μm.

[0016] The beneficial effects are:

[0017] 1. The multi-layer circuit board drilling device of the present invention is provided with a multi-axis rotary drive unit to drive three independent drilling cutters, completing the drilling of the multi-layer circuit board on the vacuum positioning seat at one time, reducing the cumulative processing error and ensuring the processing accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Schematic diagram of the structure of a drilling device for a multi-layer circuit board according to an embodiment of the present invention.

[0019] 10. Drilling table; 11. Vacuum positioning seat; 12. Vacuum adsorption groove; 13. Positioning ring; 14. Slag collection channel; 15. Negative pressure collector; 20. Multi-axis rotation drive unit; 30. Three independent drilling cutters. DETAILED DESCRIPTION

[0020] The present invention will be further described below in conjunction with the accompanying drawings:

[0021] Example:

[0022] A drilling device for a multi-layer circuit board, such as Figure 1 As shown, it includes a drilling table 10 and a driving part;

[0023] A drilling tool is provided on the drilling table 10, and the driving part includes a multi-axis rotary driving part 20 and three independent drilling cutters 30 provided at the output end of the multi-axis rotary driving part 20;

[0024] The drilling tooling includes a vacuum positioning seat 11, on which a plurality of vacuum adsorption grooves 12 are provided. A slag collection channel 14 is provided on the vacuum positioning seat 11 and the drilling table 10 at the opening positions corresponding to the multi-layer circuit board, and the slag collection channel 14 is connected to a negative pressure collector 15.

[0025] Before drilling, the multilayer circuit board is placed on the vacuum positioning seat 11, and the multilayer circuit board is adsorbed, fixed and positioned by multiple vacuum adsorption grooves 12. The three independent drilling cutters 30 are driven by the multi-axis rotation drive unit 20 to drill three wiring holes on the multilayer circuit board at one time. The drilling residue is transferred to the residue collection channel 14 and collected by the negative pressure collector 15.

[0026] The multi-layer circuit board drilling device of the present invention is provided with a multi-axis rotary drive unit 20 to drive three independent drilling cutters 30, thereby completing drilling of the multi-layer circuit board on the vacuum positioning seat 11 at one time, reducing the cumulative processing error and ensuring the processing accuracy.

[0027] In another embodiment, a positioning ring 13 is provided on the vacuum positioning seat 11. The inner diameter of the positioning ring 13 matches the outer diameter, shape and size of the multi-layer circuit board to be drilled. A slope is provided between the inner diameter and the upper side of the positioning ring 13.

[0028] The positioning ring 13 is provided so that when the multilayer circuit board is placed, it automatically slides down along the inclined surface of the positioning ring 13 in cooperation with the suction force of the vacuum adsorption groove 12 and finally enters the predetermined position, thereby achieving fast and accurate positioning.

[0029] In another embodiment, the plurality of vacuum adsorption grooves 12 are independently connected to a negative pressure pump.

[0030] Independent negative pressure ensures the vacuum adsorption effect.

[0031] In another embodiment, the drilling platform 10 is further provided with an air nozzle facing the vacuum positioning seat 11 .

[0032] The air nozzle is provided so that air can be blown to the vacuum positioning seat 11 after drilling is completed to clean the drill cuttings, which are mainly composed of glass fiber and resin with a particle size of 5-500 μm.

[0033] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and modifications fall within the scope of the invention as claimed.

Claims

1. A drilling device for a multi-layer circuit board, characterized in that: It includes a drilling table and a driving unit; The drilling table is provided with a drilling tool, and the driving part includes a multi-axis rotary driving part and three independent drilling cutters provided at the output end of the multi-axis rotary driving part; The drilling tooling includes a vacuum positioning seat, which is provided with multiple vacuum adsorption grooves. The vacuum positioning seat and the drilling table are provided with slag collection channels at the opening positions corresponding to the multi-layer circuit boards, and the slag collection channels are connected to a negative pressure collector.

2. The drilling device for a multilayer circuit board according to claim 1, characterized in that: A positioning ring is provided on the vacuum positioning seat. The inner diameter of the positioning ring matches the outer diameter, shape and size of the multi-layer circuit board to be drilled. A slope is provided between the inner diameter and the upper side of the positioning ring.

3. The drilling device for a multi-layer circuit board according to claim 1, characterized in that: The plurality of vacuum adsorption grooves are independently connected to a negative pressure pump.

4. The drilling device for a multi-layer circuit board according to claim 1, wherein: The drilling platform is also provided with an air nozzle facing the vacuum positioning seat.

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